TW201033731A - Photosensitive resin composition and display - Google Patents

Abstract

The present invention discloses a photosensitive resin composition, which comprises resin (A), polymeric compound (B), polymerization initiator (C), and solvent (D), wherein the solvent (D) is such solvent comprising dialeneglycol dialkyl ether with alkylene group of 1-3 carbon atoms and alkyl group of 1-4 carbon atoms, and alcohol solvent of 1-6 carbon atoms.

Description

201033731 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a photosensitive resin composition and a display device. [Prior Art] In recent years, as the size of a substrate such as a liquid crystal display panel has increased, generally, in order to form a transparent film or a pattern such as a surface layer on a substrate surface, coating sensitivity is applied by a spin coating method, a slit method, a rotation method, or the like. It is formed by a resin composition. In view of the improvement in productivity and the corresponding large-scale screens, the liquefaction of the photosensitive resin composition solution and the formation of a high-quality uniform coating film have been studied. In this context, in order to form a good quality coating film, a solvent type was selected. For example, it has been disclosed that a solvent is used as a mixture of propylene glycol monomethyl ether acetate, 3-ethoxyethyl propionate, 3-methoxy 1-butanol and 3-methoxybutyl acetate. A photosensitive resin composition (for example, patent document 1). [Patent Document] JP-A-2008-181087, paragraph 91 [Disclosed] However, when a typical coating method using a photosensitive resin composition using the above solvent is a slit die coating method or the like, fogging, vertical stripes, and needles may occur. Traces, so the current high quality coating is not available. Therefore, the object of the present invention is to provide a photosensitive resin composition which can suppress the formation of a high-quality coating film by uniformly forming a film, longitudinal stripes and stitches, and a display device using the same. -5- 201033731 That is, the present invention provides the following items [1] to [8]. (1) A photosensitive resin composition which contains a resin (A), a polymerizable compound (B), a polymerization initiator (C), and a solvent (D), wherein the solvent (D) is contained and has a carbon number of 1 a solvent of a dialkylene glycol dialkyl ether having an alkyl group of 3 and an alkyl group having 1 to 4 carbon atoms, and an alcohol having 1 to 6 carbon atoms. [2] The photosensitive resin composition according to [1], wherein the solvent (D) is 30 to 90% by mass of dialkylene glycol bis-alkyl ether based on the total amount of the solvent. [3] The photosensitive resin composition of [1] or [2] wherein the solvent (D) is an alcohol having a carbon number of 1 to 6 in an amount of 10 to 50% by mass based on the total amount of the solvent. [4] The photosensitive resin composition according to any one of [1] to [3] wherein the dialkylene glycol dialkyl ether is diethylene glycol ethyl methyl ether. [5] The photosensitive resin composition according to any one of [1] to [4] wherein the alcohol having 1 to 6 carbon atoms is 3-methoxybutanol. ® [6] A coating film formed using the photosensitive resin composition according to any one of [1] to [5]. [7] A pattern formed by using the photosensitive resin composition according to any one of [1] to [5]. [8] A display device comprising at least one selected from the group consisting of the coating film of [6] and the pattern of [7]. EFFECTS OF THE INVENTION -6 - 201033731 The present invention can form a high-quality coating film which can suppress the occurrence of fog, vertical stripes and stitches and which is uniform throughout the coating film. Further, a high-quality display device or the like can be obtained by using the photosensitive resin composition. MODE FOR CARRYING OUT THE INVENTION The photosensitive resin composition of the present invention contains a resin (A), a poly-based compound (B), a polymerization initiator (C), and a solvent (D). Further, the examples of the compounds of the respective components in the present specification are not particularly limited and may be used singly or in combination. The resin (A) used in the photosensitive resin composition of the present invention is, for example, a resin having alkali solubility (A1), a resin having alkali solubility and reactivity by at least one of light or heat (A2) )Wait. The alkali-soluble resin (A1), for example, at least one selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic anhydrides (a) (hereinafter referred to as "(a • ) J ) ' or (〇 and Copolymerized monomer (c) (hereinafter referred to as "(c)") copolymer, etc. (a) specific examples thereof include acrylic acid, methacrylic acid, crotonic acid, hydrazine-, m-, p-vinylbenzene Unsaturated monocarboxylic acids such as formic acid; unsaturated dicarboxylic acids such as 1,4_cyclohexyl dicarboxylic acid, methyl-5-nordecene-2,3-dicarboxylic acid; maleic acid, fumaric acid, Citraconic acid, mesaconic acid, itaconic acid, 3_vinyl decanoic acid, 4-vinyl decanoic acid, 3,4,5,6-tetrahydrofurfuric acid ' 1,2,3,6-tetrahydroanthracene Unsaturated dicarboxylic acid such as acid or dimethyltetrahydrofurfuric acid; 201033731 An anhydride of its unsaturated dicarboxylic acid; succinic acid mono [2-(methyl) propylene methoxyethyl ester], citric acid one [2- Unsaturated mono-[(meth)acryloxyalkylalkyl] ester of a polyvalent carboxylic acid having two or more valences such as (meth)acryloxyethyl]; the same molecule such as α-(hydroxymethyl)acrylic acid An unsaturated acrylate having a hydroxyl group and a hydroxyl group, etc. From the viewpoint of reactivity and alkali solubility, acrylic acid, methacrylic acid, maleic anhydride or the like is preferably used. @ (c) For example, methyl (meth) acrylate, ethyl (meth) acrylate, η-butyl (meth)acrylic acid esters, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate and other alkyl (meth) acrylates; cyclohexyl (meth) acrylate, 2- Methylcyclohexyl (meth) acrylate, tricyclo [5.2.1.02,6] decane-8-yl (meth) acrylate (known in the art as dicyclopentanyl (meth) acrylate , (cyclo)cyclopentyloxyethyl (meth) acrylate, isomethylboryl (meth) acrylate, etc. (meth)acrylic acid cyclic alkyl esters; cyclohexyl acrylate, 2-methyl Cyclohexyl acrylate, tricyclo [5.2.1.02'6] decane-8-yl acrylate (known in the art as dicyclopentanyl acrylate), bicyclopentaethoxyethyl acrylate, isocarbo Alkyl acrylates such as alkyl acrylates; phenyl (meth) acrylate, benzyl (methyl) propyl (aryl) acrylates such as acid esters; aryl acrylates such as phenyl acrylate and benzyl acrylate; -8- 201033731 diethyl maleate, diethyl fumarate, diethyl itaconate a dicarboxylic acid diester such as an ester; a hydroxyalkyl ester such as 2-hydroxyethyl (meth) acrylate or 2-hydroxypropyl (meth) acrylate; bicyclo [2_2_1]hept-2-ene' 5- Methylbicyclo[2.2.1]hept-2-ene, 5-ethylbicyclo[2.2.1]hept-2-ene, 5-hydroxybicyclo[2_2.1]hept-2-ene, 5- Carboxybicyclo[2.2.1]hept-2-ene, 5-hydroxymethylbicyclo[# 2.2.1]hept-2-ene, 5-(2'-hydroxyethyl)bicyclo[2.2.1] Hept-2-ene, 5-methoxybicyclo[2.2.1]hept-2-ene, 5-ethoxybicyclo[2.2.1]hept-2-ene, 5,6-dihydroxybicyclo [2.2.1] Hept-2-ene, 5,6-dicarboxybicyclo[2.2.1]hept-2-ene, 5,6-di(hydroxymethyl)bicyclo[2.2.1.]g- 2-ene, 5,6-bis(2'-hydroxyethyl)bicyclo[2.2.1]hept-2-ene, 5,6-dimethoxybicyclo[2.2.1]hept-2-ene , 5,6-diethoxybicyclo[2.2.1]hept-2-ene, 5-hydroxy-5-methylbicyclo[2.2.1] 2-ene, 5-hydroxy-5-ethylbicyclo[2.2.1]hept-2-ene' 5-carboxy-5-methylbicyclo® [2.2.1]hept-2-ene, 5- Carboxy-5-ethylbicyclo[2.2.1]hept-2-ene, 5-hydroxymethyl-5-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-methyl Bicyclo[2.2.1]hept-2-ene, 5-carboxy-6-ethylbicyclo[2.2.1]hept-2-ene, 5,6-dicarboxybicyclo[2.2.1]hept-2 - olefinic anhydride (bicycloheptylene anhydride), 5-tert-butoxycarbonylbicyclo[2.2.1]hept-2-ene, 5-cyclohexyloxycarbonylbicyclo[2.2.1]heptane-2 - alkene, 5-phenoxycarbonylbicyclo[2.2.1]hept-2-ene, 5,6-di(tert-butoxycarbonyl)bicyclo[2.2.1]hept-2-ene, 5, a bicyclic unsaturated compound such as 6-bis(cyclohexyloxycarbonyl)bicyclo[2.2.1]hept-2-ene; -9 - 201033731 N-phenylmaleimide, N_cyclohexylmaline Yttrium imine, N-benzyl maleimide, N-succinimide imido-3-maleimide benzoate, N-amber fermentation imine-4-malaya Aminobutyrate, N-succinimide, imine-6-maleimide caproate, N_amber, imino group, _3_maleimide propionate, N-(9- Dicarbonyl ruthenium derivatives such as pyridyl) maleic imine; styrene, α-methylstyrene, m-methylstyrene, p-methylstyrene, vinyltoluene, P-methoxy Styrene, acrylonitrile, methacrylic acid @ nitrile, vinyl chloride, vinylidene chloride, acrylamide, methacrylamide, vinyl acetate, 1,3-butadiene, isoprene, 2,3- Among them, dimethyl, 1,3-butadiene and the like are preferably styrene, N-phenylmaleimide or N-cyclohexylmaleimide from the viewpoints of copolymerization reactivity and alkali solubility. , N-benzyl maleimide, bicyclo [2.2.1] hept-2-ene, and the like. (a) and (c) may be used singly or in combination. Further, in the present specification, (meth) acrylate means acrylate and / ® or methacrylate. In the copolymer obtained by copolymerization of (a) and (c), the ratio of the constituent components caused by each of the copolymers is preferably 1% by mole based on the total number of moles of the constituent components of the copolymer. The following range. The constituent unit resulting from (a); 2 to 40 mol%; the constituent unit resulting from (c); 60 to 98 mol%. Further, the ratio of the aforementioned constituent components is more preferably in the following range. The constituent unit caused by (a); 5 to 35 mol% -10- 201033731 The constituent unit caused by (C); 65 to 95 mol%. When the above-mentioned constituent ratio is in the above range, tends to obtain good preservation stability. , imaging and solvent resistance. The above-mentioned alkali-soluble resin (A1) is described in the reference "Experimental method for polymer synthesis" (issued by Otsuka Ryokan, Ltd., the first issue of the first edition of the Chemicals, the 1st edition, issued on March 1, 1972). The method and the cited documents described in the literature are manufactured. ® Specifically, for example, 'units (a) and (c) for constituting a copolymer, a polymerization initiator, a solvent, and the like are placed in a reaction vessel, and the mixture is heated and stirred by nitrogen in the absence of oxygen. The method of insulation. The polymerization initiator, the solvent and the like used at this time are not particularly limited, and any of those generally used in the field can be used. For example, a polymerization initiator, a solvent, and the like described later can be used. Further, the obtained copolymer may be used as a solution after the reaction, or a concentrated or diluted solution may be used, and a solid (powder) obtained by reprecipitation or the like may be used. In particular, when the solvent used in the polymerization is a solvent (D) to be described later, it can be used as a solution after the reaction, so that the production step can be simplified (the same applies to the resin (A2) below). The polystyrene-equivalent weight average molecular weight of the alkali-soluble resin (A1) is preferably from 3,000 to 100,000, more preferably from 5,000 to 50,000. When the weight average molecular weight of the alkali-soluble resin (A1) is in the above range, the coating property tends to be good, and it is difficult to reduce the film during development, and it tends to obtain a good non-pixel extractability at the time of development. good. The molecular weight distribution (weight average -11 - 201033731 molecular weight (Mw) / number average molecular weight (?η)) of the alkali-soluble resin (A1) is preferably from 1.1 to 6.0, more preferably from 1.2 to 4.0. When the molecular weight distribution is in the above range, it is preferred that excellent development properties are obtained. The content of the alkali-soluble resin (Α1) used in the photosensitive resin composition of the present invention is preferably from 5 to 90% by mass, more preferably from 5 to 90% by mass, based on the solid content of the photosensitive resin composition. 10 to 70% by mass. When the content of the alkali-soluble resin (Α1) is in the above range, it is sufficiently soluble in the developing solution, and it is difficult to cause Q-developing residue on the substrate of the non-pixel portion, and it is difficult to draw the exposed portion during development. The partial reduction of the film is preferred, and the non-exposed portion is preferably detachable. Resin having alkali solubility and reactivity by at least one of light and heat (Α2), for example, resin (Α2-1): (a), (c), and a cyclic ether structure having a carbon number of 2 to 4. Copolymer resin (A2-2) of the compound (b) (hereinafter referred to as "(b)"): a copolymer of (a) and (c) and (b) a copolymer of @, a resin (A2) -3) : Copolymers of (a) and (b). (b) is a compound having a cyclic ether structure of 2 to 4 carbon atoms, that is, a polymerizable compound having at least one selected from the group consisting of an epoxy group, an oxetane group and a tetrahydrofuran group. (b) preferably a compound having a cyclic ether structure of carbon number 2 to 4 and having an ethylenic carbon-carbon unsaturated bond, more preferably a cyclic ether structure having a carbon number of 2 to 4, and having an acrylonitrile A compound of a methacryl or a methacryl group. -12- 201033731 (b) For example, a monomer having an epoxy group (bl) (hereinafter referred to as "(bl)") or a monomer having an oxetane group (b2) (hereinafter referred to as "(b2) ))), a monomer having a tetrahydrofuran group, and the like. (bl) For example, a polymerizable compound having at least one selected from the group consisting of an aliphatic epoxy group and an alicyclic epoxy group. The monomer having an epoxy group is preferably a compound having an aliphatic epoxy group and at least one selected from the group consisting of an alicyclic epoxy group and having an ethylenic carbon-carbon unsaturated bond. More preferably, it is a compound having at least one structure selected from the group consisting of an aliphatic epoxy group and an alicyclic epoxy group, and having an acryl fluorenyl group or a methacryl fluorenyl group. The aliphatic epoxy group means a monocyclic alkylene group. The alicyclic epoxy group means a group having a structure in which a ring of an alicyclic hydrocarbon is condensed with a molar ring. Specific examples of the compound having an aliphatic epoxy group in (bl) and having an ethylenic carbon-carbon unsaturated bond, for example, glycidyl (methyl) acrylate, yS-methyl glycidyl ( Methyl) acrylate, cold _ethyl glycidyl (meth) acrylate, glycidyl vinyl ether, a compound represented by the following formula described in JP-A-H07-248625, etc.

(wherein R11 to R13 are each independently a hydrogen atom or an alkyl group having 1 to 13 to 201033731 to 10, and m is an integer of 1 to 5). a compound represented by the above formula, such as '〇-vinyl-based glycidic acid, m-vinylbenzyl glycidyl ether, P-vinylhexyl glycidic acid, α-methylvinylbenzyl glycidyl ether, α-Methyl-m-vinylbenzyl glycidyl ether, α-methyl-P-vinylbenzyl glycidyl hydrazine, 2,3-diepoxypropoxymethylstyrene, 2,4-di Glycidoxymethyl styrene, 2,5-diepoxypropoxymethylstyrene, 2,6-diepoxypropoxymethylstyrene, 2,3,4-triepoxy Propyloxymethylstyrene, 2,3,5-triepoxypropoxymethoxymethylstyrene, 2,3,6-triepoxypropoxymethylstyrene, 3,4,5-three Glycidoxymethylstyrene, 2,4,6-triepoxypropoxymethylstyrene, and the like. (Α2) a compound having an alicyclic epoxy group and having an ethylenic carbon-carbon unsaturated bond in (bl), for example, a vinylcyclohexene monooxide 1,2-epoxy-4-vinyl ring Hexane (for example, Ceroxide 2000; manufactured by DAICEL Chemical Industry Co., Ltd.), 3,4-epoxycyclohexyl methacrylate (for example, Cyclomer A4 00; manufactured by DAICEL Chemical Industry Co., Ltd.), 3,4-epoxy@ Cyclohexylmethyl methacrylate (for example, Cyclomer M100; manufactured by Taisher Chemical Industry Co., Ltd.), or at least selected from the group consisting of the compound represented by the formula (I) and the compound represented by the formula (II) 1 compound. R 〇 R_ Ο

[In the formula (I) and the formula (π), R and R' each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms which may be substituted by a hydroxyl group. X and X' are each independently a single bond, C]_6 alkylene, oxy-Cy extension 201033731 alkyl, thio-Cm alkyl, amino-Ci.6 alkyl, Ct.6 alkyl - an oxy group, a Cu alkyl group, a thio group or a -6 alkyl group - an amine group. Specific examples of the hospital base are, for example, 'methyl, ethyl, η-propyl, isopropyl, n-butyl, sec-butyl, tert-butyl and the like. Hydroxyalkyl groups such as hydroxymethyl, 1-hydroxyethyl, 2-hydroxyethyl, 1-hydroxy-η-propyl, 2-hydroxy-η-propyl, 3-hydroxy-η-propyl, 1- Hydroxy-isopropyl, 2-hydroxy-isopropyl, 1-hydroxy-η-butyl, 2-hydroxy-η-butyl #, 3-hydroxy-η-butyl, 4-hydroxy-η-butyl Wait. The substituents R and R' are preferably a hydrogen atom, a methyl group, a hydroxymethyl group, a 1-hydroxyethyl group or a 2-hydroxyethyl group, more preferably a hydrogen atom or a methyl group. Alkyl groups such as methyl, ethyl, and propyl groups. The oxyalkylene group is, for example, an oxyalkylene group, an oxyethylene group, an oxypropylene group or the like. The alkylene oxide group is, for example, an epoxymethyl group, an oxiranyl group, an propylene oxide group or the like. © sulfur extended alkyl such as sulfur methyl, sulfur extended ethyl, sulfur extended propyl and the like. The alkylthio group is, for example, a methylthio group, an ethylthio group, a propylthio group or the like. The amine alkyl group is, for example, an amine group methyl group, an amine group ethyl group, an amine group propyl group or the like. The alkylamino group is, for example, a methylamino group, an ethylamino group, a propylamino group or the like. The substituents X and X are preferably a single bond, a methyl group, an ethyl group, an oxyalkylene group or an oxyethylene group, more preferably a single bond or an oxyethylene group. -15-201033731 The compound represented by the formula [I] is, for example, a compound represented by the formula (1-1) to the formula (1-15). Preferably, it is a formula (1-1), a formula (1-3), a formula (1-5), a formula (1-7), a formula (1-9), a formula (1-1 1) to a formula (1- 15). More preferably, it is a formula (1-1), a formula (1-7), a formula (1-9), and a formula (1-15).

o II

0 II h2c=ch-c-o h2c=ch-c-o-ch2 h2c=ch-c-o-c2h4 h2c=ch-c-o-c2h4-o ch3o i II h2c=c-c a o ch3 o I II HpC =0 - C - O - CH2 ch3 o I II HjC - C - C - O - C2H4 ch3 〇 I II H2C = C - C - O 〇 2 H*-o

i? CH30 It η2ο=Π-ο

H2C =CH -C -O -C2H4-S o II H2C=CH-C-O-C2H4-N H HjC =C—C —〇 -C2H4—S CH3o i II H2C—C—C—O—C2H4—N H

© ch2oh o I II h2c=c-c one o

C2H4OH o h2c=c-c-o

(1-15) The compound represented by the formula [II], for example, a compound represented by the formula (II-1) to the formula (n-15). Preferably, it is a formula (Π-1), a formula (II-3), a formula (II-5), a formula (II-7), a formula (II-9), a formula (11-11) to a formula (11-15). ). More preferably, it is a formula (II-1), a formula (II-7), a formula (II-9), and a formula (11-15). -16- 201033731 i? if 参H2C:CH—C—〇_ h2c=ch—c—o—ch2 h2c:ch—c—o—c2h4 h2c:ch—c—o—c2h4-o ch3o H2C=C— C—o ch3 o h2c=c—co a ch2 ch3 o h2c=c—:.c—o—c2h4

o II h2c:ch-c-o-c2h4-s

o II H H2C: CH—Co—C2H4—N CH3 o fH3〇h2c=c—c—o—c2h4_s H2C=C—C—O—C2H4—N h2c=c—c—o CH,〇H 0 I II H2c=cc-o

Ch3o H2C=C—c—〇—C2H4—o C2H4OH ο h2c=c-c—o

Ai-i5)

At least one compound selected from the group represented by the formula (I) and the compound represented by the formula (II) may be used singly. Also, these can be mixed at any ratio. When mixing, the molar ratio of the molar ratio is preferably, formula (I): formula (II) is 5:95 to 95:5, preferably 10:90 to 90:10, more preferably 20:80 to 80. : 20. a compound having an oxetanyl group of (b2) in the copolymers (A2-1) and (A2-2) and having an unsaturated bond such as 3-methyl-3-methylpropenyloxymethyl oxygen Heterocyclobutane, 3-methyl-3-propenyloxymethyloxetane, 3-ethyl-3-methylpropoxymethyloxetane, 3-ethyl-3- Propenoxymethyloxetane, 3-methyl-3-methylpropenyloxyethyloxene-17- 201033731 Ding Yuan, 3-methyl-3-propenyloxyethyloxene Butane, 3-ethyl-3-methylpropenyloxyethyloxetane, 3-ethyl-3-3-propaneoxyethyloxetane, and the like. The molar fraction of the total number of moles of the constituent components of the copolymer (A2-1) in the copolymer (A2-1) is preferably in the following range. The unit consisting of (a); 2 to 40 mol% of the constituent units resulting from (c); 1 to 65 m. /. The constituent unit caused by the reference (bl) or (b2): 2 to 95 mol% Further, the ratio of the above-mentioned constituent components is more preferably in the following range. The constituent units resulting from (a); 5 to 35 mol% constituting units resulting from (c); 1 to 60 mol% constituting units resulting from (bl) or (b2): 5 to 80 m. /. When the composition ratio is in the above range, the storage stability, development property, solvent resistance, heat resistance and mechanical strength tend to be excellent. For example, the resin having an alkaline solubility (A2·1) can be referred to, for example, the "Experimental Method for Polymer Synthesis" (Otsuno Ryokan, Ltd.), the same person, the first edition, the first brush, March 1, 1972 The method described in the publication and the cited documents described in the literature are manufactured. Specifically, a certain amount of a compound (a), (c), a compound which causes (b 1 ) or (b2), a polymerization initiator, and a solvent are added to the reaction vessel, and the oxygen is replaced by nitrogen. There is a method of stirring, heating, and keeping warm under oxygen. The resin (A2-2) can be produced, for example, via a two-stage process. At this time, -18-201033731, please refer to the above-mentioned document "Experimental method for polymer synthesis" (the method described in the issue of the first issue of the 1st edition of the 1st edition of the 1st edition of the Taisho Chemical Co., Ltd.). It is manufactured by the method described in the publication No. 200 1 -8 953 3 or the like. First, in the first stage, a copolymer (i.e., an alkali-soluble resin) is produced by the same method as the above-described alkali-soluble resin (A1). At this time, various forms can be cited as described above. Further, the above polystyrene is used. • The weight average molecular weight and molecular weight distribution (weight average molecular weight (Mw) / number average molecular weight (?n)) are converted. However, the ratio of the constituent components resulting from (a) and (c) is preferably in the following range with respect to the molar fraction of the total number of moles constituting the constituent components of the copolymer. The constituent unit resulting from (a); 5 to 50 mol%; the constituent unit resulting from (c); 50 to 95 mol%. Further, the ratio of the aforementioned constituent components is more preferably in the following range. β is a constituent unit resulting from (a); 10 to 45 mol% is a constituent unit resulting from (c); 55 to 90 mol%, and the second stage is a portion of (a) a carboxylic acid derived from the obtained copolymer and A carboxylic acid anhydride is reacted with an epoxy group or an oxetane group derived from the above (bl) or (b2). Specifically, for example, after replacing the nitrogen in the environment of the flask with air, the composition (bl) or (b2) with respect to the number of moles of the constituent component (a) is 5 to 80 mol%, and relative to the single The total amount of the bodies (a) to (c), 0.001 to 5% by mass of the carboxyl group and the epoxy group or oxa-19-201033731 cyclobutane reaction catalyst such as three dimethylamino groups Methylphenol, and a total amount of the polymerization inhibitors of 0.001 to 5% by mass based on the total amount of the monomers (a) to (c) are added to the flask with, for example, hydroquinone, and the reaction is continued at 60 to 130 ° C. Up to 1 hour. Thus, the resin (A2-2) was obtained. Further, the polymerization conditions can be appropriately adjusted between the production equipment and the calorific value at the time of polymerization, and the addition method and the reaction temperature. Further, the number of moles of (bl) or (b2) at this time is preferably from 10 to 75 mol%' to more preferably from 15 to 70 mol% with respect to the number of moles of (a). In the range of ◎, a good balance of preservation stability, development, solvent resistance, heat resistance, mechanical strength and sensitivity is obtained. In the resin (A2-3), the ratio of the constituent components caused by the respective components is preferably in the following range with respect to the total number of moles of the constituent components constituting the alkali-soluble resin (A2-3). The constituent unit resulting from (a); 5 to 95 mol% constituting units derived from (bl) or (b2); 5 to 95 mol%. Further, the ratio of the aforementioned constituent components is more preferably in the following range. β is a constituent unit resulting from (a); 1〇 to 90mol% is a constituent unit caused by (bl) or (b2); 10 to 90% by mole. When the above-mentioned constituent ratio is the above range, the tendency is good. Preservation stability, imaging, solvent resistance, heat resistance and mechanical strength. Resin (A2-3) can be referred to, for example, the method described in the "Experimental Method J for Polymer Synthesis (Dazu Takashi, Ltd., 1st Edition, 1st Edition, 1st March, 1970). Manufactured in the literature cited in the literature, etc. -20- 201033731 Specifically, for example, a certain amount of the unit (a) constituting the copolymer and the compound (b 1 ) or (b2), a polymerization initiator, and a solvent are placed in the reaction vessel. After the oxygen is replaced by nitrogen, the polymer is obtained by stirring, heating and keeping warm in the absence of oxygen. The obtained copolymer can be directly used as a solution after the reaction, or a concentrated or diluted solution can be used, and can be used. The solid (powder) obtained by the method of reprecipitation or the like. The polymerizable compound (B) contained in the photosensitive resin composition of the present invention is not particularly limited, and may be, for example, a monofunctional single a monofunctional monomer, a trifunctional or higher polyfunctional monomer, etc. Monofunctional monomers such as nonylphenylcarbitol (meth) acrylate, 2-hydroxy-3-phenoxypropyl (A) Acrylate, 2-ethylhexylcarbitol Methyl) acrylate, 2-(2-ethoxyethoxy)ethyl (meth) acrylate, caprolactone (meth) acrylate, ethoxylated nonyl phenol (meth) acrylate (meth) acrylate such as propoxylated nonylphenol (meth) acrylate; ® styrene, 0:-, 0-, 111-, ?-methylstyrene, 1)-methoxybenzene Styrene such as ethylene, p-tert-butoxystyrene or chloromethylstyrene; diene such as butadiene and 2,3-dimethylbutadiene 'isoprene; (methyl) Acrylic acid methyl ester, (meth)acrylic acid-ethyl ester, (meth)acrylic acid-η-propyl ester, (meth)acrylic acid-i-propyl ester, (meth)acrylic acid-η-butyl ester, (methyl Acrylic acid _sec-butyl ester, (meth)acrylic acid-tert-butyl ester, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, dodecyl (meth)acrylate, Octadecylmethyl methacrylate, (meth)acrylic acid-dicyclopentanyl ester '(meth)acrylic acid - 21 - 201033731 isobornicarboxylate, (meth)acrylic acid-cyclohexyl ester, (methyl) Acrylic acid-2-methyl ring Hexyl ester, (meth)acrylic acid-dicyclohexyl ester, (meth)acrylic acid-adamantyl ester, (meth)acrylic acid-allyl ester, (meth)acrylic acid-propargyl ester, (meth)acrylic acid- Phenyl ester, (meth)acrylic acid-naphthyl ester, (meth)acrylic acid-decyl ester, (meth)acrylic acid-cyclopentyl ester, (meth)acrylic acid-furyl ester, (meth)acrylic acid-tetrahydrofuran ester, Methyl)acrylic acid-pyranyl ester, (meth)acrylic acid-benzyl ester, (meth)acrylic acid-phenethyl ester, (meth)acrylic acid-tolyl ester, (meth)acrylic acid - @ 1,1, Bu San Fluoroethyl ester, (meth)acrylic acid-perfluoroethyl ester, (meth)acrylic acid-perfluoro-n-propyl ester, (meth)acrylic acid-perfluoro-i-propyl ester, (meth)acrylic acid-three a (meth)acrylic acid alkyl ester such as phenylmethyl ester, (meth)acrylic acid-adamantyl ester or (meth)acrylic acid-cumyl ester; a cycloalkyl (meth)acrylate or an aryl (meth)acrylate; (hydroxy) (hydroxy) methacrylate such as 2-hydroxyethyl methacrylate or 2-hydroxypropyl (meth) acrylate; (meth)acrylic acid-decylamine, Ν, Ν-dimethyl decylamine, hydrazine, hydrazine-propyl@ guanamine and other (meth)acrylic acid decylamine; (meth)acrylic acid - decyl aniline, (meth) acrylonitrile, acrolein, Vinyl compounds such as vinyl chloride, vinylidene chloride, hydrazine-vinylpyrrolidone, vinyl acetate; unsaturated dicarboxylic acid diesters such as diethyl maleate, diethyl fumarate, diethyl itaconate; glycidol (meth) acrylate, α-ethyl glycidyl (methyl) propylene vinegar, a-η-propyl glycidyl (meth) acrylate • 22-201033731 ester, α-n-butyl Glycidyl (meth) acrylate, 3,4-epoxybutyl (meth) acrylate, 3,4-epoxyheptyl (meth) acrylate, α-ethyl-6,7-ring A glycidyl compound such as oxyheptyl (meth) acrylate, allyl glycidyl ether or vinyl glycidyl ether. Specific examples of the bifunctional monomer are, for example, 1,3 -butanediol di(meth)acrylate, 1,3-butanediol (meth)acrylate, 1,6-hexanediol di(meth)acrylic acid Ester, ethylene glycol di(meth) acrylate, diethylene glycol bis β (meth) acrylate, neopentyl glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, Tetraethylene glycol di(meth)acrylate, polyethylene glycol diacrylate, bisphenol bis(propylene oxyethyl) ether, ethoxylated bisphenol A di(meth) acrylate, Propoxylated neopentyl glycol di(meth)acrylate, ethoxylated neopentyl glycol di(meth)acrylate, 3-methylpentanediol di(meth)acrylate, and the like. A trifunctional or higher polyfunctional monomer such as trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, tris(2-hydroxym-ethyl)trimeric isocyanate tri(methyl) Acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, propoxylated trimethylolpropane tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol five ( Methyl) acrylate, dipentaerythritol hexa(meth) acrylate, tripentaerythritol tetra (meth) acrylate, tripentaerythritol penta (meth) acrylate, tripentaerythritol hexa (meth) acrylate, tripentaerythritol VII ( a reaction of a methyl acrylate, a tripentaerythritol octa (meth) acrylate, a pentaerythritol tri(meth) acrylate with an acid anhydride, a reaction of dipentaerythritol penta (meth) acrylate with an acid anhydride, and a tripaerythrine tetra-23 - 201033731 Alcoholic seven (meth) acrylate and anhydride caprolactone modified trimethylolpropane tri (meth) acrylate, caprolactone modified pentaerythritol tri (meth) acrylate Caprolactone modified tris(2-hydroxyethyl)trimeric isocyanate tri(meth)acrylate, caprolactone modified pentaerythritol tetra(meth)acrylate, caprolactone modified dipentaerythritol penta(methyl) Acrylate, caprolactone modified dipentaerythritol hexa(meth) acrylate, caprolactone modified tripentaerythritol tetra(meth) acrylate, caprolactone modified tripentaerythritol penta (meth) acrylate, Ester-modified tripentaerythritol hexa(meth) acrylate ginseng, caprolactone modified tripentaerythritol hepta (meth) acrylate, caprolactone modified tripentaerythritol octa (meth) acrylate, caprolactone modified pentaerythritol a reaction of a di(methyl)propionic acid ester with an acid anhydride, a reaction of caprolactone-modified dipentaerythritol penta (meth) acrylate with an acid anhydride, and a caprolactone-modified trimellititol seven (meth) acrylate. Anhydride, etc. Among them, it is preferred to use a monomer having two or more functional groups. The content of the polymerizable compound (B) is preferably from 1 to 70% by mass, and more preferably from 5 to 60% by mass, based on the total amount of the resin (A) and the polymerizable compound (B). When the content of the polymerizable compound (B) is in the above range, it is preferable to have a good sensitivity. The strength, smoothness, reliability, and mechanical strength of the coating film and the pattern are preferable. The polymerization initiator (C) contained in the photosensitive resin composition of the present invention may be a compound which can initiate polymerization by the action of light or heat, and is not particularly limited, and a known polymerization initiator can be used. The polymerization initiator (C) is preferably a diimidazole compound, an acetophenone compound, a triazine compound, a mercaptophosphine oxide compound or a lanthanide-24-201033731 compound. Further, a photo-and/or thermal cationic polymerization initiator (for example, a gun salt cation and an anion derived from a Lewis acid) described in JP-A-2008-108 1087 can be used. Among them, a diimidazole compound having excellent sensitivity is more preferable. The aforementioned diimidazole compound such as 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyldiimidazole, 2,2,-bis(2,3-dichlorobenzene) ) 4,4',5,5'-tetraphenyldiimidazole (for example, refer to JP-A-6-75 3 72, and JP-A-6-75 3 73, etc.), 2, 2, -double (2) -Chlorophenyl)-4,4',5,5'-tetraphenyldiimidazole, 2,2,-bis(2-chlorophenyl)-4,4,5,5'-tetra(alkoxy) Phenyl)diimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetrakis(dialkoxyphenyl)diimidazole, 2,2'-bis ( 2-chlorophenyl)-4,4',5,5'-tetrakis(trialkoxyphenyl)diimidazole (for example, JP-A-48-38204, JP-A-62-174204, etc.) An imidazole compound in which a phenyl group at the 4, 4', 5, and 5'-position is substituted with a carboalkoxy group (for example, JP-A-7-10913, etc.). Preferred is 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenyldiimidazole, 2,2,-bis(2,3-dichlorophenyl) -4,4',5,5'-tetraphenyldiimidazole, 2,2,-bis(2,4-dichlorophenyl)-4,4',5,5'-tetraphenyldiimidazole. The above acetophenone-based compound such as diethoxyacetamidine, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyl dimethyl ketal, 2-hydroxy-1-[ 4 -(2-hydroxyethoxy)phenyl]-2-methylpropan-1-one, 2-hydroxy-1-indole-indole: 4-(2-hydroxy-2-methyl-propenyl)- Benzyl]-phenyl} _2_methyl-propan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1-(4-methylthiophenyl)-2-morpholinylpropane 1-ketone, 2-benzyl-2-dimethylamino-1-(4-morpholin-25-201033731-phenyl)butan-1-one, 2-(2-methylbenzyl)- 2-Dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(3-methylbenzyl)-2-dimethylamino 4-(4-morpholinylbenzene Butyl ketone, 2-(4-methylbenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(2-ethylbenzyl) -2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(2-propylbenzyl)-2-dimethylamino-1-(4-morpholine Phenylphenyl)-butanone, 2-(2-butylbenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(2,3-di Methylbenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2- (2,4 - dimethylbenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(2-chlorobenzyl)-2-dimethylamino-1 -(4-morpholinylphenyl)-butanone, 2-(2-bromobenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-( 3-chlorobenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(4-chlorobenzyl)-2-dimethylamino-1- (4-morpholinylphenyl)-butanone, 2-(3-bromobenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(4 -bromobenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(2-methoxybenzyl)-2-dimethylindenyl- 1-(4-morpholinylphenyl)-butanone, 2-(3-methoxybenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(4-Methoxybenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(2-methyl-4-methoxybenzyl -2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(2-methyl-4-bromobenzyl)-2-dimethylamino-1- (4-morpholinylphenyl)-butanone, 2-(2-bromo-4-methoxybenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butyl Ketone, 2-hydroxy-2-methyl-l-[ An oligomer of 4-(1-methylvinyl)phenyl]propan-1-one or the like. -26- 201033731 The aforementioned tricholine compounds such as '2,4_bis(trichloromethyl)-6(4-methoxyphenyl)+3,5-triazine, 2,4-bis(trichloromethyl) ··6_(4_methoxy-Cetyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)piperidinyl _ ^^^^(trichloromethyl methoxybenzene) B,3,5-triazine, 2,4-bis(trichloromethyl)_6_[2_(5-methylfuran-2-yl)ethyl]-1,3,5-triazine, 2,4_bis(trichloromethyl)_6_[ 2_(pyran-2-yl)ethylidene]-u,5-triazine, 2,4•bis(trichloromethyl)-6-[ 2 - (4-Diethylamino-2-methylphenyl)vinyl]_1 3 5•Triazine ' 2'4_Double G chloromethyl)_6-[2·(3,4_Dimethoxy Phenyl phenyl) vinyl]-1,3,5-triazine, and the like. The above-mentioned mercaptophosphine oxide-based initiator is, for example, 2,6,6-trimethylbenzoic acid diphenylphosphine oxide or the like. The above hydrazine compound is, for example, 0-ethoxycarbonyl-oxyimido-indole-phenylpropan-1-one, a compound represented by the formula (III), a compound represented by the formula (IV), and the like.

Further, the polymerization initiator (C) is preferably a polymerization initiation aid (C-1) for use in the polymerization. The polymerization initiation assistant (C-1) is, for example, a compound represented by the formula (V). -27- (V) 201033731

[In the formula (V), the wireless represented by X is an aromatic ring having 6 to 12 carbon atoms which may be substituted by a halogen atom, Y is an oxygen atom or a sulfur atom, and R1 is an alkyl group having 1 to 6 carbon atoms.

R2 is an alkyl group having 1 to 12 carbon atoms which may be substituted by a halogen atom or an aryl group which may be substituted by a halogen atom. A halogen atom such as a fluorine atom, a chlorine atom or a bromine atom. An aromatic ring having 6 to 12 carbon atoms such as a benzene ring or a naphthalene ring. An aromatic ring having 6 to 12 carbon atoms which may be substituted by a halogen atom, such as a benzene ring, a methylbenzene ring, a trimethylbenzene ring, an ethylbenzene ring, a propylbenzene ring, a butylbenzene ring, a pentylbenzene ring, Hexylbenzene ring, cyclohexylbenzene ring, chlorobenzene ring, dichlorobenzene ring, bromobenzene ring, dibromobenzene ring, phenylbenzene ring, chlorophenylbenzene ring, bromophenylbenzene ring, naphthalene ring, chloronaphthalene ring , bromine naphthalene ring and the like. ® alkyl having 1 to 6 carbon atoms such as methyl, ethyl, n-propyl, isopropyl, η-butyl, 1-methyl-η-propyl, 2-methyl-n-propyl , tert_butyl, n-pentyl, 1-methyl-η-butyl '2-methyl-n-butyl, 3-methyl-η·butyl, l1-monomethyl·η_propyl, hydrazine 2-dimethyl-η-propyl, 2,2-dimethyl-η-propyl, η-hexyl, cyclohexyl and the like. A group having 1 to 12 carbon atoms which may be substituted by a halogen atom, such as methyl, ethyl, η-propyl, isopropyl, η-butyl, ι-methyl-η-propyl, 2-methyl _η_propyl, tert-butyl, η-pentyl, 1-methyl-η-butyl, 2-methyl-η butyl -28- 201033731, 3-methyl-η-butyl, 1,1 - dimethyl-n-propyl, 1,2-dimethyl-η-propyl, 2,2-dimethyl-η-propyl, η-hexyl, cyclohexyl, 1-chloro-η-butyl Base, 2-chloro-η-butyl, 3-chloro-η-butyl, and the like. An aryl group which may be substituted by a tooth atom such as phenyl, chlorophenyl, monochlorophenyl, bromophenyl, dibromophenyl, chlorobromophenyl, biphenyl, chlorobiphenyl, dichlorobiphenyl , bromophenyl 'dibromophenyl, naphthyl, chloronaphthyl, dichloronaphthyl, bromonaphthyl, dibromonaphthyl and the like. β Further, any chemical structural formula in the present specification may vary depending on the number of carbons', and each substituent is applied to the above exemplification. In addition, anything that is both linear or branched can also contain any of these. Specific examples of the compound represented by the formula (V) include 2-benzoquinonemethyl-3-methyl-naphtho[2,1-d]thiazoline, 2-benzoquinonemethyl-3-methyl- Naphtho[l,2-d]thiazoline, 2-benzoquinonemethyl-3-methyl-naphtho[2,3-d]thiazoline, 2-(2-benzoquinonemethyl)-3 -methylbenzothiazoline, β 2-(p-benzoquinonemethyl)-3-methylbenzothiazoline, 2-(2-benzoquinonemethyl)-3-methyl-5-phenyl Benzothiazoline, 2-(1-benzoquinonemethyl)-3-methyl-5-phenylbenzothiazoline, 2-(2-benzoquinonemethyl)-3-methyl-5- Fluorobenzothiazoline '2-(Phenylhydrazinemethyl)-3-methyl-5-fluorobenzothiazoline, 2-(2-benzoquinonemethyl)-3-methyl-5-fluoro Benzothiazoline, 2-(1-phenylhydrazinemethyl)-3-methyl-5-chlorobenzothiazoline, 2-(2-benzoquinonemethyl)-3-methyl-5-bromo Benzothiazoline, 2-(1-benzoquinonemethyl)-3-methyl-5-bromobenzothiazoline, -29 - 201033731 2-(4-biphenylfluorenemethyl)-3-A Benzothiazoline, 2-(4-biphenylfluorenemethyl)-3-methyl-5-phenylbenzothiazoline, 2-(2-naphthoquinonemethyl)-3-methyl- Naphtho[2,1-d]thiazoline, 2 - (2-Naphthoquinonemethyl)-3-methyl-naphtho[l,2-d]thiazoline, 2-(4-biphenylfluorenemethyl)-3-methyl-naphtho[2 ,Ι-d]thiazoline 2-(4-biphenylfluorenemethyl)-3-methyl-naphtho[1,2-(1]thiazoline 2-(p-fluorophenylhydrazinemethyl)- 3-methyl-naphtho[2,ld]thiazoline 2-(p-fluorophenylhydrazinemethyl)-3-methyl-naphtho[1,2-d]thiazoline 2-phenylhydrazinemethyl 3-methyl-naphtho[2,1-d]oxazoline, 2-benzoquinonemethyl-3-methyl-naphtho[l,2-d]oxazoline, 2-benzoquinone Methyl-3-methyl-naphtho[2,3-d]oxazoline, 2-(2-naphthoquinonemethyl)-3-methylbenzoxazoline, 2-(1-naphthoquinone) Methyl)-3-methylbenzoxazoline, 2-(2-naphthoquinonemethyl)-3-methyl-5-phenylbenzoxazoline, 2-(1-naphthoquinone Methyl)-3-methyl-5-phenylbenzoxazoline, 2-(2-naphthoquinonemethyl)-3-methyl-5-fluorobenzoxazoline, 2-(1- Naphthoquinonemethyl)-3-methyl-5-fluorobenzoxazoline, 2-(2-naphthoquinonemethyl)-3-methyl-5-chlorobenzoxazoline, 2-( 1-naphthoquinonemethyl)-3-methyl-5-chlorobenzoxazoline, 2-(2-naphthoquinonemethyl)-3-methyl-5-bromobenzo Oxazoline, -30- 201033731 2-(1-naphthoquinonemethyl)-3-methyl-5-bromobenzoxazolidine, 2-(4-biphenylfluorenemethyl)-3-methyl Benzooxazoline, 2-(4-biphenylfluorenemethyl)-3-methyl-5-phenylbenzoxazoline, 2-(2-naphthoquinonemethyl)-3-methyl -naphtho[2,y-d]oxazoline, 2-(2-naphthoquinonemethyl)-3-methyl-naphtho[1,2-d]oxazoline, 2- (4-linked Benzoquinone methyl)-3-methyl-naphtho[2,1-d]oxazoline> 〇2-(4-biphenylfluorenemethyl)-3-methyl-naphtho[1, 2-d]oxazoline, 2-(p-fluorophenylhydrazinemethyl)-3-methyl-naphtho[2,1-d]oxazoline 2-(p-fluorophenylhydrazinemethyl) 3-methyl-naphtho[l,2-d]oxazoline and the like. Preferably, it is 2-(2-naphthoquinonemethyl)-3-methylbenzothiazoline represented by formula (V-1), and 2-benzoquinone is represented by formula (V-2). Β-based 3-methyl-naphtho[ij-d]thiazoline and 2-(4-biphenylfluorenemethyl)-3-methyl-naphtho[1, represented by formula (v-3) 2-d]thiazoline. -31 - 201033731

(V-3) When these compounds are used, the resulting photosensitive resin composition can have higher sensitivity. When the coating film and the pattern are formed by using the obtained photosensitive resin composition, the productivity of the coating film and the pattern can be improved, and the compound represented by the formula (V) is not sublimated by the heat when the film is baked. It is preferable to fade by the action of at least one of light and heat to improve transparency. Further, the polymerization initiation aid (C-1) may be a compound represented by at least one selected from the group consisting of the formula (VI) and the formula (VII). R1, R1, Y1

Y1

X2) (VII) is an aromatic ring or a heterocyclic ring having 6 to 12 carbon atoms which may be substituted by a halogen atom. Y1 and Y2 are an oxygen atom or a sulfur atom. R1 and R2 are an alkyl group having 1 to 12 carbon atoms or 32 to 201033731 an aryl group having 6 to 12 carbon atoms. These alkyl groups and aryl groups may be substituted by a halogen atom, a hydroxyl group or an alkoxy group having 1 to 6 carbon atoms]. An aromatic ring or a heterocyclic ring which may be substituted by a halogen atom, for example, a benzene ring, a methylbenzene ring, a dimethylbenzene ring, an ethylbenzene ring, a propylbenzene ring, a butylbenzene ring, a pentylbenzene ring, a hexylbenzene ring , cyclohexylbenzene ring, chlorobenzene ring, dichlorobenzene ring, bromobenzene ring, dibromobenzene ring, phenylbenzene ring, chlorophenylbenzene ring, bromophenylbenzene ring, naphthalene ring, chloronaphthalene ring, bromonaphthalene Ring, phenanthrene ring, val ring, fluoranthene ring, benzo[a]芘# ring, benzo[e]fluorene ring, anthracene ring and derivatives thereof, etc. Hydroxy-substituted alkyl group, such as hydroxymethyl group, hydroxyl group Ethyl, propylidene, hydroxybutyl and the like. A hydroxy-substituted aryl group such as a hydroxyphenyl group, a hydroxynaphthyl group or the like, an alkoxy-substituted alkyl group such as a methoxymethyl group, a methoxyethyl 'methoxypropyl group, a methoxybutyl group, a butoxy group. Methyl, ethoxyethyl 'ethoxylated 1-propyl, propoxy butyl and the like. Specific examples of the alkoxy-substituted aryl group such as a methoxyphenyl group, an ethoxy group, a compound represented by the formula (VI) and the formula (VII), for example, 'naphthalene dimethoxynaphthalene, diethoxynaphthalene, Di-alkoxy naphthalenes such as dipropoxy naphthalene and diisopropoxy dibutoxynaphthalene; diisopropoxy methoxy ethoxy methoxy butoxyethoxybutoxyisopropoxy butyl Dimethoxy oxime, diethoxy ruthenium, dipropoxy ruthenium dibutoxy ruthenium, dipentyl methoxy ruthenium, dihexyloxy fluorenyl ruthenium, methoxy propoxy oxime, methoxy isopropyl Dialkyloxyanthracene such as oxyindenyl hydrazine, ethoxyoxypropoxy fluorene, ethoxyisopropoxy fluorenyl hydrazine, propoxy oxy oxime oxime, propoxy oxy oxy oxime Class; -33- 201033731 Dioxetane, di-oxybutyl, dipropoxy, diisopropoxy, dibutoxydin, etc. . Further, as the polymerization initiator (C), a photopolymerization initiator can be used. The photopolymerization initiator is, for example, a benzoin-based compound, a benzophenone-based compound, a thioxanthone-based compound, an anthraquinone-based compound or the like. A benzoin-based compound such as 'benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether and the like. The aforementioned benzophenone-based compound such as benzophenone, hydrazine methyl hydrazide, 4-phenylbenzophenone, 4-phenylhydrazine-4'-methyldiphenyl sulfide, 3 , 3', 4, 4'-tetra (tert-butylperoxycarbonyl) benzophenone, 2,4,6-trimethylbenzophenone, and the like. The aforementioned thioxanthone-based compound such as 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, 1-chloro -4-propoxythioxanthone and the like. The aforementioned lanthanoid compounds are, for example, 9,10-dimethoxyanthracene, 2-ethyl-9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 2-ethyl-9,10- Diethoxy hydrazine _ and so on. Further, as a photopolymerization, 10-butyl-2-chloroacridone, 2-ethyl hydrazine, benzyl vinegar, 9,10-phenanthrenequinone, anthracene, methyl phenylglyoxylate, a titanocene compound or the like can be used. Initiator. Further, as the photopolymerization initiator having a chain transferable group, a photopolymerization initiator described in JP-A-2002-544205 can be used. The photopolymerization initiator having a chain transferable group is, for example, a photopolymerization initiator of the following formulas (1) to (6). -34- 201033731 o (1) ❿ h3cooc ^c-c-s-(ch2)^s- f fH3/ C——C-N ch3

(twenty three)

H2cs H3COOC ch2 ch3 \ CH3 cH3 (5)

HzV h2 / H3COOC C2H5 ch3 The above photopolymerization initiator having a chain transferable group can be used as a component of the lipid (A).

Further, the above polymerization initiator is preferably a polymerization initiator J polymerization initiator (C-2), such as an amine compound and a carboxylic acid amine compound such as triethanolamine, methyldiethanolamine, or a third aliphatic amine compound, 4- Methyl dimethylaminobenzoate, a constituting tree agent (isopropanolamine 4-dimethyl-35-201033731 ethyl benzoate, 4-dimethylamino benzoic acid, etc. Isoamyl ester, 2-ethylhexyl 4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, N,N-dimethyl-p-toluidine, 4,4,-bis ( Dimethylamino)benzophenone (commonly known as Michler's ketone), 4,4'-bis(diethylamino)benzophenone-like aromatic amine compound. Carboxylic acid compound such as phenylthioacetic acid, Methylphenyl thioacetic acid, ethyl phenyl sulphuric acid, methyl ethyl phenyl thioacetic acid, dimethyl phenyl thioacetic acid, methoxy phenyl thioacetic acid, dimethoxy phenyl thioacetic acid, chlorophenyl An aromatic heteroacetic acid such as thioacetic acid, dichlorophenylthioacetic acid, N-phenylaminoacetic acid, phenoxyacetic acid, naphthylthioacetic acid or N-naphthylamino acetic acid 'naphthyloxyacetic acid. The content of the polymerization initiator (C) is preferably from 0.1 to 40% by mass, more preferably from 1 to 30% by mass, based on the total amount of the resin (A) and the polymerizable compound (B). When the total amount of (C) is within this range, the photosensitive resin composition can have high sensitivity, and the coating film and pattern formed using the photosensitive resin composition tend to have good strength and surface smoothness. The amount of use of the ruthenium polymerization initiator (C-1) and/or (C-2) is preferably 0.01 to 50 by mass based on the total amount of the resin (A) and the polymerizable compound (B). More preferably, it is 0.1 to 40% by mass. When the amount of the polymerization initiation aid (C-1) and/or (C-2) is in this range, the sensitivity of the obtained photosensitive resin composition can be further improved, and the tendency is further It is preferable to improve the productivity of forming a pattern substrate using the photosensitive resin composition. -36- 201033731 In particular, when the compound represented by the formula (V) is used, the content thereof is relative to the polymerization initiation aid (C-1). The content is preferably from 50 to 100%, more preferably from 60 to 100%, particularly preferably from 65 to 100%. Formula (V) When the content of the compound is within this range, it is preferred that the coating film has good transparency when a coating film is formed using the photosensitive resin composition containing the same. Further, the photosensitive resin composition of the present invention may further contain a polyfunctional group. a thiol compound (T). The polyfunctional thiol compound (T) is a compound having 2 or more sulfanyl groups in the molecule, and a carbon having two or more aliphatic hydrocarbon groups bonded thereto is used. In the case of a compound of a sulfhydryl group of an atom, the sensitivity of the photosensitive resin composition of the present invention can be improved. Specific examples of the polyfunctional thiol compound (T) are, for example, hexanedithiol, decanedithiol, 1,4-dimethylmercaptobenzene, butanediol dithiopropionate, butanediol bis-mercaptoacetate, ethylene glycol bis-mercaptoacetate, trimethylolpropane tridecyl acetate, Butanediol dithiopropionate, trimethylolpropane trithiopropionate, trimethylolpropane tridecyl acetate, pentaerythritol tetrathiopropionate β, pentaerythritol tetradecyl acetate, trihydroxy ethane Trithiopropionate, pentaerythritol tetrakis(3-mercaptobutyrate), 1,4-bis(3- Butoxide acyl oxy) butane and the like. The content of the polyfunctional thiol compound (Τ) relative to the polymerization initiation aid (C) is preferably from 0.5 to 100% by mass, more preferably from 1 to 90% by mass. The content of the polyfunctional thiol compound is preferably from 0.1 to 20% by mass, more preferably from 1 to 10% by mass, based on the total of the binder resin (Α) and the photopolymerizable compound (C). When the content of the polyfunctional thiol compound (Τ) is in this range, the sensitivity is improved, and it is preferable to obtain good imageability -37-201033731. The solvent (D) used in the photosensitive resin composition of the present invention preferably dissolves the components such as the resin (A), the polymerizable compound (B), and the polymerization initiator (C) uniformly, and does not react with each component. The reaction. The solvent (D) is more preferably a solvent containing at least a specific dialkylene glycol dialkyl ether and a specific alcohol. Further, the dialkylene glycol dialkyl ether and the alcohol may be used singly or in combination of two or more. The dialkylene glycol dialkyl ether is a solvent each containing two or more alkyl groups having 1 to 3 φ carbon atoms and alkyl groups having 1 to 4 carbon atoms, and the alkyl group and the alkyl group may be the same or different. Such dialkylene glycol dialkyl ethers such as diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol diethyl ether, diethylene glycol di-n-propyl ether, diethylene Alcohol isopropyl methyl ether, diethylene glycol butyl methyl ether, diethylene glycol dibutyl ether, dipropylene glycol dimethyl ether, dipropylene glycol ethyl methyl ether, dipropylene glycol diethyl ether, dipropylene glycol methyl propyl ether, dipropylene glycol butyl group Ether, dipropylene glycol ethyl propyl ether, dipropylene glycol butyl ether, dipropylene glycol butyl propyl ether, dipropylene glycol dimethyl butyl ether and the like. Among them, diethylene glycol ethyl methyl ether is preferred. The dioxane ruber dialkyl ether is preferably contained in an amount of from 30 to 90% by mass, more preferably from 30 to 80% by mass, particularly preferably from 30 to 70% by mass, based on the total amount of the solvent (D). In this range, dry spots of the coating film can be suppressed. That is, when the coating film is dried, the solvent is usually dried by a reduced pressure drying method, but in order to shorten the drying time, it is necessary to reduce the pressure in a short time. At this time, the solvent is caused to boil and becomes a cause of dry spots, but when the dialkylene glycol dialkyl ether of this range is used, the dry spots of the coating film can be effectively prevented. -38- 201033731 The alcohol is preferably an alcohol having 1 to 6 carbon atoms. The alcohol may be a monoalcohol or a polyvalent alcohol having a divalent or higher valence. Such alcohols are, for example, methanol, ethanol, propanol, butanol, pentanol, hexanol, cyclohexanol, propylene glycol methyl ether, propylene glycol ethyl ether, propylene glycol propyl ether, ethylene glycol, ethylene glycol-methyl ether, ethylene glycol -ether, ethylene glycol-propyl ether, ethylene glycol-butyl ether, methyl lactate, ethyl lactate, propyl lactate, methyl 2-methyl lactate, diacetone alcohol, 3-methoxybutanol, glycerol , 2-hydroxyethyl propionate, methyl 2-hydroxy-2-ylpropanoate, ethyl 2-hydroxy-2-methylpropionate, methyl 3-hydroxypropionate, 3-hydroxypropionic acid Ethyl ester, propyl 3-hydroxypropionate, methyl hydroxyacetate, ethyl hydroxyacetate, butyl glycolate, and the like. Of these, 3-methoxybutanol is preferred. The total amount of ethanol relative to the solvent (D) is preferably from 1 to 50% by mass, more preferably from 10 to 45% by mass, particularly preferably from 15 to 40% by mass. When the alcohol in this range is contained, the resin or the like can be sufficiently soluble, and the viscosity can be appropriately adjusted to impart uniformity to the obtained coating film. Further, even if the photosensitive resin composition is applied by using the slit die β coater, it is possible to prevent the nozzle tip from being dried, and to suppress the deposition of foreign matter from the dried matter, and to prevent the longitudinal streaks caused by the foreign matter. Further, the following solvents may be used as necessary. For example, 'methyl cellosolve acetate, ethyl cellosolve acetate, ethylene glycol-butyl ether acetate, ethylene glycol alkyl ether acetate, etc.; propylene glycol- Alkanediol alkyl ether acetates such as methyl ether acetate, propylene glycol-diethyl ether acetate, propylene glycol-propyl ether acetate, methoxybutyl acetate, methoxypentyl acetate; -39 - 201033731 Propylene glycol-alkyl ethers with a carbon number of 7 or more such as propylene glycol-butyl ether; propylene glycol such as propylene glycol dimethyl ether, propylene glycol diethanol, propylene glycol ethyl methyl ether, propylene glycol dipropyl ether propylene glycol propyl methyl ether or propylene glycol ethyl propyl ether Dialkyl ethers; propylene glycol methyl ether propionate, propylene glycol ethyl ether propionate, propylene glycol propyl ether propionate, propylene glycol butyl ether propionate, etc.; propylene glycol alkyl ether propionate; propoxy butanol, butoxylated a butanediol monoalkylene having a carbon number of 7 or more; 10 methoxybutyl acetate, ethoxybutyl acetate, propoxybutyl acetate, butoxybutyl acetate Butane and other butanediol monoalkyl ether acetate; methoxybutyl propionate, ethoxybutyl propionate, propoxy butyl propionate Butanediol monoalkyl ether propionate such as butoxybutyl propionate; aromatic hydrocarbons such as benzene, toluene, xylene, etc.; methyl ethyl ketone, acetone, methyl pentanone, methyl Ketones such as isobutyl ketone and cyclohexanone; methyl acetate, ethyl acetate, propyl acetate, butyl acetate, methyl methoxyacetate, ethyl methoxyacetate, propyl methoxyacetate, Butyl oxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, propyl ethoxyacetate, butyl ethoxyacetate, methyl propoxyacetate, ethyl propoxyacetate, propoxy Propyl propyl acetate, butyl oxyacetate, methyl butoxyacetate, ethyl butoxyacetate, propyl butoxyacetate, butyl butoxyacetate, methyl 2-methoxypropionate, Ethyl 2-methoxypropionate, propyl 2-methoxypropionate, butyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, Propyl 2-ethoxypropionate, butyl 2-ethoxypropionate, 2-butoxy-40-201033731 methyl propyl propionate, ethyl 2-butoxypropionate, 2-butoxy propyl Butyl propylbutoxypropionate, 3-methoxypropane Methyl ester, 3-methoxypropene, propyl 3-methoxypropionate, butyl 3-methoxypropionate, 3-ethoxymethyl ester, ethyl 3-ethoxypropionate, 3-B Propyl oxypropionate, butyl 3-propionate, methyl 3-propoxypropionate, propyl 3-propoxypropionate propyl propionate, butyl 3-propoxypropionate, Ethyl 3-butoxypropionate, 3-butoxypropionate, 3-butoxypropionate, etc.; butyl lactate, butyl 3-hydroxypropionate, a hydroxyl group-containing ester having 7 or more carbon atoms such as 2-hydroxy-3-methylbutyl; a cyclic ether such as tetrahydrofuran or pyran; and a cyclic ester such as 7-butyrolactone. Among the above solvents, an organic solvent having a boiling point of 乞 to 200 ° C is preferred from the viewpoint of coatability and dryness. Among them, preferred are alkanediol alkyl esters, ketones, butanediol alkyl ether acetates, β-alkyl ethers having a carbon number of 7 or more, ethyl 3-ethoxypropionate, and 3-methoxypropane. The acid methyl ester is more preferably propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, methoxybutyl acetate, ethyl ethoxypropionate or methyl 3-propionate. However, it is preferred to use only the above-mentioned dialkylene glycol dialkyl ether and alcohol. The mass fraction of the photosensitive resin composition of the solvent (D) in the photosensitive resin composition of the present invention is preferably from 60 to 90% by mass, more preferably from 65 to 85% by mass. The content of the solvent (D) is the same as that of the spin coater, the slit & spin coater, slot coater (also known as ester, 2-acid ethyl propionate ethoxy, 3-propyl methyl ester, C Methyl acid butyrate is an ester ester such as 100 ether acetate butanediol, the amount of cyclic methoxy group is relative: amount %, when it is surrounded, the die is coated -41 - 201033731 machine, curtain flow coater)' oil spray machine, roller Various coating apparatuses such as a coater and a dip coater can obtain good coatability. The photosensitive resin composition of the present invention contains substantially no coloring agent such as a pigment or a dye. In other words, the content of the coloring agent in the photosensitive resin composition of the present invention with respect to the entire composition is, for example, less than 1% by mass, preferably less than 0.5% by mass. For example, the photosensitive resin composition of the present invention does not substantially contain the following colorants used in the field. The color index (published by The Society of Dyers and Colourists) is classified as a pigment (Pigment) compound, for example, CI Pigment Yellow 1, 3' 12, 13, 14, 15, 16, 17, 20, 24, 31, 53 Yellow pigments such as 83, 86, 93, 94, 1〇9, 11〇, 117, 125, 128, 137, 138, 139, 147, 148, 150, 153, 154, 166, 173, 194, 214; ·1. Orange pigments such as pigment orange 13, 31, 36, 38' 40, 42, 43, 51, 55, 59, 61, 64, 65, 71, 73; ❹ 123, 144, 149, 166 CI·Pigment Red pigments such as red 9, 97, 105' 122, 168, 176, 177, 180, 192, 209, 215' 216, 224, 242, 254' 255, 264, 265; CI Pigment Blue 15, 15 : :4 , 15:6, 60, etc. Blue pigments such as 32, 36, 38, etc. C.I_ Pigment Violet 1, 19, 23, 29, C·1. Pigment Green 7, 36 and other green pigments; -42- 201033731 CI Pigment Brown pigments such as brown 23, 25; black pigments such as CI pigment black 1, 7. The photosensitive resin composition of the present invention may be used in combination with various additives such as a chelating agent, another polymer compound, a surfactant, an adhesion promoter, an antioxidant, an ultraviolet absorber, a photostabilizer, and a chain transfer agent. Filling agents such as glass, cerium oxide, aluminum oxide, and the like. Other polymer compounds such as 'epoxy resin, maleimide resin, etc.> Curable resin, polyvinyl alcohol, polyacrylic acid, polyethylene glycol monoalkyl ether, polyfluoroalkyl acrylate, polyester, polyurethane The ruthenium surfactant such as a thermoplastic resin such as an ethyl ester may be any of a polysiloxane, a fluorine-based, an ester-based, a cationic, an anionic, a nonionic, or an amphoteric surfactant. Specifically, for example, polyethylene oxide alkyl ethers, polyethylene oxide alkyl phenyl ethers, polyethylene glycol diesters, sorbitan fatty acid esters, fatty acid modified polyesters, tertiary amines Polyurethanes, polyaziridines, etc., and commercially available surfactants. For example, the trade name 信 (Shin-Etsu Chemical Industry Co., Ltd.), Polyflow (Kyoei Chemical Co., Ltd.), Ftop (Mitsubishi Materials Electronics Co., Ltd.), Megafac (DIC), Flu〇rad ( Sumitomo 3M (share) system, Surflon (AGC Semi-Chemical), Solsperse (Zeneca), EFKA (made by CIBA), Ajisupa PB821 (Ajinomoto). Adhesion promoters such as vinyltrimethoxymethane, vinyltriethoxydecane, vinyltris(2-methoxyethoxy)decane, N-(2-aminoethyl)-3-amine Propylmethyldimethoxydecane, N-(2-aminoethyl-43 - 201033731 )-3 -aminopropyltrimethoxydecane' 3-aminopropyltriethoxy sand, 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropylmethyldimethoxydecane, 3-glycidoxypropylmethyldimethoxydecane, 2- (3,4-epoxycyclohexyl)ethyltrimethoxydecane, 3-chloropropylmethyldimethoxydecane, 3-chloropropyltrimethoxydecane, 3-methylpropenyloxypropane Trimethoxy decane, 3-mercaptopropyltrimethoxy decane, and the like. Antioxidants such as 2-tert-butyl-6-(3-tert-butyl-2-alkyl-5-methylbenzyl)-4-methylphenyl acrylate, 2-[1-(2) -hydroxy-3,5-Q di-tert-pentylphenyl)ethyl]-4,6-di-tert-pentylphenyl acrylate, 6-[3-(346 1^-butyl-4 -hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra-tert-butyldibenzo[d,f][1,3,2]dioxaphosphorus ,3,9-bis[2-{3-( 3-tert-butyl-4-hydroxy-5-methylphenyl)propenyloxy}-1,1-dimethylethyl]-2, 4,8,10-tetraoxaspiro[5.5]undecane, 2,2'-extended methyl bis(6-tert-butyl-4-methylphenol), 4,4'-butylene bis ( 6-tert-butyl-3-methylphenol), 4,4'-thiobis(2-tert-butyl-5-methylphenol), 2,2'-thiobis(6-tert-butyl -4-methylphenol oxime), dilauryl 3,3'-thiodipropionate, dimyristyl 3,3'-thiodipropionate, distearyl 3,3'-thiodipropane Acid ester, pentaerythritol tetrakis(3-laurylthiopropionate), 1,3,5-bis(3,5- _-butyl-4-hydrazino)· 1,3,5-triazine- 2,4,6 (1&311,51〇-trione, 3,3,,3",5,5',5 -hexa-tert-butyl-a, a', a"-(to-2,4,6-triyl)tri-indolyl-cresol, pentaerythritol tetrakis[3-(3,5-di-tert-butyl) 4-hydroxyphenyl)propionate], 2,6-di-tert-butyl-4-methylphenol, etc. UV absorbers such as 2-(2-hydroxy-5-tert-butylbenzene Base)-2H- -44- 201033731 Benzotriazole, Octyl-3-[ 3-tert-butyl-4-hydroxy-5-( 5-chloro-2H-benzotriazol-2-yl)benzene Propionate, 2-[4-[(2-hydroxy-3-dodecyloxypropyl)oxy]-2-pyridylphenyl]-4,6-bis(2,4- - _ Methylphenyl)-1,3,5-triazine, 2-[4-[(2-hydroxy-3-(2ethyl)hexyl)oxy]-2-hydroxyphenyl]-4,6- Bis(2,4-dimethylphenyl)-1,3,5-triazine, 2,4-bis(2-hydroxy-4-butoxyphenyl)-6-(2,4_bis- Butoxyphenyl)-1,3,5-triazine, 2-(2-hydroxy-4-[1-octyloxycarbonylethoxy]benzene Φ)-4,6-bis(4-benzene Phenyl)-1,3,5-triazine, 2-( 2H-benzotriazol-2-yl)-4,6-bis(1-methyl-1-phenylethyl)phenol, 2 -(2H-benzotriazol-2-yl)-6-(1-methyl-1-phenylethyl)-4-(1,1,3,3-tetramethylbutyl)phenol 2- (3-tert- butyl-2-hydroxy-5-methylphenyl) -5-chlorobenzotriazole, alkoxy benzophenone. A light stabilizer such as a polymer formed from succinic acid and (4-hydroxy-2,2,6,6-tetramethylpiperidin-1-yl)ethanol, N,N',N",N"'- Tetrakis(4,6-bis(butyl(N-methyl-2,2,6,6-tetramethylpiperidin-4-yl)amino)triazin-2-β)-4,7- Diazanonane-1,10-diamine, decane diacid, and bis(2.2.6.6-tetramethyl-1-(octyloxy)-4-piperidyl) ester, and 1,1 - Reactivity of dimethylethyl hydroperoxide, bis(1,2,2,6,6-pentamethyl-4-piperidinyl)-[[3,5-bis(1,1-di) Methyl ethyl)-4-hydroxyphenyl]methyl]butyl malonate, 2,4-bis[N-butyl-N-(1-cyclohexyloxy-2.2.6.6-tetramethyl Piperidin-4-yl)amino]-6-(2-hydroxyethylamine)-1,3,5-triazine, bis(1,2,2,6,6-pentamethyl-4-piperidin Pyridyl) sebacate, methyl (1,2,2,6,6-pentamethyl-4-piperidyl) sebacate, and the like. Chain transfer agents such as dodecyl mercaptan, 2,4-diphenyl-4-methyl-1-pentyl-45-201033731 ene, and the like. The photosensitive resin composition of the present invention can be formed on a substrate, such as a substrate such as glass, metal or plastic, a color filter, or various insulating films, a conductive film, a driving circuit, or the like, as described later. Coating film. The coating film is preferably a dried and hardened material. Further, the obtained coating film can be patterned into a desired shape to obtain a pattern. Further, these coating films and/or patterns can be used as part of a constituent member such as a display device. Further, when the curable resin composition of the present invention is poured into a quartz cell having an optical path length of 1 cm and the transmittance at a measurement wavelength of 400 to 700 nm is measured by a spectrophotometer, the average light transmittance is preferably 70. More than %, more preferably more than 75%. Thus, a transparent pattern and a coating film in the visible light field can be formed. First, the photosensitive resin composition of the present invention is applied onto a substrate. The coating can be carried out by various coating apparatuses such as a spin coater, a slit & spin coater, a slit coater, an ink sprayer, a roll coater, and a dip coater as described above. Among them, solubility, drying prevention, and prevention of foreign matter are preferably applied by a slit ® coating method, that is, coating using a slit & spin coater and slit coater. Next, drying and/or pre-baking is carried out to remove volatile components such as a solvent. This results in a smooth, unhardened film. The film thickness of the coating film at this time is not particularly limited, and can be appropriately adjusted depending on the material to be used, the use, and the like, for example, 1 to 6 μm. Then, light rays, for example, ultraviolet rays generated from a mercury lamp or a light-emitting diode, are irradiated onto the obtained uncured coating film 46-201033731 through a mask for forming a target pattern. The shape of the mask at this time is not particularly limited and may be various shapes. Further, the line width and the like can be appropriately adjusted by the size of the mask or the like. In recent years, the exposure machine can remove the wavelength range by using a filter that removes light of up to 35 Onm, and selectively removes the band by using a band filter that can extract light near 436 nm, near 408 nm, and around 365 nm. The equal wavelength domain 'evenly illuminates parallel light onto the entire exposed surface. In this case, in order to separate the mask and the substrate at the correct position, a device such as a mask lithography machine or an advanced machine φ can be used. Thereafter, the coating film is brought into contact with an aqueous alkali solution to dissolve a certain portion, for example, a non-exposed portion, and a desired pattern shape can be obtained after development. The developing method may be any one of a liquid filling method, a dipping method, a spray method, and the like. In addition, the substrate can be tilted at any angle during development. The developing solution used for development is generally an aqueous solution containing a basic compound and a surfactant. The basic compound may be any of inorganic and organic basic compounds such as sodium hydroxide, potassium hydroxide, disodium hydrogen phosphate, sodium dihydrogen phosphate, diammonium hydrogen phosphate, ammonium dihydrogen phosphate. , potassium dihydrogen phosphate, sodium citrate, potassium citrate, sodium carbonate, potassium carbonate, sodium hydrogencarbonate, potassium hydrogencarbonate, sodium borate, potassium borate, ammonia, and the like. Further, an organic basic compound such as tetramethylammonium hydroxide, 2-hydroxyethyltrimethylammonium hydroxide, monomethylamine, dimethylamine, trimethylamine, monoethylamine, and Ethylamine, triethylamine, monoisopropylamine, diisopropylamine, ethanolamine, and the like. -47- 201033731 The concentration of the inorganic and organic basic compounds in the alkali developing solution is preferably from 0 to 01% by mass, more preferably from 0.03 to 5% by mass. The surfactant may be a nonionic surfactant, an anionic surfactant or a cationic surfactant. Nonionic surfactants such as polyethylene oxide alkyl ether, polyethylene oxide aryl ether, polyethylene oxide alkyl aryl ether, other polyethylene oxide derivatives, ethylene oxide/epoxy Propane block copolymer, sorbitan fatty acid ester, polyethylene oxide sorbitan fatty acid ester, polyethylene oxide sorbitol fatty acid ester, glycerin fatty acid ester, polyethylene oxide Alkyl fatty acid esters, poly(ethylene oxide) amine amines, and the like. Anionic surfactants such as higher alcohol sulfate salts such as sodium lauryl sulfate and sodium oleate sulfate, hospital sulfates such as sodium lauryl sulfate and ammonium lauryl sulfate, and sodium sulfonate And alkyl aryl sulfonates such as sodium ketone sodium alkoxide. The cationic surfactants are, for example, an amine salt such as stearylamine hydrochloride or lauryl trimethylammonium chloride or a quaternary ammonium salt. The concentration of the surfactant in the quinone-based developing solution is preferably from 0.01 to 1% by mass, more preferably from 0.05 to 8% by mass, particularly preferably from 0.1 to 5% by mass. After the development, the water is washed, and if necessary, it can be post-baked. The post-baking can be carried out, for example, at 150 to 230 ° C for 10 to 180 minutes. The curable resin composition of the present invention is preferably a condition in which a coating film having a thickness of 3 //m is measured at a measurement wavelength of 400 to 700 nm by heat-hardening (for example, 150 to 0.25 ° C, 0.1 to 3 hours) using a spectrophotometer. When the light transmittance is lower, the light transmittance is 90% or more, and more preferably 95% or more. This can form a transparent pattern and film in the field of light -48 - 201033731. When the pattern and the coating film thus obtained are used in, for example, a liquid crystal display device, it is suitably used as a photo-aligner and a protective film which can be patterned. Further, when the uncured coating film is subjected to patterning exposure, a hole can be formed by using a mask for forming a hole, and it is suitable as an interlayer insulating film. Further, when the unhardened coating film is exposed, a transparent film can be formed by performing full exposure and heat hardening or only heat curing without using a light mask. The transparent film is suitable as a protective film. It can also be used for display devices such as touch panel #板. Thus, a display device having a high-quality coating film or pattern can be manufactured with high yield. The photosensitive resin composition of the present invention is suitably used for forming various films and patterns, for example, a transparent film, particularly a transparent film, a pattern, a photoranger, a protective film, an insulating film constituting a part of a color filter. The liquid crystal alignment protrusion, the microlens, the color pattern of the film thickness, the protective layer, and the like are combined. Further, it can be used for a color filter, an array substrate, or the like having such a coating film or a pattern for use in a part of the constituent member, or a display device such as the color filter β-ray device and/or the array substrate. For example, a liquid crystal display device, an organic EL device, or the like. [Embodiment] Hereinafter, the photosensitive resin composition of the present invention will be described in more detail by way of examples, but the present invention is not limited to the examples. In the following examples and comparative examples, unless otherwise indicated, the % or the part used as the mass basis. -49-201033731 Synthesis Example 1 Nitrogen was flowed into a 1 L flask equipped with a reflux condenser, a dropping funnel and a stirrer at a flow rate of 0.02 L/min, and placed in a mixture of diethylene glycol ethyl methyl ether (M0 part), followed by heating to a stirring 70 °C. Next, 40 parts of methacrylic acid and 3,4-epoxytricyclo[5.2_1·02'6]decyl acrylate (the compound represented by the formula (1-1) and the compound represented by the formula (ΙΙ-1)) are prepared. a mixture of molar ratios of 50:50) 360 parts of a solution of 190 parts of diethylene glycol ethyl methyl ether. The droplets were then dropped into a flask maintained at 70 ° C for 4 hours using a dropping cartridge. .

Further, 30 parts of the polymerization initiator 2,2'-azobis(2,4-dimethylvaleronitrile) was dissolved in a solution of 240 parts of diethylene glycol ethyl methyl ether using another dropping funnel for 5 hours. Into the flask. After the completion of the dropwise addition of the polymerization initiator solution, it was kept at 7 (TC for 4 hours, and then cooled to room temperature to obtain a copolymer (resin Aa) having a solid content of 42.6% and an acid value of 60 mg-KOH/g. The obtained resin Aa The weight average molecular weight (Mw) was 8,000, and the degree of dispersion was 1.91. Synthesis Example 2 Nitrogen was flowed into a 1 L flask equipped with a reflux condenser, a dropping funnel, and a stirrer at a flow rate of 0.02 L/min. After 305 parts of ethyl methyl ether, it was heated to 7 (TC) with stirring. Next, 60 parts of methacrylic acid and 3,4-epoxytricyclo[5.2.1.02'6]decyl acrylate (formula (1-1)) were prepared. Table 201033731 shows a compound and a compound of the formula (Π4) with a molar ratio of 50: 50) 240 parts of a solution of 14 parts of diethylene glycol ethyl methyl ether dissolved in a dropping funnel to 4 The solution was dropped into a flask maintained at 70 ° C. The polymerization initiator 2,2'-azobis(2,4-dimethylvaleronitrile) 30 was further used for 4 hours using a separate dropping funnel. A solution of 225 parts of diethylene glycol ethyl formate was dropped into the flask. After the solution of the polymerization initiator was dropped, it was kept at 70 ° C for 4 hours. After cooling to room temperature, a copolymer (resin Ab) having a solid content of Φ 3 2.6% and an acid value of 10 mg-KOH/g (in terms of solid content) was obtained. The weight average molecular weight Mw of the obtained resin Ab was 1,3,600, and the dispersion degree was obtained. 2.49. Synthesis Example 3 Nitrogen was flowed into a 1 L flask equipped with a reflux condenser, a dropping funnel and a stirrer at a flow rate of 0.02 L/min, and 200 parts of 3-methoxy-1-butanol and 3_A were placed. After 5 parts of oxybutyl acetate, it is heated to 7 (rc. β) with stirring. Next, 60 parts of methacrylic acid and 3,4-epoxytricyclo[5.2.1 ·〇2,6]fluorenyl group are prepared. Acrylate (a mixture of a compound represented by the formula (1-1) and a compound represented by the formula (ΙΙ-1) in a molar ratio of 50:50) 240 parts dissolved in 3-methoxybutyl acetate 14〇 The solution was dropped into a flask kept at 70 ° C for 4 hours using a dropping funnel, and the polymerization initiator 2,2'-azobis (2, was further used for 4 hours using another dropping funnel. 4-Dimethylvaleronitrile) 30 parts of a solution dissolved in 225 parts of 3-methoxybutyl acetate was dropped into the flask. After the solution of the polymerization initiator was dropped, it was kept at 70 ° C for 4 hours. After cold To room temperature, a copolymer (resin Ac) having a solid content of 32.6% and an acid value of ll 〇 mg-KOH / -51 - 201033731 g (in terms of solid content) was obtained. The weight average molecular weight Mw of the obtained resin Ac was 13,400' dispersion. 2.50. Determine the weight average molecular weight of the copolymer (resin Aa to Ac) (

Mw) and the number average molecular weight (??) were carried out under the following conditions using a GPC method. Device: K24 79 (Shimadzu Corporation (stock) system)

Column: SHIMADZU Shim-pack GPC-80M Column temperature: 40 ° C 溶剂 Solvent: THF (tetrahydrofuran) Flow rate: 1. OmL / min

The argon: RI is the degree of dispersion (Mw / Μη) of the weight average molecular weight and the number average molecular weight in terms of polystyrene obtained as described above. Examples 1 to 9 and Comparative Example 1 The compositions of Table 1 were mixed to obtain photosensitive resin compositions 1 to 10. Θ <Evaluation of the smudges> The photosensitive resin composition solution obtained in the examples and the comparative examples was applied to a 15 cm angle using a slit die coater (manufactured by ZOOM-100 Itochu Co., Ltd.). On the film-forming glass substrate, the film thickness after hardening was 5 · 5 " m. Thereafter, the reduced pressure was dried under reduced pressure to 〇.5 torr using a vacuum dryer (manufactured by VCO Microtechnical Co., Ltd.). The hot plate was prebaked at 90 ° C for 2 minutes to form a film coated with -52-201033731. After cooling, the surface of the film was irradiated with a Na lamp, and the surface of the coating film was visually confirmed. When the fog spot (cloud spot) was clearly confirmed, it was X, and it was only Δ when it was confirmed, and it was 〇 when it was almost impossible to confirm. <Evaluation Stitch> • After forming a coating film as described above, it is dried under reduced pressure. Thereafter, a stainless steel plate having a hole diameter of 60 mm and a thickness of 20 mm was placed on a hot plate set at 90 ° C, and pre-baked for 2 minutes to form a coating film. After cooling, the surface of the film was irradiated with a Na lamp, and the surface of the coating film was visually confirmed. 明确 When the stitch was clearly confirmed, it was X, and when it was confirmed, it was Δ, and when it was almost unconfirmed, it was 〇. β <Evaluation of slit nozzle dryness> A coating film was formed as described above. Thereafter, the nozzle tip was not washed and placed directly, and after 1 minute, the same coating was performed under the unwashed nozzle. Next, the reduced pressure was dried under reduced pressure to 0.5 torr using a vacuum dryer (manufactured by VCD Microtechnical Co., Ltd.), and then formed on a hot plate at 90 T: prebaked for 2 minutes to form a coating film. After cooling, the surface of the film was irradiated with a Na lamp, and the surface of the coating film was visually confirmed -53-201033731. When it was confirmed as a vertical line, it was χ', and when it was confirmed, it was Δ', and it was 〇 when it was hardly confirmed. <Average light transmittance of the composition> Using an ultraviolet visible near-infrared spectrophotometer (V-650; manufactured by JASCO Corporation) (quartz unit, optical path length: 1 cm) 'Measurement of average light transmittance of 400 to 700 nm (%). <Average light transmittance of the pattern> Using each of the photosensitive resin compositions, a cured film having a film thickness of 3 after curing was produced by the following method. The glass substrate of 5 cm angle was washed successively with a neutral detergent, water and 2-propanol and dried. The composition was applied onto the substrate using a spin coater so that the patterned film thickness after baking was 3; zm. Next, a vacuum film was dried under reduced pressure to 0.5 torr using a vacuum dryer (VCD Microsystems) to form a coating film. The coating film was pre-baked at 90 ° C for 2 minutes on a hot plate, and the exposure machine (TME-150RSK 'Tektronix) was used under the condition that the distance between the substrate and the quartz glass optical reticle was 1 〇 Aim. , light source: ultra-high pressure mercury lamp), the pre-baked coating film was exposed to an exposure amount of 100 nU/cm 2 (405 nm basis) under the atmosphere. At the time of exposure, the emitted light from the ultrahigh pressure mercury lamp was irradiated through an optical filter (LU0400, manufactured by Asahi Separation Co., Ltd.), and a light mask for forming a line pattern of 100 // m and a space pattern was used. After exposure, it was immersed in an aqueous solution of tetramethylammonium hydroxide at 23 ° C (containing 2.38 parts of tetramethylammonium hydroxide in 100 parts of the aqueous solution) for 60 seconds, followed by watering after development, and then -54 on the hot plate. 201033731 23 After 5 °C, bake for 1 minute to form a line and space pattern. The average light transmittance (%) of 400 to 700 nm was measured using a microscopic spectrophotometer (OSP-SP200; manufactured by OLYMPUS Co., Ltd.). A higher light transmittance means less absorption. [Table 1] Example Comparative Example 1 2 3 4 5 6 7 8 9 10 11 1 Photosensitive resin composition 1 2 3 4 5 6 7 8 9 10 11 12 Adhesive resin (A) (converted in solid content) Aa 60 60 60 60 60 60 60 60 — — Ab 55 — — Ac 60 50 55 Photopolymerizable compound (B) 40 40 40 40 40 40 40 40 45 40 50 45 Photopolymerization initiator (C) Ca 1.5 1.5 1.5 1. 5 1.5 1.5 1.5 1.5 1.5 ' ~ Cb -. 4.0 - 4. 0 4.0 C2a - 3. 0 - 3.0 3.0 C2b - 0.5 - 0.5 0.5 Solvent (D) Da 10 30 30 50 - 30 30 30 30 18 20 17 Db - - - - 30 - 20 Piano - - - - Dc 90 70 70 50 70 50 50 30 70 70 30 - Dd - - - - - 20 A 40 - - 38 26 De - 12 12 37 Df '-20 Moisture (mPa*s ) 5.0 5.8 7.0 7.5 5.5 6.1 6.4 6.2 6.2 5,0 6.3 6.1 Solid content (%) 23.5 23.5 27.0 23.5 23.5 23.5 23.5 23.5 23.5 21.0 25.5 23.5 Matte on the surface of the coating film oo 〇OOO 0 O 〇〇ο X Stitch o △ △ 〇A ooo △ 〇〇X The polarity of the nozzle o 〇O 0 o 〇〇〇〇ο 〇X The average rate of conversion of the object (%) Rate (%) 94.2 94.2 94.2 94.2 94.2 94.2 94.2 94.2 85.6 94.2 85.7 85.4 99.6 99.6 99.6 99.6 99.6 99.6 99.6 99.6 99.6 99.7 99.6 99.4

The components in Table 1 are as follows. Polymerizable compound (B): dipentaerythritol tetracyclate (KAYARAD DPHA: manufactured by Sakamoto Chemical Co., Ltd.) Polymerization initiator (C) Ca: 1-(4-phenylthiophenyl) Xinyuan-1 ,2-dione-2-indole-indole-benzoate (OXE 01 : manufactured by Ciba JaPan) -55- 201033731 Polymerization initiator (c) Cb: 2,2'-bis(2-chlorophenyl)- 4,4',5,5'-tetraphenyl-1,2,-biimidazole (B-CIM: manufactured by Baotu Valley Chemical Co., Ltd.) Initiator C2a: Pentaerythritol tetrapropionate (SC Organic Chemistry ( Copolymer) PEMP) Initiator C2b: 2-(2-naphthoquinonemethyl)-3-methylbenzothiazoline Solvent Da: 3-methoxybutanol solvent Db: propylene glycol monomethyl ether solvent Dc: diethylene glycol ethyl methyl ether solvent Dd: propylene glycol monomethyl ether acetate solvent De: 3-methoxybutyl acetate solvent Df: 3-ethoxyethyl propionate as described above When the coating film is formed by the photosensitive resin composition of the invention, even if a thick film thickness is formed by coating, fogging, vertical striing, and stitching do not occur, and the entire coating film can be uniformly smoothed to form a high-quality coating film. That is, since the boiling point is low, the coating drying time can be shortened, and productivity can be improved. It also suppresses the drying of the front end of the slit nozzle, and prevents the occurrence of foreign matter due to drying, mixing into the coating film and vertical stripes. Moreover, the solubility of the resin and various components is good, and the preservation stability can be improved. When the pattern and the coating film are formed by using the photosensitive resin composition, when the display device is manufactured by using the above, the yield can be improved. Industrial use possibility -56- 201033731

According to the present invention, it is possible to form a high-quality coating film which does not cause fogging, vertical gradation and stitching, and which makes the coating film uniform. Further, a high-quality display device or the like can be obtained by using the photosensitive resin composition of the present invention. -57-

Claims (1)

201033731 VII. Application for Patent Park: 1 · A photosensitive resin composition containing a resin (A), a polymerizable compound (B), a polymerization initiator (C), and a solvent (D), wherein 'solvent (D) It is a dialkylene glycol dialkyl ether containing a pendant alkyl group having 1 to 3 carbon atoms and a carbon number of 1 to 4, and a carbon number! Solvent for alcohols up to 6. The photosensitive resin composition of the first aspect of the invention, wherein the solvent (D) is 30 to 90% by mass of the di-alkylene glycol dialkyl ether based on the total amount of the solvent. 3. The photosensitive resin composition according to claim 1 or 2, wherein the solvent (D) is an alcohol having 10 to 50% by mass of a carbon number of 1 to 6 with respect to the total amount of the solvent. 4. The photosensitive resin composition according to any one of claims 1 to 3, wherein the dialkylene glycol dialkyl ether is diethylene glycol ethyl methyl ether. The photosensitive resin composition of any one of the items 4, wherein the alcohol having 1 to 6 carbon atoms is 3-methoxybutanol. A coating film formed by using the photosensitive resin composition according to any one of claims 1 to 5 of the patent application. 7 ♦ A pattern which is formed using the photosensitive resin composition as set forth in any one of claims 1 to 5. 8. A display device which is at least one selected from the group consisting of a coating film as set forth in claim 6 and a pattern as in the seventh aspect of the patent application. -58- 201033731 IV Designated representative circle: (1) The representative representative of the case is: None. (II) Simple description of the symbol of the representative figure: None 201033731 V If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: none