201024608 九、發明說明： 【發明所屬之技術領域】 本發明係涉及一種半導體照明裝置，尤係關於一種發 光二極體燈具及其所採用的光引擎。 【先前技術】 人們由於長期過度依賴石化燃料，除造成能源短缺及 石油價格高漲而牽動經濟發展，更使全球二氧化碳與有害 ❹氣體的排放濃度日益增加，導致地球暖化所引起的氣候反 常、生態環境的破壞、以及對人類生存的危害日益顯現， 為永續經營人類賴以生存的地球生態環境，必須同時解決 能源危機與環境污染問題，開發新能源及再生能源是推動 節約能源及高效率使用能源最重要的策略，而傳統照明所 消耗的能源極為可觀，發展照明節能將是最重要的新能源 科技，而半導體照明採用高功率高亮度的發光二極體光源 如發光二極體（LED)為光源，該新光源以其高發光效率、節 旎、長壽、環保（不含汞）、啟動快、指向性等優點，具有廣 泛取代傳統照明光源的潛力。 LED由於輸入電能的80%〜9〇%轉變成為熱量，只有 10%〜20%轉化為光能，且由於LED芯片面積小因此芯片 散熱是LED封裝必須解決的關鍵問題；優良的散熱系統可 在同等輸入功率下得到較低的工作溫度，延長LED的使用 壽命，或在同樣的溫度限制範圍内，增加輸入功率或芯片 密度，從而增加LED燈的亮度；結點溫度（Juncti〇n 201024608 temperature)是衡量LED封裝散熱性能的重要技術指標，由 於散熱不良導致的結點溫度升高，將嚴重影響到發光波 長、光強、光效和使用壽命。 一應用高功率高亮度LED在照明的新光源上，必須配合 高效率的散熱機構以儘量降低LED的結點溫度，才能發揮 上述諸多優點’否則照明裝置的發光亮度、使用壽命將大 打折扣，影響所及將使該照明裝置的節能效果不彰並直 ❿接衝擊該照明裝置的可靠度，引發嚴重的光衰甚至使照明 裝置失效。 習知半導體照明裝置嘗試將光源發光時釋出的熱量藉 由在縛片#開設與外界較低溫空氣接觸的大散熱面積來達 成，惟因無法在有限的照明裝置容許空間内同時建立低流 ，的冷卻氣流通道及低熱阻的導熱通道，以致不易將該熱 量快速而均句的傳輸到所述散熱面積上，而且不易將傳輸 到所述散熱面積上的該熱量快速移除，以致無法彰顯整體 ❹的散熱效果，終因長期結點溫度過高而導致光衰及影響照 明品質的穩定性。 【發明内容】 ρ有馨於此’有必要提供一種具有高散熱效率之全方位 發光一極體燈具’並提供一種該發光二極體燈具所採用的 光引擎。 ^ 種發光二極體燈具，包括一光學部、一電氣部及一 散熱7。該光學部包括一發光二極體光源及一出光通道， $ Μ提供所需的照明亮度與發光特性及對發光二極體光源 8 201024608 保護。該電氣部包括一護罩及一電路板，用以提供發光二 極體光源所需要之驅動電源、控制電路及電源管理。該散 熱部包括設於電氣部之護罩與光學部之間的一散熱器及至 少一熱管’該散熱器包括一呈環狀的散熱基座、呈放射狀 分佈於該散熱基座的一外表面的複數鰭片及設於散熱基座 罪近光學部之一端的一吸熱板。該散熱基座内設有朝向護 罩之一端開口的一腔體，所述發光二極體光源與吸熱板朝 ❹向光學部的一外表面熱接觸；所述熱管設於散熱基座之腔 體内’該熱管包括一蒸發段及至少一冷凝段，熱管之蒸發 段與吸熱板朝向電氣部的一内表面熱接觸，熱管之冷凝段 與散熱基座的一内表面熱接觸。 作為該發光二極體燈具的進一步改進，該該散熱基座 於靠近吸熱板的一端環設有對應於該等鰭片之間的複數氣 1 ’以形成一導引冷卻氣流流經該腔體的氣流通道。 作為該發光二極體燈具的進一步改進，該電路板設於 ❹腔體内。 一種光引擎，包括一發光二極體光源、一散熱器至少 一熱管，該散熱器包括一呈環狀的散熱基座、呈放射狀分 佈於該散熱基座之外表面的複數鰭片及設於散熱基座之一 端的一吸熱板，該散熱基座内設有朝向散熱基座之另一端 開口的一腔體，所述發光二極體光源與吸熱板的一外表面 熱接觸；所述熱管設於散熱基座之腔體内，該熱管包括一 蒸發段及至少一冷凝段，熱管之蒸發段與吸熱板的一内表 面熱接觸，熱管之冷凝段與散熱基座的一内表面熱接觸。 9 201024608 本發明具有如下優點·· 提供一種具有高散熱效率的光引擎，藉由吸熱板以強 化發光一極體光源與散熱器的熱連接及增加吸熱與散熱面 積，並配合熱管與吸熱板及鰭片的熱連接，進一步強化對 發光一極體光源的吸熱效率及提升鰭片的均勻散熱效率。 提供一種具有低熱阻導熱通道的發光二極體燈具，藉 由熱管與吸熱板及鰭片的熱連接，大幅降低發光二極體光 ❹源至鰭片間的熱阻，使發光二極體光源的結點溫度長期處 於低溫狀態，從而獲得半導體照明提供的高光效、穩定出 光、長壽命等諸多優點。 提供一種具有低流阻冷卻氣流通道的發光二極體燈 具，藉由散熱基座於靠近吸熱板的一端所設對應該等鰭片 之間的複數氣孔，額外在散熱器之腔體内形成自外界持續 導引冷卻氣流的通道，使腔體内壁形成一擴增的散熱面 積，從而建立一種適用於自然循環及強制對流的低流阻冷 ❹卻氣流通道，進一步強化光引擎的散熱效果。 提供一種輕巧的高效率發光二極體燈具，藉由將電氣 部t的電路板設置於散熱器的腔體内，使該發光二極體燈 具因整體長度的縮短而更加輕巧，並藉由腔體内部的冷卻 機制’使電氣部與散熱部中的熱量得以順利移除，確保該 發光二極體燈具的高發光效率與品質。 【實施方式】 以下參照圖1至圖8,對本發明發光二極體燈具及其光 引擎予以進一步說明。 201024608 圖1係本發明發光二極體燈具1〇〇第一實施例之組裝 «J面示意圖，圖2係圖1所示發光二極體燈具1〇〇中光引 擎21部分之示意圖，圖3係圖2中散熱器22去掉吸熱板 23之立體圖’圖4係圖2中吸熱板23之立體圖，圖5係圖 2中吸熱板23與熱管24之立體組裝圖；該發光二極體燈具 100主要包括一光學部一散熱部2〇及一電氣部。 光學部10其係設置於散熱部2〇前方，包括一發光二 極體光源11及一出光通道12，該發光二極體光源u為一 體成型件，包括一導熱基板lu及設於該導熱基板lu上 的至 發光體112及複數電極（圖未示），其中所述發 光體112係由至少一發光二極體晶片經透明封裝所形成； 所述發光二極體光源11之導熱基板ln與散熱部2〇的一 吸熱板23的一外表面231之間的緊密熱接觸可先在其間塗 抹一層熱界面材料（TIM),再將已套裝電絕緣墊片的複數 螺絲（圖未示）分別穿過導熱基板ηι上的複數固定孔（圖 馨未示），以便鎖固於散熱部20之吸熱板23上對應所設螺 孔（圖未示）’亦可藉由迴焊方式將導熱基板直接黏 貼（SMT)於該吸熱板23上，以傳輸及移除該發光二極體光 源11發光時釋出的熱量；該發光二極體光源的發光可 藉由電線114連接發光二極體光源11之電極與電氣部3〇 中的一電路板31以及藉由電線311連接電路板31與外部 電源達成。 所述發光二極體光源11與吸熱板23之間的緊密熱接 觸還可藉由先對吸熱板23之外表面231進行電絕緣處理， 11 201024608 然後在經電絕緣處理的該吸熱板23之外表面231上鋪設基 板電路如銅鉑基板電路，再將至少一發光二極體晶片與所 述基板電路電連接並於發光二極體晶片外包覆一透明封裝 體而達成，採用此種方式之發光二極體光源不包含導熱基 板111，從而避免導熱基板111與吸熱板23之間接觸熱阻 的産生’發光二極體光源11所産生的熱量可直接由吸熱板 23吸收並予以快速散發，可進一步提升散熱效率；為方便 ❿敍述，本實施例及以下實施例皆僅以包含有導熱基板m 之發光二極體光源11予以說明’實際上，各實施例中之發 光二極體光源11皆可用上述不含導熱基板111之發光二極 體光源替代。 出光通道12包括一光杯121及一環形的導光罩122, 其中該光杯121為向外擴散的錐面以導引該發光二極體光 源11向外射出光線，該光杯121底部設有供該發光二極體 光源11凸伸至該光杯121内的通孔123，導光罩122為包 ❹括至少一光學鏡片124的罩蓋，以提供發光二極體燈具1〇〇 所需的照明分佈、發光特性及對發光二極體光源11保護的 功能。上述導光罩122中的光學鏡片124亦可在封裝過程 中直接與發光二極體光源11 一體成型，以避免二次光學造 成的光損耗。 在實際應用時，上述發光二極體光源11亦可由複數分 離的發光體組合而成，此時出光通道12中的光杯121及導 光罩122可以是對應於該複數分離的發光體分開設置，亦 可以只用一個光杯121及導光罩122的配置。 12 201024608 電氣部30包括電路板31、一護罩32及設於該護罩32 一端的一燈頭33，該電路板31係與發光二極體光源11的 電極及與外部電源電連接，上述外部電源除可為適合該發 光二極體光源11的直流電源外，亦可透過電源轉換器將交 流市電轉換為適合該發光二極體光源11的直流電源，本實 施例僅以燈頭33與市電連接的方式說明，以搭配該電路板 31提供該發光二極體光源11之驅動電源及發光二極體燈 具100之電源管理；該護罩32係罩蓋該電路板31的一環 ®形的殼體，該護罩32底部鎖固有一底座34,該底座34上 設有連通護罩32與散熱部20的複數通孔341，該護罩32 内壁設有複數定位座321以便與電路板31上所設對應的定 位柱312接合以固定該電路板31;該護罩32之頂部設有供 氣流進出之複數氣孔322，以便將將電路板31產生的熱量 散出；另外，該護罩32上還設置有一圍設於該複數氣孔322 的防塵蓋35，以防止外部的灰塵進入護罩32内。 φ 散熱部20設於該電氣部30之護罩32與光學部10之 間，該散熱部20包括一散熱器22及複數熱管24。由所述 發光二極體光源11、散熱器22及熱管24組成一光引擎21。 該散熱器22由導熱性佳的材質製成，包括一呈環狀的散熱 基座221、呈放射狀分佈於該散熱基座221之外表面的複數 鰭片222及用於吸收發光二極體光源11所産生之熱量的吸 熱板23。該散熱基座221内設有朝向電氣部30之護罩32 開口的一腔體223，所述腔體223之内表面於靠近光學部 20的一端設有一環形的卡槽224，所述吸熱板223設於腔 13 201024608 體223靠近光學部10的一端並收容於該卡槽224内。另外， 散熱基座221於靠近吸熱板223的一端環設有對應於該等 鰭片222之間的複數氣孔225,以形成自外界將冷卻氣流導 入該腔體223内的複數氣流通道。 該等熱管24係内設有毛細結構及填充有工作流體的管 體，用於接合吸熱板23與散熱基座221，本實施例中，該 等熱管24包括兩L形熱管241及一 U形熱管242。其中， 該等熱管24還可以為其他形式的組合。所述L形熱管241 ®包括一蒸發段2411及一冷凝段2412，所述U形熱管242 包括一蒸發段2421及兩冷凝段2422 ;吸熱板23用於接合 發光二極體光源11與熱管241、242之蒸發段2411、2421。 本實施例中，吸熱板23為與散熱器22相分離的部件，其 中該吸熱板23亦可與散熱器22 —體成型。發光二極體光 源11産生之熱量的傳輸及散發係透過熱管241、242之蒸 發段2411、2421與吸熱板23的一内表面232熱接觸，並 ❹將熱管241、242之冷凝段2412、2422與散熱基座221之 内表面熱接觸’以便藉由熱管241、242在熱量傳輸的超導 性及均溫性’將發光二極體光源n的熱負荷快速而均勻地 分佈於具較大散熱面積的鰭片222，進而散發到大氣。 為使熱管241、242與吸熱板23及散熱基座221結合 更緊密，本實施例中’熱管241、242係經過壓扁整平及折 彎處理’散熱基座221之内表面設有複數沿散熱基座221 之軸向延伸的收容槽226 ’熱管241、242之冷凝段2412、 2422收容於該等收容槽226内’並與該收容槽226的内表 201024608 面熱連接。該吸熱板23之内表面232設有複數凹槽233， 該等凹槽233呈十字交叉狀，熱管241、242之蒸發段2411、 2421收容於該等凹槽233内，並與該凹槽233的内表面熱 連接。所述熱連接的方式，可採用迴焊處理或以鎖固片（圖 未示）壓制熱管241、242朝該收容槽226或該凹槽233的外 表面，以使熱管241、242的另一表面與該收容槽226或該 凹槽233的内表面緊密熱連接，為達更佳的緊密熱連接， 在熱接觸面上可先在其間塗抹一層熱界面材料（TIM)，再 以鎖固片（圖未示）壓制該熱管241、242。 該發光二極體燈具100運用熱管241、242將發光二極 體光源11的熱負荷快速而均勻地傳至具較大散熱面積的鰭 片222進行散發，不但因大幅降低發光二極體光源11至鰭 片222間的熱阻而使發光二極體光源11的結點溫度長期處 於低溫狀態，從而獲得半導體照明提供的高光效、出光穩 定、長壽命等諸多優點，且由於組件的量產性而大幅降低 ❿成本。 該發光二極體燈具100中，藉由氣流溫度差導致的密 度差所產生的熱浮力，使進入各鰭片222之間的冷空氣吸 收由發光二極體光源11傳至鰭片222的熱量而升溫並上 浮，並藉由熱空氣向上漂浮的慣性趨勢使鰭片222外的冷 空氣沿與鰭片222垂直的方向進入該鰭片222之間的流阻 降低；同時，新的冷空氣會自動填補該已上浮的熱空氣空 間，並同樣經吸熱升溫上浮而發揮鰭片222局部散熱的效 果；當該等上浮的較熱氣流繼續順利流經設有大面積複數 15 201024608 通孔341的底座34，並由電氣部30之護罩32的頂端所設 大面積複數氣孔322排出，來持續導引較低溫冷卻氣流進 入鰭片222之間，藉以在該發光二極體燈具100中形成對 自然循環最有利於低流阻的熱浮力氣流通道，達到有效移 除該發光二極體光源11發光時釋出的熱量。 為進一步強化發光二極體燈具100之散熱效果，散熱 基座221於靠近吸熱板23的一端環設有對應於該等鰭片 222之間的複數氣孔225，以形成自外界將冷卻氣流導入該 ®腔體223内的複數氣流通道，亦即由於導引發光二極體光 源11釋出的熱量而使該散熱器22的腔體223内壁呈現較 高的溫度，並加熱腔體223中的空氣，致該腔體223内的 熱空氣的密度降低而上浮，進而自散熱基座221之腔體223 朝上的開口排出離開腔體223,並繼續順利流經設有大面積 複數通孔341的底座34,再由電氣部30頂端壁面所設複數 大面積複數氣孔322排出，從而驅動外界較低溫的空氣持 ❿續自該複數氣孔225導入腔體223中，形成腔體223内的 自然冷卻循環，達到進一步強化發光二極體燈具100之散 熱效果。 該發光二極體燈具100結合在散熱基座221之腔體223 内壁所擴增的散熱面積，並由散熱基座221所設的複數氣 孔225導引氣流強制流過該擴增的散熱面積而形成一新增 的氣流通道，使該光引擎21的散熱效果遠優於習知技術， 從而確保應用在半導體照明上獲致低結點溫度的高效率照 明效果。 16 201024608 圖6係本發明發光二極體燈具100a第二實施例之組裝 剖面示意圖；本實施例與第一實施例的主要區別在於：本 實施例中發光二極體燈具l〇〇a的散熱部20a包括一風扇 25，該風扇25包括一扇框251及一扇輪252，該扇輪252 可旋轉地安裝於扇框251的一頂板253上，該頂板253上 設有複數氣流開口 254，扇框251與電氣部30之護罩32 之間設有一環形的間隔件26,該間隔件26上設有複數氣流 開口 262作為風扇25運作時的進風或排風口，該發光二極 ®體燈具l〇〇a除可藉由冷熱空氣的自然對流散熱外，並於發 光二極體光源11的結點溫度超過設定值時由控制電路啟動 風扇以強化散熱能力；本實施例亦針對高功率發光二極體 光源11的散熱需求而恆常使用風扇，並由氣流開口 254、 262引入外界的冷卻氣流吹向鰭片222來強化散熱能力；另 外，散熱基座221於靠近吸熱板的一端環設有對應該等鰭 片222之間的複數氣孔225，移除該發光二極體光源11之 @熱量除藉由風扇25導引冷空氣一部分強制流過散熱器22 外表面所設鰭片222外，並有另一部分冷空氣流過該腔體 223内形成一新的氣流通道，進一步強化散熱效率，使該發 光二極體燈具l〇〇a在啟用中恆常維持在高效率的穩定發光 狀態。 圖7係本發明發光二極體燈具100b第三實施例之組裝 剖面示意圖；本實施例與第一實施例的主要區別在於：本 實施例中，電氣部30b的一電路板31b藉由定位柱312b設 置於散熱器22之腔體223内，因電路板31b未設於護罩32b 17 201024608 内，護罩32b相比於第一實施例中的護罩32具有一較短的 長度，從而使該發光二極體燈具100b的整體長度縮短而更 加輕巧，並藉由所述腔體223内部的自然冷卻機制，使電 氣部30b之電路板31b與散熱部20中的熱量得以順利移 除，確保該發光二極體燈具100b的高發光效率與品質。 圖8係本發明發光二極體燈具100c第四實施例之組裝 剖面示意圖；本實施例同樣將電路板31b設於散熱器22之 腔體223内，與第三實施例的主要區別在於：本實施例的 發光二極體燈具100c還包含風扇25，風扇25設於電氣部 30c的一護罩32c與散熱器22之間，護罩32c於靠近風扇 25的一端環設有複數氣流開口 326作為風扇25運作時的進 風或排風口，該發光二極體燈具100c不僅因整體長度的縮 短而更加輕巧，並藉由風扇冷卻機制，使電氣部30c之電 路板31b與散熱部中的熱量得以順利移除，確保該發光二 極體燈具100c的高發光效率與品質。 @ 由上述的實施方式已進一步清楚說明本發明的技術特 徵及達成之功效，包括： (1) 本發明提供一種具有高散熱效率的光引擎，藉由吸 熱板以強化發光二極體光源與散熱器的熱連接及增加吸熱 與散熱面積，該吸熱板可為散熱器中腔體的延伸亦可單獨 設置，並配合熱管與吸熱板及鰭片的熱連接，進一步強化 對發光二極體光源的吸熱效率及提升鰭片的均勻散熱效 率。 (2) 本發明提供一種具有低熱阻導熱通道的發光二極 18 201024608 體k/、藉由熱管與吸熱板及鰭片的熱連接，大幅降低發 =二極體光源至鰭片間的熱阻，使發光二極體光源的結點 度度長期處於低溫狀態，從而獲得半導體照明提供的高光 效、穩定出光、長壽命等諸多優點。 (3) 本發明提供一種具有低流阻冷卻氣流通道的發光 ，體燈具’藉由散熱基座於靠近吸熱板的—端所設對應 該等鰭片之間的複數氣孔，額外在散熱器之腔體内形成自 ❹外界持續導引冷卻氣流的通道，使腔體内壁形成__擴增的 散熱面積’從而建立-種適用於自然循環及強制對流的低 流阻冷卻氣流通道，進-步強化光引擎的散熱效果。 (4) 本發明提供一種輕巧的高效率發光二極體燈具，藉 由將電氣料的電路板設置於散熱㈣腔㈣，使該發光 二極體燈具因整體長度的縮短而更加輕巧，並藉由腔體内 邛的冷部機制，使電氣部與散熱部中的熱量得以順利移 除，確保該發光二極體燈具的高發光效率與品質。 ® 综上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施例， 自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝 之人士援依本發明之精神所作之等效修飾或變化，皆應涵 蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本發明發光二極體燈具第一實施例之組裝剖面 示意圖。 圖2係圖1所不發光二極體燈具中光引擎部分之示意 19 201024608 圖。 圖3係圖2中散熱器去掉吸熱板之立體圖。 圖4係圖2中吸熱板之立體圖。 圖5係圖2中吸熱板與熱管之立體組裝圖。 圖6係本發明發光二極體燈具第二實施例之組裝剖面 示意圖。 圖7係本發明發光二極體燈具第三實施例之組裝剖面 示意圖。 圖8係本發明發光二極體燈具第四實施例之組裝剖面 示意圖。 【主要元件符號說明】 發光二極體燈具 100 ' 100a ' 100b 、100c 光學部 10 導熱基板 111 發光二極體光源 11 發光體 112 電線 114 出光通道 12 光杯 121 導光罩 122 通孔 123 、 341 光學鏡片 124 散熱部 20、20a 光引擎 21 散熱器 22 散熱基座 221 鰭片 222 腔體 223 卡槽 224 氣孔 225 、 322 收容槽 226 吸熱板 23 外表面 231 内表面 232 熱管 24、241、242 凹槽 233 201024608 蒸發段 2411 、2421 風扇 25 冷凝段 2412 、2422 扇框 251 扇輪 252 頂板 253 氣流開口 254、 .262、326 間隔件 26 電氣部 30、 30b ' 30c 電路板 31、 電線 311 定位柱 312 護罩 32、 32b > 32c 定位座 321 燈頭 防塵蓋 33 35 底座 34 31b 、312b 21201024608 IX. Description of the Invention: [Technical Field] The present invention relates to a semiconductor lighting device, and more particularly to a light-emitting diode lamp and a light engine employed therefor. [Prior Art] Due to long-term excessive dependence on fossil fuels, in addition to causing energy shortages and high oil prices, economic development is affected, and the global concentration of carbon dioxide and harmful helium gas is increasing, resulting in climate anomalies caused by global warming. The destruction of the environment and the harm to human survival are increasingly manifested. In order to sustain the operation of the earth's ecological environment on which human beings depend, it is necessary to solve the energy crisis and environmental pollution at the same time. The development of new and renewable energy is the promotion of energy conservation and efficient use of energy. The most important strategy, while the energy consumed by traditional lighting is extremely impressive, the development of lighting energy saving will be the most important new energy technology, and the semiconductor lighting uses high-power high-brightness LED light source such as light-emitting diode (LED) The light source has the potential to widely replace the traditional illumination source with its advantages of high luminous efficiency, thrift, longevity, environmental protection (without mercury), fast start-up, and directivity. LED is converted into heat due to 80%~9〇% of input power, only 10%~20% is converted into light energy, and because the LED chip area is small, chip heat dissipation is a key problem that LED package must solve; excellent heat dissipation system can be Lower operating temperature at the same input power, extend the life of the LED, or increase the input power or chip density within the same temperature limit, thereby increasing the brightness of the LED lamp; junction temperature (Juncti〇n 201024608 temperature) It is an important technical indicator to measure the heat dissipation performance of LED packages. As the junction temperature rises due to poor heat dissipation, it will seriously affect the wavelength of light, light intensity, light efficiency and service life. A high-power high-brightness LED should be used with a high-efficiency heat-dissipating mechanism to minimize the junction temperature of the LED in order to exert the above-mentioned advantages. Otherwise, the illumination brightness and service life of the lighting device will be greatly reduced. This will make the lighting device less energy-efficient and directly impact the reliability of the lighting device, causing severe light decay or even invalidating the lighting device. The conventional semiconductor lighting device attempts to obtain the heat released when the light source emits light by opening a large heat-dissipating area in contact with the outside air of the outside air, but it is impossible to establish a low flow at the same time in the space allowed by the limited lighting device. Cooling air flow channel and low thermal resistance heat conducting channel, so that the heat is not easily transmitted to the heat dissipating area quickly, and the heat transferred to the heat dissipating area is not easily removed, so that the whole is not revealed The heat dissipation effect of the crucible is caused by the long-term junction temperature being too high, resulting in light decay and affecting the stability of the illumination quality. SUMMARY OF THE INVENTION It is necessary to provide a omnidirectional illuminating one-pole luminaire with high heat dissipation efficiency and to provide a light engine for the illuminating diode lamp. ^ A light-emitting diode lamp comprising an optical portion, an electrical portion and a heat sink 7. The optical portion includes a light emitting diode light source and a light exiting channel, and the Μ provides the required illumination brightness and illuminating characteristics and protects the light emitting diode light source 8 201024608. The electrical part includes a shield and a circuit board for providing driving power, control circuitry, and power management required for the light emitting diode source. The heat dissipating portion includes a heat sink disposed between the shroud and the optical portion of the electric portion and at least one heat pipe. The heat sink includes an annular heat dissipating base and is radially disposed outside the heat dissipating base. a plurality of fins on the surface and a heat absorbing plate disposed at one end of the optical base of the heat sink base. The heat dissipation base is provided with a cavity opening toward one end of the shield, the light emitting diode light source and the heat absorption plate are in thermal contact with the outer surface of the optical portion; the heat pipe is disposed in the cavity of the heat dissipation base The heat pipe comprises an evaporation section and at least one condensation section. The evaporation section of the heat pipe is in thermal contact with an inner surface of the heat sink to the electric part, and the condensation section of the heat pipe is in thermal contact with an inner surface of the heat dissipation base. As a further improvement of the light-emitting diode lamp, the heat-dissipating base is disposed at an end adjacent to the heat-absorbing plate with a plurality of gas 1 ' corresponding to the fins to form a guiding cooling airflow through the cavity. Air flow channel. As a further improvement of the light-emitting diode lamp, the circuit board is disposed in the cavity. A light engine includes a light emitting diode light source and a heat sink having at least one heat pipe. The heat sink includes an annular heat sink base and a plurality of fins disposed radially on an outer surface of the heat sink base. a heat absorbing plate at one end of the heat dissipation base, the cavity is provided with a cavity facing the other end of the heat dissipation base, and the light emitting diode light source is in thermal contact with an outer surface of the heat absorbing plate; The heat pipe is disposed in the cavity of the heat dissipation base. The heat pipe includes an evaporation section and at least one condensation section. The evaporation section of the heat pipe is in thermal contact with an inner surface of the heat absorption plate, and the condensation section of the heat pipe and an inner surface of the heat dissipation base are hot. contact. 9 201024608 The present invention has the following advantages: · Providing a light engine with high heat dissipation efficiency, which enhances the thermal connection between the light source and the heat sink by the heat absorbing plate and increases the heat absorption and heat dissipation area, and cooperates with the heat pipe and the heat absorbing plate and The thermal connection of the fins further enhances the heat absorption efficiency of the light-emitting one-pole light source and improves the uniform heat dissipation efficiency of the fins. Providing a light-emitting diode lamp with a low thermal resistance heat conduction channel, the thermal connection between the heat pipe and the heat sink and the fin is greatly reduced, thereby greatly reducing the thermal resistance between the light source of the light-emitting diode and the fin, so that the light-emitting diode light source The junction temperature is in a low temperature state for a long time, thereby obtaining many advantages such as high light efficiency, stable light output, and long life provided by semiconductor illumination. Providing a light-emitting diode lamp with a low-flow-resistance cooling airflow channel, wherein a plurality of air holes corresponding to the fins are disposed at one end of the heat-absorbing plate near the heat-absorbing plate, and additionally formed in the cavity of the heat sink The outside continuously guides the passage of the cooling airflow to form an enlarged heat dissipation area of the inner wall of the cavity, thereby establishing a low flow resistance cold heading air flow channel suitable for natural circulation and forced convection, further enhancing the heat dissipation effect of the light engine. Providing a lightweight and high-efficiency light-emitting diode lamp, which is provided with a circuit board of the electric part t in a cavity of the heat sink, so that the light-emitting diode lamp is lighter due to the shortening of the overall length, and the cavity is provided The cooling mechanism inside the body enables the heat in the electric part and the heat dissipating part to be smoothly removed, ensuring high luminous efficiency and quality of the illuminating diode lamp. [Embodiment] Hereinafter, a light-emitting diode lamp and a light engine thereof according to the present invention will be further described with reference to Figs. 1 to 8 . 201024608 FIG. 1 is a schematic diagram of an assembly of a first embodiment of a light-emitting diode lamp according to the present invention, and FIG. 2 is a schematic view of a portion of a light-emitting diode 21 of the light-emitting diode lamp shown in FIG. Figure 2 is a perspective view of the heat sink 22 with the heat absorbing plate 23 removed. Figure 4 is a perspective view of the heat absorbing plate 23 of Figure 2, and Figure 5 is a perspective assembled view of the heat absorbing plate 23 and the heat pipe 24 of Figure 2; The utility model mainly comprises an optical part, a heat dissipating part 2〇 and an electric part. The optical unit 10 is disposed in front of the heat dissipating portion 2, and includes a light emitting diode light source 11 and an light emitting channel 12. The light emitting diode light source u is an integrally formed member, and includes a heat conducting substrate lu and the heat conducting substrate. The illuminant 112 and the plurality of electrodes (not shown) are formed by transparently encapsulating at least one illuminating diode wafer; the thermally conductive substrate ln of the illuminating diode source 11 The close thermal contact between an outer surface 231 of a heat absorbing plate 23 of the heat dissipating portion 2 can be first coated with a layer of thermal interface material (TIM), and then the plurality of screws (not shown) of the electrically insulating gasket are respectively provided. Passing through a plurality of fixing holes (not shown) on the heat-conducting substrate ηι so as to be locked on the heat-absorbing plate 23 of the heat-dissipating portion 20 corresponding to the screw holes (not shown) can also be used to reheat the substrate Directly pasting (SMT) on the heat absorbing plate 23 to transmit and remove heat released when the light emitting diode light source 11 emits light; the light emitting diode light source can be connected to the light emitting diode light source by the wire 114 11 of the electrode and one of the electrical parts The circuit board 31 and the circuit board 31 are connected to the external power source by the electric wires 311. The close thermal contact between the light emitting diode source 11 and the heat absorbing plate 23 can also be electrically insulated by first affixing the outer surface 231 of the heat absorbing plate 23, 11 201024608 and then to the heat absorbing plate 23 which is electrically insulated. A substrate circuit such as a copper-platinum substrate circuit is disposed on the outer surface 231, and at least one of the light-emitting diode chips is electrically connected to the substrate circuit and a transparent package is coated on the light-emitting diode chip. The light-emitting diode light source does not include the heat-conducting substrate 111, thereby avoiding the generation of thermal resistance between the heat-conductive substrate 111 and the heat-absorbing plate 23. The heat generated by the light-emitting diode light source 11 can be directly absorbed by the heat-absorbing plate 23 and quickly dissipated. The heat dissipation efficiency can be further improved. For the sake of convenience, the present embodiment and the following embodiments are only described by the light-emitting diode light source 11 including the heat-conducting substrate m. In fact, the light-emitting diode light source in each embodiment 11 can be replaced by the above-mentioned light-emitting diode light source without the heat-conductive substrate 111. The light exiting channel 12 includes a light cup 121 and an annular light guide cover 122. The light cup 121 is an outwardly diffusing tapered surface for guiding the light emitting diode light source 11 to emit light outward. The bottom of the light cup 121 is provided. There is a through hole 123 for the light emitting diode 11 to protrude into the light cup 121. The light guide cover 122 is a cover covering at least one optical lens 124 to provide a light emitting diode lamp. The required illumination distribution, illumination characteristics, and protection of the LED source 11 are provided. The optical lens 124 in the light guide cover 122 can also be integrally formed with the light-emitting diode light source 11 during the packaging process to avoid optical loss caused by secondary optics. In a practical application, the light-emitting diode light source 11 may be combined by a plurality of separate light-emitting bodies. At this time, the light cup 121 and the light guide cover 122 in the light-emitting channel 12 may be separately arranged corresponding to the plurality of separated light-emitting bodies. It is also possible to use only one configuration of the light cup 121 and the light guide cover 122. 12 201024608 The electrical part 30 includes a circuit board 31, a shroud 32, and a base 33 disposed at one end of the shroud 32. The circuit board 31 is electrically connected to the electrodes of the LED light source 11 and to an external power source. In addition to the DC power supply suitable for the LED light source 11, the power supply can also convert the AC mains power into a DC power supply suitable for the LED light source 11 through the power converter. In this embodiment, only the lamp head 33 is connected to the mains. The manner of providing the driving power of the LED light source 11 and the power management of the LED lamp 100 with the circuit board 31; the shield 32 is a ring-shaped housing covering the circuit board 31 The bottom of the cover 32 is locked with a base 34. The base 34 is provided with a plurality of through holes 341 communicating with the cover 32 and the heat dissipating portion 20. The inner wall of the cover 32 is provided with a plurality of positioning seats 321 for being connected to the circuit board 31. Corresponding positioning post 312 is engaged to fix the circuit board 31; the top of the shroud 32 is provided with a plurality of air holes 322 for airflow in and out to dissipate heat generated by the circuit board 31; in addition, the shroud 32 is further There is a setting around the complex Hole 35 of the dust cover 322, to prevent external dust from entering the inner shroud 32. The heat radiating portion 20 is disposed between the shield 32 of the electrical portion 30 and the optical portion 10. The heat radiating portion 20 includes a heat sink 22 and a plurality of heat pipes 24. A light engine 21 is composed of the light emitting diode source 11, the heat sink 22 and the heat pipe 24. The heat sink 22 is made of a material having good thermal conductivity, and includes an annular heat dissipation base 221, a plurality of fins 222 radially distributed on the outer surface of the heat dissipation base 221, and an absorption light emitting diode. A heat absorbing plate 23 for the heat generated by the light source 11. A cavity 223 is formed in the heat dissipation base 221 and is open to the cover 32 of the electrical portion 30. The inner surface of the cavity 223 is provided with an annular slot 224 near the end of the optical portion 20, and the heat absorption plate is provided. 223 is disposed in the cavity 13 201024608 The body 223 is adjacent to one end of the optical portion 10 and is received in the card slot 224. In addition, the heat dissipation base 221 is annularly disposed at an end adjacent to the heat absorption plate 223 corresponding to the plurality of air holes 225 between the fins 222 to form a plurality of air flow passages for introducing a cooling airflow into the cavity 223 from the outside. The heat pipe 24 is provided with a capillary structure and a pipe body filled with a working fluid for engaging the heat absorbing plate 23 and the heat dissipation base 221. In this embodiment, the heat pipes 24 include two L-shaped heat pipes 241 and a U shape. Heat pipe 242. The heat pipes 24 may also be combinations of other forms. The L-shaped heat pipe 241 ® includes an evaporation section 2411 and a condensation section 2412. The U-shaped heat pipe 242 includes an evaporation section 2421 and two condensation sections 2422. The heat absorption plate 23 is used to engage the LED light source 11 and the heat pipe 241. , 242 evaporation section 2411, 2421. In the present embodiment, the heat absorbing plate 23 is a separate component from the heat sink 22, and the heat absorbing plate 23 can also be integrally formed with the heat sink 22. The heat generated by the LED source 11 is transmitted and transmitted through the evaporation sections 2411 and 2421 of the heat pipes 241 and 242 to be in thermal contact with an inner surface 232 of the heat absorption plate 23, and the condensation sections 2412 and 2422 of the heat pipes 241 and 242 are disposed. The thermal contact with the inner surface of the heat dissipation pedestal 221 is used to rapidly and uniformly distribute the thermal load of the illuminating diode light source n to the heat dissipation by the superconductivity and the uniformity of heat transfer by the heat pipes 241 and 242 The fins 222 of the area are then emitted to the atmosphere. In order to make the heat pipes 241 and 242 and the heat absorbing plate 23 and the heat dissipation base 221 are tightly coupled, in the present embodiment, the heat pipes 241 and 242 are subjected to flattening and flattening treatment, and the inner surface of the heat dissipation base 221 is provided with a plurality of edges. The accommodating groove 226 of the heat-dissipating base 221 is disposed in the receiving groove 226 and is thermally connected to the inner surface of the receiving groove 226. The inner surface 232 of the heat absorbing plate 23 is provided with a plurality of grooves 233, and the grooves 233 are in a crisscross shape. The evaporation sections 2411 and 2421 of the heat pipes 241 and 242 are received in the grooves 233 and intersect with the grooves 233. The inner surface is thermally connected. In the manner of the thermal connection, the reheating treatment may be used or the heat pipes 241, 242 may be pressed toward the outer surface of the receiving groove 226 or the groove 233 by a locking piece (not shown) to make the heat pipes 241, 242 The surface is in close thermal connection with the inner surface of the receiving groove 226 or the groove 233 for better tight thermal connection. A thermal interface material (TIM) may be applied between the surface and the locking piece on the thermal contact surface. The heat pipes 241, 242 are pressed (not shown). The light-emitting diode lamp 100 uses the heat pipes 241 and 242 to quickly and uniformly transfer the heat load of the light-emitting diode light source 11 to the fins 222 having a large heat-dissipating area for emission, which not only greatly reduces the light-emitting diode light source 11 The thermal resistance between the fins 222 causes the junction temperature of the light-emitting diode source 11 to be in a low temperature state for a long time, thereby obtaining many advantages such as high luminous efficiency, light-emitting stability, long life, and the like, and mass production due to components. And significantly reduce the cost. In the light-emitting diode lamp 100, the thermal buoyancy generated by the difference in density caused by the temperature difference of the airflow causes the cold air entering between the fins 222 to absorb the heat transferred from the light-emitting diode light source 11 to the fins 222. The temperature rises and rises, and the inertial tendency of the hot air to float upward causes the flow resistance of the cold air outside the fin 222 to enter the fin 222 in a direction perpendicular to the fin 222 to decrease; at the same time, the new cold air will The hot air space that has been floated is automatically filled, and the heat dissipation of the fins 222 is also exerted by the heat absorption and temperature rise; when the floating hot air flows continue to flow smoothly through the base provided with a large area of 15 201024608 through holes 341 34. The large-area plurality of air holes 322 are disposed at the top end of the shield 32 of the electrical part 30 to continuously guide the lower-temperature cooling airflow between the fins 222, thereby forming a natural environment in the light-emitting diode lamp 100. The circulation is most beneficial to the low flow resistance of the thermal buoyancy airflow passage, so as to effectively remove the heat released when the light emitting diode light source 11 emits light. To further enhance the heat dissipation effect of the LED device 100, the heat dissipation base 221 is provided with a plurality of air holes 225 corresponding to the fins 222 at an end adjacent to the heat absorption plate 23 to form a cooling airflow from the outside. The plurality of gas flow channels in the cavity 223, that is, the heat released from the light-emitting diode source 11, causes the inner wall of the cavity 223 of the heat sink 22 to exhibit a higher temperature and heat the air in the cavity 223. The density of the hot air in the cavity 223 is lowered and floated, and then discharged from the cavity 223 of the heat dissipation pedestal 221 upwardly away from the cavity 223, and continues to flow smoothly through the large-area plurality of through holes 341. The base 34 is further disposed by a plurality of large-area plurality of air holes 322 provided on the top wall surface of the electric portion 30, so as to drive the outside air to be introduced into the cavity 223 from the plurality of air holes 225 to form a natural cooling cycle in the cavity 223. To further enhance the heat dissipation effect of the light-emitting diode lamp 100. The light-emitting diode lamp 100 is combined with the heat dissipation area of the inner wall of the cavity 223 of the heat dissipation base 221, and the air holes 225 are provided by the heat dissipation base 221 to guide the airflow to flow through the amplified heat dissipation area. The formation of a new airflow channel allows the light engine 21 to dissipate heat much better than conventional techniques, thereby ensuring high efficiency lighting effects at low junction temperatures on semiconductor lighting applications. 16 201024608 FIG. 6 is a schematic cross-sectional view showing the assembly of the second embodiment of the light-emitting diode lamp 100a of the present invention; the main difference between the embodiment and the first embodiment is that the heat dissipation of the light-emitting diode lamp 10a in this embodiment The portion 20a includes a fan 25, and the fan 25 includes a fan frame 251 and a fan wheel 252. The fan wheel 252 is rotatably mounted on a top plate 253 of the fan frame 251. The top plate 253 is provided with a plurality of airflow openings 254. An annular spacer 26 is disposed between the fan frame 251 and the shield 32 of the electrical portion 30. The spacer 26 is provided with a plurality of airflow openings 262 as air inlets or exhaust ports when the fan 25 is operated. The light emitting diode body The lamp l〇〇a can be cooled by the natural convection of the hot and cold air, and the fan is activated by the control circuit to enhance the heat dissipation capability when the junction temperature of the light-emitting diode source 11 exceeds a set value; this embodiment is also directed to high power. The heat dissipation requirement of the LED light source 11 is constant, and the fan is constantly used, and the cooling airflow introduced into the outside by the airflow openings 254 and 262 is blown toward the fins 222 to enhance the heat dissipation capability. In addition, the heat dissipation base 221 is looped near the end of the heat absorption plate. There are a plurality of apertures 225 between the fins 222, and the heat of the LEDs 11 is removed. In addition to the cold air being guided by the fan 25, a portion of the fins 222 are forced to flow outside the fins 222 provided on the outer surface of the heat sink 22. And another part of the cold air flows through the cavity 223 to form a new air flow channel, further enhancing the heat dissipation efficiency, so that the light-emitting diode lamp l〇〇a is maintained at a high efficiency and stable illumination state during the activation. . 7 is a schematic cross-sectional view showing the assembly of the third embodiment of the light-emitting diode lamp 100b of the present invention; the main difference between this embodiment and the first embodiment is that: in this embodiment, a circuit board 31b of the electrical portion 30b is provided with a positioning post. 312b is disposed in the cavity 223 of the heat sink 22. Since the circuit board 31b is not disposed in the shield 32b 17 201024608, the shield 32b has a shorter length than the shield 32 in the first embodiment, thereby The overall length of the LED device 100b is shortened and more compact, and the heat in the circuit board 31b and the heat sink 20 of the electrical portion 30b is smoothly removed by the natural cooling mechanism inside the cavity 223, thereby ensuring that the heat is removed smoothly. The luminous efficiency and quality of the light-emitting diode lamp 100b. 8 is a schematic cross-sectional view showing the assembly of the fourth embodiment of the LED lamp 100c of the present invention; in this embodiment, the circuit board 31b is also disposed in the cavity 223 of the heat sink 22. The main difference from the third embodiment is: The LED device 100c of the embodiment further includes a fan 25 disposed between a shield 32c of the electrical portion 30c and the heat sink 22. The shield 32c is provided with a plurality of airflow openings 326 at one end of the fan 25 When the fan 25 is operated with an air inlet or an air outlet, the LED lamp 100c is not only lighter due to the shortening of the overall length, but also the heat in the circuit board 31b and the heat radiating portion of the electric portion 30c can be obtained by the fan cooling mechanism. Smooth removal ensures high luminous efficiency and quality of the LED luminaire 100c. The technical features and the achieved effects of the present invention are further clarified by the above embodiments, including: (1) The present invention provides a light engine with high heat dissipation efficiency, which enhances the light emitting diode light source and heat dissipation by the heat absorbing plate. The thermal connection of the device and the increase of the heat absorption and heat dissipation area, the heat absorbing plate can be separately provided for the extension of the cavity in the heat sink, and the thermal connection between the heat pipe and the heat absorbing plate and the fin is further strengthened to further strengthen the light source of the light emitting diode. Endothermic efficiency and improved uniform heat dissipation efficiency of the fins. (2) The invention provides a light-emitting diode 18 201024608 body k/ with a low thermal resistance heat conduction channel, and the thermal connection between the heat source and the heat absorbing plate and the fin is used to greatly reduce the thermal resistance between the light source and the diode. The junction of the light-emitting diode light source is in a low temperature state for a long time, thereby obtaining the advantages of high luminous efficiency, stable light output, long life and the like provided by the semiconductor illumination. (3) The present invention provides a light-emitting device having a low-flow-resistance cooling airflow passage. The body lamp is provided with a plurality of air holes between the fins corresponding to the heat-absorbing plate at the end close to the heat-absorbing plate, and additionally in the heat sink. The cavity forms a channel for continuously guiding the cooling airflow from the outside, so that the inner wall of the cavity forms a heat dissipation area of the __, thereby establishing a low flow resistance cooling airflow channel suitable for natural circulation and forced convection, and further steps. Enhance the heat dissipation of the light engine. (4) The present invention provides a lightweight and high-efficiency light-emitting diode lamp. By placing the circuit board of the electric material in the heat dissipation (four) cavity (4), the light-emitting diode lamp is lighter and lighter due to the shortening of the overall length, and The cold part mechanism of the cavity in the cavity allows the heat in the electric part and the heat dissipating part to be smoothly removed, ensuring high luminous efficiency and quality of the illuminating diode lamp. ® In summary, the present invention has indeed met the requirements of the invention patent and has filed a patent application in accordance with the law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application in this case. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the present invention are intended to be included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing the assembly of a first embodiment of a light-emitting diode lamp of the present invention. Figure 2 is a schematic representation of the portion of the light engine in the non-emitting diode lamp of Figure 1. 19 201024608 Figure. Figure 3 is a perspective view of the heat sink of Figure 2 with the heat sink removed. Figure 4 is a perspective view of the heat absorbing plate of Figure 2. Figure 5 is a perspective assembled view of the heat absorbing plate and the heat pipe of Figure 2. Fig. 6 is a schematic cross-sectional view showing the assembly of the second embodiment of the light-emitting diode lamp of the present invention. Fig. 7 is a schematic cross-sectional view showing the assembly of the third embodiment of the light-emitting diode lamp of the present invention. Fig. 8 is a schematic cross-sectional view showing the assembly of the fourth embodiment of the light-emitting diode lamp of the present invention. [Description of main components] Light-emitting diode lamp 100 ' 100a ' 100b , 100c Optical part 10 Thermal substrate 111 Light-emitting diode light source 11 Light-emitting body 112 Wire 114 Light-emitting channel 12 Light cup 121 Light guide cover 122 Through-hole 123, 341 Optical lens 124 heat sink 20, 20a light engine 21 heat sink 22 heat sink base 221 fin 222 cavity 223 card slot 224 air hole 225, 322 receiving groove 226 heat absorbing plate 23 outer surface 231 inner surface 232 heat pipe 24, 241, 242 concave Slot 233 201024608 Evaporation section 2411, 2421 Fan 25 Condensation section 2412, 2422 Fan frame 251 Fan wheel 252 Top plate 253 Air flow opening 254, .262, 326 Spacer 26 Electrical part 30, 30b ' 30c Circuit board 31, Wire 311 Positioning post 312 Shield 32, 32b > 32c Positioning seat 321 Lamp head dust cover 33 35 Base 34 31b, 312b 21