201100791 六、發明說明： 【發明所屬之技術領域】 本發明係關於由薄鋼板的缺陷所產生的洩漏磁束來檢 測出有無缺陷之陣列型磁性探傷裝置等所使用的陣列型磁 感測器基板’特別是容易進行陣列型磁感測器的校正之陣 列型磁感應器基板。 Q 【先前技術】 從前’作爲罐頭等的材料之馬口鐵皮等帶狀材料 (strip )(此處稱爲薄鋼）的表層以及內部存在的微小缺 陷之檢測裝置，有將複數個陣列型磁感測器排列於薄鋼板 的寬幅方向，檢測由該缺陷所產生的洩漏磁束以判定有無 缺陷的陣列型磁性探傷裝置。例如可見於日本國之專利公 報、特許第3811〇39號公報（圖1、第1頁）（以下，稱 爲專利文獻1 )。 〇 此陣列型磁性探傷裝置之磁感測器頭3 0的構成顯示 於圖3。如圖3(a)所示，磁感測器頭30，在被壓接於 非磁性滾筒（roll ) 11面且於與被搬送於箭頭方向的薄鋼 板13的表面接近的逆U字形之磁化軛（y〇rk) 24的開口 部，與薄鋼板1 0之間設有特定的間隙（gap )(此處稱爲 離昇li ft- off)，藉由磁化轭24與被捲繞於磁化軛24的 磁化線圈22所構成的磁化器形成使薄鋼板13在其移動方 向上進行磁化之用的磁場。 接著，於此開口部，以預先被設定的離昇接近於於薄 -5- 201100791 鋼板1 3，設置檢測在薄鋼板1 3的缺陷部產生的洩漏磁束 之霍爾元件等半導體磁感測器1 2、與供改善此半導體磁 感測器1 2的感度之用的軟質磁性體1 4，來自薄鋼板1 3 的洩漏磁束於垂直方向上集中地橫切半導體磁感測器12 的感受面，以高感度檢測是否有微小的缺陷。 此半導體磁感測器1 2，例如圖3 ( b )所示，於薄鋼 板1 3之寬幅方向直線狀地，以可確保預先被設定的寬幅 方向的分解能的方式直線狀等間隔地排列著多數之磁感測 器（元件）。 此半導體磁感測器12，爲了使各個之磁感測器（元 件）的寬幅方向之檢測感度成爲均一，確保缺陷的檢測精 度，而進行定期的校正。 於使用這樣的陣列型磁感測器的磁感測器頭3 0，從 前使用如圖4(a)所示之校正裝置20。例如，有日本國 之公開專利公報，特開平9-229905號公報（圖1、第1 頁）（以下，稱爲專利文獻2 )。 在此校正裝置2〇，校正半導體磁感測器12的場合， 使半導體磁感測器1 2的排列方向與非磁性滾筒1 1 a之切 線面對向配置，於此非磁性滾筒11a之對向的表面上捲繞 導線1 1 b，對此導線供應電流產生器1 5使產生特定的磁 場。 接著，在此狀態驅動被連結於非磁性滾筒1 1 a的馬達 1 1 b ’如圖4 ( b )所示’非磁性滾筒1〗a旋轉，根據施加 的電流以該磁場爲基準磁場進行半導體磁感測器12的校 -6- 201100791 正。 然而，在專利文獻2所示之校正，因爲使導線lib與 半導體磁感測器1 2之列相對向，所以來自導線的磁場， 成爲與半導體磁感測器1 2的感磁面平行。 因此，於半導體磁感測器1 2的感磁面使用垂直的磁 場來校正檢測感度的場合，會有實際上使用的垂直方向的 磁場無法提供給半導體磁感測器12的問題，進而會有準 0 備大型的旋轉滾筒等使校正裝置11變成規模龐大的問題 。（以後，半導體磁感測器1 2亦被稱爲陣列型磁感測器 )° 因此，以複數個陣列型磁感測器之列，校正具有一或 複數列之陣列型磁感測器的場合，將導體配置於陣列型磁 感測器列之中心線與陣列型磁感測器的感磁面之法線所構 成的平面上以外的位置，對陣列型磁感測器列平行地配置 ，對該導體流過特定的電流使產生磁場，將該磁場作爲基 〇 準磁場而使用的陣列型磁感測器之校正方法已被揭示。例 如，有日本國之公開專利公報，特開2005-6 1 940號公報 (圖1、第1頁）（以下，稱爲專利文獻3 )。 然而，於專利文獻3之校正裝置，對磁感測器之感磁 面，可以有效率地施加垂直磁化，但是會有無法對薄鋼板 之微小缺陷之動態檢測感度，亦即薄鋼板在移動狀態之檢 測感度進行校正的問題。 因此，要校正各個磁感測器之對微小缺陷的動態（在 薄鋼板的最大移動速度下）之檢測感度的場合，會有終究 201100791 必須要靠專利文獻2所示之大型的校正裝置的問題。 在此本案發明人，如圖5所示，揭示著具備：在非磁 性體板具備直線狀捲繞1圈的導體之校正用樣品板3 2， 及對該陣列型磁感測器1 2之感磁面以特定之離昇，在對 該感磁面平行的平面上於薄鋼板的移動方向上微調整校正 用樣品板32的位置之移動機構的樣品支撐台33、及對導 體32a流以脈衝電流的脈衝電流產生器34;對導體32a 流以脈衝寬幅Pw、脈衝波高値Ph之脈衝電流，對陣列型 磁感測器1 2施加脈衝磁場，進行動態的磁感測器的檢測 感度之校正的陣列型磁性探傷裝置之校正裝置40之例， 有日本國之公開專利公報，特開2009-14678號公報（圖 1、第1頁）（以下稱爲專利文獻4 )。 【發明內容】 [發明所欲解決之課題] 於專利文獻4之校正裝置，藉由對陣列型磁感測器 1 2之感磁面施加脈衝電流，可以進行薄鋼板的動態的檢 測感度之校正。 然而’還是有必要具備：在非磁性體板具備直線狀捲 繞1圈的導體之校正用樣品板，或對該陣列型磁感測器之 感磁面以特定之離昇，在對該感磁面平行的平面上於薄鋼 板的移動方向上微調整校正用樣品板的位置之移動機構的 樣品台支撐台，會有無法避免裝置大型化的問題。 本發明係爲了解決前述問題點而發明的，目的在於提 -8 - 201100791 供於印刷電路板上具有一個或複數個陣列型磁感測 列型磁感測器基板’其係不需要供動態檢測感度校 的大型裝置’可以容易進行校正的陣列型磁感測器 [供解決課題之手段] 爲了達成前述目的’根據本發明之陣列型磁感 板，係在印刷電路板上具有一個或複數個將複數個 〇 器配置爲一列而成的陣列型磁感測器之陣列型磁感 板，其特徵爲：前述陣列型磁感測器基板，具備·· 刷電路板、於前述印刷電路板之一方之面上被排列 狀的陣列型磁感測器、於前述陣列型磁感測器之列 右之任一方單側，或者於兩側，以與該列軸平行而 定的間隔，被固定於前述印刷電路板之導體、及使 脈衝電流流至前述導體之脈衝電流產生電路·，使前 電流流至前述導體產生校正時之基準磁場，進行該 Ο 磁感測器的檢測感度校正。 [發明之效果] 根據本發明，可以提供於印刷電路板上具有一 數個陣列型磁感測器的陣列型磁感測器基板，其係 供動態檢測感度校正之用的大型裝置，可以容易進 的陣列型磁感測器基板。 【實施方式】 器的陣 正之用 基板。 測器基 磁感測 測器基 前述印 爲直線 軸的左 隔著特 特定之 述脈衝 陣列型 個或複 不需要 行校正 -9 - 201100791 以下，參照圖面說明本發明之一實施例。 [實施例] 圖1顯示陣列型磁感測器基板1 〇的構成。圖1 ( a ) 爲其平面圖，圖1(b)爲y-y，箭頭所示方向所見之剖面 圖。 陣列型磁感測器基板1 0，具備印刷電路板1、於印刷 電路板1之一方之面上被排列爲直線狀的複數磁感測器所 構成之陣列型磁感測器2、於陣列型磁感測器2之列軸的 左右之任一方單側，或者於兩側，以與該列軸平行而隔著 特定的間隔，被印刷/成形於印刷電路板1的平面上之圖 案線4、及使特定之脈衝電流流至圖案線4之脈衝電流產 生電路3。 針對此脈衝電流的設定，參照圖2來進行說明。電流 I流過有限長度的圖案線4時，由圖案線4起離開垂直距 離R的點P所產生的磁束密度B在圖2(a)所示的幾何 學位置關係的場合，係由畢奧—薩伐爾定律（Bi〇t-Savart law )而以下式求出。 ®~μ〇· I· (c〇S^ 1+ CO S θ 2) / 7ΐ · R) 亦即，提供基準磁場的磁束密度B之導體電流係以I =Β· 4π I· R/[ja〇· (cosgi 1+ COS0 2)]求出。 此處的μ〇爲真空透磁率’ 0 1爲圖案線4與連結p點 和圖案線4的左端之直線所夾的角度，0 2爲圖案線4與 連結P點和圖案線4的右端之直線所夾的角度。 -10- 201100791 實際上，圖案線4爲有限長度，所以於陣列型磁感測 器之兩端部要供給與中央部同樣的磁場，需如圖2(b) 所示，過大的電流變得有必要。亦即，圖案線4係以成爲 被容許的磁場強度的差異內的方式，設定爲比陣列型磁感 測器2更充分長的長度。 例如，於使用在薄鋼板上微小缺陷的探傷的場合，以 市售之霍爾元件構成陣列型磁感測器2，使此霍爾元件的 0 感磁面與圖案線4之平面距離R爲2mm，此時，提供的 校正時之磁束密度B爲1 mT的場合之施加的電流爲ι〇Α 程度。 加計於圖1所示的陣列型磁感測器2之列軸的兩側設 2條導體，使電流以相反的方向流動而施加的磁場的話， 每一條導體的電流成爲5A程度。此電流値，因進行校正 的磁場僅需施加時間數微秒（ms )程度之脈衝電流即可， 所以在圖案線4不需特別講究散熱對策，可以僅藉由印刷 Q 電路板上的圖案線來進行供給。 此外，因爲可以把陣列型磁感測器2與產生施加的磁 場之導體4預先固定於印刷電路板1上之正確位置，所以 不會像從前那樣，爲了對陣列型磁感測器施加一樣的校正 磁場，而設置具備微調整磁場發生裝置與陣列型磁感測器 2之感測面的位置之微調整機構，或是產生動態磁場之用 的大型旋轉機構之校正裝置。 在必須要大電流的場合，替代圖案線而在印刷電路板 上固定陣列型磁感測器2與以位置被正確固定的銅等金屬 -11 - 201100791 來形成的匯流排棒（bus bar )等之導體亦可。 此外不僅校正裝置被小型化，對陣列型磁感測器2之 各個也可以同實施加動態磁場，所以可在短時間內完成精 度佳的校正。 又，本發明並不以前述之實施例爲限，亦可將陣列型 磁感測器設置複數列，而流通脈衝電流的圖案線4，隨著 被要求的校正磁場的條件而採用最佳的剖面形狀者，或是 被要求的校正磁場的波形爲任意產生的脈衝波形皆可，隨 著作爲對象的檢測磁場所要求的條件不同，在不逸脫本發 明的要旨的範圍內可以進行適當的變更。 【圖式簡單說明】 圖1係本發明之陣列型磁感測器基板。 圖2係說明本發明之脈衝電流的設定原理之圖。 圖3係說明從前的磁感測器頭之圖。 圖4係說明從前的校正裝置之圖。 圖5係說明從前的陣列型磁性探傷裝置的校正裝置之 圖。 【主要元件符號說明】 1 :印刷電路板 2 :陣列型磁感測器 3 :脈衝電流產生電路 4 :圖案線 -12- 201100791 1 ο _·陣列型磁感測器基板 1 1 , 1 1 a :非磁性滾筒 1 1 b :導線 1 1 C :馬達 1 5 :電流產生器 20 :校正裝置 12:(半導體磁感測器）陣列型磁感測器 ^ 1 3 :帶狀材料 1 4 :軟磁性體 1 5 :薄鋼板 22 :磁化線圈 24 :磁化軛 3 0 :磁感測器頭 3 2 :校正樣品板 32a :導體 3 3 :樣品支撐台 3 3 a :移動機構 3 4 :脈衝電流產生器 4 0 :校正裝置 -13-[Technical Field] The present invention relates to an array type magnetic sensor substrate used in an array type magnetic flaw detector or the like for detecting the presence or absence of a defect by a leakage magnetic flux generated by a defect of a steel sheet. In particular, an array type magnetic sensor substrate which is easy to perform correction of an array type magnetic sensor. Q [Prior Art] There are a plurality of array type magnetic senses in the surface layer of a strip (such as thin steel) such as tinplate, which is a material such as cans, and a small defect detecting device. The detector is arranged in the wide direction of the steel sheet, and detects the leaked magnetic flux generated by the defect to determine whether or not the array type magnetic flaw detector is defective. For example, it is disclosed in Japanese Patent Publication No. 3811〇39 (Fig. 1, page 1) (hereinafter referred to as Patent Document 1).构成 The configuration of the magnetic sensor head 30 of the array type magnetic flaw detection apparatus is shown in Fig. 3. As shown in Fig. 3 (a), the magnetic sensor head 30 is pressed against the surface of the non-magnetic roller 11 and is in opposition to the surface of the steel sheet 13 conveyed in the direction of the arrow. The opening of the yoke 24 is provided with a specific gap (herein referred to as lift ft-off) between the steel sheet 10 and the magnetized yoke 24 and is wound around the magnetization. The magnetizer constituted by the magnetizing coil 22 of the yoke 24 forms a magnetic field for magnetizing the steel sheet 13 in the moving direction thereof. Next, in the opening portion, a semiconductor magnetic sensor such as a Hall element that detects a leakage magnetic flux generated in a defective portion of the steel sheet 13 is provided with a steel sheet 13 that is set close to the thin -5 - 201100791 in advance. 2, and a soft magnetic body 14 for improving the sensitivity of the semiconductor magnetic sensor 12, the leakage magnetic flux from the thin steel plate 13 is concentrated in the vertical direction transversely to the sensing surface of the semiconductor magnetic sensor 12. , with high sensitivity to detect if there are minor defects. For example, as shown in FIG. 3(b), the semiconductor magnetic sensor 1 2 is linearly arranged in a wide direction in the width direction of the steel sheet 13 and is linearly equally spaced so as to ensure the decomposition energy in the width direction set in advance. A large number of magnetic sensors (components) are arranged. The semiconductor magnetic sensor 12 performs periodic correction in order to make the detection sensitivity of the width direction of each of the magnetic sensors (components) uniform, ensuring the detection accuracy of defects. For the magnetic sensor head 30 using such an array type magnetic sensor, the correction device 20 shown in Fig. 4(a) is used in the past. For example, Japanese Laid-Open Patent Publication No. Hei 9-229905 (Fig. 1, page 1) (hereinafter referred to as Patent Document 2). In the correction device 2, when the semiconductor magnetic sensor 12 is corrected, the arrangement direction of the semiconductor magnetic sensor 12 is arranged facing the tangent of the non-magnetic roller 1 1 a, and the pair of the non-magnetic roller 11a is disposed. The wire 1 1 b is wound on the surface to which the current generator 15 is supplied to generate a specific magnetic field. Then, in this state, the motor 1 1 b ' coupled to the non-magnetic roller 1 1 a is driven to rotate as shown in FIG. 4( b ), and the semiconductor is rotated based on the applied current. Magnetic sensor 12 school -6- 201100791 positive. However, in the correction shown in Patent Document 2, since the wire lib is opposed to the column of the semiconductor magnetic sensor 12, the magnetic field from the wire is parallel to the magnetic sensitive surface of the semiconductor magnetic sensor 12. Therefore, when the magnetic sensitive surface of the semiconductor magnetic sensor 12 is used to correct the detection sensitivity, there is a problem that the magnetic field in the vertical direction which is actually used cannot be supplied to the semiconductor magnetic sensor 12, and there is a problem. The large rotating drum or the like is required to make the correction device 11 a problem of a large scale. (Afterwards, the semiconductor magnetic sensor 12 is also referred to as an array type magnetic sensor). Therefore, the array type magnetic sensor having one or a plurality of columns is corrected by a plurality of array type magnetic sensors. In this case, the conductor is disposed in a position other than the plane formed by the center line of the array type magnetic sensor column and the normal line of the magnetic sensitive surface of the array type magnetic sensor, and is arranged in parallel with the array type magnetic sensor column. A method of correcting an array type magnetic sensor using a specific current to cause a magnetic field to be generated as a reference quasi-magnetic field has been disclosed. For example, Japanese Laid-Open Patent Publication No. 2005-6 1 940 (Fig. 1, page 1) (hereinafter referred to as Patent Document 3). However, in the correction device of Patent Document 3, the perpendicular magnetization can be applied efficiently to the magnetic sensitive surface of the magnetic sensor, but there is a possibility that the dynamic detection sensitivity of the small defects of the steel sheet cannot be obtained, that is, the thin steel plate is in a moving state. The problem of detecting sensitivity is corrected. Therefore, in order to correct the detection sensitivity of the micro-defects of each of the magnetic sensors (at the maximum moving speed of the steel sheet), there is a problem that the large-sized correction device shown in Patent Document 2 must be obtained after the finalization of 201100791. . As shown in FIG. 5, the inventors of the present invention have disclosed a sample plate for calibration 3 2 including a conductor that is linearly wound one turn in a non-magnetic plate, and a magnetic sensor 1 2 for the array type magnetic sensor. The magnetic sensitive surface is lifted up in a specific manner, and the sample support table 33 of the moving mechanism for finely adjusting the position of the sample plate for calibration 32 in the moving direction of the steel plate on the plane parallel to the magnetic sensitive surface, and the flow of the conductor 32a A pulse current generator 34 for pulse current; a pulse current of a pulse width Pw and a pulse wave height 値P is applied to the conductor 32a, and a pulse magnetic field is applied to the array type magnetic sensor 12 to perform detection sensitivity of the dynamic magnetic sensor. For example, Japanese Laid-Open Patent Publication No. 2009-14678 (Fig. 1, page 1) (hereinafter referred to as Patent Document 4). [Problem to be Solved by the Invention] In the correction device of Patent Document 4, by applying a pulse current to the magnetic sensitive surface of the array type magnetic sensor 12, the dynamic detection sensitivity of the steel sheet can be corrected. . However, it is necessary to provide a calibration sample plate for a conductor that is wound linearly one turn in a non-magnetic plate, or to specifically lift the magnetic sensitive surface of the array type magnetic sensor. In the plane parallel to the magnetic plane, the sample stage support table of the moving mechanism for finely adjusting the position of the sample plate for calibration in the moving direction of the steel sheet may have a problem that the size of the apparatus cannot be prevented. The present invention has been invented in order to solve the aforementioned problems, and the object is to provide a one or a plurality of array type magnetic sensing column type magnetic sensor substrates on a printed circuit board, which is not required for dynamic detection. Sensitive large-scale device 'Array type magnetic sensor that can be easily corrected [means for solving the problem] In order to achieve the aforementioned object, the array type magnetic sensing plate according to the present invention has one or more on a printed circuit board. An array type magnetic sensing board of an array type magnetic sensor configured by arranging a plurality of elements, wherein the array type magnetic sensor substrate comprises a brush circuit board and the printed circuit board An array type magnetic sensor arranged on one side of the array, one side of the right side of the array type magnetic sensor, or both sides, fixed at an interval parallel to the column axis a magnetic field of the printed circuit board and a pulse current generating circuit for causing a pulse current to flow to the conductor, and a pre-current current flowing to the conductor to generate a reference magnetic field for correction, and the magnetic sensor is used Detector sensitivity correction. [Effects of the Invention] According to the present invention, it is possible to provide an array type magnetic sensor substrate having a plurality of array type magnetic sensors on a printed circuit board, which is a large device for dynamically detecting sensitivity correction, which can be easily Into the array type magnetic sensor substrate. [Embodiment] The array of the device is used for the substrate. The sensor base magnetic sensor base is printed on the left side of the linear axis by a specific pulse array type or a complex line correction. -9 - 201100791 Hereinafter, an embodiment of the present invention will be described with reference to the drawings. [Embodiment] Fig. 1 shows the configuration of an array type magnetic sensor substrate 1A. Figure 1 (a) is a plan view, and Figure 1 (b) is a cross-sectional view of y-y as seen in the direction of the arrow. The array type magnetic sensor substrate 10 includes an array type magnetic sensor 2 composed of a printed circuit board 1 and a plurality of magnetic sensors arranged linearly on one side of the printed circuit board 1. One of the left and right sides of the column axis of the magnetic sensor 2, or a pattern line printed on the plane of the printed circuit board 1 at a specific interval in parallel with the column axis on both sides 4. A pulse current generating circuit 3 for causing a specific pulse current to flow to the pattern line 4. The setting of this pulse current will be described with reference to Fig. 2 . When the current I flows through the finite length pattern line 4, the magnetic flux density B generated by the point P from the pattern line 4 away from the vertical distance R is in the geometric positional relationship shown in Fig. 2(a). - Savart law (Bi〇t-Savart law) and obtained by the following formula. ®~μ〇· I· (c〇S^ 1+ CO S θ 2) / 7ΐ · R) That is, the conductor current of the magnetic flux density B of the reference magnetic field is supplied as I = Β · 4π I· R/[ja 〇· (cosgi 1+ COS0 2)]. Here, μ〇 is a vacuum permeability “0 1 is an angle between the pattern line 4 and a line connecting the p point and the left end of the pattern line 4, and 0 2 is the pattern line 4 and the connection P point and the right end of the pattern line 4. The angle the line is sandwiched. -10- 201100791 Actually, the pattern line 4 has a finite length. Therefore, the same magnetic field as the center portion should be supplied to both ends of the array type magnetic sensor. As shown in Fig. 2(b), an excessive current becomes Is necessary. In other words, the pattern line 4 is set to be sufficiently longer than the array type magnetic sensor 2 so as to be within the difference of the allowable magnetic field strength. For example, in the case of using a flaw detection on a thin steel sheet, the array type magnetic sensor 2 is constituted by a commercially available Hall element, and the plane distance R between the 0 magnetic sensitive surface of the Hall element and the pattern line 4 is 2 mm, at this time, the applied current when the magnetic flux density B at the time of correction is 1 mT is ι〇Α. When two conductors are provided on both sides of the column axis of the array type magnetic sensor 2 shown in Fig. 1, and the current is applied in the opposite direction, the current of each conductor becomes 5A. Since the current is 脉冲, the magnetic field to be corrected only needs to apply a pulse current of a few microseconds (ms), so the pattern line 4 does not need to pay special attention to the heat dissipation countermeasure, and only the pattern line on the Q circuit board can be printed. Come to supply. Further, since the array type magnetic sensor 2 and the conductor 4 which generates the applied magnetic field can be previously fixed at the correct position on the printed circuit board 1, the same applies to the array type magnetic sensor as before. The magnetic field is corrected, and a fine adjustment mechanism having a position of the sensing surface of the micro-adjusting magnetic field generating device and the array type magnetic sensor 2 or a large rotating mechanism for generating a dynamic magnetic field is provided. In the case where a large current is necessary, the array type magnetic sensor 2 and the bus bar formed by the metal -11 - 201100791 such as copper which is correctly fixed at the position are fixed on the printed circuit board instead of the pattern line. The conductor can also be. Further, not only the correction device is miniaturized, but also a dynamic magnetic field can be applied to each of the array type magnetic sensors 2, so that accurate correction can be performed in a short time. Moreover, the present invention is not limited to the foregoing embodiments, and the array type magnetic sensor may be provided with a plurality of columns, and the pattern line 4 through which the pulse current flows may be optimally selected according to the condition of the required corrected magnetic field. The shape of the cross-section or the waveform of the corrected magnetic field to be applied may be any pulse waveform generated arbitrarily, and the conditions required for detecting the magnetic field to be applied may be different, and may be appropriately performed within the scope of the gist of the present invention. change. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is an array type magnetic sensor substrate of the present invention. Fig. 2 is a view for explaining the principle of setting the pulse current of the present invention. Figure 3 is a diagram illustrating a prior magnetic sensor head. Fig. 4 is a view showing the former correction device. Fig. 5 is a view showing a correction device of the prior array type magnetic flaw detector. [Main component symbol description] 1 : Printed circuit board 2 : Array type magnetic sensor 3 : Pulse current generation circuit 4 : Pattern line -12- 201100791 1 ο _ Array type magnetic sensor substrate 1 1 , 1 1 a : Non-magnetic roller 1 1 b : Wire 1 1 C : Motor 1 5 : Current generator 20 : Correction device 12 : (Semiconductor magnetic sensor) Array type magnetic sensor ^ 1 3 : Ribbon material 1 4 : Soft Magnetic body 15: Steel plate 22: Magnetized coil 24: Magnetized yoke 3 0: Magnetic sensor head 3 2 : Corrected sample plate 32a: Conductor 3 3 : Sample support table 3 3 a : Moving mechanism 3 4 : Pulse current generation 4 0 : Correction device-13-