201032956 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種翻轉平台’且特別是有關於一種用於 吸附基板並翻轉基板的基板翻轉平台以及用於其之翻轉基板 ‘ 的方法。 【先前技術】 隨著液晶顯示技術的進步加上液晶顯示裝置具有重量輕 且體積小等優點，液晶顯示裝置已廣泛地應用於多種電子產 φ 品，如數位相機、個人數位助理（personal digital assistant， PDA)、行動電話、筆記型電腦（notebook computer)以及平 面薄型化電視等。液晶顯示裝置包括液晶顯示面板與背光模 組’其中液晶顯示面板是由二基板以及位於此二基板之間的液 晶層所構成。在將此二基板組立的過程中，需先藉由翻轉平台 將其中一個基板翻面，之後再進行基板組立。 . 圖1A與圖1B是習知一種基板翻轉平台的俯視示意圖與 側視示意圖。請參照圖1A與圖1B，習知基板翻轉平台1〇〇 包括翻轉架110與固定架12〇’而翻轉架110係樞接於固定架 ❹ I20上。翻轉架110之表面112上設有多個支撐管114，每一 支撐管114的頂端皆設有一個吸附墊116，且每一吸附墊116 皆具有孔洞117。此外，翻轉架11〇内部為中空，且翻轉架11〇 内部設有多條管線（圖未示這些管線的—端經由支樓管 114内伸至吸附塾ία的孔洞ip，另一端則連接至主管 線’並透過此主管線連接至翻轉架11〇外的真空源。如此，舍 真空源開啟時，吸附塾116即可用來吸附基板。 田 圖2A至圖2C係習知技術中將二基板組立的流程圖 照圖2A，習知技術之基板組立的流程 來承載基板50，其中機械手臂H)具有多 4 201032956 以吸附基板50的背面52，而基板5〇的正 Γ :4後接=，手臂10將基板5°放置:吸附：二 ΐ面=真二:移由:_16來一的 之後’請參照圖2B，將翻轉架11〇翻轉18〇。，以使 =Γ的背面^藉由另—機械手臂2G的朗墊22來吸二基 板50的赤面52。之後，關閉真空源 基板50移走。 亚错由機械手臂20將 然後，請參照圖2C，將基板50移動至另 側，其中基板60的正面形成有驅動電路層&，且塗框跋 70，而基板50的彩色濾光層54盥美拓 ^ 蚪垃輦故贫』 與基板〇的驅動電路層幻相 其1 基板60組立，並藉由框膠70來結合 基板50與基板60。 σ 主，由於設置於翻轉架110内部的管線是透過 主S線而連接至同一真空源，所以當真空 t，m的接觸面有微粒子時’容易導致吸_二的吸 ===此’在翻轉基板50時容易產生破真空的情形， 掉落。此不僅損失基板50，還需停止整個製 各來進订賴的清理動作’所以會㈣時間成本。 【發明内容】 中掉供—種基板轉平台，崎低基板在翻轉的過程 μ ίΓ Γ另提供—種翻轉基板的方法，以防止基板在翻轉的 過程中掉洛。 ㈣ί達上述優點’本發明提出—種基板翻轉平台，其用以吸 附基板並翻轉基板。此基板翻轉平台包括固定架、翻轉架與氣 201032956 流導引裝置。翻轉架樞接於固定架上，且翻轉架内部為中空。 翻轉架具有適於吸附基板的吸附面，且吸附面設有金 =一 孔洞與複數個第二孔洞。氣流導引裝置包括第一管線單元與第 二管線單元。第一管線單元的一端伸入翻轉架内部並延伸^第 一孔洞，而第二管線單元的一端伸入翻轉架内部並延伸至第二 孔洞，且第一管線單元與第二管線單元彼此獨立、互不相通。 為達上述優點，本發明另提出一種基板翻轉平台，其包含 固定架、翻轉架、複數個第一吸附墊、複數個第二吸附墊、第 ❹一負壓源以及第二負壓源。翻轉架枢接於固定架上，第一吸附 墊與第二吸附墊呈矩陣且交替排列於翻轉架上。第一負壓源連 接於第一吸附墊，而第二負壓源連接於第二吸附墊。 為達上述優點，本發明提出一種翻轉基板的方法，其包含 下列步驟：首先’提供上述之基板翻轉平台與基板。接著，將 基板裝載於翻轉架上。之後，驅動第一負壓源，以使第一吸附 ' 墊吸附基板。然後，18〇。翻轉翻轉架與基板。 ' 在本發明之基板翻轉平台中，由於翻轉架是連接至不同的 ⑩ 士源，所以當其中一個負壓源所提供的負壓失效時，還可藉 另個負壓源所提供的負壓來吸附基板，如此可降低基板在 ^轉過程巾掉落的機率。此外，本發明之基板的翻轉方法因使 ^述之基板翻轉平台，所以可防止基板在翻轉的過程中掉 為讓本發明之上述和其他目的、特徵和優點能更明顯易 下文特舉較佳實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 4 e、vf 3是本發明—實施例之一種基板翻轉平台的俯視圖，圖 疋，口圖3中1-1，線的剖面示意圖，而圖5是氣流導引裝置的 201032956 示意圖。請參照圖3至圖5，本實施例之基板翻轉平台200是 用以吸附基板並翻轉基板。此基板翻轉平台2〇〇包括固定架 210與翻轉架220。翻轉架220樞接於固定架210上，且翻轉 架220内部為中空。翻轉架220具有適於吸附基板的吸附面 211，且吸附面211設有複數個第一孔洞222與複數個第二孔 洞223。此翻轉架220例如包括封閉框224與複數個中空柱 225。封閉框224與中空柱225的内部為中空，且中空柱225 連接於封閉框224。每一中空柱225的内部空間皆與封閉框224 ❿ 的内部空間相通，且上述之吸附面211例如是由這些中空柱 225之面向同一側的表面所構成。此外，封閉框224具有轉轴， 此轉軸包括相對的二個樞接部226。此二個樞接部226位於封 閉框224的相對二側邊，且樞接於固定架21〇上。另外，每一 中空柱225設有第一孔洞222與第二孔洞223。每一中空柱225 的第一孔洞222與第二孔洞223例如是沿中空柱225的延伸方 ‘ 向排列，且第一孔洞222與第二孔洞223係交替設置。 - 上述之基板翻轉平台200可更包括複數個支撐管，如複數 _ 個第一支撐管230a與複數個第二支撐管230b。第一支撐管 230a的一端分別連接於一個第一孔洞222,而第二支撐管230b 的一端則分別連接於一個第二孔洞223，第一支撐管230a與 第二支撐管230b例如是沿中空柱225的延伸方向排列，且第 一支撐管230a與第二支撐管230b交替設置。此外，基板翻轉 平台200可更包括複數個吸附墊，如複數個第一吸附墊240a 與複數個第二吸附墊240b。第一吸附墊240a與第二吸附墊 240b分別具有一個第三孔洞242。第一吸附墊24〇&是套設於 第一支撐管230a的另一端，且第一吸附墊240a的第三孔洞242 疋透過第一支撐管230a而與對應的第一孔洞222相通。第二 201032956 吸附墊240b是套設於第二支撐管230b的另一端，且第二吸附 墊240b的第三孔洞242是透過第二支撐管23Ob而與對應的第 二孔洞223相通。 承上述，第一吸附墊240a與第二吸附墊240b呈矩陣且交 替排列於翻轉架220上。更詳細地說，上述陣列的每一行中， 第一吸附墊240a與第二吸附墊240b係交替設置，且在上述之 陣列的每一列中，第一吸附墊240a與第二吸附墊240b係交替 設置。換言之，吸附面211上的第一孔洞222與第二孔洞223 ❹ 係呈陣列排列’且在陣列的每一行中，第一孔洞222與第二孔 洞223係交替設置，在陣列的每一列中，第一孔洞222與第二 孔洞223係交替設置。此外，每一第一吸附墊240a與第二吸 附墊240b具有一吸附墊直徑，且吸附墊直徑的範圍例如是介 於20公釐與32公釐之間。另外，相鄰第一吸附墊240a與第 二吸附墊240b之間具有一最小距離Ds，且此最小距離Ds的 ’ 範圍例如是介於12公分與29公分之間。相鄰第一吸附塾240a • 之間具有一第一距離D1，且此第一距離D1大於最小距離Ds。 B 相鄰第二吸附墊240b之間具有一第二距離D2，且此第二距離 D2大於最小距離Ds。具體而言，第一距離D1的範圍例如是 介於35公分與45公分之間，而第二距離D2的範圍例如介於 35公分與45公分之間。 本實施例之基板翻轉平台200可更包括一個第一負壓源 250a與一個第二負壓源250b，此第一負壓源250a與第二負壓 源250b例如為真空源。第一負壓源250a是連接於第一吸附墊 240a’而第二負壓源250b是連接於第二吸附墊240b。基板翻 轉平台200可更包括氣流導引裝置260，而第一吸附墊240a 與第二吸附墊240b是透過氣流導引裝置260而連接至第一負 8 201032956 壓源250a與第二負壓源250b。具體而言，氣流導引裝置26〇 包括第一管線單元262與第二管線單元264,其中第一吸附墊 240a是透過第一管線單元262而連接至第一負壓源25〇a，且 第二吸附墊24〇b是透過第二管線單元264而連接至第二負壓 源250b。第一管線單元262的一端例如是透過第一控制閥27〇& 而連接至第一負壓源250a，另一端伸入翻轉架22〇内部且延 伸至第一孔洞222，並經由第一孔洞222與第一支撐管230a 而延伸至第一吸附墊240a的第三孔洞242。第二管線單元264 〇 的一端例如是透過第二控制閥270b而連接至第二負壓源 MOb，另一端伸入翻轉架22〇内部且延伸至第二孔洞223，並 經由第一孔洞223與第二支樓管23Qb而延伸至第二吸附塾 240b的第三孔洞242。此外，第一管線單元262與第二管線單 几264彼此獨立、互不相通。上述之第一控制間27如與第二 控制閥270b例如為電磁閥。 • 上述之第一管線單元262包括第一管線262a、複數根第 •—管線262b與複數根第三管、線262c。第-管線262a的一端例 φ $是透過第一控制閥^而連接至第一負壓源25〇a，另-端 广封閉框224内。每一第二管線㈣的一端連接第一管線 ^ a ’且另一端伸入—個中空柱225 β，並沿中空柱225的延 向延伸。第三管線綠位於第一支撐管2施内且每一 第，管、線262c的-端連接對應的第二管線勘，且經由第一 222第—支榜管2咖的延伸方向延伸至第—吸附墊 四2 ,第一孔f 242。此外’上述之第二管線單元264包括第 &总204a、她根第五管線26扑與複數根第六管線施。 —=線264a的-端例如是透過第二控制闕2葡而連接至第 -負壓源25Gb，另1伸入封閉框⑽内。每—第五管線鳩 201032956 的一端連接第四管線264a’且另—端伸入一個中空柱2 並沿中空柱225的延伸方向延伸。第 护其OQnuh ^ 弟，、官線264c位於第二支 二牝且二2 一第六管線264。的一端連接對應的第五管 ίΓΓνί 洞223，沿第二切管通的延伸方 向延伸至#二吸附塾鳩的第三孔洞242。另外， 個樞接部226的内部例如為中* ,而曾 與始一 第一管線單元262與第二 吕線早7L 264例如是經由此二個樞接部226至少其中之 ❹ =入翻轉架220内部。換言之，第—管線單元262與第二管 =早=64可經由同一_部226的内部而伸入翻轉架咖 内，或疋經由不同樞接部226的内部而伸入翻轉架細内。 承上述，第-管線262a例如為第一主幹真空軟管，每一 第-管線262b例如為-第—次枝^軟管，騎-第三 262c例如為-第一末枝真妹管。這些第二管線勘例如是 彼此平行，*這鮮三錄262e例如是彼辭行。此外 四^線264a例如為第二主幹真空軟管，每一第五管線麟 如是一第二次枝真空軟管，而每一第六管線26如例如是一第 二末枝真空軟管。這些第五管線264b例如是彼此平行， 些第六管線264c例如是彼此平行。 本實施例之基板翻轉平台200中，用於吸附基板的第—吸 附墊240a與第二吸附墊240b是連接至不同的負壓源，所以當 其中一個負壓源異常或是因吸附墊與基板的接觸面之間有微 粒子而導致其中一個負壓源失效時，還可藉由另一負壓源所提 供的負壓來吸附基板’如此可降低基板在翻轉架22〇翻轉時掉 落的機率。 由於本實施例之基板翻轉平台200可僅藉由第一吸附聲 240a或是僅藉由第二吸附墊240b來吸住基板，所以若第一吸 201032956 附墊240a或第二吸附墊240b的理論吸附力為w，且基板所需 的吸附力為F，則第一吸附墊240a或第二吸附墊240b的理論 吸附力W需大於或等於基板所需的吸附力F的二倍，即w ^ 2xF。如此，當其中一個負壓源失效時，還可藉由另一負壓源 所提供的負壓來吸附基板。 承上述，上述第一吸附墊240a之任一或第二吸附墊240b 之任一的理論吸附力W = |P卜Sx(u，其中p為第一負壓源25〇a 或第一負壓源250b所提供的負壓，；§為所有第一吸附塾24〇a ® 之任一個或所有第二吸附墊240b之任一個的面積。在本實施 例中’理論吸附力W的範圍例如是介於24與39之間，負壓P 的範圍例如是介於-50千帕（kPa)與-80千帕之間，而面積s 的範圍例如是介於3平方公分與8平方公分之間。 此外，若基板的重量為Μ、所需的安全率為8，所有第一 吸附墊240a與第二吸附墊240b的總數量為Ν，則上述之基板 所需的吸附力F = (M/N)x8。在本實施例中，上述之基板所需 • 的吸附力F的範圍例如是介於9與11之間，基板的重量μ的 ，範圍例如是介於100與105之間，而第一吸附墊24〇a與第二 吸附墊240b的總數量N的範圍例如是介於72與88之間。 下文將以一個實際的例子來說明本實施例之基板翻轉平 台200在其中一個負壓源失效時，仍可吸住基板。 若基板翻轉平台200之第一吸附墊240a與第二吸附墊 24〇b的總數量N為80，基板為玻璃基板，且其密度為2 69公 克/立方公分’其尺寸為220公分χ250公分χθ.07公分，則基板 的重量Μ為10356.65公克，約為101.6牛頓，所以基板所需 的吸附力F等於10.16牛頓。換言之’每一第一吸附塾24〇a 或每一第二吸附墊240b所需提供的吸附力需大於或等於1〇16 201032956 牛頓。 表一疋吸附墊（即第—吸附墊24〇a與第二吸附墊24〇b) 之理論吸附力在不同參數下的數值，單位科頓（N)。 --^ 吸附墊直徑 (mm) φ 13 --------- φ 16 ------ φ 20 φ25 φ32 φ 40 φ 50 吸附墊 (cm2) 面積 1.33 2.01 3.14 4.01 8.04 12.6 19.6 -85 11.3 17.1 26.7 41.7 68.3 107 167 -80 10.6 16.1 25.1 39.3 64.3 101 157 -75 9.98 15.1 23.6 36.8 60.3 94.5 147 -70 9.31 14.1 22.0 34.4 56.3 88.2 137 負 壓 -65 8.65 13,1 20.4 31.9 52.3 81.9 127 (kPa) -60 7.98 12.1 18.8 29.5 48.2 75.6 118 -55 7.32 11.1 … ,, 17.3 27.0 44.2 69.3 108 -50 6.65 10.1 15.7 24.6 40.2 63.0 96.0 -45 5.99 9.05 14.1 22.1 36.2 56.7 88.2 -40 5.32 8.04 12.6 19.6 32.2 50.4 78.4 如表一所示，若第一負壓源250a與第二負壓源25〇b所提 供的負壓P为別為-50千帕，且所有第一吸附塾240a之任一或 所有第二吸附墊240b之任一的吸附墊直徑為25公釐，面積s 為4.01平方公分，則上述第一吸附墊240a之任一或第二吸附 墊240b之任一的理論吸附力w等於24.6牛頓。 由於上述之第一吸附墊240a之任一或第二吸附墊24〇b之 任一的理論吸附力W為24.6，基板所需的吸附力f僅為 12 201032956 10.16,所以即使其中一負壓源失效，本實施例之基板翻轉平 台200仍可吸住基板。 值得一提的是’理論吸附力W為24.6時，安全餘裕約為 2.4 (即24.6/10.16)倍，所以可使用雙真空源。依此類推，安 全餘裕大於3倍時可使用三真空源或雙真空源，例如使用吸附 塾直住Φ為32公釐，且負壓為_4〇〜-85千帕，則吸附塾的理 論吸附力W可大於3倍的安全餘裕。安全餘裕大於4倍時可 使用四真空源、三真空源或雙真空源，例如使用吸附墊直徑少 ❹ 為32公釐，且負壓為_5〇〜-85千帕，則吸附墊的理論吸附力 W可大於4倍的安全餘裕。因此，真空源的數目應小於安全餘 裕，安全餘裕最小為2，本發明並不對真空源的數目作其它的 限制。 因此’在另一實施例中’上述之基板翻轉平台2〇〇的吸附 面211可更設有複數個第四孔洞（圖未示），而氣流導引裝置 .260可更包括一第三管線單元（圖未示），其一端伸入翻轉架 =内部並延伸至第四孔洞m線單元262、第二管線 ，單元264與第二管線單元彼此獨立、互不相通。此外，吸附面 211還可設有複數個第五孔洞（圖未示），而氣流導引裝置26〇 更包括-第四管線單元（圖未示），其—端伸人翻轉架22〇内 4並延伸至第五孔洞，第—管線單元262、第二管線單元 264、第'管:線單元與第四管線單元彼此獨立、互不相通。 一由於第三管線單元與第四管線單元與上述之第一管線單 7L 262《第二管線單元264相似，所屬技術領域中具有通常知 2者在參照本朗書後當刊瞭，所以有縣板翻轉平台具有 =孔洞（甚至具有第五孔洞）與第三管線單元（甚至具有第 四管線單元）的實施例’將不另以圖式說明。 13 201032956 圖6A至圖6C是本發明一實施例之一種翻轉基板的方法 之流程圖。請先參照圖6A，本實施例之翻轉基板的方法是先 提供上述之基板翻轉平台200與基板80，接著將基板8〇裝載 於翻轉架220上。本實施例可藉由機械手臂3〇來承載基板8〇, 並將基板80放置於第一吸附墊240a與第二吸附墊24〇b上， 其中機械手臂30具有多個吸附墊32,其係用以吸附基板8〇。 之後，驅動第一負壓源250a’並開啟第一控制閥27〇a，以使 第一吸附墊240a吸附基板80，並將機械手臂30移開。 ❹ 接著’如圖6B所示，180。翻轉翻轉架220與基板80。 3月參照圖6C ’本實施例之翻轉基板的方法可另包含切斷 或關閉第一負壓源250a以使第一吸附墊240a不再吸附基板 80，其中切斷第一負壓源250a的方法例如是關閉第一控制閥 270a。接著’將基板8〇自翻轉架220上卸載。具體而言，本 實施例可藉由機械手臂40的吸附墊42來吸附基板。之後，切 斷或關閉第一負壓源250a，並藉由機械手臂40將基板80移 走。 上述之翻轉基板的方法可另包含驅動第二負壓源250b並 〇 開啟第一控制閥270b，以使第二吸附塾240b吸附基板80。此 外’上述之翻轉基板的方法可另包含切斷或關閉第一負壓源 250a與第二負壓源250b其中之一，以使第一吸附墊240a與第 二吸附墊240b其中之一不再吸附基板80，之後將基板80自 翻轉架220上卸載。上述切斷或關閉第一負壓源250a與第二 負壓源250b其中之一的方法例如是有意地關閉第一控制閥 270a與第二控制閥270b其中之一，或第一負壓源250a與第二 負壓源250b其中之一或第一控制閥270a與第二控制閥270b 其中之一無意地或無預期地失效所致。 14 201032956 由於本實施例之翻轉基板的方法可同時藉由連接至不同 負壓源的第一吸附墊240a與第二吸附墊2401)來吸附基板，當 其中一負壓源失效時’仍可藉由另一負壓源所提供的負壓來吸 附基板80，以防止基板80在翻轉的過程中掉落。 在本發明中’第一吸附墊240a與第二吸附墊24〇b的排列 方式（即第一孔洞222與第二孔洞223的排列方式）以及氣流 導引裝置260之管線的排列方式並不限定於圖3所示，以下將 另舉其他實施例來說明。 圖7是本發明另一實施例之一種基板翻轉平台的第一吸 附塾與第二吸附墊的排列方式以及氣流導引裝置的示意圖，圖 8是沿圖7的Π-Π ’線與ΙΠ-ΙΠ’線的剖面示意圖。請參照圖7 與圖8，在本實施例中第一孔洞222排列成多列，而第二孔洞 223亦排列成多列’且第一孔洞222排列而成的這些列與第二 孔洞223排成的這些列係交替設置。換言之，第一吸附勢24〇a 排列成多列’而第二吸附墊240b排列成多列，且第一吸附墊 240a排列而成的這些列與第二吸附墊240b排成的這些列係交 替設置。 在本實施例中’氣流導引裝置包括第一管線單元2 61與第 二管線單元263。第一管線單元261包括一個第一真空導管 261a與複數根第一真空支管261b。第一真空導管261a伸入翻 轉架220内部，且延伸至第一孔洞222下方’而第一真空支管 261b位於第一支撐管23〇a内。這些第一真空支管261b的一 端連接至第一真空導管261a，另一端經由第一孔洞222沿第 一支撐管230a的延伸方向延伸至第一吸附墊240a。另外，第 二管線單元263包括—個第二真空導管263a與複數根第二真 空支管263b。第二真空導管263a伸入翻轉架220内部，且延 15 201032956 伸至第二孔洞223下方。第二真空支管减位於第二 230b内第二真空支管263b的一端連接至第二真空導^ -263a，另一端經由第二孔洞223沿第二支撐管230b的延伸方 向延伸至第二吸附墊240b。 更詳細地說，上述之第一真空導管261a包括一第一基段 265a與連接此第一基段265a的多個第一延伸段26sb，且這此 第一延伸段265b的延伸方向與第一基段265a的延伸方向^ 同。第二真空導管263a包括一第二基段267a與連接此第二基 ❻段267a的多個第二延伸段267b。這些第二延伸段267b的延 伸方向與第二基段267a的延伸方向不同’且這些第一延伸段 265b與這些第二延伸267b段係交替設置。此外，第一基段265a 與第二基段267a相對’第一基段265a與第二基段267a沿一 第一方向A1延伸’而這些第一延伸段265b與這些第二延伸 段267b沿一第二方向A2延伸，且第一方向A1實質上垂直於 第二方向A2。 圖9是本發明另一實施例之一種基板翻轉平台的第一吸 附墊與第二吸附墊的排列方式以及氣流導引裝置的示意圖。請 參照圖9，本實施例之第一吸附塾240a與第二吸附替240b的 排列方式與圖3相似，差別處在於氣流導引裝置。具體而言， 在本實施例中第一真空導管261a的第一基段265a與第二真空 導管263a的第二基段267a相對，且分別彎折成L形。第一基 段265a與第二基段267a係沿一矩形軌跡R設置’而第一延伸 段265b與第二延伸段267b係沿一預定方向A3延伸，且此預 定方向A3不垂直於矩形軌跡R的任一邊。具體而言，預定方 向A3與矩形轨跡之間所夾的銳角0 1可為45度。 圖10是本發明另一實施例之一種基板翻轉平台的第一吸 16 201032956 附墊與第二吸附墊的排列方式以及氣流導弓丨裝置的示意圖。請 參照圖ίο，在本實施例中，第一真空導管261a的第一^段265a 係沿矩形執跡R之其中三邊彎折，而第二真空導管&如的第 二基段267a係部分或全部設置於矩形軌跡R内且彎折成u 形，且第二基段267a之相平行的兩邊係平行於第一基段26元 之相平行的兩邊。第一真空導管261a的第—延伸段與第 二真空導管263a的第二延伸段267b係位於矩形軌跡r内]第 一真空導管261a的第一延伸段265b例如是垂直於第一基段 ❹265a ’而第二真空導管263a的第二延伸段26几例如是垂 第二基段267a。第一吸附墊240a設置於第一真空導管261a 上方，而第二吸附墊240b設置於第二真空導管263a上方，且 第一吸附墊240a與第二吸附墊240b排成一陣列。 圖11是本發明另一實施例之一種基板翻轉平台的第一吸 附墊與第二吸附墊的排列方式以及氣流導引裝置的示意圖。請 參照圖11’在本實施例中’第一真空導管261a的第一基&段26% 係沿矩形軌跡R之其中三邊彎折，而第二真空導管263a的第 一基段267a係設置於矩形軌跡R内。第二基段267a包括平行 ® 第一基段265a之其中兩邊的二平行段269a以及連接於這些平 行段269a之間的一連接段269b，其中連接段26%不平行且 不垂直於這些平行段269a，且第一真空導管261a的第一延伸 段265b與第二真空導管263a的第二延伸段267b係位於矩形 轨跡R内。第一吸附墊240a設置於第一真空導管261a上方， 而第二吸附墊240b設置於第二真空導管263a上方，且第一吸 附墊240a與第二吸附墊240b排成一陣列。 圖12是本發明另一實施例之一種基板翻轉平台的第一吸 附墊與第二吸附墊的排列方式以及氣流導引裝置的示意圖。請 17 201032956 參照圖12 ’在本實施例中’第一真空導管261 a彎折形成具有 多個彎折處的螺旋狀’且第一真空導管261a之間有一螺旋狀 區域S。第二真空導管263a從位於螺旋狀區域S内的一端彎 折至位於螺旋狀區域S外的另一端，以形成具有多個彎折處的 螺旋狀’且第一真空導管261a與第二真空導管263a之彎折處 的彎折角度6>2為90度。第一吸附墊240a設置於第一真空導 管261a上方’而第二吸附墊240b設置於第二真空導管263a 上方’且第一吸附墊240a與第二吸附塾240b排成一陣列。 ❹ 上述各實施例中’若第一孔洞222的數量與第二孔洞223 的數量相同’則第一真空支管261b的長度與第二真空支管 263b的長度可為相同，以避免不必要的真空損耗。此外，若 第一孔洞222的數量大於第二孔洞223的數量，則第一真空支 管261b的長度可小於第二真空支管263b的長度，亦可避免不 必要的真空損耗。 圖13是本發明另一實施例之一種基板翻轉平台之部分第 一孔洞與第二孔洞的排列方式的示意圖。請參照圖13,本實 施例之第一孔洞222與第二孔洞223的排列方式是在第一孔洞 β 222與第二孔洞223所排成的陣列之任一 3*3陣列中，當位於 3*3陣列的中心為第一孔洞222時（如陣列Μ1)，此3*3陣 列Ml的周圍包括至少一個第一孔洞222。當第二孔洞223位 於3*3陣列的中心時（如陣列m2 )，此3*3陣列M2的周圍 包括至少一個第二孔洞223。需注意的是圖13中，陣列M1、 M2僅為舉例之用，第一孔洞222與第二孔洞223的排列方式 並不侷限於此。 圖14是本發明另一實施例之一種基板翻轉平台之第一孔 洞與第二孔洞的排列方式的示意圖。請參照圖14，在本實施 18 201032956 例中’以第一孔洞222與第二孔洞223所排成的陣列的幾何中 心C為原點定義出一直角座標系，使每一第一孔洞222與每一 第二孔洞223分別具有一座標值。這些第一孔洞222的座標值 之和為零，且這些第二孔洞223的座標值之和為零。需注意的 是，第一孔洞222與第二孔洞223的排列方式並不侷限於圖 14所示。 雖然本發明已以較佳實施例揭露如上，然其並非用以限定 本發明，本發明所屬技術領域中具有通常知識者，在不脫離本 ❹發明，巧神和範圍内，當可作些許之更動與潤飾，因此本發明 之保5蔓範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1A與圖1B是習知一種基板翻轉平台的俯視示意圖與 側視示意圖。 、 圖2A至圖2C是習知技術中將二基板組立的流程圖。 圖3是本發明—實施例之_種基板翻轉平台的俯視圖。 圖4是沿圖3中1-1’線的剖面示意圖。 圖5是氣流導引裝置的示意圖。 圖6A至圖6C是本發明—實施例之—種翻轉基 之流程圖。 圖7疋本發明另一實施例之一種基板翻轉平台的第一吸 附墊與第二吸附塾的排列方式以及氣流導引裝置的示意圖。 圖8是沿圖7的Π-Π’線與瓜-瓜，線的剖面示意圖。 圖9是本發明另一實施例之一種基板翻轉平台的第一吸 附墊與第二吸附墊的排列方式以及氣流導引裝置的示意圖。 圖10是本發明另一實施例之一種基板翻轉平台的第一吸 附塾與第二吸附墊的排列方式以及氣流導引裳置的示意圖。 19 201032956 圖11是本發明另一實施例之一種基板翻轉平台的第一吸 附墊與第二吸附墊的排列方式以及氣流導引裝置的示意圖。 圖12是本發明另一實施例之一種基板翻轉平台的第一吸 附墊與第二吸附墊的排列方式以及氣流導引裝置的示意圖。 圖13是本發明另一實施例之一種基板翻轉平台之部分第 一孔洞與第二孔洞的排列方式的示意圖。 圖14是本發明另一實施例之一種基板翻轉平台之第一孔 洞與第二孔洞的排列方式的示意圖。 ^ 【主要元件符號說明】 10、20、30、40 :機械手臂 12、22、32、42 :吸附墊 50、60、80 :基板 52 :背面 54 :彩色濾光層 62 :驅動電路層 70 :框膠 100、200 :翻轉平台 ⑩ 110、220:翻轉架 112 :表面 114 :支撐管 116 :吸附墊 117 :孔洞 120、210 :固定架 211 :吸附面 222 :第一孔洞 223 :第二孔洞 20 201032956 224 :封閉框 225 :中空柱 230a : 230b ： 240a ： 240b ： 242 ： 250a : 250b 226 :樞接部 第一支撐管 :第二支撐管 :第一吸附墊 :第二吸附墊 第三孔洞 :第一負壓源 :第二負壓源 260 :氣流導引裝置 261、262 :第一管線單元 261a :第一真空導管 261b :第一真空支管 262a:第一管線 262b :第二管線 262c :第三管線 ⑩ 263、264 :第二管線單元 263a :第二真空導管 263b :第二真空支管 264a :第四管線 264b:第五管線 264c :第六管線 265a :第一基段 265b :第一延伸段 267a :第二基段 21 201032956 267b :第二延伸段 269a :平行段 269b :連接段 270a :第一控制閥 270b :第二控制閥 A1 :第一方向 A2 :第二方向 A3 :預定方向 C :幾何中心 D1 :第一距離 D2 :第二距離 Ds :最小距離 Ml、M2 : 3*3 陣列 0 1 :夾角 0 2 :彎折角度BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flipping platform ′ and particularly to a substrate flipping platform for absorbing a substrate and flipping a substrate, and a method for flipping the substrate ‘ therefor. [Prior Art] With the advancement of liquid crystal display technology and the advantages of light weight and small size of liquid crystal display devices, liquid crystal display devices have been widely used in various electronic products such as digital cameras and personal digital assistants. , PDA), mobile phones, notebook computers, and flat-panel TVs. The liquid crystal display device includes a liquid crystal display panel and a backlight module. The liquid crystal display panel is composed of a two substrate and a liquid crystal layer between the two substrates. In the process of assembling the two substrates, one of the substrates is first turned over by the flipping platform, and then the substrate is assembled. 1A and 1B are a top plan view and a side view of a conventional substrate flipping platform. Referring to FIG. 1A and FIG. 1B, the conventional substrate flipping platform 1 includes a flip frame 110 and a mounting frame 12'', and the flip frame 110 is pivotally connected to the mounting frame 110. A plurality of support tubes 114 are disposed on the surface 112 of the flip frame 110. Each of the support tubes 114 is provided with an adsorption pad 116 at the top end thereof, and each of the adsorption pads 116 has a hole 117. In addition, the inside of the flip frame 11 is hollow, and the inside of the flip frame 11 is provided with a plurality of pipelines (the lines of the pipelines are not shown to extend through the branch pipe 114 to the hole ip of the adsorption αία, and the other end is connected to The main line ' is connected to the vacuum source outside the flip frame 11 through the main line. Thus, when the vacuum source is turned on, the adsorption crucible 116 can be used to adsorb the substrate. FIG. 2A to FIG. 2C are two substrates in the prior art. The assembled flow chart is shown in FIG. 2A. The substrate assembly process of the prior art is used to carry the substrate 50, wherein the robot arm H) has more 4 201032956 to adsorb the back surface 52 of the substrate 50, and the substrate 5〇 is positive: 4 is followed by = The arm 10 places the substrate 5°: adsorption: two sides = true two: after: _16 comes after one 'please refer to FIG. 2B, flip the flip frame 11 〇 18 〇. So that the back side of =Γ is sucked by the red pad 22 of the other mechanical arm 2G to absorb the red surface 52 of the two substrates 50. Thereafter, the vacuum source substrate 50 is turned off. The error is then moved by the robot arm 20, then, referring to FIG. 2C, the substrate 50 is moved to the other side, wherein the front surface of the substrate 60 is formed with a driving circuit layer & and the frame 跋 70 is coated, and the color filter layer 54 of the substrate 50 is formed. The substrate circuit 60 is assembled with the substrate circuit 60, and the substrate 50 and the substrate 60 are bonded by the sealant 70. σ main, since the pipeline disposed inside the flip frame 110 is connected to the same vacuum source through the main S line, when the contact surface of the vacuum t, m has fine particles, it is easy to cause suction _ two suction === this When the substrate 50 is turned over, it is easy to generate a vacuum and drop. This not only loses the substrate 50, but also stops the cleaning operation of the entire system. Therefore, (four) time cost. SUMMARY OF THE INVENTION In the process of turning off the substrate, the substrate is turned over, and the substrate is flipped. The method of flipping the substrate is also provided to prevent the substrate from falling during the flipping process. (4) The above advantages are achieved. The present invention proposes a substrate flipping platform for absorbing a substrate and flipping the substrate. The substrate flipping platform includes a fixing frame, a flip frame and a gas 201032956 flow guiding device. The flip frame is pivotally connected to the fixed frame, and the inside of the flip frame is hollow. The flip frame has an adsorption surface adapted to adsorb the substrate, and the adsorption surface is provided with gold = a hole and a plurality of second holes. The airflow guiding device includes a first pipeline unit and a second pipeline unit. One end of the first pipeline unit extends into the interior of the flip frame and extends into the first hole, and one end of the second pipeline unit extends into the interior of the flip frame and extends to the second hole, and the first pipeline unit and the second pipeline unit are independent of each other. They are not connected to each other. In order to achieve the above advantages, the present invention further provides a substrate flipping platform, which comprises a fixing frame, a flip frame, a plurality of first adsorption pads, a plurality of second adsorption pads, a first negative pressure source and a second negative pressure source. The flip frame is pivotally connected to the mounting frame, and the first adsorption pad and the second adsorption pad are arranged in a matrix and alternately arranged on the flip frame. The first negative pressure source is coupled to the first adsorption pad and the second negative pressure source is coupled to the second adsorption pad. To achieve the above advantages, the present invention provides a method of flipping a substrate comprising the steps of: first providing the substrate flipping platform and substrate described above. Next, the substrate is loaded on the flip frame. Thereafter, the first negative pressure source is driven to cause the first adsorption pad to adsorb the substrate. Then, 18〇. Flip the flip frame and the substrate. In the substrate flipping platform of the present invention, since the flip frame is connected to different 10 sources, when the negative pressure provided by one of the negative pressure sources fails, the negative pressure provided by another negative pressure source can also be used. To adsorb the substrate, the probability of the substrate falling down during the process is reduced. In addition, the method for inverting the substrate of the present invention can prevent the substrate from being turned over during the inversion process, so that the above and other objects, features and advantages of the present invention are more apparent. The embodiments, in conjunction with the drawings, are described in detail below. [Embodiment] 4 e, vf 3 is a top view of a substrate flipping platform of the present invention - an embodiment, a cross-sectional view of a line 1-1 in the mouth of FIG. 3, and FIG. 5 is a schematic view of the airflow guiding device 201032956 . Referring to FIG. 3 to FIG. 5, the substrate flipping platform 200 of the embodiment is used for adsorbing a substrate and flipping the substrate. The substrate flipping platform 2 includes a holder 210 and a flip frame 220. The flip frame 220 is pivotally connected to the fixing frame 210, and the inside of the flip frame 220 is hollow. The flip frame 220 has an adsorption surface 211 adapted to adsorb the substrate, and the adsorption surface 211 is provided with a plurality of first holes 222 and a plurality of second holes 223. The flip frame 220 includes, for example, a closed frame 224 and a plurality of hollow columns 225. The inside of the closed frame 224 and the hollow column 225 is hollow, and the hollow column 225 is connected to the closed frame 224. The inner space of each hollow column 225 is in communication with the inner space of the closed frame 224 ,, and the above-mentioned adsorption surface 211 is constituted, for example, by the surfaces of the hollow columns 225 facing the same side. In addition, the closed frame 224 has a rotating shaft, and the rotating shaft includes two opposite pivoting portions 226. The two pivoting portions 226 are located on opposite sides of the sealing frame 224 and are pivotally connected to the fixing frame 21A. In addition, each of the hollow columns 225 is provided with a first hole 222 and a second hole 223. The first hole 222 and the second hole 223 of each hollow column 225 are, for example, aligned along the extending direction of the hollow column 225, and the first hole 222 and the second hole 223 are alternately arranged. The substrate flipping platform 200 described above may further include a plurality of support tubes, such as a plurality of first support tubes 230a and a plurality of second support tubes 230b. One end of the first support tube 230a is respectively connected to one first hole 222, and one end of the second support tube 230b is respectively connected to a second hole 223, and the first support tube 230a and the second support tube 230b are, for example, along the hollow column. The extending direction of the 225 is aligned, and the first support tube 230a and the second support tube 230b are alternately disposed. In addition, the substrate flipping platform 200 may further include a plurality of adsorption pads, such as a plurality of first adsorption pads 240a and a plurality of second adsorption pads 240b. The first adsorption pad 240a and the second adsorption pad 240b respectively have a third hole 242. The first adsorption pad 24〇& is sleeved on the other end of the first support tube 230a, and the third hole 242 of the first adsorption pad 240a communicates with the corresponding first hole 222 through the first support tube 230a. The second suction hole 240b is sleeved on the other end of the second support tube 230b, and the third hole 242 of the second adsorption pad 240b is communicated with the corresponding second hole 223 through the second support tube 23Ob. In the above, the first adsorption pad 240a and the second adsorption pad 240b are arranged in a matrix and alternately arranged on the flip frame 220. In more detail, in each row of the array, the first adsorption pad 240a and the second adsorption pad 240b are alternately disposed, and in each column of the array, the first adsorption pad 240a and the second adsorption pad 240b are alternated. Settings. In other words, the first holes 222 and the second holes 223 on the adsorption surface 211 are arranged in an array 'and in each row of the array, the first holes 222 and the second holes 223 are alternately arranged, in each column of the array, The first hole 222 and the second hole 223 are alternately arranged. Further, each of the first adsorption pad 240a and the second adsorption pad 240b has a suction pad diameter, and the adsorption pad diameter ranges, for example, between 20 mm and 32 mm. Further, there is a minimum distance Ds between the adjacent first adsorption pad 240a and the second adsorption pad 240b, and the range of the minimum distance Ds is, for example, between 12 cm and 29 cm. There is a first distance D1 between adjacent first adsorption ports 240a, and the first distance D1 is greater than the minimum distance Ds. B has a second distance D2 between adjacent second adsorption pads 240b, and the second distance D2 is greater than the minimum distance Ds. Specifically, the range of the first distance D1 is, for example, between 35 cm and 45 cm, and the range of the second distance D2 is, for example, between 35 cm and 45 cm. The substrate inversion platform 200 of the present embodiment may further include a first negative pressure source 250a and a second negative pressure source 250b. The first negative pressure source 250a and the second negative pressure source 250b are, for example, vacuum sources. The first negative pressure source 250a is connected to the first adsorption pad 240a' and the second negative pressure source 250b is connected to the second adsorption pad 240b. The substrate flipping platform 200 may further include a gas flow guiding device 260, and the first adsorption pad 240a and the second adsorption pad 240b are connected to the first negative 8 201032956 pressure source 250a and the second negative pressure source 250b through the airflow guiding device 260. . Specifically, the airflow guiding device 26 includes a first pipeline unit 262 and a second pipeline unit 264, wherein the first adsorption pad 240a is connected to the first negative pressure source 25A through the first pipeline unit 262, and The second adsorption pad 24〇b is connected to the second negative pressure source 250b through the second line unit 264. One end of the first pipeline unit 262 is connected to the first negative pressure source 250a through the first control valve 27〇, and the other end extends into the inside of the flip frame 22 and extends to the first hole 222, and passes through the first hole. 222 and the first support tube 230a extend to the third hole 242 of the first adsorption pad 240a. One end of the second pipeline unit 264 is connected to the second negative pressure source MOb through the second control valve 270b, and the other end extends into the inside of the flip frame 22 and extends to the second hole 223, and is connected to the second hole 223 via the first hole 223. The second branch pipe 23Qb extends to the third hole 242 of the second adsorption port 240b. Further, the first line unit 262 and the second line unit 264 are independent of each other and are not in communication with each other. The first control room 27 as described above and the second control valve 270b are, for example, solenoid valves. • The first line unit 262 described above includes a first line 262a, a plurality of lines 262b, a plurality of third tubes, and a line 262c. An end of the first line 262a, φ $ , is connected to the first negative pressure source 25〇a through the first control valve, and is closed at the other end. One end of each of the second lines (4) is connected to the first line ^ a ' and the other end is extended into the hollow column 225 β and extends along the extension of the hollow column 225. The third pipeline green is located in the first support pipe 2 and each of the first pipe and the line 262c is connected to the corresponding second pipeline, and extends to the first direction through the extension direction of the first 222 - Adsorption pad 4 2, first hole f 242. Further, the second pipeline unit 264 described above includes a & total 204a, a fifth root line 26 of her root, and a plurality of sixth pipelines. The -end of the -= line 264a is connected to the first negative pressure source 25Gb, for example, through the second control port 2, and the other 1 is inserted into the closed frame (10). One end of each of the fifth line ports 201032956 is connected to the fourth line 264a' and the other end is extended into a hollow column 2 and extends in the extending direction of the hollow column 225. The first guardian of its OQnuh ^ brother, the official line 264c is located in the second branch and the second and second pipelines 264. One end is connected to the corresponding fifth tube ίΓΓνί hole 223, and extends along the extending direction of the second tube duct to the third hole 242 of the #2 adsorption port. In addition, the interior of the pivoting portion 226 is, for example, a middle*, and the first first pipeline unit 262 and the second second cable are 7L 264, for example, via at least one of the two pivoting portions 226. 220 internal. In other words, the first line unit 262 and the second tube = early = 64 may extend into the flip frame via the interior of the same portion 226 or may extend into the flip frame through the interior of the different pivot portion 226. In the above, the first-line 262a is, for example, a first main vacuum hose, and each of the first-line 262b is, for example, a -th-those hose, and the ride-third 262c is, for example, a first-end tube. These second pipelines are, for example, parallel to each other, and such a fresh record 262e is, for example, a slogan. Further, the fourth line 264a is, for example, a second main vacuum hose, and each of the fifth lines is a second branch vacuum hose, and each of the sixth lines 26 is, for example, a second final vacuum hose. These fifth lines 264b are, for example, parallel to each other, and the sixth lines 264c are, for example, parallel to each other. In the substrate inversion platform 200 of the embodiment, the first adsorption pad 240a and the second adsorption pad 240b for adsorbing the substrate are connected to different negative pressure sources, so when one of the negative pressure sources is abnormal or due to the adsorption pad and the substrate When there is a microparticle between the contact faces, and one of the negative pressure sources fails, the substrate can be adsorbed by the negative pressure provided by another negative pressure source. This can reduce the probability of the substrate falling when the flip frame 22 is turned over. . Since the substrate flipping platform 200 of the embodiment can suck the substrate only by the first adsorption sound 240a or only by the second adsorption pad 240b, if the first suction 201032956 attaches the pad 240a or the second adsorption pad 240b The adsorption force is w, and the required adsorption force of the substrate is F, the theoretical adsorption force W of the first adsorption pad 240a or the second adsorption pad 240b needs to be greater than or equal to twice the adsorption force F required by the substrate, that is, w ^ 2xF. Thus, when one of the negative pressure sources fails, the substrate can be adsorbed by the negative pressure provided by another negative pressure source. According to the above, the theoretical adsorption force W of any of the first adsorption pads 240a or the second adsorption pad 240b is W = |PBu Sx(u, where p is the first negative pressure source 25〇a or the first negative pressure The negative pressure provided by the source 250b, § is the area of any one of all or all of the second adsorption pads 240b of the first adsorption 塾24〇a®. In the present embodiment, the range of the theoretical adsorption force W is, for example, Between 24 and 39, the range of negative pressure P is, for example, between -50 kPa and -80 kPa, and the range of area s is, for example, between 3 and 8 square centimeters. In addition, if the weight of the substrate is Μ, the required safety factor is 8, and the total number of all the first adsorption pads 240a and the second adsorption pads 240b is Ν, the required adsorption force of the above substrate F = (M/ N)x8. In the present embodiment, the range of the adsorption force F required for the substrate is, for example, between 9 and 11, and the weight of the substrate is μ, for example, between 100 and 105, and The total number N of the first adsorption pad 24A and the second adsorption pad 240b is, for example, between 72 and 88. Hereinafter, a practical example will be used to illustrate the present invention. The substrate flipping platform 200 of the embodiment can still hold the substrate when one of the negative pressure sources fails. If the total number N of the first adsorption pad 240a and the second adsorption pad 24〇b of the substrate inversion platform 200 is 80, the substrate is The glass substrate has a density of 2 69 g/cm 3 and its size is 220 cm χ 250 cm χ θ. 07 cm, and the weight of the substrate is 10356.65 g, which is about 101.6 Newtons, so the required adsorption force F of the substrate is equal to 10.16. Newton. In other words, the adsorption force required for each first adsorption 塾24〇a or each second adsorption pad 240b needs to be greater than or equal to 1〇16 201032956 Newtons. Table 1 疋 adsorption pad (ie, the first adsorption pad 24〇a The value of the theoretical adsorption force with the second adsorption pad 24〇b) under different parameters, unit Coton (N). --^ Adsorption pad diameter (mm) φ 13 --------- φ 16 - ----- φ 20 φ25 φ32 φ 40 φ 50 Adsorption pad (cm2) Area 1.33 2.01 3.14 4.01 8.04 12.6 19.6 -85 11.3 17.1 26.7 41.7 68.3 107 167 -80 10.6 16.1 25.1 39.3 64.3 101 157 -75 9.98 15.1 23.6 36.8 60.3 94.5 147 -70 9.31 14.1 22.0 34.4 56.3 88.2 137 Negative pressure -65 8.65 13,1 20.4 31.9 52.3 81.9 127 (kPa) -60 7.98 12.1 18.8 29.5 48.2 75.6 118 -55 7.32 11.1 ... ,, 17.3 27.0 44.2 69.3 108 -50 6.65 10.1 15.7 24.6 40.2 63.0 96.0 -45 5.99 9.05 14.1 22.1 36.2 56.7 88.2 -40 5.32 8.04 12.6 19.6 32.2 50.4 78.4 As shown in Table 1, if the negative pressure P provided by the first negative pressure source 250a and the second negative pressure source 25〇b is -50 kPa, and all Any one or all of the second adsorption pads 240b of the first adsorption enthalpy 240a have a diameter of 25 mm and an area s of 4.01 cm 2 , and any one of the first adsorption pads 240a or the second adsorption pad 240b The theoretical adsorption force w of either is equal to 24.6 Newtons. Since the theoretical adsorption force W of any one of the first adsorption pads 240a or the second adsorption pad 24〇b is 24.6, the required adsorption force f of the substrate is only 12 201032956 10.16, so even one of the negative pressure sources In failure, the substrate flipping platform 200 of the embodiment can still hold the substrate. It is worth mentioning that when the theoretical adsorption force W is 24.6, the safety margin is about 2.4 (ie 24.6/10.16) times, so a double vacuum source can be used. By analogy, when the safety margin is more than 3 times, a triple vacuum source or a double vacuum source can be used. For example, if the adsorption enthalpy is used to directly hold Φ 32 mm and the negative pressure is _4 〇 to -85 kPa, the theory of adsorption enthalpy is adopted. The adsorption force W can be greater than 3 times the safety margin. When the safety margin is more than 4 times, four vacuum sources, three vacuum sources or double vacuum sources can be used. For example, if the adsorption pad diameter is less than 32 mm and the negative pressure is _5 〇 to -85 kPa, the theory of the adsorption pad is used. The adsorption force W can be greater than 4 times the safety margin. Therefore, the number of vacuum sources should be less than the safety margin, and the safety margin is at least 2, and the present invention does not impose other restrictions on the number of vacuum sources. Therefore, in another embodiment, the adsorption surface 211 of the substrate flipping platform 2 can be further provided with a plurality of fourth holes (not shown), and the air flow guiding device 260 can further include a third pipeline. The unit (not shown) has one end extending into the flip frame=inside and extending to the fourth hole m line unit 262 and the second line, and the unit 264 and the second line unit are independent of each other and are not in communication with each other. In addition, the adsorption surface 211 can also be provided with a plurality of fifth holes (not shown), and the air flow guiding device 26 further includes a fourth pipeline unit (not shown), which extends into the flip frame 22 4 and extending to the fifth hole, the first pipeline unit 262, the second pipeline unit 264, and the 'tube: the line unit and the fourth pipeline unit are independent of each other and are not in communication with each other. Since the third pipeline unit and the fourth pipeline unit are similar to the first pipeline unit 7L 262 “the second pipeline unit 264 described above, the general knowledge in the technical field is published after referring to the book, so there is a county. The embodiment of the plate turning platform having a hole (even with a fifth hole) and a third line unit (even with a fourth line unit) will not be illustrated. 13 201032956 FIG. 6A to FIG. 6C are flowcharts showing a method of flipping a substrate according to an embodiment of the present invention. Referring to FIG. 6A, the method for flipping the substrate in this embodiment is to first provide the substrate flipping platform 200 and the substrate 80, and then load the substrate 8 onto the flip frame 220. In this embodiment, the substrate 8 is carried by the robot arm 3, and the substrate 80 is placed on the first adsorption pad 240a and the second adsorption pad 24〇b. The robot arm 30 has a plurality of adsorption pads 32, which are It is used to adsorb the substrate 8〇. Thereafter, the first negative pressure source 250a' is driven and the first control valve 27a is opened to cause the first adsorption pad 240a to adsorb the substrate 80 and remove the robot arm 30. ❹ Next, as shown in Fig. 6B, 180. The flip frame 220 is flipped over with the substrate 80. Referring to FIG. 6C, the method of flipping the substrate of the present embodiment may further include cutting or closing the first negative pressure source 250a such that the first adsorption pad 240a no longer adsorbs the substrate 80, wherein the first negative pressure source 250a is cut off. The method is, for example, closing the first control valve 270a. Next, the substrate 8 is unloaded from the flip frame 220. Specifically, in this embodiment, the substrate can be adsorbed by the adsorption pad 42 of the robot arm 40. Thereafter, the first negative pressure source 250a is cut or closed, and the substrate 80 is removed by the robot arm 40. The above method of flipping the substrate may further comprise driving the second negative pressure source 250b and opening the first control valve 270b to cause the second adsorption 塾 240b to adsorb the substrate 80. In addition, the method of flipping the substrate may further include cutting or turning off one of the first negative pressure source 250a and the second negative pressure source 250b such that one of the first adsorption pad 240a and the second adsorption pad 240b is no longer The substrate 80 is adsorbed, and then the substrate 80 is unloaded from the flip frame 220. The above method of cutting off or closing one of the first negative pressure source 250a and the second negative pressure source 250b is, for example, intentionally closing one of the first control valve 270a and the second control valve 270b, or the first negative pressure source 250a. And one of the second negative pressure source 250b or one of the first control valve 270a and the second control valve 270b is unintentionally or unexpectedly failed. 14 201032956 The method for flipping the substrate of the embodiment can simultaneously adsorb the substrate by the first adsorption pad 240a and the second adsorption pad 2401 connected to different negative pressure sources, and when one of the negative pressure sources fails, the method can still be borrowed. The substrate 80 is adsorbed by a negative pressure provided by another negative pressure source to prevent the substrate 80 from falling during the inversion process. In the present invention, the arrangement of the first adsorption pad 240a and the second adsorption pad 24〇b (that is, the arrangement of the first hole 222 and the second hole 223) and the arrangement of the pipeline of the airflow guiding device 260 are not limited. As shown in FIG. 3, other embodiments will be described below. 7 is a schematic view showing the arrangement of the first adsorption enthalpy and the second adsorption pad of the substrate flipping platform and the airflow guiding device according to another embodiment of the present invention, and FIG. 8 is a line along the Π-Π' line of FIG.剖面' schematic diagram of the line. Referring to FIG. 7 and FIG. 8 , in the embodiment, the first holes 222 are arranged in a plurality of rows, and the second holes 223 are also arranged in a plurality of columns ′ and the first holes 222 are arranged and the second holes 223 are arranged. These columns are alternately set. In other words, the first adsorption potentials 24〇a are arranged in a plurality of columns 'the second adsorption pads 240b are arranged in a plurality of columns, and the columns in which the first adsorption pads 240a are arranged alternate with the columns arranged in the second adsorption pads 240b. Settings. In the present embodiment, the air flow guiding means includes a first line unit 2 61 and a second line unit 263. The first line unit 261 includes a first vacuum conduit 261a and a plurality of first vacuum manifolds 261b. The first vacuum conduit 261a extends into the interior of the flip frame 220 and extends below the first aperture 222' and the first vacuum manifold 261b is located within the first support tube 23〇a. One end of these first vacuum manifolds 261b is connected to the first vacuum conduit 261a, and the other end extends through the first holes 222 in the extending direction of the first support tube 230a to the first adsorption pad 240a. Further, the second line unit 263 includes a second vacuum conduit 263a and a plurality of second vacuum manifolds 263b. The second vacuum conduit 263a extends into the interior of the flip frame 220 and extends 15 201032956 below the second aperture 223. The second vacuum branch pipe is located in the second 230b. One end of the second vacuum branch pipe 263b is connected to the second vacuum guide 263a, and the other end is extended to the second adsorption pad 240b via the second hole 223 along the extending direction of the second support pipe 230b. . In more detail, the first vacuum conduit 261a includes a first base segment 265a and a plurality of first extension segments 26sb connected to the first base segment 265a, and the first extension segment 265b extends in the first direction. The extension direction of the base section 265a is the same. The second vacuum conduit 263a includes a second base section 267a and a plurality of second extensions 267b that connect the second base section 267a. The second extensions 267b extend in a direction different from the direction in which the second base segments 267a extend, and the first extensions 265b are alternately disposed with the second extensions 267b. In addition, the first base segment 265a and the second base segment 267a are opposite to each other, 'the first base segment 265a and the second base segment 267a extend along a first direction A1', and the first extension segment 265b and the second extension segment 267b are along a The second direction A2 extends, and the first direction A1 is substantially perpendicular to the second direction A2. FIG. 9 is a schematic view showing the arrangement of the first adsorption pad and the second adsorption pad of the substrate inversion platform and the airflow guiding device according to another embodiment of the present invention. Referring to FIG. 9, the first adsorption enthalpy 240a and the second adsorption detachment 240b of the present embodiment are arranged in a similar manner to FIG. 3, and the difference lies in the airflow guiding device. Specifically, in the present embodiment, the first base section 265a of the first vacuum duct 261a is opposed to the second base section 267a of the second vacuum duct 263a, and is bent into an L shape, respectively. The first base segment 265a and the second base segment 267a are disposed along a rectangular trajectory R, and the first extension segment 265b and the second extension segment 267b extend along a predetermined direction A3, and the predetermined direction A3 is not perpendicular to the rectangular trajectory R. Either side. Specifically, the acute angle 0 1 between the predetermined direction A3 and the rectangular track may be 45 degrees. FIG. 10 is a schematic view showing the arrangement of the first suction 16 201032956 attachment pad and the second adsorption pad and the air flow guiding device according to another embodiment of the present invention. Referring to the figure, in the embodiment, the first segment 265a of the first vacuum conduit 261a is bent along three sides of the rectangular trace R, and the second vacuum conduit & second base segment 267a is Part or all of it is disposed in the rectangular trajectory R and is bent into a u shape, and the two parallel sides of the second base segment 267a are parallel to the two parallel sides of the first base segment 26 element. The first extension of the first vacuum conduit 261a and the second extension 267b of the second vacuum conduit 263a are located within the rectangular trajectory r] the first extension 265b of the first vacuum conduit 261a is, for example, perpendicular to the first base segment ❹265a' The second extension 26 of the second vacuum conduit 263a is, for example, a second base section 267a. The first adsorption pad 240a is disposed above the first vacuum conduit 261a, and the second adsorption pad 240b is disposed above the second vacuum conduit 263a, and the first adsorption pad 240a and the second adsorption pad 240b are arranged in an array. Figure 11 is a schematic view showing the arrangement of the first and second adsorption pads of the substrate reversing platform and the airflow guiding device according to another embodiment of the present invention. Referring to FIG. 11 'in the present embodiment, 'the first base portion of the first vacuum conduit 261a 26% is bent along three sides of the rectangular trajectory R, and the first base portion 267a of the second vacuum conduit 263a is Set in the rectangular track R. The second base segment 267a includes two parallel segments 269a on either side of the parallel® first base segment 265a and a connecting segment 269b coupled between the parallel segments 269a, wherein the connecting segments 26% are non-parallel and are not perpendicular to the parallel segments 269a, and the first extension 265b of the first vacuum conduit 261a and the second extension 267b of the second vacuum conduit 263a are located within the rectangular trajectory R. The first adsorption pad 240a is disposed above the first vacuum conduit 261a, and the second adsorption pad 240b is disposed above the second vacuum conduit 263a, and the first adsorption pad 240a and the second adsorption pad 240b are arranged in an array. Figure 12 is a schematic view showing the arrangement of the first and second adsorption pads of the substrate inversion platform and the airflow guiding device according to another embodiment of the present invention. Referring to Fig. 12' in the present embodiment, the first vacuum duct 261a is bent to form a spiral shape having a plurality of bends, and a spiral region S is formed between the first vacuum ducts 261a. The second vacuum conduit 263a is bent from one end located in the spiral region S to the other end located outside the spiral region S to form a spiral shape having a plurality of bends and the first vacuum conduit 261a and the second vacuum conduit The bending angle 6 > 2 at the bend of 263a is 90 degrees. The first adsorption pad 240a is disposed above the first vacuum conduit 261a and the second adsorption pad 240b is disposed above the second vacuum conduit 263a and the first adsorption pad 240a and the second adsorption buffer 240b are arranged in an array. ❹ In the above embodiments, 'if the number of the first holes 222 is the same as the number of the second holes 223', the length of the first vacuum branch pipe 261b and the length of the second vacuum branch pipe 263b may be the same to avoid unnecessary vacuum loss. . Further, if the number of the first holes 222 is larger than the number of the second holes 223, the length of the first vacuum branch pipe 261b may be smaller than the length of the second vacuum branch pipe 263b, and unnecessary vacuum loss may be avoided. FIG. 13 is a schematic diagram showing the arrangement of a portion of a first hole and a second hole of a substrate flipping platform according to another embodiment of the present invention. Referring to FIG. 13, the first hole 222 and the second hole 223 of the embodiment are arranged in any 3*3 array of the array arranged by the first hole β 222 and the second hole 223. *3 When the center of the array is the first hole 222 (such as the array Μ1), the periphery of the 3*3 array M1 includes at least one first hole 222. When the second hole 223 is located at the center of the 3*3 array (e.g., array m2), the periphery of the 3*3 array M2 includes at least one second hole 223. It should be noted that in FIG. 13, the arrays M1 and M2 are for example only, and the arrangement of the first holes 222 and the second holes 223 is not limited thereto. FIG. 14 is a schematic diagram showing the arrangement of a first hole and a second hole of a substrate flipping platform according to another embodiment of the present invention. Referring to FIG. 14 , in the example of the embodiment 18 201032956, 'the geometric center C of the array arranged by the first hole 222 and the second hole 223 defines a right angle coordinate system, so that each first hole 222 and Each of the second holes 223 has a nominal value. The sum of the coordinate values of the first holes 222 is zero, and the sum of the coordinate values of the second holes 223 is zero. It should be noted that the arrangement of the first holes 222 and the second holes 223 is not limited to that shown in FIG. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention, and those of ordinary skill in the art to which the present invention pertains may be made without departing from the scope of the invention. It is intended to be modified and retouched, and therefore the scope of the invention is defined by the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A and FIG. 1B are schematic top and side views of a conventional substrate flipping platform. 2A to 2C are flowcharts showing the assembly of two substrates in the prior art. 3 is a plan view of a substrate flipping platform of the present invention. Figure 4 is a cross-sectional view taken along line 1-1' of Figure 3. Figure 5 is a schematic illustration of a gas flow guiding device. 6A through 6C are flow charts of a flipping base of the present invention - an embodiment. Fig. 7 is a schematic view showing the arrangement of the first adsorption pad and the second adsorption raft of the substrate reversing platform and the air flow guiding device according to another embodiment of the present invention. Fig. 8 is a schematic cross-sectional view taken along line Π-Π' of Fig. 7 and melon-cucumber. FIG. 9 is a schematic view showing the arrangement of the first adsorption pad and the second adsorption pad of the substrate inversion platform and the airflow guiding device according to another embodiment of the present invention. FIG. 10 is a schematic view showing the arrangement of the first and second adsorption pads of the substrate inversion platform and the airflow guiding skirt according to another embodiment of the present invention. 19 201032956 FIG. 11 is a schematic view showing the arrangement of the first adsorption pad and the second adsorption pad of the substrate inversion platform and the airflow guiding device according to another embodiment of the present invention. Figure 12 is a schematic view showing the arrangement of the first and second adsorption pads of the substrate inversion platform and the airflow guiding device according to another embodiment of the present invention. FIG. 13 is a schematic diagram showing the arrangement of a portion of a first hole and a second hole of a substrate flipping platform according to another embodiment of the present invention. FIG. 14 is a schematic diagram showing the arrangement of a first hole and a second hole of a substrate flipping platform according to another embodiment of the present invention. ^ [Main component symbol description] 10, 20, 30, 40: Robot arm 12, 22, 32, 42: adsorption pad 50, 60, 80: substrate 52: back surface 54: color filter layer 62: drive circuit layer 70: Frame glue 100, 200: flip platform 10 110, 220: flip frame 112: surface 114: support tube 116: adsorption pad 117: hole 120, 210: holder 211: adsorption surface 222: first hole 223: second hole 20 201032956 224: closed frame 225: hollow column 230a: 230b: 240a: 240b: 242: 250a: 250b 226: pivotal first support tube: second support tube: first adsorption pad: second adsorption pad third hole: First negative pressure source: second negative pressure source 260: air flow guiding device 261, 262: first pipeline unit 261a: first vacuum conduit 261b: first vacuum manifold 262a: first pipeline 262b: second pipeline 262c: Three pipelines 10 263, 264: second pipeline unit 263a: second vacuum conduit 263b: second vacuum manifold 264a: fourth pipeline 264b: fifth pipeline 264c: sixth pipeline 265a: first base section 265b: first extension 267a: second base section 21 201032956 267b: second extension section 269a: parallel section 269b: connection Section 270a: first control valve 270b: second control valve A1: first direction A2: second direction A3: predetermined direction C: geometric center D1: first distance D2: second distance Ds: minimum distance Ml, M2: 3 *3 Array 0 1 : Angle 0 2 : Bend angle