TW201043910A - Water-cooling device and its manufacturing method - Google Patents

Water-cooling device and its manufacturing method Download PDF

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Publication number
TW201043910A
TW201043910A TW098118364A TW98118364A TW201043910A TW 201043910 A TW201043910 A TW 201043910A TW 098118364 A TW098118364 A TW 098118364A TW 98118364 A TW98118364 A TW 98118364A TW 201043910 A TW201043910 A TW 201043910A
Authority
TW
Taiwan
Prior art keywords
water
cooling device
wall
heat
manufacturing
Prior art date
Application number
TW098118364A
Other languages
English (en)
Chinese (zh)
Other versions
TWI379987B (enExample
Inventor
wen-zhong Jiang
Original Assignee
High Conduction Scient Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by High Conduction Scient Co Ltd filed Critical High Conduction Scient Co Ltd
Priority to TW098118364A priority Critical patent/TW201043910A/zh
Priority to US12/802,214 priority patent/US20100307730A1/en
Publication of TW201043910A publication Critical patent/TW201043910A/zh
Application granted granted Critical
Publication of TWI379987B publication Critical patent/TWI379987B/zh
Priority to US14/077,430 priority patent/US20140090825A1/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/04—Constructions of heat-exchange apparatus characterised by the selection of particular materials of ceramic; of concrete; of natural stone
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081—Heat exchange elements made from metals or metal alloys
    • F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW098118364A 2009-06-03 2009-06-03 Water-cooling device and its manufacturing method TW201043910A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW098118364A TW201043910A (en) 2009-06-03 2009-06-03 Water-cooling device and its manufacturing method
US12/802,214 US20100307730A1 (en) 2009-06-03 2010-06-01 Liquid-cooled heat dissipating device and method of making the same
US14/077,430 US20140090825A1 (en) 2009-06-03 2013-11-12 Liquid-cooled heat dissipating device and method of making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098118364A TW201043910A (en) 2009-06-03 2009-06-03 Water-cooling device and its manufacturing method

Publications (2)

Publication Number Publication Date
TW201043910A true TW201043910A (en) 2010-12-16
TWI379987B TWI379987B (enExample) 2012-12-21

Family

ID=43299915

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098118364A TW201043910A (en) 2009-06-03 2009-06-03 Water-cooling device and its manufacturing method

Country Status (2)

Country Link
US (2) US20100307730A1 (enExample)
TW (1) TW201043910A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI703317B (zh) * 2018-05-08 2020-09-01 大陸商上海綠曜能源科技有限公司 可測漏液冷傳熱裝置
TWI767774B (zh) * 2020-11-16 2022-06-11 廣達電腦股份有限公司 冷卻裝置、冷卻組合件、以及液體冷卻系統
TWI820476B (zh) * 2021-08-25 2023-11-01 均賀科技股份有限公司 熱交換器結構

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2936179B1 (fr) * 2008-09-23 2010-10-15 Commissariat Energie Atomique Procede fabrication d'un systeme d'echangeur de chaleur, de preference du type echangeur/reacteur.
DE102012107570B4 (de) * 2012-08-17 2017-08-03 Rogers Germany Gmbh Verfahren zur Herstellung von Hohlkörpern, insbesondere von Kühlern, Hohlkörper sowie Kühler enthaltende elektrische oder elektronische Baugruppen
EP3195711A4 (en) * 2014-09-15 2018-08-29 D'Onofrio, Nicholas, Michael Liquid cooled metal core printed circuit board
CN105992503B (zh) * 2015-03-02 2018-03-02 中山大洋电机股份有限公司 一种功率器件的并联冷却结构及其应用的电机控制器
KR102109491B1 (ko) * 2015-08-28 2020-05-12 교세라 가부시키가이샤 유로 부재
JP6519428B2 (ja) * 2015-09-25 2019-05-29 三洋電機株式会社 冷却装置およびこの冷却装置を有する電源装置
CN107425323B (zh) * 2017-08-28 2022-07-05 深圳市沃尔新能源电气科技股份有限公司 一种插接母端子及应用该母端子的充电枪、充电枪用插座
CN112469242B (zh) * 2020-11-11 2023-02-21 中国第一汽车股份有限公司 液冷式车载电源

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4165561A (en) * 1976-04-15 1979-08-28 American Hospital Supply Corporation Orthodontic appliance with porous tooth-abutting face
US4612978A (en) * 1983-07-14 1986-09-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages
GB9303940D0 (en) * 1993-02-26 1993-04-14 Gec Alsthom Ltd Heat sink
DE19514548C1 (de) * 1995-04-20 1996-10-02 Daimler Benz Ag Verfahren zur Herstellung einer Mikrokühleinrichtung
JPH11346480A (ja) * 1998-06-02 1999-12-14 Hitachi Ltd インバータ装置
US6152215A (en) * 1998-12-23 2000-11-28 Sundstrand Corporation High intensity cooler
US6388317B1 (en) * 2000-09-25 2002-05-14 Lockheed Martin Corporation Solid-state chip cooling by use of microchannel coolant flow
US8087452B2 (en) * 2002-04-11 2012-01-03 Lytron, Inc. Contact cooling device
US7044199B2 (en) * 2003-10-20 2006-05-16 Thermal Corp. Porous media cold plate
WO2005104323A2 (en) * 2004-03-30 2005-11-03 Purdue Research Foundation Improved microchannel heat sink
US7188662B2 (en) * 2004-06-04 2007-03-13 Cooligy, Inc. Apparatus and method of efficient fluid delivery for cooling a heat producing device
CN101208574B (zh) * 2005-09-13 2010-07-14 三菱电机株式会社 散热器
US7849914B2 (en) * 2006-05-02 2010-12-14 Clockspeed, Inc. Cooling apparatus for microelectronic devices
US7898807B2 (en) * 2009-03-09 2011-03-01 General Electric Company Methods for making millichannel substrate, and cooling device and apparatus using the substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI703317B (zh) * 2018-05-08 2020-09-01 大陸商上海綠曜能源科技有限公司 可測漏液冷傳熱裝置
TWI767774B (zh) * 2020-11-16 2022-06-11 廣達電腦股份有限公司 冷卻裝置、冷卻組合件、以及液體冷卻系統
US11882672B2 (en) 2020-11-16 2024-01-23 Quanta Computer Inc. Anti-leakage liquid cooling connectors
TWI820476B (zh) * 2021-08-25 2023-11-01 均賀科技股份有限公司 熱交換器結構

Also Published As

Publication number Publication date
US20140090825A1 (en) 2014-04-03
TWI379987B (enExample) 2012-12-21
US20100307730A1 (en) 2010-12-09

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