201013106 九、發明說明： - 【發明所屬之技術領域】 本發明係涉及一種半導體照明裝置，尤係關於一種發 光二極體燈具。 【先前技術】 人們由於長期過度依賴石化燃料，除造成能源短缺及 石油價格高漲而牽動經濟發展，更使全球二氧化碳與有害 ❹氣體的排放濃度日益增加，導致地球暖化所引起的氣候反 常、生態環境的破壞、以及對人類生存的危害日益顯現， 為永續經營人類賴以生存的地球生態環境，必須同時解決 能源危機與環境污染問題，開發新能源及再生能源是推動 節約能源及高效率使用能源最重要的策略，而傳統照明所 消耗的能源極為可觀，發展照明節能將是最重要的新能源 科技，而半導體照明採用高功率高亮度的發光二極體（led) 為光源，該新光源以其高發光效率、節能、長壽、環保（不 ©含汞）、啟動快、指向性等優點，具有廣泛取代傳統照明光 源的潛力。 LED由於輸入電能的80%〜9〇%轉變成為熱量，只有 10%〜20%轉化為光能，且由於LED芯片面積小，因此芯片 ，熱是；LED封裝必須解決的關_題；優良的散熱系統可 =等輸人功率下得職低的王作溫度，延長咖的使用 可P，或在同樣的溫度限制範圍内，增加輸 密度，從而增加LE…亮度，'結點溫度二。n 8 201013106 .te叫⑽㈣)是衡量LED封裝散熱性能的重要技術指標，由 •於散熱不良導致的結點溫度升高，將嚴重影響到發光波 長、光強、光效和使用壽命。 應用高功率高亮度LED在照㈣新光社，必須配合 高效率的散熱機構以儘量降低LED的結點溫度，才能發揮 上述諸多優點，否則照明裝置的發光亮度、使用壽命將大 打折扣，影響所及將使該照明裝置的節能效果不彰並直 接衝擊該照明裝置的可靠度’引發嚴重的光衰甚至使 裝置失效。 欲使該半導體照明裝置能持續自外界彡丨進較低溫氣 流，必需在照明裝置令建立一低流阻的冷卻氣流通道；在 不使用風扇的狀況下，低輸出功率的照明應用除利用低氣 流驅動力的自然、循環散熱外，亦能藉由大的散熱面積達 成；惟，在高功率高亮度的照明應用中，常因空間或重量 的限制及成本的考量下，使用風扇冷卻對輕化與縮小照明 〇裝置、降低成本及提升散熱效率具有顯著的效益；習 導體照明裝置雖已見使用風扇的產品，但由於並未對冷卻 氣流的導引及冷卻流道的通暢作深入的研究，致風扇戶; 立的冷卻流場無法充分發揮散熱的效果，從而影響照明品 質的穩定性與無法達到預期的使用壽命。 【發明内容】 有繁於此，有必要提供一種具有高散熱效率之發 極體燈具。 ~ -種發光二極體燈具，包括—光學部、—電氣部及— 9 201013106 散熱部。該光學部包括至少一發光二極體光源及一出光通 道，該電氣部包括一後殼體及設於該後殼體内的一電路 板，該後殼體上環設有複數開孔。該散熱部包括一前殼體、 一散熱器及一風扇。該前殼體為一中空殼體’光學部及電 氣部分別設於該前殼體的兩端，該散熱器設於該前殼體内 並靠近光學部設置，該散熱器包括一實心體及設於實心體 上的複數鰭片，該實心體於靠近光學部的一端面為一吸熱 面，所述發光二極體光源設於該吸熱面上，該風扇設於前 〇殼體内並位於散熱器與電氣部之間，所述前殼體之壁面上 環設有複數氣孔，風扇運轉時自該等氣孔靠近電氣部的一 侧引入冷卻空氣，由風扇所産生的氣流吹向散熱器並由該 等氣孔靠近光學部的一侧排出以將發光二極體光源所産生 的熱量散發。 作為該發光二極體燈具的進一步改進，該散熱部還包 括一設於前殼體内的導流裝置，該導流裝置為環設於風扇 ❹之外圍的一環體，所述環體由兩端向内呈内聚的錐形面。 本發明具有如下優點： 本發明提供一種具有結合前殼體與後殼體之發光二極 體燈具’用以整合固設於前殼體端部的出光通道、設於前 殼體内的散熱器與風扇、以及固設於後殼體的電路板，達 到充为利用威體空間、簡化裝配製程、方便拆卸維修、及 節省製造成本之功效。 > 本發明藉由在前殼體内壁周緣設置的導流裝置，以及 在兩殼體之不同位置設置的複數氣孔及開孔，使風扇自外 201013106 •界導引的冷卻氣流在所述發光二極體燈具内形成一順暢而 有效的散熱氣流通道，強化光引擎的散熱效果。 本發明結合同步降低吸熱熱阻與散熱熱阻之技術手 段，提供一種整合光學部、散熱部及電氣部的發光二極體 燈具，以達發光二極體燈具在設計及製程上的系統化。 本發明運用文氏管（venturi)的高效率流體動力傳輸機 制，在發光二極體燈具中建立一低流阻冷卻氣流通道，大 幅改善使用風扇的先天弱點，以強化散熱效率，從而獲致 ®低結點溫度、長壽命、高光效的照明效果。 【實施方式】 以下參照圖1至圖11 ’對本發明發光二極體燈具予以 進一步說明。 圖1係本發明發光二極體燈具1〇〇第一實施例之立體 組裝圖，圖2係圖1之立體分解圖，圖3係圖2中光引擎 21之立體組裝圖；該發光二極體燈具1〇〇包括一光學部 ◎ 10、一散熱部20及一電氣部30。其中： 光學部10係没置於散熱部20之前方，包括一發光-極體光源11及一出光通道12’該發光二極體光源1：1為一 體成型件’係包括由至少一發光二極體晶片組成的透明封 裝發光體lll(Emitter)、複數電極112及位於發光體lu底 部的一導熱基板113 ’所述發光二極體光源可經由電線 (圖未示）電性連接電極112與電氣部30中的一電路板31 以及藉由一燈頭32電性連接該電路板31與外部電源（圖 未示）而發光，並使該導熱基板113與散熱部20中一散熱 11 201013106 器22之實心體221的一吸熱面223緊密熱接觸，以傳輸及 移除該發光二極體光源11發光時釋出的熱量。在本實施例 中，該導熱基板113與實心體221的吸熱面223之間的緊 密熱接觸可先在兩者之間塗抹一層熱介面材料（TIM)，再將 已套裝電絕緣片的複數螺絲114分別穿過導熱基板113上 的複數固定孔115，以便鎖固於實心體221的吸熱面223 所設螺孔224達成’亦可藉由迴焊方式將導熱基板113直 接黏貼（SMT)於該吸熱面223上達成。 光學部10之發光二極體光源η亦可以為其他形式， 如不包含導熱基板113’此種形式之發光二極體光源與實心 體221的吸熱面223之間的緊密熱接觸可藉由先對實心體 221的咴熱面223進行電絕緣處理，然後在該經電絕緣處理 的吸熱面223上鋪設金屬基板電路如銅鉑基板電路，再將 發光二極體晶片與所述金屬基板電路電連接並於發光二極 體晶片外包覆一透明封裝體而達成，採用此種方式之發光 二極體光源不包含導熱基板113，從而避免導熱基板113 與實心體221之間接觸熱阻的産生，發光二極體光源所産 生的熱量可直接由實心體221吸收並予以快速散發，可進 一步提升散熱效率。為方便敍述，本實施例及以下的實施 例皆僅以包含有導熱基板113之發光二極體光源11予以說 明，實際上，各實施例中之發光二極體光源11皆可用上述 不含導熱基板113之發光二極體光源替代。 出光通道12包括一光杯121及一導光罩122,其中光 杯121具有由發光二極體光源11向外擴散的一錐形反射 12 201013106 面，光杯121於靠近發光二極體光源11之一端的中央設有 一通孔123以供透明封裝發光體111凸伸至光杯121内， 導光罩122設置於光杯121之另一端的外緣，為包括至少 一光學透鏡的罩蓋，該導光罩122的外緣鑲嵌於一卡環124 内，所述卡環124的外周面設有螺牙125，以與散熱部20 的一前殼體23鎖固，從而提供發光二極體燈具100所需的 照明亮度與發光特性及光源保護功能；所述光學透鏡可依 實用目的而有不同的形式，例如：一具有複數小凸球面的 ❹透光罩蓋或一呈半透明的毛面罩蓋以降低眩光，以及呈透 明的罩蓋以使出光效率達到最高。 在實際應用時，上述發光二極體光源11亦可由複數分 離的單一發光二極體光源組合而成，此時出光通道12中的 光杯121及導光罩122可以是對應於該複數分離的發光二 極體光源分開設置，亦可以只用一個光杯121及導光罩122 的配置。 Ο 散熱部20位於該光學部10與電氣部30之間，包括前 殼體23、散熱器22、一風扇24及一導流裝置25 ;其中所 述散熱器22、風扇24及導流裝置25設於該前殼體23内， 發光二極體光源11設於散熱器22之吸熱面223上，並由 所述發光二極體光源11、散熱器22、風扇24組成一光引 擎21。 前殼體23為一環形的中空殼體，該前殼體23的内徑 由靠近電氣部30的一端向靠近光學部10的一端遞減，所 述前殼體23靠近光學部10的一端於内表面設有與卡環124 13 201013106 之螺牙125相結合之螺牙231，藉由該卡環124可將導光罩 122及光杯121與前殼體23相結合；該前殼體23之周面環 設有複數氣孔，該等氣孔由前殼體23上一環形的中隔板 232沿軸向分隔成兩組，即靠近電氣部30的第一組氣孔233 及靠近光學部10的第二組氣孔234，所述第一組氣孔233 及第二組氣孔234均沿前殼體23的軸向延伸設置。 散熱器22包括一圓柱形的實心體221及由該實心體 221朝向電氣部30的一端面沿軸向延伸的複數鰭片222， ❹當散熱器22設於前殼體23内時，前殼體23上靠近光學部 10所設的第二組氣孔234涵蓋散熱器22之部分實心體221 及大部分鰭片222 ;本實施例中，鰭片222為柱狀鰭片（pin fin)，其中所述鰭片222亦可為其他形式，例如板形鰭片； 該散熱器22之實心體221朝向光學部10的一端面為與發 光二極體光源11緊密熱接觸的吸熱面223，用以傳輸該發 光二極體光源11發光時所釋放出的熱量。該散熱器22之 ©實心體221的邊緣沿軸向設置有複數固定孔225,所述固定 孔225貫通實心體221之兩端面，以在所述固定孔225中 分別插設一螺桿226以用於固定散熱器22。 風扇24設於前殼體23内並位於散熱器22與電氣部30 之間；該風扇24包括一支架241、設於該支架241上的一 定子及與該定子相樞接的一葉輪243，另外，該風扇24還 包括一設於支架241與葉輪243之間的一導線架244,用以 支撐及導引由風扇24之定子所引出的電線，以避免該電線 干擾風扇24的轉動；所述支架241的外端對應散熱器22 14 201013106 之固定孔225相應地設有固定孔242，以供螺桿226穿設， 從而將風扇24固定於散熱器22之鰭片222的端部。本實 施例中，風扇24對應設於前殼體23之中隔板232處，該 風扇24係軸流風扇，用於朝向散熱器22吹風，此時該前 殼體23上靠近電氣部30所設的第一組氣孔233用於進風， 前殼體23上靠近光學部10所設的第二組氣孔234用於排 風，風扇24由前殼體23上的第一組氣孔233吸入冷卻空 氣並吹向散熱器22之鰭片222，與鰭片222進行熱交換後 ❹升溫的氣流再經前殼體23上的第二組氣孔234排出，從而 將發光二極體光源11所産生的熱量散發。 為進一步強化本發明的光引擎21之散熱效果，前殼體 23内還設有導流裝置25,所述導流裝置25位於中隔板232 處且環設於風扇24之外圍；本實施例中，該導流裝置25 為一環體，該環體的内表面由兩端向内呈内聚的錐形面 251，即環體中部之内徑小於環體兩端之内徑，該環體的軸 ©向高度與中隔板232的軸向長度相同，環體的外徑係與中 隔板232的最小内徑相同，以便將環體膠合於該中隔板232 的内侧，並使散熱器22之鰭片222端部外緣與環體之一端 的内壁相接觸；當風扇24朝向散熱器22吹風以引進冷卻 空氣時，該導流裝置25將該前殼體23之内壁與散熱器22 之鰭片222的端部之間的流道阻擋，使冷卻氣流只能流經 相.對較高流阻的鰭片222之間，該導流裝置25之進風端呈 内聚的錐形面251及其中部較小的流體截面積迫使氣流逐 漸加速並導入鑛片222之間，藉由該内聚的斜面導引流體 15 201013106 ‘的運動慣性，使該氣流朝散熱器22的中心最熱區匯聚並吸 -熱；由於風扇24的葉輪243中心區為具有大面積的輪轂， ，輪轂會阻擋風力進入散熱器22的中央區，而該區卻往往 疋最熱且最需要強化散熱的主要熱源區，設置該導流裝置 25正好可將由外殼體23之進風氣孔即第一組氣孔233所引 入的最低溫氣流導引至熱通量（heatflux)最高的該中央熱 源區’大幅彌補使用風扇24㈣天弱點；#引人的冷卻氣 流吸熱後升溫膨脹並向其周邊擴散，進一步以較高溫的氣 流冷部其周邊較次要的熱源，使由風扇24引入的冷卻空氣 ，到最佳的利用效率’從而使光引擎21的散熱效率獲得顯 者的提升；最後，f氣流自排風氣孔（即第二組氣孔234) 離開時’由該導流裝置25朝外擴展的斜面導引已吸熱的更 高溫氣流逐步減速’並擴散至外界而最終將發光二極體光 源11的熱量釋出；由此可見，設置所述導流裝置25並匹 配前殼體23周邊所設置的進風氣孔（即第一組氣孔233) ❹及排風氣孔（即第二組氣孔234)，不但可有效防止剛引入 的冷卻氣流直接由排風氣孔溢散的浪費，並將文氏管 (venturi)的高效率流體動力傳輸機制巧妙地納入本發明 的發光一極體燈具100中，大幅強化使用風扇24的先天弱 點’並紋發光二極體燈具⑽的高效率散熱需求，使風 扇24自外界導引的冷卻氣流在所述發光二極體燈具100内 形成一順暢而有效的低流阻移熱氣流通道，進一步降低散 熱熱阻=強化光51擎21的散熱效率，從而可獲致低結點溫 度、長壽命、高光效的照明效果。 16 201013106 電氣部30包括一與前殼體23相連接的後殼體33及設 於該後殼體33内的電路板31，該電路板31係與發光二極 體光源11的電極112及與外部電源電連接，所述電源除可 為電池或電瓶等直流電源外，亦可透過電源轉換器將交流 市電轉換為適合該發光二極體光源11的直流電源，本實施 例係採用燈頭32與市電連接的方式，藉由電路板31提供 該發光二極體光源11之驅動電源及發光二極體燈具100之 電源管理；該後殼體33為一中空的杯狀護罩，該後殼體33 ❹於遠離前殼體23之一端的外表面設有與商用金屬燈頭32 螺鎖的螺牙331，該後殼體33内部的空間用以容置電路板 31的各電子元件312，達到充分利用殼體空間之功效；該 後殼體33於靠近前殼體23之一端的内壁還設置複數固定 座332，該固定座332之中心設有螺孔333，所述螺孔333 與實心體221邊緣沿軸向所設之固定孔225對應，該電路 板31之周緣對應後殼體33之固定座332分別設有固定孔 β 311，以供鎖固件穿設從而將電路板31固定至後殼體33 ; ❿ 本實施例中，所述電路板31與後殼體33之固定座332之 間及電路板31與風扇24之支架241之間分別設有複數轉 接頭34;所述轉接頭34的一端設有外螺紋而另一端則設有 螺孔，並藉由螺桿226及轉接頭34將散熱器22、風扇24、 電路板31及後殼體33固定在一起；藉由在後殼體33之固 定座332上設置轉接頭34，可以降低拆裝時的螺孔磨損、 強化整體結構、簡化裝配製程及提高可靠度，尤其當後殼 體33為塑膠材料製成時，可有效防止固定座332不受損 17 201013106 壞；另外，該後殼體33靠近燈頭32 —端的周邊還環設有 複數開孔334，以便將電路板31產生的熱量散出。 所述前殼體23與後殼體33上分別設有定位結構及扣 合結構以將兩者結合，即藉由兩殼體23、33端部分別設置 沿軸向對應匹配的定位凹槽235與定位凸柱335間的滑動 定位，以導引前殼體23之端部外周緣所設的凸緣236嵌入 後殼體33之端部内周緣所設的凹槽336中，達到該兩殼體 23、33定位扣合的目的；上述結合方式不但易於組裝，且 ❿使兩殼體結合後防止轉動，以確保兩殼體23、33内已事先 定位的電線不致因扭轉而受損或導致電連接的脫落。另 外，為有效降低由進風氣孔及開孔334引入的塵埃，在與 所述進風氣孔及開孔334相對應的兩殼體23、33的内壁處 可分別裝設一紗網或低流阻的濾網。 上述發光二極體燈具100藉由前殼體23與後殼體33 的結合，用以整合固設於前殼體23端部之出光通道12與 &固設於後殼體33的電氣部30及光引擎21，結合後出光通 ❿ 道12與光引擎21罩蓋於前殼體23内，電氣部30罩蓋於 後殼體33内；由於發光二極體光源11所釋放之熱量通常 遠大於電氣部30所釋放之熱量，為使所述發光二極體燈具 100中發光二極體光源11與電氣部30兩熱源負荷的散熱匹 配，後殼體33上所設開孔334的總面積小於前殼體23上 所設進風氣孔（即第一組氣孔233 )的總面積，以使較小部 分的冷卻氣流流經該電氣部30，並將較大的主冷卻氣流導 引至散熱器22的鰭片222之間，以充分利用由該風扇24 18 201013106 驅動的冷卻氣流通道，有效傳輸及移除發光二極體光源u 發光時所釋放之熱量，以致該光引擎21的散熱能力遠優於 習知技術，從而綠保該發光二極體燈具100發揮高效率與 穩定的光輸出效果。 圖4係本發明發光二極體燈具第二實施例中光引擎41 之立體分解圖’圖5係圖4之立體組裝圖；本實施例中光 引擎41與第一實施例中光引擎21的主要區別在於：本實 施例中的散熱器42包括一位於中央的實心體421及沿該實 ❹心體之周面沿徑向向外延伸的複數鳍片422，發光二極體光 源11與位於實心體421 —端的一吸熱面423緊密熱接觸， 風扇24設於實心體421之另一端，並藉由螺桿226及轉接 頭34將風扇24之支架241目定；由於本實施例的散熱器 42採用與前述實施例相同的外觀尺寸，因此可以直接替換 所述散熱器22而採用與第一實施例中相同的其他元件後以 相同的方式組裝成發光二極體燈具，並使前殼體23所設之 〇排風氣孔涵蓋散熱器42靠近發光二極體光源^ 一端的大 4刀鰭片422，由於本實施例的散熱器42可以採用擠形製 程，因此適合大量生產而具有節省成本的優勢；導流裝置 25亦可以使風扇24自外界導引的冷卻氣流在發光二極體 燈具的散熱器42内形成相同功效的移熱氣流通道，可進一 步降低散祕阻以優化本發㈣光彳丨擎41之散熱功效，從 而確保應用在半導體照明上獲致低結點溫度的高效率照明 效果。 圖6係本發明發光二極體燈具第三實施例中光引擎51 19 201013106 之立體分解圖，圖7係圖6之立體組裝圖，圖8係圖6中 • 散熱器52之立體圖。本實施例中光引擎5]L與第一實施例 中光引擎21的主要區別在於：本實施例中的散熱器52包 括一圓柱形的實心體521、由該實心體521之一端面的中心 沿軸向朝向風扇24延伸的一中心柱體523及由該中心柱體 523的周面沿徑向延伸且呈放射狀分佈的複數直板形的鰭 片524 ’且所述鰭片524與實心體521的端面522連接，以 擴增散熱面積及提供多重的導熱路徑’強化光引擎的散 ®熱效果。 所述散熱器52的實心體521背向鰭片524的一端面為 一吸熱面525 ’發光二極體光源11設於該吸熱面525上並 與該吸熱面525緊密熱接觸，該吸熱面525上設有一用於 谷置感溫線526的線槽527 ’所述感温線526 —端設於發光 二極體光源11的中心發熱區以量測發光二極體光源n的 中心最熱溫度。所述感溫線526與電路板31的一過溫保護 ❹控制電路電連接，以便於發光二極體光源n之結點溫度高 於設定值時執行斷電以保護發光二極管燈具；同時藉由該 吸熱面525, 一方面將實心體521中心最熱區所吸收的熱量 沿徑向傳導並擴散至其周邊，以及沿軸向傳導至該實心體 521的知面522上所設的鰭片524及中心柱體523 ;另一方 面熱量由中心柱體523沿徑向傳導至鰭片524,以提供多元 的導熱路徑及擴增的散熱面積；再藉由風扇24直接吹拂該 散熱鰭片524’使所述自中心柱體523呈放射狀的複數鰭片 524之間形成朝實心體521周邊擴大的低流阻冷卻氣^通 20 201013106 道；上述經由該中心柱體523可將風扇24吹拂無法觸及的 中〜隶熱區用於傳導熱量，藉由該散熱器52所提供多重的 導熱路徑及擴增的散熱面積直接導引至鰭片524,以充分發 揮高效率傳輸該發光二極體光源1;1發光時所釋出的熱量。 另外，本實施例中之光引擎51與電路板31及後殼體 33之間的固定亦與第一實施有所不同，本實施中，風扇％ 與電路板31之間設有複數彈簧512及套筒513，以取代第 一實施例中的轉接頭34,將光引擎51、電路板31及後殼 體33相固定時，係藉由一較長的螺桿511依次穿過實心體 的固定孔528、風扇24之支架241上的固定孔242、彈 簧512、套筒513及電路板31上的固定孔3n，再與設於 後殼體33上的轉接頭34相螺接。 圖9係本發明發光二極體燈具600萃四實施例之立體 組裝圖，圖10係圖9之立體分解圖，目^係圖1〇所示散 熱器62之立體圖；本實施例與前述實施例的主要區別在於 ❹散熱器62及前殼體63之結構，本實施例中的散熱器㈣ 結構與第三實施例中的散熱器52的結構基本相同，差別在 於散熱器62的韓4 624的形狀為圍繞於中心柱體623周邊 呈放射狀的螺旋板形，以增加發光二極體光源U的散熱面 積及導熱路控，該螺旋的板形鰭片624的螺旋方向係鱼風 扇24的葉輪243的旋轉方向一致，並配合風扇24軸流吹 拂的方向，使冷卻氣流更易導人縛片624之間以吸收鰭片 624的熱買並順暢排出，以進—步強化光引擎的散執效果 另外，本實施例中的前殼體63周面環設有複數氣孔631 ’ 21 201013106 所述氣孔631係將第一實施例中前殼體23上的進風氣孔 (即第一組氣孔233)與排風氣孔（即第二組氣孔234)相 導通而形成，以簡化製程並增加冷卻氣流的總體流通面 積，風扇24運轉時自氣孔631靠近後殼體33的一側吸入 冷卻空氣並吹向散熱器62的鰭片624之間，經吸熱後的氣 流再經由氣孔遠離後殼體33的一侧流出，以將發光二極體 光源11所産生的熱量散發。 為進一步強化本實施例的發光二極體燈具600之散熱 ❿效果’在該前殼體63對應於風扇24位置的内壁周緣上亦 可設置與第一實施例相同的一導流裝置25。另外，前述各 實施例中的散熱器亦可用於本實施例中以替代散熱器62。 由上述的實施方式已進一步清楚說明本發明的技術特 徵及達成之功效，包括： (1) 本發明運用在發光二極體燈具中建立一低流阻冷 卻氣流通道之技術手段’除導引一小部分氣流強制通過電 ❹氣部外，並將主要的冷卻氣流導引至散熱器的鰭片之間， 以充分利用該冷卻氣流通道，從而確保應用在半導體照明 上獲致低結點溫度的高效率照明效果。 (2) 本發明提供一種具有結合前殼體與後殼體之發光 二極體燈具，用以整合固設於前殼體端部之導光罩與固設 於後殼體的電路板及光引擎，達到充分利用殼體空間、簡 化裝配製程、方便拆卸維修、及節省製造成本之功效。 (3) 本發明提供一種具有鰭片及實心體的光引擎，藉由 在如设體内壁周緣設置的導流裝置’以及在兩殼體之不同 22 201013106 位置設置的複數氣孔及開孔，使風扇自外界導引的冷卻氣 •流在所述發光二極體燈具内形成—順暢而有效的氣流通 道’強化光引擎的散熱效果。 (4)本發明以模組化的高效率光引擎為核心，結合同步 降低吸熱熱阻與散熱熱阻之技術手段，提供一種整合光學 部、散熱部及電氣部的通用發光二極體燈具結構，以達= 導體發光二極體燈具在設計及製程上的系統化。 ❹曰綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施例， 自不能以此限制本案之申請專利範圍。舉凡熟悉本案技藝 =人士援依本發明之精神所作之等效修飾或變化，皆應涵 蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本發明發光二極體燈具第一實施例之立體組裝 圖。 〇 圖2係圖1之立體分解圖。 圖3係圖2中光引擎之立體組裝圖。 圖4係本發明發光二極體燈具第二實施例中光引擎之 立體分解圖。 圖5係圖4之立體組裝圖。 圖6係本發明發光二極體燈具第三實施例中光引擎之 立體分解圖。 圖7係圖6之立體組裝圖。 圖8係圖6中散熱器之立體圖。 23 201013106 圖9係本發明發光二極體燈具第四實施例之立體組裝 圖。 圖10係圖9之立體分解圖。 圖11係圖10所示散熱器之立體圖 主要元件符號說明】 ❿ 發光二極體燈具 100 、 600 光學部 10 發光二極體光源 11 發光體 111 電極 112 導熱基板 113 螺絲 114 出光通道 12 固定孔 115 、 225 、 242、311、 528 光杯 121 導光罩 122 通孔 123 卡環 124 螺牙 125 、 231 、 331 散熱部 20 實心體 221、421 光引擎 21 、 41 、 51 散熱器 22、42、52 '62 籍片 222、422、 524 、 624 吸熱面 223 、 423 、 525 螺孔 224 螺桿 226 、 511 前殼體 23、63 中隔板 232 第一組氣孔 233 第二組氣孔 234 定位凹槽 235 凸緣 236 風扇 24 支架 241 葉輪 243 導線架 244 24 201013106 導流裝置 25 電氣部 30 電子元件 312 後殼體 33 開孔 334 凹槽 336 彈簧 512 端面 522 ❹感溫線 526 氣孔 631 錐形面 251 電路板 31 燈頭 32 固定座 332 定位凸柱 335 轉接頭 34 套筒 513 中心柱體 523 、 623 線槽 527 ❿ 25201013106 IX. Description of the Invention: - Technical Field of the Invention The present invention relates to a semiconductor lighting device, and more particularly to a light-emitting diode lamp. [Prior Art] Due to long-term excessive dependence on fossil fuels, in addition to causing energy shortages and high oil prices, economic development is affected, and the global concentration of carbon dioxide and harmful helium gas is increasing, resulting in climate anomalies caused by global warming. The destruction of the environment and the harm to human survival are increasingly manifested. In order to sustain the operation of the earth's ecological environment on which human beings depend, it is necessary to solve the energy crisis and environmental pollution at the same time. The development of new and renewable energy is the promotion of energy conservation and efficient use of energy. The most important strategy, while the energy consumed by traditional lighting is extremely impressive, the development of lighting energy saving will be the most important new energy technology, and the semiconductor lighting uses high-power high-brightness LED (LED) as the light source, the new light source Its high luminous efficiency, energy saving, longevity, environmental protection (not containing mercury), fast start-up, directivity, etc., have the potential to widely replace traditional lighting sources. The LED is converted into heat due to 80%~9〇% of the input electric energy, only 10%~20% is converted into light energy, and because the LED chip area is small, the chip is hot; the LED package must be solved by the problem; excellent The cooling system can be used to wait for the low power of the king to make the temperature, to extend the use of the coffee, or to increase the density within the same temperature limit, thereby increasing the brightness of the LE... n 8 201013106 .te (10) (4) is an important technical indicator for measuring the heat dissipation performance of LED packages. The increase in junction temperature caused by poor heat dissipation will seriously affect the luminous wavelength, light intensity, luminous efficiency and service life. Application of high-power high-brightness LED in the photo (4) Xinguangshe, must cooperate with high-efficiency heat dissipation mechanism to minimize the junction temperature of the LED, in order to exert the above advantages, otherwise the illumination brightness and service life of the lighting device will be greatly reduced, affecting The energy saving effect of the lighting device will be inconsistent and directly impact the reliability of the lighting device', causing severe light decay or even invalidating the device. In order to enable the semiconductor lighting device to continuously enter the lower temperature airflow from the outside, it is necessary to establish a low flow resistance cooling airflow passage in the lighting device; in the case of not using the fan, the low output power lighting application uses the low airflow. In addition to the natural driving and heat dissipation of the driving force, it can also be achieved by a large heat dissipation area. However, in high-power and high-brightness lighting applications, fan cooling is often used due to space or weight limitations and cost considerations. Significant benefits have been achieved in reducing the size of the lighting device, reducing the cost, and improving the heat dissipation efficiency. Although the conductor lighting device has seen the use of a fan, it has not conducted in-depth research on the guidance of the cooling airflow and the smoothing of the cooling flow path. To the fan household; the vertical cooling flow field can not fully exert the heat dissipation effect, thus affecting the stability of the lighting quality and failing to achieve the expected service life. SUMMARY OF THE INVENTION In view of this, it is necessary to provide an emitter lamp having high heat dissipation efficiency. ~ - Light-emitting diode lamps, including - optics, - electrical and - 9 201013106 heat dissipation. The optical portion includes at least one light emitting diode light source and a light exiting channel. The electrical portion includes a rear casing and a circuit board disposed in the rear casing. The rear casing is provided with a plurality of openings. The heat dissipation portion includes a front housing, a heat sink and a fan. The front housing is a hollow housing. The optical portion and the electrical portion are respectively disposed at two ends of the front housing. The heat sink is disposed in the front housing and disposed adjacent to the optical portion. The heat sink includes a solid body. And a plurality of fins disposed on the solid body, the solid body is a heat absorbing surface adjacent to an end surface of the optical portion, the light emitting diode light source is disposed on the heat absorbing surface, and the fan is disposed in the front 〇 housing Located between the heat sink and the electric part, a plurality of air holes are arranged on the wall surface of the front casing, and when the fan is running, cooling air is introduced from a side of the air holes close to the electric part, and the airflow generated by the fan is blown toward the heat sink. The holes are discharged from the side close to the optical portion to dissipate heat generated by the light-emitting diode light source. As a further improvement of the illuminating diode lamp, the heat dissipating portion further includes a flow guiding device disposed in the front casing, wherein the guiding device is a ring body disposed on a periphery of the fan cymbal, the ring body is composed of two The end is inwardly conical with a conical surface. The present invention has the following advantages: The present invention provides a light-emitting diode lamp having a front case and a rear case for integrating a light-emitting passage fixed to an end portion of the front case, and a heat sink disposed in the front case. With the fan and the circuit board fixed on the rear casing, the utility model can be used for utilizing the space of the power body, simplifying the assembly process, facilitating disassembly and maintenance, and saving manufacturing cost. < The present invention enables the fan to guide the cooling airflow from the outer 201013106 boundary by the flow guiding device disposed at the periphery of the inner wall of the front casing and the plurality of air holes and openings provided at different positions of the two casings A smooth and effective cooling airflow channel is formed in the diode lamp to enhance the heat dissipation effect of the light engine. The invention combines the technical means of synchronously reducing the heat absorption thermal resistance and the heat dissipation thermal resistance, and provides a light-emitting diode lamp integrating the optical part, the heat dissipation part and the electric part, so as to systemize the design and process of the light-emitting diode lamp. The invention utilizes a high-efficiency fluid power transmission mechanism of a venturi to establish a low flow resistance cooling airflow passage in the light-emitting diode lamp, thereby greatly improving the inherent weakness of the fan to enhance the heat dissipation efficiency, thereby achieving a low Node temperature, long life, high luminous efficiency. [Embodiment] Hereinafter, a light-emitting diode lamp of the present invention will be further described with reference to Figs. 1 to 11'. 1 is a perspective assembled view of a first embodiment of a light-emitting diode lamp according to the present invention, FIG. 2 is an exploded perspective view of FIG. 1, and FIG. 3 is an assembled view of the light engine 21 of FIG. The body lamp 1 includes an optical portion ◎ 10, a heat dissipation portion 20, and an electrical portion 30. Wherein: the optical portion 10 is not placed in front of the heat dissipating portion 20, and includes a light-emitting body light source 11 and an light-emitting channel 12'. The light-emitting diode light source 1:1 is an integrally formed member' including at least one light-emitting portion The transparent package illuminator 111 (Emitter) of the polar body wafer, the plurality of electrodes 112, and a heat-conducting substrate 113 at the bottom of the illuminator lu can be electrically connected to the electrode 112 via a wire (not shown). A circuit board 31 in the electrical unit 30 is electrically connected to the circuit board 31 and an external power source (not shown) by a lamp cap 32, and heats the heat-dissipating substrate 113 and the heat-dissipating portion 20 to form a heat sink 11 201013106 A heat absorbing surface 223 of the solid body 221 is in close thermal contact to transmit and remove heat released when the light emitting diode light source 11 emits light. In this embodiment, the close thermal contact between the heat conducting substrate 113 and the heat absorbing surface 223 of the solid body 221 may be first applied with a thermal interface material (TIM) between the two, and then the plurality of screws of the electrical insulating sheet are assembled. 114, respectively, through the plurality of fixing holes 115 on the heat-conducting substrate 113, so as to be locked to the screw holes 224 of the heat-absorbing surface 223 of the solid body 221, the thermal conductive substrate 113 can be directly adhered (SMT) by the reflow method. The heat absorption surface 223 is achieved. The light-emitting diode light source η of the optical portion 10 can also be in other forms. For example, the close thermal contact between the light-emitting diode source of the form not including the heat-conducting substrate 113' and the heat-absorbing surface 223 of the solid body 221 can be used first. The thermal surface 223 of the solid body 221 is electrically insulated, and then a metal substrate circuit such as a copper-platinum substrate circuit is laid on the electrically insulating heat-absorbing surface 223, and the light-emitting diode wafer and the metal substrate circuit are electrically connected. The light-emitting diode light source does not include the heat-conducting substrate 113, and the thermal resistance of the contact between the heat-conductive substrate 113 and the solid body 221 is avoided. The heat generated by the light-emitting diode light source can be directly absorbed by the solid body 221 and quickly dissipated, which can further improve the heat dissipation efficiency. For the convenience of description, the embodiment and the following embodiments are all described by the light-emitting diode light source 11 including the heat-conductive substrate 113. In fact, the light-emitting diode light source 11 of each embodiment can be used without the above-mentioned heat conduction. The light-emitting diode light source of the substrate 113 is replaced. The light exiting channel 12 includes a light cup 121 and a light guide cover 122. The light cup 121 has a tapered reflection 12 201013106 surface which is outwardly diffused by the light emitting diode light source 11 , and the light cup 121 is adjacent to the light emitting diode light source 11 . A through hole 123 is defined in the center of one end for the transparent package illuminator 111 to protrude into the light cup 121. The light guide cover 122 is disposed on the outer edge of the other end of the light cup 121, and is a cover including at least one optical lens. The outer edge of the light guide cover 122 is embedded in a snap ring 124. The outer peripheral surface of the snap ring 124 is provided with a screw 125 for locking with a front housing 23 of the heat dissipation portion 20 to provide a light emitting diode. The illumination brightness and illumination characteristics and the light source protection function required for the lamp 100; the optical lens may have different forms according to practical purposes, for example: a translucent cover having a plurality of small convex spherical surfaces or a translucent hair The mask cover reduces glare and a transparent cover for maximum light extraction efficiency. In a practical application, the light-emitting diode light source 11 may be combined by a plurality of separate single-light-emitting diode light sources. At this time, the light cup 121 and the light guide cover 122 in the light-emitting channel 12 may correspond to the complex separation. The light source of the light emitting diodes is separately provided, and only one configuration of the light cup 121 and the light guide cover 122 may be used. The heat dissipating portion 20 is located between the optical portion 10 and the electrical portion 30, and includes a front housing 23, a heat sink 22, a fan 24, and a flow guiding device 25; wherein the heat sink 22, the fan 24, and the flow guiding device 25 The light-emitting diode light source 11 is disposed on the heat absorption surface 223 of the heat sink 22, and the light-emitting diode light source 11, the heat sink 22, and the fan 24 constitute a light engine 21. The front housing 23 is an annular hollow housing, and the inner diameter of the front housing 23 is decreased from an end near the electrical portion 30 toward an end close to the optical portion 10, and the front housing 23 is adjacent to one end of the optical portion 10. The inner surface is provided with a thread 231 coupled with a thread 125 of the snap ring 124 13 201013106 , by which the light guide cover 122 and the light cup 121 can be combined with the front housing 23; the front housing 23 The peripheral ring is provided with a plurality of air holes which are axially divided into two groups by an annular intermediate partition 232 of the front casing 23, that is, the first group of air holes 233 adjacent to the electric portion 30 and the optical unit 10 close to the optical portion 10. The second group of air holes 234, the first group of air holes 233 and the second group of air holes 234 are all extended along the axial direction of the front housing 23. The heat sink 22 includes a cylindrical solid body 221 and a plurality of fins 222 extending axially from the solid body 221 toward an end surface of the electrical portion 30. When the heat sink 22 is disposed in the front housing 23, the front housing A second set of air holes 234 disposed on the body 23 adjacent to the optical portion 10 covers a portion of the solid body 221 and a majority of the fins 222 of the heat sink 22. In this embodiment, the fins 222 are pin fins. The fins 222 may be in other forms, such as a plate-shaped fin; the solid body 221 of the heat sink 22 faces the end surface of the optical portion 10 and is a heat absorbing surface 223 that is in close thermal contact with the light-emitting diode light source 11 for The heat released when the light-emitting diode light source 11 emits light is transmitted. The edge of the solid body 221 of the heat sink 22 is axially disposed with a plurality of fixing holes 225 extending through the end faces of the solid body 221 to respectively insert a screw 226 into the fixing hole 225 for use. The fixed heat sink 22 is fixed. The fan 24 is disposed in the front housing 23 and located between the heat sink 22 and the electrical portion 30. The fan 24 includes a bracket 241, a stator disposed on the bracket 241, and an impeller 243 pivotally connected to the stator. In addition, the fan 24 further includes a lead frame 244 disposed between the bracket 241 and the impeller 243 for supporting and guiding the wires led by the stator of the fan 24 to prevent the wire from interfering with the rotation of the fan 24. The fixing hole 225 of the outer end of the bracket 241 corresponding to the heat sink 22 14 201013106 is correspondingly provided with a fixing hole 242 for the screw 226 to pass through, thereby fixing the fan 24 to the end of the fin 222 of the heat sink 22 . In this embodiment, the fan 24 is correspondingly disposed in the partition 232 of the front casing 23, and the fan 24 is an axial flow fan for blowing air toward the heat sink 22. At this time, the front casing 23 is adjacent to the electric part 30. The first group of air holes 233 are provided for air intake, and the second group of air holes 234 provided on the front casing 23 near the optical portion 10 are used for exhausting air, and the fan 24 is sucked and cooled by the first group of air holes 233 on the front casing 23. The air is blown to the fins 222 of the heat sink 22, and after the heat exchange with the fins 222, the heated airflow is discharged through the second group of air holes 234 on the front casing 23, thereby generating the light-emitting diode light source 11. Heat is emitted. In order to further enhance the heat dissipation effect of the light engine 21 of the present invention, the front housing 23 is further provided with a flow guiding device 25, and the flow guiding device 25 is located at the middle partition 232 and is disposed at the periphery of the fan 24. The flow guiding device 25 is a ring body, and the inner surface of the ring body is a conical surface 251 which is cohesively inwardly from both ends, that is, the inner diameter of the middle portion of the ring body is smaller than the inner diameter of the two ends of the ring body, the ring body The shaft axis height is the same as the axial length of the middle partition plate 232, and the outer diameter of the ring body is the same as the minimum inner diameter of the middle partition plate 232, so that the ring body is glued to the inner side of the middle partition plate 232, and the heat dissipation is performed. The outer edge of the end of the fin 222 of the device 22 is in contact with the inner wall of one end of the ring body; when the fan 24 is blown toward the heat sink 22 to introduce cooling air, the flow guiding device 25 connects the inner wall of the front case 23 with the heat sink The flow path between the ends of the fins 222 of the 22 is blocked so that the cooling airflow can only flow through the phase. Between the fins 222 of the higher flow resistance, the air inlet end of the flow guiding device 25 is a cohesive cone. The shaped surface 251 and the smaller cross-sectional area of the fluid in the middle thereof force the airflow to gradually accelerate and be introduced between the ore plates 222, by which the cohesive inclined surface guide The motion inertia of the fluid guide 15 201013106 'converges the airflow toward the hottest zone in the center of the radiator 22 and absorbs heat - since the central region of the impeller 243 of the fan 24 is a hub having a large area, the hub blocks the wind from entering the radiator The central zone of 22, which is often the hottest and most in need of enhanced heat dissipation, is provided with the lowest temperature that can be introduced by the air vents of the outer casing 23, i.e., the first set of vents 233. The airflow is directed to the central heat source zone where the heat flux is the highest, which greatly compensates for the use of the fan 24 (four) days of weakness; #引化的冷流流吸热热热热 expansion and spread to its periphery, further cooling it with a higher temperature airflow The secondary heat source is used to make the cooling air introduced by the fan 24 to the optimal utilization efficiency, so that the heat dissipation efficiency of the light engine 21 is significantly improved; finally, the f air flow is self-exhausting air holes (ie, the second group) When the air hole 234) leaves, the inclined surface which is extended outward by the flow guiding device 25 guides the heat-absorbing higher-temperature airflow to gradually decelerate and diffuses to the outside, and finally heats the light-emitting diode light source 11 It can be seen that the flow guiding device 25 is disposed and matched with the air inlet holes (ie, the first group of air holes 233) and the air outlet holes (ie, the second group of holes 234) provided around the front casing 23. The waste airflow just introduced can be effectively prevented from being directly discharged by the exhaust air hole, and the high-efficiency fluid power transmission mechanism of the venturi is skillfully incorporated into the light-emitting one-pole lamp 100 of the present invention, and the use is greatly enhanced. The intrinsic weakness of the fan 24's high-efficiency heat dissipation requirement of the lenticular light-emitting diode lamp (10) causes the cooling airflow guided by the fan 24 from the outside to form a smooth and effective low-flow resistance in the light-emitting diode lamp 100. The hot air flow channel further reduces the heat dissipation resistance = the heat dissipation efficiency of the enhanced light 51 engine 21, thereby achieving a low junction temperature, a long life, and a high luminous efficiency. 16 201013106 The electrical part 30 includes a rear case 33 connected to the front case 23 and a circuit board 31 disposed in the rear case 33. The circuit board 31 is connected to the electrode 112 of the light-emitting diode light source 11 and The external power source is electrically connected. The power source can be a DC power source such as a battery or a battery, and the AC power can be converted into a DC power source suitable for the LED source 11 through the power converter. In this embodiment, the lamp head 32 is used. The power supply connection mode is provided by the circuit board 31 to provide the driving power of the LED light source 11 and the power management of the LED lamp 100; the rear housing 33 is a hollow cup-shaped shield, the rear housing The outer surface of one end away from the front end of the front housing 23 is provided with a screw 331 which is screwed with the commercial metal base 32. The space inside the rear housing 33 is for accommodating the electronic components 312 of the circuit board 31. The rear housing 33 is further provided with a plurality of fixing bases 332 on the inner wall of one end of the front housing 33. The center of the fixing base 332 is provided with a screw hole 333, and the screw hole 333 and the solid body 221 The fixing hole 225 provided at the edge along the axial direction corresponds to The fixing edge 332 of the rear cover 33 of the circuit board 31 is respectively provided with a fixing hole β 311 for the fastener to pass through to fix the circuit board 31 to the rear housing 33. ❿ In this embodiment, A plurality of adapters 34 are respectively disposed between the circuit board 31 and the fixing base 332 of the rear housing 33 and between the circuit board 31 and the bracket 241 of the fan 24; one end of the adapter 34 is provided with an external thread and the other end A screw hole is provided, and the heat sink 22, the fan 24, the circuit board 31 and the rear housing 33 are fixed together by the screw 226 and the adapter 34; by turning on the fixing base 332 of the rear housing 33 The joint 34 can reduce the screw hole wear during disassembly and assembly, strengthen the overall structure, simplify the assembly process and improve the reliability, especially when the rear casing 33 is made of a plastic material, the fixing seat 332 can be effectively prevented from being damaged 17 201013106 In addition, the rear casing 33 is further provided with a plurality of openings 334 near the periphery of the end of the lamp cap 32 to dissipate heat generated by the circuit board 31. The front housing 23 and the rear housing 33 are respectively provided with a positioning structure and a fastening structure to combine the two, that is, the end portions of the two housings 23 and 33 are respectively provided with corresponding positioning grooves 235 in the axial direction. The sliding position between the positioning post 335 and the positioning flange 335 is such that the flange 236 provided on the outer periphery of the end portion of the front housing 23 is inserted into the recess 336 provided in the inner periphery of the end portion of the rear housing 33 to reach the two housings. 23, 33 the purpose of positioning and fastening; the above combination is not only easy to assemble, but also prevents the two housings from being combined to prevent rotation, so as to ensure that the pre-positioned wires in the two housings 23, 33 are not damaged or caused by twisting. The connection is detached. In addition, in order to effectively reduce the dust introduced by the air inlet holes and the openings 334, a gauze or a low flow may be respectively disposed at the inner walls of the two casings 23, 33 corresponding to the inlet air holes and the openings 334. Resistive filter. The light-emitting diode lamp 100 is combined with the rear casing 33 by the front casing 23 and the rear casing 33 for integrating the light-emitting passage 12 fixed to the end of the front casing 23 and the electric portion fixed to the rear casing 33. 30 and the light engine 21, the combined light-emitting channel 12 and the light engine 21 are covered in the front casing 23, and the electric portion 30 is covered in the rear casing 33; the heat released by the light-emitting diode light source 11 is usually The heat released by the electrical part 30 is farther than that of the heat source load of the light-emitting diode light source 11 and the electrical part 30 of the light-emitting diode lamp 100, and the total opening 334 of the rear casing 33 is provided. The area is smaller than the total area of the inlet air holes (ie, the first group of air holes 233) provided in the front casing 23, so that a smaller portion of the cooling airflow flows through the electrical portion 30, and the larger main cooling airflow is directed to Between the fins 222 of the heat sink 22, the cooling airflow channel driven by the fan 24 18 201013106 is utilized to effectively transmit and remove the heat released when the light emitting diode light source illuminates, so that the heat of the light engine 21 is dissipated. The ability is far superior to the conventional technology, so the green guarantee light emitting diodes 100 lamps High efficiency and stable light output. 4 is a perspective exploded view of the light engine 41 in the second embodiment of the light-emitting diode lamp of the present invention. FIG. 5 is a perspective assembled view of FIG. 4; in the embodiment, the light engine 41 and the light engine 21 in the first embodiment. The main difference is that the heat sink 42 in this embodiment includes a central solid body 421 and a plurality of fins 422 extending radially outward along the circumferential surface of the solid core body, and the light emitting diode light source 11 is located at A heat absorbing surface 423 of the solid body 421 is in close thermal contact. The fan 24 is disposed at the other end of the solid body 421, and the bracket 241 of the fan 24 is visualized by the screw 226 and the adapter 34. The heat sink of the embodiment 42 adopts the same external dimensions as the foregoing embodiment, so that the heat sink 22 can be directly replaced and the same components as in the first embodiment can be used to assemble the LED illuminator in the same manner and the front housing The ventilating air hole of 23 covers the large 4-blade fin 422 of the heat sink 42 near the end of the light-emitting diode light source ^. Since the heat sink 42 of the embodiment can adopt the extrusion process, it is suitable for mass production and has cost saving. The advantages; The flow guiding device 25 can also make the cooling airflow guided by the fan 24 from the outside to form the same function of the heat transfer airflow channel in the heat sink 42 of the LED body lamp, which can further reduce the loose resistance to optimize the hair (4) aperture. The heat dissipation effect of the engine 41 ensures that the application achieves high-efficiency lighting effects at low junction temperatures on semiconductor lighting. 6 is an exploded perspective view of a light engine 51 19 201013106 in a third embodiment of the light-emitting diode lamp of the present invention, FIG. 7 is a perspective assembled view of FIG. 6, and FIG. 8 is a perspective view of the heat sink 52 in FIG. The main difference between the light engine 5]L in this embodiment and the light engine 21 in the first embodiment is that the heat sink 52 in this embodiment includes a cylindrical solid body 521, and the center of one end surface of the solid body 521 a central cylinder 523 extending in the axial direction toward the fan 24 and a plurality of straight fins 524 ′ extending radially and radially from the circumferential surface of the central cylinder 523 and the fins 524 and the solid body The end faces 522 of the 521 are connected to amplify the heat dissipation area and provide multiple heat conduction paths to enhance the heat dissipation effect of the light engine. An end surface of the solid body 521 of the heat sink 52 facing away from the fin 524 is a heat absorbing surface 525. The light emitting diode light source 11 is disposed on the heat absorbing surface 525 and is in close thermal contact with the heat absorbing surface 525. The heat absorbing surface 525 There is a wire slot 527 for the valley sensing line 526. The temperature sensing line 526 is disposed at the central heating zone of the light emitting diode source 11 to measure the central hottest temperature of the light emitting diode source n. . The temperature sensing line 526 is electrically connected to an over-temperature protection ❹ control circuit of the circuit board 31, so that when the junction temperature of the illuminating diode light source n is higher than a set value, power-off is performed to protect the LED illuminator; The heat absorbing surface 525 radiates and diffuses heat absorbed by the hottest zone in the center of the solid body 521 to the periphery thereof, and is radiated to the fin 524 provided on the face 522 of the solid body 521 in the axial direction. And the central cylinder 523; on the other hand, heat is radially transmitted from the central cylinder 523 to the fins 524 to provide a plurality of heat conduction paths and an amplified heat dissipation area; and the heat dissipation fins 524' are directly blown by the fan 24. The low-flow resistance cooling gas 20 201013106 that is enlarged toward the periphery of the solid body 521 is formed between the plurality of fins 524 that are radially from the center cylinder 523; the fan 24 can be blown through the center cylinder 523. The medium to thermal zone that is touched is used to conduct heat, and the multiple heat conduction paths and the amplified heat dissipation area provided by the heat sink 52 are directly guided to the fins 524 to fully utilize the high efficiency to transmit the light emitting diode light source. 1;1 released when illuminated Heat. In addition, the fixing between the light engine 51 and the circuit board 31 and the rear housing 33 in this embodiment is different from that of the first embodiment. In the present embodiment, a plurality of springs 512 are disposed between the fan % and the circuit board 31. In place of the adapter 34 in the first embodiment, the sleeve 513 is fixed to the light body 51, the circuit board 31 and the rear housing 33 by a long screw 511. The hole 528, the fixing hole 242 on the bracket 241 of the fan 24, the spring 512, the sleeve 513, and the fixing hole 3n on the circuit board 31 are screwed to the adapter 34 provided on the rear case 33. 9 is a perspective assembled view of the embodiment of the light-emitting diode lamp 600 of the present invention, and FIG. 10 is an exploded perspective view of FIG. 9 , which is a perspective view of the heat sink 62 shown in FIG. 1 ; the embodiment and the foregoing implementation. The main difference between the example is the structure of the heat sink 62 and the front case 63. The structure of the heat sink (4) in this embodiment is basically the same as that of the heat sink 52 in the third embodiment, and the difference lies in the Han 4 624 of the heat sink 62. The shape is a spiral shape which is radially around the center cylinder 623 to increase the heat dissipation area and the heat conduction path of the light-emitting diode light source U. The spiral direction of the spiral plate-shaped fin 624 is the fish fan 24 The direction of rotation of the impeller 243 is uniform, and the direction of the axial flow of the fan 24 is matched, so that the cooling airflow is more easily guided between the tabs 624 to absorb the heat of the fins 624 and smoothly discharged, so as to further strengthen the dispersal of the light engine. In addition, the peripheral surface of the front casing 63 in the present embodiment is provided with a plurality of air holes 631 ' 21 201013106. The air holes 631 are the air inlet holes on the front casing 23 in the first embodiment (ie, the first group of air holes 233). ) with the exhaust vent (ie the second set of vents 23) 4) The phase is formed to simplify the process and increase the overall flow area of the cooling airflow. When the fan 24 is in operation, the cooling air is sucked from the side of the air hole 631 near the rear casing 33 and blown between the fins 624 of the radiator 62. The endothermic airflow then flows away from the side of the rear casing 33 via the air holes to dissipate the heat generated by the light-emitting diode light source 11. In order to further enhance the heat dissipation effect of the light-emitting diode lamp 600 of the present embodiment, a flow guiding device 25 similar to that of the first embodiment may be disposed on the inner wall periphery of the front casing 63 corresponding to the position of the fan 24. Further, the heat sink in the foregoing embodiments may be used in the present embodiment instead of the heat sink 62. The technical features and the achieved effects of the present invention are further clarified by the above embodiments, including: (1) The present invention utilizes a technical means of establishing a low flow resistance cooling air flow channel in a light-emitting diode lamp. A small portion of the airflow is forced out of the electric helium and directs the main cooling airflow between the fins of the heat sink to take full advantage of the cooling airflow path to ensure high junction temperature on the semiconductor illumination Efficiency lighting effect. (2) The present invention provides a light-emitting diode lamp having a front case and a rear case for integrating a light guide cover fixed to an end portion of the front case and a circuit board and light fixed to the rear case The engine achieves full use of the housing space, simplifies the assembly process, facilitates disassembly and maintenance, and saves manufacturing costs. (3) The present invention provides a light engine having a fin and a solid body, which is provided by a flow guiding device disposed at a periphery of the inner wall of the inner body and a plurality of air holes and openings provided at positions of the different casings of the two housings 201013106. The cooling gas flow from the outside of the fan is formed in the light-emitting diode lamp - a smooth and effective air flow channel - enhances the heat dissipation effect of the light engine. (4) The invention adopts a modular high-efficiency light engine as a core, and combines the technical means of synchronously reducing the heat-absorbing thermal resistance and the heat-dissipating thermal resistance to provide a general-purpose light-emitting diode lamp structure integrating the optical part, the heat-dissipating part and the electric part. , to Da = the systematic design of the conductor light-emitting diode lamps in the design and process. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application in accordance with the law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application in this case. Equivalent modifications or variations made by persons in accordance with the spirit of the present invention are intended to be within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of a first embodiment of a light-emitting diode lamp of the present invention. 〇 Figure 2 is an exploded perspective view of Figure 1. 3 is a perspective assembled view of the light engine of FIG. 2. Fig. 4 is an exploded perspective view showing the light engine of the second embodiment of the light-emitting diode lamp of the present invention. Figure 5 is a perspective assembled view of Figure 4. Fig. 6 is an exploded perspective view showing a light engine in a third embodiment of the light-emitting diode lamp of the present invention. Figure 7 is a perspective assembled view of Figure 6. Figure 8 is a perspective view of the heat sink of Figure 6. 23 201013106 Fig. 9 is a perspective assembled view of a fourth embodiment of the light-emitting diode lamp of the present invention. Figure 10 is an exploded perspective view of Figure 9. 11 is a perspective view of a heat sink shown in FIG. 10; 发光 light-emitting diode lamp 100, 600 optical portion 10 light-emitting diode light source 11 illuminant 111 electrode 112 heat-conductive substrate 113 screw 114 light-emitting passage 12 fixing hole 115 , 225, 242, 311, 528 light cup 121 light guide 122 through hole 123 snap ring 124 screw 125, 231, 331 heat sink 20 solid body 221, 421 light engine 21, 41, 51 heat sink 22, 42, 52 '62 222, 422, 524, 624 heat absorbing surface 223, 423, 525 screw hole 224 screw 226, 511 front housing 23, 63 partition 232 first group air hole 233 second group air hole 234 positioning groove 235 convex Edge 236 Fan 24 Bracket 241 Impeller 243 Lead frame 244 24 201013106 Diversion device 25 Electrical part 30 Electronic component 312 Rear housing 33 Opening 334 Groove 336 Spring 512 End face 522 ❹ Temperature line 526 Air hole 631 Conical surface 251 Circuit board 31 Lamp cap 32 Mounting bracket 332 Positioning stud 335 Adapter 34 Sleeve 513 Center cylinder 523, 623 Trunking 527 ❿ 25