TW201100956A - Radiation-sensitive resin composition, spacer and insulating film for organic EL display element and method for forming the same - Google Patents

Abstract

An object of the present invention is to provide a radiation-sensitive resin composition having not only sufficient resolution but also high durability to resist-stripper solution, besides, it has both excellent radiation sensitivity and high light-screening ability during heating. The present invention relates to a radiation-sensitive resin composition for forming spacer and insulating film, which comprises [A] an alkali soluble resin of a copolymer (it is formed by copolymerizing (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride and (a2) a monomer containing a compound selected from a group consisted of a compound containing phenol skeleton represented by formula (I), a compound represented by formula (II) and a compound represented by formula (III)), [B] 1, 2-quinone diazido compound and [C] thermosensitive pigment.

Description

[Technical Field] The present invention relates to a radiation sensitive resin composition for forming a partition wall and an insulating film, a partition wall for an organic EL display device, and an insulating film, and a method for forming the same. Further, the present invention relates to a radiation-sensitive resin composition for forming a partition wall and an insulating film by radiation such as ultraviolet rays, far ultraviolet rays, X rays, and the like, and a partition wall for an organic EL display element formed by the above. An insulating film, and a method of forming the partition and the insulating film. 〇[Prior Art] Organic EL display elements have no viewing angle dependence due to self-illumination. Also, due to solid components, excellent impact resistance, low voltage drive, low power consumption, and low temperature operation are stable. High performance, and various advantages compared to liquid crystal display elements. The organic EL display element is highly promising due to the high degree of expectation of having such advantages, especially for mobile applications such as mobile terminals or in-vehicle devices. Such an organic EL display element is generally produced by the following method. First, 图形 a pattern of a transparent electrode (hole injection electrode) such as tin-doped indium oxide (1TO) and a hole transport layer is formed on the substrate. Next, in the case of a passive organic EL display device, the organic EL layer, the electron transport layer, and the cathode (electron injection electrode) are patterned by vapor deposition after forming the pattern of the insulating film and the pattern of the cathode partition. In the case of the active organic EL display device, after forming a pattern of an insulating film used as a partition wall of an ITO pattern or an organic EL layer, an organic EL is formed by a masking method, an inkjet method, or the like. The pattern of layers 'then forms an electron transport layer and a cathode (electron injection electrode). Here, in the aspect of the organic EL layer of 201100956, a material such as Alq3 or BeBq3 doped with quinacridone or coumarin on the substrate precursor is used, and in terms of the cathode material, it is used such as magnesium or silver. The metal of the low work function is the material of the main body. » In recent years, in response to the demand for high definition, we are begging for organic EL display components with higher aperture ratios. However, for the following reasons, there is a limit to the increase in the aperture ratio. That is, in the passive organic EL display device, in order to increase the aperture ratio, it is necessary to reduce the pattern width of the insulating film and the cathode barrier, and it is not necessary to pass through these portions, since we require a certain intensity and a viewpoint from the resolution. There is a limit to the reduction in the width of the pattern, so that a high aperture ratio cannot be sufficiently obtained. Further, in the active organic EL display device, in order to avoid a short circuit of the IT0 pattern of each pixel, it is necessary to provide a predetermined interval between the pixels, so that there is a limit to the improvement of the aperture ratio. Recently, we are begging for an active organic EL display that can achieve a higher aperture ratio. Such an active organic EL display element can be manufactured, for example, by the following method. First, a driving terminal is formed on a substrate such as glass, and a first insulating film having a planarizing film is formed thereon. Next, a pattern of a transparent electrode (hole injection electrode) such as IT0 is formed thereon. The pattern is formed at this time, usually in accordance with the wet etching method. Further, on this, a pattern of the hole transport layer is formed by a mask method. Then, the pattern of the second insulating film used as the partition wall of the ITO pattern and the organic EL layer and the pattern of the organic EL layer are formed by a mask method, an inkjet method, or the like, and then an electron transport layer is formed in order. Cathode (electron injection electrode). At this time, in order to obtain conduction between the IT0 electrode (electrical 201100956 hole injection electrode) and the driving terminal, it is necessary to form a through hole of about 1 to 15 μm or a three-shaped recess in the first insulating film. However, it is known that the organic EL light-emitting layer is rapidly degraded in contact with moisture even in the low molecular light-emitting layer or the polymer light-emitting layer, and its light-emitting state is hindered. In the case where the water is infiltrated into the organic EL layer, the amount of water contained in the insulating film material is gradually infiltrated into the organic EL layer. Up to now, there has been no proposal to form a material having an insulating film which can form a necessary through hole or a 凹-shaped recess for achieving a higher aperture ratio, and has sufficient resolution, excellent flatness, and transparency. The photoresist stripping liquid used for electrode formation has high resistance, and further, it is possible to prevent penetration of impurities (mainly moisture) which hinder light emission. On the one hand, in order to improve the contrast in the display device using the organic EL display element and to improve the visibility, it has been attempted to maintain the light-shielding property at the base of the insulating film and/or the element isolation structure (see, for example, Japanese Patent Laid-Open No. 11-273870) Japanese Patent Laid-Open Publication No. 2002-116536. However, in such a radiation sensitive resin composition, in order to sufficiently improve the light blocking property of the light-shielding hardened film or the black matrix, it is necessary to use a considerable amount of the coloring agent. In the case where such a large amount of the coloring agent is used, since the exposed radiation is absorbed by the coloring agent, the effective intensity of the radiation in the coating film is lowered, and the radiation sensitivity (exposure sensitivity) for pattern formation is lowered. Not suitable. A method of adding a heat-sensitive material and a color developing agent to a positive-type resist containing an alkali-soluble resin and a diazonium, such as a novolak resin 201100956, in a specific method of reducing the radiation sensitivity and imparting light shielding properties to the partition wall or the insulating film (Japanese Patent Laid-Open No. Hei 10-170715, JP-A-2008-122501). In this method, by heating, a positive-type radiation-sensitive resin composition in which a black-colored heat-sensitive material and a color developer are added in advance can be used. In such a radiation-sensitive resin composition, since the heat-sensitive material is not in a state of being unreacted before exposure, the resin composition itself does not have a light-shielding property, and the radiation sensitivity does not deteriorate. However, the pattern in the organic EL display element, or the temperature necessary for the formation of the partition walls or the insulating film, is generally around 200 °C. Therefore, in the developer and the color former disclosed in Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. Insufficient, not only is it impossible to obtain a satisfactory light-shielding property, but also sublimation at the time of pattern formation, and there is a danger of contamination of the firing furnace. Japanese Laid-Open Patent Publication No. JP-A-2002-116536 (Patent Document No. JP-A-2002-116536) Patent Document No. JP-A-2002-116536 SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide a radiation sensitive resin composition having a through hole or a concave portion in which an insulating film can be formed. It has excellent resolution and flattening performance, and has high resistance to the photoresist stripping liquid used for forming the transparent electrode 201100956, and has excellent radiation sensitivity and high light-shielding property during heating. It is used to form the adjacent wall of the organic EL display element. Solution to the problem of the radiation-sensitive resin composition for an insulating film. The present invention has been made in order to solve the above problems, and is a radiation-sensitive resin composition containing: Ο [A] an alkali-soluble resin, which will contain (al) And at least one selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic anhydrides, and (a2) selected from the group consisting of phenolic skeletons represented by the following formula (I) a copolymer obtained by copolymerizing a saturated compound, a compound represented by the following formula (II) and a compound represented by the following formula (III) to form a compound of the group, [B] 1,2-quinonediazide group Compound, and [C] sensible pigment, 〇

C H2=C

(I)

201100956

(In the formula (I), R1 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; R2 to R6 are the same or different and are a hydrogen atom, a hydroxyl group or an alkyl group having 1 to 4 carbon atoms; and B is a single bond. , -COO-, or -CONH-: m is an integer from 0 to 3, but at least one of R2 to R6 is a hydroxyl group; in the formula (II), R1 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; Y1 And Y2 are the same or different and are a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; X1 to X4 are the same or different and are a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or a halogen atom; and Z is a single bond. Or - 0(CH2)w-, w is an integer from 1 to 6; in the formula (III), R1 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; Z is a single bond or - 〇(CH2)w-, w is an integer from 1 to 6). 〇w The radiation-sensitive resin composition for forming a partition wall and an insulating film contains an unsaturated carboxylic acid or the like which acts as both an alkali-soluble resin and a color developing agent, and a copolymer containing a phenol skeleton unsaturated compound and a thermosensitive dye. Therefore, it has heat resistance to high temperature at the time of formation of the partition wall and the insulating film, and can prevent sublimation of the color developing agent, and at the same time, high light-shielding property in addition to excellent radiation sensitivity and developability, and heating. The alkali-soluble resin of the component [A] in the radiation-sensitive resin composition is preferably contained in addition to the (al) component and the (a2) component, and (a3) an epoxy group-containing epoxy group-10-201100956. The monomers are copolymerized to form a copolymer. The component of the copolymer of the alkali-soluble resin of the component [A] can further improve the heat resistance of the partition wall and the insulating film formed of the radiation-sensitive resin composition by using such an epoxy group-containing unsaturated compound. Sex and surface hardness. The content of the thermosensitive dye of the component [C] in the radiation sensitive linear resin composition is preferably 0.1 part by mass or more and 30 parts by mass or less based on 100 parts by mass of the alkali-soluble resin of the component [A]. By setting the content of the thermosensitive pigment of the component [C] in such a range, the heat absorption sensitivity, or the radiation sensitivity, the heat resistance, and the solvent resistance can be maintained at an appropriate level. Further, the method for forming an insulating film for an organic EL display device of the present invention and an insulating film for an organic EL display device includes: (1) a step of forming a coating film of the radiation sensitive resin composition on a substrate; (2) At least a part of the coating film formed in the step (1), a step of irradiating the radiation; (3) a step of developing the coating film irradiated with the radiation in the step (2); and Q (4) coating the developing film in the step (3) The step of heating the film. When the barrier layer of the organic EL display device and the insulating film are produced by the above-described steps, the sensible dye contained in the composition before exposure is unreacted, and the light-shielding property cannot be exhibited. However, when heated after exposure, high light-shielding property is exhibited, and the display device having the organic EL display element having the partition wall and the insulating film is extremely excellent in comparison. Advantageous Effects of Invention As described above, since the radiation-sensitive resin composition of the present invention is used as a color developing agent by using an alkali-soluble resin of a predetermined copolymer, it has a high temperature at the time of forming a wall and an insulating film from 11 to 201100956. The heat resistance prevents the sublimation of the color developing agent, and at the same time, it is possible to obtain high light-shielding properties in addition to excellent radiation sensitivity and developability, and heating. [Embodiment] The radiation sensitive resin composition for forming a partition wall and an insulating film of the present invention contains an alkali-soluble resin of the component [A], a 1,2-quinonediazide compound of the component [B], Sensible pigment of [C] component, and other optional components. The following is a description of each 〇 v component. The component [A] of the component [A] contains at least one selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic acid anhydride; and (a2) a phenolic skeleton-containing unsaturated compound selected from the above formula (1). A compound obtained by copolymerizing a compound represented by the above formula (1 1) and a compound represented by the above formula (111), and a monomer of the compound of the group. Hereinafter, the copolymerized peach is referred to as "copolymer [A]". The copolymer [A], which contains, in addition to Q, the compound (al) and the compound (a2), further contains: (a3) an epoxy group-containing unsaturated compound and/or (a4) the compounds A copolymer obtained by copolymerizing a monomer having a radical polymerizable unsaturated compound other than (a) to (a3). The copolymer [A] is an alkali-soluble resin, but functions as a color developing agent in the radiation-sensitive linear resin composition. According to the radiation-sensitive resin composition containing the copolymer [A], it is possible to obtain high heat resistance, high radiation sensitivity, and high developability in the formation of the partition walls and the insulating film, and excellent light-shielding properties upon heating. -12- 201100956 Copolymer [A] can be free-radically polymerized by the compounds (a 1) and (a2), and any of the compounds (a3) and (a4) in the presence of a polymerization initiator in a solvent. And manufacturing. The copolymer [A] preferably has a constituent unit derived from the compound (a1) in an amount of from 5 to 40% by mass based on the total of the constituent units derived from the compounds (a1), (a2), (a3) and (a4). /», especially good contains 1〇 to 30% by mass. By using the constituent unit derived from the compound (al) in such a ratio, the solubility with respect to the aqueous alkali solution can be controlled to an appropriate range in the developing step of the copolymer. The compound (al) is a radically polymerizable unsaturated citric acid and/or an unsaturated carboxylic anhydride. The compound (al) includes, for example, a monocarboxylic acid, a dicarboxylic acid, an anhydride of a dicarboxylic acid, a mono[(meth)acryloxyalkylene] ester of a polyvalent carboxylic acid, and a polymer having a carboxyl group and a hydroxyl group at both terminals. Mono (meth) acrylate, polycyclic compound having a carboxyl group, and anhydride thereof. Specific examples of the compound (al) include, for example, acrylic acid, methacrylic acid, crotonic acid, etc.; and dicarboxylic acids such as maleic acid, fumaric acid, citraconic acid, and mesaconic acid. And the acid anhydride of the dicarboxylic acid is, for example, an anhydride of the compound exemplified above for the dicarboxylic acid; and the mono ((meth) propylene oxyalkyl) ester of a polyvalent carboxylic acid, for example, succinic acid mono 2-(Methyl)acryloyloxyethyl]ester, mono-2-(methyl)propenyloxyethyl] decanoate, etc.; mono(meth)acrylate of a polymer having a carboxyl group and a hydroxyl group at both terminals For example, ω-carboxypolycaprolactone mono(meth)acrylate, etc.; -13- 201100956 Polycyclic compound having a carboxyl group and an anhydride thereof are, for example, 5-carboxybicyclo[2 2 ihept-2-ene, 5 , 6-dicarboxybicyclo[2.2.1]hept-2-ene, 5-carboxy-5-methylbicyclo[2.2.1]hept-2-pyrene, 5-nonyl-5-ethylbicyclo[2.2. 1] Geng-2-supplement, 5-resyl-6-methylbicyclo[2.2.1]hept-2-pyrene, 5-resin-6-ethylbicyclo[2.2.1]hept-2-ene, 5,6-Dicarboxybicyclo[2·2·1]hept-2-ene anhydride and the like. Among these compounds (a1), an anhydride of a monocarboxylic acid or a dicarboxylic acid is preferably used. Among them, acrylic acid, methacrylic acid, and maleic anhydride are particularly suitably used from the viewpoints of copolymerization reactivity with other compounds, solubility in an aqueous alkali solution, and ease of availability. These compounds (al) may be used singly or in combination. The copolymer [A] is preferably a constituent unit derived from the compound (a2) in an amount of from 1 to 50% by mass based on the total of the constituent units derived from the compounds (al), (a2), (a3) and (a4). It is particularly preferably contained in an amount of from 3 to 40% by mass. By using the constituent unit derived from the compound (a2) in an amount of 1% by mass or more, the radiation sensitivity of the radiation sensitive resin composition can be improved. On the other hand, by setting the amount of the constituent unit to 50% by mass or less, it is possible to prevent excessive solubility in the aqueous alkali solution in the developing step in the formation of the partition walls and the insulating film. The compound (a2) is a compound selected from the group consisting of the compound represented by the above formula (II) and the compound represented by the above formula (ΠΙ), which is a phenol skeleton-free unsaturated compound represented by the above formula (I). The unsaturated compound containing the phenol skeleton represented by the above formula (I) can be classified into the compounds represented by the following formulas (IV) to (VIII) according to the definitions of B and m. -14 - (17)201100956 R1

HN\ Ο (CHz)n

(In the formula (IV), n is an integer of 1 to 3, and R1, R2, R3, R4, R5, and R6 have the same meanings as in the formula (1)).

(V) (In the formula (V), R1, R2, R3, R4, R5, and R6 have the same meanings as in the above formula (1)). 〇

(VI) 15- 201100956 (In equation (VI), ρ is an integer from 1 to 3. The definitions of Rl, r2 and R6 are the same as above (1))

(W) Ο

(In the formula (VII), R1, R2, R3, r4, R5, and R6 have the same meanings as in the above formula (I)).

(In the formula (VIII), R1, R2, R3, R4, R5, and R6 have the same meanings as in the above formula (I)). Among these phenolic skeleton-containing unsaturated compounds, N-(3,5-dimethyl-4-hydroxybenzyl)(meth)acrylamide, N-(4-hydroxyphenyl) (methyl) ) acrylamide, 4-hydroxybenzyl (meth)acrylate, 4-hydroxyphenyl (meth)acrylate, o-hydroxystyrene, m-hydroxystyrene, p-hydroxystyrene, α-methyl-hydroxystyrene , α-methyl-hydroxy-hydroxystyrene, α-methyl-p-hydroxystyrene, which can increase the radiation sensitivity of the radiation-sensitive resin composition, and increase the development margin (development time -16 - 201100956 allowable range) It can be suitably used to improve the heat resistance of the obtained partition walls and the insulating film. The compound represented by the above formula (II) is a compound in which a hydroxyl group of a bisphenol type compound is introduced into a polymerizable unsaturated group. In the case of the compound represented by the above formula (11), there are, for example, 4,4'-isopropylene glycol, 4,4,-isopropylidene (2-chlorophenol), 4,4'-isopropylidene Bis(2,6-dibromophenol), 4,4'-isopropylidene bis(2,6-dichlorophenol), 4,4·-isopropylidene bis(2-cresol), 4,4, - isopropylidene bis(2,6-xylenol), 4,4,- isopropylidene bis (2-tertiary butyl phenol), 4,4,-secondary butylene diol, 4,4,-s A compound in which a hydroxy group of a bisphenol type compound such as butylene 0 (2-cresol) is introduced into a (meth) acrylonitrile group. Among them, from the viewpoint of improving the color development property of the compound forming the [A] component, it is particularly preferable to introduce a (meth)-propyl sulfhydryl group into the hydroxyl group of the 4,4--isopropylidene phenol. Compound. The compound represented by the above formula (III) is a compound in which a polymerizable unsaturated group is introduced into a hydroxyl group of a naphthalenediol. The naphthalenediol may be any isomer of 1,2-body, 1,3-body, 1,4-body, 1,5-form, 2,3-body and 2,6-form, or may be These o. Specific examples of the compound represented by the above formula (III) include hydrazine propylene oxy-4-naphthol, 1-propene oxime 5-naphthol, 2-propene oxime-6-naphthol, 1-methyl Acryloxy-naphthol, 1-methylpropenyloxy-5-naphthol, 2-methylpropenyloxy-6-naphthol, and the like. Among these compounds, from the viewpoint of improvement in color development property and copolymerizability of the compound of the [Α] component formed, it is particularly preferable that 丨_methylpropane is 醯oxy-4·naphthoquinone. The copolymer [Α] is derived from a compound having the radically polymerizable epoxy group-containing unsaturated compound (a3) based on the total of the constituent units derived from the compounds (al), (a2), ruthenium 3) and (a4). The constituent unit preferably contains from 80 -17 to 201100956 mass%, particularly preferably from 20 to 70 mass%. By setting the amount of the constituent unit derived from the compound (a3) to be 1% by mass or more, the heat resistance or surface hardness of the obtained partition wall and the insulating film can be improved. On the other hand, by setting the amount of the constituent unit to 80% by mass or less, the storage stability of the radiation sensitive resin composition can be highly maintained. Examples of the compound (a3) include, for example, glycidyl acrylate, glycidyl methacrylate, α-ethyl acrylate propyl acrylate, α-n-propyl propylene acrylate, and (X-n-butyl acrylate). Glycidyl acrylate, acrylic acid _3,4_epoxybutyl vinegar, -3-3,4-epoxybutyl methacrylate, -6,7-epoxyheptyl acrylate, -6,7-cyclomethacrylate Oxyheptyl ester, α-ethyl acrylate-6,7-epoxyheptyl ester, o-vinylbenzyl epoxidized propyl ether, m-vinyl benzyl epoxidized ether, p-vinyl benzyl epoxidized ether, methacrylic acid 3, 4 - Epoxycyclohexyl ester, etc. In the compound (a3), 'glycidyl methacrylate, -6,7-epoxyheptyl methacrylate, p-vinyl benzyl epoxidized ether, m-vinyl benzyl ring Oxypropyl propyl ether, p-vinyl benzyl epoxidized propyl ether, 3,4-epoxycyclohexyl methacrylate, etc., due to copolymerization with other compounds, Q properties, and heat resistance or surface hardness of the resulting partition walls and insulating films The compound (a3) may be used singly or in combination. The copolymer [A] is a constituent list derived from the compounds (al), (a2), (a3) and (a4). In general, the constituent unit derived from the compound (a4) having a radical polymerizable unsaturated compound other than the above compounds (al), (a2) and (a3) is preferably contained in an amount of 5 to 70% by mass. In particular, the content of the compound (a4) is 5% by mass or more, and the storage stability of the radiation-sensitive resin composition can be improved. In the aspect of -18-201100956, By setting the amount of the constituent unit to 70% by mass or less, the solubility of the composition in the aqueous alkali solution can be promoted in the development step in the formation of the partition walls and the insulating film. For the compound (a4), for example, methacrylic acid Chain alkyl ester, acrylic chain alkyl ester, methacrylic acid alkyl acrylate, hydroxy group-containing methacrylate, acrylic acid cyclic alkyl ester, methacrylic acid aryl ester, aryl acrylate, unsaturated dicarboxylic acid diester , bicyclic unsaturated compound, maleimide compound, unsaturated aromatic compound, conjugated diene, unsaturated compound having tetrahydrofuran bone truss, unsaturated compound having furan skeleton , An unsaturated compound having a skeleton tetrahydropyran, pyran skeleton with an unsaturated compound, with (IX) an unsaturated compound having a skeleton, and other unsaturated compound of the following formula.

(In the formula (IX), R7 is a hydrogen atom or a methyl group. q is an integer of 1 or more). As such specific examples, as the linear alkyl methacrylate, there are, for example, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, butyl methacrylate, and tertiary butyl methacrylate. , 2-ethylhexyl methacrylate, isodecyl methacrylate, n-lauryl methacrylate, tridecyl methacrylate, n-stearyl methacrylate, etc.; Ester, such as methyl acrylate, isopropyl acrylate, etc.; -19- 201100956 Cycloalkyl methacrylate, such as cyclohexyl methacrylate, 2-methylcyclohexyl methacrylate, methacrylic acid Ring [5.2.1.02'6]decane-8, dimethyl methacrylate [5.2.1.02'6]decane-8-yloxyethyl ester, isobornyl methacrylate, etc.; The acrylate is, for example, hydroxymethyl methacrylate, 2-hydroxyethyl methacrylate, 3-hydroxypropyl methacrylate, 4-hydroxybutyl methacrylate, diethylene glycol monomethacrylate, 2,3-dihydroxypropyl methacrylate, 2-methylpropenyloxyethylglycoside (glycoside), etc.; The cyclic alkyl esters are, for example, cyclohexyl acrylate, 2-methylcyclohexyl acrylate, tricyclo[5.2.1.02,6]decane-8 ester, tricyclo[5.2.1.〇2'6]癸Alkenyl-8 oxyethyl ester, isobornyl acrylate, etc.; aryl methacrylate, such as phenyl methacrylate, benzyl methacrylate, etc.; aryl acrylate, such as phenyl acrylate, benzyl acrylate, etc.; The saturated dicarboxylic acid diester is, for example, diethyl maleate, diethyl fumarate, diethyl itaconate or the like; a bicyclic unsaturated compound having, for example, a bicyclo [2·2·1] Heptane-2-ene, 5-methylbicyclo[2.2.1]hept-2-ene, 5-ethylbicyclo[2.2.1]hept-2-ene, 5-methoxybicyclo[2.2.1]heptane- 2-ene, 5-ethoxybicyclo[2.2.1]heptene, 5,6-dimethoxybicyclo[2.2.1]hept-2-ene, 5,6-diethoxybicyclo[2.2.1]g 2-ene, 5-tridebutoxycarbonylbicyclo[2.2.1]hept-2-ene, 5-cyclohexyloxycarbonylbicyclo[2.in:^hept-2-ene, 5-phenoxycarbonylbicyclo[ 2.2.1] Hept-2-ene, 5,6-di(tertiary butoxycarbonyl)bicyclo[2.2.1]hept-2-ene, 5,6-di(cyclohexyloxycarbonyl)bicyclo[2.2. Geng-plantene, 5-(2'-hydroxyethyl)bicyclo[2.2.1]heptan-2- , 5,6-dihydroxybicyclo[2.2_1]hept-20- 201100956-2-ene, 5,6-bis(hydroxymethyl)bicyclo[2.2.1]hept-2-ene, 5,6-di ( 2,-Hydroxyethyl)bicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-ethylbicyclo[2.2.1 Hept-2-ene, 5-hydroxymethyl-5-methylbicyclo[2.2.1]hept-2-ene, etc.; maleimide compound, for example, N-phenylbutylene Amine, N-cyclohexylmethyleneimine, N-benzyl maleimide, N-(4-hydroxyphenyl) maleimide, Ν-(4.hydroxybenzyl) Butylenediamine, anthracene-succinimide-3-oxanediimide benzoate, anthracene-amber quinone imido-4-butylene diimine Acid ester, hydrazine-succinimide, hexamethylene phthalate, hydrazine-succinimide, benzyl hydrazide, hydrazine Maleic imide or the like; unsaturated aromatic compound such as styrene, α-methylstyrene, m-methylstyrene, p-methylstyrene, vinyltoluene, p-methoxystyrene, etc.; A conjugated diene having, for example, 1,3-butadiene, isoprene, 2,3- Methyl

An unsaturated compound having a tetrahydrofuran skeleton, such as tetrahydrofurfuryl (meth) acrylate, 2-methylpropenyloxy-tetrahydrofurfuryl propionate, 3-(methyl) propylene oxime tetrahydrofuran-2-one And an unsaturated compound containing a furan skeleton, for example, 2-methyl-5-(3-furyl)-1-penten-3-one, decyl (meth)acrylate, 1-furan-2-butane 3--3-en-2-one, 1-furan-2-butyl-3-methoxy-3-ene-2-one, 6-(2-furyl)-2-methyl-1-hexyl En-3-one, 6·furan-2-yl-hex-1-en-3-one, propylene-21 - 201100956 acid-2-furan-2-yl-1-methyl-ethyl vinegar, 6-( 2-furyl)-6-methyl-1-heptan-3-one or the like; an unsaturated compound containing a tetrahydropyran skeleton, for example, (tetrahydropyran-2-yl)methyl methacrylate , 2,6-dimethyl-8-(tetrahydropyran-2-yloxy)-oct-1-en-3-one, 2-tetrahydropyran-2-yl methacrylate, 1-(tetrahydrogen) Piper-2-oxo)-butyl-3-en-2-one and the like; an unsaturated compound containing a melane skeleton is, for example, 4-(1,4-dioxa-5-sideoxy-6-heptene 6-methyl-2-pyran, 4-(1,5-dioxa-6-o-oxy-7-octyl (6)-methyl-2-pyrane or the like; an unsaturated compound containing a skeleton represented by the above formula (IX), for example, polyethylene glycol (n = 2 to 10) mono(meth)acrylate, poly Propylene glycol (n = 2 to 10) mono (meth) acrylate or the like; other unsaturated compounds, each of which may, for example, be acrylonitrile, methacrylonitrile, vinyl chloride, vinylidene chloride, acrylamide, methacryl Indoleamine, vinyl acetate. Preferably, in the compound (a4), a linear alkyl methacrylate, a cyclic alkyl methacrylate, a cyclic alkyl acrylate, an unsaturated diacetic acid diacetate, a bicyclic unsaturated compound, and maleic acid are used. An imine compound, an unsaturated aromatic compound, a conjugated diene, an unsaturated compound containing a tetrahydrofuran skeleton, an unsaturated compound containing a tetrahydropyran skeleton, or an unsaturated compound containing a skeleton represented by the above formula (IX). Among these, especially styrene, butyl methacrylate, ternary methacrylate [5. 2. 1 · 02, 6] decane-8 vinegar, p-methoxystyrene, 2-methylcyclohexyl acrylate, 1,3-butadiene, bicyclo [2. 2·1] Hept-2-ene, tetrahydrofurfuryl (meth)acrylate, polyethylene glycol (η = 2 to 1 〇) mono (A-22-201100956) acrylate, 3-(methyl) Propylene oxime tetrahydrofuran-2-one, 1-(tetrahydropentan-2-oxo)-butyl-3-en-2-one, decyl (meth) acrylate, N-cyclohexyl maleic acid The imine is preferably selected from the viewpoints of copolymerization reactivity with other compounds and solubility in an aqueous alkali solution. These compounds (a4) may be used singly or in combination. In the copolymer [A] used in the present invention, a preferred specific example of the combination of the compound groups of the monomers is a methacrylic acid/methacrylic acid tricyclic ring [5. 2. 1. 02,6]decane-8-yl ester/glycidyl methacrylate/2-methylindole cyclohexyl acrylate/N-(3,5-dimethyl-4-hydroxybenzyl)methacryl Indoleamine copolymer, methacrylic acid/glycidyl methacrylate/1-(tetrahydropyran-2-oxy)-butyl-3-en-2-one/N-cyclohexyl-n-butenylene Imine/p-methoxystyrene/N-(3,5-dimethyl-4-hydroxybenzyl)methacrylamide copolymer, methacrylic acid/glycidyl methacrylate/methacrylic acid Ring [5. 2. 1. 02'6] decane-8 ester / styrene / N-phenyl maleimide / N-(4-hydroxyphenyl) methacrylamide copolymer, methacrylic acid / methacrylic acid ring Oxypropyl propyl ester / methyl propyl q enoate tricyclo [5. 2. 1. 02'6]decane-8-yl ester/n-lauryl methacrylate/3-methylpropenyloxytetrahydrofuran-2-one/N-(4-hydroxyphenyl)methacrylamide copolymer, A Acrylic acid/glycidyl methacrylate/trimethyl methacrylate [5. 2. 1. 〇 2'6] decane-8 ester / p-methoxy styrene / 4-hydroxybenzyl methacrylate copolymer, methacrylic acid / methacrylic acid tricyclo [5. 2. 1. 02,6]decane-8 ester/glycidyl methacrylate/styrene/p-vinyl benzyl epoxidized propyl ether/tetrahydrofurfuryl methacrylate/4- phenyl acrylate copolymer, methyl Acrylic acid / glycidyl methacrylate / N-cyclohexyl maleimide / 3 - methacryloyloxytetrahydrofuran-2-one / tetrahydrofurfuryl methacrylate / methacrylic acid 4_ -23- 201100956 Hydroxyphenyl ester copolymer, methyl propylene acid/methyl propylene acid propyl acrylate / tetrahydrofurfuryl methacrylate / N-phenyl maleimide / α-methyl-pair Styrene copolymer, methacrylic acid / glycidyl methacrylate / trimethacrylate [5. 2. 1. 02,6]decane-8 ester / fluorene-cyclohexylm-butyleneimide / n-lauryl methacrylate / α-methyl-p-hydroxystyrene copolymer, methacrylic acid / methacrylic acid epoxy Propyl ester / tetrahydrofurfuryl methacrylate / Ν · cyclohexyl maleimide / n-lauryl methacrylate / α-methyl-p-hydroxystyrene copolymer, methacrylic acid / methacrylic acid Ring [5. 2. 1. 02'6] decane-8 ester / formazan propylene acrylate / 2-methylcyclohexyl acrylate / 4,4 '-isopropylidene-diphenol hydroxy group introduced into methacryl oxime Copolymer of compound, methacrylic acid / methacrylic acid tricyclo [5. 2. 1. 02'6] decane-8 ester / methacrylic acid propylene acrylate / 2-methylcyclohexyl acrylate / 1-methyl propylene oxime - 4-naphthol copolymer. The converted polystyrene weight average molecular weight (hereinafter referred to as "Mw") of the copolymer [Α] is preferably 2 x 10 3 to 1 x 10 5 , more preferably 5 χ 103 to 5 χ 104. q By setting the Mw of the copolymer [Α] to 2x1 03 or more, a sufficient development margin of the radiation sensitive resin composition can be obtained, and at the same time, the residual film ratio of the formed coating film can be prevented (the ratio of the pattern shape film remaining properly) In addition, the pattern shape, heat resistance, and the like of the obtained partition walls and the insulating film can be favorably maintained. On the other hand, by setting the Mw of the copolymer [A] to be ΙχΙΟ5 or less, it is possible to maintain a high degree of radiation sensitivity and obtain a good pattern shape. Further, the molecular weight distribution of the copolymer [A] (hereinafter referred to as "Mw/Mn") is preferably 5. 0 or less, more preferably 3. 0 or less. By setting the Mw/Mn of the copolymer [A] to 5. Below 0, the pattern shape of the obtained partition walls and the insulating film can be favorably maintained. Further, the radiation-sensitive resin composition containing the above-mentioned copolymer [A] having a Mw and Mw/Mn ratio which is better than the range of -24 to 201100956, since it has high developability, does not cause development in the developing step. Residual, a predetermined pattern shape can be easily formed. The solvent used in the polymerization for producing the copolymer [A] is, for example, an alcohol, an ether, a glycol ether, an ethylene glycol alkyl ether acetate, a diethylene glycol alkyl ether, a propylene glycol monoalkyl ether. , propylene glycol monoalkyl ether acetate, propylene glycol monoalkyl ether propionate, aromatic hydrocarbons, ketones, other esters, and the like. Examples of the solvent include methanol, ethanol, hexanol, 2-phenyl η ^ ethanol, 3-phenyl-1-propanol, and the like; ethers such as tetrahydrofuran; and glycol ethers such as B. Glycol monomethyl ether, ethylene glycol monoethyl ether, etc.; ethylene glycol alkyl ether acetate, such as methyl cellosolve acetate, ethyl cellosolve acetate, ethylene glycol monobutyl ether acetate Ester, ethylene glycol monoacetic acid acetate, etc.; diethylene glycol alkyl ether, such as diethylene glycol monomethyl ether, diethyl ether monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether , propylene glycol monomethyl ether, etc.; propylene glycol monoalkyl ether such as propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, etc.; propylene glycol monoalkyl ether acetate, such as propylene glycol monomethyl ether Acetate, propylene glycol monoethyl ether acetate 'propylene glycol monopropyl ether acetate, propanol monobutyl ether acetate, etc.; -25 - 201100956 propylene glycol monoalkyl ether propionate, such as exopropyl monoethyl Alcohol methyl ether propionate, propylene glycol monoethyl ether propionate, propylene glycol monopropyl ether propionate, propylene glycol monobutyl ether propionate, etc.; Examples of the hydrocarbons include toluene, xylene, and the like: ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, and the like; and other esters may, for example, methyl acetate or ethyl acetate. , propyl acetate, butyl acetate, ethyl 2-hydroxypropionate, methyl 2-hydroxy-2-methylpropionate, ethyl 2-hydroxy-2-methylpropionate, methyl glycolate, glycolic acid Ethyl ester, butyl glycolate, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, methyl 3-hydroxypropionate, ethyl 3-hydroxypropionate, propyl 3-hydroxypropionate, 3- Butyl hydroxypropionate, methyl 2-hydroxy-3-methylbutanoate, methyl methoxyacetate, ethyl methoxyacetate, propyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, Ethyl ethoxyacetate, propyl ethoxyacetate, butyl ethoxyacetate, methyl propyl oxyacetate, ethyl propyl oxyacetate, propyl propoxyacetate, butyl propyl acetate, methyl butoxyacetate, butyl Q Ethyl oxyacetate, butyl butoxyacetate, butyl butoxyacetate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, 2-methoxypropionic acid Butyl ester, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate , propyl 2-ethoxypropionate, butyl 2-ethoxypropionate, methyl 2-butoxypropionate, ethyl 2-butoxypropionate, propyl 2-butoxypropionate, 2-butoxy Butyl propionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, propyl 3-methoxypropionate, butyl 3-methoxypropionate, methyl 3-ethoxypropionate, Ethyl 3-ethoxypropionate, propyl 3-ethoxypropionate, butyl 3-ethoxypropionate, methyl 3-propoxypropionate, ethyl 3-propoxypropionate, 3-propoxypropane Propyl acrylate, 3-propoxy-26- 201100956 butyl propionate, methyl 3-butoxypropionate, ethyl 3-butoxypropionate, propyl 3-butoxypropionate, 3-butoxypropionic acid Esters such as esters. Among these solvents, it is preferably ethylene glycol alkyl ether acetate, diethylene glycol alkyl ether, propylene glycol monoalkyl ether, propylene glycol alkyl ether acetate, particularly diethylene glycol dimethyl ether, diethylene glycol Ethyl ether, propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate. As the polymerization initiator to be used in the polymerization for producing the copolymer [A], a conventionally known radical polymerization initiator can be generally used. Examples are 2,2'-azobisisobutyronitrile, 2,2·-azobis-(2,4-dimethylvaleronitrile), 2,2·-azobis-(4-methoxy Azo compounds such as benzyl-2,4-dimethylvaleronitrile; benzamidine peroxide, lauryl peroxide, tertiary butyl peroxytrimethyl acetate, 1, Γ-bis-(three An organic peroxide such as butyloxy)cyclohexane; and hydrogen peroxide. In the case where a peroxide is used as the radical polymerization initiator, it is also possible to use a peroxide together with a reducing agent as a redox type initiator. In the polymerization reaction for producing a copolymer [Α], a molecular weight modifier may be used in order to adjust the amount of molecular Q. Specific examples of the molecular weight modifier include halogenated hydrocarbons such as chloroform and carbon tetrabromide; mercaptans such as n-hexyl mercaptan, n-octyl mercaptan, n-dodecyl mercaptan, tridecyl thiol, and thioglycolic acid; ; xanthogen sulfide (xanthogen) sulfide, diisopropylxanthate disulfide and other xanthogens; terpinolene, α-methyl benzene ethane dimer. [B] component The component [B] used in the radiation sensitive resin composition of the present invention is a 1,2-quinonediazide compound which generates a carboxylic acid by irradiation with radiation. -27- 201100956 1,2-醌 diazide compound condensate of phenolic compound or alcoholic compound (hereinafter referred to as "mother core") and 1,2-naphthoquinonediazidesulfonic acid halide . Examples of the above-mentioned parent core include, for example, trihydroxybenzophenone, tetrahydrohydroxybenzophenone, pentahydroxybenzophenone, hexahydrohydroxybenzophenone, (polyhydroxyphenyl)alkane, and other mother cores. In terms of the core, in the hydroxybenzophenone, there are, for example, 2,3,4-trihydroxybenzophenone, 2,4,6-trihydroxybenzophenone, etc.; tetrahydrohydroxybenzophenone, for example, 2 , 2_, 4, 4, _ tetrahydroperbenzophenone, 2,3,4,3'-tetrahydroperbenzophenone, 2,3,4,4,-tetrahydro hydroxybenzophenone, 2,3 , 4,2'-tetrahydrohydroxy-4|-methylbenzophenone, 2,3,4,4--tetrahydro-pyridyl-31-methoxybenzophenone, etc.; pentahydroxybenzophenone, for example 2 , 3,4,2',6'-pentahydroxybenzophenone, etc.; hexahydrodiphenyl ketone, such as 2,4,6,3_,4',5'-hexahydrodiphenyl hydrazine, 3, 4,5,3',4',5'-hexahydrohydroxybenzophenone, etc.; (polyhydroxyphenyl)alkane, for example, bis(2,4-dihydroxyphenyl)methanthine (p-hydroxybenzene) Methane, ginseng (p-hydroxyphenyl) methane, 1,1,1-parameter (p-phenylene 0, bis (2,3,4-triphenyl)), 2,2-dual ( 2,3,4_3 phenyl)propane Q, 1,1,3-parade (2,5-dimethyl-4-hydroxyphenyl)-3-benzene [4-[ 1-[ 4-hydroxybenzene 5-ylethyl]phenyl]ethylene]biguanide, bis(2,5-dimethyl-4-hydroxyphenyl)-2-hydroxyphenylmethane, 3,3,3,,3, _Tetramethyl-1, Γ-helical bismuth-5,6,7,5',6·,7'·hexanol, 2,2,4 -h methyl _7 2, 4,.  Others, such as 2-methyl-2-(2,4-dihydroxyphenyl)_4_(4_phenyl)-7-hydroxychroman (chroman) , 2-[bis{(5-isopropyl-4-hydroxy-2-methyl)phenyl}methyl], hydroxyphenylmethyl}_4,6-dihydroxyphenyl)-1-methylethyl]- 3-(1-(3-{1-(4-hydroxyphenylethyl-28-201100956)}-4,6-dihydroxyphenyl)-1-methylethyl)benzene, 4,6-double {1- (4-Hydroxyphenyl)-1-methylethyl}-1,3-dihydroxybenzene. In the parent core, 'it is preferably 2,3,4,4,-tetrahydro hydroxybenzophenone, 1,1, 1-n-(p-hydroxyphenyl)ethane, 4,4,-[1-[4-[1-[4-hydroxyphenyl]-1-methylethyl]phenyl]ethylidene] biguanide. '1,2-naphthoquinonediazidesulfonic acid halogen is preferably 12-naphthoquinonediazidesulfonic acid chloride. Specific examples of 1,2-naphthoquinonediazidesulfonic acid chloride, for example 1,2-naphthoquinonediazide-4-sulfonic acid chloride and 1,2-naphthoquinonediazide-5-indolesulfonic acid chloride. Among them, the use of 1,2.naphthoquinonediazide Chloride-5-sulfonic acid chloride. In the condensation reaction of a phenolic compound or an alcoholic compound (mother core) with a 1,2-naphthoquinonediazidesulfonic acid halide, relative to phenolation The number of OH groups in the compound or the alcohol compound is preferably from 30 to 85 mol%, more preferably from 50 to 70 mol% of 1,2-naphthoquinonediazidesulfonic acid halide. Further, in the case of the 1,2-quinonediazide compound, the 1,2-naphthoquinonediazide group which is exemplified by the Q-modified ester bond of the above-mentioned Q to form a guanamine bond can also be suitably used. Sulfonium sulfonate, for example, 2,3,4-trihydroxybenzophenone-1,2-naphthoquinonediazide-4-sulfonic acid decylamine, etc. The [B] components may be used alone or in combination. The use ratio of the component [B] in the radiation sensitive resin composition is preferably from 5 to 100 parts by mass, more preferably from 10 to 50 parts by mass, per 100 parts by mass of the copolymer [A]. When the ratio of the component [B] in the resin composition is 5 parts by mass or more, the difference in solubility between the irradiated portion and the unirradiated portion of the aqueous solution which is the aqueous solution of the developer is increased, and patterning is facilitated, and at the same time - 29- 201100956 Good heat resistance and solvent resistance of the obtained partition wall and insulating film. On the one hand, 'by setting the ratio of [B] component When the amount of the alkali aqueous solution in the radiation-irradiated portion is maintained at a sufficiently high level, the development can be easily performed. The component [C] is a thermosensitive dye. The so-called "sensible heat" A dye is a compound which has a coloring property by heating in a state of accepting an electron accepting compound (for example, a proton such as an acid). In terms of a thermosensitive dye, it is particularly preferred to have a lactone and an indoleamine. A part of the skeleton of sultone, spirulina, vinegar, guanamine or the like is preferably a colorless compound which rapidly opens or cleaves the partial skeleton upon contact with the electron accepting compound. Examples of such sensible dyes include 3,3-bis(4-dimethylaminophenyl)_6-dimethylamino phthalide (referred to as "crystal violet lactone"), 3,3- Bis(4-dimethylaminophenyl)decalactone, 3-(4-dimethylaminophenyl)-3-(4-diethylamino-2-tolyl)-6-dimethylamino azlactone , 3-(4-dimethylaminophenyl)-3-(1,2-dimethyl Q indol-3-yl)decanolide, 3-(4-dimethylaminophenyl)-3-(2 -carbam-3-yl) azlactone, 3,3-bis(1,2-dimethyl-3-yl)-5-dimethylaminodecanolide, 3,3-di (1 , 2-dimethyl-3-yl)-6-dimethylamino azlactone, 3,3-bis(9-ethyloxazol-3-yl)-6-dimethylaminodecalactone, 3,3-bis(2-phenylindole-3-yl)-6-dimethylamino azlactone, 3-(4-dimethylaminophenyl)-3-(1-methylpyrrole-3-yl -6-dimethylamino azlactone; 3, 3-bis[l,l-bis(4-dimethylaminophenyl)ethen-2-yl]-4,5,6,7-tetrachloroindole Lactone, 3,3-bis[1,1-bis(4-pyrrolidino)vinyl-2-yl]-4,5,6,7-tetrabromodecanolide, 3,3-dual 1-(4-Dimethylaminophenyl)-1-(4-methoxy-30- 201100956 phenyl)vinyl-2-yl]-4,5,6,7 - Chlorolactone, 3,3-bis[1-(4-pyrrolidinyl)-1-(4-methoxyphenyl)ethen-2-yl]-4,5,6,7-tetrachloro Azlactone, 3-[ 1,1-di(1-ethyl-2-carboxy-3-yl)ethen-2-yl]-3-(4-diethylamine phenyl)decalactone, 3-[ 1,1-bis(1-ethyl-2-methylindol-3-yl)ethenyl-2-yl]-3-(4-N-ethyl-N-anilinophenyl)decanolide , 3-(2-ethoxy-4-diethylamine phenyl)-3-(1-n-octyl-2-carboxy-3-yl)-decalactone, 3,3-dual (1) -n-octyl-2-carboxy-3-yl)-decalactone, 3-(2-methyl-4-diethylaminephenyl)-3-(1-n-octyl-2-carboxamidine酞-3 yl)-decalactone and the like azlactone 0; 4,4-bis-dimethylamino benzoin benzyl ether, N-halophenyl-leuco-auramine , N-2,4,5-dichlorophenyl colorless amine, rhodamine-B-anilinoindol, rhodamine-(4-nitroanilino) indoleamine; rhodamine-B-(4- Chloroanilino), decylamine, 3,7-bis(diethylamino)-10-benzimidylazine, benzamidine leuco methylene blue, 4-nitrobenzhydryl methylene blue; 3,6-Dimethoxyfluorescent yellow fluoran, 3-dimethylamino-7-A Fluorescence Q yellow mother, 3 -diethylamino-6-methoxy campan yellow mother, 3 -diethylamino-7-methoxyfluorescent yellow mother, 3-diethylamino-7-chlorofluorescence Yellow mother, 3-diethylamino-6-methyl-7-chlorofluorescent yellow mother, 3-diethylamino-6,7-dimethylfluorescent yellow mother, 3-N-cyclohexyl-N- n-Butylamino-7-methylfluorescent yellow mother, 3-diethylamino-7-dibenzylamine fluorescent yellow mother, 3-diethylamino-7-octylamine fluorescent yellow mother, 3-two Ethylamino-7-di-n-hexylamine fluorescent yellow mother, 3-diethylamino-7-phenylamine fluorescent yellow mother, 3-diethylamino-7-(2fluoroanilino) fluorescent yellow mother, 3-Diethylamino-7-(2'-chloroanilino)fluorescent yellow mother, 3-diethylamino-7-(3·-chloroanilino)fluorescent yellow mother, 3-diethylamino - 7-(2 31-dichloroanilino) -31- 201100956 Fluorescent yellow mother, 3-diethylamino-7-(3'-trifluoromethylanilino) fluorescent yellow matrix, 3-di- n-Butylamino-7-(2'-fluoroanilino)fluorescent yellow mother, 3-di-n-butylamino-7-(2'-chloroanilino)fluorescent yellow mother, 3-N-isoprene -N-ethylamino-7-(2'-chloroanilino)fluorescent yellow precursor; 3-N-n-hexyl-N-ethylamino-7-(2'-chloroaniline Fluorescent yellow mother, 3-diethylamino-6-chloro-7-aniline fluorescent yellow mother, 3-di-n-butylamino-6-chloro-7-phenylamine fluorescent yellow mother, 3-2-B Amino-6-methoxy-7-phenylamine fluorescent yellow mother, 3-di-n-butylamino-6-ethoxy-7-phenylamine fluorescent yellow mother, 3-pyrrolidine-6-A -7-aniline fluorescent yellow mother, 3-N-hexahydropyridyl-6-methyl-7-phenylamine fluorescent yellow mother, 3-morpholinyl-6-methyl-7-aniline fluorescent yellow matrix , 3-dimethylamino-6-methyl-7-phenylamine fluorescent yellow mother, 3-diethylamino-6-methyl-7-aniline fluorescent yellow mother, 3-di-n-butylamino group- 6-methyl-7-aniline fluorescent yellow mother, 3-di-n-pentylamino-6-methyl-7-phenylamine fluorescent yellow mother, 3-N-ethyl-N-methylamino-6- Methyl-7-aniline fluorescent yellow mother, 3-N-n-propyl-N-methylamino-6-methyl-7-phenylamine fluorescent yellow mother, 3-N-n-propyl-N-ethylamine Base q -6-methyl-7-aniline fluorescent yellow mother, 3-N-n-butyl-N-methylamino-6-methyl-7-phenylamine fluorescent yellow mother, 3-N-n-butyl -N-ethylamino-6-methyl-7-phenylamine fluorescent yellow mother, 3-N-isobutyl-N-methylamino-6-methyl-7-phenylamine fluorescent yellow mother, 3-N -isobutyl-N-ethylamino-6-A -7-aniline fluorescent yellow mother, 3-N-isopentyl-N-ethylamino-6-methyl-7-phenylamine fluorescent yellow mother, 3-N-n-hexyl-N-methylamino-6 -Methyl-7-aniline fluorescent yellow mother, 3-N-cyclohexyl-N-ethylamino-6-methyl-7-phenylamine fluorescent yellow precursor, 3-N-cyclohexyl-N-n-propylamino _6_Methyl-7-aniline fluorescent yellow mother, 3-N-cyclohexyl-N-n-butylamino-6-methyl-7-phenylamine fluorescent yellow mother, 3-N-cyclohexyl-N- n-Hexylamino-6-methyl-32- 201100956 -7-aniline fluorescent yellow mother, 3-N-cyclohexyl-N-n-octylamino-6-methyl-7-aniline fluorescent yellow matrix; 3- Ν-(2·-methoxyethyl)-N-methylamino-6-methyl-7-phenylamine fluorescent yellow precursor, 3-indole-(2'-methoxyethyl)-indole-ethylamino group- 6-Methyl-7-aniline fluorescent yellow mother, 3_Ν·(2'-methoxyethyl)-Ν-isobutylamino-6-methyl-7-phenylamine fluorescent yellow mother, 3-Ν-( 2'-Ethoxyethyl)-indole-methylamino-6-methyl-7-anilinofluorescent yellow mother, 3-indole-(2'-ethoxyethyl)-indole-ethylamino-6 -Methyl-7-anilinofluorescent yellow mother, 3-indole-(3'-methoxypropyl)-indole-methylamino-6-methyl-7-aniline fluorene^ Light yellow mother, 3-Ν -(3'-methoxypropyl)-indole-ethylamino-6-methyl-7-benzene Fluorescent yellow mother, 3-Ν-(3'-ethoxypropyl)-fluorene-methylamino-6-methyl-7-phenylamine fluorescent yellow mother, 3-Ν-(3'-ethoxypropyl )-Ν-ethylamino-6-methyl-7-phenylamine fluorescent yellow mother, 3-Ν-(2'-tetrahydroindenyl)-fluorene-ethylamino-6-methyl-7-aniline Light yellow precursor, 3-Ν-(4'-methylphenyl)-oxime-ethylamino-6-methyl-7-phenylamine fluorescent yellow mother, 3-diethylamino-6-ethyl-7-aniline Fluorescent yellow mother, 3-diethylamino-6-methyltoluamide, fluorescent yellow mother, 3-diethylamino-6-methylq-7-(2',6'-dimethylaniline Fluorescent yellow mother, 3-di-n-butylamino-6-methyl-7-(2',6'-dimethylamino) fluorescent yellow precursor, 3-di-n-butylamino-7 -(2',6'-dimethylamino)fluorescent yellow mother, 2,2-bis[4'-(3-Ν-cyclohexyl-fluorenyl-methylamino-6-methylfluorescent yellow mother) -7-aminoamine phenyl]propane, 3-[4'-(4-anilinophenyl)amine phenyl]amino-6-methyl-7-chlorofluorescent yellow mother, 3-[4'-(two Fluorescent yellow mother of methylamine phenyl)-amino-5,7-dimethylfluorescent yellow precursor; 3-(2-methyl-4-diethylaminephenyl)-3-(1-ethyl 2-methylindole-3-yl)-4-azaindole lactone 3-(2-n-propoxycarbonylamino-4-di-n-propylamine phenyl)-3-(iethyl-2-carboxy-3-yl)-4-azadecanolactone, 3-(2 -Methylamino-33- 201100956 -4-di-n-propylamine phenyl)-3-(1-ethyl-2-carboxy-3-yl)-4-azadecanolactone, 3-(2 -methyl-4-di-n-hexylamine phenyl)-3-(1-n-octyl-2-carboindole-3-yl)-4,7-diazepine lactone, 3,3-bis (2 -ethoxy-4-diethylamine phenyl)_4_ azaindole, 3,3-bis(1-n-octyl-2-methylindol-3-yl)-4 -azaindole Ester, 3-(2-ethoxy-4-diethylamine phenyl)-3-(1-ethyl-2-carbazin-3-yl)-4-azadecanolactone, 3-( 2-ethoxy-4-diethylamine phenyl)-3-(1-octyl-2-carboxy-3-yl)-4 or 7-azadecalactone, 3-(2-B Oxy-4-diethylamine phenyl)-3-(1-ethyl-2-carboxy-3-yl)-4 or 7·azadecanolide, 3-(2-^hexyloxy) -4-diethylamine phenyl)-3-(1-ethyl-2-carboxy-3-yl)-4 or 7-azapinolide, 3-(2-ethoxy-4-di Ethylamine phenyl)-3-(1-ethyl-2-benzoin-3-yl)-4 or 7-azadecalactone, 3-(2-butoxy-4-diethylamine benzene Benzyl-3-(1-ethyl-2-phenylindole-3-yl)-4 or 7-nitrogen Heterolactone 3-methyl-helix-dinaphthylpyran, 3-ethyl-helix-dinaphthylpyran, 3-phenyl-helix-dinaphthylpyran, 3-benzyl-helix- Dinaphthylpyran, 3-methyl-naphtho-(3-methoxybenzo)spiropyran, 3-propyl-helix-dibenzopyran-3,6-bis(dimethyl q-amino group )F-9-helix-3'-(6'.dimethylamino)decalactone, 3,6-bis(diethylamino)phosphonium-9-helix-3^(6'-dimethylamino) Azlactones such as azlactone; others have 2·-anilino-6'-(Ν-ethyl-Ν-isopentyl)amino-3'-methyl helix [isobenzofuran-1 (3Η), 9'-(9Η)]卩山唱-3-嗣, 21-anilino-6'-(Ν-ethyl-Ν-(4-methylphenyl))amino-3'-methyl helix [isobenzofuran-1 (3H), 9'-(9H)D mountain sing]-3-one, 3'-fluorene, fluorene-dibenzylamino- 6'-fluorene, fluorene-diethylamine-based helix [isobenzofuran-1 (3Η), 9'-(9Η)卩山喔]-3-one, 2'-(Ν-methyl-Ν-phenyl)amino- 6'-(Ν-B Alkyl-fluorene-(4-tolyl)amine-based helix [isobenzofuran-1 (3Η), 9, (9Η) anthraquinone]-3-one, and the like. -34- 201100956 For the commercial products of these thermosensitive pigments, there are ETAC, RED 5 00, RED520, CVL, S-205, BLACK305, BLACK400, BLACK100, BLACK500, Η-70 (Π, GREEN300, NIR BLACK78, BLUE220, H-3035, BLUE203' ATP, Η-1046, Η-2114 (manufactured by Yamada Chemical Industry Co., Ltd.), ORANGE-DCF, Vermilion-DCF, PINK-DCF 'RED-DCF, BLMB, CVL > GREEN-DCF ' T Η - 1 0 7 (Η odogaya Chemical Co., Ltd.), etc. Among these commercial products, ETAC, S-205, BLACK3 05, BLACK400, BLACK100, BLACK500, H-700 1, Ο GREEN300, NIR BLACK78, H-3035, ATP, H-1046, H-2114, GREEN-DCF are preferred because of the good visible light absorption of the formed film. The sensible dyes are visible through the partition walls and insulating films. The light spectrum may be used in combination of two or more kinds of components. The use ratio of the [C] component in the radiation sensitive resin composition is preferably 0. by mass based on 100 parts by mass of the copolymer [A]. 1 to 30 parts by mass, more preferably 0. 5 to 15 parts by mass. By setting the ratio of [C] components to 0. When the amount is 1 part by mass or more, the light of the desired Q can be efficiently absorbed, and the light blocking property is exhibited. On the other hand, by setting the ratio of the component [C] to 30 parts by mass or less, the radiation sensitivity of the radiation sensitive resin composition and the solvent resistance or heat resistance of the obtained partition walls and the insulating film can be favorably maintained. Other optional components The radiation sensitive resin composition of the present invention contains the above [A], [B], and [C] components as essential components, but other may contain: [D] sensible acid generating compound, [E] A polymerizable compound having at least one ethylenically unsaturated double bond, an epoxy resin other than the [F] copolymer [A], a [G] surfactant, and a [H] adhesion aid. -35- 201100956 The heat-sensitive acid generating compound of the [D] component is used to improve the heat resistance or surface hardness of the obtained partition wall and the insulating film. The thermosensitive acid generating compound may, for example, be a salt of a sulfonium salt, a benzothiazolium salt, an ammonium salt or a scale salt. Examples of the above sulfonium salt include alkane sulfonium salt, benzamidine salt, dibenzyl hydrazine salt, and substituted benzyl sulfonium salt. In terms of the onium salts, the alkoxides are, for example, 4-ethenyloxyphenyldimethylhydrazine hexafluoroantimonate, 4-ethenoxyphenyldimethylhydrazine hexafluoroarsenate, dimethyl-4-(benzylidene). Oxycarbonyloxy)phenylphosphonium hexafluoroantimonate, dimethyl-4-(benzylideneoxy)phenylphosphonium hexafluoroantimonate, dimethyl-4-(benzidineoxy)phenylphosphonium hexafluorophosphate Arsenate, dimethyl 3 - chloro - 4 - ethoxy phenyl hexafluoroantimonate, etc.; benzamidine salt such as benzyl-4-hydroxybenzhydryl hexafluoroantimonate 'benzyl-4 - hydroxybenzimidium hexafluorophosphate, 4-ethenoxybenzylbenzyl sulfonium hexafluoroantimonate, benzyl-4-methoxybenzhydryl hexafluoroantimonate, benzyl-2-methyl-4 - hydroxybenzimidium hexafluoroantimonate, benzyl-3-chloro-4-hydroxybenzhydrazinium hexafluoroarsenate, 4-methoxybenzyl-4-hydroxyphthalate hexafluorophosphate, etc.; a dibenzyl sulfonium salt, for example, dibenzyl-4-hydroxyphenylhydrazine hexafluoroantimonate, dibenzyl-4-hydroxyphenylhydrazine hexafluorophosphate, 4-ethenoxybenzoic acid hexafluoroantimonate , dibenzyl-4-methoxybenzoquinone hexafluoroantimonate, dibenzyl-3-chloro-4-hydroxyphenylhydrazine hexafluoroarsenate, dibenzyl-3-methyl-4-hydroxy-5 - Tertiary butylphthalide hexafluoroantimonate, benzyl-4-methoxybenzyl-4- Benzoquinone hexafluorophosphate or the like; the substituted benzamidine salt may, for example, be p-chlorobenzyl-4-hydroxybenzylsulfonium hexafluoroantimonate or p-nitrobenzyl-4-hydroxybenzamide hexafluoroantimonate , p-chlorobenzyl-4-hydroxybenzyl mirror hexafluorophosphate, p-nitrobenzyl-3-methyl-4-hydroxybenzhydrazinium hexafluoroantimonic acid-36- 201100956 salt, 3,5-dichlorobenzyl 4-hydroxybenzimidium hexafluoroantimonate, o-chlorobenzyl-3-chloro-4-hydroxybenzhydrazinium hexafluoroantimonate, and the like. Examples of the above benzothiazole moieties include 3-benzylbenzothiazole hexafluoroantimonate, 3-benzylbenzothiazole gun hexafluorophosphate, 3-benzylbenzothiazole quaternary boron fluoroborate. , 3-(p-methoxybenzyl) benzothiazole iron hexafluoroantimonate, 3-benzyl-2-methylthiobenzothiazole gun hexafluoroantimonate, 3-benzyl-5-chlorobenzene And thiazole gun hexafluoroantimonate. Among these thermosensitive acid generating compounds, an onium salt and a benzothiazole key salt are preferably used. More preferably, it is 4-ethyloxoxime hexafluoroarsenate, benzyl-4-hydroxybenzhydrazinium hexafluoroantimonate, 4-ethenoxabenzamide hexafluoroantimonate, Benzyl-4-hydroxyphenylhydrazine hexafluoroantimonate, 4-ethenoxybenzoquinone hexafluoroantimonate, 3-benzylbenzothiazole gun hexafluoroantimonate. For the commercial products of these sensible acid-generating compounds, Sun A SI-L85, Sunaid SI-L110, Sunaid SI-L145, Sunaid SI-L150, and Sunaid SI-L160 (manufactured by Sanshin Chemical Industry Co., Ltd.) Wait. The use ratio of the [D] component in the radiation sensitive resin composition is preferably 0.% by mass based on 100 parts by mass of the copolymer [A]. 1 to 20 parts by mass is more preferably 1 to 10 parts by mass. By setting the mixing amount of the [D] component to 0. 1 to 20 parts by mass, it is possible to prevent the occurrence of precipitates in the coating film forming step while forming a cured film having sufficient strength. In the case of a polymerizable compound having at least one ethylenically unsaturated double bond of the component [E], for example, a monofunctional (meth) acrylate, a bifunctional (meth) acrylate, or a trifunctional or higher (methyl group) can be suitably used. )Acrylate. -37- 201100956 For monofunctional (meth) acrylates, for example, 2-hydroxyethyl (meth)acrylate, carbitol (meth)acrylate, isobornyl (meth)acrylate, (methyl) 3-methoxybutyl acrylate, 2-(phthalic acid) (meth) propylene oxiranyl 2-hydroxypropyl ester, and the like. Examples of the commercially available monofunctional (meth) acrylates include Aronics M-101, A'ronics M-lll, Aronics M-114 (above, East Asia Synthetic Co., Ltd.), KAYARAD TC -110S, KAYARAD TC-120S (above is manufactured by Nippon Kayaku Co., Ltd.), Viscoat 158, Viscoat 2311 (above, manufactured by Osaka Organic Chemical Industry Co., Ltd.). Examples of the bifunctional (meth) acrylate include ethylene glycol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, and 1,9-fluorene di(meth)acrylate. Alcohol ester, polypropylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, bisphenoxyethanol decyl diacrylate, bisphenoxyethanol acrylate, and the like. As a commercial item of such a bifunctional (meth) acrylate, for example, Aronics M-210, Aronics M-240, Aronics M-6200 (above, manufactured by Toagosei Co., Ltd.), KAYARADHDDA, and HX can be exemplified. -220, the same as R-604 (the above is manufactured by Nippon Kayaku Co., Ltd.), Viscoat 260, Viscoat 312, and Viscoat 335HP (the above is manufactured by Osaka Organic Chemical Industry Co., Ltd.). Examples of the trifunctional or higher (meth) acrylate include trimethylol (meth)acrylate, neopentyl tris(meth)acrylate, and bis((meth)acryloyloxyethyl)phosphoric acid. Ester, neopentyl tetrakis(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, and the like. For commercial products of such trifunctional or higher (meth) acrylates, for example, Aronics M-3 09 'Aronics M-400 ' Aronics M-405 ' Aronics -38- 201100956 M-450 , Aronics M-7 1 00, Aronics M-803 0, Aronics M-8060 (above is East Asia Synthetic Co., Ltd.), KAYARAD TMPTA, KAYARAD DPH A, KAYARAD DPCA-20, KAYARAD DPCA-30, KAYARAD DPCA-60, KAYARAD DPCA-120 (The above is manufactured by Nippon Kayaku Co., Ltd.), Viscoat 295, Viscoat 300, Viscoat 3 60, Viscoat GPT, Viscoat 3PA, and Viscoat 400 (above, manufactured by Osaka Organic Chemical Industry Co., Ltd.). Among these methyl (acrylate) types, it is preferable to use a trifunctional or higher (meth) acrylate from the viewpoint of improvement in heat resistance and surface hardness of the formed partition wall and the insulating film. Among them, trimethylol (meth)acrylate, neopentyl tetra(meth)acrylate, and neopentyl hexa(meth)acrylate are preferred. These monofunctional, bifunctional or trifunctional or higher functional (meth) acrylates may be used singly or in combination. The use ratio of the [E] component in the radiation sensitive resin composition is preferably from 1 to 50 parts by mass, more preferably from 3 to 30 parts by mass, based on 100 parts by mass of the copolymer [A].设定 By setting the mixing amount of the [E] component to 1 to 50 parts by mass, the heat resistance and surface hardness of the obtained partition walls and the insulating film can be improved, and the occurrence of film splitting in the step of forming a coating film on the substrate can be suppressed. . The epoxy resin other than the copolymer [A] of the [F] component is not particularly limited as long as it does not adversely affect the compatibility of the components contained in the radiation sensitive resin composition. Examples of such an epoxy resin are bisphenol A epoxy resin, phenol novolak epoxy resin, cresol novolak epoxy resin, cyclic aliphatic epoxy resin, and glycidyl ester. Epoxy resin, -39- 201100956 Epoxy propylamine type epoxy resin, heterocyclic epoxy resin, resin (co)polymerization of glycidyl methacrylate. Among these, a bisphenol A type epoxy resin, a cresol novolac type epoxy resin, a glycidyl ester type epoxy resin, and the like are particularly preferable. The use ratio of the [F] component in the radiation sensitive resin composition is preferably 30 parts by mass or less based on 100 parts by mass of the copolymer [A]. By using the [F] component in such a ratio, the heat resistance and surface hardness of the partition wall and the insulating film obtained from the self-inductive radiation-linear resin composition can be further improved, and a coating film of a radiation-sensitive resin composition can be formed on the substrate. At that time, a high film thickness uniformity can be obtained. Further, although the copolymer [A] may also be referred to as "epoxy resin", it is different from the [F] component in view of having an alkali solubility. The [F] component is alkali-insoluble. In the radiation sensitive resin composition, a surfactant can be used in order to further improve the applicability of the coating film formation [[G] component. The surfactant which can be suitably used may, for example, be a fluorine-based surfactant, a polyfluorene-based surfactant, or a nonionic surfactant. Examples of fluorine-based surfactants include 1,1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl)ether, 1,1,2,2-tetrafluorooctyl Ether, octaethylene glycol di(i,i,2,2-tetrafluorobutyl)ether, hexaethylene glycol (1,1,2,2,3,3-hexafluoropentyl)ether, octapropylene glycol a fluoroether such as (1,1,2,2-tetrafluorobutyl)ether or hexapropanediol bis(1,1,2,2,3,3-hexafluoropentyl)ether; perfluorododecylsulfonate Sodium fluoride; 1,1,2,2,8,8,9,9,10,10-decafluorododecane, l,l,2,2,3,3-hexafluorodecane, etc. Sodium fluoroalkanesulfonate; fluoroalkane oxyethylene ether; fluoroalkylammonium iodide; fluoroalkane polyoxyethylene ether; -40- 201100956 perfluoroalkane polyoxyethanol; perfluoroalkane alkoxide Class; fluorine alkyl esters and the like. Commercial products of these fluorine-based surfactants include BM-1 000, BM-1100 (above BM Chemie), megafac F142D, megafac F 1 72, megafac F 1 7 3, megafac F 1 8 3 , megafac F 1 7 8 ' megafac F191, megafac F471 (above is made by Dainippon Ink Chemical Industry Co., Ltd.), Fluorad FC-170C, FC-171, FC-430, FC-431 (above Sumitomo 3M (shares) Company), Surflon S-112, SUrflon S-113, Surflon S-131, Surflon S-141, Surflon S-145, Surflon O S-382, Surflon SC-101, Surflon SC-102, Surflon SC-103, Surflon SC-104, Surflon SC-105, Surflon SC-106 (made by Asahi Glass Co., Ltd.), EFTOP EF301, EFTOP 303, EFTOP 352 (made by Shinki Ueda Chemical Co., Ltd.). Specific examples of the polyoxo-based surfactant include commercially available product names such as DC3PA, DC7PA' FS-1 265, SF-8428, SH11PA, SH21PA, SH28PA, SH29PA, SH30PA, SH-190, and SH-193. , SZ-6032 (to the line on Toray.  Dow Corning · Polyoxane Co., Ltd.), TSF-4440, TSF-4300, TSF-4445, TSF-4446, TSF-4460, TSF-4452 (above is GE Toshiba Polyxide Co., Ltd.) Wait. Examples of the nonionic surfactant include polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, and polyoxyethylene oleyl ether; polyoxyethylene octyl phenyl ether and polyoxyethylene benzene A polyoxyethylene aryl ether such as ether; a polyoxyethylene dialkyl ester such as polyoxyethylene dilaurate or polyoxyethylene distearate; or a (meth)acrylic copolymer. A representative commercial product of a nonionic surfactant is polyflovvNo. 57, 95 (Common Sociology -41 - 201100956 academic (share) system). These surfactants may be used singly or in combination of two or more. In the radiation sensitive resin composition, the surfactant of the [G] component is preferably 〇 with respect to 100 parts by mass of the copolymer [A]. 〇 1 to 5 parts by mass, more preferably 0. 0 5 to 3 parts by mass. By setting the amount of surfactant to be mixed at 0. 0 to 5 parts by mass, and the occurrence of film splitting when a coating film is formed on a substrate can be suppressed. In the radiation sensitive resin composition of the present invention, in order to improve the adhesion to the substrate, an adhesion aid which is a component [H] can be used. In the case of such an adhesion aid, it is preferred to use a functional decane coupling agent. Examples of the functional decane coupling agent include a decane coupling agent having a reactive substituent such as a carboxyl group, a methacryl group, an isocyanate group or an epoxy group. Specific examples of the functional decane coupling agent include trimethoxymethane benzoate, γ-methyl propylene oxypropyl trimethoxy decane 'ethylene triethoxy decane, ethylene trimethoprim, γ-isocyanate C A triethoxylate, gamma-glycidoxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxydecane, and the like. In the radiation-sensitive resin composition, the adhesion aid is preferably 0% by mass based on 100 parts by mass of the copolymer [Α]. 1 to 30 parts by mass, more preferably 1 to 25 parts by mass. By setting the mixing amount of the adhesion aid of the [Η] component to 〇·1 to 20 parts by mass', the development residue can be prevented from being developed in the developing step, and the pattern can be easily formed by exhibiting sufficient adhesion with respect to the substrate. Radiation-sensitive resin composition The radiation-sensitive resin composition of the present invention is obtained by uniformly mixing the above [A], [Β], and [C] components, and optional components ([D] to [Η] components). And -42- 201100956 modulation. Usually, the radiation sensitive resin composition ' is preferably dissolved in a suitable solvent, stored in a solution state, and used. For example, a radiation-sensitive resin composition in a solution state can be prepared by mixing the components [A], [B] and [C] and optional components in a predetermined ratio in a solvent. The solvent used for the preparation of the radiation sensitive resin composition can be uniformly dissolved by the components of the above [A], [B] and [C] components and the optional components ([D] to [H] components). The substance which does not react with each component is not specifically limited. The solvent is exemplified as the solvent which can be used as the solvent for producing the copolymerized product [A]. In such a solvent, from the viewpoints of solubility of each component, non-reactivity with each component, and easiness of formation of a coating film, it is preferred to use an alcohol, a glycol ether, or an ethylene glycol alkyl ether acetate. , esters and diethylene glycol alkyl ethers. Among these solvents, benzyl alcohol, 2-phenylethyl alcohol, 3-phenyl-1-propanol, ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether, diethylene glycol diethyl ether, and the like are particularly preferred. , diethylene glycol ethyl ether, diethylene glycol dimethyl ether, propylene glycol monomethyl acid, propylene glycol monomethyl ether acetate, 2- or 3-methoxypropionic acid methyl ester, 2- or 3 · ethoxy Ethyl propionate. Further, in order to increase the in-plane uniformity of the film thickness of the formed coating film, a high boiling point solvent may be used together with the solvent. Examples of high-boiling solvents that can be used include, for example, N-methylformamide, N,N-dimethylformamide, N-methyl N-aniline, N-methylacetamide, N, N. - Dimethylacetamide, N-methylpyrrole n-butanone, dimethyl hydrazine, benzyl ether, dihexyl ether, acetone acetone, isophorone, hexanoic acid, octanoic acid, 1-octanol, hydrazine , benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate-43- 201100956 olefin ester, propyl carbonate, phenyl cellosolve B Acid esters, etc. Among these high boiling solvents, N-methylpyrrolidone, γ-butyrolactone, and N,N-dimethylacetamide are preferred. The solvent for the radiation-sensitive resin composition is preferably used in an amount of from 1 to 40% by mass, more preferably from 3 to 30% by mass, based on the total amount of the solvent, in the case of using a high-boiling solvent. By setting it as 1 to 40% by mass, the coating property at the time of forming a coating film can be further improved, and the decrease in radiation sensitivity and residual film ratio can be suppressed. In the case where the modulating radiation-sensitive resin composition is in a solution state, components other than the solvent (that is, components of the copolymer [A], [B], and [C], and other optional components) are occupied in the solvent solution. The ratio may be arbitrarily set depending on the purpose of use or the desired film thickness, etc., but is preferably from 5 to 50% by mass, more preferably from 1% to 40% by mass, still more preferably from 15 to 35% by mass. %. As a result, the solution of the radiation sensitive resin composition prepared is a pore size of 0. A micropore filter of about 2 μηι is filtered and used. Formation of partition wall and insulating film 0 Next, a method of forming the partition wall and the insulating film of the present invention using the above-described radiation sensitive resin composition will be described in detail later. This method is described in the following order and includes the following steps. (1) a step of forming a coating film of the radiation sensitive resin composition of the present invention on a substrate; (2) a step of irradiating at least a part of the coating film formed in the step (1) with radiation; (3) in the step (2) a step of developing a coating film for irradiating radiation; and (4) a step of heating the coating film developed in the step (3). -44 - 201100956 (1) Step of forming a coating film of a radiation sensitive resin composition on a substrate In the step (1), a solution of the radiation sensitive resin composition of the present invention is applied onto a surface of a substrate. Preferably, the solvent is removed by prebaking, and a coating film of the radiation sensitive resin composition is formed. The type of the substrate that can be used is, for example, a glass substrate, a germanium wafer, and a substrate on which various metals are formed on the surface. The method of applying the composition solution is not particularly limited, and for example, a spray method or a roll coating may be employed. A suitable method such as a cloth method, a spin coating method (spin coating method), a slit die coating method, a bar coating method, or an inkjet method. Among these coating methods, a spin coating method and a slit die coating method are particularly preferred. The pre-baking conditions vary depending on the type of each component, the ratio of use, and the like, but can be set, for example, at 60 to 110 ° C for about 30 seconds to 15 minutes. On the film thickness of the formed coating film, the crucible after prebaking can be set to 3 to 6 μm. (2) Step of irradiating at least a part of the coating film with radiation In the step (2) above, the radiation is irradiated through a mask having a predetermined pattern in the formed coating film. Examples of the radiation used at this time include ultraviolet rays, far ultraviolet rays, X-rays, and charged particle rays. Examples of the ultraviolet rays include a g-line (wavelength of 43 6 nm), an i-line (wavelength of 3 65 nm), and the like. In terms of far ultraviolet rays, there are, for example, KrF excimer lasers. For the X-ray, there are, for example, synchrotron radiation. Examples of the charged particle beam include, for example, an electron beam. Among these radiations, ultraviolet rays are preferable, and among ultraviolet rays, radiation containing g-line and/or i-line is particularly preferable. In terms of exposure, it should be 50 to 1,500 J/m2. (3) Developing step -45 - 201100956 (3) In the developing step, "developing" is performed with respect to the coating film irradiated with radiation in the above step (2), and the irradiated portion of the radiation is removed to form a desired pattern. For the developer used in the development treatment, for example, sodium hydroxide, potassium hydroxide, sodium carbonate, sodium citrate, sodium methyl citrate, ammonia, ethylamine, n-propylamine, diethylamine, diethylamine ethanol, or the like can be used. Di-n-propylamine, triethylamine, methyldiethylamine, dimethylethanolamine, triethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, pyrrole, piperidine, 1,8-diazabicyclo[5 An aqueous solution of a base (basic compound) of 4,0]-7-undecene, 1,^ 1,5-diazabicyclo[4,3,0]-5-nonane. Further, an aqueous solution of a water-soluble organic solvent such as methanol or ethanol or an aqueous solution of a surfactant may be added to the aqueous solution of the base; or a small amount of an aqueous alkali solution containing various organic solvents in which the radiation-sensitive resin composition is dissolved may be used as a developing solution. . Further, as the developing method, a suitable method such as a liquid-filling method, a dipping method, a shaking dipping method, a rinsing method, or the like can be used. The development time varies depending on the composition of the radiation-sensitive resin composition, and can be set, for example, from 3 to 12 seconds. Further, in the well-known radiation sensitive resin composition, when the development time is more than about 20 to 25 seconds from the optimum, since the peeling occurs in the formed pattern, it is necessary to strictly control the development time. On the other hand, since the radiation-sensitive resin composition of the present invention has a high development margin, even if it is more than 30 seconds from the optimum development time, a good pattern can be formed, and the advantage in product productivity is extremely large. (4) Heating step-46-201100956 (4) In the heating step, after the (3) development step, the rinsing treatment by running water is preferably performed with respect to the patterned film, and then, by It is preferable that the radiation caused by the high-pressure mercury lamp or the like is subjected to total irradiation (post-exposure), and the decomposition treatment of the 1,2-quinonediazide compound remaining in the film can be performed. Then, the film is subjected to a heat treatment by a heating means such as a hot plate or an oven, and the film is subjected to heat treatment (post-baking treatment) to perform film hardening treatment. The exposure amount in the subsequent exposure described above is preferably about 2,000 to 5,000 Å/m2. Further, the firing temperature in the hardening treatment is, for example, 120 to 250 °C. The heating time varies depending on the type of the heating machine. However, for example, the heat treatment on the hot plate may be set to 5 to 30 minutes, and the heat treatment in the oven may be set to 30 to 90 minutes. In this case, a step baking method or the like which performs two or more heating steps may be used. As a result, a partition wall for the purpose or a pattern-shaped film corresponding to the insulating film can be formed on the surface of the substrate. The partition wall or the insulating film formed in the above manner can be understood from the examples described later, and all of the radiation sensitivity, the development margin (the scale of developability), the solvent resistance, the heat resistance, and the total light transmittance (the light-shielding property) The scale) and the dielectric constant (the scale of the dielectric properties) show extremely excellent characteristics. EXAMPLES The present invention will be further specifically described by way of Synthesis Examples and Examples, but the present invention is not limited to the following examples. The weight average molecular weight (Mw) and the number average molecular weight (?n) of the copolymer obtained from the following Synthesis Examples and Comparative Synthesis Examples can be measured by gel permeation chromatography (GPC) of the following specifications. -47- 201100956 Device: GPC-101 (made by Showa Denko Co., Ltd.) Column: Combined with GPC-KF-801, GPC-KF-802, GPC-KF-803 and GPC-KF-8〇4 (Showa Denko ( Share) company's mobile phase: containing phosphoric acid 0. Synthesis Example of a 5% by mass of tetrahydrofuran copolymer [Synthesis Example 1] In a flask equipped with a cooling tube and a stirrer, 7 parts by mass of 2,2,-azobis-(2,4-dimethylvaleronitrile) was charged, and 200 parts by mass of ethylene glycol ethyl ether. Next, 14 parts by mass of methacrylic acid and tricyclomethacrylate were added. 2. 1. 02'6] 16 parts by mass of decane-8 ester, 20 parts by mass of 2-cyclohexyl acrylate, 40 parts by mass of glycidyl methacrylate, N-(3,5-dimethyl-4-hydroxybenzyl group ) methacrylamide 1 part by mass and 3 parts by mass of α-methylstyrene dimer, which were slowly stirred after being substituted with nitrogen. The temperature of the solution was raised to 70 ° C, and this temperature was maintained for 4 hours to obtain a polymer solution containing the copolymer [A-1]. The converted polystyrene weight average molecular weight (Mw) of the copolymer [A-1] was 8,000, and the molecular weight fraction Q cloth (Mw/Mn) was 2. 3. Further, the solid solution concentration of the polymer solution obtained here is 3 4. 4 quality. /〇. [Synthesis Example 2] In a flask equipped with a cooling tube and a stirrer, 9 parts by mass of 2,2'-azobis-(2,4-dimethylvaleronitrile) and 22 parts by mass of diethylene glycol ethyl ether were charged. . Next, 12 parts by mass of methacrylic acid, 12 parts by mass of p-methoxystyrene, 15 parts by mass of 1-(tetrahydropyran-2-oxy)-butyl-3-en-2-one, and a methacrylic acid ring were charged. 40 parts by mass of oxypropyl ester, 1 part by mass of N-cyclohexamethyleneimine, and 1 part by mass of hydrazine-(3,5-dimethyl-4-hydroxybenzyl)methacrylamide. And α-methylphenylethyl-48-201100956 3 parts by mass of the olefin dimer, after being substituted with nitrogen, began to stir slowly. The temperature of the solution was raised to 70 ° C, and this temperature was maintained for 4 hours to obtain a polymer solution containing the copolymer [A-2]. The converted polystyrene weight average molecular weight (Mw) of the copolymer [A-2] was 8,100, and the molecular weight distribution (Mw/Mn) was 2. 4. Further, the solid solution concentration of the polymer solution obtained here is 3 2. 7% by mass. [Synthesis Example 3] In a flask equipped with a cooling tube and a stirrer, 7 parts by mass of 2,2'-azobis-(2,4-dimethylvaleronitrile) and 200 parts by mass of diethylene glycol ethyl ether were charged. Next, 14 parts by mass of methacrylic acid and tricyclomethacrylate were added [5. 2. 1. 02'6] 16 parts by mass of decane-8 ester, 10 parts by mass of p-methoxystyrene, 40 parts by mass of glycidyl methacrylate, 20 parts by mass of m-hydroxybenzyl methacrylate, and α-methylstyrene After 3 parts by mass of the dimer, after substituting with nitrogen, stirring was slowly started. The temperature of the solution was raised to 7, and this temperature was maintained for 4 hours to obtain a polymer solution containing the copolymer [A-3]. The converted polystyrene of the copolymer [A-3] had a weight average molecular weight (Mw) of 8,500 and a molecular weight distribution (Mw/Mn) of 2. 3. Further, the solid solution concentration of the polymer solution obtained here is 3 4. 1% by mass. [Synthesis Example 4] A flask equipped with a cooling tube and a stirrer was charged with 2,2'-azobis-(2,4-dimethylvaleronitrile and 220 parts by mass of diethylene glycol ethyl ether. 11 parts by mass of methacrylic acid, 12 parts by mass of tetrahydrofurfuryl methacrylate, 40 parts by mass of glycidyl methacrylate, 15 parts by mass of N-cyclohexylmethyleneimine, and lauric methacrylate 10 parts by mass of the ester, 10 parts by mass of α-methyl-p-hydroxystyrene, and 3 parts by mass of the α-methylstyrene dimer were gradually stirred after being substituted with nitrogen, and the temperature of the solution was raised to 70 ° C. The temperature of -49-201100956 was maintained for 5 hours to obtain a polymer solution containing the copolymer [A-4]. The converted polystyrene of the copolymer [A-4] had a weight average molecular weight (Mw) of 8,000, and the molecular weight was 8,000. The distribution (Mw/Mn) is 2. 3. Further, the solid solution concentration of the resultant solution obtained here was 3 1 . 9% by mass. [Synthesis Example 5] In a flask equipped with a cooling tube and a stirrer, 7 parts by mass of 2,2'-azobis-(2,4-dimethylvaleronitrile) and 200 parts by mass of diethylene glycol ethyl ether were charged. Next, 14 parts by mass of methacrylic acid and tricyclomethacrylate were added [5. 2. 1. 02'6] 16 parts by mass of decane® -8 ester, 20 parts by mass of 2-methylcyclohexyl acrylate, 40 parts by mass of glycidyl methacrylate, and hydroxyl group of 4,4′-isopropylene glycol 10 parts by mass of a compound having a methyl methacrylate group and 3 parts by mass of a-methylstyrene dimer were introduced, and after being substituted with nitrogen, stirring was gradually started. The temperature of the solution was raised to 70 ° C, and this temperature was maintained for 4 hours to obtain a polymer solution containing the copolymer [A-5]. The converted polystyrene of the copolymer [A-5] had a weight average molecular weight (Mw) of 7,000 and a molecular weight distribution (Mw/Mn) of 2. 5. Further, the solid concentration of the Q polymer solution obtained here is 3 4. 8% by mass. [Synthesis Example 6] In a flask equipped with a cooling tube and a stirrer, 7 parts by mass of 2,2'-azobis-(2,4-dimethylvaleronitrile) and 200 parts by mass of diethylene glycol ethyl ether were charged. Next, 14 parts by mass of methacrylic acid and tricyclomethacrylate were added [5. 2. 1. 02'6] 16 parts by mass of decane-8 ester, 20 parts by mass of 2-cyclohexyl acrylate, 40 parts by mass of glycidyl methacrylate, and 1 -methacryloxy-4-naphthol 1 〇 mass The mixture and 3 parts by mass of the α-methylstyrene dimer were gradually stirred after being substituted with nitrogen. The temperature of the solution was raised to 7 (TC, maintaining this temperature for 4 hours) to obtain a polymer solution containing the copolymer [々-6]. The average weight of the converted polystyrene of the copolymer [human-6] The molecular weight (Mw) was 8,000 and the molecular weight distribution (Mw/Mn) was 2. 5. Further, the solid solution concentration of the polymer solution obtained herein is 34. 6% by mass. [Comparative Synthesis Example 1] In a flask equipped with a cooling tube and a stirrer, 8 parts by mass of 2,2'-azobis-(2,4-dimethylvaleronitrile) and 220 parts by mass of diethylene glycol ethyl ether were charged. . Next, 12 parts by mass of methacrylic acid, 12 parts by mass of p-methoxystyrene, and 15 parts by mass of 1-(tetrahydrofuran-2-oxo)-butyl-3-en-2-one, methacrylic acid were charged. 40 parts by mass of glycidyl ester, 10 parts by mass of N-cyclohexylmethyleneimine, tricyclomethyline [5. 2. 10 parts by mass of 1_02,6]decane-8 ester and 3 parts by mass of a-methylstyrene dimer were gradually stirred after being substituted with nitrogen. The temperature of the solution was raised to 70 ° C to maintain this temperature for 4 hours to obtain a polymer solution containing the copolymer [a-1]. The converted polystyrene weight average molecular weight (Mw) of the copolymer [a-1] was 8,900' molecular weight distribution (Mw/Mn) was 2. 5. Further, the solid solution concentration of the polymer solution obtained at Q was 32. 9% by mass. <Preparation of Radiation-Sensitive Resin Composition> [Example 1] The solution [A] containing the copolymer [A-1] of Synthesis Example 1 corresponds to 1 part by mass of the copolymer (solid matter) And [B] is 4,4'-[1-[4-[1-[4-hydroxyphenyl]-1-methylethyl]phenyl]ethylidene]bisphenol (1.0) 30 parts by mass of a condensate (Bl) of 1,2-naphthoquinonediazide-5-sulfonic acid chloride (2.0 mol); and [C] component 2,-anilino-6'- (N-ethyl-N-isopentyl)amino-3,-methyl helix [isobenzofuran-51- 201100956 -1(3H),9'-(9H)卩山噃]-3-ketone (Cl) 5 parts by mass of the mixture was dissolved in diethylene glycol ethyl ether to have a solid content of 30% by mass, and then filtered through a membrane filter having a diameter of 0 · 2 μm to prepare a radiation-sensitive resin composition. Solution (S-1). [Examples 2 to 5, 7 to 10, and Comparative Examples 1 to 4] The same as Example 1 except that the [A], [Β], and [C] components were used in the same manner as in Table 1 To modulate the solutions (S-2) to (S-5), (S-7) to (S-10), and (s-1) to (s-4) of the radiation sensitive resin composition. D [Example 6] Except that it was dissolved in diethylene glycol ethyl ether / propylene glycol monocarboxylic acid acetate = 6 / 4 (mole ratio) so that the solid content concentration was 20 mass %, otherwise, and Example 1 Similarly, a solution of the radiation sensitive resin composition is prepared (S-6. In Table 1, the abbreviations of the components represent the following compounds. (Β-1): 4,4·-[1-[4-[1·[4 -hydroxyphenyl]-1-methylethyl]phenyl]ethylidene Q-based]bisphenol (1.0 mol) and 1,2-naphthoquinonediazide-5-sulfonic acid chloride (2.0 mol) Condensate (Β·2): 1,1,Bushen (p-hydroxyphenyl)ethane (1.〇莫耳) and 丨, 2-naphthoquinonediazidesulfonate chloride (2. Condensate (Cl): 21-anilino-6,-(Ν-ethyl-oxime-isopentyl)amino-3,-methylspiro[isobenzofuran-l(3H), 9' -(9H)t!lIl嗤]-3-one (Yaida Chemical Industry Co., Ltd. made by the company's trade name S205) -52- 201100956 * (C-2)2|-anilino- 6'-(N-B --N-(4-tolyl))amino-3'-methylspiro[isobenzofuran-1(3H),9,-(9H)卩山哩]-3-one (Yamada Chemical Industry) (share) company system, trade name ETAC) (C-3) 3'-N,N-dibenzylamino group - 6,-N , N-diethylamine spiral [isobenzoquinone-l(3H), 9'-(9H)l] hawthorn]-3-one (manufactured by Hodogaya Chemical Co., Ltd., trade name GREEN DCF) (:-4) 2,-(1^-methyl-:^phenyl)amino-6,-(^[-ethyl-:^-(4-methylphenyl))amine-based helix [isobenzo] Furan-1(3H),9,-(9H)卩山嘎]-3-one (Yamada 彳匕 _ U Industrial Co., Ltd., trade name ATP) (G) Surfactant: SH28PA (Toray. Dow (G) Adhesive Additive: β-(3,4-epoxycyclohexyl)ethyltrimethoxyoxane (Χ-1) Low Molecular Color Reagent: BONJET BLACK0052 (Oriental Chemical Industry Co., Ltd.) (X-2) Low Molecular Color Reagent: 4-Phenol

-53- 201100956 Table 1 Composition of species copolymerization! Chengfen [B Chengcheng [c Cheng Cheng other classification categories quality part size mass parts type mass parts type mass parts Example 1 (S-1) A-1 100 B-1 30 Cl 5 - Example 2 (S-2) A-1 100 B-1 30 C-2 5 Η 5 Example 3 (S-3) A-2 100 B-1 30 C-3 5 — — Implementation Example 4 (S-4) A-2 100 B-2 30 C-4 5 - Example 5 (S-5) A-2 100 B-1/B-2 15/15 Cl 10 - Example 6 (S-6) A-1 100 B-1 30 Cl 5 G 0.1 Example 7 (S-7) A-3 100 B-1 30 Cl 5 — Example 8 (S-8) A-4 100 B -1 30 Cl 5 - Example 9 (S-9) A-5 100 B-1 30 Cl 5 - Example 10 (S-10) A-6 100 B-1 30 Cl 5 - Comparative Example 1 (s-1) a-1 100 B-1 30 Cl 5 I - Comparative Example 2 (s-2) A-1 100 B-1 30 - One - Comparative Example 3 (s-3) A-1 100 B -1 30 - Xl 5 Comparative Example 4 (s-4) a-1 100 B-1 30 - X-2 10 <Performance evaluation as partition wall and insulating film> [Example 1 1 to 20, Comparative Examples 5 to 8] The radiation-sensitive resin composition prepared as described above was used as the partition wall in the following manner. Various characteristics of the insulating film. [Evaluation of Radiation Sensitivity] With respect to Examples 1 to 15, 17 to 20, and Comparative Examples 5 to 8, a rotator was used, and in Example 16, a slit coater was used on a ruthenium substrate. After coating the composition described in Table 2, it was prebaked on a hot plate at 90 ° C for 2 minutes to form a coating film having a film thickness of 3.0 μm. With respect to the obtained coating film, a PLA-501F exposure machine (ultra-high pressure mercury lamp) manufactured by Canon Co., Ltd. was used, and the exposure time was changed via a pattern mask having a predetermined pattern, and after exposure, the concentration shown in Table 2 was used. The aqueous solution of tetramethylammonium hydroxide was developed at 25 ° C, 80 seconds, liquid-54-201100956. Then, it was washed with ultrapure water for 1 minute, and then dried to form a pattern on the wafer. The amount of exposure required to completely dissolve the space of the line of 3 · 0 μηη and the space (1 〇 to 1) is completely dissolved. The enthalpy was used as the radiation sensitivity (exposure sensitivity) as shown in Table 2. The 値 is below 1 000 J/m2 and the sensitivity is good. [Evaluation of development margin] As in the above [Evaluation of radiation sensitivity], a coating film was formed on the ruthenium substrate. Using a PLA-501F exposure machine (Ultra High Pressure Mercury Lamp) manufactured by Canon Co., Ltd.' ^ via a mask having a pattern of line and space (10 to 1) of 3.0 μm, on the obtained coating film, equivalent use The exposure amount of the radiation sensitivity measured by the above [Evaluation of Radiation Sensitivity] was exposed, and development was carried out by a liquid-holding method using a tetramethylammonium hydroxide aqueous solution having a concentration shown in Table 2 at a change of development time at 25 ° C. Then, it was washed with ultrapure water for 1 minute, and dried, and a pattern was formed on the wafer. At this time, in order to make the line width of the line 3 Ομηι, the required development time as the optimum development time is as shown in Table 2. ^ Further, when the development was continued from the optimum development time, the time from the line of 3.00 μm to the peeling of the pattern was measured, and the development margin (the allowable range of the development time) was as shown in Table 2. When the enthalpy is 30 seconds or more, the development margin is good. [Evaluation of Solvent Resistance] As in the above [Evaluation of Radiation Sensitivity], a coating film was formed on the ruthenium substrate. The obtained coating film was heated in a clean oven at 220 ° C for 1 hour to obtain a cured film. The film thickness (T 1) of the obtained cured film was measured, and then the film thickness of the cured film was measured by immersing the ruthenium substrate formed of the cured film in dimethyl ya at a temperature controlled at 70 ° C for 20 minutes. (tl), Calculate the film caused by impregnation -55- 201100956 Thickness change rate { I tl-T1 I /ΤΙ }χ 100 [%]. The results of the film thickness change rate are shown in Table 2. When the enthalpy is 4% or less, the solvent resistance is good. Further, in the evaluation of the solvent resistance, since the patterning of the formed film is not required, the radiation irradiation step and the development step are omitted, and only the coating film forming step and the heating step are performed and evaluated. [Evaluation of heat resistance] A cured film was formed in the same manner as the evaluation of the solvent resistance described above, and the film thickness (Τ2) of the obtained hardened film was measured. Next, the tantalum substrate formed by the cured film was measured in a V-clean oven at 24 (TC, additional baking for 1 hour, and the film thickness (t2) of the cured film was measured, and the film caused by additional baking was counted. Thickness change rate {|t2-T2|/T2}xl00 [%] The results of heat resistance are shown in Table 2. When the enthalpy is 1% or less, heat resistance is good. [Full light transmittance (light blocking property) Evaluation] A cured film was formed on a glass substrate in the same manner as in the above [Evaluation of Solvent Resistance], except that the glass substrate "C〇rning7059 (manufactured by Corning)" was used instead of the ruthenium substrate. Using a spectrophotometer "1 50-20 type Double-beam (manufactured by Hitachi, Ltd.), the total light transmittance of the glass substrate having the cured film is measured at a wavelength in the range of 380 to 780 nm. As shown in Table 2, when the enthalpy is less than 50%, the light-shielding property is good. [Evaluation of dielectric constant] On the SUS304 substrate which has been honed, Examples 11 to 15, 17 to 20, and Comparative Example 5 are used. The 8 series uses a rotator, and regarding the embodiment -56-201100956 16, a slot die coater is used, After the composition described in Table 2 was placed, it was prebaked on a hot plate at 90 ° C for 2 minutes to form a coating film having a film thickness of 3.0 μm. The obtained coating film was placed in a clean oven at 220 ° C. The cured film was obtained by firing for 1 hour. A Pt/Pd electrode pattern was formed by a vapor deposition method to prepare a sample for dielectric constant measurement. HP16451B electrode manufactured by Yokogawa Hewlett-Packard Co., Ltd. was used. And the HP4284A precision LCR measuring device measures the dielectric constant of the sample by the CV method at a frequency of 10 kHz. The results of the dielectric constant are shown in Table 2. When the 値 is 3.7 or less, the dielectric constant is good. In the evaluation of the dielectric constant, since the patterning of the formed film is not required, the radiation irradiation step and the development step can be omitted, and only the coating film forming step and the heating step can be performed for evaluation.

-57- 201100956 CN嗽 dielectric constant cn rn rn r- rn rn rn rn rn rn rn rn rn ΚΠ rn CO 卜 full light transmittance g Ο 〇o 〇OOO 〇oo S heat resistance film thickness change rate (% rH T-^ »-h »''<<N (N hardened film thickness (μιη) yn oi in CN KT) CN (N rsi CN vn CN CN CN vn oi (N (N CN vn < N Solvent-resistant film thickness change rate (%) ΓΛ m inch inch inch inch inch cn m 硬化 Hardened film thickness (μιη) (N iT) CN iT) CN (N <N m cs in CN oi m (N CN (N CN (N CN (N CN) N (N vn < N to (N development margin development margin (seconds) m 沄r〇cn vn m yr) mmmv〇m optimum development time (seconds) § § § § radiation sensitivity (J/m2) 600 o 550 550 |55〇| | 600 I 600 600 600 I 600 550 600 2000 650 developer concentration (% by mass) inch o inch o 2.38 2.38 2.38 inch · o inch o inch o inch o inch oo inch o inch o inch Ο Composition type 1 (Sl) (S-2) (S-3) (S-4) (S-5) (S-6) (S-7) (S-8) (S-9) (S- 10) (sl) (s-2) (s-4) Example 11 _1 | Example 12 | 1 Example 13 | 丨 Example 14 | | Example 15 | 丨 Example 16| I example n| |Example 18| 1 Example 19| Example 20 Comparative Example 5 1 Comparative Example 6 1 Comparative Example 7 丨Comparative Example 8 1 - 8 ς - 201100956 From the results shown in Table 2, In Examples 11 to 20 in which the radiation-sensitive resin compositions prepared in Examples 1 to 10 were used, radiation sensitivity (exposure sensitivity), development margin, solvent resistance, heat resistance, total light transmittance, and dielectric constant were all The characteristics are well balanced and extremely excellent. Especially in all the embodiments, the total light transmittance of 45% or less can be obtained without using other ways of the color developing agent, and a remarkable good light blocking property can be achieved. On the one hand, the use is not Comparative Example 5 containing a composition containing a phenolic skeleton unsaturated compound as a constituent compound of the copolymer, or a composition using a composition containing no thermosensitive pigment and a color developing agent, in Comparative Example 6, was not able to obtain less than 50%. The light transmittance, especially the latter, is a very high enthalpy of 70%. Further, in Comparative Example 7 in which a composition containing no sensible dye and containing a low molecular color developer was used, although a total light transmittance of less than 50% was obtained, the radiation sensitivity was extremely poor. In addition, Comparative Example 8 which is a constituent compound of a copolymer which does not contain a phenol skeleton-containing unsaturated compound and does not contain a thermotropic dye and contains a low molecular color developer is used (corresponding to Patent Documents 3 and 4) ), it is impossible to obtain a total light transmittance of less than 50%. As is apparent from the results of the above-described examples and comparative examples, the radiation-sensitive resin composition of the present invention has sufficient developability to form a through-hole or a three-dimensional recess of the insulating film, and has high resistance to a solvent, and Since it has excellent radiation sensitivity and high light-shielding property, it can be suitably used as a partition and an insulating film. INDUSTRIAL APPLICABILITY The radiation-sensitive resin composition of the present invention uses a predetermined alkali-soluble resin as a color developing agent, so that heat resistance at a high temperature of -59 to 201100956 when the partition wall and the insulating film are formed can prevent color development. Sublimation of the agent, in addition to excellent radiation sensitivity, developability, coupled with high light-shielding properties during heating. Therefore, the organic EL element having the partition wall and the insulating film formed of the radiation sensitive resin composition described above exhibits good contrast and can be suitably used as an electronic component of a display device. [Simple description of the diagram] fnr has no 0 [Description of main component symbols] 〇 $. 〇 -60-

Claims (1)

201100956 VII. Patent application scope: 1. A radiation sensitive resin composition comprising: [A] an alkali-soluble resin which will contain (a1) at least one selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic anhydrides. And (a2) a monomer selected from the group consisting of a phenol skeleton-containing unsaturated compound represented by the following formula (I), a compound represented by the following formula (11), and a compound represented by the following formula (III); Copolymerized copolymer '[B] 1,2-quinonediazide compound, and 〇[C] sensible pigment' (Π) -61 201100956 (In the formula (I), R1 is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; and R2 to R6 are the same or different and are a hydrogen atom, a hydroxyl group or an alkyl group having 1 to 4 carbon atoms; B is a single bond, -COO-, or -CONH-; m is an integer from 0 to 3, but at least one of R2 to R6 is a hydroxyl group; in the formula (II), R1 is a hydrogen atom or a carbon number of 1 to 4 The alkyl group; Y1 and Y2 are the same or different and are a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; and X1 to X4 are the same or different and are a hydrogen atom, an alkyl group having a carbon number of i to 4 or a halogen atom; Z is a single bond or - 〇(CH2)w_, w is an integer from 1 to 6; in the formula (III), R1 is a hydrogen atom or an alkylene group having 1 to 4 carbon atoms; Z is a single bond or - 0 ( CH2)w·, W is an integer from 1 to 6). 2. The radiation-sensitive resin composition according to the first aspect of the patent application, wherein the alkali-soluble resin of the component [A] is such that (a3) contains an epoxy group in addition to the (a1) component and the (a2) component. A copolymer obtained by copolymerization of a monomer of a group of unsaturated compounds. 3. The radiation-sensitive resin composition of the first aspect of the invention, wherein the content of the Q-thermal pigment of the component [C] is 0.1 part by mass or more, based on 100 parts by mass of the alkali-soluble resin of the component [A]. Below the mass. A partition wall for an organic EL display element which is formed of a radiation-sensitive resin composition as disclosed in claim 1, 2 or 3. An organic EL coating insulating film formed of a radiation sensitive resin composition as disclosed in claim 1, 2 or 3. 6. A method of forming a partition wall for an organic EL display element, comprising: (1) a step of forming a coating film of a radiation sensitive resin composition as disclosed in claim 1, 2 or 3 on a substrate; 2) at least a part of the coating film formed in the step (1), irradiating the radiation-62-201100956; (3) the step of developing the coating film irradiated with the radiation in the step (2): and (4) performing the step (3) A step of heating the developed coating film. 7. A method of forming an insulating film for an organic EL display device, comprising: (1) a step of forming a coating film of a radiation-sensitive resin composition as disclosed in claim 1, 2 or 3 on a substrate; (2) a step of irradiating at least a part of the coating film formed in the step (1) with a radiation ridge; (3) a step of developing the coating film irradiated with the radiation in the step (2): and (4) performing the step ( 3) A step of heating the developed coating film. -63- 201100956 IV. Designated representative map: (1) The representative representative of the case is: None. (2) A brief description of the symbol of the representative figure: Μ . 5. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: Sister Q