JP2010152335A - Photosensitive resin composition and display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which suppresses occurrence of haze, vertical streaky defects and marks of pins and enables to form a high-quality coating film having uniformity all over, and a display and the like using the same. <P>SOLUTION: The photosensitive resin composition including a resin (A), a polymerizable compound (B), a polymerization initiator (C), and a solvent (D), wherein the solvent (D) is a solvent containing a dialkylene glycol dialkyl ether having 1-3C alkylene groups and 1-4C alkyl groups and a 1-6C alcohol. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a photosensitive resin composition and a display device.

In recent liquid crystal display panels and the like, the size of a substrate has been increased, and a photosensitive resin composition is usually formed by a spin coating method in order to form a transparent film or pattern such as a coat layer on a substrate surface. The coating is formed by a slit & spin method or the like.
On the other hand, from the viewpoint of improving productivity, supporting large screens, etc., a method for forming a high-quality uniform coating film while reducing the liquid content of the photosensitive resin composition solution has been studied.

  From such a background, in order to form an excellent quality coating film, selection of a solvent species is being sought. For example, it is disclosed that a photosensitive resin composition using a mixture of propylene glycol monomethyl ether acetate, 3-ethoxyethyl propionate, 3-methoxy 1-butanol and 3-methoxybutyl acetate as a solvent is disclosed. (For example, patent document 1).

Japanese Patent Laying-Open No. 2008-181087, paragraph 91

However, even if the photosensitive resin composition using the above-described solvent is applied to a typical coating method, such as a slit die coating method, moire unevenness, vertical stripe unevenness and pin marks do not necessarily occur, and high quality The present condition is that no coating film is obtained.
The present invention has been made in view of the above problems, and is a photosensitive resin composition that suppresses the occurrence of haze unevenness, vertical stripe unevenness, and pin marks, and can form a uniform and high-quality coating film over the entire coating film. An object is to provide an object and a display device using the object.

  The photosensitive resin composition of the present invention includes a resin (A), a polymerizable compound (B), a polymerization initiator (C) and a solvent (D), and the solvent (D) is an alkylene group having 1 to 3 carbon atoms. And a solvent comprising a dialkylene glycol dialkyl ether having an alkyl group having 1 to 4 carbon atoms and an alcohol having 1 to 6 carbon atoms.

Moreover, in this photosensitive resin composition, the solvent (D) is a solvent containing 30 to 90% by mass of dialkylene glycol dialkyl ether or an alcohol having 1 to 6 carbon atoms based on the total amount of the solvent. % Of the solvent is preferable.
Furthermore, it is preferable that the dialkylene glycol dialkyl ether is diethylene glycol ethyl methyl ether, or the alcohol having 1 to 6 carbon atoms is 3-methoxybutanol.

The coating film of this invention is formed using the photosensitive resin composition mentioned above, It is characterized by the above-mentioned.
The pattern of this invention is formed using the coating film mentioned above, It is characterized by the above-mentioned.
The display device of the present invention is formed using at least one selected from the group consisting of the above-described coating film and the pattern according to claim 7.

According to the photosensitive resin composition of the present invention, generation of haze unevenness, vertical stripe unevenness and pin marks can be suppressed, and a uniform and high-quality coating film can be formed throughout the coating film.
Further, by using this photosensitive resin composition, it is possible to obtain a high-quality display device or the like.

  The photosensitive resin composition of the present invention comprises a resin (A), a polymerizable compound (B), a polymerization initiator (C), and a solvent (D). In addition, in this specification, the compound illustrated as each component can be used individually or in combination unless there is particular notice.

  As the resin (A) used in the photosensitive resin composition of the present invention, a resin (A1) having alkali solubility, a resin (A2) having reactivity due to alkali solubility and at least one of light and heat. And the like.

  As the resin (A1) having alkali solubility, at least one selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic acid anhydrides (hereinafter sometimes referred to as “(a)”), ( Examples thereof include a copolymer of a) and a copolymerizable monomer (c) (hereinafter sometimes referred to as “(c)”).

Specific examples of (a) include unsaturated monocarboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, o-, m-, and p-vinylbenzoic acid;
Saturated dicarboxylic acids such as 1,4-cyclohexene dicarboxylic acid and methyl-5-norbornene-2,3-dicarboxylic acid;
Maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, 3-vinylphthalic acid, 4-vinylphthalic acid, 3,4,5,6-tetrahydrophthalic acid, 1,2,3,6-tetrahydrophthalic acid, dimethyl Unsaturated dicarboxylic acids such as tetrahydrophthalic acid;
Anhydrides of these unsaturated dicarboxylic acids;

Unsaturated mono [(meth) acryloyloxyalkyl] esters of polyvalent carboxylic acids such as succinic acid mono [2- (meth) acryloyloxyethyl] and phthalic acid mono [2- (meth) acryloyloxyethyl] Kind;
Examples thereof include unsaturated acrylates containing a hydroxy group and a carboxy group in the same molecule, such as α- (hydroxymethyl) acrylic acid.
Of these, acrylic acid, methacrylic acid, maleic anhydride and the like are preferably used from the viewpoint of copolymerization reactivity and alkali solubility.

(C) As (meth) acrylic acid alkyl ester such as methyl (meth) acrylate, ethyl (meth) acrylate, n-butyl (meth) acrylate, sec-butyl (meth) acrylate, tert-butyl (meth) acrylate Kind;
Cyclohexyl (meth) acrylate, 2-methylcyclohexyl (meth) acrylate, tricyclo [5.2.1.0 ^2,6 ] decan-8-yl (meth) acrylate (in this technical field, dicyclopenta Nyl (meth) acrylate), (meth) acrylic acid cyclic alkyl esters such as dicyclopentanyloxyethyl (meth) acrylate and isoboronyl (meth) acrylate;

Cyclohexyl acrylate, 2-methylcyclohexyl acrylate, tricyclo [5.2.1.0 ^2,6 ] decan-8-yl acrylate (commonly referred to in the art as dicyclopentanyl acrylate), dicyclo Acrylic acid cyclic alkyl esters such as pentaoxyethyl acrylate and isobornyl acrylate;
(Meth) acrylic acid aryl esters such as phenyl (meth) acrylate and benzyl (meth) acrylate;
Acrylic acid aryl esters such as phenyl acrylate and benzyl acrylate;
Dicarboxylic acid diesters such as diethyl maleate, diethyl fumarate, diethyl itaconate;
Hydroxyalkyl esters such as 2-hydroxyethyl (meth) acrylate and 2-hydroxypropyl (meth) acrylate;

  Bicyclo [2.2.1] hept-2-ene, 5-methylbicyclo [2.2.1] hept-2-ene, 5-ethylbicyclo [2.2.1] hept-2-ene, 5- Hydroxybicyclo [2.2.1] hept-2-ene, 5-carboxybicyclo [2.2.1] hept-2-ene, 5-hydroxymethylbicyclo [2.2.1] hept-2-ene, 5- (2′-hydroxyethyl) bicyclo [2.2.1] hept-2-ene, 5-methoxybicyclo [2.2.1] hept-2-ene, 5-ethoxybicyclo [2.2.1 ] Hept-2-ene, 5,6-dihydroxybicyclo [2.2.1] hept-2-ene, 5,6-dicarboxybicyclo [2.2.1] hept-2-ene, 5,6- Di (hydroxymethyl) bicyclo [2.2.1] hept-2- 5,6-di (2′-hydroxyethyl) bicyclo [2.2.1] hept-2-ene, 5,6-dimethoxybicyclo [2.2.1] hept-2-ene, 5,6 -Diethoxybicyclo [2.2.1] hept-2-ene, 5-hydroxy-5-methylbicyclo [2.2.1] hept-2-ene, 5-hydroxy-5-ethylbicyclo [2.2 .1] Hept-2-ene, 5-carboxy-5-methylbicyclo [2.2.1] hept-2-ene, 5-carboxy-5-ethylbicyclo [2.2.1] hept-2-ene 5-hydroxymethyl-5-methylbicyclo [2.2.1] hept-2-ene, 5-carboxy-6-methylbicyclo [2.2.1] hept-2-ene, 5-carboxy-6- Ethylbicyclo [2.2.1] hept-2-ene, , 6-dicarboxybicyclo [2.2.1] hept-2-ene anhydride (hymic anhydride), 5-tert-butoxycarbonylbicyclo [2.2.1] hept-2-ene, 5-cyclohexyl Oxycarbonylbicyclo [2.2.1] hept-2-ene, 5-phenoxycarbonylbicyclo [2.2.1] hept-2-ene, 5,6-di (tert-butoxycarbonyl) bicyclo [2.2 .1] bicyclounsaturated compounds such as hept-2-ene, 5,6-di (cyclohexyloxycarbonyl) bicyclo [2.2.1] hept-2-ene;

  N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, N-succinimidyl-3-maleimidobenzoate, N-succinimidyl-4-maleimidobutyrate, N-succinimidyl-6-maleimidocaproate, N-succinimidyl-3 -Dicarbonylimide derivatives such as maleimide propionate, N- (9-acridinyl) maleimide;

Styrene, α-methylstyrene, m-methylstyrene, p-methylstyrene, vinyl toluene, p-methoxystyrene, acrylonitrile, methacrylonitrile, vinyl chloride, vinylidene chloride, acrylamide, methacrylamide, vinyl acetate, 1,3-butadiene , Isoprene, 2,3-dimethyl-1,3-butadiene and the like.
Of these, styrene, N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, bicyclo [2.2.1] hept-2-ene and the like are preferable from the viewpoint of copolymerization reactivity and alkali solubility.
(A) and (c) are used alone or in combination.
In the present specification, (meth) acrylate means acrylate and / or methacrylate.

In the copolymer obtained by copolymerizing (a) and (c), the ratio of the constituent components derived from each is 100 mol% in terms of the total number of moles of the constituent components constituting the copolymer. Sometimes it is preferred that the molar fraction is in the following range:
Structural units derived from (a); 2 to 40 mol%
Structural unit derived from (c); 60 to 98 mol%

Moreover, it is more preferable in the ratio of the said structural component being the following ranges.
Structural units derived from (a); 5-35 mol%
Structural unit derived from (c); 65 to 95 mol%
When the composition ratio is in the above range, storage stability, developability, and solvent resistance tend to be good.

  The resin (A1) having alkali solubility is described in, for example, the document “Experimental Method for Polymer Synthesis” (published by Takayuki Otsu, Chemical Dojin Co., Ltd., First Edition, First Edition, issued March 1, 1972). It can be produced with reference to the described method and the cited references described in the document.

  Specifically, a predetermined amount of units (a) and (c) constituting the copolymer, a polymerization initiator, a solvent, and the like are charged into a reaction vessel, and the oxygen is replaced with nitrogen. Then, a method of stirring, heating and keeping warm is exemplified. In addition, the polymerization initiator, the solvent, and the like used here are not particularly limited, and any of those usually used in the field can be used. For example, a polymerization initiator and a solvent described later can be used.

  In addition, the obtained copolymer may use the solution after reaction as it is, may use the concentrated or diluted solution, and took out as solid (powder) by methods, such as reprecipitation. Things may be used. In particular, by using a solvent (D) described later as a solvent in this polymerization, the solution after the reaction can be used as it is, and the production process can be simplified (hereinafter referred to as resin (A2)). The same applies to the above).

  The weight average molecular weight in terms of polystyrene of the resin (A1) having alkali solubility is preferably 3,000 to 100,000, more preferably 5,000 to 50,000. If the weight-average molecular weight of the resin (A1) having alkali solubility is in the above range, the coating property tends to be good, the film is not easily reduced during development, and the non-pixel portion can be removed during development. Tends to be good, which is preferable.

  The molecular weight distribution [weight average molecular weight (Mw) / number average molecular weight (Mn)] of the resin (A1) having alkali solubility is preferably 1.1 to 6.0, more preferably 1.2 to 4. 0. The molecular weight distribution in the above range is preferable because it tends to be excellent in developability.

  Content of resin (A1) which has alkali solubility which can be used for the photosensitive resin composition of this invention is a mass fraction with respect to solid content in the photosensitive resin composition, Preferably it is 5-90 mass. %, More preferably 10 to 70% by mass. If the content of the resin (A1) having alkali solubility is in the above range, the solubility in the developer is sufficient, and development residues are hardly generated on the non-pixel portion of the substrate, and exposure is performed during development. It is preferable that the film thickness of the pixel portion of the portion does not easily decrease, and the non-exposed portion tends to be easily removed.

As the resin (A2) having alkali solubility and reactivity by the action of at least one of light and heat,
Resin (A2-1): a copolymer of (a), (c), and a compound (b) having a cyclic ether structure having 2 to 4 carbon atoms (hereinafter sometimes referred to as “(b)”),
Resin (A2-2): a copolymer obtained by reacting (b) with a copolymer of (a) and (c),
Resin (A2-3): The copolymer of (a) and (b) etc. are mentioned.

  (B) refers to a polymerizable compound having at least one structure selected from the group consisting of, for example, a cyclic ether structure having 2 to 4 carbon atoms (for example, an epoxy group, an oxetanyl group, and a tetrahydrofuryl group). (B) is preferably a compound having at least one structure selected from the group consisting of cyclic ether structures having 2 to 4 carbon atoms and having an ethylenic carbon-carbon unsaturated bond. It is more preferable that the compound has at least one structure selected from the group consisting of -4 cyclic ether structures and has an acryloyl group or a methacryloyl group.

  Examples of (b) include a monomer (b1) having an epoxy group (hereinafter sometimes referred to as “(b1)”), a monomer (b2) having an oxetanyl group (hereinafter referred to as “(b2)”) And a monomer having a tetrahydrofuryl group.

(B1) refers to, for example, a polymerizable compound having at least one structure selected from the group consisting of an aliphatic epoxy structure and an alicyclic epoxy structure. The monomer having an epoxy group is a compound having at least one structure selected from the group consisting of an aliphatic epoxy structure and an alicyclic epoxy structure, and having an ethylenic carbon-carbon unsaturated bond. It is more preferable that the compound has at least one structure selected from the group consisting of an aliphatic epoxy group and an alicyclic epoxy group, and has an acryloyl group or a methacryloyl group.
Here, the aliphatic epoxy structure means a structure obtained by epoxidizing a chain olefin, and the alicyclic epoxy structure means a structure obtained by epoxidizing a cyclic olefin.

（式中、Ｒ^１１〜Ｒ^１３は、それぞれ独立に水素原子または炭素原子数１〜１０のアルキル基であり、ｍは１〜５の整数である。）。
アルキル基としては、具体的には、メチル基、エチル基、ｎ−プロピル基、イソプロピル基、ｎ−ブチル基、１−メチル−ｎ−プロピル基、２−メチル−ｎ−プロピル基、ｔｅｒｔ−ブチル基、ｎ−ペンチル基、１−メチル−ｎ−ブチル基、２−メチル−ｎ−ブチル基、３−メチル−ｎ−ブチル基、１，１−ジメチル−ｎ−プロピル基、１，２−ジメチル−ｎ−プロピル基、２，２−ジメチル−ｎ−プロピル基、ｎ−ヘキシル基、シクロヘキシル基などが挙げられる。 Among (b1) in (A2), specific examples of the compound having an aliphatic epoxy structure and having an ethylenic carbon-carbon unsaturated bond include glycidyl (meth) acrylate, β-methylglycidyl (meta ) Acrylate, β-ethylglycidyl (meth) acrylate, glycidyl vinyl ether, and compounds represented by the following formulas described in JP-A-7-248625.

(In formula, R < ¹¹ > -R < ¹³ > is a hydrogen atom or a C1-C10 alkyl group each independently, and m is an integer of 1-5.).
Specific examples of the alkyl group include methyl, ethyl, n-propyl, isopropyl, n-butyl, 1-methyl-n-propyl, 2-methyl-n-propyl, tert-butyl. Group, n-pentyl group, 1-methyl-n-butyl group, 2-methyl-n-butyl group, 3-methyl-n-butyl group, 1,1-dimethyl-n-propyl group, 1,2-dimethyl group -N-propyl group, 2,2-dimethyl-n-propyl group, n-hexyl group, cyclohexyl group and the like can be mentioned.

  Examples of the compound represented by the above formula include o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, α-methyl-o-vinylbenzyl glycidyl ether, α-methyl-m- Vinylbenzyl glycidyl ether, α-methyl-p-vinylbenzyl glycidyl ether, 2,3-diglycidyloxymethylstyrene, 2,4-diglycidyloxymethylstyrene, 2,5-diglycidyloxymethylstyrene, 2,6- Diglycidyloxymethylstyrene, 2,3,4-triglycidyloxymethylstyrene, 2,3,5-triglycidyloxymethylstyrene, 2,3,6-triglycidyloxymethylstyrene, 3,4,5-triglycidyl Oxymethylstyrene, 2 Such as 4,6-triglycidyl oxymethyl styrene.

  Among (b1) in (A2), as the compound having an alicyclic epoxy group and having an ethylenic carbon-carbon unsaturated bond, vinylcyclohexene monooxide 1,2-epoxy-4-vinylcyclohexane (for example, , Celoxide 2000; manufactured by Daicel Chemical Industries, Ltd.), 3,4-epoxycyclohexylmethyl acrylate (for example, Cyclomer A400; manufactured by Daicel Chemical Industries, Ltd.), 3,4-epoxycyclohexylmethyl methacrylate (for example, cyclic) Mer M100; manufactured by Daicel Chemical Industries, Ltd.) or at least one compound selected from the group consisting of a compound represented by formula (I) and a compound represented by formula (II).

[In Formula (I) and Formula (II), R and R ′ each independently represents a C 1-4 alkyl group which may be substituted with a hydrogen atom or a hydroxy group.
X and X 'each independently represent a single _{bond, C 1 to 6} alkylene groups, oxy _{-C 1 to 6} alkylene, thio _{-C 1 to 6} alkylene or imino _{-C 1 to 6} alkylene _{group, C 1 to 6} It represents an imino group - alkylene group - _{oxy, C 1 to 6} alkylene - thio or _{C 1 to 6} alkylene. ]

Examples of the alkyl group are the same as those described above.
Examples of the hydroxyalkyl group include hydroxymethyl group, 1-hydroxyethyl group, 2-hydroxyethyl group, 1-hydroxy-n-propyl group, 2-hydroxy-n-propyl group, 3-hydroxy-n-propyl group, 1 -Hydroxy-isopropyl group, 2-hydroxy-isopropyl group, 1-hydroxy-n-butyl group, 2-hydroxy-n-butyl group, 3-hydroxy-n-butyl group, 4-hydroxy-n-butyl group, etc. Can be mentioned.
As the substituents R and R ′, a hydrogen atom, a methyl group, a hydroxymethyl group, a 1-hydroxyethyl group, and a 2-hydroxyethyl group are preferable, and a hydrogen atom and a methyl group are more preferable.

Examples of the alkylene group include a methylene group, an ethylene group, and a propylene group.
Examples of the oxyalkylene group include an oxymethylene group, an oxyethylene group, and an oxypropylene group.
Examples of the thioalkylene group include a thiomethylene group, a thioethylene group, and a thiopropylene group.
Examples of the iminoalkylene group include an iminomethylene group, an iminoethylene group, and an iminopropylene group.

Examples of the alkyleneoxy group include a methyleneoxy group, an ethyleneoxy group, and a propyleneoxy group.
Examples of the alkylenethio group include a methylenethio group, an ethylenethio group, and a propylenethio group.
Examples of the alkyleneimino group include a methyleneimino group, an ethyleneimino group, and a propyleneimino group.
The substituents X and X ′ are preferably a single bond, a methylene group, an ethylene group, an oxymethylene group and an oxyethylene group, more preferably a single bond and an oxyethylene group.

  Examples of the compound represented by the formula (I) include compounds represented by the formula (I-1) to the formula (I-15). Preferably Formula (I-1), Formula (I-3), Formula (I-5), Formula (I-7), Formula (I-9), Formula (I-11) to Formula (I-15) Is mentioned. More preferably, Formula (I-1), Formula (I-7), Formula (I-9), and Formula (I-15) are mentioned.

  Examples of the compound represented by the formula (II) include compounds represented by the formula (II-1) to the formula (II-15). Preferably Formula (II-1), Formula (II-3), Formula (II-5), Formula (II-7), Formula (II-9), Formula (II-11) to Formula (II-15) Is mentioned. More preferably, Formula (II-1), Formula (II-7), Formula (II-9), and Formula (II-15) are mentioned.

  At least one compound selected from the group consisting of the compound represented by formula (I) and the compound represented by formula (II) can be used alone. They can also be mixed in any ratio. In the case of mixing, the mixing ratio is a molar ratio, preferably 5:95 to 95: 5, more preferably 10:90 to 90:10, particularly preferably 20:80 in the formula (I): formula (II). ~ 80: 20.

  Examples of the compound having an oxetanyl group (b2) and an unsaturated bond in the copolymers (A2-1) and (A2-2) include 3-methyl-3-methacryloxymethyloxetane, 3-methyl -3-acryloxymethyl oxetane, 3-ethyl-3-methacryloxymethyl oxetane, 3-ethyl-3-acryloxymethyl oxetane, 3-methyl-3-methacryloxyethyl oxetane, 3-methyl-3-acryloxyethyl Examples include oxetane, 3-ethyl-3-methacryloxyethyl oxetane, and 3-ethyl-3-acryloxyethyl oxetane.

In the copolymer (A2-1), the ratio of the constituent component derived from each is in the following range in terms of a mole fraction with respect to the total number of moles of the constituent component constituting the copolymer (A2-1). It is preferable.
Structural units derived from (a); 2 to 40 mol%
Structural units derived from (c); 1 to 65 mol%
Structural units derived from (b1) or (b2); 2-95 mol%

Moreover, it is more preferable in the ratio of the said structural component being the following ranges.
Structural units derived from (a); 5-35 mol%
Structural units derived from (c); 1 to 60 mol%
Structural units derived from (b1) or (b2); 5 to 80 mol%
When the composition ratio is in the above range, storage stability, developability, solvent resistance, heat resistance and mechanical strength tend to be good.

  The resin (A2-1) having alkali solubility is disclosed in, for example, the document “Experimental Method for Polymer Synthesis” (Takayuki Otsu Publishing Co., Ltd., Chemical Dojin Co., Ltd. First Edition, First Edition, issued March 1, 1972) ) With reference to the method described in (1) and the cited references described in the document.

  Specifically, a predetermined amount of a compound that leads to the units (a), (c) and (b1) or (b2) constituting the copolymer, a polymerization initiator and a solvent are charged into a reaction vessel, and oxygen is added with nitrogen. By substituting, there may be mentioned a method of stirring, heating and keeping warm in the absence of oxygen.

  Resin (A2-2) can be manufactured through a two-step process, for example. In this case as well, the method described in the above-mentioned document “Experimental Methods for Polymer Synthesis” (Takayuki Otsu Publishing Co., Ltd., Chemical Dojin Co., Ltd., 1st edition, 1st edition, published on March 1, 1972), JP-A-2001-2001 It can be produced with reference to the method described in JP 89533.

First, as a first step, a copolymer (that is, a resin having alkali solubility) is obtained in the same manner as in the method for producing the alkali-soluble resin (A1) described above.
In this case, similar to the above, it can be continuously used in various forms. Moreover, it is suitable to make it the polystyrene equivalent weight average molecular weight and molecular weight distribution [weight average molecular weight (Mw) / number average molecular weight (Mn)] similar to the above.
However, it is preferable that the ratio of the component derived from each of (a) and (c) is in the following range in terms of a mole fraction with respect to the total number of moles of the component constituting the copolymer.
Structural units derived from (a); 5 to 50 mol%
Structural unit derived from (c); 50 to 95 mol%
Moreover, it is more preferable in the ratio of the said structural component being the following ranges.
Structural units derived from (a); 10 to 45 mol%
Structural unit derived from (c); 55 to 90 mol%

Next, as a second step, a part of the carboxylic acid and carboxylic acid anhydride (a) derived from the obtained copolymer is replaced with the epoxy group or oxetanyl group derived from the aforementioned (b1) or (b2). React with.
Specifically, following the above, the atmosphere in the flask is replaced from nitrogen to air, and 5 to 80 mol% of the component (b1) or (b2), a carboxy group with respect to the number of moles of the component (a) As a reaction catalyst for the epoxy group or oxetanyl group, for example, trisdimethylaminomethylphenol is 0.001 to 5% on a mass basis with respect to the total amount of monomers (a) to (c) and a polymerization inhibitor, for example, hydroquinone. 0.001-5% is put into a flask on a mass basis with respect to the total amount of monomers (a) to (c), and the reaction is continued at 60 to 130 ° C. for 1 to 10 hours. Thereby, resin (A2-2) can be obtained. In addition, like the polymerization conditions, the charging method and the reaction temperature can be appropriately adjusted in consideration of the production equipment, the amount of heat generated by the polymerization, and the like.
In this case, the number of moles of (b1) or (b2) is preferably 10 to 75% by mole, more preferably 15 to 70% by mole with respect to the number of moles of (a). By setting it as this range, there exists a tendency for the balance of storage stability, developability, solvent resistance, heat resistance, mechanical strength, and sensitivity to become favorable.

In the resin (A2-3), the ratio of the constituent components derived from each may be in the following range in terms of mole fraction with respect to the total number of moles of the constituent components constituting the alkali-soluble resin (A2-3). preferable.
Structural units derived from (a); 5-95 mol%
Structural units derived from (b1) or (b2); 5-95 mol%
Moreover, it is more preferable in the ratio of the said structural component being the following ranges.
Structural units derived from (a); 10 to 90 mol%
Structural units derived from (b1) or (b2); 10-90 mol%
When the composition ratio is in the above range, storage stability, developability, solvent resistance, heat resistance and mechanical strength tend to be good.

Resin (A2-3) is, for example, a method described in the document “Experimental Method of Polymer Synthesis” (Takayuki Otsu, published by Kagaku Dojin Co., Ltd., First Edition, First Edition, issued March 1, 1972) It can manufacture with reference to the cited reference etc. which were described in the said literature.
Specifically, a predetermined amount of a compound that leads to the units (a) and (b1) or (b2) constituting the copolymer, a polymerization initiator and a solvent are charged into a reaction vessel, and oxygen is substituted with nitrogen. Thus, a polymer can be obtained by stirring, heating and heat-retaining in the absence of oxygen. In addition, the obtained copolymer may use the solution after reaction as it is, may use the concentrated or diluted solution, and took out as solid (powder) by methods, such as reprecipitation. Things may be used.

  The polymerizable compound (B) contained in the photosensitive fat composition of the present invention is not particularly limited as long as it has polymerizability, and examples thereof include a monofunctional monomer, a bifunctional monomer, a trifunctional or higher polyfunctional monomer, and the like. The

Monofunctional monomers include nonylphenyl carbitol (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, 2-ethylhexyl carbitol (meth) acrylate, 2- (2-ethoxyethoxy) ethyl (meth) (Meth) acrylates such as acrylate, caprolactone (meth) acrylate, ethoxylated nonylphenol (meth) acrylate, propoxylated nonylphenol (meth) acrylate;
Styrenes such as styrene, α-, o-, m-, p-methylstyrene, p-methoxystyrene, p-tertbutoxystyrene, chloromethylstyrene;
Dienes such as butadiene, 2,3-dimethylbutadiene, isoprene;

  Methyl (meth) acrylate, ethyl (meth) acrylate, n-propyl (meth) acrylate, i-propyl (meth) acrylate, n-butyl (meth) acrylate, sec-butyl (meth) acrylate, Tert-butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, lauryl (meth) acrylate, dodecyl (meth) acrylate, stearyl (meth) acrylate, dicyclopentanyl (meth) acrylate, ( (Meth) acrylic acid isobornyl, (meth) acrylic acid cyclohexyl, (meth) acrylic acid 2-methylcyclohexyl, (meth) acrylic acid dicyclohexyl, (meth) acrylic acid adamantyl, (meth) acrylic acid allyl, (meth) acrylic acid probagil , Phenyl (meth) acrylate, naphthyl (meth) acrylate, (meth) Anthracenyl acrylate, cyclopentyl (meth) acrylate, furyl (meth) acrylate, tetrahydrofuryl (meth) acrylate, pyranyl (meth) acrylate, benzyl (meth) acrylate, phenethyl (meth) acrylate, (meth) Cresyl acrylate, 1,1,1-trifluoroethyl (meth) acrylate, perfluoroethyl (meth) acrylate, perfluoro-n-propyl (meth) acrylate, perfluoro-i- (meth) acrylate (Meth) acrylic acid alkyl esters such as propyl, triphenylmethyl (meth) acrylate, cumyl (meth) acrylate, cycloalkyl (meth) acrylate or aryl (meth) acrylate;

(Meth) acrylic acid hydroxyalkyl esters such as (meth) acrylic acid 2-hydroxyethyl, (meth) acrylic acid 2-hydroxypropyl;
Vinyl compounds such as (meth) acrylic acid amide, (meth) acrylic acid-anilide, (meth) acrylonitrile, acrolein, vinyl chloride, vinylidene chloride, N-vinylpyrrolidone, vinyl acetate;
Unsaturated dicarboxylic acid diesters such as diethyl maleate, diethyl fumarate, diethyl itaconate;

  Glycidyl (meth) acrylate, α-ethylglycidyl (meth) acrylate, α-n-propylglycidyl (meth) acrylate, α-n-butylglycidyl (meth) acrylate, 3,4-epoxybutyl (meth) acrylate, 3, Examples include glycidyl compounds such as 4-epoxyheptyl (meth) acrylate, α-ethyl-6,7-epoxyheptyl (meth) acrylate, allyl glycidyl ether, and vinyl glycidyl ether.

  Specific examples of the bifunctional monomer include 1,3-butanediol di (meth) acrylate, 1,3-butanediol (meth) acrylate, 1,6-hexanediol di (meth) acrylate, and ethylene glycol di (meth). Acrylate, diethylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, triethylene glycol di (meth) acrylate, tetraethylene glycol di (meth) acrylate, polyethylene glycol diacrylate, bisphenol A bis (acryloyloxyethyl) ) Ether, ethoxylated bisphenol A di (meth) acrylate, propoxylated neopentyl glycol di (meth) acrylate, ethoxylated neopentyl glycol di (meth) acrylate, 3-methyl Ntanjioruji (meth) acrylate.

  The trifunctional or higher polyfunctional monomers include trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, tris (2-hydroxyethyl) isocyanurate tri (meth) acrylate, ethoxylated trimethylolpropane tri (meth) ) Acrylate, propoxylated trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, tripentaerythritol tetra (meth) acrylate, tri Pentaerythritol penta (meth) acrylate, tripentaerythritol hexa (meth) acrylate, tripentaerythritol hepta (meth) acrylate Rate, tripentaerythritol octa (meth) acrylate, reaction product of pentaerythritol tri (meth) acrylate and acid anhydride, reaction product of dipentaerythritol penta (meth) acrylate and acid anhydride, tripentaerythritol hepta (meta ) Acrylate and acid anhydride caprolactone modified trimethylolpropane tri (meth) acrylate, caprolactone modified pentaerythritol tri (meth) acrylate, caprolactone modified tris (2-hydroxyethyl) isocyanurate tri (meth) acrylate, caprolactone modified pentaerythritol tetra ( (Meth) acrylate, caprolactone-modified dipentaerythritol penta (meth) acrylate, caprolactone-modified dipentaerythritol hexa (meth) Chryrate, caprolactone-modified tripentaerythritol tetra (meth) acrylate, caprolactone-modified tripentaerythritol penta (meth) acrylate, caprolactone-modified tripentaerythritol hexa (meth) acrylate, caprolactone-modified tripentaerythritol hepta (meth) acrylate, caprolactone-modified tripenta Erythritol octa (meth) acrylate, caprolactone-modified pentaerythritol tri (meth) acrylate and acid anhydride reaction product, caprolactone-modified dipentaerythritol penta (meth) acrylate and acid anhydride reaction product, caprolactone-modified tripentaerythritol hepta (Meth) acrylate, acid anhydride, etc. are mentioned. Among these, a bifunctional or higher functional monomer is preferably used.

  Content of a polymeric compound (B) is a mass fraction with respect to the total amount of resin (A) and polymeric compound (B), Preferably it is 1-70 mass%, More preferably, it is 5-60 mass%. is there. When the content of the polymerizable compound (B) is in the above range, the sensitivity, the strength and smoothness of the coating film and the pattern, the reliability, and the mechanical strength tend to be good, which is preferable.

The polymerization initiator (C) contained in the photosensitive resin composition of the present invention is not particularly limited as long as it is a compound that initiates polymerization by the action of light or heat, and a known polymerization initiator may be used. it can.
As the polymerization initiator (C), for example, biimidazole compounds, acetophenone compounds, triazine compounds, acylphosphine oxide compounds, and oxime compounds are preferable. Moreover, you may use the light and / or thermal cationic polymerization initiator (For example, what is comprised from the onium cation and the anion derived from a Lewis acid) described in Unexamined-Japanese-Patent No. 2008-181087. Of these, biimidazole compounds are more preferred because of their excellent sensitivity.

  Examples of the biimidazole compound include 2,2′-bis (2-chlorophenyl) -4,4 ′, 5,5′-tetraphenylbiimidazole and 2,2′-bis (2,3-dichlorophenyl) -4. , 4 ′, 5,5′-tetraphenylbiimidazole (see, for example, JP-A-6-75372 and JP-A-6-75373), 2,2′-bis (2-chlorophenyl) -4, 4 ′, 5,5′-tetraphenylbiimidazole, 2,2′-bis (2-chlorophenyl) -4,4 ′, 5,5′-tetra (alkoxyphenyl) biimidazole, 2,2′-bis ( 2-chlorophenyl) -4,4 ′, 5,5′-tetra (dialkoxyphenyl) biimidazole, 2,2′-bis (2-chlorophenyl) -4,4 ′, 5,5′-tetra (trialkoxy) Phenyl) biimidazole (for example, see JP-B-48-38403, JP-A-62-174204, etc.), and the phenyl group at the 4,4′5,5′-position is substituted with a carboalkoxy group. Examples thereof include imidazole compounds (for example, see JP-A-7-10913). Preferably, 2,2′-bis (2-chlorophenyl) -4,4 ′, 5,5′-tetraphenylbiimidazole, 2,2′-bis (2,3-dichlorophenyl) -4,4 ′, 5 Examples include 5'-tetraphenylbiimidazole and 2,2'-bis (2,4-dichlorophenyl) -4,4 ', 5,5'-tetraphenylbiimidazole.

  Examples of the acetophenone compound include diethoxyacetophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, benzyldimethyl ketal, 2-hydroxy-1- [4- (2-hydroxyethoxy) phenyl]. 2-methylpropan-1-one, 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] -phenyl} -2-methyl-propan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butane-1- ON, 2- (2-methylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl) -buta 2- (3-methylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (4-methylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl)- Butanone, 2- (2-ethylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (2-propylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl)- Butanone, 2- (2-butylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (2,3-dimethylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl) ) -Butanone, 2- (2,4-dimethylbenzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (2-chloro) Ndyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (2-bromobenzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (3-chloro Benzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (4-chlorobenzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (3-bromo Benzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (4-bromobenzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (2-methoxy) Benzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (3-methoxybenzyl) -2-dimethylamino-1 -(4-morpholinophenyl) -butanone, 2- (4-methoxybenzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (2-methyl-4-methoxybenzyl) -2- Dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (2-methyl-4-bromobenzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2- (2-bromo- 4-Methoxybenzyl) -2-dimethylamino-1- (4-morpholinophenyl) -butanone, 2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propan-1-one oligomer Etc.

  Examples of the triazine compound include 2,4-bis (trichloromethyl) -6- (4-methoxyphenyl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- (4- Methoxynaphthyl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6-piperonyl-1,3,5-triazine, 2,4-bis (trichloromethyl) -6- (4-methoxy Styryl) -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- [2- (5-methylfuran-2-yl) ethenyl] -1,3,5-triazine, 2,4 -Bis (trichloromethyl) -6- [2- (furan-2-yl) ethenyl] -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- [2- (4-diethylamino- 2-methylphenyl) Thenyl] -1,3,5-triazine, 2,4-bis (trichloromethyl) -6- [2- (3,4-dimethoxyphenyl) ethenyl] -1,3,5-triazine.

  Examples of the acylphosphine oxide initiator include 2,4,6-trimethylbenzoyldiphenylphosphine oxide.

  Examples of the oxime compound include O-ethoxycarbonyl-α-oximino-1-phenylpropan-1-one, a compound represented by the formula (III), a compound represented by the formula (IV), and the like.

  In addition, it is preferable to use a polymerization initiation assistant (C-1) together with the polymerization initiator (C) described above. Examples of the polymerization initiation assistant (C-1) include compounds represented by the formula (V).

［式（Ｖ）中、Ｘで示される点線はハロゲン原子で置換されていてもよい炭素数６〜１２の芳香環を表す。
Ｙは、酸素原子、硫黄原子を表す。
Ｒ^１は、炭素数１〜６のアルキル基を表す。
Ｒ^２は、ハロゲン原子で置換されていてもよい炭素数１〜１２のアルキル基またはハロゲン原子で置換されていてもよいアリール基を表す。］

[In the formula (V), a dotted line represented by X represents an aromatic ring having 6 to 12 carbon atoms which may be substituted with a halogen atom.
Y represents an oxygen atom or a sulfur atom.
R ¹ represents an alkyl group having 1 to 6 carbon atoms.
R ² represents an alkyl group having 1 to 12 carbon atoms which may be substituted with a halogen atom or an aryl group which may be substituted with a halogen atom. ]

Examples of the halogen atom include a fluorine atom, a chlorine atom, and a bromine atom.
Examples of the aromatic ring having 6 to 12 carbon atoms include a benzene ring and a naphthalene ring.

  Examples of the aromatic ring having 6 to 12 carbon atoms which may be substituted with a halogen atom include a benzene ring, a methylbenzene ring, a dimethylbenzene ring, an ethylbenzene ring, a propylbenzene ring, a butylbenzene ring, a pentylbenzene ring, a hexylbenzene ring, Examples include cyclohexylbenzene ring, chlorobenzene ring, dichlorobenzene ring, bromobenzene ring, dibromobenzene ring, phenylbenzene ring, chlorophenylbenzene ring, bromophenylbenzene ring, naphthalene ring, chloronaphthalene ring, bromonaphthalene ring, and the like.

Examples of the alkyl group are the same as those described above.
Examples of the alkyl group having 1 to 12 carbon atoms which may be substituted with a halogen atom include a methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, 1-methyl-n-propyl group, 2- Methyl-n-propyl group, tert-butyl group, n-pentyl group, 1-methyl-n-butyl group, 2-methyl-n-butyl group, 3-methyl-n-butyl group, 1,1-dimethyl- n-propyl group, 1,2-dimethyl-n-propyl group, 2,2-dimethyl-n-propyl group, n-hexyl group, cyclohexyl group, 1-chloro-n-butyl group, 2-chloro-n- A butyl group, 3-chloro-n-butyl group, etc. are mentioned.

The aryl group which may be substituted with a halogen atom includes a phenyl group, a chlorophenyl group, a dichlorophenyl group, a bromophenyl group, a dibromophenyl group, a chlorobromophenyl group, a biphenyl group, a chlorobiphenyl group, a dichlorobiphenyl group, and a bromophenyl group. , Dibromophenyl group, naphthyl group, chloronaphthyl group, dichloronaphthyl group, bromonaphthyl group, dibromonaphthyl group and the like.
In the present specification, any chemical structural formula varies depending on the number of carbon atoms, but the above examples are applied to each substituent unless otherwise specified. Moreover, the thing which can take both a linear or branched includes both.

As the compound represented by the formula (V), specifically,
2-benzoylmethylene-3-methyl-naphtho [2,1-d] thiazoline,
2-benzoylmethylene-3-methyl-naphtho [1,2-d] thiazoline,
2-benzoylmethylene-3-methyl-naphtho [2,3-d] thiazoline,
2- (2-naphthoylmethylene) -3-methylbenzothiazoline,
2- (1-naphthoylmethylene) -3-methylbenzothiazoline,
2- (2-naphthoylmethylene) -3-methyl-5-phenylbenzothiazoline,
2- (1-naphthoylmethylene) -3-methyl-5-phenylbenzothiazoline,
2- (2-naphthoylmethylene) -3-methyl-5-fluorobenzothiazoline,
2- (1-naphthoylmethylene) -3-methyl-5-fluorobenzothiazoline,
2- (2-naphthoylmethylene) -3-methyl-5-chlorobenzothiazoline,
2- (1-naphthoylmethylene) -3-methyl-5-chlorobenzothiazoline,
2- (2-naphthoylmethylene) -3-methyl-5-bromobenzothiazoline,
2- (1-naphthoylmethylene) -3-methyl-5-bromobenzothiazoline,
2- (4-biphenoylmethylene) -3-methylbenzothiazoline,
2- (4-biphenoylmethylene) -3-methyl-5-phenylbenzothiazoline,
2- (2-naphthoylmethylene) -3-methyl-naphtho [2,1-d] thiazoline,
2- (2-naphthoylmethylene) -3-methyl-naphtho [1,2-d] thiazoline,
2- (4-biphenoylmethylene) -3-methyl-naphtho [2,1-d] thiazoline,
2- (4-biphenoylmethylene) -3-methyl-naphtho [1,2-d] thiazoline,
2- (p-fluorobenzoylmethylene) -3-methyl-naphtho [2,1-d] thiazoline,
2- (p-fluorobenzoylmethylene) -3-methyl-naphtho [1,2-d] thiazoline,
2-benzoylmethylene-3-methyl-naphtho [2,1-d] oxazoline,
2-benzoylmethylene-3-methyl-naphtho [1,2-d] oxazoline,
2-benzoylmethylene-3-methyl-naphtho [2,3-d] oxazoline,
2- (2-naphthoylmethylene) -3-methylbenzoxazoline,
2- (1-naphthoylmethylene) -3-methylbenzoxazoline,
2- (2-naphthoylmethylene) -3-methyl-5-phenylbenzoxazoline,
2- (1-naphthoylmethylene) -3-methyl-5-phenylbenzoxazoline,
2- (2-naphthoylmethylene) -3-methyl-5-fluorobenzoxazoline,
2- (1-naphthoylmethylene) -3-methyl-5-fluorobenzoxazoline,
2- (2-naphthoylmethylene) -3-methyl-5-chlorobenzoxazoline,
2- (1-naphthoylmethylene) -3-methyl-5-chlorobenzoxazoline,
2- (2-naphthoylmethylene) -3-methyl-5-bromobenzoxazoline,
2- (1-naphthoylmethylene) -3-methyl-5-bromobenzoxazoline,
2- (4-biphenoylmethylene) -3-methylbenzoxazoline,
2- (4-biphenoylmethylene) -3-methyl-5-phenylbenzoxazoline,
2- (2-naphthoylmethylene) -3-methyl-naphtho [2,1-d] oxazoline,
2- (2-naphthoylmethylene) -3-methyl-naphtho [1,2-d] oxazoline,
2- (4-biphenoylmethylene) -3-methyl-naphtho [2,1-d] oxazoline,
2- (4-biphenoylmethylene) -3-methyl-naphtho [1,2-d] oxazoline,
2- (p-fluorobenzoylmethylene) -3-methyl-naphtho [2,1-d] oxazoline,
2- (p-fluorobenzoylmethylene) -3-methyl-naphtho [1,2-d] oxazoline and the like.

  Among these, 2- (2-naphthoylmethylene) -3-methylbenzothiazoline represented by the formula (V-1), 2-benzoylmethylene-3-methyl-naphtho represented by the formula (V-2) [ 1,2-d] thiazoline and 2- (4-biphenoylmethylene) -3-methyl-naphtho [1,2-d] thiazoline represented by the formula (V-3).

  By using these compounds, the resulting photosensitive resin composition has high sensitivity. Therefore, since the productivity of a coating film or a pattern improves by forming a coating film or a pattern using this, it is preferable. The compound represented by the formula (V) is preferable because it does not sublime due to the heat at the time of post-baking of the coating film, and discolors due to the action of at least one of light and heat to improve transparency.

  Further, as the polymerization initiation aid (C-1), a compound represented by at least one selected from the group consisting of formula (VI) and formula (VII) may be used.

[In Formula (VI) and Formula (VII), Ring X ¹ and Ring X ² each independently represent an aromatic or heterocyclic ring having 6 to 12 carbon atoms which may be substituted with a halogen atom. Y ¹ and Y ² represent an oxygen atom or a sulfur atom. R ³ and R ⁴ represent an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms. These alkyl groups and aryl groups may be substituted with a halogen atom, a hydroxy group, or an alkoxy group having 1 to 6 carbon atoms.

  The aromatic ring or heterocyclic ring optionally substituted with a halogen atom includes a benzene ring, a methylbenzene ring, a dimethylbenzene ring, an ethylbenzene ring, a propylbenzene ring, a butylbenzene ring, a pentylbenzene ring, a hexylbenzene ring, and a cyclohexylbenzene ring. , Chlorobenzene ring, dichlorobenzene ring, bromobenzene ring, dibromobenzene ring, phenylbenzene ring, chlorophenylbenzene ring, bromophenylbenzene ring, naphthalene ring, chloronaphthalene ring, bromonaphthalene ring, phenanthrene ring, chrysene ring, fluoranthene ring, benzo [A] pyrene ring, benzo [e] pyrene ring, perylene ring and derivatives thereof.

Examples of the hydroxy group-substituted alkyl group include a hydroxymethyl group, a hydroxyethyl group, a hydroxypropyl group, and a hydroxybutyl group.
Examples of the hydroxy group-substituted aryl group include a hydroxyphenyl group and a hydroxynaphthyl group.
Examples of the alkoxy-substituted alkyl group include a methoxymethyl group, a methoxyethyl group, a methoxypropyl group, a methoxybutyl group, a butoxymethyl group, an ethoxyethyl group, an ethoxypropyl group, and a propoxybutyl group.
Examples of the alkoxy-substituted aryl group include a methoxyphenyl group and an ethoxynaphthyl group.

Specifically, the compounds represented by formula (VI) and formula (VII) are:
Dialkoxynaphthalenes such as dimethoxynaphthalene, diethoxynaphthalene, dipropoxynaphthalene, diisopropoxynaphthalene, dibutoxynaphthalene,
Dimethoxyanthracene, diethoxyanthracene, dipropoxyanthracene, diisopropoxyanthracene, dibutoxyanthracene, dipentaoxyanthracene, dihexaoxyanthracene, methoxyethoxyanthracene, methoxypropoxyanthracene, methoxyisopropoxyanthracene, methoxybutoxyanthracene, ethoxypropoxyanthracene Dialkoxyanthracenes such as ethoxyisopropoxyanthracene, ethoxybutoxyanthracene, propoxyisopropoxyanthracene, propoxybutoxyanthracene, isopropoxybutoxyanthracene,
Examples thereof include dialkoxynaphthacenes such as dimethoxynaphthacene, diethoxynaphthacene, dipropoxynaphthacene, diisopropoxynaphthacene, dibutoxynaphthacene and the like.

Moreover, you may use a photoinitiator as a polymerization initiator (C) mentioned above.
Examples of the photopolymerization initiator include benzoin compounds, benzophenone compounds, thioxanthone compounds, anthracene compounds, and the like.
Examples of the benzoin compound include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, and benzoin isobutyl ether.

  Examples of the benzophenone compounds include benzophenone, methyl o-benzoylbenzoate, 4-phenylbenzophenone, 4-benzoyl-4′-methyldiphenyl sulfide, 3,3 ′, 4,4′-tetra (tert-butyl). Peroxycarbonyl) benzophenone, 2,4,6-trimethylbenzophenone, and the like.

  Examples of the thioxanthone compound include 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-dichlorothioxanthone, 1-chloro-4-propoxythioxanthone, and the like.

  Examples of the anthracene compound include 9,10-dimethoxyanthracene, 2-ethyl-9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 2-ethyl-9,10-diethoxyanthracene and the like. It is done.

  Furthermore, 10-butyl-2-chloroacridone, 2-ethylanthraquinone, benzyl, 9,10-phenanthrenequinone, camphorquinone, methyl phenylglyoxylate, titanocene compound, etc. may be used as a photopolymerization initiator. .

Moreover, you may use the photoinitiator described in the Japanese translations of PCT publication No. 2002-544205 gazette as a photoinitiator which has the group which can raise | generate chain transfer.
As a photoinitiator which has the group which can raise | generate the said chain transfer, the photoinitiator of following formula (1)-(6) is mentioned, for example.

  The photopolymerization initiator having a group capable of causing chain transfer can also be used as a component constituting the resin (A).

In addition, it is preferable to use a polymerization initiation assistant (C-2) together with the polymerization initiator described above.
Examples of the polymerization initiation assistant (C-2) include amine compounds and carboxylic acid compounds.
Examples of amine compounds include aliphatic amine compounds such as triethanolamine, methyldiethanolamine, triisopropanolamine, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, isoamyl 4-dimethylaminobenzoate, 4-dimethylamino. Of 2-ethylhexyl benzoate, 2-dimethylaminoethyl benzoate, N, N-dimethylparatoluidine, 4,4′-bis (dimethylamino) benzophenone (common name; Michler's ketone), 4,4′-bis (diethylamino) benzophenone Such aromatic amine compounds are mentioned.

  Examples of carboxylic acid compounds include phenylthioacetic acid, methylphenylthioacetic acid, ethylphenylthioacetic acid, methylethylphenylthioacetic acid, dimethylphenylthioacetic acid, methoxyphenylthioacetic acid, dimethoxyphenylthioacetic acid, chlorophenylthioacetic acid, dichlorophenylthioacetic acid, N- Aromatic heteroacetic acids such as phenylglycine, phenoxyacetic acid, naphthylthioacetic acid, N-naphthylglycine, naphthoxyacetic acid and the like can be mentioned.

Content of a polymerization initiator (C) is a mass fraction with respect to the total amount of resin (A) and polymeric compound (B), Preferably it is 0.1-40 mass%, More preferably, it is 1-30 mass. %.
When the total amount of the polymerization initiator (C) is within this range, the photosensitive resin composition becomes highly sensitive, the strength of the coating film or pattern formed using this photosensitive resin composition, The smoothness on the surface tends to be good, which is preferable.

The amount of the polymerization initiation aid (C-1) and / or (C-2) used is a mass fraction with respect to the total amount of the resin (A) and the polymerizable compound (B), preferably 0.01. It is -50 mass%, More preferably, it is 0.1-40 mass%.
When the amount of the polymerization initiation assistant (C-1) and / or (C-2) is within this range, the sensitivity of the resulting photosensitive resin composition is further increased, and the photosensitive resin composition is formed using this photosensitive resin composition. This is preferable because the productivity of the patterned substrate tends to be improved.

  In particular, when the compound represented by the formula (V) is used, the content thereof is 50% by mass to 100% by mass, and further 60% by mass with respect to the content of the polymerization initiation assistant (C-1). It is preferable to set it to -100 mass%, especially 65 mass%-100 mass%. When the content of the compound represented by the formula (V) is in this range, when the coating film is formed using the photosensitive resin composition containing the compound, the transparency of the coating film becomes favorable.

  Moreover, the photosensitive resin composition of this invention may contain the polyfunctional thiol compound (T) further. This polyfunctional thiol compound (T) is a compound having two or more sulfanyl groups in the molecule. Especially, when using the compound which has two or more sulfanyl groups couple | bonded with the carbon atom of two or more aliphatic hydrocarbon groups, since the sensitivity of the photosensitive resin composition of this invention becomes high, it is preferable.

Specific examples of the polyfunctional thiol compound (T) include hexanedithiol, decanedithiol, 1,4-dimethylmercaptobenzene, butanediol bisthiopropionate, butanediol bisthioglycolate, and ethylene glycol bisthioglycolate. , Trimethylolpropane tristhioglycolate, butanediol bisthiopropionate, trimethylolpropane tristhiopropionate, trimethylolpropane tristhioglycolate, pentaerythritol tetrakisthiopropionate, pentaerythritol tetrakisthioglycolate, tris Hydroxyethyl tristhiopropionate, pentaerythritol tetrakis (3-mercaptobutyrate), 1,4-bis (3-mercaptobutyryloxy) bu Emissions, and the like.
Content of a polyfunctional thiol compound (T) is a mass fraction with respect to a polymerization initiator (C), Preferably it is 0.5-100 mass%, More preferably, it is 1-90 mass%. Moreover, content of a polyfunctional thiol compound is a mass fraction with respect to the total amount of binder resin (A) and a photopolymerizable compound (C), Preferably it is 0.1-20 mass%, More preferably, it is 1-. 10% by mass. When the content of the polyfunctional thiol compound (T) is within this range, the sensitivity becomes high and the developability tends to be good, which is preferable.

  The solvent (D) used in the photosensitive resin composition of the present invention uniformly dissolves components such as the resin (A), the polymerizable compound (B), and the polymerization initiator (C), and reacts with each component. It is suitable not to. Moreover, it is suitable that the solvent (D) is a solvent containing at least a specific dialkylene glycol dialkyl ether and a specific alcohol. The dialkylene glycol dialkyl ether and the alcohol may be used alone or in combination of two or more.

The dialkylene glycol dialkyl ether is a solvent containing two or more alkylene groups having 1 to 3 carbon atoms and two or more alkyl groups having 1 to 4 carbon atoms, and the alkylene group and the alkyl group may be the same or different. .
Examples of such dialkylene glycol dialkyl ethers include diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol diethyl ether, diethylene glycol di-n-propyl ether, diethylene glycol isopropyl methyl ether, diethylene glycol butyl methyl ether, diethylene glycol dibutyl ether, dipropylene glycol. Dimethyl ether, Dipropylene glycol ethyl methyl ether, Dipropylene glycol diethyl ether, Dipropylene glycol methyl propyl ether, Dipropylene glycol butyl methyl ether, Dipropylene glycol ethyl propyl ether, Dipropylene glycol butyl ethyl ether, Di B propylene glycol butyl propyl ether, dipropylene glycol dibutyl ether, and the like. Of these, diethylene glycol ethyl methyl ether is preferable.

  The dialkylene glycol dialkyl ether is preferably contained in an amount of 30 to 90% by mass, more preferably 30 to 80% by mass, and particularly preferably 30 to 70% by mass with respect to the total amount of the solvent (D). By setting it as this range, the drying nonuniformity of a coating film can be suppressed. That is, when the coating film is dried, the solvent is usually dried by drying under reduced pressure, but since the drying time tends to be shortened, the pressure is reduced in a short time. At this time, the solvent bumps and causes uneven drying. By using dialkylene glycol dialkyl ether in this range, it is possible to effectively prevent uneven coating.

As the alcohol, an alcohol having 1 to 6 carbon atoms is suitable. The alcohol may be a monoalcohol or a dihydric or higher polyhydric alcohol.
Such alcohols include methanol, ethanol, propanol, butanol, pentanol, hexanol, cyclohexanol, propylene glycol methyl ether, propylene glycol ethyl ether, propylene glycol propyl ether, ethylene glycol, ethylene glycol monomethyl ether, ethylene glycol monoethyl. Ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, methyl lactate, ethyl lactate, propyl lactate, methyl methyl lactate, diacetone alcohol, 3-methoxybutanol, glycerin, ethyl 2-hydroxypropionate, 2-hydroxy- Methyl 2-methylpropionate, ethyl 2-hydroxy-2-methylpropionate, 3-hydroxy Examples include methyl cypropionate, ethyl 3-hydroxypropionate, propyl 3-hydroxypropionate, methyl hydroxyacetate, ethyl hydroxyacetate, and butyl hydroxyacetate. Of these, 3-methoxybutanol is preferable.

The alcohol is preferably contained in an amount of 10 to 50% by mass, further 10 to 45% by mass, especially 15 to 40% by mass, based on the total amount of the solvent (D).
By containing the alcohol within this range, the solubility of the resin and the like can be sufficiently obtained, and the uniformity of the obtained coating film can be achieved by adjusting to an appropriate viscosity. In addition, when applying the photosensitive resin composition using a slit die coater, it is possible to prevent the nozzle tip from being dried, to suppress the deposition of foreign matter due to the dried product, and to ensure that vertical streaks due to the foreign matter are generated. Can be prevented.

Moreover, you may use the following solvents together as needed.
For example, ethylene glycol alkyl ether acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, ethylene glycol monobutyl ether acetate, ethylene glycol monoethyl ether acetate;
Alkylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, methoxybutyl acetate, methoxypentyl acetate;

Propylene glycol monoalkyl ethers having 7 or more carbon atoms such as propylene glycol monobutyl ether;
Propylene glycol dialkyl ethers such as propylene glycol dimethyl ether, propylene glycol diethyl ether, propylene glycol ethyl methyl ether, propylene glycol dipropyl ether, propylene glycol propyl methyl ether, propylene glycol ethyl propyl ether, propylene glycol methyl ether propionate, propylene glycol ethyl ether Propylene glycol alkyl ether propionates such as propionate, propylene glycol propyl ether propionate, propylene glycol butyl ether propionate;

Butanediol monoalkyl ethers having 7 or more carbon atoms such as propoxybutanol and butoxybutanol;
Butanediol monoalkyl ether acetates such as methoxybutyl acetate, ethoxybutyl acetate, propoxybutyl acetate, butoxybutyl acetate;
Butanediol monoalkyl ether propionates such as methoxybutyl propionate, ethoxybutyl propionate, propoxybutyl propionate, butoxybutyl propionate;

Aromatic hydrocarbons such as benzene, toluene, xylene, mesitylene;
Ketones such as methyl ethyl ketone, acetone, methyl amyl ketone, methyl isobutyl ketone, cyclohexanone;

Methyl acetate, ethyl acetate, propyl acetate, butyl acetate, methyl methoxyacetate, ethyl methoxyacetate, propyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, propyl ethoxyacetate, butyl ethoxyacetate, methyl propoxyacetate, propoxyacetic acid Ethyl, propyl propoxyacetate, butyl propoxyacetate, methyl butoxyacetate, ethyl butoxyacetate, propyl butoxyacetate, butyl butoxyacetate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, 2-methoxy Butyl propionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, propyl 2-ethoxypropionate, butyl 2-ethoxypropionate, 2-butoxypropio Acid methyl, ethyl 2-butoxypropionate, propyl 2-butoxypropionate, butyl 2-butoxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, propyl 3-methoxypropionate, 3-methoxypropionic acid Butyl, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, propyl 3-ethoxypropionate, butyl 3-ethoxypropionate, methyl 3-propoxypropionate, ethyl 3-propoxypropionate, propyl 3-propoxypropionate Esters such as butyl 3-propoxypropionate, methyl 3-butoxypropionate, ethyl 3-butoxypropionate, propyl 3-butoxypropionate, butyl 3-butoxypropionate;
Hydroxy group-containing esters having 7 or more carbon atoms such as butyl lactate, butyl 3-hydroxypropionate, methyl 2-hydroxy-3-methylbutanoate;
Cyclic ethers such as tetrahydrofuran and pyran;
and cyclic esters such as γ-butyrolactone.

Among the above solvents, an organic solvent having a boiling point of 100 ° C. to 200 ° C. is preferable from the viewpoints of coating properties and drying properties. Among these, esters such as alkylene glycol alkyl ether acetates, ketones, butanediol alkyl ether acetates, butanediol monoalkyl ethers having 7 or more carbon atoms, ethyl 3-ethoxypropionate, methyl 3-methoxypropionate, etc. More preferred are propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, cyclohexanone, methoxybutyl acetate, ethyl 3-ethoxypropionate, and methyl 3-methoxypropionate.
However, it is preferable to use only the above-mentioned dialkylene glycol dialkyl ether and alcohol.

  60-90 mass% is suitable for content of the solvent (D) in the photosensitive resin composition of this invention with a mass fraction with respect to the photosensitive resin composition, and 65-85 mass% is preferable. When the content of the solvent (D) is within this range, various types such as a spin coater, a slit & spin coater, a slit coater (sometimes called a die coater or a curtain flow coater), an ink jet, a roll coater, a dip coater, etc. In this coating apparatus, good coating properties can be expected.

The photosensitive resin composition of the present invention does not substantially contain colorants such as pigments and dyes. That is, in the photosensitive resin composition of the present invention, the content of the colorant with respect to the whole composition is, for example, a mass fraction of less than 1% by mass, preferably less than 0.5% by mass.
For example, the photosensitive resin composition of the present invention does not substantially contain the following colorant used in the art.
Compounds classified as Pigments in the Color Index (published by The Society of Dyers and Colorists), specifically
C. I. Pigment Yellow 1, 3, 12, 13, 14, 15, 16, 17, 20, 24, 31, 53, 83, 86, 93, 94, 109, 110, 117, 125, 128, 137, 138, 139, Yellow pigments such as 147, 148, 150, 153, 154, 166, 173, 194, 214;
C. I. Orange pigments such as CI Pigment Orange 13, 31, 36, 38, 40, 42, 43, 51, 55, 59, 61, 64, 65, 71, 73;
C. I. Red pigments such as CI Pigment Red 9, 97, 105, 122, 123, 144, 149, 166, 168, 176, 177, 180, 192, 209, 215, 216, 224, 242, 254, 255, 264, 265;
C. I. Blue pigments such as CI Pigment Blue 15, 15: 3, 15: 4, 15: 6, 60; I. Violet color pigments such as CI Pigment Violet 1, 19, 23, 29, 32, 36, 38;
C. I. Green pigments such as CI Pigment Green 7 and 36;
C. I. Brown pigments such as CI Pigment Brown 23 and 25;
C. I. Black pigments such as CI Pigment Black 1 and 7.

  In the photosensitive resin composition of the present invention, a filler, other polymer compound, a pigment dispersant, an adhesion promoter, an antioxidant, an ultraviolet absorber, a light stabilizer, a chain transfer agent and the like are included as necessary. Various additives may be used in combination.

Examples of the filler include glass, silica, and alumina.
Examples of other polymer compounds include thermoplastic resins such as curable resins such as epoxy resins and maleimide resins, polyvinyl alcohol, polyacrylic acid, polyethylene glycol monoalkyl ether, polyfluoroalkyl acrylate, polyester, and polyurethane. .

  The surfactant may be any of silicone-based, fluorine-based, ester-based, cationic-based, anionic-based, nonionic-based, and amphoteric surfactants. Specific examples include polyoxyethylene alkyl ethers, polyoxyethylene alkyl phenyl ethers, polyethylene glycol diesters, sorbitan fatty acid esters, fatty acid-modified polyesters, tertiary amine-modified polyurethanes, and polyethyleneimines. These surfactants can be used. For example, KP (manufactured by Shin-Etsu Chemical Co., Ltd.), Polyflow (manufactured by Kyoei Chemical Co., Ltd.), F-top (Mitsubishi Materials Electronics Chemical Co., Ltd.), MegaFac (manufactured by DIC Corporation), Florard ( Sumitomo 3M Co., Ltd.), Surflon (manufactured by AGC Seimi Chemical Co., Ltd.), Solsperse (manufactured by Geneca Co., Ltd.), EFKA (manufactured by CIBA Co., Ltd.), Ajisper PB821 (manufactured by Ajinomoto Co., Inc.) and the like.

  Examples of the adhesion promoter include vinyltrimethoxysilane, vinyltriethoxysilane, vinyltris (2-methoxyethoxy) silane, N- (2-aminoethyl) -3-aminopropylmethyldimethoxysilane, and N- (2-amino). Ethyl) -3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 2- (3,4-epoxycyclohexyl) ethyl Examples include trimethoxysilane, 3-chloropropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, and 3-mercaptopropyltrimethoxysilane.

  Examples of the antioxidant include 2-tert-butyl-6- (3-tert-butyl-2-hydroxy-5-methylbenzyl) -4-methylphenyl acrylate, 2- [1- (2-hydroxy-3). , 5-Di-tert-pentylphenyl) ethyl] -4,6-di-tert-pentylphenyl acrylate, 6- [3- (3-tert-butyl-4-hydroxy-5-methylphenyl) propoxy] -2 , 4,8,10-tetra-tert-butyldibenz [d, f] [1,3,2] dioxaphosphine, 3,9-bis [2- {3- (3-tert-butyl-4- Hydroxy-5-methylphenyl) propionyloxy} -1,1-dimethylethyl] -2,4,8,10-tetraoxaspiro [5.5] undecane, 2,2′-methyle Bis (6-tert-butyl-4-methylphenol), 4,4′-butylidenebis (6-tert-butyl-3-methylphenol), 4,4′-thiobis (2-tert-butyl-5-methylphenol) ), 2,2′-thiobis (6-tert-butyl-4-methylphenol), dilauryl 3,3′-thiodipropionate, dimyristyl 3,3′-thiodipropionate, distearyl 3,3′- Thiodipropionate, pentaerythrityltetrakis (3-laurylthiopropionate), 1,3,5-tris (3,5-di-tert-butyl-4-hydroxybenzyl) -1,3,5-triazine -2,4,6 (1H, 3H, 5H) -trione, 3,3 ', 3 ", 5,5', 5" -hexa-tert-butyl-a, a ', a " (Mesitylene-2,4,6-triyl) tri-p-cresol, pentaerythritol tetrakis [3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate], 2,6-di-tert- And butyl-4-methylphenol.

  Examples of the ultraviolet absorber include 2- (2-hydroxy-5-tert-butylphenyl) -2H-benzotriazole, octyl-3- [3-tert-butyl-4-hydroxy-5- (5-chloro- 2H-benzotriazol-2-yl) phenyl] propionate, 2- [4-[(2-hydroxy-3-dodecyloxypropyl) oxy] -2-hydroxyphenyl] -4,6-bis (2,4-dimethyl) Phenyl) -1,3,5-triazine, 2- [4-[(2-hydroxy-3- (2′-ethyl) hexyl) oxy] -2-hydroxyphenyl] -4,6-bis (2,4 -Dimethylphenyl) -1,3,5-triazine, 2,4-bis (2-hydroxy-4-butyloxyphenyl) -6- (2,4-bis-butyloxyphenyl) 1,3,5-triazine, 2- (2-hydroxy-4- [1-octyloxycarbonylethoxy] phenyl) -4,6-bis (4-phenylphenyl) -1,3,5-triazine, 2- (2H-benzotriazol-2-yl) -4,6-bis (1-methyl-1-phenylethyl) phenol, 2- (2H-benzotriazol-2-yl) -6- (1-methyl-1- Phenylethyl) -4- (1,1,3,3-tetramethylbutyl) phenol, 2- (3-tert-butyl-2-hydroxy-5-methylphenyl) -5-chlorobenzotriazole, alkoxybenzophenone, etc. Can be mentioned.

  Examples of the light stabilizer include a polymer composed of succinic acid and (4-hydroxy-2,2,6,6-tetramethylpiperidin-1-yl) ethanol, N, N ′, N ″, N ″. '-Tetrakis (4,6-bis (butyl- (N-methyl-2,2,6,6-tetramethylpiperidin-4-yl) amino) triazin-2-yl) -4,7-diazadecane-1, Reaction product of 10-diamine, decandioic acid, bis (2,2,6,6-tetramethyl-1- (octyloxy) -4-piperidinyl) ester and 1,1-dimethylethyl hydroperoxide Bis (1,2,2,6,6-pentamethyl-4-piperidinyl)-[[3,5-bis (1,1-dimethylethyl) -4-hydroxyphenyl] methyl] butyl malonate, 2,4 -Bis [N-B Ru-N- (1-cyclohexyloxy-2,2,6,6-tetramethylpiperidin-4-yl) amino] -6- (2-hydroxyethylamine) -1,3,5-triazine, bis (1, 2,2,6,6-pentamethyl-4-piperidinyl) sebacate, methyl (1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate and the like.

  Examples of the chain transfer agent include dodecyl mercaptan and 2,4-diphenyl-4-methyl-1-pentene.

  The photosensitive resin composition of the present invention is, for example, as described later, a substrate such as a substrate made of glass, metal, plastic, etc., a color filter, various insulating films or conductive films, a drive circuit, etc. By applying on top, it can be formed as a coating film. The coating film is preferably dried and cured. Moreover, the obtained coating film can be patterned into a desired shape and used as a pattern. Furthermore, these coating films and / or patterns may be formed and used as a part of components such as a display device.

  In addition, when the curable resin composition of the present invention is filled in a quartz cell having an optical path length of 1 cm and the transmittance is measured under a measurement wavelength of 400 to 700 nm using a spectrophotometer, the average transmittance is It is 70% or more, preferably 75% or more. Thereby, a transparent pattern and coating film can be formed in the visible light region.

First, the photosensitive resin composition of this invention is apply | coated on a base material.
As described above, the coating can be performed using various coating apparatuses such as a spin coater, a slit & spin coater, a slit coater, an ink jet, a roll coater, and a dip coater. Among these, from the viewpoint of solubility, prevention of drying, prevention of the generation of foreign matter, and the like, it is preferable to perform coating by a slit coating method, that is, coating using a slit & spin coater and a slit coater.

It is then suitable to dry and / or pre-bake to remove volatile components such as solvents. Thereby, a smooth uncured coating film can be obtained.
The film thickness of the coating film in this case is not particularly limited, and can be appropriately adjusted depending on the material used, application, etc. For example, about 1 to 6 μm is exemplified.

Furthermore, the obtained uncured coating film is irradiated with light, for example, ultraviolet rays generated from a mercury lamp or a light emitting diode, through a mask for forming a target pattern. The shape of the mask at this time is not particularly limited, and various shapes can be mentioned. Further, the line width and the like can be appropriately adjusted depending on the mask size and the like.
In recent exposure machines, light of less than 350 nm is cut using a filter that cuts this wavelength range, or light near 436 nm, 408 nm, and 365 nm is used using a bandpass filter that extracts these wavelength ranges. It is possible to selectively take out and irradiate parallel light uniformly on the entire exposure surface. At this time, an apparatus such as a mask aligner or a stepper may be used to accurately align the mask and the substrate.

Thereafter, a desired pattern shape can be obtained by bringing the coating film into contact with an aqueous alkali solution to dissolve a predetermined portion, for example, an unexposed portion, and developing.
The developing method may be any of a liquid piling method, a dipping method, a spray method, and the like. Further, the substrate may be inclined at an arbitrary angle during development.

The developer used for development is usually an aqueous solution containing an alkaline compound and a surfactant.
The alkaline compound may be either an inorganic or organic alkaline compound.
Specific examples of the inorganic alkaline compound include sodium hydroxide, potassium hydroxide, disodium hydrogen phosphate, sodium dihydrogen phosphate, diammonium hydrogen phosphate, ammonium dihydrogen phosphate, potassium dihydrogen phosphate, sodium silicate, potassium silicate, Examples thereof include sodium carbonate, potassium carbonate, sodium hydrogen carbonate, potassium hydrogen carbonate, sodium borate, potassium borate, and ammonia.

Examples of the organic alkaline compound include tetramethylammonium hydroxide, 2-hydroxyethyltrimethylammonium hydroxide, monomethylamine, dimethylamine, trimethylamine, monoethylamine, diethylamine, triethylamine, monoisopropylamine, diisopropylamine, and ethanolamine. Is mentioned.
The density | concentration in the alkali developing solution of these inorganic and organic alkaline compounds becomes like this. Preferably it is 0.01-10 mass%, More preferably, it is 0.03-5 mass%.

The surfactant may be any of a nonionic surfactant, an anionic surfactant, or a cationic surfactant.
Nonionic surfactants include, for example, polyoxyethylene alkyl ether, polyoxyethylene aryl ether, polyoxyethylene alkyl aryl ether, other polyoxyethylene derivatives, oxyethylene / oxypropylene block copolymers, sorbitan fatty acid esters, polyoxyethylene Examples include ethylene sorbitan fatty acid ester, polyoxyethylene sorbitol fatty acid ester, glycerin fatty acid ester, polyoxyethylene fatty acid ester, and polyoxyethylene alkylamine.

  Examples of the anionic surfactant include higher alcohol sulfates such as sodium lauryl alcohol sulfate and sodium oleyl alcohol sulfate, alkyl sulfates such as sodium lauryl sulfate and ammonium lauryl sulfate, sodium dodecylbenzenesulfonate and dodecyl sulfate. And alkylaryl sulfonates such as sodium naphthalene sulfonate.

Examples of the cationic surfactant include amine salts or quaternary ammonium salts such as stearylamine hydrochloride and lauryltrimethylammonium chloride.
The concentration of the surfactant in the alkali developer is preferably in the range of 0.01 to 10% by mass, more preferably 0.05 to 8% by mass, and more preferably 0.1 to 5% by mass.

  After development, washing may be performed, and post-baking may be performed as necessary. The post-bake is suitable for a temperature range of 150 to 230 ° C. and 10 to 180 minutes, for example.

  The curable resin composition of the present invention has a measurement wavelength of 400 to 700 nm using a spectrophotometer for a coating film having a thickness of 3 μm after heat curing (for example, 150 to 250 ° C., 0.1 to 3 hours). When the transmittance is measured under the above conditions, the transmittance is 90% or more, preferably 95% or more. Thereby, a transparent pattern and coating film can be formed in the visible light region.

The coating film or pattern thus obtained is useful as, for example, a photospacer used in a liquid crystal display device or a patternable overcoat. Moreover, a hole can be formed by using the photomask for hole formation at the time of patterning exposure to an uncured coating film, and it is useful as an interlayer insulation film. Furthermore, a transparent film can be formed by performing only the whole surface exposure and heat curing or heat curing without using a photomask when exposing an uncured coating film. This transparent film is useful as an overcoat. Further, it can be used for a display device such as a touch panel. Thereby, it is possible to manufacture a display device having a high-quality coating film or pattern with a high yield.
The photosensitive resin composition of the present invention is a material for forming various films and patterns, such as a transparent film, in particular, a transparent film, a pattern, a photospacer, an overcoat, and an insulating film constituting a part of a color filter. It can be suitably used for forming liquid crystal alignment control protrusions, microlenses, colored patterns combining different film thicknesses, coat layers, and the like. Further, a color filter, an array substrate, or the like provided with these coating films or patterns as a part of its constituent parts, and a display device including these color filters and / or an array substrate, for example, a liquid crystal display device, an organic EL device Etc. can be used.

  Hereinafter, although the photosensitive resin composition of this invention is demonstrated in detail by an Example, this invention is not limited by these Examples. Moreover, in the following Examples and Comparative Examples,% and part representing the content or amount used are based on mass unless otherwise specified.

Synthesis example 1
Nitrogen was flowed at a rate of 0.02 L / min into a 1 L flask equipped with a reflux condenser, a dropping funnel and a stirrer to form a nitrogen atmosphere, and 140 parts of diethylene glycol ethyl methyl ether was added and heated to 70 ° C. with stirring. Next, 40 parts of methacrylic acid, 3,4-epoxytricyclo [5.2.1.0 ^2.6 ] decyl acrylate (a compound represented by the formula (I-1) and a formula (II-1) The compound is dissolved in a molar ratio of 50:50 in a mixture of 360 parts and 190 parts of diethylene glycol ethyl methyl ether to prepare a solution, and the resulting solution is added over 4 hours using a dropping pump. It was dripped in the flask kept at 70 degreeC.

  On the other hand, a solution prepared by dissolving 30 parts of a polymerization initiator 2,2′-azobis (2,4-dimethylvaleronitrile) in 240 parts of diethylene glycol ethyl methyl ether was placed in a flask over another 5 hours using another dropping pump. It was dripped. After completion of the dropwise addition of the polymerization initiator solution, the mixture was kept at 70 ° C. for 4 hours, and then cooled to room temperature, and a copolymer having a solid content of 42.6% and an acid value of 60 mg-KOH / g (resin Aa) Solution was obtained. The obtained resin Aa had a weight average molecular weight (Mw) of 8,000 and a dispersity of 1.91.

Synthesis example 2
Nitrogen was flowed at a rate of 0.02 L / min into a 1 L flask equipped with a reflux condenser, a dropping funnel and a stirrer to form a nitrogen atmosphere, 305 parts of diethylene glycol ethyl methyl ether was added, and the mixture was heated to 70 ° C. with stirring. Next, 60 parts of methacrylic acid, 3,4-epoxytricyclo [5.2.1.0 ^2.6 ] decyl acrylate (a compound represented by the formula (I-1) and a formula (II-1) 240 parts of a compound having a molar ratio of 50:50) is dissolved in 140 parts of diethylene glycol ethyl methyl ether to prepare a solution. The solution is heated to 70 ° C. over 4 hours using a dropping funnel. It was dripped in the flask kept warm. On the other hand, a solution obtained by dissolving 30 parts of a polymerization initiator 2,2′-azobis (2,4-dimethylvaleronitrile) in 225 parts of diethylene glycol ethyl methyl ether was dropped into the flask using another dropping funnel over 4 hours. did. After completion of the dropwise addition of the polymerization initiator solution, the mixture was kept at 70 ° C. for 4 hours, and then cooled to room temperature, and the solid content was 32.6% and the acid value was 110 mg-KOH / g (solid content conversion). A solution of coalescence (resin Ab) was obtained. The obtained resin Ab had a weight average molecular weight Mw of 13,600 and a dispersity of 2.49.

Synthesis example 3
Into a 1 L flask equipped with a reflux condenser, a dropping funnel and a stirrer, nitrogen was allowed to flow at 0.02 L / min to form a nitrogen atmosphere, and 200 parts of 3-methoxy-1-butanol and 105 parts of 3-methoxybutyl acetate were added. Heat to 70 ° C. with stirring. Next, 60 parts of methacrylic acid, 3,4-epoxytricyclo [5.2.1.0 ^2.6 ] decyl acrylate (a compound represented by the formula (I-1) and a formula (II-1) 240 parts of a compound having a molar ratio of 50:50) is dissolved in 140 parts of 3-methoxybutyl acetate to prepare a solution, and the resulting solution is added at 70 ° C. over 4 hours using a dropping funnel. It was dripped in the flask kept warm. On the other hand, a solution obtained by dissolving 30 parts of a polymerization initiator 2,2′-azobis (2,4-dimethylvaleronitrile) in 225 parts of 3-methoxybutyl acetate was placed in a flask using another dropping funnel over 4 hours. It was dripped. After completion of the dropwise addition of the polymerization initiator solution, the mixture was kept at 70 ° C. for 4 hours, and then cooled to room temperature. The solid content was 32.6% and the acid value was 110 mg-KOH / g (solid content conversion). A solution of coalescence (resin Ac) was obtained. The obtained resin Ac had a weight average molecular weight Mw of 13,400 and a dispersity of 2.50.

The weight average molecular weight (Mw) and number average molecular weight (Mn) of the copolymers (resins Aa to Ac) were measured using the GPC method under the following conditions.
Apparatus; K2479 (manufactured by Shimadzu Corporation)
Column; SHIMADZU Shim-pack GPC-80M
Column temperature: 40 ° C
Solvent; THF (tetrahydrofuran)
Flow rate: 1.0 mL / min
Detector; RI

  The ratio of the weight-average molecular weight and number-average molecular weight obtained above in terms of polystyrene was defined as the degree of dispersion (Mw / Mn).

Examples 1-9, Comparative Example 1
The composition of Table 1 was mixed and the photosensitive resin compositions 1-10 were obtained.

<Moyamura evaluation>
Each of the solutions of the photosensitive resin compositions obtained in the examples and comparative examples on a 15 cm square ITO film-formed glass substrate was used with a slit die coater (Taku Die-100, manufactured by ITOCHU MACHINERY CO., LTD.). The film was applied under conditions such that the film thickness after curing was 5.5 μm.
Thereafter, the degree of vacuum was reduced to 0.5 torr using a vacuum dryer (VCD Microtech Co., Ltd.). A coating film was formed by prebaking at 90 ° C. for 2 minutes on a hot plate.
After cooling, the film surface was illuminated with a Na lamp, and the coating film surface was confirmed visually.
X was observed when haze unevenness (cloudy unevenness) was clearly confirmed, Δ when slightly confirmed, and ○ when almost not confirmed.

<Pin mark evaluation>
In the same manner as described above, a coating film was formed and then dried under reduced pressure. Thereafter, a stainless steel plate having a thickness of 20 mm with a hole having a diameter of 60 mm was placed on a hot plate set at 90 ° C., and prebaked thereon for 2 minutes to form a coating film.
After cooling, the film surface was illuminated with a Na lamp, and the coating film surface was confirmed visually.
When the pin mark was clearly confirmed, it was evaluated as “X”, when it was confirmed slightly, “△”, and when almost not confirmed, “◯”.

<Slit nozzle dryness evaluation>
A coating film was formed in the same manner as described above.
Thereafter, the nozzle tip was not washed and left as it was. After 1 minute, the same coating was performed without cleaning the nozzle tip.
Subsequently, the degree of vacuum was reduced to 0.5 torr with a vacuum dryer (VCD Microtech Co., Ltd.) and prebaked on a hot plate at 90 ° C. for 2 minutes to form a coating film.
After cooling, the film surface was illuminated with a Na lamp, and the coating film surface was confirmed visually.
When the vertical stripe unevenness was clearly confirmed, it was evaluated as “X”, when it was confirmed slightly, “△”, and when almost not confirmed, “◯”.

<Average transmittance of composition>
About each photosensitive resin composition, the average transmittance | permeability (%) in 400-700 nm was used for the ultraviolet visible near-infrared spectrophotometer (V-650; JASCO Corporation make) (quartz cell, optical path length: 1 cm). ) Was measured.

<Average transmittance of pattern>
Using each photosensitive resin composition, a cured film was prepared as follows so that the film thickness after curing was 3 μm.
A 5 cm square glass substrate was sequentially washed with a neutral detergent, water and 2-propanol and then dried. On this substrate, the composition was applied by spin coating so that the film thickness of the post-baked pattern was 3 μm. Next, the degree of vacuum was reduced to 0.5 torr with a vacuum dryer (VCD Microtech Co., Ltd.) and dried to form a coating film. This coating film was prebaked for 2 minutes at 90 ° C. in a hot plate. The distance between the substrate and the quartz glass photomask was set to 10 μm, and the exposure amount (405 nm) was 100 mJ / cm ^{2 in} an air atmosphere using an exposure machine (TME-150RSK; manufactured by Topcon Corporation, light source: ultrahigh pressure mercury lamp). Standard), the pre-baked coating film was exposed. In this exposure, the emitted light from the ultra-high pressure mercury lamp was irradiated through an optical filter (LU0400; manufactured by Asahi Spectroscopic Co., Ltd.). A photomask for forming a 100 μm line and space pattern was used. After exposure, the film was soaked in a 23 ° C. aqueous tetramethylammonium hydroxide solution (containing 2.38 parts of tetramethylammonium hydroxide in 100 parts of an aqueous solution) for 60 seconds, washed with water, and then 235 ° C. on a hot plate. Was post-baked for 11 minutes to form a line and space pattern.
About each obtained pattern, the average transmittance (%) in 400-700 nm was measured using the microspectrophotometer (OSP-SP200; OLYMPUS company make).
Higher transmittance means less absorption.

Each component in Table 1 is as follows.
Polymerizable compound (B); dipentaerythritol hexaacrylate (KAYARAD DPHA; manufactured by Nippon Kayaku Co., Ltd.)
Polymerization initiator (C) Ca; 1- (4-phenylsulfanylphenyl) octane-1,2-dione-2-oxime-O-benzoate (OXE 01; manufactured by Ciba Japan)
Polymerization initiator (C) Cb; 2,2′-bis (2-chlorophenyl) -4,4 ′, 5,5′-tetraphenyl-1,2′-biimidazole (B-CIM; Hodogaya Chemical Co., Ltd.) ) Made)
Initiating aid C2a; pentaerythritol tetrakis (3-sulfanylpropionate) (PEMP manufactured by SC Organic Chemical Co., Ltd.)
Initiating aid C2b; 2- (2-naphthoylmethylene) -3-methylbenzothiazoline solvent Da; 3-methoxy-1-butanol solvent Db; propylene glycol monomethyl ether solvent Dc; diethylene glycol ethyl methyl ether solvent Dd; propylene glycol monomethyl Ether acetate solvent De; 3-methoxybutyl acetate solvent Df; ethyl 3-ethoxypropionate

As described above, when a coating film is formed using the photosensitive resin composition of the present invention, even when a coating is formed on a relatively thick film, occurrence of haze unevenness, vertical stripe unevenness, and pin marks is suppressed, and coating is performed. It is uniform and smooth throughout the film, and a high-quality coating film can be formed. In other words, since the boiling point is relatively low, the coating and drying time can be shortened, and productivity can be improved, while drying of the tip of the slit nozzle is suppressed, and the generation of foreign substances due to drying and coating are suppressed. Mixing into the film and vertical stripes can be prevented.
Further, the solubility of the resin and various components is good, and the storage stability can be improved.
By forming a coating film or a pattern using such a photosensitive resin composition and manufacturing a display device using them, it is possible to improve the yield.

According to the photosensitive resin composition of the present invention, generation of haze unevenness, vertical stripe unevenness and pin marks can be suppressed, and a uniform and high-quality coating film can be formed throughout the coating film.
Further, by using this photosensitive resin composition, it is possible to obtain a high-quality display device or the like.

Claims (8)

Resin (A), polymerizable compound (B), polymerization initiator (C) and solvent (D),
The photosensitive resin composition whose solvent (D) is a solvent containing the C1-C3 alkylene group and the C1-C4 alkyl group dialkylene glycol dialkyl ether and C1-C6 alcohol. .   The photosensitive resin composition according to claim 1, wherein the solvent (D) is a solvent containing 30 to 90% by mass of dialkylene glycol dialkyl ether based on the total amount of the solvent.   The photosensitive resin composition according to claim 1 or 2, wherein the solvent (D) is a solvent containing 10 to 50% by mass of an alcohol having 1 to 6 carbon atoms based on the total amount of the solvent.   The photosensitive resin composition according to any one of claims 1 to 3, wherein the dialkylene glycol dialkyl ether is diethylene glycol ethyl methyl ether.   The photosensitive resin composition according to any one of claims 1 to 4, wherein the alcohol having 1 to 6 carbon atoms is 3-methoxybutanol.   The coating film formed using the photosensitive resin composition in any one of Claims 1-5.   The pattern formed using the photosensitive resin composition in any one of Claims 1-5.   A display device comprising at least one selected from the group consisting of the coating film of claim 6 and the pattern of claim 7.