201024828 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種真空壓合裝置。特別是關於一種基 板真空中定位及加屢之真空壓合裝置。 【先前技藝】 傳統液晶顯示器(Liquid Crystal Display，LCD)的液晶 ❹ 注入方式是在上下玻璃基板對組之後以毛細原理將液晶慢 慢吸入，這種注入液晶方法的缺點是非常耗時且浪費液 晶。而新的滴下式液晶注入法(One Drop Filling, ODF)， 則疋先將液晶直接滴在玻璃基板上，然後再進行真空中上 下玻璃基板的對組壓合。這種新的製程可以大幅節省灌液 晶的時間與液晶材料，尤其在超大尺寸面板具有絕對的優 勢。以三十吋面板為例，傳統灌液晶方式灌一片大約需要 五天的時間，ODF只需要五分鐘，並且節省約4〇%的液 φ 晶材料。 過去的對組壓合，由於是在液晶尚未封入的狀態下所 作的工.程道次，因此比目前ODF製程必須在真空環境下 達成壓合的精度要簡單得多。為了達成真空麗合及定位之 目的’目前ODF機台採用了靜電吸引的方式在真空中吸 附以及釋放玻璃基板。在對組的過程中，經過兩次的定位 程序’並且在上方玻璃基板與下方玻璃基板對位精準後， 由於液晶已經滴入於第二基板上，故需將玻璃基板腔體内 的壓力逐漸降低’之後達到預定真空規格之需求。最後再 4 201024828 以皮膜加壓及靜電釋放之方式，使得第一基板得以脫離上 板組，並與第二基板密合。 然而’先前提到整合液晶滴入製程中之真空壓合機， 在精密定位的過程中，會遇上如何在真空中將第一基板乎 順且快速的貼合於第二基板上而不能破壞框膠結構或均勻 性的問題。此外，對於第一基板脫離上固定板之實施，過 去的做法一般採用單純地解除靜電吸附或者辅以利用通過 φ 固定板鑽孔之氣流以強迫解除靜電吸附而使基板自由落雜 的方式。不論何種方式都必須要解決下列的問題： *上、下固定板之間加工平行度公差的限制，造成 密合時框膠的破壞； 籲第一基板脫離上固定板時，所產生的位移偏差； 癱快速處理靜電吸附/釋放。 ❹ 有鑑於此，本發明之主要範疇在於提供一種真空壓合裝 置，具有精密對位以及快速處理靜電吸附的釋放的功能。 【發明内容】 本發明之一範疇在於提供一種真空壓合裝置，具有基 板的精密對仙及快速釋放靜電吸_基板的功能了 根據-具體實施例，本發明之真空屢合裝置包含框架 =構、上板組以及下板組。上板組包含上板、上板連接機 複_吸魅。上板連錢構係輕上板與框架結 、、月b使上板相對於框架結構垂直移動。吸盤組係設置於 5 201024828 上板上，用以真空吸附第一基板。下板組包含下板及下板 連接機構。下板係相對上板設置，用以固定第二基板。下 板連接機構係連接下板與框架結構，並能使下板相對於框 架結構沿水平面移動及旋轉。 於此，施例中，上板連接機構能垂直移動上板使得第 基板與第二基板相距一適當距離，並且下板連接機構能 移動或旋轉下板使得第二基板與第一基板對位。201024828 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a vacuum pressing device. In particular, it relates to a vacuum forming device for positioning and repeating in a vacuum in a substrate. [Previous Art] The liquid crystal 注入 injection method of a conventional liquid crystal display (LCD) is to slowly inhale the liquid crystal by capillary principle after the pair of upper and lower glass substrates are paired. The disadvantage of this liquid crystal injection method is that it is very time consuming and wastes liquid crystal. . In the new One Drop Filling (ODF) method, the liquid crystal is directly dropped on the glass substrate, and then the pair of the upper and lower glass substrates in the vacuum is pressed. This new process saves time on liquid crystals and liquid crystal materials, especially in oversized panels. Taking the thirty-inch panel as an example, it takes about five days to fill a conventional liquid crystal method. The ODF takes only five minutes and saves about 4% of the liquid crystal material. In the past, the press-fit of the group was much easier than the current ODF process to achieve the press-fit in a vacuum environment because the process was performed in a state where the liquid crystal was not sealed. In order to achieve vacuum and positioning purposes, the ODF machine currently uses electrostatic attraction to absorb and release the glass substrate in a vacuum. In the process of pairing, after two positioning procedures' and after the upper glass substrate is aligned with the lower glass substrate, since the liquid crystal has been dropped on the second substrate, the pressure in the glass substrate cavity needs to be gradually increased. Reduce the need to reach a predetermined vacuum specification afterwards. Finally, 4 201024828, by means of film pressing and electrostatic discharge, the first substrate is separated from the upper plate group and is in close contact with the second substrate. However, the vacuum press that previously integrated the liquid crystal dropping process, in the process of precise positioning, will encounter how to apply the first substrate in a vacuum to the second substrate without being damaged. The problem of the sealant structure or uniformity. Further, in the case where the first substrate is detached from the upper fixing plate, the conventional method generally employs a method of simply releasing the electrostatic adsorption or supplementing the airflow drilled through the φ fixing plate to forcibly release the electrostatic adsorption to freely stack the substrate. In any case, the following problems must be solved: * The limitation of the parallelism tolerance between the upper and lower fixed plates, causing the damage of the sealant during the sealing; the displacement caused when the first substrate is detached from the upper fixed plate Deviation; 瘫 Quickly handle electrostatic adsorption/release. In view of the above, the main scope of the present invention is to provide a vacuum lamination apparatus having a function of precise alignment and rapid treatment of electrostatic adsorption release. SUMMARY OF THE INVENTION One aspect of the present invention is to provide a vacuum pressing device having the functions of a precision alignment of a substrate and a quick release electrostatic absorption substrate. According to a specific embodiment, the vacuum relay device of the present invention comprises a frame structure. , upper board group and lower board group. The upper board group includes the upper board and the upper board connecting machine. The upper plate is connected with the light structure and the frame, and the monthly b moves the upper plate vertically relative to the frame structure. The suction cup set is placed on the upper plate of 5 201024828 for vacuum suction of the first substrate. The lower plate group includes a lower plate and a lower plate connecting mechanism. The lower plate is disposed opposite to the upper plate for fixing the second substrate. The lower plate attachment mechanism connects the lower plate to the frame structure and enables the lower plate to move and rotate relative to the frame structure along a horizontal plane. In this embodiment, the upper board connecting mechanism can vertically move the upper board such that the first substrate and the second substrate are at an appropriate distance, and the lower board connecting mechanism can move or rotate the lower board such that the second substrate is aligned with the first substrate.
—因此，本發明之真空壓合裝置利用吸盤組真空吸附第 基板並可輕易地釋放第—基板’不會钱前技術甲因靜 =殘留而使基板不易脫離的問題；並且下板組之下板連接 構可使下板㈣於框架結構沿水平面移動及旋轉，進而 第一基板與第二基板精密對位之目的，避免了先前技 V壓合過程造成的偏移公差及框膠被破壞的問題。 關於本發明之優點與精神可以藉由以下的發明詳述及 所附圖式得到進一步的瞭解。 【實施方式】 例之置發明之較佳具想實施 裝置1之不思圖。如圖一所示，真空壓合裝 匕人 =架結構10、上板組12以及下板組14。上板組 126(^1 、上板連接機構124以及複數個吸盤組 鱼框年沾、一中}。上板連接機構124係連接上板122 動。並能使上板122相對於框架結構1〇垂直移 動及盤組126係設置於上板122上，用以朝下真空吸附 6 201024828 第一基板(未繪示於圖一中下板組14包含下板142以 及下板連接機構144。下板142係相對上板122設置，用 以承載並固疋第二基板(未繪示於圖一中）。下板連接機構 144係連接下板142與框架結構1〇 ’並能使下板142相對 於框架結構1〇沿水平面移動及旋轉。以下將針對本發明 之較佳具體實施例之真空壓合裝置丨作更深入的介紹與更 詳細的說明，包含其上各部位的結構與其功能以及作動方 式。 如圖一所示’上板連接機搆124包含四根導柱132、 氣麼缸134及施力板136。氣壓缸134固定於框架結構1〇 上，其滑動桿則連接施力板130。導柱132兩端分別固定 於施力板136及上板122。於本較佳具體實施例中，上板 122能藉由氣壓缸134連動施力板136以沿著垂直方向 N1向上移動。分別放入第一基板與第二基板於上板122 以及下板142之間，其中第一基板被吸盤組126真空吸 附，第二基板則固定於下板142。接著藉由氣壓缸134連 動施力板136以使上板122沿著垂直方向N1向下移動， 以使得第一基板與第二基板相距一適當距離。下板連接機 構144移動或旋轉下板142使得第二基板與第一基板對 位，並完成密封。然後在上板122與下板142之間抽成一 真空腔體。最後再由吸盤組126真空釋放(亦即，在吸盤 組126中充氣)使得第一基板自上板122被釋放，並可進 一步對吸盤組126充氣，使得第一基板被強迫脫離上板 122。在實際應科’第—基板以及第二基板可以分別為 液晶顯示器製程中玻璃基板的上板與下板。當玻璃基板之 上板與下板對位完成後，上板與下板形成容置空間，並且 7 201024828 被抽成真空。 請參閱圖二。圖二係繪示真空壓合裝置丨之上板組 12之示意圖。需要說明的是，於此較佳具體實施例中， 上板122進一步分為第一上板122A以及第二上板 122B。第一上板122A係與第二上板122B疊層連接，並 且在其上表面具有複數個通孔H1(擇一標示），其通孔H1 與抽氣機連接。第二上板122B亦具有許多通孔，可以將 ❹ 吸盤組126(未繪示於圖中)鎖固於其中。吸盤組120係藉 由抽氣機經由通孔H1抽氣而產生真空吸力以吸附第一基 板。 於此較佳具體實施例中，上板組12可進一步包含靜 電板(未繪示於圖中），設置於第二上板122B上，其靜電 板主要利用靜電力來吸附第一基板。當靜電板欲吸附第一 基板時’靜電板内部會通有—電塵。而產生電壓之電極會 使得第-基板導電並產生一相異電性，進而使得第一基板 ❹ 被靜電板所吸附。需要說明的是，靜電板表面進一步包含 許多通孔，可以使得吸盤組126通過對應的孔洞，進而使 得吸盤組126得叫靜電板—起吸附第—基板。吸盤組 126之結構及其作動詳述如後。 請-併參閱圖三A與圖三B。圖三A係纷示上板組 2之及盤組126之示意圖。圖三B係緣示圖三a之吸盤 組126之剖視圖。如圖三A以及圖三B所示，吸盤組 126包含座體1260、本體1262、心ϋ 1264以及彈性皮膜 1266。座體1260係利用複數個螺栓Β1鎖固於第二上板 8 201024828 122B上，並且包含有一個通孔H2。心袖i264係滑動地 設置於通孔H2中。本體1262係連接於心轴1264上。彈 性皮膜1266係包覆連接於本體1262，並與本體1262形 成腔體C卜彈性皮膜腿的外表面於吸附前將先貼附於 第一基板。當彈性皮膜1266與本體1262之間的腔體^ 與，一上板122A連通並被抽氣機抽氣時，腔體ei因被 抽氣形成負壓狀態進而使得彈性皮膜1266與第一基板之 間會形成真空室(未綠示於圖中），然後使得第一基板被吸 參 盤組126吸附。當第一基板需自上板122脫落時，吸盤組 12:會連通匕第一上板122A之通孔m，此時該通孔為 充=之狀態，使得吸盤組126之腔體C1充滿壓力，進而 使得彈性皮膜1266向外鼓張讓第一基板得以脫離上板 122。因此，即使第一基板有殘留的感應電荷，第一基板 仍將因外鼓的彈性皮膜1266而可順利脫離上板122。 於此較佳具體施實例中，每一個吸盤組126進一步包 含彈簧S1 ’並且壓縮地設置於座體126〇與本體1262之 間。^腔體C1被抽氣時，心轴1264會帶動本體1262與 彈簧si相對於座體1260作動，此時彈簧S1會受到壓縮 而產生預壓應力。當腔體C1被充氣時，彈簧S1會釋放 預壓應力，而使得心轴1264與本體1262會被推回原來的 位置。因此，縱使第一基板之平行度不佳，但因為各吸盤 組126之本體1262移動係獨立者，故仍可適應第一基板 各處之高度差以保持穩定的吸附。 凊參閱及圖四至圖六，並一併參閱圖二。圖四係繪示 真空壓合裝置1之下板組14的細部結構之透視圖。圖五 9 201024828 係缚示環狀彈性管件128、 142形成真空腔體 板、上盍146以及下板 置1之下板组Γ音 圖。圖六雜示真空壓合裝 下板組14進—步如圖二、圖四以及圖五所示， 盥 匕3上盍146，可以用來固定上板122 進一牛二人圖二所示，於此較佳具體實施例令，上板 130(擇一二Ά狀彈性管件128以及複數個固定構件 固上蓋146與上板122 °而複數個 彈性管件m、#接上蓋㈣與上板122,肋壓迫環狀 =二件28 ’藉以產生具有彈性之密封效果。此外，如 蓋146 I二板組14進—步包含密封環0卜係設置於上 程度。、I42之間，主要是用來保持腔體C2之氣密 =此=具體實施例中，當上板122射板142之間 ❹ 體C2B夺’首先，利用上蓋1㈣上板 22與下板142固絲—起。其中，上蓋⑽以及 =2之間具有—密封環⑴。接著，利 定r 13°將上板122、上蓋二二： 甚μΓ/ 使得環狀彈性管件128、上板122、上 之間形成一腔體C2。最後，利用抽氣 抽成真空腔體C2。其f ’環狀彈性管件 128以及鱗環⑴可以防止空氣進人腔體ο 而使腔體C2具有氣密之功能。 田 數個補充說明的是，於此較佳具體實施例中，複 數個固疋構件130包含螺栓Β2以及彈簧S2。彈簧S2係 201024828 壓應力壓縮地緊抵上蓋146與上板122。而 螺栓B2係穿過彈簧S2並連接上们杯與上板122。 平二：η四戶 下板連接機構144進一步包含水平移動 ^口 1440。水平移動平台144〇包含平台η以及虚平台 P1銜接之縱軸移動組件1440A及橫軸移動組件1440B， 明接於/工板142(未緣示於圖四中）。這在裡要補充說- Therefore, the vacuum pressing device of the present invention utilizes a suction cup set to vacuum-adsorb the first substrate and can easily release the first substrate. The problem is that the substrate is not easily detached due to the residual technique; The plate connection structure can make the lower plate (4) move and rotate along the horizontal plane of the frame structure, thereby precisely aligning the first substrate and the second substrate, thereby avoiding the offset tolerance caused by the prior art V-pressing process and the destruction of the sealant. problem. The advantages and spirit of the present invention will be further understood from the following detailed description of the invention. [Embodiment] The preferred embodiment of the invention is not intended to be implemented. As shown in Fig. 1, the vacuum press fits the frame structure 10, the upper plate group 12, and the lower plate group 14. The upper plate group 126 (^1, the upper plate connecting mechanism 124, and the plurality of suction cup groups, the fish frame is dipped, one middle}. The upper plate connecting mechanism 124 is connected to the upper plate 122, and can enable the upper plate 122 relative to the frame structure 1 The vertical movement and the disk group 126 are disposed on the upper plate 122 for vacuum-adsorbing the 6 201024828 first substrate (the lower plate group 14 is not shown in FIG. 1 and includes the lower plate 142 and the lower plate connecting mechanism 144. The plate 142 is disposed opposite to the upper plate 122 for carrying and fixing the second substrate (not shown in FIG. 1). The lower plate connecting mechanism 144 is connected to the lower plate 142 and the frame structure 1' and enables the lower plate 142. The movement and rotation of the frame structure 1 〇 along the horizontal plane. The vacuum compression device of the preferred embodiment of the present invention will be further described and described in more detail, including the structure and function of the various parts thereof. The upper plate connecting mechanism 124 includes four guide posts 132, a gas cylinder 134 and a force plate 136. The pneumatic cylinder 134 is fixed on the frame structure 1〇, and the sliding rod is connected to the force plate. 130. The two ends of the guide post 132 are respectively fixed to the force plate 136 and In the preferred embodiment, the upper plate 122 can be moved upwardly along the vertical direction N1 by the pneumatic cylinder 134. The first substrate and the second substrate are respectively placed on the upper plate 122 and Between the lower plates 142, wherein the first substrate is vacuum-adsorbed by the chuck group 126, and the second substrate is fixed to the lower plate 142. Then, the force plate 136 is linked by the pneumatic cylinder 134 to lower the upper plate 122 in the vertical direction N1. Moving so that the first substrate is at an appropriate distance from the second substrate. The lower plate connecting mechanism 144 moves or rotates the lower plate 142 such that the second substrate is aligned with the first substrate and the sealing is completed. Then on the upper plate 122 and the lower plate A vacuum chamber is drawn between the ends 142. Finally, the vacuum is released by the suction cup set 126 (i.e., inflated in the suction cup set 126) such that the first substrate is released from the upper plate 122, and the suction cup set 126 can be further inflated, such that A substrate is forcibly separated from the upper plate 122. In the actual application, the first substrate and the second substrate may respectively be the upper plate and the lower plate of the glass substrate in the liquid crystal display process. When the upper plate and the lower plate of the glass substrate are aligned, , upper and lower The plate forms an accommodating space, and 7 201024828 is evacuated. Please refer to FIG. 2. FIG. 2 is a schematic diagram showing the upper group 12 of the vacuum pressing device 。. It should be noted that, in the preferred embodiment, The upper plate 122 is further divided into a first upper plate 122A and a second upper plate 122B. The first upper plate 122A is laminated and connected to the second upper plate 122B, and has a plurality of through holes H1 on the upper surface thereof (optional indication) The through hole H1 is connected to the air extractor. The second upper plate 122B also has a plurality of through holes for locking the suction cup set 126 (not shown). The chuck group 120 generates vacuum suction by suction of the air through the through hole H1 to adsorb the first substrate. In the preferred embodiment, the upper board group 12 further includes an electrostatic board (not shown) disposed on the second upper board 122B, and the electrostatic board mainly uses an electrostatic force to adsorb the first substrate. When the electrostatic board is to be attracted to the first substrate, the inside of the electrostatic board will have electric dust. The electrode that generates the voltage causes the first substrate to conduct electricity and generate an electric phase difference, so that the first substrate ❹ is adsorbed by the electrostatic plate. It should be noted that the surface of the electrostatic board further includes a plurality of through holes, so that the suction cup group 126 passes through the corresponding holes, so that the suction cup group 126 is called an electrostatic plate to adsorb the first substrate. The structure of the suction cup set 126 and its actuation are detailed below. Please - see Figure 3A and Figure 3B. Figure 3A shows a schematic diagram of the upper plate group 2 and the disk group 126. Figure 3B is a cross-sectional view of the suction cup set 126 of Figure 3a. As shown in FIG. 3A and FIG. 3B, the suction cup set 126 includes a seat body 1260, a body 1262, a heart palpe 1264, and an elastic film 1266. The seat body 1260 is locked to the second upper plate 8 201024828 122B by a plurality of bolts Β 1 and includes a through hole H2. The sleeve i264 is slidably disposed in the through hole H2. The body 1262 is attached to the mandrel 1264. The elastic film 1266 is coated and attached to the body 1262, and forms a cavity with the body 1262. The outer surface of the elastic film leg is attached to the first substrate before being adsorbed. When the cavity between the elastic film 1266 and the body 1262 and the upper plate 122A communicate with each other and are pumped by the air extractor, the cavity ei is evacuated to form a negative pressure state, thereby causing the elastic film 1266 and the first substrate. A vacuum chamber (not shown in the figure) is formed, and then the first substrate is attracted by the chucking disc group 126. When the first substrate needs to be detached from the upper plate 122, the suction cup group 12: is connected to the through hole m of the first upper plate 122A, and the through hole is in a state of being charged, so that the cavity C1 of the suction cup group 126 is filled with pressure. In turn, the elastic film 1266 is bulged outwardly to allow the first substrate to be detached from the upper plate 122. Therefore, even if the first substrate has residual induced charges, the first substrate can be smoothly separated from the upper plate 122 by the elastic film 1266 of the outer drum. In the preferred embodiment, each of the suction cup sets 126 further includes a spring S1' and is compressively disposed between the base 126 and the body 1262. When the cavity C1 is pumped, the mandrel 1264 will move the body 1262 and the spring si relative to the seat 1260, at which time the spring S1 will be compressed to generate a pre-compressive stress. When the cavity C1 is inflated, the spring S1 releases the pre-stress, so that the mandrel 1264 and the body 1262 are pushed back to their original positions. Therefore, even if the parallelism of the first substrate is not good, since the movement of the body 1262 of each of the chuck groups 126 is independent, the height difference between the first substrates can be accommodated to maintain stable adsorption.凊 Refer to Figure 4 to Figure 6 and refer to Figure 2 together. Figure 4 is a perspective view showing the detailed structure of the plate group 14 under the vacuum pressing device 1. Figure 5 9 201024828 The interlocking elastic tube members 128, 142 form a vacuum chamber plate, the upper jaw 146 and the lower plate set 1 below. Figure 6 shows the vacuum press-fit lower plate group 14 step-by-step as shown in Figure 2, Figure 4 and Figure 5. The 盥匕3 upper 盍146 can be used to fix the upper plate 122 into a cow and two. In the preferred embodiment, the upper plate 130 (the second elastic member 128 and the plurality of fixing members are fixed on the upper cover 122 and the upper plate 122°, and the plurality of elastic tubes m and # are connected to the upper cover (four) and the upper plate 122, The rib compression ring = two pieces 28' to create an elastic sealing effect. In addition, if the cover 146 I two plate group 14 step-by-step includes the sealing ring 0 is set to the upper degree. Between I42, mainly used Keeping the airtightness of the cavity C2 = this = in the specific embodiment, when the upper plate 122 is between the plate 142, the body C2B is taken up. First, the upper cover 1 (four) upper plate 22 and the lower plate 142 are fixed together. Among them, the upper cover (10) And a seal ring (1) is provided between = 2. Then, the upper plate 122 and the upper cover are two: two μ: / so that a cavity C2 is formed between the annular elastic tube member 128, the upper plate 122 and the upper portion. Finally, the evacuation chamber is used to evacuate the vacuum chamber C2. The f' annular elastic tube member 128 and the scale ring (1) prevent air from entering the chamber. o The cavity C2 has a function of airtightness. In the preferred embodiment, the plurality of solid members 130 comprise a bolt Β2 and a spring S2. The spring S2 is 201024828 compressively compressively compressed The upper cover 146 and the upper plate 122 are fastened. The bolt B2 is passed through the spring S2 and connected to the upper cup and the upper plate 122. The second: n-four lower plate connecting mechanism 144 further includes a horizontal moving port 1440. The horizontal moving platform 144 The vertical axis moving component 1440A and the horizontal axis moving component 1440B including the platform η and the virtual platform P1 are connected to the / board 142 (not shown in Figure 4).
1440Λ疋平移動平台M4G可以藉由縱軸移動組件 A以及橫軸移動組件14棚鶴下板142(如圖六所 不)產生位移，進而使得第二基板沿著水平面（即圖中水平 方向N2A及N2B所建構出之平面)移動。 於此較佳具體實施例當中，縱軸移動組件Μ·包 含致動器14舰、_ S3以及一滑塊板i44〇A2。致動 器1440A1 ©定於框架構件1〇(未繪示於圖四中)並與平台 P1銜接。當致動器1440A1致動平台P1移動時，平台ρι 會進-步使下板142移動(如圖六所示）。彈簧S3係相對 於致動器1440A1 it接於平台ρι及框架結構1〇，當致動 器144〇A1作動時’彈簧S3會相對於致動器m〇A1作 動，藉以穩固平台P1。滑塊組144〇A2係連接下板 142(未繪示於圖四中）與框架結構1〇，可以用來導引水平 移動平台1440移動。同樣地，橫轴移動組件M4〇B包含 致動器、彈簧S4以及一滑塊組144〇B2。致動器 1440B1固定於框架構件10(未繪示於圖四中)並與平台μ 銜接。當致動器1440Β1致動平台P1移動時，平'台&會 進一步使下板142移動(如圖六所示）。彈簧弘^相對^ 致動器1440Β1連接於平台P1及框架結構1〇，當致動器 11 201024828 1440B1作動時，彈簧S4會相對於致動器1440B1作動， 藉以穩固平台P1。滑塊組1440B2係連接下板142(未繪示 於圖四中）與框架結構10，可以用來導引水平移動平台 1440移動。The 1440 移动 flat mobile platform M4G can be displaced by the longitudinal axis moving component A and the horizontal axis moving component 14 of the shed lower plate 142 (as shown in FIG. 6), so that the second substrate is along the horizontal plane (ie, the horizontal direction in the figure is N2A). And the plane built by N2B) moves. In the preferred embodiment, the longitudinal axis moving assembly includes an actuator 14 ship, _S3, and a slider plate i44A2. Actuator 1440A1 is positioned in frame member 1 (not shown in Figure 4) and engages platform P1. When the actuator 1440A1 actuates the platform P1 to move, the platform ρι advances the lower plate 142 (as shown in Figure 6). The spring S3 is coupled to the platform ρι and the frame structure 1 相对 with respect to the actuator 1440A1. When the actuator 144 〇 A1 is actuated, the spring S3 is actuated relative to the actuator m 〇 A1 to stabilize the platform P1. The slider set 144A2 is connected to the lower plate 142 (not shown in FIG. 4) and the frame structure 1〇, and can be used to guide the horizontal movement platform 1440 to move. Similarly, the horizontal axis moving assembly M4〇B includes an actuator, a spring S4, and a slider group 144〇B2. The actuator 1440B1 is fixed to the frame member 10 (not shown in Fig. 4) and is engaged with the platform μ. When the actuator 1440Β1 actuates the platform P1 to move, the flat 'stage& will further move the lower plate 142 (as shown in Fig. 6). The spring 14 is coupled to the platform P1 and the frame structure 1 〇. When the actuator 11 201024828 1440B1 is actuated, the spring S4 is actuated relative to the actuator 1440B1 to stabilize the platform P1. The slider set 1440B2 is coupled to the lower plate 142 (not shown in FIG. 4) and the frame structure 10, and can be used to guide the horizontal movement platform 1440 to move.
如圖四所示，下板連接機構144進一步包含旋轉移動 平台1442，可以用來旋轉下板142，使得第二基板沿著水 平面旋轉。其中，旋轉移動平台包含平台P1(與水平移動 平台144〇共用）、旋轉座1442A、施力組1442B以及二個 彈簧片1442C。旋轉座1442A可以旋轉地設置於平台ρι 上。二個彈簧片1442C可以相對地連接於旋轉座1442A 上。施力組1442B可以設置於平台Pi上，並經由二個彈 簧片1442C轉動旋轉座1442A。其中施力組1442B包含 減速機構及串聯壓電致動器，減速機構可為渦桿（亦即， 渦齒機構或行星式減速機構）。 於此較佳具體實施例中，當第一基板與第 ^ /土、/队六尔一丞孜欲進 打精猶對位時，可以先調整水平移動平台1440。藉由水 1=2台也1440之橫轴移動組件l44〇B以及縱軸移動組 件44〇A來驅使第二基板在水平面方向移動。接 調1442，藉由旋轉移動平台可以使得第 旋轉。由以上之步驟可以使得第一基板 與第一基板I有精密對位之功效。 麼合圖七並一併參閱圖四。圖七編真空 接。I5 148之示意圖。如圖六所 立 板142包含複數個 =二L ’其中下 叫通孔H3(擇一標不）。並且，如圖四及 12 201024828 圖七所不’下板組14進一步包含複數個承載部148。其 中’複數個承載部148分別滑動設置於對應的通孔H3 中’使得複數個承載部148能突出對應的通孔H3以承載 第一基板。此外’圖七所示，其中每一個承載部148與通 孔之間包含一密封環〇2，用以使承載部148與對應的通 孔H3間密封，以維持真空腔體c2(如圖五所示）之氣密狀 態。並且，每一個承載部148與第二基板之間會也有一密 封裱03，用於以承載部吸附第二基板時，產生真空 ❹ 氣至之用。 請參閱圖八。圖八係繪示根據本發明之較佳俱體實施 例之真空壓合方法之流程圖。其係應用於如圖一之真空壓 合裝置1，包含下列步驟。 首先’該真空壓合方法執行步驟Si〇，將上板122藉 由氣壓缸垂直方向向施力板136移動。接著，該真空壓合 方法執行步驟sn，將第一基板載入於真空壓合裝置^當 ❹ 中（亦即上板122與下板M2之間），然後起動口承載部二 真空吸附第一基板並推往上板122。 隨後，該真空壓合方法執行步驟S14，當第一基板貼 附上板122時，啟動上板組12之吸盤組126真空吸附， 其後，啟動靜電吸附；吸附後’承载部148卸除真空吸附 並退回原位m真空壓合方法執行步驟si6:將 二基板載人於真空壓合裝置i當中（亦即上板122鱼 之間）’並利用承載部148真空吸附。 之後，該真空壓合方法執行步驟Sl8，下降第一基板 13 201024828 使之與第二基板相距適當距離，再利用下板組14之水平 移動平台1440以及旋轉移動平台1442將第一基板以及第 二基板進行對位。其中，該適當距離之設定係為使位於第 基板與第一基板間之液晶不致因該適當距離過小而受過 度壓迫流失，亦不致因該適當距離過大而無法有效充 基板與第一基板間之空間，故此距離之值應視實際產σ 製造情形而定，此為該技術領域之人所習知者，故不待g 述0 接下來’該真空壓合方法執行步驟S20，利用上蓋 146將上板122以及下板142鎖合在一起，並利用抽氣機 抽氣使得上板122、下板142以及上蓋146之間形成—真 空腔體C2,其中第一基板與第二基板位於上板122以及 下板142之間。 ^最後，該真空壓合方法執行步驟S22，解除上板122 靜電吸附及真空吸附，並且改為吹氣使得吸盤組126受到 ® 吹使雜皮膜1266鼓張，進而讓第—基板得以 從上板122被釋放。並經由皮膜之作用，準確無誤的將第 基板釋放於第二基板之上，並經由皮膜加壓，使第—及 第二基板可均勻的密封。 相較於相先前技術，本發明之真空壓合裝置利用吸盤 2真空吸附第—基板並可輕易地釋放第-基板，不會有先 月’J技術中因感應靜電殘留而使基板不易脫離的問題；並且 下板組之下板連接機構可使下板相對於框架結構沿水平面 移動及旋轉，進而達到第一基板與第二基板精密對位之目 201024828 的，避免了先前技術中壓合過程造成的偏移公差及膠框被 破壞的問題。 藉由以上較佳具體實施例之詳述，係希望能更加清楚 描述本發明之特徵與精神，而並非以上述所揭露的較佳具 體實施例來對本發明之範脅加以限制。相反地，其目的是 希望能涵蓋各觀變及具相雜的安排於本發明所欲申請 之專利範圍的範.内。 【圖式簡單說明】 裝置根據本發明之較佳频實關之真空壓合 圖 圖二係繪示真空壓合裝 置之上板組的部結構之示意 罄 圖 係繪不真空壓合I置之吸魅之示意圖。 係—之吸盤組之剖視圖。 Μ不真空壓合裝置之下板組細部結構之示意 上板、上蓋以及下板形成 真空彈性管件、 圖六係繪示真空腹 圖 七係％示真办 合裴置之下板組之示意圖 壓合裝置之承接部之示意 圖 15 201024828 圖八係繪示根據本發明之較佳俱體實施例之真空壓合 方法之流程圖。 【主要元件符號說明】 1 :真空壓合裝置 10 :框架結構 12 :上板組 122 :上板 122A :第一上板 參 122B :第二上板 124 :上板連接機構 126 :吸盤組 1260 :座體 1262 :本體 1264 :心轴 1266 :彈性皮膜 128 :環狀彈性管件 130 :固定構件 132 :導柱 134 :氣壓缸 ® 136:施力板 14 :下板組 142 :下板 144 :下板連接機構 1440 :水平移動平台 1440A :縱軸移動組件 1440B :橫軸移動組件 1440A1、1440B1 :致動器 1440A2、1440B2 :滑塊組 1442 :旋轉移動平台 1442A :旋轉座 1442B :施力組 16 201024828 1442C :彈簧片 146 :上蓋 148 :承載部 B卜B2 :螺栓 Cl、C2 :腔體 HI、H2、H3 :通孑L 0卜02、03 :密封環 P1 :平台 SI、S2、S3、S4 :彈簧 N1 :垂直方向 參 N2A、N2B:水平方向 S10〜S22 :實施步驟 ❿ 17As shown in Figure 4, the lower plate attachment mechanism 144 further includes a rotational movement platform 1442 that can be used to rotate the lower plate 142 such that the second substrate rotates along a horizontal plane. The rotary moving platform includes a platform P1 (shared with the horizontal moving platform 144A), a rotating base 1442A, a force applying group 1442B, and two spring pieces 1442C. The rotary seat 1442A is rotatably disposed on the platform ρι. Two spring pieces 1442C can be oppositely coupled to the rotating base 1442A. The force applying group 1442B may be disposed on the platform Pi and rotate the rotating base 1442A via the two spring pieces 1442C. The force applying group 1442B includes a speed reducing mechanism and a series piezoelectric actuator, and the speed reducing mechanism may be a scroll (ie, a scroll mechanism or a planetary speed reducing mechanism). In the preferred embodiment of the present invention, when the first substrate is in alignment with the first/earth and/or the team, the horizontal moving platform 1440 may be adjusted first. The second substrate is moved in the horizontal direction by the horizontal axis moving assembly l44 〇 B of the water 1 = 2 and 1440 and the vertical axis moving assembly 44 〇 A. Tuning 1442, the first rotation can be made by rotating the mobile platform. The above steps can make the first substrate and the first substrate I have a precise alignment effect. See Figure 4 and see Figure 4. Figure 7 is a vacuum connection. Schematic diagram of I5 148. As shown in Fig. 6, the vertical plate 142 includes a plurality of = two L's, which are referred to as through holes H3 (optional). Moreover, as shown in Figures 4 and 12, 201024828, Figure 7 does not include a plurality of carrier portions 148. The plurality of carrying portions 148 are respectively slidably disposed in the corresponding through holes H3 so that the plurality of carrying portions 148 can protrude the corresponding through holes H3 to carry the first substrate. In addition, as shown in FIG. 7, each of the bearing portion 148 and the through hole includes a sealing ring 〇 2 for sealing the bearing portion 148 and the corresponding through hole H3 to maintain the vacuum chamber c2 (see FIG. The airtight state shown). Moreover, there is also a sealing 裱03 between each of the carrying portions 148 and the second substrate for generating vacuum enthalpy when the second substrate is adsorbed by the carrying portion. Please refer to Figure 8. Figure 8 is a flow chart showing a vacuum compression method according to a preferred embodiment of the present invention. It is applied to the vacuum pressing device 1 shown in Fig. 1, and includes the following steps. First, the vacuum pressing method performs the step of 〇, and the upper plate 122 is moved to the urging plate 136 by the vertical direction of the pneumatic cylinder. Then, the vacuum pressing method performs step sn, loading the first substrate into the vacuum pressing device (that is, between the upper plate 122 and the lower plate M2), and then the starting port bearing portion is vacuum-adsorbed first. The substrate is pushed to the upper plate 122. Subsequently, the vacuum pressing method performs step S14. When the first substrate is attached to the upper plate 122, the suction cup group 126 of the upper plate group 12 is activated to be vacuum-adsorbed, and thereafter, electrostatic adsorption is started; after the adsorption, the load-bearing portion 148 removes the vacuum. Adsorption and retraction in situ m vacuum compression method performs step si6: the two substrates are carried in the vacuum pressing device i (ie, between the upper plate 122 fish) and vacuum-adsorbed by the bearing portion 148. Then, the vacuum pressing method performs step S18, lowering the first substrate 13 201024828 to an appropriate distance from the second substrate, and then using the horizontal moving platform 1440 of the lower plate group 14 and the rotating moving platform 1442 to the first substrate and the second substrate. The substrate is aligned. Wherein, the appropriate distance is set such that the liquid crystal between the first substrate and the first substrate is not excessively pressed due to the excessively small distance, and the appropriate distance is not too large to effectively fill the substrate and the first substrate. Space, so the value of the distance should be determined according to the actual production σ manufacturing situation, which is known to those skilled in the art, so it is not necessary to say 0. Next, the vacuum pressing method performs step S20, and the upper cover 146 is used. The first and second substrates are located on the upper plate 122. And between the lower plates 142. Finally, the vacuum pressing method performs step S22 to release the electrostatic adsorption and vacuum adsorption of the upper plate 122, and the blowing is changed so that the suction cup group 126 is blown by the ® film 1266, thereby allowing the first substrate to be lifted from the upper plate. 122 was released. And through the action of the film, the first substrate is released on the second substrate accurately and pressurized through the film, so that the first and second substrates can be uniformly sealed. Compared with the prior art, the vacuum pressing device of the present invention vacuum-adsorbs the first substrate by the suction cup 2 and can easily release the first substrate, and there is no problem that the substrate is not easily separated due to the induction of static electricity residue in the prior art. And the lower plate connecting mechanism of the lower plate group can move and rotate the lower plate along the horizontal plane relative to the frame structure, thereby achieving the precision alignment of the first substrate and the second substrate 201024828, thereby avoiding the pressing process in the prior art. The offset tolerance and the problem of the plastic frame being destroyed. The features and spirit of the present invention are intended to be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover the various aspects of the invention and the scope of the invention as claimed. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 2 is a schematic diagram showing the structure of a portion of a plate assembly on a vacuum compression device according to the preferred embodiment of the present invention, and is not vacuum-pressed. A schematic diagram of the charm. A cross-sectional view of the suction cup set.示意The vacuum plate is formed on the upper plate, the upper cover and the lower plate of the detailed structure of the plate group under the vacuum pressing device, and the vacuum plate is formed on the upper cover and the lower plate. Schematic diagram of the receiving portion of the device 15 201024828 FIG. 8 is a flow chart showing a vacuum pressing method according to a preferred embodiment of the present invention. [Main component symbol description] 1 : Vacuum pressing device 10 : Frame structure 12 : Upper plate group 122 : Upper plate 122A : First upper plate reference 122B : Second upper plate 124 : Upper plate connecting mechanism 126 : Suction cup set 1260 : Seat 1262: body 1264: mandrel 1266: elastic film 128: annular elastic pipe member 130: fixing member 132: guide post 134: pneumatic cylinder® 136: force plate 14: lower plate group 142: lower plate 144: lower plate Connection mechanism 1440: horizontal movement platform 1440A: vertical axis movement assembly 1440B: horizontal axis movement assembly 1440A1, 1440B1: actuators 1440A2, 1440B2: slider group 1442: rotary movement platform 1442A: rotary seat 1442B: force group 16 201024828 1442C : Spring piece 146 : Upper cover 148 : Bearing part B b B2 : Bolt Cl, C2 : Chamber HI, H2, H3 : Through L 0 Bu 02, 03 : Seal ring P1 : Platform SI, S2, S3, S4 : Spring N1: vertical direction reference N2A, N2B: horizontal direction S10~S22: implementation step ❿ 17