201029902 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種翻轉裝置，且特別是有關於一種用於 吸附基板並翻轉基板的翻轉裝置與翻轉基板的方法。 【先前技術】 隨者液晶顯不技術的進步加上液晶顯示裝置具有重量輕 且體積小等優點，液晶顯示裝置已廣泛地應用於多種電子產 品，如數位相機、個人數位助理（personal digital assistant， PDA)、行動電話、筆記型電腦（notebook computer)以及丰 ❹ 面薄型化電視等。液晶顯示裝置包括液晶顯示面板與背光模 組’其中液晶顯示面板是由二個基板以及位於此二個基板之間 的液晶層所構成。在將此二個基板組立的過程中，需先藉由翻 轉裝置將其中一個基板翻面，之後再進行基板的組立。 習知翻轉裝置具有固定架與翻轉架，其中翻轉架樞接於固 定架。翻轉架僅具有一個吸附面，其用以吸附基板。當翻轉架 的吸附面吸附基板且翻轉架沿預定方向翻轉18〇度時，被翻轉 架所吸附的基板會隨之翻轉180度，如此可將基板翻面。在將 ❹ 基板翻面後，可藉由機械手臂接收基板，以進行後續基板組立 製程。然而，由於翻轉架只有一個吸附面，所以在基板被機械 手臂移走後，需將翻轉架沿著與上述預定方向相反的方向翻轉 180度，以將翻轉架的吸附面歸位，來繼續吸附並翻轉另一基 板。如此，不僅浪費時間，且由於翻轉翻轉架時二 遂造成製造成本的增加。 胃“ 【發明内容】 本發明提供一種翻轉裝置，以避免浪費電能。 本發明錢供—_轉基㈣方法，轉升翻轉基板的效 201029902 為達上述優點，本發明提出一種翻轉裝置，其適於吸附基 板並翻轉此基板。此翻轉裝置包括翻轉架以及氣流導引單元。 翻轉架内部為中空，且翻轉架具有相對的第一吸附面與第二吸 附面，而第一吸附面與第二吸附面分別設有多個第一孔洞。氣 流導引單元包括控制模組、第一管線組以及第二管線組。第一 管線組的一端連接至控制模組，另一端伸入翻轉架内部並連接 至設於第一吸附面的第一孔洞。第二管線組的一端連接至控制 模組’另一端伸入翻轉架内部並連接至設於第二吸附面的第一 .孔洞。控制模組適於使第一吸附面及第二吸附面其中之一能吸 附基板，而翻轉架適於翻轉吸附於第一吸附面與第二吸附面其 中之一的基板。 、 在本發明之一實施例中，上述之翻轉架更具有多個支撐管 與用以吸附基板的多個吸附墊，且每一吸附墊具有第二孔洞。 支撐官的一端連接於第一孔洞，吸附墊套設於支撐管的另一 端，且第一管線組與第二管線組係經由第一孔洞與支撐管而連 接至第二孔洞。201029902 VI. Description of the Invention: [Technical Field] The present invention relates to an inverting device, and more particularly to a method for inverting a substrate and inverting a substrate and inverting the substrate. [Prior Art] With the advancement of liquid crystal display technology and the advantages of light weight and small size of liquid crystal display devices, liquid crystal display devices have been widely used in various electronic products such as digital cameras and personal digital assistants. PDA), mobile phones, notebook computers, and thin-screen TVs. The liquid crystal display device includes a liquid crystal display panel and a backlight module. The liquid crystal display panel is composed of two substrates and a liquid crystal layer between the two substrates. In the process of assembling the two substrates, one of the substrates is first turned by the flipping device, and then the substrate is assembled. The conventional turning device has a fixing frame and a turnover frame, wherein the turnover frame is pivotally connected to the fixing frame. The flip frame has only one adsorption surface for adsorbing the substrate. When the adsorption surface of the flip frame adsorbs the substrate and the flip frame is flipped by 18 degrees in a predetermined direction, the substrate adsorbed by the flip frame is flipped by 180 degrees, so that the substrate can be turned over. After the 基板 substrate is turned over, the substrate can be received by the robot arm for subsequent substrate assembly process. However, since the flip frame has only one adsorption surface, after the substrate is removed by the robot arm, the flip frame needs to be flipped 180 degrees in the opposite direction to the predetermined direction to return the adsorption surface of the flip frame to continue the adsorption. And flip the other substrate. In this way, not only is time wasted, but also the manufacturing cost is increased due to the fact that the flip frame is flipped over. [Summary of the Invention] The present invention provides a turning device to avoid wasting electric energy. The present invention provides a turning device, which is suitable for the above advantages, in order to achieve the above advantages. The substrate is adsorbed and the substrate is inverted. The turning device comprises a flip frame and an air flow guiding unit. The inside of the flip frame is hollow, and the flip frame has opposite first and second adsorption faces, and the first adsorption surface and the second The adsorption surface is respectively provided with a plurality of first holes. The airflow guiding unit comprises a control module, a first pipeline group and a second pipeline group. One end of the first pipeline group is connected to the control module, and the other end is inserted into the interior of the turnover frame. The first pipeline is connected to the first hole provided on the first adsorption surface. One end of the second pipeline group is connected to the control module and the other end extends into the interior of the flip frame and is connected to the first hole provided in the second adsorption surface. Preferably, one of the first adsorption surface and the second adsorption surface can adsorb the substrate, and the flip frame is adapted to invert the substrate adsorbed on one of the first adsorption surface and the second adsorption surface. In an embodiment of the present invention, the flip frame further includes a plurality of support tubes and a plurality of adsorption pads for adsorbing the substrate, and each of the adsorption pads has a second hole. One end of the support member is connected to the first hole. The adsorption pad is sleeved on the other end of the support tube, and the first pipeline group and the second pipeline group are connected to the second hole via the first hole and the support tube.
在本發明之一 實施例中’上述之翻轉I置更包括第二機械 5 201029902 Γ二第第1:面t第/吸附面其中之一面向接_ :與第一吸附面其中另一面向卸載側，且第 中空柱 側的支撐管之間，以接㈣向卸載_基板。、 f本七明之-實施例中，上述之翻轉架包括封閉框與多個 内部為中空，而中空柱連接於。' =====部空間相通，且第，是設 在本發明之-實施射，上述這㈣战解行排列。In an embodiment of the present invention, the above-mentioned flipping I further includes a second machine 5 201029902 2nd: 1st surface t/adsorption surface one of the facing surfaces _: with the first adsorption surface, the other facing the unloading On the side, and between the support tubes on the side of the hollow column, the substrate is unloaded (4). In the embodiment, the flip frame comprises a closed frame and a plurality of interiors being hollow, and the hollow columns are connected. ' ===== The space of the department is the same, and the first is the implementation of the present invention, and the above (4) is arranged in a row.
站勺明之一實施例中’上述之封閉框具有轉軸，且此轉 軸^相對的二個樞接部i二個_部位於封閉框的相 側邊。 在本發明之-實施例中，上述之樞接部内部為中空，而第 一管線組與第二管線組係經由樞接部至少其中之一的内部 入翻轉架内部。 ° 在本發明之-實施例中，上述之翻轉裝置更包括固定架， 而樞接部係樞接於固定架。 在本發明之-實施例中，上述之翻轉裝置更包括固定架， 而翻轉架係樞接於固定架。 在本發明之一實施例中，上述之控制模組包括至少一個第 一控制閥與至少一個第二控制閥，其中第一控制閥連接至第一 管線組，而第二控制閥連接至第二管線組。 為達上述優點，本發明另提出-種翻轉基板的方法，其適 於依序翻轉多個基板。翻轉基板的方法包括下列步驟：（a) 提供具有翻轉架的翻轉裝置’其中翻轉架具有相對的二吸附 面，且當吸附面其中之一面向接收側時，吸附面其中另一面向 卸載侧。（b)將基板其中之傳送至面向接收側的吸附面， 6 201029902 以藉由位於接收側的吸附面吸附基板。（C)翻轉翻轉架，以 使吸附基板的吸附面面向卸載侧，且使未吸附基板的吸附面面 向接收侧。（d)接收面向卸載側的吸附面所吸附的基板。（e) 重複步驟（b)至（d)。 在本發明之一實施例中’上述之步驟（b)是藉由第一機 械手臂傳送基板，其中第一機械手臂吸附基板之第一面並傳送 至面向接收侧的吸附面之後，面向接收侧的吸附面吸附基板之 第一面。 在本發明之一實施例中，上述之步驟（c)是使翻轉架沿 轉軸翻轉180度。 在本發明之一實施例中，上述之步驟（d)是藉由第二機 械手臂接收基板，其中第二機械手臂伸入面向卸載側的吸附面 與基板之間來接收基板。 在本發明之一實施例中，上述之步驟（d)是藉由第二機 械手臂接收基板，其中第二機械手臂吸附基板之一第一面以接 收基板之前’面向卸載側的吸附面吸附基板之第一面。 在本發明之一實施例中，在步驟（d)中，在接收基板之 ® 前更包括將翻轉架從第一位置移動至第二位置，且在接收基板 之後更包括將翻轉架從第二位置移動至第一位置。 在本發明之一實施例中，在步驟（c)中，在翻轉翻轉架 之前更包括將翻轉架從第一位置移動至第二位置，而在步驟 (〇中，在接收基板之後更包括將翻轉架從第二位置移動至 第一位置。 本發明之翻轉裝置的翻轉架具有二個吸附面（即第一吸附 面與第二吸附面），所以翻轉架在將基板翻面後，可直接藉由 另一吸附面來吸附另一基板，如此可避免浪費電能，並提高翻 7 201029902 轉基板的效率。此外’本發明之翻轉基板的方法所使用的翻轉 裝置其翻轉架具有二個吸附面。當翻轉架將基板翻面後，可直 接藉由另一吸附面來吸附另一基板，如此可避免浪費電能，並 提高翻轉基板的效率。 為讓本發明之上述和其他目的、特徵和優點能更明顯易 懂’下文特舉較佳實施例’並配合所附圖式，作詳細說明如下。 【實施方式】 圖1是本發明一實施例之一種翻轉裝置的俯視示意圖，圖 Φ 2A是沿圖1中1-1，線所見之翻轉架的剖面示意圖，圖2B是氣 流導引單元連接圖1之翻轉架的示意圖，其中圖2B是以翻轉 架的其中一個中空柱之剖面示意圖來表示翻轉架。請參照圖 1、圖2A與圖2B，本實施例之翻轉裝置200適於吸附基板（圖 中未示）並翻轉此基板。此翻轉裝置2〇〇包括翻轉架210以及 氣流導引單元220。翻轉架210内部為中空，且翻轉架210具 有相對的第一吸附面211與第二吸附面212,而第一吸附面211 與第二吸附面212分別設有多個第一孔洞213。氣流導引單元 220包括控制模組222、第一管線組224以及第二管線組226。 Ο 第一管線組224的一端連接至控制模組222，另一端伸入翻轉 架210内部並連接至設於第一吸附面211的第一孔洞213。第 二管線組226的一端連接至控制模組222，另一端伸入翻轉架 210内部並連接至設於第二吸附面212的第一孔洞213。控制 模組222適於使第一吸附面211及第二吸附面212其中之一能 吸附基板’而翻轉架210適於翻轉吸附於第一吸附面211與第 二吸附面212其中之一的基板。需說明的是，圖2B所示的氣 流引導單元220的管線分布僅是連接關係示意圖，並非用以限 制實際管線的尺寸、彎曲角度、比例、延伸深度、位置等條件，In one embodiment of the station scooping, the closed frame has a rotating shaft, and the two pivot portions i of the rotating shaft are located at the side edges of the closed frame. In an embodiment of the invention, the pivot portion is hollow inside, and the first pipeline group and the second pipeline group are inserted into the interior of the flip frame via at least one of the pivot portions. In the embodiment of the present invention, the inverting device further includes a fixing frame, and the pivoting portion is pivotally connected to the fixing frame. In an embodiment of the invention, the inverting device further includes a fixing frame, and the inverting frame is pivotally connected to the fixing frame. In an embodiment of the invention, the control module includes at least one first control valve and at least one second control valve, wherein the first control valve is connected to the first pipeline group, and the second control valve is connected to the second Pipeline group. In order to achieve the above advantages, the present invention further proposes a method of flipping a substrate, which is suitable for sequentially flipping a plurality of substrates. The method of flipping the substrate comprises the steps of: (a) providing a turning device having a flipping frame' wherein the flipping frame has opposing two adsorption faces, and when one of the adsorbing faces faces the receiving side, the other of the adsorbing faces faces the unloading side. (b) transferring the substrate to the adsorption surface facing the receiving side, 6 201029902 to adsorb the substrate by the adsorption surface on the receiving side. (C) Turning the flip frame so that the adsorption surface of the adsorption substrate faces the unloading side, and the adsorption surface of the non-adsorbed substrate faces the receiving side. (d) receiving the substrate adsorbed by the adsorption surface facing the unloading side. (e) Repeat steps (b) through (d). In an embodiment of the present invention, the above step (b) is to transfer the substrate by the first robot arm, wherein the first robot arm adsorbs the first surface of the substrate and transmits to the adsorption surface facing the receiving side, facing the receiving side. The adsorption surface adsorbs the first side of the substrate. In one embodiment of the invention, step (c) above is to flip the flip frame 180 degrees along the axis of rotation. In an embodiment of the invention, the step (d) of the present invention is to receive the substrate by the second mechanical arm, wherein the second robot arm extends between the adsorption surface facing the unloading side and the substrate to receive the substrate. In an embodiment of the invention, the step (d) is: receiving the substrate by the second robot arm, wherein the second robot arm adsorbs the substrate on the unloading side of the unloading side before the first surface of the substrate is adsorbed to receive the substrate The first side. In an embodiment of the invention, in step (d), before receiving the substrate of the substrate, the method further comprises: moving the flip frame from the first position to the second position, and further comprising: connecting the flip frame from the second after receiving the substrate The position moves to the first position. In an embodiment of the present invention, in step (c), before the flipping the flipping frame, the method further comprises: moving the flipping frame from the first position to the second position, and in the step (in the step, after receiving the substrate, the The flip frame is moved from the second position to the first position. The flip frame of the inverting device of the present invention has two adsorption surfaces (ie, the first adsorption surface and the second adsorption surface), so that the flip frame can directly directly turn the substrate The other substrate is adsorbed by another adsorption surface, so that waste of electric energy can be avoided, and the efficiency of the substrate can be improved. In addition, the flipping device used in the method for flipping the substrate of the present invention has two adsorption surfaces. When the flipping frame flips the substrate, the other substrate can be directly adsorbed by the other adsorption surface, thereby avoiding wasting electric energy and improving the efficiency of flipping the substrate. The above and other objects, features and advantages of the present invention are made. The following is a detailed description of the preferred embodiment of the present invention. The following is a detailed description of the following: [Embodiment] FIG. 1 is a turning device according to an embodiment of the present invention. In a top view, FIG. 2A is a schematic cross-sectional view of the flip frame seen along line 1-1 of FIG. 1, and FIG. 2B is a schematic view of the air flow guiding unit connected to the flip frame of FIG. 1, wherein FIG. 2B is one of the flip frames. The cross-sectional view of the hollow column is used to indicate the flip frame. Referring to Figures 1, 2A and 2B, the inverting device 200 of the present embodiment is adapted to adsorb a substrate (not shown) and flip the substrate. The inverting device 2 includes The flip frame 210 and the air flow guiding unit 220. The inside of the flip frame 210 is hollow, and the flip frame 210 has a first first adsorption surface 211 and a second adsorption surface 212, and the first adsorption surface 211 and the second adsorption surface 212 are respectively provided. There are a plurality of first holes 213. The airflow guiding unit 220 includes a control module 222, a first pipeline group 224, and a second pipeline group 226. Ο One end of the first pipeline group 224 is connected to the control module 222, and the other end is extended. The inside of the flip frame 210 is connected to the first hole 213 disposed on the first adsorption surface 211. One end of the second pipeline group 226 is connected to the control module 222, and the other end extends into the interior of the flip frame 210 and is connected to the second adsorption. First hole 213 of face 212 The control module 222 is adapted to enable one of the first adsorption surface 211 and the second adsorption surface 212 to adsorb the substrate and the flip frame 210 is adapted to flip the substrate adsorbed on one of the first adsorption surface 211 and the second adsorption surface 212 It should be noted that the pipeline distribution of the airflow guiding unit 220 shown in FIG. 2B is only a schematic diagram of the connection relationship, and is not used to limit the actual pipeline size, bending angle, proportion, extension depth, position, and the like.
S 201029902 相關技藝人士可依實際情況調整。 上述之翻轉裝置200中，當第一吸附面211面向接收側 時’第二吸附面212励卸載側，而當第一吸附面2ΐι面向卸 賴時’第二吸附面、212面向接收侧。面向接收侧的第一吸附 面211或第二吸附面212適於接收基板並吸附基板而面向卸 載側的第-吸附面211或第二吸附面212適於將被其所吸附的 基板卸載。關於接收基板與卸載基板的細節，將在後文中說 明。此外，翻轉架210可更具有多個支撐管214與用以吸附基 ❹板的多個吸附墊215，且每-吸附墊215具有第二孔洞216。 這，支撐管214是配置於第一吸附面211與第二吸附面212， 且每一支撐管214的一端是連接於一個第一孔洞213，而吸附 ，215是套設於支撐管214的另一端。第一管線組224與第二 管線組226可經由第一孔洞213與支撐管214而連接至第二孔 洞216。此外，翻轉架21〇例如包括封閉框217與多個中空柱 218。封閉框217的内部為中空，而中空柱218連接於封閉框 217。每一中空柱218的内部空間與封閉框217的内部空間相 通’且上述第一孔洞213是設置於每一中空柱218之相對的兩 _ 表面。也就是說，上述之第一吸附面211與第二吸附面212可 由母中空柱218之相對的兩表面所構成。本發明可利用中空 柱218結構的搭配’使實際管線可沿著中空柱Mg分布，使管 線較有條理且較不會紊亂易於糾結，在控管線路與維護線路達 到較佳的效果。另外，上述這些中空柱218例如是平行排列。 惟本發明不限於此，亦可依實際需求調整中空柱218的尺寸、 分布位置、數目、排列方向等條件。 上述之第一管線組224例如包括一個第一管線224a、多 個第二管線224b與多個第三管線224c。第一管線224a的一端 9 201029902 ，接至控制模組222，另一端伸入封閉框217内，而這些第二 官線224b連接至第一管線224a，且每一第二管線22牝伸入 一個中空柱218内。每一第三管線224c則是連接第二管線 224b，且第三管線224c經由設於第一吸附面211的第一孔洞 213與支撐管214而連接至吸附墊215的第二孔洞216。此外， 上述之第二管線組226例如包括一個第四管線226a、多個第 五管線226b與多個第六管線226c。第四管線226a的一端連接 至控制模組222，另一端伸入封閉框2Π内，而這些第五管線 226b連接至第四管線226a，且每一第五管線226b伸入一個中 空柱+218内。每一第六管線226c則是連接第五管線226b，且 第六管線226c經由設於第二吸附面212的第一孔洞213與支 撐管214而連接至吸附墊215的第二孔洞216。 上述之控制模組222可包括一個第一控制閥222a與一個 第二控制閥222b，其中第一控制閥222a連接至第一管線組224 的第一管線224a與負壓源60a，而第二控制閥22几連接至第 二官線組226的第四管線226a與負壓源6〇b。連接至負壓源 60a的第控制閥222a開啟時，第一管線組224可與負壓源 ❿ 60a連通，如此可使設於第一吸附面211上的吸附墊215具有 吸附基板的能力。同理，連接至負壓源6〇b的第二控制閥222b 開啟時，第二管線組226可與負壓源6〇b連通，如此可使第二 吸附面212上的吸附墊215具有吸附基板的能力。此外，控制 模組222可更包括另一個連接至空氣源7〇a的第一控制間2瓜 與另一個連接至空氣源70b的第二控制閥222b。連接至空氣 源70a的第一控制閥222a開啟時，第一管線組224可與空氣 源70a連通，如此可使設於第—吸附面211上的吸附墊215喪 失吸附基板的能力，以卸下基板。同理，連接至空氣源 ^ 201029902 第二控制閥島開啟時，第二管線組226可與空氣源赐連 通’如此可使設於第二吸附面212上的吸附墊215喪失吸附基 板的能力’以卸下基板。另外，上述之負壓源術、_例^ 是真空源’而上述之第-控糊222a與第二控侧通例如 是電磁閥，惟不限於此，亦可依實際需求選擇適當的控制間種 = 線路配置等。空氣源術、7〇b可採用潔淨乾燥 厭士 但不限於此’亦可視需求變更氣體種類、氣體 壓力寺條件。S 201029902 Related artisans can adjust according to the actual situation. In the above-described inverting device 200, when the first adsorption surface 211 faces the receiving side, the second adsorption surface 212 is on the unloading side, and when the first adsorption surface 2 is facing the unloading, the second adsorption surface 212 faces the receiving side. The first adsorption surface 211 or the second adsorption surface 212 facing the receiving side is adapted to receive the substrate and adsorb the substrate, and the first adsorption surface 211 or the second adsorption surface 212 facing the unloading side is adapted to unload the substrate to be adsorbed thereon. Details regarding the receiving substrate and the unloading substrate will be described later. In addition, the flip frame 210 may further have a plurality of support tubes 214 and a plurality of adsorption pads 215 for adsorbing the base plates, and each of the adsorption pads 215 has a second hole 216. The support tube 214 is disposed on the first adsorption surface 211 and the second adsorption surface 212, and one end of each support tube 214 is connected to a first hole 213, and the adsorption 215 is sleeved on the support tube 214. One end. The first line set 224 and the second line set 226 can be coupled to the second bore 216 via the first bore 213 and the support tube 214. Further, the flip frame 21 includes, for example, a closed frame 217 and a plurality of hollow columns 218. The inside of the closed frame 217 is hollow, and the hollow post 218 is connected to the closed frame 217. The inner space of each hollow column 218 is in communication with the inner space of the closed frame 217 and the first holes 213 are disposed on opposite sides of each hollow column 218. That is, the first adsorption surface 211 and the second adsorption surface 212 may be formed by opposite surfaces of the mother hollow column 218. The invention can utilize the combination of the hollow columns 218 structure to make the actual pipelines distribute along the hollow pillars Mg, so that the pipelines are more organized and less turbulent and easy to entangle, and the control pipelines and the maintenance pipelines achieve better results. Further, the above hollow columns 218 are, for example, arranged in parallel. However, the present invention is not limited thereto, and the size, distribution position, number, arrangement direction, and the like of the hollow column 218 may be adjusted according to actual needs. The first line group 224 described above includes, for example, a first line 224a, a plurality of second lines 224b, and a plurality of third lines 224c. One end 9 201029902 of the first line 224a is connected to the control module 222, and the other end extends into the closed frame 217, and the second official line 224b is connected to the first line 224a, and each second line 22 is extended into one Inside the hollow column 218. Each of the third lines 224c is connected to the second line 224b, and the third line 224c is connected to the second holes 216 of the adsorption pad 215 via the first holes 213 and the support tubes 214 provided on the first adsorption surface 211. Further, the second line group 226 described above includes, for example, a fourth line 226a, a plurality of fifth lines 226b, and a plurality of sixth lines 226c. One end of the fourth line 226a is connected to the control module 222, the other end extends into the closed frame 2, and the fifth line 226b is connected to the fourth line 226a, and each of the fifth lines 226b extends into a hollow column +218 . Each of the sixth lines 226c is connected to the fifth line 226b, and the sixth line 226c is connected to the second holes 216 of the adsorption pad 215 via the first holes 213 and the support tubes 214 provided on the second adsorption surface 212. The control module 222 may include a first control valve 222a and a second control valve 222b, wherein the first control valve 222a is connected to the first line 224a of the first line group 224 and the negative pressure source 60a, and the second control The valve 22 is connected to the fourth line 226a of the second official line group 226 and the negative pressure source 6〇b. When the first control valve 222a connected to the negative pressure source 60a is turned on, the first line group 224 can communicate with the negative pressure source ❿ 60a, so that the adsorption pad 215 provided on the first adsorption surface 211 can have the ability to adsorb the substrate. Similarly, when the second control valve 222b connected to the negative pressure source 6〇b is turned on, the second line group 226 can communicate with the negative pressure source 6〇b, so that the adsorption pad 215 on the second adsorption surface 212 can be adsorbed. The ability of the substrate. In addition, the control module 222 may further include another first control room 2 connected to the air source 7A and a second control valve 222b connected to the air source 70b. When the first control valve 222a connected to the air source 70a is opened, the first line group 224 can communicate with the air source 70a, so that the adsorption pad 215 disposed on the first adsorption surface 211 can lose the ability to adsorb the substrate to be unloaded. Substrate. Similarly, when connected to the air source ^ 201029902, when the second control valve island is opened, the second pipeline group 226 can communicate with the air source. Thus, the adsorption pad 215 disposed on the second adsorption surface 212 can lose the ability to adsorb the substrate. To remove the substrate. In addition, the above-mentioned negative pressure source, _example ^ is a vacuum source', and the above-mentioned first control paste 222a and the second control side pass are, for example, solenoid valves, but are not limited thereto, and an appropriate control room may be selected according to actual needs. Kind = line configuration, etc. Air source, 7〇b can be clean and dry. It is not limited to this. Depending on the demand, the gas type and gas pressure temple conditions can be changed.
上述之翻轉裝置200可更包括固定架23〇，而翻轉架加 係插接於固定架230。具體而言，翻轉架⑽的封閉框217可 具有轉軸’且此轉軸包括相對的二個樞接部219。此二個樞接 邛219刀別位於封閉框217的相對兩側邊，且樞接部2D係可 樞，於固疋架230。此外，樞接部219的内部可為中空，而第 笞線組224與第二管線組226可經由此二個樞接部219至少 其中之一的内部伸入翻轉架21〇的内部。也就是說，第一管線 224a與第四管線226a可經由同一樞接部219的内部伸入封閉 忙217的内。卩，或是分別經由不同的樞接部up的内部伸入封 閉框217的内部。 ，3是本發明一實施例之翻轉裝置的機械手臂的示意 辟睛參照圖2A與圖3 ’上述之翻轉裝置綱可更包括機械 24G，其適於伸人支樓管214之間，用以接收基板或傳遞 ^板。此外，機械手臂24〇可包括多個承載臂Μ2與多個吸附 43而及附嘴243是設於承載臂242上，且吸附243 用以吸附基板。 以下將以上述之翻轉裝置2〇〇為例來說明本一 例之翻轉基板的方法。 11 201029902 圖4A至圖4D是本發明一實施例之翻轉基板的方法，其 中圖4A至圖4D中所繪示的翻轉裝置是侧視示意圖。請先參 照圖4A，本實施例之翻轉基板的方法適於依序翻轉多個基 板。此翻轉基板的方法包括下列步驟：步驟（a)，提供具有 翻轉架的翻轉裝置’且翻轉架具有相對的二個吸附面。在本實 施例中所提供的翻轉裝置例如是上述之翻轉裝置2〇〇，其翻轉 架210的第一吸附面211與第二吸附面212其中之一面向接收 側時，第一吸附面211與第二吸附面212其中另一面向卸載 側。在圖4A至圖4D中接收側例如是位於翻轉架21〇上方， ® 而卸载側例如是位於翻轉架210下方。 步驟（b)，如圖4B所示，將一個基板80傳送至面向接 收侧的吸附面（如第一吸附面211)，以藉由位於接收側的吸 附面（如第一吸附面211)吸附基板80。此基板8〇具有相對 的第一面82與第二面84,其中第二面84例如形成有彩色濟 光層、驅動電路層或其他膜層。此外，在此步驟中可藉由第二 機械手臂240a傳送基板80,其中第一機械手臂240a的結構與 圖3之機械手臂240的結構相同’第一機械手臂24〇a吸附基 ❹ 板80之第一面82並傳送至面向接收側的吸附面（如第一吸$ 面211)之後，面向接收側的吸附面（如第一吸附面an)可 吸附基板80之第一面82。具體而言，基板80例如是先放置 於第一機械手臂240a上，而由於基板80的第二面84上形成 有如彩色濾光層或驅動電路層等膜層’所以第一機械手臂24〇a 只能接觸基板80的第一面82。第一機械手臂240a的吸附嘴 243會吸附基板80之第一面82’之後第一機械手臂24〇a之承 載臂242會伸入設於面向接收側的吸附面（如第一吸附面211) 上的支撐管214之間，以將基板80傳送至面向接收側的吸附 12 201029902 ^如第一吸附面211)。此時，藉由面向接收側的吸附面（如 μ 211 吸附基板80之第-面82，之後將第-機 二口 a移開。更詳細地說，請參照圖2Β與圖4Β，以第 沾：附：二1為面向接收側的吸附面為例，連接至負壓源60a 合^\閱办會開啟且連接至空氣源術的第一控制閥 8, U，以使第一吸附面211能吸附基板80之第一面 就疋”兒，如圖4B所示，第一機械手臂24〇a可適於伸入 丨1接收側的支稽官214之間，以將基板80運送至面向接收 二、215 _L °需注意的是’支樓管214之高度H1實質 =第-機械手臂24〇a的承載臂242與吸附嘴243的叠加高 xH2，以供第一機械手臂240a伸入支撐管214之間。 步驟（C)，如圖4C所示，翻轉翻轉架210，以使吸附基 板80的吸附面（如篦__哄w 弟及附面211)面向卸載側，且使未吸 的吸附面（如第二吸附面212)面向接收侧。翻轉 翻轉架21〇的方法例如是使翻轉架21〇沿轉軸翻轉18〇度轉 步驟（d)，如^4D所示，接收面向卸載侧的吸附面（如 =附面211)所吸附的基板8()。在此步驟中可藉由第二機 2働來魏紐8G ’財帛二贼手臂24Gb吸附基 =〇之第-面82以接收基板8G之前，面向卸載側的吸= J如第-吸附面2η)可吸附基板80之第一面82。此 的結構與圖3之機械手臂相似，其差別處在 :母：第二機械手臂纖之相對的兩個表面都設有吸附嘴 =3。然而’第二機械手臂鳩的結構亦可與機械手臂相 同’或者第-機械手臂2他的結構亦可與第二機械手臂鳩 =同，惟祕於此’可依魏需求_賴手臂所需的承載臂 “吸附嘴的數目、位置、分布等條件。也就是說，第二機械手 13 201029902 # 240b，承載’ 242可伸入面向卸載側 吸 == 基板8°之間來接收基板8。。更詳丄第二 " 的承載臂242是伸入設於面向卸載侧的吸附面The inverting device 200 described above may further include a fixing frame 23, and the inverting frame is inserted into the fixing frame 230. Specifically, the closed frame 217 of the flip frame (10) may have a rotating shaft ' and the rotating shaft includes two opposite pivoting portions 219. The two pivoting jaws 219 are located on opposite sides of the closed frame 217, and the pivoting portion 2D is pivotable to the solid frame 230. In addition, the interior of the pivoting portion 219 may be hollow, and the first set of turns 224 and the second set of conduits 226 may extend into the interior of the flip frame 21A via the interior of at least one of the two pivotal portions 219. That is, the first line 224a and the fourth line 226a may extend into the enclosed busy 217 via the interior of the same pivoting portion 219. Or, respectively, extending into the interior of the closure frame 217 via the interior of the different pivotal portions up. 3 is a schematic view of the robot arm of the inverting device according to an embodiment of the present invention. Referring to FIG. 2A and FIG. 3, the above-mentioned inverting device can further include a mechanical 24G, which is adapted to extend between the branch pipes 214 for Receiving a substrate or a transfer board. In addition, the robot arm 24 can include a plurality of carrier arms 2 and a plurality of adsorptions 43 and the attachment nozzle 243 is disposed on the carrier arm 242, and the adsorption 243 is used to adsorb the substrate. Hereinafter, the method of flipping the substrate of this embodiment will be described by taking the above-described inverting device 2 as an example. 11A to 4D is a method of flipping a substrate according to an embodiment of the present invention, wherein the inverting device illustrated in Figs. 4A to 4D is a side view. Referring first to Figure 4A, the method of flipping the substrate of the present embodiment is adapted to sequentially flip a plurality of substrates. The method of flipping the substrate comprises the steps of: step (a), providing a turning device with a flip frame' and the flip frame having opposite adsorption faces. The inverting device provided in this embodiment is, for example, the inverting device 2 described above, and when one of the first adsorption surface 211 and the second adsorption surface 212 of the flip frame 210 faces the receiving side, the first adsorption surface 211 is The second adsorption surface 212 has the other side facing the unloading side. In FIGS. 4A to 4D, for example, the receiving side is located above the flip frame 21〇, and the unloading side is for example located below the flip frame 210. Step (b), as shown in FIG. 4B, a substrate 80 is transported to an adsorption surface facing the receiving side (such as the first adsorption surface 211) to be adsorbed by an adsorption surface (such as the first adsorption surface 211) on the receiving side. Substrate 80. The substrate 8A has opposing first and second faces 82, 84, wherein the second face 84 is formed, for example, with a color light layer, a driver circuit layer, or other film layer. In addition, in this step, the substrate 80 can be transported by the second robot arm 240a, wherein the structure of the first robot arm 240a is the same as that of the robot arm 240 of FIG. 3. The first robot arm 24A adsorbs the base plate 80. After the first surface 82 is transferred to the adsorption surface facing the receiving side (such as the first suction surface 211), the adsorption surface facing the receiving side (such as the first adsorption surface an) can adsorb the first surface 82 of the substrate 80. Specifically, the substrate 80 is placed on the first robot arm 240a, for example, and the first robot arm 24〇a is formed on the second surface 84 of the substrate 80 such as a color filter layer or a driver circuit layer. Only the first face 82 of the substrate 80 can be accessed. After the suction nozzle 243 of the first robot arm 240a adsorbs the first surface 82' of the substrate 80, the carrier arm 242 of the first robot arm 24A protrudes into the adsorption surface (such as the first adsorption surface 211) disposed on the receiving side. Between the upper support tubes 214, the substrate 80 is transported to the adsorption side facing the receiving side 12 201029902 ^ as the first adsorption surface 211). At this time, the adsorption surface of the receiving side (for example, the first surface 82 of the substrate 211 is adsorbed by the μ 211, and then the second opening a of the substrate is removed. More specifically, please refer to FIG. 2A and FIG. Dip: Attachment: 2 is the suction side facing the receiving side as an example, connected to the negative pressure source 60a and the first control valve 8, U connected to the air source to open the first adsorption surface 211 can adsorb the first side of the substrate 80, as shown in FIG. 4B, the first mechanical arm 24A can be adapted to extend between the ejector 214 on the receiving side of the cymbal 1 to transport the substrate 80 to For the reception of 2, 215 _L °, it should be noted that the height H1 of the branch pipe 214 is substantially the height xH2 of the carrying arm 242 of the first mechanical arm 24〇a and the suction nozzle 243 for the first robot arm 240a to extend. Between the support tubes 214. Step (C), as shown in FIG. 4C, flip the flip frame 210 so that the adsorption surface of the adsorption substrate 80 (such as 篦__哄w and the surface 211) faces the unloading side, and The suction adsorption surface (such as the second adsorption surface 212) faces the receiving side. The method of flipping the flip frame 21〇 is, for example, flipping the flip frame 21〇 along the rotating shaft by 18 turns. (d), as shown in ^4D, receiving the substrate 8() adsorbed by the adsorption surface (such as = the surface 211) facing the unloading side. In this step, the second machine 2 The second thief arm 24Gb adsorption base = the first surface 82 of the crucible to receive the substrate 8G, the suction side facing the unloading side (such as the first adsorption surface 2n) can adsorb the first surface 82 of the substrate 80. The structure of this is the same as that of FIG. The mechanical arm is similar, the difference is: mother: the opposite surface of the second mechanical arm is provided with a suction nozzle = 3. However, the structure of the second mechanical arm can also be the same as that of the mechanical arm or the first mechanical The structure of the arm 2 can also be the same as that of the second robotic arm, but it is the secret of the number, position and distribution of the suction nozzles. That is, the second robot 13 201029902 # 240b, the carrier ' 242 can extend into the unloading side suction == 8° between the substrates to receive the substrate 8. . More specifically, the second " carrying arm 242 is extended into the adsorption surface provided on the unloading side
水吸，面211 ) i的支標管214之間，並可藉由吸附嘴 、吸附板80的第一面82。接著，請參照圖2B與圖4D， 以第及附面211為面向卸載側的吸附面為例，連接負壓源 _第一控_如會關閉且連接至空氣源控制 間⑽會開啟’如此第一吸附面211無法吸附基板8〇之第-面82，因此第二機械手臂240b可將基板80移走。也就是說， 如圖jD所示’第一機械手臂24〇b可適於伸入面向卸載侧的 支樓管214之間’以接收面向卸載侧的基板8〇。需注意的是， 支撲管214之高度H1實質大於第二機械手臂24Gb的承载臂 242與吸附嘴243的叠加高度H3，以供第二機械手f 24〇 入支撐管214之間。 步驟（e)，重複步驟（b)至（d),以繼續翻轉其他基 板。 上述之翻轉裝置2〇〇與基板的翻轉方法中，由於翻轉裝置 200的翻轉架210具有二個吸附面（即第一吸附面211與第二 吸附面212)，所以將吸附於其中一個吸附面的基板8〇翻面 後’翻轉架210不需再翻轉回原來的位置即可藉由另一吸附面 來吸附另一基板，以繼續進行翻轉基板的流程，也就是說，原 先以第一吸附面211來吸附基板並加以翻轉，之後無需將第一 吸附面211翻轉回去，即可用第二吸附面212來吸附另一基板 並加以翻轉。如此，不僅可避免浪費電力，還可節省時間，以 提高翻轉多個基板的效率。 需注意的是’在另一實施例之基板的翻轉方法的步驟（d) 14 201029902 中’在接收基板80之前可先將翻轉架210從第一位置移動至 第二位置’其中第一位置例如是較接近第一機械手臂24〇a的 位置’而第二位置例如是較接近第二機械手臂24〇b的位置。 此外，在接收基板80之後，可將翻轉架21〇移回原位，也就 是將翻轉架210從第二位置移動至第一位置。 ’ 在又一實施例之基板的翻轉方法的步驟中，在翻轉 翻轉架210之前可先將翻轉架210從第一位置移動至第二位 置，而且在步驟（d)中，在接收基板8〇之後可將翻轉架21〇 從第二位置移動至第-位置。惟本發明不限於上述描述，可依 實際情況調整，例如翻轉裝置可在原地轉動等。 綜上所述，本發明至少具有下列優點： 1·本發明之翻轉裝置的翻轉架具有二個吸附面（即第一明The water is sucked between the sub-tubes 214 of the face 211) i and may be passed through the suction nozzle and the first face 82 of the suction plate 80. Next, referring to FIG. 2B and FIG. 4D, taking the first and the second surface of the adsorption surface facing the unloading side as an example, the connection of the negative pressure source _ the first control _ will be closed and the connection to the air source control room (10) will be turned on. The first adsorption surface 211 cannot adsorb the first surface 82 of the substrate 8 , so the second mechanical arm 240 b can remove the substrate 80 . That is, the first robot arm 24b can be adapted to protrude between the branch pipes 214 facing the unloading side as shown in Fig. jD to receive the substrate 8A facing the unloading side. It should be noted that the height H1 of the baffle 214 is substantially greater than the superimposed height H3 of the carrying arm 242 of the second robot arm 24Gb and the suction nozzle 243 for the second robot f 24 to enter between the support tubes 214. In step (e), steps (b) through (d) are repeated to continue flipping the other substrates. In the above-mentioned method for inverting the inverting device 2〇〇 and the substrate, since the inverting frame 210 of the inverting device 200 has two adsorption surfaces (ie, the first adsorption surface 211 and the second adsorption surface 212), it will be adsorbed to one of the adsorption surfaces. After the substrate 8 is turned over, the flip frame 210 can be moved to another substrate by another adsorption surface without further flipping back to the original position, so as to continue the process of flipping the substrate, that is, the first adsorption The surface 211 adsorbs the substrate and inverts it, and then the second adsorption surface 212 is used to adsorb the other substrate and flip it without flipping the first adsorption surface 211 back. In this way, not only was power wasted, but also time was saved to improve the efficiency of flipping multiple substrates. It should be noted that 'in step (d) 14 201029902 of the flipping method of the substrate of another embodiment, 'the flip frame 210 may be moved from the first position to the second position before receiving the substrate 80', wherein the first position, for example It is a position closer to the first robot arm 24〇a' and the second position is, for example, a position closer to the second robot arm 24〇b. Furthermore, after receiving the substrate 80, the flip frame 21 can be moved back to its original position, i.e., the flip frame 210 is moved from the second position to the first position. In the step of the flipping method of the substrate of still another embodiment, the flip frame 210 may be moved from the first position to the second position before the flip frame 210 is turned over, and in the step (d), the substrate 8 is received. The flip frame 21〇 can then be moved from the second position to the first position. However, the present invention is not limited to the above description and can be adjusted according to actual conditions, for example, the turning device can be rotated in place or the like. In summary, the present invention has at least the following advantages: 1. The flip frame of the inverting device of the present invention has two adsorption faces (ie, the first
，所以不會對基板上的膜層造成傷害。 雖然本發明已以較#音So it will not cause damage to the film on the substrate. Although the present invention has been
當準因此本發明 之保護範圍 然其並非用以限定 識者，在不脫離本 15 201029902 ' 【圖式簡單說明】 圖1是本發明一實施例之一種翻轉裝置的俯視示意圖。 圖2A是沿圖1中Ι-Γ線所見之翻轉架的剖面示意圖。 圖2B是氣流導引單元伸入圖1之翻轉架的示意圖。 圖3是本發明一實施例之翻轉裝置的機械手臂的示意圖。 圖4A至圖4D是本發明一實施例之翻轉基板的方法。 【主要元件符號說明】 80 :基板 60a、60b :負壓源 © 70a、70b:空氣源 82 :第一面 84 :第二面 200:翻轉裝置 210 :翻轉架 214 :支撐管 215 :吸附墊 230 :固定架 φ 211 :第一吸附面 212 :第二吸附面 213 :第一孔洞 216 :第二孔洞 217 :封閉框 218 :中空柱 219 :樞接部 220 :氣流導引單元 222 :控制模組 16 201029902 222a :第一控制閥 222b :第二控制閥 224 :第一管線組 224a :第一管線 224b :第二管線 224c :第三管線 226 :第二管線組 226a :第四管線 226b :第五管線 226c :第六管線 240 :機械手臂 240a :第一機械手臂 240b :第二機械手臂 242 :承載臂 243 :吸附嘴The scope of the present invention is not intended to limit the scope of the invention, and is not to be construed as a limitation. FIG. 1 is a schematic plan view of an inverting device according to an embodiment of the present invention. Figure 2A is a schematic cross-sectional view of the flip frame as seen along the Ι-Γ line of Figure 1. 2B is a schematic view of the airflow guiding unit extending into the inverting frame of FIG. 1. 3 is a schematic view of a robot arm of a turning device according to an embodiment of the present invention. 4A to 4D illustrate a method of flipping a substrate according to an embodiment of the present invention. [Main component symbol description] 80: Substrate 60a, 60b: Negative pressure source © 70a, 70b: Air source 82: First face 84: Second face 200: Flip device 210: Flip frame 214: Support tube 215: Adsorption pad 230 : fixing frame φ 211 : first adsorption surface 212 : second adsorption surface 213 : first hole 216 : second hole 217 : closed frame 218 : hollow column 219 : pivoting portion 220 : air flow guiding unit 222 : control module 16 201029902 222a: first control valve 222b: second control valve 224: first line group 224a: first line 224b: second line 224c: third line 226: second line group 226a: fourth line 226b: fifth Line 226c: sixth line 240: robot arm 240a: first robot arm 240b: second robot arm 242: carrier arm 243: nozzle