TW201022320A - Curable resin composition - Google Patents

Curable resin composition Download PDF

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Publication number
TW201022320A
TW201022320A TW098137268A TW98137268A TW201022320A TW 201022320 A TW201022320 A TW 201022320A TW 098137268 A TW098137268 A TW 098137268A TW 98137268 A TW98137268 A TW 98137268A TW 201022320 A TW201022320 A TW 201022320A
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Taiwan
Prior art keywords
group
compound
resin composition
curable resin
methyl
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TW098137268A
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Chinese (zh)
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TWI464189B (en
Inventor
Kazuo Takebe
Ki-Bum Paik
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Sumitomo Chemical Co
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Publication of TWI464189B publication Critical patent/TWI464189B/en

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/02Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04Coating
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/10Esters; Ether-esters
    • C08K5/11Esters; Ether-esters of acyclic polycarboxylic acids
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1334Constructional arrangements; Manufacturing methods based on polymer dispersed liquid crystals, e.g. microencapsulated liquid crystals
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Epoxy Resins (AREA)
  • Printing Methods (AREA)
  • Materials For Photolithography (AREA)
  • Paints Or Removers (AREA)

Abstract

The invention relates to a curable resin composition, which includes (A) a binding resin, (B) a polymeric compound and (D) a solvent, in which relative to the total content of the (A) binding resin and the (B) polymeric compound and the (D) solvent, the content of the solvent (D) is 20% or more by mass and less than 80% by mass.

Description

201022320 六、發明說明: 【發明所屬之技術領域】 本發明係關於硬化性樹脂組成物、塗膜、圖型及顯示 裝置。 【先前技術】 目前有提出於液晶顯示裝置或觸控面板等,在構成顯 Φ 示裝置之濾色器與陣列基板之間,以使用了感光性樹脂之 光微影術而形成間隔器(光刻型間隔器)一事。藉由此方 法,可在任意之場所形成間隔器。作爲光微影術所用之組 ,成物,已知含有黏合劑樹脂、光聚合性化合物、光聚合開 始劑及溶劑之感光性樹脂組成物(專利文獻1 )。 然而,此般之光微影術由於係經由製膜、曝光、顯像 等之步驟而形成間隔器之圖型,其步驟爲長且複雜,又, 大規模之製造設備則爲必要。 Φ 光微影術以外之方法已知有藉由噴墨印刷法、橡皮凸 板印刷法(flexographic printing )等之印刷法,將含有硬 化性樹脂組成物而成之液狀油墨塗佈於被印刷基材上之特 定位置,而形成圖型之方法(專利文獻2 )。 [專利文獻1]特開2006- 1 7 1 1 60號公報 [專利文獻2]特開2008 - 1 5 8284號公報 【發明內容】 然而,專利文獻1記載之感光性樹脂組成物所含之溶 -5- 201022320 劑之量相對於全組成物爲60質量%以上,專利文獻2記 載之硬化性樹脂組成物所含之溶劑之量相對於全組成物爲 80質量%以上,於印刷後去除溶劑用之乾燥則需要長時間 ,於印刷後或乾燥中因有形狀變化,其並非係容易使用於 印刷法。 本發明之課題,在於提供藉由印刷法,可形成高透過 率之塗膜或圖型的硬化性樹脂組成物。 本發明者,爲了找出可解決前述課題之硬化性樹脂組 成物經過探討之結果,發現藉由將所含之溶劑的量使其相 對於全組成物爲20質量%以上未滿60質量%,以印刷法 可得到可形成高透過率之塗膜或圖型的硬化性樹脂組成物 ,而完成本發明。 即,本發明係提供以下之[1]〜[16]者。 [1] 一種硬化性樹脂組成物,其含有黏合劑樹脂(A) 、聚合性化合物(B)及溶劑(D), 相對於黏合劑樹脂(A )、聚合性化合物(B )及溶 劑(D )之合計量,溶劑(D )之量爲20質量%以上未滿 6 0質量%。 [2] 如前述[1 ]記載之硬化性樹脂組成物,相對於黏合 劑樹脂(A )、聚合性化合物(B )及溶劑(D )之合計量 ’溶劑(D )之量爲25質量%以上50質量%以下。 [3] 如前述[1]或[2]記載之硬化性樹脂組成物,其中黏 合劑樹脂(A )係爲至少使選自由不飽和羧酸及不飽和羧 酸酐(A-a)所成裙之至少1種化合物,與具有碳數2〜4 -6- 201022320 之環 數2- 氧基 肪族 ^ 物及 h2c: [式( 碳數 1~6 : 參 ,其 之至 和羧 式( 群之 及式 狀醚的單體(A-c)使聚合而成之共聚物。 [4] 如前述[3]記載之硬化性樹脂組成物,其中具有碳 -4之環狀醚的單體(A-c)爲具有環氧基之單體。 [5] 如前述[4]記載之硬化性樹脂組成物,其中具有環 之單體爲具有脂肪族多環式環氧基之單體。 [6] 如前述[5]記載之硬化性樹脂組成物,其中具有脂 多環式環氧基之單體爲選自由式(I)所表示之化合 式(Π)所表之化合物所成群之至少1種化合物。201022320 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a curable resin composition, a coating film, a pattern, and a display device. [Prior Art] It is proposed to form a spacer (light) between a color filter constituting a display device and an array substrate, and a photolithography using a photosensitive resin, in a liquid crystal display device or a touch panel. Engraved spacers). By this method, a spacer can be formed at any place. A photosensitive resin composition containing a binder resin, a photopolymerizable compound, a photopolymerization initiator, and a solvent is known as a group for use in photolithography (Patent Document 1). However, such photolithography is a pattern of spacers formed by steps of film formation, exposure, development, etc., and the steps are long and complicated, and large-scale manufacturing equipment is necessary. In addition to the Φ photolithography method, a liquid ink containing a curable resin composition is applied to a printing method by a printing method such as an inkjet printing method or a flexographic printing method. A method of forming a pattern at a specific position on a substrate (Patent Document 2). [Patent Document 1] Japanese Laid-Open Patent Publication No. JP-A No. 2008-158 -5-201022320 The amount of the agent is 60% by mass or more based on the total composition, and the amount of the solvent contained in the curable resin composition described in Patent Document 2 is 80% by mass or more based on the total composition, and the solvent is removed after printing. It takes a long time to dry, and it has a shape change after printing or drying, and it is not easy to use in a printing method. An object of the present invention is to provide a curable resin composition which can form a coating film or a pattern having a high transmittance by a printing method. The inventors of the present invention have found that the amount of the solvent to be contained is 20% by mass or more and less than 60% by mass based on the total composition, in order to find a result of the curable resin composition which can solve the above-mentioned problems. The present invention has been completed by a printing method to obtain a curable resin composition which can form a coating film or a pattern having a high transmittance. That is, the present invention provides the following [1] to [16]. [1] A curable resin composition comprising a binder resin (A), a polymerizable compound (B), and a solvent (D), with respect to a binder resin (A), a polymerizable compound (B), and a solvent (D) The total amount of the solvent (D) is 20% by mass or more and less than 60% by mass. [2] The curable resin composition according to the above [1], the total amount of the solvent (D) is 25% by mass based on the total amount of the binder resin (A), the polymerizable compound (B), and the solvent (D). The above 50% by mass or less. [3] The curable resin composition according to the above [1] or [2] wherein the binder resin (A) is at least selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic anhydride (Aa). a compound, and a ring number 2-oxyl compound having a carbon number of 2 to 4 -6 to 201022320 and h2c: [Formula (carbon number 1 to 6: ginseng, and the carboxy group thereof) The monomer (Ac) having a cyclic ether of carbon-4 as described in the above [3], wherein the monomer (Ac) having a cyclic ether of carbon-4 has a copolymer. [5] The curable resin composition according to the above [4], wherein the monomer having a ring is a monomer having an aliphatic polycyclic epoxy group. [6] as described above [5] The curable resin composition according to the invention, wherein the monomer having an aliphatic polycyclic epoxy group is at least one compound selected from the group consisting of compounds represented by the formula (I) represented by the formula (I).

I)及式(II)中,R!及R2各自獨立表示氫原子或 1〜4之烷基。該烷基所含之氫原子可被羥基取代。 X2係各自獨立表示可含有單鍵或雜原子之碳數 之伸烷基。] [7] 如前述[3]〜[6]中任一項記載之硬化性樹脂組成物 中選自由不飽和羧酸及不飽和羧酸酐(A-a)所成群 少1種化合物爲選自脂肪族不飽和羧酸及脂肪族不飽 酸酐所成群之至少1種的化合物。 [8] 如前述[6]記載之硬化性樹脂組成物,其中選自由 I )所表示之化合物及式(II )所表示之化合物所成 至少1種化合物係爲選自由式(I’)所表示之化合物 (IΓ )所表示之化合物所成群之至少1種化合物。 201022320In I) and formula (II), R! and R2 each independently represent a hydrogen atom or an alkyl group of 1 to 4. The hydrogen atom contained in the alkyl group may be substituted with a hydroxyl group. X2 each independently represents an alkylene group which may have a single bond or a carbon number of a hetero atom. [7] The curable resin composition according to any one of the above [3] to [6], which is selected from the group consisting of an unsaturated carboxylic acid and an unsaturated carboxylic anhydride (Aa), is one selected from the group consisting of fats. A compound of at least one selected from the group consisting of a group of unsaturated carboxylic acids and aliphatic unsaturated anhydrides. [8] The curable resin composition according to the above [6], wherein at least one compound selected from the group consisting of the compound represented by I) and the compound represented by formula (II) is selected from the group consisting of formula (I') At least one compound in which the compounds represented by the compound (IΓ) are grouped. 201022320

[式(I,)及式(II,)中、I’及R2,各自獨立表示氫原子 或碳數1〜4之烷基。該烷基所含之氫原子可被羥基取代。 ] [9] 如前述[1]〜[8]中任一項記載之硬化性樹脂組成物 ,其中溶劑(D)其沸點爲200 °C以上,含有選自由酯系 溶劑、醚系溶劑及醇系溶劑所成群之至少1種溶劑的溶劑 〇 [10] 如前述[1]〜[9]中任一項記載之硬化性樹脂組成物 ,其中更含有聚合開始劑(C)。 [Π ]如前述[1 0]記載之硬化性樹脂組成物,其中聚合 開始劑(C)係含有選自雙咪唑系化合物、苯乙酮系化合 物、三嗪系化合物、醯基膦氧化物系化合物及肟系化合物 所群之至少1種之化合物的聚合開始劑。 [12] —種如前述[1]〜[U]中任一項記載之硬化性樹脂 ¥ 組成物之使用,其係爲形成塗膜或圖型用者。 [13] —種塗膜或圖型,其係使用如前述[ihtu]中任 一項記載之硬化性樹脂組成物所形成。 [14] 一種顯示裝置,其係含有前述[13]記載之塗膜或 圖型。 [15] —種塗膜或圖型之製造方法,其係具有將如前述 [1 ]~[ 11 ]中任一項記載之硬化性樹脂組成物使用印刷法於 基材上進行塗佈、乾燥、加熱而得到塗膜或圖型之步驟。 -8- 201022320 [I6]—種塗膜或圖型之製造方法,其係具有將如前述 [1 ]〜[1 1 ]中任一項記載之硬化性樹脂組成物使用印刷法於 基材上進行塗佈、乾燥、曝光處理、更依據需要進行加熱 而得到塗膜或圖型之步驟。 發明之效果 本發明之硬化性樹脂組成物藉由印刷法可形成高透_ _ 率之塗膜或圖型。 【實施方式】 以下,詳細說明本發明。 本發明之硬化性樹脂組成物含有黏合劑樹脂(A )、 聚合性化合物(B )及溶劑(D ),黏合劑樹脂(A )相對 於聚合性化合物(B )及溶劑(D )之合計量,溶劑(D ) 之量爲20質量%以上未滿60質量%者。 φ 作爲本發明之硬化性樹脂組成物所用之黏合劑樹脂( A),可例示黏合劑樹脂(A1)或黏合劑樹脂(A2)。黏 合劑樹脂(A 1 )具有酸性基,黏合劑樹脂(A2 )具有酸 性基’且藉由光及熱之至少任一方之作用而顯示反應性。 黏合劑樹脂若具有酸性基,則有黏合劑樹脂之Tg及 機械特性變高之傾向而爲理想。又,將具有碳數2~4之環 狀醚構造基的單體(A-c )作爲共聚物成分而含有之情況 ’有硬化性升高、耐藥品性及耐熱性變高之傾向而爲理想 -9- 201022320 作爲黏合劑樹脂(A 1 )可例示選自由不飽和羧酸及 不飽和羧酸酐所成群之至少1種(A-a)(以下有稱爲「 (A-a)」之情況),與(A-a)可共聚合之單體(A-b) (但,除(A-a )以外)(以下「有稱爲(A_b )」之情況 )之共聚物等。 (A-a )可舉出例如脂肪族不飽和羧酸及/或脂肪族 不飽和羧酸酐等,具體而言,例如可舉出, 丙烯酸、甲基丙烯酸、巴豆酸等之不飽和單羧酸類; 馬來酸、富馬酸、檸康酸、中康酸、伊康酸等之不飽 和之羧酸類; 及前述之不飽和二羧酸類之無水物; 琥珀酸單[2-(甲基)丙烯醯氧基乙基]酯、酞酸單[2-(甲基)丙烯醯氧基乙基]酯等之2價以上之多價羧酸之 不飽和單[(甲基)丙烯醯氧基烷基]酯類; α-(羥基甲基)丙烯酸等之於同一分子中含有羥基 及羧基之不飽和丙烯酸酯類等。 此些之中,以丙烯酸、甲基丙烯酸或無水馬來酸等, 其共聚合反應性良好、共聚物之Tg及機械特性高、無黏 著(tack)性可理想使用。此些可單獨或組合使用。 (A-b )可舉出, (甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基 )丙烯酸正丁酯、(甲基)丙烯酸sec-丁基酯、(甲基) 丙烯酸tert-丁基酯等之(甲基)丙烯酸烷基酯類; (甲基)丙烯酸環已基酯、(甲基)丙烯酸2-甲基 -10- 201022320 環己基酯、(甲基)丙烯酸三環[5.2.1.02’6]癸烷_8·基酯( 該技術領域中之慣用名被稱爲(甲基)丙烯酸二環戊基酯 (D i c y c 1 ο p e n t a n y 1 M e t h a c r y 1 a t e )。)' (甲基)丙燒酸 二環戊基氧基乙基酯 ' (甲基)丙烯酸異佛爾基酯等之( 甲基)丙烯酸環狀烷基酯類; 丙烯酸環己基酯、丙烯酸2 -甲基環己基酯、丙烯酸 三環[5.2.1. 〇2,6]癸烷_8_基酯(該技術領域中之慣用名被稱 φ 丙烯酸二環戊基酯。)、丙烯酸二環戊氧基乙基酯、丙烯 酸異佛爾基酯等之丙烯酸環狀烷基酯類; (甲基)丙烯酸苯酯、(甲基)丙烯酸苄酯等之(甲 基)丙烯酸芳香酯類; 丙嫌酸苯酯、丙烯酸苄酯等之丙烯酸芳香酯類; 馬來酸二乙酯、富馬酸二乙酯、伊康酸二乙酯等之二 羧酸二酯; ❹ (甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥 基丙酯酯等之羥基烷基酯類; 雙環[2.2.1]庚_2 -烯、5 -甲基雙環[2,2.1]庚_2·烯、5-乙基雙環[2.2.1]庚_2_烯、5-羥基雙環[2·21]庚·2_烯、5. 殘基雙環[2.2.:1]庚_2_稀、5_經基甲基雙環[2.21]庚_2_嫌 、5- (2’-羥基甲基)雙環口·2.〗]庚·2_烯、5_甲氧基雙環 [2.2」]庚_2_焴、5_乙氧基雙環[2.2 im_2,、5,6•二羥基 雙環、5,6·二翔基雙環[2 2.·ι稀、$ & 基) 經基甲基)雙環[221]庚_2_烯、5乂-二(2,_經基乙 雙環urn2·烯、5>二甲氧基雙環u 2··_2·燦 -11 - 201022320 、5,6-二乙氧基雙環[2·2·1]庚-2·烯、5-羥基-5-甲基雙環 [2.2.1]庚-2-烯、5-羥基_5_乙基雙環[2.2.1]庚-2-烯、5-羧 基-5-甲基雙環[2.2.1]庚_2·烯、5·羧基-5-乙基雙環[2,2.1] 庚-2-烯、5-羥基甲基_5_甲基雙環[2.2.1]庚-2-烯、5-羧基-6-甲基雙環[2.2.1]庚-2-烯、5-羧基-6_乙基雙環[2.2.1]庚-2-烯、5,6-二羧基雙環[2.2.Π庚-2-烯酐(腐植酸酐)、5-tert-丁氧基羰基雙環[2.2.1]庚-2-烯、5-環己基氧基羰基雙 環[2.2.1]庚-2-烯、5-苯氧基羰基雙環[2.2.1]庚-2-烯、5,6-二(tert-丁氧基羰基)雙環[2.2.1]庚-2-烯、5,6-二(環己 基氧基羰基)雙環[2.2.1]庚-2-烯等之雙環不飽和化合物 類; N-苯基馬來醯亞胺、N-環己基馬來醯亞胺、N_苄基馬 來醯亞胺、N -丁二醯亞胺基-3-馬來醯亞胺苯甲酸酯、N-丁二醯亞胺基馬來醯亞胺丁酸酯、N -丁二醯亞胺基- 6-馬來醯亞胺己酸酯、N -丁二醯亞胺基-3-馬來醯亞胺丙酸 酯、N- (9 -吖啶基)馬來醯亞胺等之二羰基醯亞胺衍生物 類; 苯乙烯、甲基苯乙烯、m-甲基苯乙烯、p-甲基苯 乙烯、乙烯甲苯' p-甲氧基苯乙烯、丙烯腈、甲基丙烯腈 、氯乙烯、氯化亞乙烯、丙烯醯胺、甲基丙烯醯胺、乙酸 乙烯酯、1,3-丁二烯、異戊二烯、2,3-二甲基-1,3-丁二烯 等。 此些之中’以苯乙烯、N-苯基馬來醯亞胺、N-環己基 馬來醯亞胺' N-苄基馬來醯亞胺、雙環[2.2.1]庚-2-烯等 -12- 201022320 由共聚合反應性及鹼溶解性之觀點爲佳。 (A-a )及(A-b )可單獨或組合使用。 尙,本說明書中,(甲基)丙烯酸酯係指丙烯酸酯及 /或甲基丙烯酸酯。 在使(A-a )及(A-b )共聚合而得之共聚物中,由各 自所衍生之構成成分之比率爲將構成前述之共聚物的構成 成分之合計莫耳數設爲100莫耳%時,以莫耳分率在以下 φ 之範圍爲佳。 由(A-a)所衍生之構成單位:2〜40莫耳% 由(A-b )所衍生之構成單位:60~98莫耳% 又,前述之構成成分之比率在以下之範圍爲更佳。 由(A-a)所衍生之構成單位:5〜35莫耳% 由(A-b )所衍生之構成單位:65〜95莫耳% 前述之構成比率若在上述之範圍,有保存安定性及耐 溶劑性變得良好之傾向。 φ 黏合劑樹脂(A1)可參考例如文獻「高分子合成之 實驗法」(大津隆行著 發行所(股)化學同人 第1版 第1刷 1 972年3月1日發行)所記載之方法及該文獻 所記載之引用文獻進行製造。 具體而言,將構成共聚物之單位(A-a)及(A-b)之 既定量、聚合開始劑及溶劑放入反應容器中,藉由以氮取 代氧,在不存在氧下,藉由進行攪拌、加熱 '保溫而得到 聚合物。且,所得之共聚物可直接使用反應後之溶液,亦 可使用其經濃縮或稀釋之溶液,也可使用以再沈殿等之方 -13- 201022320 法以固體(粉體)所取出者。 黏合劑樹脂(A1)之以聚乙烯換算之重量平均分子 量,較佳爲3,000~1 00,000,更佳爲 5,000〜50,000。具有 酸性基之樹脂(A1)的重量平均分子量若在前述之範圍 ,有塗佈性變得良好之傾向,且有黏合劑樹脂之Tg及機 械特性變高之傾向,黏著性變無之傾向,故爲佳。 黏合劑樹脂(A1)之分子量分佈[重量平均分子量( Mw) /數平均分子量(Μη)],較佳爲1.1-6.0,更佳爲 1.2〜4.0。分子量分佈若在前述之範圍,因有塗佈性變優 良之傾向,故爲佳。 可使用於本發明之硬化性樹脂組成物的黏合劑樹脂( A 1 )之含有量,相對於硬化性樹脂組成物中之固形分以 質量分率較佳爲5~90質量%,更佳爲10〜70質量%。黏合 劑樹脂(A 1 )之含有量若在前述之範圍,有印刷性變得 良好之傾向,故爲佳。 具有酸性基,且藉光及熱之任一方之作用顯示反應性 之黏合劑樹脂(A2 ),可例示(A2-1 )〜(A2-3 )。 黏合劑樹脂(A2-1)係(A-a) 、(A-b),與具有碳 數2〜4之環狀醚構造之單體(A-c)(以下「有稱爲(A-c )」之情況)的共聚物。 黏合劑樹脂(A2-2)係在(A-a)與(A-b)之共聚物 中,藉由使源自(A-a)之羧基的一部分與源自(A-c)之 碳數2〜4之環狀醚構造反應而得之共聚物。 黏合劑樹脂(A2-3)係(A-a)與(A-c)之共聚物。 -14 - 201022320 (A-c)係指例如具有選自由碳數2〜4之環狀醚構造 (例如,環氧乙烷構造、氧環丁烷構造及四氫呋喃構造所 成群之至少1種構造的聚合性化合物。該具有碳數2〜4之 環狀醚構造的單體(A-c )係以,具有選自由碳數2〜4之 環狀醚構造所群之至少1種構造且具有碳-碳不飽和鍵結 之化合物爲佳,以具有選自碳數2~4之環狀醚構造所成群 之至少1種構造且具有丙烯醯基或甲基丙烯醯基之化合物 ❿爲更佳° (A-c)例如可舉出具有環氧基之單體、具有氧環丁 烷基之單體、具有四氫糠基之單體等。 前述之具有環氧基的單體係指例如具有選自由脂肪族 環氧基及脂環式環氧基所成群之至少1種之基的聚合性化 合物。該具有環氧基之單體係以具有選自由脂肪族環氧基 及脂環式環氧基所成群之至少1種之基,且具有碳-碳不 飽和鍵結之化合物爲佳,以具有選自由脂肪族環氧基及脂 % 環式環氧基所成選之至少1種之構造,且具有丙烯醯基或 甲基丙烯醯基之化合物爲佳。 在此,脂肪族環氧基係指單環之環氧乙烷基( oxiranyl ),脂環式環氧基係指具有脂環式烴之環與環氧 乙烷環經縮合之構造之基。 前述之具有環氧基之單體中,具有脂肪族環氧基之化 合物可具體舉出環氧丙基(甲基)丙烯酸酯、/3 -甲基環 氧丙基(甲基)丙烯酸酯、/3-乙基環氧丙基(甲基)丙 烯酸酯、環氧丙基乙烯醚、記載於特開平7-248625號公 -15- 201022320 報中之以下述之式所示之化合物等。[In the formula (I,) and the formula (II), I' and R2 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. The hydrogen atom contained in the alkyl group may be substituted with a hydroxyl group. [9] The curable resin composition according to any one of the above [1], wherein the solvent (D) has a boiling point of 200 ° C or higher and contains an ester solvent, an ether solvent, and an alcohol. The curable resin composition according to any one of the above [1] to [9], further comprising a polymerization initiator (C). [Claim] The curable resin composition according to the above [10], wherein the polymerization initiator (C) is selected from the group consisting of a bisimidazole compound, an acetophenone compound, a triazine compound, and a mercaptophosphine oxide system. A polymerization initiator for at least one compound of the compound and the quinone compound. [12] The curable resin according to any one of the above [1] to [U], wherein the composition is used for forming a coating film or a pattern. [13] A coating film or a pattern formed by using the curable resin composition as described in any one of the above [ihtu]. [14] A display device comprising the coating film or pattern described in the above [13]. [15] A method for producing a coating film or a pattern, comprising applying the curable resin composition according to any one of the above [1] to [11] on a substrate by a printing method, and drying the substrate. The step of heating to obtain a coating film or pattern. -8-201022320 [I6] The method for producing a coating film or a pattern, comprising the curable resin composition according to any one of the above [1] to [1 1], using a printing method on a substrate The steps of coating, drying, exposing, and further heating as needed to obtain a coating film or pattern. EFFECT OF THE INVENTION The curable resin composition of the present invention can form a coating film or pattern having a high transmittance by a printing method. [Embodiment] Hereinafter, the present invention will be described in detail. The curable resin composition of the present invention contains the binder resin (A), the polymerizable compound (B), and the solvent (D), and the total amount of the binder resin (A) relative to the polymerizable compound (B) and the solvent (D). The amount of the solvent (D) is 20% by mass or more and less than 60% by mass. φ As the binder resin (A) used in the curable resin composition of the present invention, a binder resin (A1) or a binder resin (A2) can be exemplified. The binder resin (A 1 ) has an acidic group, and the binder resin (A2 ) has an acid group and exhibits reactivity by at least one of light and heat. When the binder resin has an acidic group, the Tg of the binder resin and the mechanical properties tend to be high. In addition, when a monomer (Ac) having a cyclic ether structural group having 2 to 4 carbon atoms is contained as a copolymer component, it is preferable that the curing property is high, and chemical resistance and heat resistance are high. 9-201022320 The binder resin (A1) is exemplified by at least one selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic anhydrides (Aa) (hereinafter referred to as "(Aa)"), and Aa) A copolymer which can be copolymerized with a monomer (Ab) (other than (Aa)) (hereinafter referred to as "A_b"). (Aa), for example, an aliphatic unsaturated carboxylic acid and/or an aliphatic unsaturated carboxylic acid anhydride, and the like, and specific examples thereof include unsaturated monocarboxylic acids such as acrylic acid, methacrylic acid, and crotonic acid; An unsaturated carboxylic acid such as acid, fumaric acid, citraconic acid, mesaconic acid or itaconic acid; and an anhydrous substance of the aforementioned unsaturated dicarboxylic acid; succinic acid mono [2-(methyl) propylene oxime Unsaturated mono[(methyl)acryloxyalkylene group of a polyvalent carboxylic acid having two or more valences such as oxyethyl] ester and decanoic acid mono [2-(methyl) propylene methoxyethyl] ester An ester; an unsaturated acrylate having a hydroxyl group and a carboxyl group in the same molecule, such as α-(hydroxymethyl)acrylic acid. Among them, acrylic acid, methacrylic acid or anhydrous maleic acid is preferred because it has good copolymerization reactivity, high Tg and mechanical properties of the copolymer, and no tackiness. These can be used singly or in combination. (Ab) may, for example, methyl (meth)acrylate, ethyl (meth)acrylate, n-butyl (meth)acrylate, sec-butyl (meth)acrylate, tert-(meth)acrylate Alkyl (meth)acrylates such as butyl ester; cyclohexyl (meth)acrylate, 2-methyl-10-(meth)acrylate-10-201022320 cyclohexyl ester, trimethyl (meth)acrylate [ 5.2.1.02 '6] decane _8· benzyl ester (the customary name in the art is called Dicyc 1 ο pentany 1 M ethacry 1 ate ). Methyl)propane succinic acid dicyclopentyloxyethyl ester '(meth)acrylic acid cyclic alkyl esters such as isophoryl (meth)acrylate; cyclohexyl acrylate, 2-methyl acrylate Cyclohexyl ester, tricyclo[5.2.1. 〇2,6]decane-8-yl ester (common name in the art is called φ dicyclopentyl acrylate), dicyclopentyl acrylate a cyclic alkyl acrylate such as ethyl ester or isophoryl acrylate; phenyl (meth) acrylate or benzyl (meth) acrylate (A) Acrylic acid aromatic esters; acrylic acid aromatic esters such as phenyl benzoate, benzyl acrylate, etc.; dicarboxylic acid diesters such as diethyl maleate, diethyl fumarate, diethyl itaconate ; hydroxyalkyl esters of 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate; bicyclo[2.2.1]hept-2-ene, 5-methylbicyclo[ 2, 2.1] hept-2-ene, 5-ethylbicyclo[2.2.1]hept-2-ene, 5-hydroxybicyclo[2·21]hept-2-ene, 5. Residue bicyclo[2.2.: 1] Geng_2_dilute, 5-cysylmethylbicyclo[2.21]hept-2-y,5-(2'-hydroxymethyl)bicyclophene-2.]]g-2·ene, 5_A Oxybicyclo[2.2]]heptan-2-y,5-ethoxybicyclo[2.2 im_2,5,6•dihydroxybicyclo, 5,6·disylbicyclo[2 2.·ι稀, $ &amp ; base) benzyl) bicyclo [221] hept-2-ene, 5 乂-bis (2, _ acetylidene urn 2 ene, 5 > dimethoxybicyclo ub 2 ········ - 201022320, 5,6-diethoxybicyclo[2·2·1]heptan-2-ene, 5-hydroxy-5-methylbicyclo[2.2.1]hept-2-ene, 5-hydroxy-5 _ethylbicyclo[2.2.1]hept-2-ene, 5-carboxy-5-methylbicyclo[2.2.1]hept-2-ene 5. Carboxy-5-ethylbicyclo[2,2.1]hept-2-ene, 5-hydroxymethyl-5-methylbicyclo[2.2.1]hept-2-ene, 5-carboxy-6-methyl Bicyclo[2.2.1]hept-2-ene, 5-carboxy-6-ethylbicyclo[2.2.1]hept-2-ene, 5,6-dicarboxybicyclo[2.2. Humic anhydride), 5-tert-butoxycarbonylbicyclo[2.2.1]hept-2-ene, 5-cyclohexyloxycarbonylbicyclo[2.2.1]hept-2-ene, 5-phenoxycarbonylbicyclo [2.2.1] Hept-2-ene, 5,6-di(tert-butoxycarbonyl)bicyclo[2.2.1]hept-2-ene, 5,6-di(cyclohexyloxycarbonyl)bicyclo[ 2.2.1] Bicyclic unsaturated compounds such as hept-2-ene; N-phenyl maleimine, N-cyclohexylmaleimide, N-benzyl maleimide, N-butyl Diterpenoidimine-3-maleimide benzoate, N-butylenediamine imide maleimide butyrate, N-butanediamine- 6-Malaysia a dicarbonyl quinone imine derivative such as an amine hexanoate, N-butanediimido-3-maleimide propionate or N-(9-acridinyl)maleimide; Styrene, methyl styrene, m-methyl styrene, p-methyl styrene, vinyl toluene ' p-methoxy styrene, C Alkenonitrile, methacrylonitrile, vinyl chloride, vinylidene chloride, acrylamide, methacrylamide, vinyl acetate, 1,3-butadiene, isoprene, 2,3-dimethyl -1,3-butadiene and the like. Among these, 'with styrene, N-phenylmaleimide, N-cyclohexylmaleimide' N-benzylmaleimide, bicyclo[2.2.1]hept-2-ene Etc.-12-201022320 It is preferred from the viewpoints of copolymerization reactivity and alkali solubility. (A-a) and (A-b) may be used singly or in combination. In the present specification, (meth) acrylate means acrylate and/or methacrylate. In the copolymer obtained by copolymerizing (Aa) and (Ab), the ratio of the constituent components derived from the respective copolymers is such that the total number of moles of the constituent components constituting the copolymer is 100 mol%. The molar fraction is preferably in the range of φ below. The constituent unit derived from (A-a): 2 to 40 mol% The constituent unit derived from (A-b): 60 to 98 mol% Further, the ratio of the above-mentioned constituent components is more preferably in the following range. Constituent unit derived from (Aa): 5 to 35 mol% Constituent unit derived from (Ab): 65 to 95 mol % The above-mentioned composition ratio is in the above range, and has stability and solvent resistance. The tendency to become good. φ Binder resin (A1) can be referred to, for example, the method described in the literature "Experimental method for polymer synthesis" (Otsuka Ryokan, Ltd., 1st edition, 1st edition, 1st, 1st, 1972). The cited documents described in this document are manufactured. Specifically, a predetermined amount, a polymerization initiator, and a solvent of the units (Aa) and (Ab) constituting the copolymer are placed in a reaction vessel, and oxygen is replaced by nitrogen, and stirring is carried out in the absence of oxygen. Heated 'insulated to give a polymer. Further, the obtained copolymer may be directly used as a solution after the reaction, or a solution obtained by concentration or dilution thereof, or may be used as a solid (powder) by a method of re-sinking, etc. -13-201022320. The weight average molecular weight of the binder resin (A1) in terms of polyethylene is preferably 3,000 to 1,000,000, more preferably 5,000 to 50,000. When the weight average molecular weight of the resin (A1) having an acidic group is in the above range, the coating property tends to be good, and the Tg and mechanical properties of the binder resin tend to be high, and the adhesiveness tends to be insufficient. Therefore, it is better. The molecular weight distribution [weight average molecular weight (Mw) / number average molecular weight (?η)] of the binder resin (A1) is preferably from 1.1 to 6.0, more preferably from 1.2 to 4.0. When the molecular weight distribution is in the above range, the coating property tends to be excellent, which is preferable. The content of the binder resin (A 1 ) to be used in the curable resin composition of the present invention is preferably from 5 to 90% by mass, more preferably from 5 to 90% by mass, based on the solid content of the curable resin composition. 10 to 70% by mass. When the content of the binder resin (A1) is within the above range, the printability tends to be good, which is preferable. The binder resin (A2) which has an acidic group and exhibits reactivity by the action of either light or heat can be exemplified by (A2-1) to (A2-3). The binder resin (A2-1) is a copolymer of (Aa) and (Ab) and a monomer (Ac) having a cyclic ether structure having a carbon number of 2 to 4 (hereinafter referred to as "Ac"). Things. The binder resin (A2-2) is a copolymer of (Aa) and (Ab) by using a part of a carboxyl group derived from (Aa) and a cyclic ether derived from (Ac) a carbon number of 2 to 4. The copolymer obtained by the reaction was constructed. The binder resin (A2-3) is a copolymer of (A-a) and (A-c). -14 - 201022320 (Ac) is, for example, a polymerization having at least one structure selected from the group consisting of a cyclic ether structure having a carbon number of 2 to 4 (for example, an ethylene oxide structure, an oxycyclobutane structure, and a tetrahydrofuran structure). The monomer (Ac) having a cyclic ether structure having 2 to 4 carbon atoms has at least one structure selected from the group consisting of a cyclic ether having 2 to 4 carbon atoms and has carbon-carbon Preferably, the compound having a saturated bond is preferably a compound having at least one structure selected from the group consisting of a cyclic ether structure having 2 to 4 carbon atoms and having an acrylonitrile group or a methacryl group. For example, a monomer having an epoxy group, a monomer having an oxycyclobutane group, a monomer having a tetrahydroindenyl group, and the like may be mentioned. The aforementioned single system having an epoxy group means, for example, having an aliphatic group selected from the group consisting of a polymerizable compound having at least one group of an epoxy group and an alicyclic epoxy group. The single system having an epoxy group has a group selected from the group consisting of an aliphatic epoxy group and an alicyclic epoxy group. a group of at least one group having a carbon-carbon unsaturated bond, preferably having a group selected from an aliphatic ring A compound having at least one structure selected from the group consisting of an oxy group and an epoxy group, and having a propylene fluorenyl group or a methacryl fluorenyl group is preferred. Here, the aliphatic epoxy group means a ring of a single ring. An oxiranyl group, an alicyclic epoxy group, a group having a structure in which a ring of an alicyclic hydrocarbon is condensed with an oxirane ring. The above-mentioned monomer having an epoxy group has an aliphatic group. The epoxy group compound may specifically be exemplified by epoxypropyl (meth) acrylate, /3-methylepoxypropyl (meth) acrylate, / 3-ethylepoxypropyl (meth) acrylate. The compound represented by the following formula, etc., which is described in the following paragraph, is disclosed in JP-A-H07-201022320.

(式中、rh-r 13各自獨立爲氫原子或碳原子數1〜10之院 基,m爲1〜5之整數)。 前述之式所示之化合物例如可舉出〇-乙烯苄基環氧 丙基醚、m-乙烯苄基環氧丙基醚、P-乙烯苄基環氧丙基酸 、α-甲基-〇-乙烯苄基環氧丙基醚、α-甲基-m-乙稀节基 環氧丙基醚、α-甲基-P-乙烯苄基環氧丙基醚、2,3·二環 氧丙基氧基甲基苯乙烯、2,4-二環氧丙基氧基甲基苯乙嫌 、2,5-二環氧丙基氧基甲基苯乙烯、2,6-二環氧丙基氧基 甲基苯乙烯、2,3,4-三環氧丙基氧基甲基苯乙烯、2,3,5·三 環氧丙基氧基甲基苯乙烯、2,3,6-三環氧丙基氧基甲基苯 乙烯、3,4,5-三環氧丙基氧基甲基苯乙烯、2,4,6-三環氧丙 基氧基甲基苯乙烯等。 前述之具有環氧基之單體之中,具有脂環式環氧基之 單體例如可舉出具有脂肪族單環式環氧基之單體 '具有'脂 肪族多環式環氧基之單體等。 前述之具有脂肪族單環式環氧基之單體係指具有單環 之脂環式烴之環與環氧乙烷環經縮合之構造的聚合性化合 物。該具有脂肪族單環式環氧基之單體以具有單環之脂環 式烴之環與環氧乙烷環經縮合之構造,且具有碳-碳不飽 和鍵結的化合物爲佳,以具有單環之脂環式烴之環與環氧 -16- 201022320 乙烷環經縮合之構造’且具有丙烯醯基或甲基丙烯醯基的 化合物爲更佳。 該單環之脂環式烴之環例如可舉出環丁烷環、環戊烷 環、環己烷環、環庚烷環等,其中以碳數爲4〜6之環爲佳 〇 該具有脂肪族單環式環氧基之單體,具體可舉出乙烯 環己烯單氧化物1,2-環氧基-4-乙烯環己烷(例如, φ Celloxide 2000 ; Daicel 化學工業(股)製)、3,4-環氧基 環己基甲基丙烯酸酯(例如,Cyclomer A400 ; Daicel化 學工業(股)製)、3,4-環氧基環己基甲基甲基丙烯酸酯 (例如,Cyclomer M100; Daicel化學工業(股)製)等 〇 前述之具有脂肪族多環式環氧基之單體係指具有多環 之脂環式烴之環與環氧乙烷環經縮合之構造的聚合性化合 物。該具有多環之脂環式烴之環與環氧乙烷環經縮合之構 φ 造的單體以具有多環之脂環式烴之環與環氧乙烷環經縮合 之構造,且具有碳-碳不飽和鍵結的化合物爲佳,以具有 多環之脂環式烴之環與環氧乙烷環經縮合之構造,且具有 丙烯醯基或甲基丙烯醯基的化合物爲更佳。 該多環之脂環式烴之環例如可舉出二環戊烷環、三環 癸烷環、降莰烷環、異降莰烷環、雙環辛烷環、雙環壬烷 環、雙環十一烷環、三環十一烷環、雙環十二烷環、三環 十二烷環等,其中以碳數爲8至12之化合物爲佳。 前述之具有脂肪族多環式環氧基之單體,例如可舉出 -17- 201022320 選自由式(η所表示之化合物及式 物所成群之至少1種之化合物等。 h2c=c-c-o-x1 (】>(wherein, rh-r 13 is each independently a hydrogen atom or a group having 1 to 10 carbon atoms, and m is an integer of 1 to 5). Examples of the compound represented by the above formula include fluorene-vinylbenzylepoxypropyl ether, m-vinylbenzylepoxypropyl ether, P-vinylbenzylepoxypropyl acid, and α-methyl-hydrazine. -vinylbenzyl epoxypropyl ether, α-methyl-m-ethyl epoxide epoxypropyl ether, α-methyl-P-vinylbenzyl epoxypropyl ether, 2,3·diepoxy Propyloxymethylstyrene, 2,4-diepoxypropyloxymethylbenzene, 2,5-diepoxypropyloxymethylstyrene, 2,6-diepoxypropane Hydroxymethylstyrene, 2,3,4-triepoxypropyloxymethylstyrene, 2,3,5·triepoxypropyloxymethylstyrene, 2,3,6- Triepoxypropyloxymethylstyrene, 3,4,5-triepoxypropyloxymethylstyrene, 2,4,6-triepoxypropyloxymethylstyrene, and the like. Among the above-mentioned monomers having an epoxy group, the monomer having an alicyclic epoxy group may, for example, be a monomer having an aliphatic monocyclic epoxy group and having an aliphatic polycyclic epoxy group. Monomers, etc. The above-mentioned single system having an aliphatic monocyclic epoxy group means a polymerizable compound having a structure in which a ring of a monocyclic alicyclic hydrocarbon is condensed with an oxirane ring. The monomer having an aliphatic monocyclic epoxy group is preferably a compound having a monocyclic alicyclic hydrocarbon ring condensed with an oxirane ring, and a compound having a carbon-carbon unsaturated bond is preferred. A compound having a monocyclic alicyclic hydrocarbon ring and an epoxy-16-201022320 ethane ring condensed structure and having a propylene fluorenyl group or a methacryl fluorenyl group is more preferable. The ring of the monocyclic alicyclic hydrocarbon may, for example, be a cyclobutane ring, a cyclopentane ring, a cyclohexane ring or a cycloheptane ring, and the like, wherein a ring having a carbon number of 4 to 6 is preferred. The monomer of the aliphatic monocyclic epoxy group is specifically ethylenecyclohexene monooxide 1,2-epoxy-4-vinylcyclohexane (for example, φ Celloxide 2000; Daicel Chemical Industry Co., Ltd.) , 3,4-epoxycyclohexyl methacrylate (for example, Cyclomer A400; manufactured by Daicel Chemical Industry Co., Ltd.), 3,4-epoxycyclohexylmethyl methacrylate (for example, Cyclomer) M100; Daicel Chemical Industry Co., Ltd.) is equivalent to the above-mentioned single system having an aliphatic polycyclic epoxy group, which means a polymerization of a structure in which a ring of an alicyclic hydrocarbon having a polycyclic ring is condensed with an oxirane ring. Sex compounds. The monomer having a polycyclic alicyclic hydrocarbon ring condensed with an oxirane ring has a structure in which a ring having a polycyclic alicyclic hydrocarbon is condensed with an oxirane ring, and has A carbon-carbon unsaturated bonded compound is preferred, and a compound having a polycyclic alicyclic hydrocarbon ring condensed with an oxirane ring, and a compound having an acryl fluorenyl group or a methacryl fluorenyl group is more preferable. . Examples of the ring of the polycyclic alicyclic hydrocarbon include a dicyclopentane ring, a tricyclodecane ring, a norbornane ring, an isodecane ring, a bicyclooctane ring, a bicyclodecane ring, and a bicyclo 11 An alkane ring, a tricycloundecane ring, a bicyclododecan ring, a tricyclododecane ring or the like, wherein a compound having 8 to 12 carbon atoms is preferred. The monomer having an aliphatic polycyclic epoxy group as described above may, for example, be a -17-201022320 free formula (a compound represented by η and a compound of at least one group of the formulae, etc.) h2c=cco- X1 (]>

式(I)及式(II)中’ 1^及R2各自獨立表示可被氫 原子或羥基取代之碳數1〜4之烷基。 Χι及x2各自獨立表示單鍵或可含雜原子之碳數1~6 之伸烷基。 1及R2具體的可舉出氫原子;甲基、乙基、N-丙基 、異丙基、η-丁基、sec-丁基、tert-丁基等之烷基; 羥基甲基、1-羥基乙基、2-羥基乙基、丨_羥基_n-丙基 、2-羥基-η_丙基、3-羥基-η-丙基、卜羥基-異丙基、2_羥 基-異丙基、1-羥基- η-丁基、2-羥基·η-丁基、3-羥基-η-丁 基、4-羥基-η-丁基等之含有羥基之烷基。其中’較佳可 舉出氫原子、甲基、羥基甲基、1-羥基乙基、2·羥基乙基 ,更佳可舉出氫原子、甲基。 又!及Χ2具體可舉出單鍵;亞甲基、伸乙基、伸丙基 等之伸烷基; 氧基亞甲基、氧基伸乙基、氧基伸丙基、硫代亞甲基 、硫代伸乙基、硫代伸丙基、胺基亞甲基、胺基伸乙基、 胺基伸丙基等之含有雜原子之伸烷基等。其中,較佳可舉 出單鍵、亞甲基、伸乙基、氧基亞甲基、氧基伸乙基,更 佳可舉出單鍵、氧基伸乙基。 作爲選自式(I)所表示之化合物及式(II)所表示 -18- 201022320 之化合物所成群之至少1種之化合物,以選自由下述之式 (I’)所表示之化合物及式(II’)所表示之化合物所成群 之至少1種之化合物爲佳。In the formulae (I) and (II), '1' and R2 each independently represent an alkyl group having 1 to 4 carbon atoms which may be substituted by a hydrogen atom or a hydroxyl group. Χι and x2 each independently represent a single bond or an alkylene group having a carbon number of 1 to 6 which may contain a hetero atom. Specific examples of 1 and R2 include a hydrogen atom; an alkyl group such as a methyl group, an ethyl group, an N-propyl group, an isopropyl group, an η-butyl group, a sec-butyl group, a tert-butyl group or the like; a hydroxymethyl group; -hydroxyethyl, 2-hydroxyethyl, hydrazine-hydroxy-n-propyl, 2-hydroxy-η-propyl, 3-hydroxy-η-propyl, hydroxy-isopropyl, 2-hydroxy-iso A hydroxy group-containing alkyl group such as a propyl group, a 1-hydroxy-η-butyl group, a 2-hydroxy-n-butyl group, a 3-hydroxy-η-butyl group, a 4-hydroxy-η-butyl group or the like. Among them, a hydrogen atom, a methyl group, a hydroxymethyl group, a 1-hydroxyethyl group or a 2-hydroxyethyl group is preferable, and a hydrogen atom or a methyl group is more preferable. also! And Χ2 specifically can be exemplified by a single bond; methylene, ethyl, propyl and the like alkyl; oxymethylene, oxyethyl, oxypropyl, thiomethylene, thio The alkyl group, the thiopropyl group, the aminomethylene group, the amine group ethyl group, the amine group propyl group and the like, and the hetero atom-containing alkyl group. Among them, a single bond, a methylene group, an ethylidene group, an oxymethylene group or an oxyethyl group is preferable, and a single bond or an oxyethyl group is more preferable. a compound selected from the group consisting of a compound represented by the formula (I) and a compound represented by the formula (II) and a compound represented by the formula (II): -18 to 201022320, which is selected from the group consisting of the compound represented by the following formula (I') It is preferred that at least one compound is a group of the compounds represented by the formula (II').

HjCJX〇HjCJX〇

式(Γ)及式(ΙΓ)中,Ri’及R2’各自與前述Ri及 R2同義。 式(I)所表示之化合物’具體可舉出例如式(1-1) ~式(1-15)所表示之化合物等’較佳可舉出式(1-1)、 式(1-3)、式(1-5)、式(1-7)、式(1-9)、式(1-11 )~式(1-15),更佳可舉出式(〖-1)、式(1-7)、式( 1-9 )、式(I- 1 5 )。In the formula (Γ) and the formula (ΙΓ), Ri' and R2' are each synonymous with the above Ri and R2. Specific examples of the compound represented by the formula (I) include a compound represented by the formula (1-1) to the formula (1-15), etc., and a formula (1-1) and a formula (1-3) are preferred. ), formula (1-5), formula (1-7), formula (1-9), formula (1-11) to formula (1-15), more preferably formula (〖-1), (1-7), formula (1-9), and formula (I-15).

HaCHaC

HjC=CH—ΰ—ΟHjC=CH—ΰ—Ο

CH2OH -i_ΰ-οCH2OH -i_ΰ-ο

1-1 2> 2H4OH O1-1 2> 2H4OH O

式(π)所表示化合物,具體可舉出例如式(u·1) 式(II-!5)所表示之化合物等,較佳可舉出式(n-1) -19- 201022320 ,H-9)、式( 式(H-3)、式(II-5)、式(Η.7)、式 式(Specific examples of the compound represented by the formula (π) include a compound represented by the formula (u·1), and a compound represented by the formula (II-!5). Preferably, the formula (n-1) -19-201022320, H- 9), formula (Formula (H-3), Formula (II-5), Formula (Η.7), Formula (

II-11)〜式(Π_15) ’更佳可舉出式(U )、式(II-9)、式(n_15)。II-11)~((_15) ' is more preferably a formula (U), a formula (II-9), or a formula (n-15).

選自由式(I)所表示之化合物及式(11)所表不之 化合物所成群之至少1種化合物,可各自單獨使用,亦可 以任意之比率進行混合。進行混合之情況,其混合比率以 © 莫耳比式(I):式(I1)爲5 : 95〜95 : 5爲佳’較佳爲 10: 90-90: 10,更佳爲 20: 80〜80: 20。 前述之具有氧環丁烷基之單體係指例如具有選自由脂 肪族氧環丁烷基及脂環式氧環丁烷基所成群之至少1種之 基的聚合性化合物。該具有氧環丁烷基之單體係以具有選 自由脂肪族氧環丁烷基及脂環式氧環丁烷基所成群之至少 1種之基,且具有不飽和鍵結之化合物爲佳。 該具有氧環丁烷基之單體具體可舉出3-甲基-3-甲基 -20- 201022320 丙烯醯氧基甲基氧環丁烷、3-甲基-3-丙烯醯氧基甲基氧 環丁烷、3-乙基-3-甲基丙烯醯氧基甲基氧環丁烷、3-乙 基-3-丙烯醯氧基甲基氧環丁烷、3-甲基-3-甲基丙烯醯氧 基乙基氧環丁烷、3-甲基-3-丙烯醯氧基乙基氧環丁烷、3-乙基-3-甲基丙烯醯氧基乙基氧環丁烷或3-乙基-3-丙烯醯 氧基乙基氧環丁烷等。 此些可單獨或組合使用。 φ 前述之具有四氫糠基之單體係指例如具有選自由脂肪 族四氫糠基及脂環式四氫糠基所成群之至少種之基的聚合 性化合物。該具有四氫糠基之單體係以具有選自由脂肪族 四氫糠基及脂環式四氫糠基所成之至少〗種之基,且具有 不飽和鍵結之化合物爲佳。 該具有四氫糠基之單體具體可舉出四氫糠基丙烯酸酯 、四氫糠基甲基丙烯酸酯等。 此些可單獨或將其組合使用。 φ 黏合劑樹脂(A2-1)中,由各自所衍生之構成成分之 比率,相對於構成黏合劑樹脂(A2-1 )之構成成分之合計 莫耳數,以莫耳分率表示在以下之範圍爲佳。 由(A-a )所衍生之構成單位:2〜40莫耳% 由(A-b )所衍生之構成單位:1〜65莫耳% 由(A-c)所衍生之構成單位:2〜95莫耳% 又,前述之構成成分之比率以在以下之範圍爲更佳。 由(A-a)所衍生之構成單位’· 5~35莫耳% 由(A-b )所衍生之構成單位:1〜60莫耳% 201022320 由(A-c)所衍生之構成單位:5~80莫耳% 前述之構成比率若在上述之範圍,有保存安定性、耐 溶劑性、耐熱性及機械強度變得良好之傾向。 黏合劑樹脂(A2-1 )可參考例如文獻「高分子合成之 實驗法」(大津隆行著 發行所(股)化學同人 第1版 第1刷 1 972年3月1日發行)所記載之方法及該當文 獻中記載之引用文獻進行製造。 具體而言,可將衍生構成共聚物之單位(A-a) 、( @ A-b )及(A-c )的化合物既定量、聚合開始劑及溶劑放入 反應容器中,藉以氮將氧取代,在不存在氧下,藉由進行 攪拌、加熱、保溫,得到聚合物。且,所得之共聚物係可 直接使用反應後之溶液,亦可使用經濃縮或稀釋之溶液, 也可使用以再沈殿等之方法以固體(粉體)所取出者。 製造黏合劑樹脂(A2-2 )時,首先使(A-a)及(A-b )共聚合而製造共聚物。由各個所衍生之構成成分之比率 ,相對於構成前述之共聚物之構成成分的合計莫耳數’其 @ 莫耳分率以在以下之範圍爲佳。 由(A-a )所衍生之構成單位:5〜50莫耳% 由(A-b )所衍生之構成單位:50~95莫耳% 又,前述之構成成分之比率若在以下之範圍爲更佳。 由(A-a)所衍生之構成單位:1〇~45莫耳% 由(A-b )所衍生之構成單位:55〜90莫耳% 其次,爲了使其具有因光或熱之作用所成之反應性’ 使源自將(A-a )及(A-b )共聚合所得之共聚物的(A-a -22- 201022320 )之羧酸及羧酸酐之一部分與源自(A-c )之環氧基或氧 環丁烷基反應。 (A-c)之莫耳數係相對於(A-a)之莫耳數爲5〜80 莫耳%,較佳爲1 0~75莫耳%,更佳爲1 5〜70莫耳。/〇。 構成比率若在上述之範圍,有保存安定性、耐溶劑性 、耐熱性、機械強度及感度(所謂的光硬化性)之平衡變 得良好之傾向。 φ 黏合劑樹脂(A2-2 )可經由二階段之步驟而製造。例 如可參考文獻「高分子合成之實驗法」(大津隆行著 發 行所(股)化學同人 第1版第1刷 1 972年3月1日 發行)所記載之方法,或特開2 0 0 1 - 8 9 5 3 3號公報中記載 之方法而進行製造。 具體而言,首先說明關於第一階段之步驟。將衍生構 成(A-a)及(A-b )共聚合而得之共聚物(即,黏合劑樹 脂)之單位(A-a)及(A-b)的化合物既定量、聚合開始 0 劑及溶劑放入反應容器中,藉由以氮取代氧,在不存在氧 下,藉由攪拌、加熱、保溫,得到黏合劑樹脂。且,所得 之樹脂,可直接使用反應後之溶液,亦可使用經濃縮或稀 釋之溶液,也可使用以再沈殿等之方法以固體(粉體)所 取出者。前述之樹脂以聚乙烯換算之重量平均分子量,以 3,000〜1 00,000爲佳,5,000〜50,000爲更佳。樹脂之重量 平均分子量若在前述之範圍,有塗佈性變得良好之傾向, 故爲佳。 前述之樹脂之分子量分佈[重量平均分子量(Mw) / -23- 201022320 數平均分子量(Μη)],較佳爲1.1〜6.0,更佳爲1.2-4.0 。分子量分佈若在前述之範圍,因有塗佈性變優良之傾向 ,故爲佳。 其次,說明關於第二階段之步驟。接著,將燒瓶内雰 圍由氮取代爲空氣,將相對於構成成分(A-a)之莫耳數 爲5〜8 0莫耳%之構成成分(A-c)、作爲羧基與環氧基或 氧環丁烷基之反應觸媒,例如使參二甲基胺基甲基酚爲相 對於單體(A-a )〜(A-c )之合計量以質量基準爲 0.001〜5%、及作爲聚合禁止劑,例如使氫醌相對於單體( A-a) ~(A-c)之合計量以質量基準爲0.001〜5%放入燒瓶 内,藉由在6 0- 130 °C下持續1〜10小時反應,可使前述之 樹脂與構成成分(A-c )反應。但,與聚合條件同樣地, 考慮到製造設備或聚合所生成之發熱量等,可適宜調整放 入方法或反應溫度。 黏合劑樹脂(A2-3 )中,由各自所衍生之構成成分之 比率,相對於構成黏合劑樹脂(A2-3 )之構成成分之合計 莫耳數,以莫耳分率在以下之範圍爲佳。 由(A-a)所衍生之構成單位:5〜95莫耳% 由(A-c)所衍生之構成單位:5〜95莫耳% 又,前述之構成成分之比率若在以下之範圍爲更佳。 由(A-a)所衍生之構成單位:10〜90莫耳% 由(A-c)所衍生之構成單位:10〜90莫耳% 前述之構成比率若在上述之範圍,有保存安定性、耐 溶劑性、耐熱性及機械強度變得良好之傾向。 -24- 201022320 黏合劑樹脂(A2-3 )例如可參考文獻「高分子合成之 實驗法」(大津隆行著發行所(股)化學同人第1版 第1刷 1 972年3月1日發行)所記載之方法及該文獻 中記載之引用文獻而製造。 具體而言,將衍生構成共聚物之單位(A-a)及(A-c )的化合物既定量、聚合開始劑及溶劑放入反應容器中, 藉由以氮取代氧,在不存在氧下,藉由攪拌、加熱、保溫 0 ,得到聚合物。且,所得之共聚物係可直接使用反應後之 溶液,亦可使用經濃縮或稀釋之溶液,也可使用以再沈殿 等之方法以固體(粉體)所取出者 本發明之硬化性樹脂組成物所含之聚合性化合物(B )’可舉出單官能單體、2官能單體或其他3官能以上之 多官能單體。 單官能單體之具體例可舉出壬基苯基卡必醇(甲基) 丙烯酸酯、2-羥基-3-苯氧基丙基(甲基)丙烯酸酯、2-乙 φ 卡必醇(甲基)丙烯酸酯、2-羥乙基(甲基)丙烯 酸醋、月桂基(甲基)丙烯酸酯、十八基(甲基)丙烯酸 醋、2- (2-乙氧基乙氧基)乙基(甲基)丙烯酸酯、四氫 糠基(甲基)丙烯酸酯、己內酯(甲基)丙烯酸酯、乙氧 基化壬基酹(甲基)丙烯酸酯、丙氧基化壬基酚(甲基) 丙烯酸酯或N -乙烯吡咯啶酮等。 又’ 2官能單體之具體例可舉出丨,3_ 丁二醇二(甲基 )丙稀酸醋' 1,3-丁二醇(甲基)丙烯酸酯、1>6_己二醇 二(甲基)丙烯酸酯、乙二醇二(甲基)丙烯酸酯、二乙 -25- 201022320 二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯 、三乙二醇二(甲基)丙烯酸酯、四乙二醇二(甲基)丙 烯酸酯、聚乙二醇二丙烯酸酯、雙酚A之雙(丙烯醯氧基 乙基)醚、乙氧基化雙酚A之(甲基)丙烯酸酯、丙氧基 化新戊二醇二(甲基)丙烯酸酯、乙氧基化新戊二醇二( 甲基)丙烯酸酯或3-甲基戊二醇二(甲基)丙烯酸酯等 〇 其他之3官能以上之多官能單體之具體例可舉出三羥 甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯 酸酯、參(2-羥基乙基)異氰脲酸酯三(甲基)丙烯酸酯 、乙氧基化三羥甲基丙烷三(甲基)丙烯酸酯、丙氧基化 三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇四(甲基) 丙烯酸酯、二季戊四醇五(甲基)丙烯酸酯、二季戊四醇 六(甲基)丙烯酸酯、三季戊四醇四(甲基)丙烯酸酯、 三季戊四醇五(甲基)丙烯酸酯、三季戊四醇六(甲基) 丙烯酸酯、三季戊四醇七(甲基)丙烯酸酯、三季戊四醇 八(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯與酸 酐之反應物、二季戊四醇五(甲基)丙烯酸酯與酸酐之反 應物、三季戊四醇七(甲基)丙烯酸酯與酸酐己內酯變性 三羥甲基丙烷三(甲基)丙烯酸酯、己內酯變性季戊四醇 三(甲基)丙烯酸酯、己內酯變性參(2-羥基乙基)異氰 脲酸酯三(甲基)丙烯酸酯、己內酯變性季戊四醇四(甲 基)丙烯酸酯、己內酯變性二季戊四醇五(甲基)丙烯酸 酯、己內酯變性二季戊四醇六(甲基)丙烯酸酯、己內酯 -26- 201022320 變性三季戊四醇四(甲基)丙烯酸酯、己內酯變性三季戊 四醇五(甲基)丙烯酸酯、己內酯變性三季戊四醇六(甲 基)丙烯酸酯、己內酯變性三季戊四醇七(甲基)丙烯酸 酯、己內酯變性三季戊四醇八(甲基)丙烯酸酯、己內酯 變性季戊四醇三(甲基)丙烯酸酯與酸酐之反應物、己內 酯變性二季戊四醇五(甲基)丙烯酸酯與酸酐之反應物, 或己內酯變性三季戊四醇五(甲基)丙烯酸酯與酸酐等。 Φ 尙,本說明書中,己內酯變性係指在源自(甲基)丙 烯酸酯化合物之醇的部位與(甲基)丙烯醯氧基之間,導 入己內酯之開環體或開環聚合物一事。 特別係使用2官能以上之多官能單體爲佳。此些之聚 合性化合物(B )可單獨或將二種以上倂用使用。 聚合性化合物(B)之含有量,相對於黏合劑樹脂( A)及聚合性化合物(B)之合計量,以質量分率較佳爲 1〜70質量%,更佳爲5〜60質量%。聚合性化合物(B )之 φ 含有量若在前述之範圍,有感度、塗膜及圖型之強度、平 滑性、信頼性及機械強度變得良好之傾向,故爲佳。 本發明之硬化性樹脂組成物所含之聚合開始劑(C ) 係爲藉光或熱之作用而開始聚合之化合物,以雙咪唑系化 合物、苯乙酮系化合物、三嗪系化合物、醯基膦氧化物系 化合物或肟系化合物爲佳,因雙咪唑系化合物感度優良爲 特佳。 前述之雙咪唑化合物可舉出2,2’-雙(2-氯苯基)-4,4’,5,5’- 四 苯基雙 咪唑、 2,2’- 雙 (2,3- 二 氯苯基 ) _ -27- 201022320 4,4’,5,5’-四苯基雙咪唑(例如參考特開平6-75372號公報 、特開平6-75373號公報等)、2,2’-雙(2-氯苯基)_ 4,4’,5,5’-四苯基雙咪唑、2,2’-雙(2-氯苯基)-4,4’,5,5,-四(烷氧基苯基)雙咪唑、2,2’-雙(2-氯苯基)_ 4,4’,5,5’-四(二烷氧基苯基)雙咪唑、2,2’-雙(2-氯苯 基)_4,4’,5,5’-四(三烷氧基苯基)雙咪唑(例如參考特 公昭48-3 8403號公報、特開昭62-1 74204號公報等)、 4,4’5,5’-位之苯基被烷氧羰基取代之咪唑化合物(例如參 考特開平7-10913號公報等)等,較佳可舉出2,2,-雙(2_ 氯苯基)-4,4,,5,5,-四苯基雙咪唑、2,2,-雙(2、3-二氯苯 基)-4,4’,5,5’-四苯基雙咪唑、2,2,-雙(2、4-二氯苯基 )_4,4’,5,5’-四苯基雙咪唑。 前述之苯乙酮系化合物可舉出二乙氧基苯乙酮、2 _經 基-2-甲基-1-苯基丙烷-^酮、苄基二甲基縮酮、2_羥基-卜 [4-(2-羥基乙氧基)苯基]_2_甲基丙烷-1-酮、2_羥基_1_ {4-[4-(2-羥基-2-甲基-丙醯基)-苄基]-苯基} -2-甲基_ 丙烷-1-酮、1-羥基環己基苯基酮、2-甲基-2-嗎啉基“_( 4_甲基磺醯基)丙烷-1-酮、2-苄基-2-二甲基胺基-1-( 4_ 嗎啉基苯基)丁院-1-酮、2- (2 -甲基节基)-2 -二甲基胺 基-1-(4-嗎啉基苯基)-丁酮、2- (3-甲基苄基)-2-二甲 基胺基-1-(4-嗎啉基苯基)-丁酮、2-(4-甲基苄基)_2_ 二甲基胺基-1-( 4-嗎啉基苯基)-丁酮、2- (2-乙基苄基 )-2-二甲基胺基4-(4-嗎啉基苯基)· 丁酮、2- (2-丙基 苄基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-(2- 201022320 丁基苄基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-(2,3-二甲基苄基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2- ( 2、4-二甲基苄基)-2-二甲基胺基-1- ( 4-嗎啉 基苯基)-丁酮、2-(2-氯苄基)-2-二甲基胺基-1-(4-嗎 啉基苯基)-丁酮、2- (2-溴苄基)-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2-(3-氯苄基)-2-二甲基胺基-1-( 4-嗎啉基苯基)-丁酮、2- (4-氯苄基)-2-二甲基胺基-1-_ ( 4-嗎啉基苯基)-丁酮、2- ( 3-溴苄基)-2-二甲基胺基- 1- (4-嗎啉基苯基)-丁酮、2- (4-溴苄基)-2-二甲基胺 基-1-(4-嗎啉基苯基)-丁酮、2- (2-甲氧基苄基)-2-二 甲基胺基-1-(4-嗎啉基苯基)-丁酮、2- (3-甲氧基苄基 )-2-二甲基胺基-1-(4-嗎啉基苯基)-丁酮、2- (4-甲氧 基苄基)-2 -二甲基胺基-1-(4 -嗎啉基苯基)-丁酮、2-( 2- 甲基-4-甲氧基苄基)-2-二甲基胺基-1-(4-嗎啉基苯基 )-丁酮、2- ( 2-甲基-4-溴苄基)-2-二甲基胺基-1- ( 4-嗎 φ 啉基苯基)-丁酮、2-(2-溴-4-甲氧基苄基)-2-二甲基胺 基-1- ( 4-嗎啉基苯基)-丁酮、2-羥基-2-甲基- l-[4- ( 1-甲基乙烯基)苯基]丙烷-1-酮之寡聚物等。 前述之三嗪系化合物可舉出2,4-雙(三氯甲基)-6-(4-甲氧基苯基)-1,3 ,5-三嗪、2,4-雙(三氯甲基)-6-( 4-甲氧基萘基)-1,3,5-三嗪、2,4-雙(三氯甲基)-6-胡椒 基-1,3,5-三嗪、2,4-雙(三氯甲基)-6-( 4_甲氧基苯乙烯 基)-1,3,5-三嗪、2,4-雙(三氯甲基)-6-[2-(5-甲基呋 喃-2-基)乙炔基]-1,3,5-三嗪、2,4-雙(三氯甲基)-6-[2- -29- 201022320 (呋喃-2-基)乙块基]-1,3,5-三嗪、2,4-雙(三氯甲基)-6-[2-(4 -二乙基胺基-2-甲基苯基)乙炔基]-1,3,5 -三嗪、 2,4-雙(三氯甲基)-6-[2-(3,4-二甲氧基苯基)乙炔基]-1,3,5-三嗪等。 前述之醯基膦氧化物系開始劑可舉出2,4,6-三甲基苄 醯基二苯基膦氧化物等。 前述之肟化合物可舉出0·乙氧基羰基-α-氧基胺基-1-苯基丙烷-1-酮、式(IV )所表示之化合物、式(V )所 表示之化合物等。At least one compound selected from the group consisting of the compound represented by the formula (I) and the compound represented by the formula (11) may be used singly or in any ratio. In the case of mixing, the mixing ratio is in the molar ratio (I): Formula (I1) is 5: 95 to 95: 5 is preferable, preferably 10: 90-90: 10, more preferably 20: 80. ~80: 20. The above-mentioned single system having an oxycyclobutane group means, for example, a polymerizable compound having at least one selected from the group consisting of an aliphatic oxycyclobutane group and an alicyclic oxycyclobutane group. The single system having an oxycyclobutane group has at least one selected from the group consisting of an aliphatic oxycyclobutane group and an alicyclic oxocyclobutane group, and the compound having an unsaturated bond is good. Specific examples of the monomer having an oxycyclobutane group include 3-methyl-3-methyl-20-201022320 propylene methoxymethyloxycyclobutane and 3-methyl-3-propenyloxymethyl group. Oxycyclobutane, 3-ethyl-3-methylpropenyloxymethyloxycyclobutane, 3-ethyl-3-propenyloxymethyloxycyclobutane, 3-methyl-3 -Methethyloxyethyloxycyclobutane, 3-methyl-3-propenyloxyethyloxycyclobutane, 3-ethyl-3-methylpropenyloxyethyloxetane Alkane or 3-ethyl-3-propenyloxyethyloxycyclobutane and the like. These can be used singly or in combination. φ The above-mentioned single system having a tetrahydroindenyl group means, for example, a polymerizable compound having at least a group selected from the group consisting of an aliphatic tetrahydroindenyl group and an alicyclic tetrahydroindenyl group. The single system having a tetrahydroindenyl group is preferably a compound having at least one selected from the group consisting of an aliphatic tetrahydroindenyl group and an alicyclic tetrahydroindenyl group, and having an unsaturated bond. Specific examples of the monomer having a tetrahydroindenyl group include tetrahydrofurfuryl acrylate and tetrahydrofurfuryl methacrylate. These may be used singly or in combination. In the φ binder resin (A2-1), the ratio of the constituent components derived from each of the components is expressed by the molar ratio in the following by the total number of moles of the constituent components constituting the binder resin (A2-1). The range is good. Constituent unit derived from (Aa): 2 to 40 mol% Constituent unit derived from (Ab): 1 to 65 mol% Constituent unit derived from (Ac): 2 to 95 mol % The ratio of the aforementioned constituent components is more preferably in the range below. The constituent unit derived from (Aa) '· 5~35 mol% constituting unit derived from (Ab ): 1 to 60 mol% 201022320 The constituent unit derived from (Ac): 5 to 80 mol% When the composition ratio is within the above range, the stability, the solvent resistance, the heat resistance, and the mechanical strength tend to be good. For the binder resin (A2-1), for example, the method described in the literature "Experimental method for polymer synthesis" (Otsuya Ryokan, Ltd., 1st edition, 1st edition, 1st, 1st, 1972) And the cited documents described in the literature are manufactured. Specifically, a compound derived from units (Aa), (@Ab), and (Ac) constituting the copolymer can be metered, a polymerization initiator, and a solvent are placed in a reaction vessel, whereby nitrogen is substituted for oxygen in the absence of oxygen. Next, the polymer was obtained by stirring, heating, and heat preservation. Further, the obtained copolymer may be directly used as a solution after the reaction, or a solution which is concentrated or diluted, or a solid (powder) which is taken out by a method such as re-sinking. When the binder resin (A2-2) is produced, (A-a) and (A-b) are first copolymerized to produce a copolymer. The ratio of the constituent components derived from each of the components to the total number of moles constituting the constituent components of the copolymer described above is preferably in the range of the following. The constituent unit derived from (A-a): 5 to 50 mol% The constituent unit derived from (A-b): 50 to 95 mol% Further, the ratio of the above-mentioned constituent components is more preferably in the following range. The constituent unit derived from (Aa): 1〇~45mol% The constituent unit derived from (Ab): 55~90mol% Next, in order to make it have reactivity due to the action of light or heat 'A part of a carboxylic acid and a carboxylic anhydride derived from a copolymer obtained by copolymerizing (Aa) and (Ab) (Aa-22-201022320) with an epoxy group derived from (Ac) or an oxycyclobutane group reaction. The molar number of (A-c) is from 5 to 80 mol%, preferably from 10 to 75 mol%, more preferably from 1 5 to 70 mol%, relative to the molar number of (A-a). /〇. When the composition ratio is within the above range, the balance between storage stability, solvent resistance, heat resistance, mechanical strength, and sensitivity (so-called photocurability) tends to be good. The φ binder resin (A2-2) can be produced through a two-stage process. For example, please refer to the document "Experimental method for polymer synthesis" (the method described in the issue of the first issue of the first issue of the Otsuka Ryokan, Ltd., the first issue of the syllabus, March 1, 1 972), or special opening 2 0 0 1 - The method described in the publication of 8 9 5 3 3 is manufactured. Specifically, the steps regarding the first stage are first explained. The compound (Aa) and (Ab) of the copolymer (ie, the binder resin) obtained by copolymerizing the composition (Aa) and (Ab) are derivatized, the polymerization start agent and the solvent are placed in the reaction container. The binder resin is obtained by substituting oxygen with nitrogen, stirring, heating, and heat preservation in the absence of oxygen. Further, as the obtained resin, the solution after the reaction may be used as it is, or a solution which is concentrated or diluted may be used, or a solid (powder) may be used by a method such as re-sinking. The above-mentioned resin preferably has a weight average molecular weight in terms of polyethylene, preferably 3,000 to 10,000,000, more preferably 5,000 to 50,000. Resin weight The average molecular weight is preferably within the above range, and the coating property tends to be good. The molecular weight distribution of the aforementioned resin [weight average molecular weight (Mw) / -23 - 201022320 number average molecular weight (?η)], preferably from 1.1 to 6.0, more preferably from 1.2 to 4.0. When the molecular weight distribution is in the above range, the coating property tends to be excellent, which is preferable. Next, explain the steps related to the second phase. Next, the atmosphere in the flask is replaced with air by nitrogen, and the component (Ac) having a molar number of 5 to 80 mol% with respect to the constituent component (Aa) is used as a carboxyl group and an epoxy group or an oxycyclobutane. The reaction catalyst of the base, for example, the dimethylaminomethylphenol is 0.001 to 5% by mass based on the total amount of the monomers (Aa) to (Ac), and is used as a polymerization inhibiting agent, for example, hydrogen.醌 is placed in a flask at a mass ratio of 0.001 to 5% with respect to the total amount of the monomers (Aa) to (Ac), and the above resin can be obtained by continuing the reaction at 60 to 130 ° C for 1 to 10 hours. Reacts with the constituent component (Ac). However, similarly to the polymerization conditions, the introduction method or the reaction temperature can be appropriately adjusted in consideration of the heat generation amount generated by the production equipment or the polymerization. In the binder resin (A2-3), the ratio of the constituent components derived from the respective components to the total number of moles of the constituent components constituting the binder resin (A2-3) is in the range of the following molar ratio. good. The constituent unit derived from (A-a): 5 to 95 mol % The constituent unit derived from (A-c): 5 to 95 mol % Further, the ratio of the above-mentioned constituent components is more preferably in the following range. Constituent unit derived from (Aa): 10 to 90 mol% Constituent unit derived from (Ac): 10 to 90 mol% The above-mentioned composition ratio is in the above range, and has stability and solvent resistance. The heat resistance and mechanical strength tend to be good. -24- 201022320 For the adhesive resin (A2-3), for example, please refer to the "Experimental Method for Polymer Synthesis" (Otsuno Ryokan, Ltd., Chemical Co., Ltd., 1st edition, 1st brush, issued on March 1, 1972) It is produced by the method described and the cited documents described in the literature. Specifically, a compound derived from units (Aa) and (Ac) constituting the copolymer is metered, a polymerization initiator, and a solvent are placed in a reaction vessel, and oxygen is replaced by nitrogen in the absence of oxygen by stirring. , heating, holding 0, to obtain a polymer. Further, the obtained copolymer may be directly used as a solution after the reaction, or may be a solution which is concentrated or diluted, or may be used as a hardening resin of the present invention which is taken out as a solid (powder) by a method such as re-sinking. The polymerizable compound (B)' contained in the substance may be a monofunctional monomer, a bifunctional monomer or another trifunctional or higher polyfunctional monomer. Specific examples of the monofunctional monomer include mercaptophenyl carbitol (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, 2-ethyl φ carbitol ( Methyl) acrylate, 2-hydroxyethyl (meth) acrylate, lauryl (meth) acrylate, octadecyl (meth) acrylate, 2-(2-ethoxyethoxy) B (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, caprolactone (meth) acrylate, ethoxylated fluorenyl hydrazide (meth) acrylate, propoxylated nonyl phenol (Meth) acrylate or N-vinylpyrrolidone. Further, specific examples of the 'bifunctional monomer' may include hydrazine, 3-butanediol di(meth)acrylic acid vinegar '1,3-butanediol (meth) acrylate, 1>6-hexanediol II. (Meth) acrylate, ethylene glycol di(meth) acrylate, diethyl-25-201022320 diol di(meth) acrylate, neopentyl glycol di(meth) acrylate, triethylene glycol Di(meth)acrylate, tetraethylene glycol di(meth)acrylate, polyethylene glycol diacrylate, bisphenol A bis(acryloxyethyl)ether, ethoxylated bisphenol A (meth) acrylate, propoxylated neopentyl glycol di(meth) acrylate, ethoxylated neopentyl glycol di(meth) acrylate or 3-methyl pentanediol di (a) Specific examples of the other trifunctional or higher polyfunctional monomer such as acrylate and the like include trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, and bis(2-hydroxy group B). Isocyanurate tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, propoxylated trishydroxypropyl Tris (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, tripentaerythritol tetra (meth) acrylate, tripentaerythritol Reaction of (meth) acrylate, tripentaerythritol hexa(meth) acrylate, tripentaerythritol hepta (meth) acrylate, tripentaerythritol octa (meth) acrylate, pentaerythritol tri(meth) acrylate and anhydride a reaction of dipentaerythritol penta (meth) acrylate with an acid anhydride, tripentaerythritol hepta (meth) acrylate and anhydride caprolactone denatured trimethylolpropane tri(meth) acrylate, caprolactone denatured pentaerythritol III (Meth) acrylate, caprolactone denatured ginseng (2-hydroxyethyl) isocyanurate tri(meth) acrylate, caprolactone modified pentaerythritol tetra (meth) acrylate, caprolactone denatured Pentaerythritol penta (meth) acrylate, caprolactone denatured dipentaerythritol hexa(meth) acrylate, caprolactone -26- 201022320 Tetraol tetra(meth)acrylate, caprolactone denatured tripentaerythritol penta (meth) acrylate, caprolactone denatured tripentaerythritol hexa(meth) acrylate, caprolactone denatured tripentaerythritol hepta(meth) acrylate Ester, caprolactone denatured tripentaerythritol octa (meth) acrylate, caprolactone denatured pentaerythritol tri(meth) acrylate and anhydride reaction, caprolactone denatured dipentaerythritol penta (meth) acrylate and anhydride The reactant, or caprolactone, denatures trispentaerythritol penta (meth) acrylate with an acid anhydride or the like. Φ 尙 In the present specification, caprolactone denature means a ring-opening or ring-opening in which a caprolactone is introduced between a site derived from an alcohol of a (meth) acrylate compound and a (meth) acryloxy group. The thing about polymers. In particular, it is preferred to use a polyfunctional monomer having two or more functional groups. These polymerizable compounds (B) may be used singly or in combination of two or more. The content of the polymerizable compound (B) is preferably from 1 to 70% by mass, more preferably from 5 to 60% by mass, based on the total amount of the binder resin (A) and the polymerizable compound (B). . When the content of φ of the polymerizable compound (B) is in the above range, the strength, smoothness, letterability, and mechanical strength of the sensitivity, the coating film, and the pattern tend to be good, which is preferable. The polymerization initiator (C) contained in the curable resin composition of the present invention is a compound which starts polymerization by the action of light or heat, and is a bisimidazole compound, an acetophenone compound, a triazine compound, or a mercapto group. A phosphine oxide compound or an anthraquinone compound is preferred, and a bisimidazole compound is particularly excellent in sensitivity. The above biimidazole compound may, for example, be 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbisimidazole, 2,2'-bis(2,3-di Chlorophenyl) _ -27- 201022320 4,4',5,5'-tetraphenylbisimidazole (for example, JP-A-6-75372, JP-A-6-75373, etc.), 2, 2'- Bis(2-chlorophenyl)-4,4',5,5'-tetraphenylbisimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5,-tetra (alkoxyphenyl)biimidazole, 2,2'-bis(2-chlorophenyl)-4,4',5,5'-tetrakis(dialkoxyphenyl)bisimidazole, 2,2' - bis(2-chlorophenyl)_4,4',5,5'-tetrakis(trialkoxyphenyl)bisimidazole (for example, refer to Japanese Patent Publication No. Sho 48-3 8403, JP-A-62-1 74204 The imidazole compound in which the phenyl group at the 4,4'5,5'-position is substituted with an alkoxycarbonyl group (for example, JP-A-7-10913, etc.), etc., preferably 2, 2, - double (2_chlorophenyl)-4,4,5,5,-tetraphenylbisimidazole, 2,2,-bis(2,3-dichlorophenyl)-4,4',5,5'- Tetraphenylbisimidazole, 2,2,-bis(2,4-dichlorophenyl)_4,4',5,5'-tetraphenyl double Imidazole. The above-mentioned acetophenone-based compound may, for example, be diethoxyacetophenone, 2- mercapto-2-methyl-1-phenylpropane-ketone, benzyldimethylketal, 2-hydroxyl-bu [4-(2-Hydroxyethoxy)phenyl]_2-methylpropan-1-one, 2-hydroxyl_1_ {4-[4-(2-hydroxy-2-methyl-propenyl)- Benzyl]-phenyl}-2-methyl-propan-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-2-morpholinyl "_(4-methylsulfonyl)propane 1-ketone, 2-benzyl-2-dimethylamino-1-(4-morpholinylphenyl)butan-1-one, 2-(2-methylhexyl)-2-dimethyl Amino-1-(4-morpholinylphenyl)-butanone, 2-(3-methylbenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)- Butanone, 2-(4-methylbenzyl)_2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(2-ethylbenzyl)-2-dimethyl 4-amino-4-(4-morpholinylphenyl)butanone, 2-(2-propylbenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butyl Ketone, 2-(2-201022320 butylbenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(2,3-dimethylbenzyl) -2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(2,4-dimethylbenzyl) Benzyl-2-methylamino-1-(4-morpholinylphenyl)-butanone, 2-(2-chlorobenzyl)-2-dimethylamino-1-(4-? Phenylphenyl)-butanone, 2-(2-bromobenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(3-chlorobenzyl )-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(4-chlorobenzyl)-2-dimethylamino-1-- (4-? Phenylphenyl)-butanone, 2-(3-bromobenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(4-bromobenzyl -2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(2-methoxybenzyl)-2-dimethylamino-1-(4- Morpholinylphenyl)-butanone, 2-(3-methoxybenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(4- Methoxybenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2-(2-methyl-4-methoxybenzyl)-2-di Methylamino-1-(4-morpholinylphenyl)-butanone, 2-(2-methyl-4-bromobenzyl)-2-dimethylamino-1-(4-? Phenylphenyl)-butanone, 2-(2-bromo-4-methoxybenzyl)-2-dimethylamino-1-(4-morpholinylphenyl)-butanone, 2- Hydroxy-2-methyl- l-[4- ( An oligomer of 1-methylvinyl)phenyl]propan-1-one or the like. The aforementioned triazine-based compound may, for example, be 2,4-bis(trichloromethyl)-6-(4-methoxyphenyl)-1,3,5-triazine or 2,4-bis(trichloro). Methyl)-6-(4-methoxynaphthyl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-piperidin-1,3,5-triazine , 2,4-bis(trichloromethyl)-6-(4-methoxystyryl)-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[ 2-(5-methylfuran-2-yl)ethynyl]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2- -29- 201022320 (furan- 2-yl)ethylidene]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(4-diethylamino-2-methylphenyl) Ethylene group]-1,3,5-triazine, 2,4-bis(trichloromethyl)-6-[2-(3,4-dimethoxyphenyl)ethynyl]-1,3 , 5-triazine, etc. The above-mentioned mercaptophosphine oxide-based initiator may, for example, be 2,4,6-trimethylbenzylindenyldiphenylphosphine oxide. Examples of the hydrazine compound include 0. ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one, a compound represented by the formula (IV), a compound represented by the formula (V), and the like.

只要係不損及本發明之效果的程度’可更倂用光聚合 開始劑等,該光聚合開始劑可舉出例如安息香系化合物、 二苯甲酮系化合物或噻吨酮系化合物等。 @ 更具體而言可舉出以下般之化合物’此些可各別單獨 ’或將2種以上組合使用。 前述之安息香系化合物可舉出例如安息香、安息香甲 醚、安息香乙醚、安息香異丙醚或安息香異丁酸等。 前述之二苯甲酮系化合物,例如可舉出二苯甲酮、0_ 苄醯基安息香酸甲酯' 4 -苯基二苯甲酮、4 -苄醯基·4’ -甲 基二苯基硫化物、3,3,,4,4,-四(tert-丁基過氧羰基)二苯 甲酮或2,4,6-三甲基二苯甲酮等。 -30- 201022320 前述之噻吨酮系化合物,例如可舉出2 -異丙基噻吨 酮、4 -異丙基噻吨酮、2,4 -二乙基噻吨酮、2,4 -二氯唾吨 酮或1-氯-4-丙氧基噻吨酮等。 其他也可例示10-丁基-2_氯吖啶酮、2-乙基蒽醌、苄 基、9, 10-菲醌、莰醌、苯基乙醛酸甲酯或二茂鈦化合物 等作爲光聚合開始劑。 又,具有可引起鏈轉移之基的光聚合開始劑,可使用 φ 特表2002-544205號公報記載之光聚合開始劑。 前述之具有可引起鏈轉移之基的光聚合開始劑,可舉 出例如下述式(5 )〜下述式(1 0 )之光聚合開始劑。The photopolymerization initiator may be, for example, a benzoin-based compound, a benzophenone-based compound or a thioxanthone-based compound, as long as it does not impair the effect of the present invention. More specifically, the following compounds can be used. These may be used singly or in combination of two or more. The aforementioned benzoin-based compound may, for example, be benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether or benzoin isobutyric acid. Examples of the benzophenone-based compound include benzophenone, methyl 10-benzylidene benzoate, 4-phenylbenzophenone, and 4-benzylbenzyl-4'-methyldiphenyl. Sulfide, 3,3,,4,4,-tetra (tert-butyl peroxycarbonyl) benzophenone or 2,4,6-trimethylbenzophenone. -30- 201022320 The aforementioned thioxanthone-based compound may, for example, be 2-isopropylthioxanthone, 4-isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-di Chloridinone or 1-chloro-4-propoxythioxanthone and the like. Other examples of 10-butyl-2-chloroacridone, 2-ethylhydrazine, benzyl, 9,10-phenanthrenequinone, anthracene, methyl phenylglyoxylate or a titanocene compound can be exemplified. Photopolymerization initiator. Further, as a photopolymerization initiator having a group capable of causing chain transfer, a photopolymerization initiator described in JP-A-2002-544205 can be used. The photopolymerization initiator of the above-mentioned formula (5) to the following formula (10) can be mentioned as a photopolymerization initiator.

又,可使用光及/或熱陽離子聚合開始劑。 光及/或熱陽離子聚合開始劑可使用由鑰陽離子與源 自路易斯酸之陰離子所構成者。 前述鎗陽離子之具體例可舉出二苯基鎮鑰、雙(p-苄 201022320 基)鎭鑰、雙(p-tert-丁基苯基)碘鎗、雙(p -辛基苯基 )鍈鑰、雙(p -十八基苯基)縝鑰、雙(p -半基氧基苯基 )銚鑰、雙(P -十八基氧基苯基)碘鎗、苯基(P -十八基 氧基苯基)鎮鎗、(P·苄基)(P -異丙基苯基)銕鑰、三 苯基鏑、參(p -节基)鏑、參(p -異丙基苯基)蔬、參( 2,6-二甲基苯基)鏡、參(?_^61^-丁基苯基)鏡、參(?_ 氰基苯基)毓、參(P-氯苯基)锍、二甲基(甲氧基)鏑 、二甲基(乙氧基)蔬、二甲基(丙氧基)毓、二甲基( 丁氧基)鏑、二甲基(辛基氧基)锍、二甲基(十八烷氧 基)锍、二甲基(異丙氧基)銃、二甲基(tert-丁氧基) 鏑、二甲基(環戊基氧基)鏡、二甲基(環己基氧基)毓 、二甲基(氟甲氧基)锍、二甲基(2-氯乙氧基)锍、二 甲基(3 -溴丙氧基)锍、二甲基(4 -氰基丁氧基)锍、二 甲基(8 -硝基辛基氧基)鏑、二甲基(18 -三氟甲基十八 烷氧基)锍、二甲基(2-羥基異丙氧基)锍、或二甲基( 參(三氯甲基)甲基)锍等。 較佳之鑰陽離子可舉出雙(P-苄基)碘鑰、(P-苄基 )(ρ -異丙基苯基)碘鎗、雙(p-tert -丁基苯基)鎭鎗、 三苯基鏡或參(p-tert-丁基苯基)鍊等。 前述源自路易斯酸之陰離子之具體例可舉出六氟磷酸 鹽、六氟砷酸鹽、六氟銻酸鹽或肆(五氟苯基)硼酸鹽等 。較佳之源自路易斯酸之陰離子可舉出六氟銻酸鹽或肆( 五氟苯基)硼酸鹽。 前述之鑰陽離子及源自路易斯酸之陰離子可任意組合 -32- 201022320 使用。 陽離子聚合開始劑之具體例,可舉出二苯基鎮鑰六氟 磷酸鹽、雙(P-苄基)鈹鑰六氟磷酸鹽、雙(p-tert-丁基 苯基)鋏鑰六氟磷酸鹽、雙(P-辛基苯基)鏔鎗六氟磷酸 鹽、雙(P-十八基苯基)鎮鎗六氟磷酸鹽、雙(P-辛基氧 基苯基)錐鑰六氟磷酸鹽、雙(P-十八基氧基苯基)鎮鑰 六氟磷酸鹽、苯基(P·十八基氧基苯基)碘鑰六氟磷酸鹽 _ 、(P-苄基)(P-異丙基苯基)鎮鎗六氟磷酸鹽、甲基萘 基鎭鎗六氟磷酸鹽、乙基萘基鎭鑰六氟磷酸鹽、三苯基锍 六氟磷酸鹽、參(P -苄基)锍六氟磷酸鹽、參(P -異丙基 苯基)锍六氟磷酸鹽、參(2,6-二甲基苯基)锍六氟磷酸 鹽、參(p-tert-丁基苯基)锍六氟磷酸鹽、參(p-氰基苯 基)锍六氟磷酸鹽、參(P-氯苯基)鏑六氟磷酸鹽、二甲 基萘基锍六氟磷酸鹽、二乙基萘基鏡六氟磷酸鹽、二甲基 (甲氧基)锍六氟磷酸鹽 '二甲基(乙氧基)锍六氟磷酸 _ 鹽、二甲基(丙氧基)銃六氟磷酸鹽、二甲基(丁氧基) 鏑六氟磷酸鹽、二甲基(辛基氧基)锍六氟磷酸鹽、二甲 基(十八烷氧基)鏑六氟磷酸鹽、二甲基(異丙氧基)锍 六氟磷酸鹽、二甲基(ter t-丁氧基)锍六氟磷酸鹽、二甲 基(環戊基氧基)鏑六氟磷酸鹽、二甲基(環己基氧基) 鏑六氟磷酸鹽、二甲基(氟甲氧基)锍六氟磷酸鹽、二甲 基(2-氯乙氧基)锍六氟磷酸鹽、二甲基(3-溴丙氧基) 锍六氟磷酸鹽、二甲基(4-氰基丁氧基)锍六氟磷酸鹽、 二甲基(8 -硝基辛基氧基)毓六氟磷酸鹽、二甲基(18- -33- 201022320 三氟甲基十八烷氧基)锍六氟磷酸鹽、二甲基(2-羥基異 丙氧基)锍六氟磷酸鹽、二甲基(參(三氯甲基)甲基) 锍六氟磷酸鹽; 二苯基鎮鑰六氟砷酸鹽、雙(P-苄基)碘鑰六氟砷酸 鹽、雙(p-tert-丁基苯基)鍈鎗六氟砷酸鹽、雙(p-辛基 苯基)錤鎗六氟砷酸鹽、雙(P-十八基苯基)鍈鑰六氟砷 酸鹽、雙(P-辛基氧基苯基)碘鑰六氟砷酸鹽、雙(P-十 八基氧基苯基)碘鑰六氟砷酸鹽、苯基(P-十八基氧基苯 基)鎭鑰六氟砷酸鹽、(P-苄基)(P-異丙基苯基)鎭鑰 六氟砷酸鹽、甲基萘基鍈鎗六氟砷酸鹽、乙基萘基鎭鎗六 氟砷酸鹽、三苯基锍六氟砷酸鹽、參(P-苄基)锍六氟砷 酸鹽、參(P-異丙基苯基)锍六氟砷酸鹽、參(2,6_二甲 基苯基)锍六氟砷酸鹽、參(p-tert-丁基苯基)锍六氟砷 酸鹽、參(P-氰基苯基)锍六氟砷酸鹽、參(P-氯苯基) 鏑六氟砷酸鹽、二甲基萘基锍六氟砷酸鹽、二乙基萘基锍 六氟砷酸鹽、二甲基(甲氧基)锍六氟砷酸鹽、二甲基( 乙氧基)锍六氟砷酸鹽、二甲基(丙氧基)锍六氟砷酸鹽 、二甲基(丁氧基)锍六氟砷酸鹽、二甲基(辛基氧基) 锍六氟砷酸鹽、二甲基(十八烷氧基)锍六氟砷酸鹽、二 甲基(異丙氧基)锍六氟砷酸鹽、二甲基(tert-丁氧基) 锍六氟砷酸鹽、二甲基(環戊基氧基)锍六氟砷酸鹽、二 甲基(環己基氧基)锍六氟砷酸鹽、二甲基(氟甲氧基) 锍六氟砷酸鹽、二甲基(2-氯乙氧基)锍六氟砷酸鹽、二 甲基(3-溴丙氧基)锍六氟砷酸鹽、二甲基(4-氰基丁氧 -34- 201022320 基)锍六氟砷酸鹽、二甲基(8-硝基辛基氧基)銃六氟砷 酸鹽、二甲基(18-三氟甲基十八烷氧基)毓六氟砷酸鹽 、二甲基(2-羥基異丙氧基)毓六氟砷酸鹽、二甲基(參 (三氯甲基)甲基)鏑六氟砷酸鹽; 二苯基銚鎗六氟銻酸鹽、雙(P-苄基)鎮鑰六氟銻酸 鹽、雙(p-tert-丁基苯基)碘鍚六氟銻酸鹽、雙(p-辛基 苯基)銚鑰六氟銻酸鹽、雙(P-十八基苯基)鎭鎩六氟銻 _ 酸鹽、雙(P-辛基氧基苯基)鍥鑰六氟銻酸鹽、雙(P-十 八基氧基苯基)鍈鑰六氟銻酸鹽、苯基(P-十八基氧基苯 基)鎭鐺六氟銻酸鹽、(P-苄基)(P-異丙基苯基)鎮鑰 六氟銻酸鹽、甲基萘基鎖鑰六氟銻酸鹽、乙基萘基鎭鑰六 氟銻酸鹽、三苯基銃六氟銻酸鹽、參(P-苄基)锍六氟銻 酸鹽、參(P-異丙基苯基)锍六氟銻酸鹽、參(2,6-二甲 基苯基)锍六氟銻酸鹽、參(p-tert-丁基苯基)锍六氟銻 酸鹽、參(P-氰基苯基)鏑六氟銻酸鹽、參(P-氯苯基) φ 鏑六氟銻酸鹽、二甲基萘基锍六氟銻酸鹽、二乙基萘基锍 六氟銻酸鹽、二甲基(甲氧基)毓六氟銻酸鹽、二甲基( 乙氧基)锍六氟銻酸鹽、二甲基(丙氧基)鏑六氟銻酸鹽 、二甲基(丁氧基)锍六氟銻酸鹽、二甲基(辛基氧基) 锍六氟銻酸鹽、二甲基(十八烷氧基)锍六氟銻酸鹽、二 甲基(異丙氧基)锍六氟銻酸鹽、二甲基(tert-丁氧基) 鏑六氟銻酸鹽 '二甲基(環戊基氧基)鏑六氟銻酸鹽、二 甲基(環己基氧基)銃六氟銻酸鹽、二甲基(氟甲氧基) 锍六氟銻酸鹽、二甲基(2 -氯乙氧基)锍六氟銻酸鹽、二 -35- 201022320 甲基(3-溴丙氧基)鏑六氟銻酸鹽、二甲基(4-氰基丁氧 基)锍六氟銻酸鹽、二甲基(8-硝基辛基氧基)锍六氟銻 酸鹽、二甲基(18 -三氟甲基十八烷氧基)锍六氟銻酸鹽 、二甲基(2-羥基異丙氧基)锍六氟銻酸鹽、二甲基(參 (三氯甲基)甲基)銃六氟銻酸鹽; 二苯基錤鎗肆(五氟苯基)硼酸鹽、雙(P-苄基)鐄 鎗肆(五氟苯基)硼酸鹽、雙(p-tert-丁基苯基)鍈鑰肆 (五氟苯基)硼酸鹽、雙(P-辛基苯基)鎮鐵肆(五氟苯 基)硼酸鹽、雙(P-十八基苯基)鍈鎗肆(五氟苯基)硼 酸鹽、雙(P-辛基氧基苯基)鎭鑰肆(五氟苯基)硼酸鹽 、雙(P-十八基氧基苯基)銕鎗肆(五氟苯基)硼酸鹽、 苯基(P-十八基氧基苯基)錤鑰肆(五氟苯基)硼酸鹽、 (P-苄基)(P-異丙基苯基)鎮鐺肆(五氟苯基)硼酸鹽 、甲基萘基錤鑰肆(五氟苯基)硼酸鹽、乙基萘基碘鑰肆 (五氟苯基)硼酸鹽、三苯基锍肆(五氟苯基)硼酸鹽、 參(P-苄基)锍肆(五氟苯基)硼酸鹽、參(P-異丙基苯 基)锍肆(五氟苯基)硼酸鹽、參(2,6-二甲基苯基)毓 肆(五氟苯基)硼酸鹽、參(p-ter t-丁基苯基)锍肆(五 氟苯基)硼酸鹽、參(P-氰基苯基)锍肆(五氟苯基)硼 酸鹽、參(P-氯苯基)鏑肆(五氟苯基)硼酸鹽、二甲基 萘基锍肆(五氟苯基)硼酸鹽、二乙基萘基锍肆(五氟苯 基)硼酸鹽、二甲基(甲氧基)锍肆(五氟苯基)硼酸鹽 、二甲基(乙氧基)锍肆(五氟苯基)硼酸鹽、二甲基( 丙氧基)鏑肆(五氟苯基)硼酸鹽、二甲基(丁氧基)锍 -36- 201022320 肆(五氟苯基)硼酸鹽、二甲基(辛基氧基)锍肆 苯基)硼酸鹽、二甲基(十八烷氧基)毓肆(五氟 硼酸鹽、二甲基(異丙氧基)锍肆(五氟苯基)硼 二甲基(tert-丁氧基)锍肆(五氟苯基)硼酸鹽、 (環戊基氧基)锍肆(五氟苯基)硼酸鹽、二甲基 基氧基)锍肆(五氟苯基)硼酸鹽、二甲基(氟甲 毓肆(五氟苯基)硼酸鹽、二甲基(2-氯乙氧基) 0 五氟苯基)硼酸鹽、二甲基(3-溴丙氧基)毓肆( 基)硼酸鹽、二甲基(4-氰基丁氧基)鏡肆(五氟 硼酸鹽、二甲基(8 -硝基辛基氧基)锍肆(五氟苯 酸鹽、二甲基(18-三氟甲基十八烷氧基)鏑肆( 基)硼酸鹽、二甲基(2-羥基異丙氧基)锍肆(五 )硼酸鹽、二甲基(參(三氯甲基)甲基)锍肆( 基)硼酸鹽等,較佳可舉出雙(P-苄基)鎭鑰六氟 、(P-苄基)(P-異丙基苯基)鎮鎗六氟磷酸鹽、 φ tert-丁基苯基)鎭鑰六氟磷酸鹽、三苯基锍六氟磷 參(p-tert-丁基苯基)锍六氟磷酸鹽、雙(p-苄基 六氟砷酸鹽、(P-苄基)(P-異丙基苯基)鋏鑰六 鹽、雙(p-tert-丁基苯基)碘鎗六氟砷酸鹽、三苯 氟砷酸鹽、參(p-t-丁基苯基)锍六氟砷酸鹽、雙 基)鎭鑰六氟銻酸鹽、(P-苄基)(P-異丙基苯基 六氟銻酸鹽、雙(P-tert-丁基苯基)鎭鑰六氟銻酸 苯基锍六氟銻酸鹽、參(p-tert-丁基苯基)毓六氟 、雙(P-苄基)鑛鑰肆(五氟苯基)硼酸鹽、(P- (五氟 苯基) 酸鹽、 二甲基 (環己 氧基) 锍肆( 五氟苯 苯基) 基)硼 五氟苯 氟苯基 五氟苯 磷酸鹽 雙(P-酸鹽、 )鎭鐵 氟砷酸 基鏡六 (p -节 )鎭鐵 鹽、三 銻酸鹽 苄基) -37- 201022320 (P-異丙基苯基)銚鎗肆(五氟苯基)硼酸鹽、雙(P-tert-丁基苯基)錤鐺、三苯基锍肆(五氟苯基)硼酸鹽、 參(p-tert-丁基苯基)毓肆(五氟苯基)硼酸鹽等,更佳 可舉出雙(P-苄基)碘鑰六氟銻酸鹽、(P-苄基)(P-異 丙基苯基)鐄鑰六氟銻酸鹽、雙(P-tert-丁基苯基)碘鎗 六氟銻酸鹽、三苯基鏑六氟銻酸鹽、參(P-tert-丁基苯基 )锍六氟銻酸鹽、雙(P-苄基)碘鑰肆(五氟苯基)硼酸 鹽、(P-苄基)(P-異丙基苯基)鎮鑰肆(五氟苯基)硼 酸鹽、雙(p-tert-丁基苯基)鎮鎗肆(五氟苯基)硼酸鹽 、三苯基锍肆(五氟苯基)硼酸鹽、或參(P-tert-丁基苯 基)锍肆(五氟苯基)硼酸鹽等。 又,在不損及本發明之效果的程度下,可在聚合開始 劑(C )中組合使用聚合開始助劑(C- 1 ),亦可複數組合 使用聚合開始助劑。 聚合開始助劑(C· 1 )可舉出胺化合物、羧酸化合物 、多官能硫醇化合物、式(III )所表示之化合物、式( A-1 )或式(A-2 )所表示之化合物等。 前述之胺化合物可舉出三乙醇胺、甲基二乙醇胺、三 異丙醇胺等之脂肪族胺化合物、4-二甲基胺基安息香酸甲 酯、4-二甲基胺基安息香酸乙酯、4-二甲基胺基安息香酸 異戊酯、4-二甲基胺基安息香酸2-乙基己酯、安息香酸 2-二甲基胺基乙酯、N,N-二甲基對甲苯胺、4,4’-雙(二甲 基胺基)二苯甲酮(通稱;米希勒酮)或4,4’-雙(二乙 基胺基)二苯甲酮等之芳香族胺化合物。 -38- 201022320 前述之竣酸化合物可舉出苯基硫代乙酸、甲基苯基硫 代乙酸、乙基苯基硫代乙酸、甲基乙基苯基硫代乙酸、二 甲基苯基硫代乙酸、甲氧基苯基硫代乙酸、二甲氧基苯基 硫代乙酸、氯苯基硫代乙酸、二氯苯基硫代乙酸、N_苯基 甘胺酸、苯氧基乙酸、萘基硫代乙酸、Ν·萘基甘胺酸或萘 氧基乙酸等之芳香族雜乙酸類。 前述之多官能硫醇化合物係於分子内具有2個以上之 φ 磺醯基的化合物。其中’以具有2個以上之與2個以上脂 肪族烴基之碳原子相鍵結之磺醯基的化合物’因可使本發 明之硬化性樹脂組成物之感度變高爲更佳。 多官能硫醇化合物具體可舉出己烷二硫醇、癸烷二硫 醇、1,4-二甲基硫醇基苯、丁二醇雙硫代丙酸酯、丁二醇 雙巯基乙酸酯、乙二醇雙毓基乙酸酯、三羥甲基丙烷參锍 基乙酸酯、丁二醇雙硫代丙酸酯、三羥甲基丙烷參硫代丙 酸酯、三羥甲基丙烷參锍基乙酸酯、季戊四醇肆硫代丙酸 φ 酯、季戊四醇肆锍基乙酸酯、參羥基乙基參硫代丙酸酯、 季戊四醇肆(3-毓基丁酸酯)或1,4-雙(3-巯基丁醯基氧 基)丁烷等。 多官能硫醇化合物之含有量,相對於聚合開始劑(C )’以質量分率較佳爲0.5〜20質量%,更佳爲1〜15質量 %。多官能硫醇化合物之含有量若在前述之範圍,有感度 變高之傾向,故爲佳。 聚合開始助劑(C-1 )亦可使用下述式(ΙΠ )所表示 之化合物。 -39- 201022320Further, a light and/or thermal cationic polymerization initiator can be used. The photo-and/or thermal cationic polymerization initiator may be composed of a key cation and an anion derived from a Lewis acid. Specific examples of the above gun cation include diphenyl sulfonium, bis(p-benzyl 201022320) oxime, bis(p-tert-butylphenyl) iodine gun, and bis(p-octylphenyl) fluorene. Key, bis(p-octadecylphenyl) ruthenium, bis(p-semiyloxyphenyl) oxime, bis(P-octadecyloxyphenyl) iodine gun, phenyl (P-Ten Octamethoxyphenyl) shotgun, (P·benzyl)(P-isopropylphenyl)oxime, triphenylsulfonium, ginseng (p-nod) fluorene, ginseng (p-isopropylbenzene) Base, vegetable, ginseng (2,6-dimethylphenyl) mirror, ginseng (?_^61^-butylphenyl) mirror, ginseng (?_cyanophenyl)anthracene, ginseng (P-chlorobenzene)锍, dimethyl (methoxy) hydrazine, dimethyl (ethoxy) vegetable, dimethyl (propoxy) hydrazine, dimethyl (butoxy) hydrazine, dimethyl (octyl) Oxy) hydrazine, dimethyl (octadecyloxy) hydrazine, dimethyl (isopropoxy) hydrazine, dimethyl (tert-butoxy) hydrazine, dimethyl (cyclopentyloxy) Mirror, dimethyl (cyclohexyloxy) hydrazine, dimethyl (fluoromethoxy) hydrazine, dimethyl (2-chloroethoxy) hydrazine, dimethyl (3-bromopropyl)锍, dimethyl (4-cyanobutoxy) hydrazine, dimethyl (8-nitrooctyloxy) fluorene, dimethyl (18-trifluoromethyloctadecyloxy) hydrazine , dimethyl (2-hydroxyisopropoxy) hydrazine, or dimethyl (glycol (trichloromethyl) methyl) hydrazine. Preferred key cations include bis(P-benzyl) iodine, (P-benzyl)(ρ-isopropylphenyl) iodine gun, bis(p-tert-butylphenyl) guanidine gun, and three Phenyl mirror or ginseng (p-tert-butylphenyl) chain. Specific examples of the anion derived from the Lewis acid include hexafluorophosphate, hexafluoroarsenate, hexafluoroantimonate or decyl (pentafluorophenyl) borate. Preferred examples of the anion derived from the Lewis acid include hexafluoroantimonate or quinone (pentafluorophenyl) borate. The above-mentioned key cation and an anion derived from a Lewis acid can be used arbitrarily in combination -32-201022320. Specific examples of the cationic polymerization initiator include diphenyl sulphate hexafluorophosphate, bis(P-benzyl) quinone hexafluorophosphate, and bis(p-tert-butylphenyl) ruthenium hexafluorophosphate. Phosphate, bis(P-octylphenyl) oxime gun hexafluorophosphate, bis(P-octadecylphenyl) lancehal hexafluorophosphate, bis(P-octyloxyphenyl) cone key Fluorophosphate, bis(P-octadecyloxyphenyl) sulphur hexafluorophosphate, phenyl (P·octadecyloxyphenyl) iodine hexafluorophosphate _ , (P-benzyl) (P-isopropylphenyl) shotgun hexafluorophosphate, methylnaphthylquinone gun hexafluorophosphate, ethylnaphthylquinone hexafluorophosphate, triphenylsulfonium hexafluorophosphate, ginseng (P -benzyl)phosphonium hexafluorophosphate, ginseng (P-isopropylphenyl)phosphonium hexafluorophosphate, ginseng (2,6-dimethylphenyl)phosphonium hexafluorophosphate, ginseng (p-tert- Butylphenyl)phosphonium hexafluorophosphate, ginseng (p-cyanophenyl)phosphonium hexafluorophosphate, ginseng (P-chlorophenyl)phosphonium hexafluorophosphate, dimethylnaphthylphosphonium hexafluorophosphate , diethyl naphthyl mirror hexafluorophosphate, dimethyl (methoxy) sulfonium hexafluorophosphate 'Dimethyl(ethoxy)phosphonium hexafluorophosphate_salt, dimethyl(propoxy)phosphonium hexafluorophosphate, dimethyl(butoxy)phosphonium hexafluorophosphate, dimethyl (octyl) Oxy) hexafluorophosphate, dimethyl(octadecyloxy)phosphonium hexafluorophosphate, dimethyl(isopropoxy)phosphonium hexafluorophosphate, dimethyl (ter t-butoxy) Hexafluorophosphate, dimethyl(cyclopentyloxy)phosphonium hexafluorophosphate, dimethyl(cyclohexyloxy)phosphonium hexafluorophosphate, dimethyl(fluoromethoxy)phosphonium hexafluorophosphate Phosphate, dimethyl(2-chloroethoxy)phosphonium hexafluorophosphate, dimethyl(3-bromopropoxy)phosphonium hexafluorophosphate, dimethyl(4-cyanobutoxy)anthracene Hexafluorophosphate, dimethyl(8-nitrooctyloxy)phosphonium hexafluorophosphate, dimethyl (18-33-201022320 trifluoromethyloctadecyloxy)phosphonium hexafluorophosphate, Dimethyl (2-hydroxyisopropoxy)phosphonium hexafluorophosphate, dimethyl (paras(trichloromethyl)methyl) sulfonium hexafluorophosphate; diphenyl sulphate hexafluoroarsenate, double (P-benzyl) iodine hexafluoroarsenate, double (p-tert- Phenyl phenyl) arsenic hexafluoroarsenate, bis(p-octylphenyl) hydrazine hexafluoroarsenate, bis(P-octadecylphenyl) quinone hexafluoroarsenate, double (P - octyloxyphenyl) iodine hexafluoroarsenate, bis(P-octadecyloxyphenyl) iodine hexafluoroarsenate, phenyl (P-octadecyloxyphenyl) fluorene Key hexafluoroarsenate, (P-benzyl) (P-isopropylphenyl) quinone hexafluoroarsenate, methylnaphthyl hydrazine hexafluoroarsenate, ethylnaphthyl hydrazine hexafluoro Arsenate, triphenylsulfonium hexafluoroarsenate, ginseng (P-benzyl)phosphonium hexafluoroarsenate, ginseng (P-isopropylphenyl)phosphonium hexafluoroarsenate, ginseng (2,6 _Dimethylphenyl)phosphonium hexafluoroarsenate, ginseng (p-tert-butylphenyl)phosphonium hexafluoroarsenate, ginseng (P-cyanophenyl)phosphonium hexafluoroarsenate, ginseng P-chlorophenyl) hexafluoroarsenate, dimethylnaphthylphosphonium hexafluoroarsenate, diethylnaphthylphosphonium hexafluoroarsenate, dimethyl(methoxy)phosphonium hexafluoroarsenate Salt, dimethyl(ethoxy)phosphonium hexafluoroarsenate, dimethyl(propoxy)phosphonium hexafluoroarsenate, dimethyl(butoxy)phosphonium hexafluoroarsenate, Methyl(octyloxy)phosphonium hexafluoroarsenate, dimethyl(octadecyloxy)phosphonium hexafluoroarsenate, dimethyl(isopropoxy)phosphonium hexafluoroarsenate, dimethyl (tert-butoxy) hexafluoroarsenate, dimethyl(cyclopentyloxy)phosphonium hexafluoroarsenate, dimethyl(cyclohexyloxy)phosphonium hexafluoroarsenate, dimethyl (fluoromethoxy) hexafluoroarsenate, dimethyl(2-chloroethoxy)phosphonium hexafluoroarsenate, dimethyl(3-bromopropoxy)phosphonium hexafluoroarsenate, Dimethyl (4-cyanobutoxy-34-201022320) hexafluoroarsenate, dimethyl(8-nitrooctyloxy)phosphonium hexafluoroarsenate, dimethyl (18-three) Fluoromethyloctadecyloxy)phosphonium hexafluoroarsenate, dimethyl(2-hydroxyisopropoxy)phosphonium hexafluoroarsenate, dimethyl(xyl(trichloromethyl)methyl)anthracene Hexafluoroarsenate; diphenyl sulfonium hexafluoroantimonate, bis(P-benzyl) hexafluoroantimonate, bis(p-tert-butylphenyl)iodonium hexafluoroantimonate , bis(p-octylphenyl)phosphonium hexafluoroantimonate, bis(P-octadecylphenyl)phosphonium hexafluoroate, double (P- Alkyl phenyl) quinone hexafluoroantimonate, bis(P-octadecyloxyphenyl) quinone hexafluoroantimonate, phenyl (P-octadecyloxyphenyl) fluorene Fluoride, (P-benzyl) (P-isopropylphenyl) hexafluoroantimonate, methylnaphthyl hexafluoroantimonate, ethylnaphthyl quinone hexafluoroantimonate , triphenylsulfonium hexafluoroantimonate, ginseng (P-benzyl) hexafluoroantimonate, ginseng (P-isopropylphenyl) hexafluoroantimonate, ginseng (2,6-dimethyl Phenyl) hexafluoroantimonate, ginseng (p-tert-butylphenyl) hexafluoroantimonate, ginseng (P-cyanophenyl) hexafluoroantimonate, ginseng (P-chloro Phenyl) φ 镝 hexafluoroantimonate, dimethylnaphthyl hydrazine hexafluoroantimonate, diethyl naphthyl fluorene hexafluoroantimonate, dimethyl (methoxy) hexafluoroantimonate, Dimethyl(ethoxy)phosphonium hexafluoroantimonate, dimethyl(propoxy)phosphonium hexafluoroantimonate, dimethyl(butoxy)phosphonium hexafluoroantimonate, dimethyl (xin Hydroxylated hexafluoroantimonate, dimethyl(octadecyloxy)phosphonium hexafluoroantimonate, dimethyl(isopropoxy)phosphonium hexafluoroantimonate , dimethyl (tert-butoxy) hexafluoroantimonate 'dimethyl (cyclopentyloxy) hexafluoroantimonate, dimethyl (cyclohexyloxy) hexafluoroantimonate , dimethyl (fluoromethoxy) hexafluoroantimonate, dimethyl (2-chloroethoxy) hexafluoroantimonate, bis-35-201022320 methyl (3-bromopropoxy) Hexafluoroantimonate, dimethyl(4-cyanobutoxy)phosphonium hexafluoroantimonate, dimethyl(8-nitrooctyloxy)phosphonium hexafluoroantimonate, dimethyl ( 18-trifluoromethyloctadecyloxy)phosphonium hexafluoroantimonate, dimethyl(2-hydroxyisopropoxy)phosphonium hexafluoroantimonate, dimethyl (paras(trichloromethyl)methyl) Hexafluoroantimonate; diphenyl fluorene (pentafluorophenyl) borate, bis(P-benzyl) fluorene (pentafluorophenyl) borate, bis (p-tert-butyl) Phenyl phenyl) quinone (pentafluorophenyl) borate, bis(P-octylphenyl) stilbene (pentafluorophenyl) borate, bis(P-octadecylphenyl) hydrazine (pentafluorophenyl)borate, bis(P-octyloxyphenyl)indole quinone (pentafluorophenyl)borate, double (P- Octyloxyphenyl)indole (pentafluorophenyl)borate, phenyl(P-octadecyloxyphenyl)indole quinone (pentafluorophenyl)borate, (P-benzyl) (P-isopropylphenyl) anthraquinone (pentafluorophenyl) borate, methylnaphthylquinone quinone (pentafluorophenyl) borate, ethylnaphthyl iodine quinone (pentafluorophenyl) Borate, triphenylsulfonium (pentafluorophenyl) borate, ginseng (P-benzyl) hydrazine (pentafluorophenyl) borate, ginseng (P-isopropylphenyl) hydrazine (pentafluoro Phenyl)borate, ginseng (2,6-dimethylphenyl)phosphonium (pentafluorophenyl)borate, ginseng (p-ter t-butylphenyl)phosphonium (pentafluorophenyl)boronic acid Salt, ginseng (P-cyanophenyl) ruthenium (pentafluorophenyl) borate, ginseng (P-chlorophenyl) ruthenium (pentafluorophenyl) borate, dimethylnaphthyl ruthenium (five Fluorophenyl)borate, diethylnaphthylhydrazine (pentafluorophenyl)borate, dimethyl(methoxy)indole (pentafluorophenyl)borate, dimethyl(ethoxy) Bis(pentafluorophenyl)borate, dimethyl(propyloxy)phosphonium (pentafluorophenyl)boron Acid salt, dimethyl (butoxy) oxime-36- 201022320 ruthenium (pentafluorophenyl) borate, dimethyl (octyloxy) phenyl) borate, dimethyl (octadecane) Oxy) quinone (pentafluoroborate, dimethyl (isopropoxy) ruthenium (pentafluorophenyl) boron dimethyl (tert-butoxy) ruthenium (pentafluorophenyl) borate, (cyclopentyloxy) ruthenium (pentafluorophenyl) borate, dimethyloxy) ruthenium (pentafluorophenyl) borate, dimethyl (fluoromethane (pentafluorophenyl)) Borate, dimethyl (2-chloroethoxy) 0 pentafluorophenyl) borate, dimethyl (3-bromopropoxy) sulfonate, dimethyl (4-cyano) Butoxy) quinone (pentafluoroborate, dimethyl (8-nitrooctyloxy) hydrazine (pentafluorophenylate, dimethyl (18-trifluoromethyloctadecyloxy)) Barium (yl) borate, dimethyl (2-hydroxyisopropoxy) ruthenium (penta) borate, dimethyl (glycol (trichloromethyl) methyl) ruthenium (yl) borate, etc. Preferably, bis(P-benzyl)phosphorus hexafluoro, (P-benzyl) (P) -isopropylphenyl) lancehol hexafluorophosphate, φ tert-butylphenyl) quinone hexafluorophosphate, triphenylsulfonium hexafluorophosphate (p-tert-butylphenyl) hexafluorophosphate Phosphate, bis(p-benzylhexafluoroarsenate, (P-benzyl)(P-isopropylphenyl)phosphonium hexaphosphate, bis(p-tert-butylphenyl) iodine hexafluoride Arsenate, triphenylfluoroarsenate, ginseng (pt-butylphenyl)phosphonium hexafluoroarsenate, dibasic) hexafluoroantimonate, (P-benzyl) (P-isopropyl) Phenyl hexafluoroantimonate, bis(P-tert-butylphenyl) quinone hexafluoroantimonate phenyl hexafluoroantimonate, ginseng (p-tert-butylphenyl) hexafluorocyclohexane, double (P-benzyl) mineral key quinone (pentafluorophenyl) borate, (P-(pentafluorophenyl) acid salt, dimethyl (cyclohexyloxy) fluorene (pentafluorophenyl)) Boron pentafluorobenzene fluorophenyl pentafluorophenyl phosphate bis (P-salt, ) bismuth iron fluoroarsenic acid mirror six (p-section) strontium iron salt, tribasic acid benzyl) -37- 201022320 (P -isopropylphenyl)indole (pentafluorophenyl)borate, bis(P-tert-butylphenyl)anthracene, triphenylsulfonium (pentafluorobenzene) a borate, a ginseng (p-tert-butylphenyl) ruthenium (pentafluorophenyl) borate, etc., more preferably a bis(P-benzyl) iodine hexafluoroantimonate, (P- Benzyl)(P-isopropylphenyl)phosphonium hexafluoroantimonate, bis(P-tert-butylphenyl) iodine hexafluoroantimonate, triphenylsulfonium hexafluoroantimonate, ginseng (P-tert-butylphenyl)phosphonium hexafluoroantimonate, bis(P-benzyl)iodonium quinone (pentafluorophenyl)borate, (P-benzyl) (P-isopropylphenyl) Carbium quinone (pentafluorophenyl) borate, bis(p-tert-butylphenyl) sulphonium (pentafluorophenyl) borate, triphenylsulfonium (pentafluorophenyl) borate, Or ginseng (P-tert-butylphenyl) ruthenium (pentafluorophenyl) borate. Further, the polymerization start aid (C-1) may be used in combination with the polymerization initiator (C) to the extent that the effects of the present invention are not impaired, or a polymerization start aid may be used in combination. The polymerization initiation aid (C·1) may, for example, be an amine compound, a carboxylic acid compound, a polyfunctional thiol compound, a compound represented by the formula (III), or a formula (A-1) or a formula (A-2). Compounds, etc. Examples of the amine compound include an aliphatic amine compound such as triethanolamine, methyldiethanolamine or triisopropanolamine, methyl 4-dimethylaminobenzoate, and ethyl 4-dimethylaminobenzoate. , 4-dimethylamino benzoic acid isoamyl ester, 4-dimethylamino benzoic acid 2-ethylhexyl ester, benzoic acid 2-dimethylaminoethyl ester, N, N-dimethyl pair Aromatic amines such as toluidine, 4,4'-bis(dimethylamino)benzophenone (general name; Michlerone) or 4,4'-bis(diethylamino)benzophenone Amine compound. -38- 201022320 The above-mentioned citric acid compound may, for example, be phenylthioacetic acid, methylphenylthioacetic acid, ethylphenylthioacetic acid, methylethylphenylthioacetic acid or dimethylphenylsulfide. Acetic acid, methoxyphenylthioacetic acid, dimethoxyphenylthioacetic acid, chlorophenylthioacetic acid, dichlorophenylthioacetic acid, N-phenylglycine, phenoxyacetic acid, An aromatic heteroacetic acid such as naphthylthioacetic acid, anthracene naphthylglycine or naphthyloxyacetic acid. The above polyfunctional thiol compound is a compound having two or more φ sulfonyl groups in the molecule. The compound 'having a sulfonyl group having two or more carbon atoms bonded to two or more aliphatic hydrocarbon groups' is more preferable because the sensitivity of the curable resin composition of the present invention can be increased. Specific examples of the polyfunctional thiol compound include hexanedithiol, decanedithiol, 1,4-dimethylthiolbenzene, butanediol dithiopropionate, butanediol bis-mercaptoacetic acid. Ester, ethylene glycol bis-mercaptoacetate, trimethylolpropane decyl acetate, butanediol dithiopropionate, trimethylolpropane thiopropionate, trimethylol Propane hydrazide acetate, pentaerythritol thioglycolate φ ester, pentaerythritol thioglycolate, hydroxyethyl thiopropionate, pentaerythritol bismuth (3-mercaptobutyrate) or 1, 4-bis(3-mercaptobutyloxy)butane or the like. The content of the polyfunctional thiol compound is preferably from 0.5 to 20% by mass, more preferably from 1 to 15% by mass, based on the polymerization initiator (C)'. When the content of the polyfunctional thiol compound is within the above range, the sensitivity tends to be high, which is preferable. A compound represented by the following formula (ΙΠ) can also be used as the polymerization initiation aid (C-1). -39- 201022320

式(III)中’ X所不之點線係表示亦可被鹵素原子所 取代之碳數6〜12之芳香環。 Y表示氧原子、硫原子。 R21表示碳數1〜6之烷基。 R22表示可被鹵素原子取代之碳數1〜12之烷基或亦可 被鹵素原子取代之芳香基。 鹵素原子可舉出氟原子、氯原子、溴原子等。 碳數6〜12之芳香環可舉出苯環、萘環等。 可被鹵素原子取代之碳數6~ 12之芳香環可舉出苯環 '甲基苯環、二甲基苯環、乙基苯環、丙基苯環、丁基苯 環、戊基苯環、己基苯環、環己基苯環、氯苯環、二氯苯 環、溴苯環、二溴苯環、苯基苯環、氯苯基苯環、溴苯基 苯環、萘環、氯萘環、溴萘環等。 碳數1〜6之烷基可舉出甲基、乙基、η-丙基、異丙基 、η-丁基、1-甲基-η-丙基、2-甲基-η-丙基、tert-丁基、η-戊基基' 1-甲基-η-丁基、2-甲基-η-丁基、3-甲基-η-丁基 、1,1-二甲基-η-丙基、1,2-二甲基-η-丙基、2,2-二甲基-η-丙基、η-己基、環己基等。 可被鹵素原子取代之碳數1~12之烷基可舉出甲基、 乙基、η-丙基 '異丙基、η-丁基、1-甲基-η-丙基、2-甲 基-η-丙基、tert-丁基、η-戊基、1-甲基-η-丁基、2-甲基- 201022320 η-丁基、3-甲基-η-丁基、1,1-二甲基-η-丙基、1,2-二甲 基-η-丙基、2,2-二甲基-η-丙基、η-己基、環己基基、1-氣- η-丁基、2 -氣- η-丁基、3-氣- η-丁基寺。 可被鹵素原子取代之芳香基可舉出苯基、氯苯基、二 氯苯基、溴苯基、二溴苯基、氯溴苯基、聯苯基、氯聯苯 基、二氯聯苯基、溴苯基、二溴苯基、萘基、氯萘基、二 氯萘基、溴萘基、二溴萘基等。 _ 式(III)所表示之合物,具體而言可舉出 2-苄醯基亞甲基-3-甲基-苯并噻唑啉、 2-苄醯基亞甲基-3-甲基-萘并[2,l-d]噻唑啉、 2-苄醯基亞甲基-3-甲基-萘并[1,2-d]噻唑啉、 2-苄醯基亞甲基-3-甲基-萘并[2,3-d]噻唑啉、 2- (2-萘甲醯基亞甲基)-3-甲基苯并噻唑啉、 2- ( 1-萘甲醯基亞甲基)-3-甲基苯并噻唑啉、 2- (2-萘甲醯基亞甲基)-3-甲基-5·苯基苯并噻唑啉 ❿ 2-(卜萘甲醯基亞甲基)-3-甲基-5-苯基苯并噻唑啉 、 2- (2-萘甲醯基亞甲基)-3-甲基-5-氟苯并噻唑啉、 2- ( 1-萘甲醯基亞甲基)-3-甲基-5-氟苯并噻唑啉、 2- (2-萘甲醯基亞甲基)-3-甲基-5-氯苯并噻唑啉、 2-(卜萘甲醯基亞甲基)-3-甲基-5-氯苯并噻唑啉、 2- (2-萘甲醯基亞甲基)-3-甲基-5-溴苯并噻唑啉、 2- ( 1-萘甲醯基亞甲基)-3-甲基-5-溴苯并噻唑啉、 -41 - 201022320 2- (4-聯苯二甲醯基亞甲基)-3-甲基苯并噻唑啉、 2- (4-聯苯二甲醯基亞甲基)-3-甲基-5-苯基苯并噻 唑啉、 2- (2-萘甲醯基亞甲基)-3-甲基-萘并[2,1-d]噻唑啉 2- (2-萘甲醯基亞甲基)-3-甲基-萘并[l,2-d]噻唑啉 > 2- (4-聯苯二甲醯基亞甲基)-3-甲基-萘并[2,1-d]噻 唑啉、 2- (4-聯苯二甲醯基亞甲基)-3-甲基-萘并[l,2-d]噻 唑啉、 2- (p-氟苄醯基亞甲基)-3_甲基-萘并[2,1-d]噻唑啉 、 2-(p-氟苄醯基亞甲基)-3_甲基-萘并[l,2-d]噻唑啉 、 2-苄醯基亞甲基-3-甲基-萘并[2,1-d]噁唑啉、 2-苄醯基亞甲基-3-甲基-萘并[1,2-d]噁唑啉、 2-苄醯基亞甲基-3-甲基-萘并[2,3-d]噁唑啉、 2- (2-萘甲醯基亞甲基)-3-甲基苯并噁唑啉、 2- ( 1-萘甲醯基亞甲基)-3-甲基苯并噁唑啉、 2- ( 2-萘甲醯基亞甲基)-3-甲基-5-苯基苯并噁唑啉 > 2-(1-萘甲醯基亞甲基)-3 -甲基-5 -苯基苯并噁唑啉 -42- 201022320 2- (2-萘甲醯基亞甲基)-3-甲基-5-氟苯并噁唑啉、 2-(1-萘甲醯基亞甲基)-3-甲基-5-氟苯并噁嗖啉、 2- (2-萘甲醯基亞甲基)-3-甲基-5-氯苯并噁唑啉、 2- ( 1-萘甲醯基亞甲基)-3-甲基-5-氯苯并噁唑啉、 2- (2-萘甲醯基亞甲基)-3-甲基-5-溴苯并噁唑啉、 2- ( 1-萘甲醯基亞甲基)-3-甲基-5-溴苯并噁唑啉、 2-(4-聯苯二甲醯基(1^?11611〇丫1)亞甲基)-3-甲基 鲁 苯并噪π坐琳、 2-(4-聯苯二甲醯基亞甲基)-3-甲基-5-苯基苯并噁 唑啉、 2- (2-萘甲醯基亞甲基)-3-甲基-萘并[2,l-d]噁唑啉 2- ( 2-萘甲醯基亞甲基)-3-甲基-萘并[l,2-d]噁唑啉 2- (4-聯苯二甲醯基亞甲基)-3-甲基-萘并[2,1-d]噁 _ 哩啉、 2- (4-聯苯二甲醯基亞甲基)-3-甲基-萘并[1,2-d]噁 唑啉、 2-(p-氟苄醯基亞甲基)-3-甲基-萘并[2,1-d]噁唑啉 、 2-(?-氟苄醯基亞甲基)-3-甲基-萘并[1,2-(1]噁唑啉 等。 其中,以式(ΙΠ-1)所表示之2-(2-萘甲醯基亞甲基 )-3-甲基苯并噻唑啉、式(III-2)所表示之2-苄醯基亞 -43- 201022320 甲基-3-甲基-萘并[l,2-d]噻唑啉及式(III-3)所表示之2-(4-聯苯二甲醯基亞甲基)-3-甲基-萘并[l,2-d]噻唑啉、 2-苄醯基亞甲基-3-甲基-苯并噻唑啉爲佳。The dotted line in the formula (III) where X is not represented by an aromatic ring having a carbon number of 6 to 12 which may be substituted by a halogen atom. Y represents an oxygen atom or a sulfur atom. R21 represents an alkyl group having 1 to 6 carbon atoms. R22 represents an alkyl group having 1 to 12 carbon atoms which may be substituted by a halogen atom or an aromatic group which may be substituted by a halogen atom. Examples of the halogen atom include a fluorine atom, a chlorine atom, and a bromine atom. Examples of the aromatic ring having 6 to 12 carbon atoms include a benzene ring and a naphthalene ring. The aromatic ring having 6 to 12 carbon atoms which may be substituted by a halogen atom may be a benzene ring 'methylbenzene ring, dimethylbenzene ring, ethylbenzene ring, propylbenzene ring, butylbenzene ring or pentylbenzene ring. , hexylbenzene ring, cyclohexylbenzene ring, chlorobenzene ring, dichlorobenzene ring, bromobenzene ring, dibromobenzene ring, phenylbenzene ring, chlorophenylbenzene ring, bromophenylbenzene ring, naphthalene ring, chloronaphthalene Ring, bromine naphthalene ring, and the like. The alkyl group having 1 to 6 carbon atoms may, for example, be methyl, ethyl, η-propyl, isopropyl, η-butyl, 1-methyl-η-propyl or 2-methyl-η-propyl. , tert-butyl, η-pentyl ' 1-methyl-η-butyl, 2-methyl-η-butyl, 3-methyl-η-butyl, 1,1-dimethyl- Η-propyl, 1,2-dimethyl-η-propyl, 2,2-dimethyl-η-propyl, η-hexyl, cyclohexyl and the like. The alkyl group having 1 to 12 carbon atoms which may be substituted by a halogen atom may, for example, be methyl, ethyl, η-propyl 'isopropyl, η-butyl, 1-methyl-η-propyl, 2-methyl -η-propyl, tert-butyl, η-pentyl, 1-methyl-η-butyl, 2-methyl-201022320 η-butyl, 3-methyl-η-butyl, 1, 1-dimethyl-η-propyl, 1,2-dimethyl-η-propyl, 2,2-dimethyl-η-propyl, η-hexyl, cyclohexyl, 1-gas-η - butyl, 2- gas-η-butyl, 3-gas-η-butyl temple. The aromatic group which may be substituted by a halogen atom may, for example, be phenyl, chlorophenyl, dichlorophenyl, bromophenyl, dibromophenyl, chlorobromophenyl, biphenyl, chlorobiphenyl or dichlorobiphenyl. Base, bromophenyl, dibromophenyl, naphthyl, chloronaphthyl, dichloronaphthyl, bromonaphthyl, dibromonaphthyl and the like. _ The compound represented by the formula (III), specifically, 2-benzylindolyl-3-methyl-benzothiazoline, 2-benzylidenemethylene-3-methyl- Naphtho[2,ld]thiazoline, 2-benzylindolyl-3-methyl-naphtho[1,2-d]thiazoline, 2-benzylindolyl-3-methyl- Naphtho[2,3-d]thiazoline, 2-(2-naphthylmethylidenemethyl)-3-methylbenzothiazoline, 2-(1-naphthylmethylidenemethyl)-3 -methylbenzothiazoline, 2-(2-naphthylmethylidenemethyl)-3-methyl-5-phenylbenzothiazolinium 2-(b-naphthylmethylidene)-3 -methyl-5-phenylbenzothiazoline, 2-(2-naphthylmethylidenemethyl)-3-methyl-5-fluorobenzothiazoline, 2-(1-naphthylmethyl) Methyl)-3-methyl-5-fluorobenzothiazoline, 2-(2-naphthylmethylidene methylene)-3-methyl-5-chlorobenzothiazoline, 2-(b. Mercaptomethyl)-3-methyl-5-chlorobenzothiazoline, 2-(2-naphthylmethylidenemethyl)-3-methyl-5-bromobenzothiazoline, 2- ( 1-naphthylmethylidene methylene)-3-methyl-5-bromobenzothiazoline, -41 - 201022320 2-(4-biphenyldimethylidene methylene)-3-methylbenzo Thiazoline, 2- (4- Biphenyldimethylbenzylidene-3-methyl-5-phenylbenzothiazoline, 2-(2-naphthylmethylidenemethyl)-3-methyl-naphtho[2,1 -d]thiazoline 2-(2-naphthomethylidene methylene)-3-methyl-naphtho[l,2-d]thiazoline> 2-(4-biphenyldimethylidene) 3-methyl-naphtho[2,1-d]thiazoline, 2-(4-biphenyldimethylbenzylidene)-3-methyl-naphtho[l,2-d] Thiazoline, 2-(p-fluorobenzylidenemethylene)-3_methyl-naphtho[2,1-d]thiazoline, 2-(p-fluorobenzylidenemethylene)-3_ Methyl-naphtho[l,2-d]thiazoline, 2-benzylindolyl-3-methyl-naphtho[2,1-d]oxazoline, 2-benzylidene methylene -3-methyl-naphtho[1,2-d]oxazoline, 2-benzylindolyl-3-methyl-naphtho[2,3-d]oxazoline, 2- (2 -naphthylmethylidenemethyl)-3-methylbenzoxazoline, 2-(1-naphthylmethylidenemethylene)-3-methylbenzoxazoline, 2-(2-naphthalene Methyl mercaptomethyl)-3-methyl-5-phenylbenzoxazoline> 2-(1-naphthylmethylidene methylene)-3-methyl-5-phenylbenzone Oxazoline-42- 201022320 2-(2-naphthylmethylidene methylene)-3-methyl-5-fluorobenzoxazoline, 2-(1-naphthylmethyl) Methylene)-3-methyl-5-fluorobenzoxanthionine, 2-(2-naphthylmethylidenemethyl)-3-methyl-5-chlorobenzoxazoline, 2-( 1-naphthylmethylidene methylene)-3-methyl-5-chlorobenzoxazoline, 2-(2-naphthylmethylidene methylene)-3-methyl-5-bromobenzopyrene Oxazoline, 2-(1-naphthylmethylidene methylene)-3-methyl-5-bromobenzoxazoline, 2-(4-biphenyldimethylhydrazyl (1^?11611〇丫1) )methylene)-3-methyl benzobenzol π sitin, 2-(4-biphenyldimethylbenzylidene)-3-methyl-5-phenylbenzoxazoline, 2 - (2-Naphthylmethylidene methylene)-3-methyl-naphtho[2,ld]oxazoline 2-(2-naphthylmethylidene methylene)-3-methyl-naphtho[ l,2-d]oxazoline 2-(4-biphenyldimethylbenzylidene)-3-methyl-naphtho[2,1-d]oxoporphyrin, 2-(4-linked Benzomethylene methylene)-3-methyl-naphtho[1,2-d]oxazoline, 2-(p-fluorobenzylidenemethylene)-3-methyl-naphtho[ 2,1-d]oxazoline, 2-(?-fluorobenzylidenemethylene)-3-methyl-naphtho[1,2-(1]oxazoline, and the like. Wherein, 2-(2-naphthylmethylidenemethylene)-3-methylbenzothiazoline represented by the formula (ΙΠ-1), 2-benzylindenyl represented by the formula (III-2) -43- 201022320 methyl-3-methyl-naphtho[l,2-d]thiazoline and 2-(4-biphenyldimethylbenzylidene)-3 represented by formula (III-3) -Methyl-naphtho[l,2-d]thiazoline or 2-benzylindolyl-3-methyl-benzothiazoline is preferred.

❹ 聚合開始助劑(C-1)亦可使用選自由式(A_l)及式 (A-2 )所成群之至少1種所表示之化合物。❹ The polymerization initiation aid (C-1) may be a compound selected from at least one selected from the group consisting of the formula (A-1) and the formula (A-2).

[式(A-1)及式(A-2)中’環X31及環X32各自獨立表 示碳數6~ 12之芳香環。Y31及Y32表示氧原子或硫原子。 R31及R32表示碳數1~12之烷基或碳數6〜12之芳香 基。 該芳香環、該烷基或芳香基所含之碳原子亦可被氧原 子、氮原子、硫原子或鹵素原子取代。] 鹵素原子可舉出氟原子,氯原子、溴原子等。 碳數6~12之芳香環可舉出苯環、甲基苯環、二甲基 苯環、乙基苯環、丙基苯環、丁基苯環、戊基苯環、己基 苯環、環己基苯環、氯苯環、二氯苯環、溴苯環、二溴苯 -44 - 201022320 環、苯基苯環、氯苯基苯環、溴苯基苯環、萘環、氯萘環 '溴萘環、菲環、屈(chrysene )環、芙環、苯并[a]芘環 、苯并[e]芘環、茈環及彼等之衍生物等。 碳數1〜12之烷基可舉出甲基、乙基、η-丙基、異丙 基、η-丁基、卜甲基·η_丙基、2 -甲基-η-丙基、tert-丁基 、η -戊基、甲基-η-丁基、2 -甲基-η-丁基、3 -甲基-η-丁 基、1,1-二甲基-η-丙基、1,2-二甲基-η-丙基、2,2-二甲基-0 η-丙基、η-己基、環己基基、1 -氯-η-丁基、2-氯-η-丁基、 3-氯-η-丁基等。 碳數6〜12之芳香基可舉出苯基、氯苯基 '二氯苯基 、溴苯基、二溴苯基、氯溴苯基、羥基苯基、烷氧基苯基 、聯苯基、氯聯苯基、二氯聯苯基、溴苯基、二溴苯基、 萘基、氯萘基、二氯萘基、溴萘基、二溴萘基、羥基萘基 等。 式(Α-1)或式(Α-2)所表示之化合物,具體可舉出 0 二甲氧基萘、二乙氧基萘、二丙氧基萘、二異丙氧基 萘、二丁氧基萘等之二烷氧基萘類 二甲氧基蒽、二乙氧基蒽、二丙氧基蒽、二異丙氧基 蒽、二丁氧基蒽、二戊氧基蒽、二己氧基蒽、甲氧基乙氧 基蒽、甲氧基丙氧基蒽、甲氧基異丙氧基蒽、甲氧基丁氧 基蒽、乙氧基丙氧基蒽、乙氧基異丙氧基蒽、乙氧基丁氧 基蒽、丙氧基異丙氧基蒽、丙氧基丁氧基蒽、異丙氧基丁 氧基蒽等之二烷氧基蒽類 二甲氧基稠四苯、二乙氧基稠四苯、二丙氧基稠四苯 -45- 201022320 、二異丙氧基稠四苯、二丁氧基稠四苯等之二烷氧基稠四 苯類等,但不受限於此等。 聚合開始劑(C )之含有量,相對於黏合劑樹脂(A )及聚合性化合物(B)之合計量,以質量分率較佳爲 0.1~40質量%,更佳爲1~3〇質量%。 又,聚合開始助劑(C-1)之含有量,與前述相同之 基準下’較佳爲0.01~50質量%,更佳爲0.^40質量%。 選自由式(A-1 )及式(A-2 )所成群之至少1種所表 示之化合物之含有量,相對於聚合開始助劑(C-1 )之含 有量’以 50〜100%爲佳,較佳爲 60~100%,更佳爲 65〜100%。選自由式(A-1)及式(A-2 )所成之至少1種 所表示之化合物之含有量若在前述之範圍,使用含有此之 硬化性樹脂組成物形成塗膜時,塗膜之透明性變得良好, 故爲佳。 聚合開始劑(C )之合計量若在前述之範圍,硬化性 樹脂組成物成爲高感度,有使用前述之硬化性樹脂組成物 形成之塗膜或圖型之強度、前述之塗膜或圖型之表面中之 平滑性變得良好之傾向,故爲佳。前述以外,聚合開始助 劑(C -1 )之量若在前述之範圍,所得之硬化性樹脂組成 物之感度變得更高,有使用前述之硬化性樹脂組成物形成 之圖型之生產性提升之傾向,故爲佳。 本發明之硬化性樹脂組成物含有溶劑(D )。前述之 溶劑(D)可舉出硬化性樹脂組成物之領域中所使用之各 種的有機溶劑,其具體例可舉出乙二醇單甲基醚、乙二醇 -46- 201022320 單乙基醚、乙二醇單丙基醚及乙二醇單丁基醚般之乙二醇 單烷基醚類; 二乙二醇二甲基醚、二乙二醇二乙基醚、二乙二醇乙 基甲基醚、二乙二醇二丙基醚、二乙二醇二丁基醚等之二 乙二醇二烷基醚類; 甲基溶纖劑乙酸酯、乙基溶纖劑乙酸酯、乙二醇單丁 基醚乙酸酯、乙二醇單乙基醚乙酸酯等之乙二醇烷基醚乙 0 酸酯類; 丙二醇單甲基醚乙酸酯、丙二醇單乙基醚乙酸酯、丙 二醇單丙基醚乙酸酯、甲氧基丁基乙酸酯、甲氧基戊基乙 酸酯等之伸烷基二醇烷基醚乙酸酯類; 丙二醇單甲基醚、丙二醇單乙基醚、丙二醇單丙基醚 、丙二醇單丁基醚等之丙二醇單烷基醚類; 丙二醇二甲基醚、丙二醇二乙基醚、丙二醇乙基甲基 醚、丙二醇二丙基醚丙二醇丙基甲基醚、丙二醇乙基丙基 φ 醚等之丙二醇二烷基醚類 丙二醇甲基醚丙酸酯、丙二醇乙基醚丙酸酯、丙二醇 丙基醚丙酸酯、丙二醇丁基醚丙酸酯等之丙二醇烷基醚丙 酸酯類; 甲氧基丁基醇、乙氧基丁基醇、丙氧基丁基醇、丁氧 基丁基醇等之丁基二醇單烷基醚類; 甲氧基丁基乙酸酯、乙氧基丁基乙酸酯、丙氧基丁基 乙酸酯、丁氧基丁基乙酸酯等之丁二醇單烷基醚乙酸酯類 -47- 201022320 甲氧基丁基丙酸酯、乙氧基丁基丙酸酯、丙氧基丁基 丙酸酯、丁氧基丁基丙酸酯等之丁二醇單烷基醚丙酸酯類 二丙二醇二甲基醚、二丙二醇二乙基醚、二丙二醇甲 基乙基醚等之二丙二醇二烷基醚類; 苯、甲苯、茬、對稱三甲苯等之芳香族烴類; 甲基乙基酮、丙酮、甲基戊基酮、甲基異丁基酮、環 己酮等之酮類; 乙醇、丙醇、丁醇、己醇、環己醇、乙二醇、丙三醇 等之醇類; 乙酸甲酯、乙酸乙酯、乙酸丙酯、乙酸丁酯、2-羥基 丙酸乙酯、2-羥基-2-甲基丙酸甲酯、2-羥基-2-甲基丙酸 乙酯、羥基乙酸甲酯、羥基乙酸乙酯、羥基乙酸丁基、乳 酸甲酯、乳酸乙酯、乳酸丙酯、乳酸丁酯、3-羥基丙酸甲 酯、3-羥基丙酸乙酯、3-羥基丙酸丙酯、3-羥基丙酸丁基 、2-羥基-3-甲基丁酸甲酯、甲氧基乙酸甲酯、甲氧基乙 酸乙酯 '甲氧基乙酸丙酯、甲氧基乙酸丁酯、乙氧基乙酸 甲酯、乙氧基乙酸乙酯、乙氧基乙酸丙酯、乙氧基乙酸丁 酯、丙氧基乙酸甲酯、丙氧基乙酸乙酯、丙氧基乙酸丙酯 、丙氧基乙酸丁酯、丁氧基乙酸甲酯、丁氧基乙酸乙酯、 丁氧基乙酸丙酯、丁氧基乙酸丁酯、2-甲氧基丙酸甲酯、 2-甲氧基丙酸乙酯' 2-甲氧基丙酸丙酯、2-甲氧基丙酸丁 酯、2-乙氧基丙酸甲酯、2_乙氧基丙酸乙酯、2-乙氧基丙 酸丙酯、2-乙氧基丙酸丁酯、2-丁氧基丙酸甲酯、2-丁氧 -48- 201022320 基丙酸乙酯、2-丁氧基丙酸丙酯、2-丁氧基丙酸丁酯、3-甲氧基丙酸甲酯、3-甲氧基丙酸乙酯、3-甲氧基丙酸丙酯 、3-甲氧基丙酸丁酯、3-乙氧基丙酸甲酯、3-乙氧基丙酸 乙酯、3-乙氧基丙酸丙酯、3-乙氧基丙酸丁酯、3-丙氧基 丙酸甲酯、3-丙氧基丙酸乙酯、3-丙氧基丙酸丙酯、3-丙 氧基丙酸丁酯、3-丁氧基丙酸甲酯、3-丁氧基丙酸乙酯、 3-丁氧基丙酸丙酯、3-丁氧基丙酸丁酯等之酯類; ❿ ❹ 四氫呋喃、哌喃等之環狀醚基類; r-丁內酯等之環狀酯類等。 上述之溶劑之中,由塗佈性、印刷性、溶解性、乾燥 性之觀點’沸點爲200 °C以上,較佳爲200〜300。(:之酯系 溶劑、醚系溶劑及醇系溶劑爲佳。 醋系溶劑係指具有酯鍵結,不具有羥基之有機溶劑。 酯系溶劑之具體例’例如可舉出二乙二醇單乙基醚乙 酸醋(沸點217t )、二乙二醇單丙基醚乙酸酯(232 t: )、二乙二醇單丁基醚乙酸酯(沸點247°C )、甘油三乙 酸醋(沸點260°C) ’較佳可舉出二乙二醇單丁基醚乙酸 酯(沸點247。(:)、甘油三乙酸酯(沸點26〇t )。 酸系溶劑係指具有醚鍵結’不具有酯鍵結及羥基之有 機溶劑。 上述醚系溶劑之具體例,例如可舉出二乙二醇丁基甲 基醚(沸點2 1 21 )、三丙二醇二甲基醚(沸點2丨5艽) 、二乙二醇二甲基醚(沸點216它)、二乙二醇二丁基醚 (沸點256°C )、三乙二醇丁基甲基醚(沸點26ir )、 -49- 201022320 275°C ),較佳可舉出二乙二醇 、三乙二醇丁基甲基醚(沸點 四乙—醇—甲基醚(沸點 二丁基醚(沸點2 5 6 t:) 26 1〇C )。 醇系溶劑係指具有羥基之有機溶劑。 上述醇系溶劑之具體例,例如可舉出乙二醇單己基醚 (沸點208C)、乙二醇單2 -乙基己基醚(沸點229〇c) 、乙一醇單苯基魅(沸點245 °C)、乙二醇單苄基醚(沸 點256C)、二乙二醇單異丙基醚(沸點2071)、二乙 一醇單異丁基醚(沸點220°C)、二乙二醇單丁基醚(沸[In the formula (A-1) and the formula (A-2), the ring X31 and the ring X32 each independently represent an aromatic ring having 6 to 12 carbon atoms. Y31 and Y32 represent an oxygen atom or a sulfur atom. R31 and R32 represent an alkyl group having 1 to 12 carbon atoms or an aromatic group having 6 to 12 carbon atoms. The carbon atom contained in the aromatic ring, the alkyl group or the aromatic group may be substituted by an oxygen atom, a nitrogen atom, a sulfur atom or a halogen atom. The halogen atom may, for example, be a fluorine atom, a chlorine atom or a bromine atom. The aromatic ring having 6 to 12 carbon atoms may, for example, be a benzene ring, a methylbenzene ring, a dimethylbenzene ring, an ethylbenzene ring, a propylbenzene ring, a butylbenzene ring, a pentylbenzene ring, a hexylbenzene ring or a ring. Hexylbenzene ring, chlorobenzene ring, dichlorobenzene ring, bromobenzene ring, dibromobenzene-44 - 201022320 ring, phenylbenzene ring, chlorophenylbenzene ring, bromophenylbenzene ring, naphthalene ring, chloronaphthalene ring Bromophthalene ring, phenanthrene ring, chrysene ring, fluorenyl ring, benzo[a]anthracene ring, benzo[e]fluorene ring, anthracene ring and derivatives thereof. Examples of the alkyl group having 1 to 12 carbon atoms include a methyl group, an ethyl group, an η-propyl group, an isopropyl group, a η-butyl group, a methyl group, a η-propyl group, a 2-methyl-η-propyl group, and a tert- group. Butyl, η-pentyl, methyl-η-butyl, 2-methyl-η-butyl, 3-methyl-η-butyl, 1,1-dimethyl-η-propyl, 1 ,2-dimethyl-η-propyl, 2,2-dimethyl-0 η-propyl, η-hexyl, cyclohexyl, 1-chloro-η-butyl, 2-chloro-η-butyl Base, 3-chloro-η-butyl, and the like. Examples of the aromatic group having 6 to 12 carbon atoms include a phenyl group, a chlorophenyl 'dichlorophenyl group, a bromophenyl group, a dibromophenyl group, a chlorobromophenyl group, a hydroxyphenyl group, an alkoxyphenyl group, and a biphenyl group. , chlorobiphenyl, dichlorobiphenyl, bromophenyl, dibromophenyl, naphthyl, chloronaphthyl, dichloronaphthyl, bromonaphthyl, dibromonaphthyl, hydroxynaphthyl and the like. Specific examples of the compound represented by the formula (Α-1) or the formula (Α-2) include 0-dimethoxynaphthalene, diethoxynaphthalene, dipropoxynaphthalene, diisopropoxynaphthalene, and dibutyl. a dialkoxynaphthalene type dimethoxy oxime such as oxynaphthalene, diethoxy ruthenium, dipropoxy ruthenium, diisopropoxy ruthenium, dibutoxy ruthenium, dipentyl oxime, or dihexyl Oxime, methoxyethoxy oxime, methoxypropoxy oxime, methoxyisopropoxy oxime, methoxybutoxy oxime, ethoxy propoxy oxime, ethoxy isopropyl a dialkoxy quinone dimethoxy thick such as oxindole, ethoxybutoxy fluorene, propoxy oxyhydroxy fluorene, propoxy oxy fluorene, isopropoxy butyl hydrazine or the like Tetrabenzene, diethoxy fused tetraphenyl, dipropoxy fused tetraphenyl-45-201022320, diisopropoxy fused tetraphenyl, dibutoxy fused tetraphenyl, etc. , but not limited to this. The content of the polymerization initiator (C) is preferably 0.1 to 40% by mass, more preferably 1 to 3 % by mass based on the total amount of the binder resin (A) and the polymerizable compound (B). %. Further, the content of the polymerization initiation aid (C-1) is preferably from 0.01 to 50% by mass, more preferably from 0 to 40% by mass, based on the same criteria as described above. The content of the compound represented by at least one of the groups of the formula (A-1) and the formula (A-2) is 50 to 100% with respect to the content of the polymerization initiation aid (C-1). Preferably, it is preferably 60 to 100%, more preferably 65 to 100%. When the content of the compound represented by at least one of the formulas (A-1) and (A-2) is within the above range, when a coating film is formed using the curable resin composition containing the coating film, the coating film is formed. The transparency is good, so it is better. When the total amount of the polymerization initiator (C) is within the above range, the curable resin composition has high sensitivity, and the strength of the coating film or pattern formed using the above-mentioned curable resin composition, the above-mentioned coating film or pattern The smoothness in the surface tends to be good, so it is preferable. When the amount of the polymerization start aid (C-1) is within the above range, the sensitivity of the obtained curable resin composition is higher, and the productivity of the pattern formed using the above-described curable resin composition is obtained. It is better to promote the tendency. The curable resin composition of the present invention contains a solvent (D). The solvent (D) is exemplified by various organic solvents used in the field of the curable resin composition, and specific examples thereof include ethylene glycol monomethyl ether and ethylene glycol-46-201022320 monoethyl ether. Ethylene glycol monopropyl ether and ethylene glycol monoalkyl ether like ethylene glycol monobutyl ether; diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol Diethylene glycol dialkyl ethers such as methyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether; methyl cellosolve acetate, ethyl cellosolve acetate Ethylene glycol alkyl ether oxalates such as ester, ethylene glycol monobutyl ether acetate, ethylene glycol monoethyl ether acetate; propylene glycol monomethyl ether acetate, propylene glycol monoethyl Alkyl glycol alkyl ether acetates such as ether acetate, propylene glycol monopropyl ether acetate, methoxybutyl acetate, methoxypentyl acetate; propylene glycol monomethyl ether a propylene glycol monoalkyl ether such as propylene glycol monoethyl ether, propylene glycol monopropyl ether or propylene glycol monobutyl ether; propylene glycol dimethyl ether, propylene glycol diethyl ether, propylene glycol ethyl methyl Propylene glycol dialkyl ether propylene glycol methyl ether propionate, propylene glycol ethyl ether propionate, propylene glycol propyl ether propionic acid, propylene glycol dipropyl ether propylene glycol propyl methyl ether, propylene glycol ethyl propyl phthalate a propylene glycol alkyl ether propionate such as ester, propylene glycol butyl ether propionate or the like; butyl butyl alcohol, ethoxybutyl alcohol, propoxy butyl alcohol, butoxybutyl alcohol, etc. Butyl glycol monoalkyl ethers; butanediol singles such as methoxybutyl acetate, ethoxybutyl acetate, propoxybutyl acetate, butoxybutyl acetate Alkyl ether acetate-47- 201022320 Butylene glycol such as methoxybutyl propionate, ethoxybutyl propionate, propoxybutyl propionate, butoxybutyl propionate a dipropylene glycol dialkyl ether such as a monoalkyl ether propionate dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether or dipropylene glycol methyl ethyl ether; benzene, toluene, hydrazine, symmetrical trimethylbenzene, etc. Aromatic hydrocarbons; ketones such as methyl ethyl ketone, acetone, methyl amyl ketone, methyl isobutyl ketone, cyclohexanone; ethanol, propanol, butanol, Alcohols such as cyclohexanol, ethylene glycol, glycerin, etc.; methyl acetate, ethyl acetate, propyl acetate, butyl acetate, ethyl 2-hydroxypropionate, 2-hydroxy-2-methylpropane Methyl ester, ethyl 2-hydroxy-2-methylpropionate, methyl hydroxyacetate, ethyl hydroxyacetate, butyl glycolate, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, 3- Methyl hydroxypropionate, ethyl 3-hydroxypropionate, propyl 3-hydroxypropionate, butyl 3-hydroxypropionate, methyl 2-hydroxy-3-methylbutanoate, methyl methoxyacetate, Ethyl methoxyacetate propyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, propyl ethoxyacetate, butyl ethoxyacetate, C Methyloxyacetate, ethyl propoxyacetate, propyl propoxyacetate, butyl propoxyacetate, methyl butoxyacetate, ethyl butoxylate, propyl butoxyacetate, butoxy Butyl acetate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate propyl 2-methoxypropionate, butyl 2-methoxypropionate, 2-ethoxyl Methyl propionate, ethyl 2-ethoxypropionate, 2 -propyl ethoxypropionate, butyl 2-ethoxypropionate, methyl 2-butoxypropionate, 2-butoxy-48-201022320 ethyl propyl propionate, 2-butoxypropionic acid Propyl ester, butyl 2-butoxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, propyl 3-methoxypropionate, 3-methoxypropionic acid Butyl ester, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, propyl 3-ethoxypropionate, butyl 3-ethoxypropionate, 3-propoxypropionic acid Methyl ester, ethyl 3-propoxypropionate, propyl 3-propoxypropionate, butyl 3-propoxypropionate, methyl 3-butoxypropionate, 3-butoxypropionic acid An ester of ethyl ester, propyl 3-butoxypropionate or butyl 3-butoxypropionate; 环状 环状 a cyclic ether group such as tetrahydrofuran or piperane; a ring of r-butyrolactone or the like Esters and the like. Among the above solvents, the boiling point is 200 ° C or higher, preferably 200 to 300, from the viewpoints of coatability, printability, solubility, and drying property. (The ester solvent, the ether solvent, and the alcohol solvent are preferred. The vinegar solvent refers to an organic solvent having an ester bond and having no hydroxyl group. Specific examples of the ester solvent include, for example, diethylene glycol alone Ethyl ether acetate vinegar (boiling point 217t), diethylene glycol monopropyl ether acetate (232 t: ), diethylene glycol monobutyl ether acetate (boiling point 247 ° C), glycerol triacetate ( The boiling point of 260 ° C) is preferably diethylene glycol monobutyl ether acetate (boiling point 247. (:), triacetin (boiling point 26 〇t). Acid solvent means having an ether bond The organic solvent which does not have an ester bond and a hydroxyl group. Specific examples of the ether solvent include diethylene glycol butyl methyl ether (boiling point 2 1 21 ) and tripropylene glycol dimethyl ether (boiling point 2丨5).艽), diethylene glycol dimethyl ether (boiling point 216), diethylene glycol dibutyl ether (boiling point 256 ° C), triethylene glycol butyl methyl ether (boiling point 26ir), -49- 201022320 275° C), preferably diethylene glycol, triethylene glycol butyl methyl ether (boiling point tetraethyl alcohol-methyl ether (boiling point dibutyl ether (boiling point 2 5 6 t:)) 26 1〇C) The alcohol-based solvent is an organic solvent having a hydroxyl group. Specific examples of the alcohol-based solvent include ethylene glycol monohexyl ether (boiling point 208C) and ethylene glycol mono-2-ethylhexyl ether. (boiling point 229〇c), ethyl phenyl monophenyl charm (boiling point 245 °C), ethylene glycol monobenzyl ether (boiling point 256C), diethylene glycol monoisopropyl ether (boiling point 2071), diethyl diol Isobutyl ether (boiling point 220 ° C), diethylene glycol monobutyl ether (boiling

點 2 3 0 °C 二乙二醇單戊基醚、Point 2 3 0 °C diethylene glycol monopentyl ether,

點259°C )、二乙二醇單2-乙基己基醚(272t:)、二乙 二醇單苯基醚(沸點283。(:)、三乙二醇單甲基醚(沸點 249°C)、三乙二醇單丁基醚(沸點271t:)、聚乙二醇 單甲基醚(沸點295 °C)、三丙二醇單甲基醚(沸點242 °c)、二丙二醇單丙基醚(沸點212〇c)、二丙二醇單丁 基醚(沸點231°C )、丙二醇單苯基醚(沸點243。(:), 較佳可舉出乙二醇單苯基醚(沸點245 t)、乙二醇單苄 基醚(沸點256°C)、二乙二醇單戊基醚、二乙二醇單己 基醚(沸點259°C )、丙二醇單苯基醚(沸點243 °C )。 此些之溶劑(D)可各自單獨亦可2種類以上混合使 用。 本發明之硬化性樹脂組成物中,相對於黏合劑樹脂( A)、聚合性化合物(B)及溶劑(D)之合計量,溶劑( D )之量例如以質量分率以20質量%以上未滿60質量%, 201022320 較佳爲20質量%以上未滿50質量%,更佳爲25質量%以 上50質量%以下。溶劑(D)之含有量若未滿20質量%之 情況,因硬化性組成物之黏度變得過高,印刷法中之轉印 性變得拙劣。另一方面,若爲80質量%以上,因硬化性 組成物之黏度過得過低,於凹版上容易殘留硬化性組成物 ,變得難以適用於印刷法。 本發明之硬化性樹脂組成物實質上不含有顔料及染料 φ 等之著色劑。即,本發明之硬化性樹脂組成物中,相對於 組成物全體而著色劑之含量爲例如以質量分率爲未滿1質 量%,較佳爲未滿0.5質量%。 例如,本發明之硬化性樹脂組成物實質上不含有該領 域所使用之以下之著色劑。 以 Color index ( The Society of Dyers and Colourists 出版)被分類爲顏料(Pigment)之化合物,具體而言,Point 259 ° C), diethylene glycol mono 2-ethylhexyl ether (272t:), diethylene glycol monophenyl ether (boiling point 283. (:), triethylene glycol monomethyl ether (boiling point 249 ° C), triethylene glycol monobutyl ether (boiling point 271t:), polyethylene glycol monomethyl ether (boiling point 295 ° C), tripropylene glycol monomethyl ether (boiling point 242 ° C), dipropylene glycol monopropyl Ether (boiling point 212〇c), dipropylene glycol monobutyl ether (boiling point 231 ° C), propylene glycol monophenyl ether (boiling point 243. (:), preferably ethylene glycol monophenyl ether (boiling point 245 t) ), ethylene glycol monobenzyl ether (boiling point 256 ° C), diethylene glycol monopentyl ether, diethylene glycol monohexyl ether (boiling point 259 ° C), propylene glycol monophenyl ether (boiling point 243 ° C) The solvent (D) may be used alone or in combination of two or more kinds. The curable resin composition of the present invention is relative to the binder resin (A), the polymerizable compound (B), and the solvent (D). In the total amount, the amount of the solvent (D) is, for example, 20% by mass or more and less than 60% by mass in the mass fraction, and preferably 20% by mass or more and less than 50% by mass in 201022320, more preferably 25% by mass or more and 50% by mass. When the content of the solvent (D) is less than 20% by mass, the viscosity of the curable composition is too high, and the transfer property in the printing method is deteriorated. On the other hand, if it is 80% by mass When the viscosity of the curable composition is too low, the curable composition is likely to remain on the intaglio plate, and it is difficult to apply it to the printing method. The curable resin composition of the present invention does not substantially contain a pigment or a dye φ or the like. In the curable resin composition of the present invention, the content of the coloring agent is, for example, less than 1% by mass, preferably less than 0.5% by mass, based on the total mass of the composition. The curable resin composition of the present invention does not substantially contain the following coloring agents used in the field. The compound classified as a pigment by Color Index (published by The Society of Dyers and Colourists), specifically,

C.I. Pigment Yellow 1、 、20、 24、 31、 53、 83' 86 125、 128 ' 137、 138、 139、 3 ' 12 ' 13 、14、 1 5、 16 ' 17 、93、 94、 109、 1 10、 117、 147、 148、 150、 1 5 3、 154、 166、173、194、214等之黃色顔料; C.I. Pigment Orange 13、31、36、38、40、42、43、 51、55、59、61、64、65' 71、73 等之橙色之顔料; C.I. Pigment Red 9、97、105、122、123、144、149 ' 166、 168、 176、 177、 180、 192、 209、 215、 216、 224 、242、254、25 5、264、265 等之紅色顔料; C. I. Pigment Blue 15、15: 3、15: 4、15: 6、60 等 -51 - 201022320 之藍色顔料; C . I. Pigment Vi ο 1 et 1、1 9、2 3、29、3 2、3 6、3 8 等 之紫色顔料; C.I. Pigment Green 7、36 等之綠色顔料; C.I. Pigment Brown 23、25 等之棕色顔料; C.I. Pigment Black 1、7 等之黑色顔料。 本發明之硬化性樹脂組成物,依據需要可倂用充塡劑 、其他高分子化合物、均染劑、密著促進劑、抗氧化劑、 紫外線吸收劑、光安定劑、防凝集材、鏈轉移劑等之添加 劑。 充塡劑具體可舉出玻璃、二氧化矽、氧化鋁等。 其他高分子化合物具體可舉出環氧樹脂、馬來醯亞胺 樹脂等之硬化性樹脂或聚乙烯醇、聚丙烯酸、聚乙二醇單 烷基醚、聚氟烷基丙烯酸酯、聚酯、聚胺基甲酸酯等之熱 可塑性樹脂等。 均染劑可使用市售之界面活性劑,例如可舉出聚矽氧 系、氟系、酯系、陽離子系、陰離子系、非離子系、兩性 等之界面活性劑等,其可各自單獨亦可2種以上組合使用 。前述之界面活性劑可舉出例如聚氧乙烯烷基醚類、聚氧 乙烯烷基苯基醚類、聚乙二醇二酯類、山梨醇酐脂肪酸酯 類、脂肪酸變性聚酯類、3級胺變性聚胺基甲酸酯類、聚 乙烯胺類等以外,尙有商品名爲KP(信越化學工業(股 )製)、Polyflow (共榮社化學(股)製)、Eftop (三菱 Material 電子化成(股))、Megafac (DIC (股)製) -52- 201022320 、Fluorad (住友 3M (股)製)、Asahiguide (旭硝子( 股)製)、Surflon ( AGC SEIMI C Η Ε ΜIC A L (股)製) 、Solsperse ( Zeneca (股)製)、EFKA ( CIBA公司製) 、Ajisper PB821 (味之素(股)製)等。 密著促進劑以矽烷系化合物爲佳,具體可舉出乙烯三 甲氧基矽烷、乙烯三乙氧基矽烷、乙烯參(2-甲氧基乙氧 基)矽烷、N- ( 2-胺基乙基)-3-胺基丙基甲基二甲氧基 _ 矽烷、N-( 2-胺基乙基)-3-胺基丙基三甲氧基矽烷、3-胺 基丙基三乙氧基矽烷、3-環氧丙氧基丙基三甲氧基矽烷、 3-環氧丙氧基丙基甲基二甲氧基矽烷、2- (3,4-環氧基環 己基)乙基三甲氧基矽烷、3-氯丙基甲基二甲氧基矽烷、 3-氯丙基三甲氧基矽烷、3-甲基丙烯醯氧基丙基三甲氧基 矽烷、3-锍基丙基三甲氧基矽烷等。 抗氧化劑具體可舉出2-tert-丁基-6- ( 3-tert-丁基-2-羥基-5-甲基苄基)-4-甲基苯基丙烯酸酯、2-[1-(2-羥基-φ 3,5-二-tert-戊基苯基)乙基]-4,6-二-tert-戊基苯基丙烯酸 酯、6-[3- ( 3-tert-丁基-4-羥基-5 -甲基苯基)丙氧基]-2,4,8,10-四-tert-丁基二苯并[d、f][.l,3,2] dioxaphosphepine 、3,9-雙[2- { 3- ( 3-tert-丁基-4-羥基-5-甲基苯基)丙醯 基氧基} -1,1-二甲基乙基]-2,4,8,10-四氧螺環[5.5]十一烷 、2,2’-亞甲基雙(6-tert-丁基-4-甲基酚)、4,4’-亞丁基 雙(6-tert-丁基-3 -甲基酚)' 4,4’-硫代雙(2-tert-丁基-5-甲基酚)、2,2’-硫代雙(6-tert-丁基-4-甲基酚)、二月 桂基3,3’-硫代二丙酸酯、二肉豆蔻基3,3’-硫代二丙酸酯 -53- 201022320 、貳十八烷基3,3’·硫代二丙酸酯、季戊四醇肆(3_月桂 基硫代丙酸酯)、1,3,5-參(3,5·二- tert-丁基-4-經基节基 )-1,3,5-三嗪-2,4,6 ( 1 Η ,3 Η,5 Η )-三酮、 3,3,,3’’,5,5’,5’,-六-1以1-丁基-3,&’,3’’-(對稱三甲苯- 2.4.6- 三基)三-Ρ-甲酚、季戊四醇肆[3-(3,5-二-tert-丁 基-4-羥基苯基)丙酸酯]、2,6-二-tert-丁基-4·甲基酚等。 紫外線吸收劑具體可舉出、2- (2-羥基-5-tert-丁基苯 基)-2 H-苯並三唑、辛基- 3-[3-tert-丁基-4-羥基-5- ( 5-氯-2 H-苯並三唑-2-基)苯基]丙酸酯、2-[4-[ (2-羥基- 3-十二基氧基丙基)氧基]-2-羥基苯基]-4,6-雙(2,4-二甲基 苯基)-1,3,5-三嗪、2-[4-[ ( 2-羥基-3- ( 2’-乙基)己基) 氧基]-2-羥基苯基]-4,6-雙(2,4-二甲基苯基)-1,3,5-三嗪 、2,4-雙(2-羥基-4-丁基氧基苯基)-6- ( 2,4-雙-丁基氧 基苯基)-1,3,5-三嗪、2- (2-羥基-4-[1-辛基氧基羰基乙 氧基]苯基)-4,6-雙(4-苯基苯基)-1,3,5-三嗪、2- (2 H-苯並三唑-2-基)-4,6-雙(1-甲基-1-苯基乙基)酚、2-(2 H-苯並三唑-2-基)-6-(1-甲基-1-苯基乙基)-4-( 1,1,3,3-四甲基丁基)酚、2-(3-16以-丁基-2-羥基-5-甲基 苯基)-5-氯苯並三唑或烷氧基二苯甲酮等。 光安定劑具體可舉出由琥珀酸與(4_羥基-2,2,6,6-四 甲基哌啶-1-基)乙醇構成之高分子'\,\’,1^’’,]^’’’-肆( 4.6- 雙(丁基-(N·甲基-2,2,6,6-四甲基哌啶-4-基)胺基 )三嗪-2-基)-4,7-二吖癸烷-1,1〇_二胺、癸二酸與雙( 2.2.6.6- 四甲基-1-(辛基氧基)-4-哌啶基)酯與1,1-二甲 201022320 基乙基氫過氧化物之反應物、雙(12,2,6,6-戊基甲基-4-哌啶基)-[[3,5-雙(1,1-二甲基乙基)_4_羥基苯基]甲基] 丁基丙二酸酯、2,4-雙[N- 丁基·Ν·(丨·環己基氧基-2,2,6,6-四甲 基哌啶 -4-基) 胺基]-6- ( 2-羥基 乙基胺 ) _ 1,3,5-三嗪、雙(ι,2,2,6,6-五甲基-4-哌啶基)癸二酸酯或 甲基(1,2,2,6,6-五甲基-4-峨Π定基)癸二酸醋等。 防凝集材可舉出聚丙烯酸鈉等。 φ 且’鏈轉移劑可舉出十二基硫醇、2,4-二苯基_4·甲 基-1-戊稀等。 本發明之硬化性樹脂組成物,乾燥性爲低,不易發生 溶劑揮發所成之乾燥異物,既使在高固形分下其保存安定 性亦爲良好,特別適合於印刷法。 作爲前述之印刷法,可使適用於該領域中既知之印刷 法’例如,噴墨印刷法 '橡皮凸板印刷法、凹板印刷法、 平板印刷法、網板印刷法等。 Q 又,將本發明之硬化性樹脂組成物塡充於光徑長度爲 1cm之石英晶胞,若使用分光光度計在測定波長 400〜700nm之條件下測定透過率,其平均透過率爲70%以 上,較佳爲75 %以上。藉此,可形成透明之圖型或塗膜。 本發明之硬化性樹脂組成物之硬化條件可依據組成物 之各成分之種類、含有量等適宜選擇,通常爲使用紫外線 等之光硬化、使用烤箱等之加熱硬化。 又,對本發明之硬化性樹脂組成物在加熱硬化(例如 ,150〜2 50 °C、0.1〜3小時)後之3/zm之厚度之塗膜,若 -55- 201022320 使用分光光度計在測定波長400~700nm之條件下測定透 過率,透過率爲90%以上,較佳爲95 %以上。藉此,可形 成透明之圖型或塗膜。 本發明之硬化性樹脂組成物可例如如下般進行,可在 已形成玻璃基板或薄膜基板、濾色器或驅動回路的基材上 ’藉由印刷法進行塗佈 '進行光硬化或加熱硬化,形成塗 膜或圖型。 又,將此硬化性樹脂組成物在基板(通常爲玻璃)或 預先形成之由硬化性樹脂組成物之固形分構成之層上藉由 印刷法進行塗佈,由經塗佈之硬化性樹脂組成物層藉由進 行預烘烤去除溶劑等之揮發成分,得到平滑之未硬化塗膜 (包含圖型)。此時之未硬化塗膜之厚度爲約1〜6/zm。 亦可對如此般所得之未硬化塗膜照射由水銀燈或發光二極 體所產生之紫外線。 又,圖型形成中,其線幅可依據凹版尺寸適宜控制。 更進一步依據需要,可施予在150~230°C下10~180 分之後烘烤。 使用本發明之硬化性樹脂組成物,經過如以上般之各 步驟,可在基板上或濾色器基板上形成塗膜或圖型。此塗 膜或圖型可用作爲液晶顯示裝置所使用之光刻型間隔器或 液晶配向用突起、隔壁、保護層。 藉由將如此般所得之塗膜或圖型嵌入液晶顯示裝置等 之顯示裝置,可高產率地製造優良品質之顯示裝置。 -56- 201022320 實施例 以下’藉由實施例詳細說明本發明,但本發明並非係 受此些實施例所限定者。例中’含有量乃至使用量所表示 之%及份,若無特別限定則係爲質量基準。 [合成例1 ] 對具備有還流冷卻器、滴下漏斗及攪拌機之〗L之燒 φ 瓶内將氮以0.02 L/分進行流通使其成爲氮環境,放入 3 -甲氧基丁基乙酸酯305質量份,—邊攪拌一邊加熱至 70 °C。其次’將甲基丙稀酸55質量份、3,4 -環氧基三環 [5.2.1.02·6]癸基丙烯酸酯(式(1_1)所表示之化合物及式 (Π-1)所表示化合物以莫耳比50: 50混合)175質量份 及N -環己基馬來醯亞胺70質量份溶解於3 -甲氧基丁基乙 酸酯140質量份調製成溶液,將該溶解液使用滴入泵經時 4小時滴下於保溫在70 °C之燒瓶内。另一方面,將聚合開 φ 始劑2,2’-偶氮雙(2,4-二甲基戊腈)45質量份溶解於3-甲氧基丁基乙酸酯22 5質量份之溶液使用其它的滴入泵經 時5小時滴入於燒瓶内。聚合開始劑之溶液的滴下結束後 ,保持4小時、70 °C中,其後冷卻至室溫,得到固形分 32.6質量%、酸價34.3mg-KOH/g之共聚物的樹脂溶液 。所得之樹脂Aa之重量平均分子量Mw爲9,000、分散度 爲2.01。對此樹脂溶液245質量份放入二乙二醇η-丁基 醚乙酸酯45質量份,使用旋轉蒸發器在減壓下90°C中將 3-甲氧基丁基乙酸酯濃縮餾除,得到固形分64.0質量%之 -57- 201022320 樹脂Aa之二乙二醇η-丁基醚乙酸萨 ^ ^ 酸Θ日溶液。酸價、重量平 均分子量Mw、及分散度與濃縮前相同。 〇 h2c=ch-c—0CI Pigment Yellow 1, 20, 24, 31, 53, 83' 86 125, 128 ' 137, 138, 139, 3 ' 12 ' 13 , 14, 1 5, 16 ' 17 , 93 , 94 , 109 , 1 10 Yellow pigments of 117, 147, 148, 150, 1 5 3, 154, 166, 173, 194, 214, etc.; CI Pigment Orange 13, 31, 36, 38, 40, 42, 43, 51, 55, 59, 61, 64, 65' 71, 73, etc. orange pigment; CI Pigment Red 9, 97, 105, 122, 123, 144, 149 ' 166, 168, 176, 177, 180, 192, 209, 215, 216, Red pigments of 224, 242, 254, 25 5, 264, 265; CI Pigment Blue 15, 15: 3, 15: 4, 15: 6, 60, etc. -51 - 201022320 blue pigment; C. I. Pigment Vi ο 1 et 1, 19, 2 3, 29, 3 2, 3 6 , 3 8 and other purple pigments; CI Pigment Green 7, 36, etc. green pigment; CI Pigment Brown 23, 25, etc. brown pigment; CI Black pigments such as Pigment Black 1, 7, etc. The curable resin composition of the present invention may be used as a filler, other polymer compound, leveling agent, adhesion promoter, antioxidant, ultraviolet absorber, light stabilizer, anti-agglomerate, chain transfer agent, etc., as needed. Additives such as. Specific examples of the hydrating agent include glass, cerium oxide, and aluminum oxide. Specific examples of the other polymer compound include curable resins such as epoxy resins and maleic imine resins, polyvinyl alcohol, polyacrylic acid, polyethylene glycol monoalkyl ether, polyfluoroalkyl acrylate, and polyester. A thermoplastic resin such as a polyurethane or the like. A commercially available surfactant can be used as the leveling agent, and examples thereof include a surfactant such as a polyfluorene-based, a fluorine-based, an ester-based, a cationic-based, an anionic-based, nonionic-based or amphoteric surfactant, and the like. It can be used in combination of 2 or more types. Examples of the surfactant include polyoxyethylene alkyl ethers, polyoxyethylene alkylphenyl ethers, polyethylene glycol diesters, sorbitan fatty acid esters, fatty acid modified polyesters, and grade 3 In addition to amine-denatured polyurethanes and polyvinylamines, the trade name is KP (manufactured by Shin-Etsu Chemical Co., Ltd.), Polyflow (manufactured by Kyoeisha Chemical Co., Ltd.), and Eftop (Mitsubishi Material Electronicization). (share)), Megafac (DIC system) -52- 201022320, Fluorad (Sumitomo 3M (share) system), Asahiguide (Asahi (manufactured by the company), Surfllon (AGC SEIMI C Η Μ Μ IC AL (share) system ), Solsperse (Zeneca), EFKA (made by CIBA), Ajisper PB821 (Ajinomoto). The adhesion promoter is preferably a decane-based compound, and specific examples thereof include ethylene trimethoxy decane, ethylene triethoxy decane, ethylene ginseng (2-methoxyethoxy) decane, and N-(2-amino group B. 3-aminopropylmethyldimethoxy-decane, N-(2-aminoethyl)-3-aminopropyltrimethoxydecane, 3-aminopropyltriethoxylate Decane, 3-glycidoxypropyltrimethoxydecane, 3-glycidoxypropylmethyldimethoxydecane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxy Baseline, 3-chloropropylmethyldimethoxydecane, 3-chloropropyltrimethoxydecane, 3-methylpropenyloxypropyltrimethoxydecane, 3-mercaptopropyltrimethoxy Decane and so on. Specific examples of the antioxidant include 2-tert-butyl-6-(3-tert-butyl-2-hydroxy-5-methylbenzyl)-4-methylphenyl acrylate, 2-[1-( 2-hydroxy-φ 3,5-di-tert-pentylphenyl)ethyl]-4,6-di-tert-pentylphenyl acrylate, 6-[3-( 3-tert-butyl- 4-hydroxy-5-methylphenyl)propoxy]-2,4,8,10-tetra-tert-butyldibenzo[d,f][.l,3,2] dioxaphosphepine, 3, 9-bis[2- { 3- ( 3-tert-butyl-4-hydroxy-5-methylphenyl)propanyloxy} -1,1-dimethylethyl]-2,4, 8,10-Tetraoxacyclo[5.5]undecane, 2,2'-methylenebis(6-tert-butyl-4-methylphenol), 4,4'-butylene bis (6- Tert-butyl-3-methylphenol) '4,4'-thiobis(2-tert-butyl-5-methylphenol), 2,2'-thiobis(6-tert-butyl -4-methylphenol), dilauryl 3,3'-thiodipropionate, dimyristyl 3,3'-thiodipropionate-53-201022320, octadecyl 3, 3'·thiodipropionate, pentaerythritol bismuth (3_lauryl thiopropionate), 1,3,5-gin (3,5·di-tert-butyl-4-alkyl) -1,3,5-triazine-2,4,6 ( 1 Η ,3 Η,5 Η )-trione, 3,3,,3 ',5,5',5',-6-1 to 1-butyl-3,&',3''-(symmetric trimethyl- 2.4.6-triyl)tris-cresol, pentaerythritol [3-(3,5-Di-tert-butyl-4-hydroxyphenyl)propionate], 2,6-di-tert-butyl-4-methylphenol, and the like. Specific examples of the ultraviolet absorber include 2-(2-hydroxy-5-tert-butylphenyl)-2H-benzotriazole, octyl-3-[3-tert-butyl-4-hydroxy- 5-(5-Chloro-2H-benzotriazol-2-yl)phenyl]propionate, 2-[4-[(2-hydroxy-3-dodecyloxypropyl)oxy] -2-hydroxyphenyl]-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine, 2-[4-[(2-hydroxy-3-( 2') -ethyl)hexyl)oxy]-2-hydroxyphenyl]-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine, 2,4-bis (2 -hydroxy-4-butyloxyphenyl)-6-(2,4-bis-butyloxyphenyl)-1,3,5-triazine, 2-(2-hydroxy-4-[1 -octyloxycarbonylethoxy]phenyl)-4,6-bis(4-phenylphenyl)-1,3,5-triazine, 2-(2H-benzotriazole-2- -4,6-bis(1-methyl-1-phenylethyl)phenol, 2-(2H-benzotriazol-2-yl)-6-(1-methyl-1-benzene Benzyl)-4-(1,3,3-tetramethylbutyl)phenol, 2-(3-16-butyl-2-hydroxy-5-methylphenyl)-5-chloro Benzotriazole or alkoxybenzophenone. The light stabilizer may specifically be a polymer '\, \', 1^'' composed of succinic acid and (4-hydroxy-2,2,6,6-tetramethylpiperidin-1-yl)ethanol. ]^'''-肆(4.6-bis(butyl-(N.methyl-2,2,6,6-tetramethylpiperidin-4-yl)amino)triazin-2-yl)- 4,7-dioxane-1,1〇-diamine, sebacic acid and bis(2.2.6.6-tetramethyl-1-(octyloxy)-4-piperidyl) ester, 1-dimethyl 201022320 base ethyl hydroperoxide reactant, bis(12,2,6,6-pentylmethyl-4-piperidinyl)-[[3,5-bis(1,1- Dimethylethyl)_4_hydroxyphenyl]methyl]butylmalonate, 2,4-bis[N-butyl·Ν·(丨·cyclohexyloxy-2,2,6,6 -tetramethylpiperidin-4-yl)amino]-6-(2-hydroxyethylamine) _ 1,3,5-triazine, bis(ι,2,2,6,6-pentamethyl 4-piperidinyl) sebacate or methyl (1,2,2,6,6-pentamethyl-4-decyl) azelaic acid vinegar and the like. The anti-agglomerate aggregate may, for example, be sodium polyacrylate. Examples of the φ and 'chain transfer agent include dodecyl mercaptan and 2,4-diphenyl-4-methyl-1-pentene. The curable resin composition of the present invention has a low drying property and is less likely to cause dry foreign matter formed by solvent volatilization, and is excellent in storage stability even under high solid content, and is particularly suitable for a printing method. As the printing method described above, it can be applied to a printing method known in the art, for example, an inkjet printing method, a rubber plate printing method, a gravure printing method, a lithography method, a screen printing method, or the like. Further, the curable resin composition of the present invention is filled with a quartz cell having an optical path length of 1 cm, and the transmittance is measured by using a spectrophotometer at a measurement wavelength of 400 to 700 nm, and the average transmittance is 70%. The above is preferably 75% or more. Thereby, a transparent pattern or a coating film can be formed. The curing conditions of the curable resin composition of the present invention can be appropriately selected depending on the type and content of each component of the composition, and are usually cured by light curing using an ultraviolet ray or the like, and heat curing using an oven or the like. Further, the coating film having a thickness of 3/zm after heat-curing (for example, 150 to 2 50 ° C, 0.1 to 3 hours) of the curable resin composition of the present invention is measured by a spectrophotometer using -55-201022320. The transmittance is measured under the conditions of a wavelength of 400 to 700 nm, and the transmittance is 90% or more, preferably 95% or more. Thereby, a transparent pattern or a coating film can be formed. The curable resin composition of the present invention can be carried out, for example, as follows, and can be photocured or heat-cured by "coating by a printing method" on a substrate on which a glass substrate or a film substrate, a color filter or a drive circuit has been formed. Form a coating film or pattern. Further, the curable resin composition is applied by a printing method on a substrate (usually glass) or a layer formed of a solid component of a curable resin composition which is formed in advance, and is composed of a coated curable resin. The material layer is subjected to prebaking to remove volatile components such as a solvent to obtain a smooth unhardened coating film (including a pattern). The thickness of the uncured coating film at this time is about 1 to 6/zm. The uncured coating film thus obtained may also be irradiated with ultraviolet rays generated by a mercury lamp or a light-emitting diode. Moreover, in the formation of the pattern, the line width can be appropriately controlled according to the gravure size. Further, depending on the need, it can be applied after baking at 150 to 230 ° C for 10 to 180 minutes. Using the curable resin composition of the present invention, a coating film or pattern can be formed on the substrate or on the color filter substrate through the above steps. This coating film or pattern can be used as a lithographic spacer or a liquid crystal alignment protrusion, a partition wall, and a protective layer used in a liquid crystal display device. By embedding the coating film or pattern thus obtained in a display device such as a liquid crystal display device, it is possible to manufacture a display device of excellent quality at a high yield. -56-201022320 EXAMPLES Hereinafter, the present invention will be described in detail by way of examples, but the invention should not be construed as limited. In the examples, the % and the parts indicated by the content and the amount used are based on the mass basis unless otherwise specified. [Synthesis Example 1] In a φ bottle containing a reflow cooler, a dropping funnel, and a stirrer, nitrogen was circulated at 0.02 L/min to form a nitrogen atmosphere, and 3-methoxybutylacetic acid was placed therein. 305 parts by mass of the ester, heated to 70 ° C while stirring. Next, '55 parts by weight of methyl acrylate, 3,4-epoxytricyclo[5.2.1.02·6]decyl acrylate (the compound represented by the formula (1_1) and the formula (Π-1)) The compound is mixed with 175 parts by mass of a molar ratio of 50:50 and 70 parts by mass of N-cyclohexylmaleimine in 140 parts by mass of 3-methoxybutyl acetate to prepare a solution, and the solution is used. The dropwise addition pump was dropped in a flask maintained at 70 ° C for 4 hours. On the other hand, 45 parts by mass of a polymerization initiator 2,2'-azobis(2,4-dimethylvaleronitrile) is dissolved in a solution of 22 parts by mass of 3-methoxybutyl acetate. It was dropped into the flask over 5 hours using another dropping pump. After the completion of the dropwise addition of the solution of the polymerization initiator, the mixture was kept at 4 hours and 70 ° C, and then cooled to room temperature to obtain a resin solution of a copolymer having a solid content of 32.6 mass% and an acid value of 34.3 mg-KOH/g. The obtained resin Aa had a weight average molecular weight Mw of 9,000 and a degree of dispersion of 2.01. To 245 parts by mass of the resin solution, 45 parts by mass of diethylene glycol η-butyl ether acetate was placed, and 3-methoxybutyl acetate was concentrated by distillation using a rotary evaporator at 90 ° C under reduced pressure. In addition, a solid solution of 64.0% by mass of -57-201022320 of a resin Aa diethylene glycol η-butyl ether acetate was obtained. The acid value, the weight average molecular weight Mw, and the degree of dispersion are the same as those before concentration. 〇 h2c=ch-c—0

(Μ)(Μ)

[合成例2][Synthesis Example 2]

對具備有還流冷卻器、滴下漏斗及攪拌機之丨L之燒 瓶内將氮以0.02 L/分進行流通使其成爲氮環境,放入 3-甲氧基丁基乙酸醋3 05質量份,—邊攪拌一邊加熱至 70C。其次’將甲基丙烯酸60質量份、3 4_環氧基三環 ^^.(^'”癸基丙烯酸酯:式^-^所表示之化合物及式 (ΙΙ-1)所表不之化合物以莫耳比50: 5〇混合)240質量 份及溶解於3-甲氧基丁基乙酸酯14〇質量份調製成溶液 ’將該溶解液使用滴下漏斗經時4小時,滴入於保溫在 70 °C中之燒瓶内。另一方面’將聚合開始劑2,2’_偶氮雙 (2,4 -二甲基戊腈)45質量份溶解於3_甲氧基丁基乙酸酯 225質量份之溶液使用其他的滴下漏斗經時4小時滴入於 燒瓶内。聚合開始劑之溶液之滴入結束後,保持4小時、 7〇°C中’其後冷卻至室溫,得到固形分32.3質量%、酸價 3 5.6mg-KOH/ g之共聚物的樹脂溶液。所得之樹脂Ab之 重量平均分子量Mw爲9,100,分散度爲2.02。對此樹脂 溶液245質量份加入二乙二醇n-丁基醚乙酸酯45質量份 ,使用旋轉蒸發器在減壓下90 °C中將3 -甲氧基丁基乙酸 酯濃縮餾除,得到固形分6 4.0質量%之樹脂Ab的二乙::: -58- 201022320 醇η-丁基醚乙酸酯溶液。酸價、重量平均分子量Mw、及 分散度與濃縮前相同。 (分子量之測定) 關於樹脂Aa及Ab之重量平均分子量(Mw)及數平 均分子量(Μη )的測定係使用GPC法在以下的條件下進 行。 φ 裝置:Κ2479 ((股)島津製作所製)In a flask equipped with a reflow cooler, a dropping funnel, and a stirrer, nitrogen was circulated at 0.02 L/min to form a nitrogen atmosphere, and 3 parts by mass of 3-methoxybutylacetic acid vinegar was added thereto. Heat to 70C while stirring. Next, '60 parts by mass of methacrylic acid, 3 4_epoxytricyclo^^.(^'" mercapto acrylate: a compound represented by the formula: -^ and a compound represented by the formula (ΙΙ-1) 240 parts by mass of a molar ratio of 50:5 ) and dissolved in 14 parts by mass of 3-methoxybutyl acetate to prepare a solution. The solution was dropped into a funnel for 4 hours, and then dropped into the heat preservation solution. In a flask at 70 ° C. On the other hand, 'polymerization initiator 2,2'-azobis(2,4-dimethylvaleronitrile) 45 parts by mass was dissolved in 3-methoxybutylacetic acid A solution of 225 parts by mass of the ester was dropped into the flask over 4 hours using another dropping funnel, and after the completion of the dropwise addition of the solution of the polymerization initiator, it was kept for 4 hours, at 7 ° C, and then cooled to room temperature to obtain A resin solution of a copolymer having a solid content of 32.3 mass% and an acid value of 3 5.6 mg-KOH/g. The obtained resin Ab has a weight average molecular weight Mw of 9,100 and a degree of dispersion of 2.02. 245 parts by mass of the resin solution is added to the second solution. 45 parts by mass of alcohol n-butyl ether acetate, and concentrated-concentrating 3-methoxybutyl acetate at 90 ° C under reduced pressure using a rotary evaporator to obtain a solid 6: 4.0% by mass of resin Ab of diethyl::: -58- 201022320 Alcohol η-butyl ether acetate solution. The acid value, weight average molecular weight Mw, and dispersion are the same as before concentration. (Measurement of molecular weight) The measurement of the weight average molecular weight (Mw) and the number average molecular weight (Μη) of the resins Aa and Ab was carried out under the following conditions using the GPC method. φ Device: Κ2479 (manufactured by Shimadzu Corporation)

管柱:SHIMADZU Shim-pack GPC-80MColumn: SHIMADZU Shim-pack GPC-80M

管柱溫度:40°C 溶劑:THF (四氫呋喃)Column temperature: 40 ° C Solvent: THF (tetrahydrofuran)

流速:1.0ml /min 檢驗器;RI 將上述所得之以聚乙烯換算之重量平均分子量及數平 均分子量之比作爲分散度(Mw/ Μη )。 參 [實施例1] 對含有合成例1所得之樹脂Aa的樹脂溶液94份(固 形分換算60份)混合二季戊四醇六丙烯酸酯(日本化藥 (股)製 KAYARAD DPHA) 40 份、2-甲基-2-嗎啉基-1-(4-甲基磺醯基)丙烷-1-酮1份、二乙二醇n-丁基醚乙 酸酯34份而得到硬化性樹脂組成物1。 其次,使硬化性樹脂組成物1如以下般進行而形成圖 型。參考圖1進行說明此方法。 -59- 201022320 首先,由供給裝置(1 ),將硬化性樹脂組成物1(2 )滴入設置於實驗印刷機之凹版(3)上(步驟a)。使 滴入之硬化性樹脂組成物1以供給刀(4 ) 一邊均平,一 邊以刮墨刀(5 )將殘餘之硬化性樹脂組成物1刮取(步 驟b)。其次,使轉印薄片(6)裝著於外周面之轉印筒 體(7)在凹版(3)上轉動,將硬化性樹脂組成物1轉印 於轉印薄片(6)面(步驟c)。其次,將轉印薄片(6) 面之硬化性樹脂組成物1轉印於基材(8 )面(步驟d ) 〇 轉印於基材(8 )後,進行在l〇〇°C / 10分鐘乾燥、 曝光100mJ/cm2 ( I線)、220°C / 20分加熱硬化,得到 圖型1。 [實施例2] 於實施例1中,除了省略曝光步驟以外,進行與實施 例1同樣之操作,由硬化性樹脂組成物1得到圖型2。 [實施例3] 以如表1所示之組成,與實施例1相同樣地進行,得 到硬化性樹脂組成物2及圖型3。 [實施例4] 以如表1所示之組成,與實施例1相同様地進行,得 到硬化性樹脂組成物3及圖型4。 -60- 201022320 [實施例5] 以如表1所示之組成’與實施例1相同樣地進行,得 到硬化性樹脂組成物4及圖型5。 [比較例1 ] 以如表1所示之組成,與實施例1相同様地進行,得 ^ 到硬化性樹脂組成物5。硬化性樹脂組成物5在與實施例 1同樣地使用印刷法之情況時,因凹版上殘留大量硬化,丨生 組成物,而無法形成圖型。 對如上述般所得之硬化性樹脂組成物1〜5及圖型!〜6 ,進行以下之評價。其結果如表1所示。 <組成物之平均透過率> 關於各硬化性樹脂組成物,使用紫外線可視近紅外& φ 光光度計(V-650;日本分光(股)製)(石英晶胞、光徑 長度;lcm),測定在400~700nm中之平均透過率(〇/0) <膜之平均透過率> 使用各硬化性樹脂組成物,使硬化後之膜厚成爲3/z m,如以下般進行製作硬化膜。 將硬化性樹脂組成物以二乙二醇N-丁基醚乙酸酯使 其成爲固形分20質量%進行稀釋。以旋轉塗佈法使硬化 • 61 - 201022320 後膜厚成爲3 " m進行塗佈,1 00°C x 1 〇分預烘烤後、在 220°Cx20分下加熱硬化。 關於所得之各硬化膜,使用顯微分光測光裝置(OSP-SP200;OLYMPUS公司製),測定4 0 0〜7 0 0 nm中之平均透 過率(% )。 透過率變高則係指吸收變小。 <圖型之形狀〉 將各圖型之形狀以三次元非接觸表面形狀測量系統( Micromap MM527N (股)菱化系統製)進彳了測量。 [表1] 實施 例1 實施 例2 實施 例3 實施 例4 實施 例5 比較 例1 樹脂組成物 1 1 2 3 4 5 黏合劑樹脂( A) 樹脂Aa (僅固形分)(份) 60 60 60 0 0 60 樹月旨Ab (僅固形分)(份) 0 0 0 60 60 0 聚合性化合物 (B) 二季戊四醇六丙嫌酸酯(日本化藥( 股)製 KAYARADDPHA)(份) 40 40 40 40 40 40 聚合開始劑 (C) 2-甲基-2-嗎琳基-1- (4-甲基硫烷 基苯基)丙烷-1-酮(CibaJapan ( 股)公司製IRGACURE907)(份) 1 1 1 1 1 1 溶劑 (D) 二乙二醇η-丁基醚乙酸酯 (沸點247°C)(份) 34 34 101 34 101 404 溶劑量(質量%)※ 25 25 50 25 50 80 組成物在波長400〜700nm下之平均透過率(%) 79.2 79.0 85.6 79.0 85.3 94.0 膜3 // m在波長400〜700nm下之平均透過率(%) 99.6 99.5 99.6 99.5 99.5 99.6 圖型之形狀 半球 半球 半球 半球 半球 - X 100 ※ 溶劑量(質量%)= _溶劑(D)_ 黏合劑樹脂(A)+聚合性化合物(B)+溶劑(D) -62- 201022320 由如表1所示之實施例1〜5之結果,得知含有所定量 之溶劑的本發明之硬化性樹脂組成物,使用印刷法,可形 成高透過率之塗膜及圖型。另一方面,比較例1並無法使 用印刷法。 產業上之可利用性 本發明之硬化性樹脂組成物使用印刷法可形成透過率 φ 優良之塗膜及圖型。因此,可適宜用於用以配合覆蓋塗層、 光刻型間隔器、絶緣膜、液晶配向控制用突起、著色圖型之 膜厚的塗膜層等、顯示裝置所用之塗膜或圖型之形成。 【圖式簡單說明】 [圖1]表示使用印刷法由樹脂組成物形成圖型之方法° 【主要元件符號說明】 . 1 :供給裝置 2 :樹脂組成物 3 :凹版 4:供給刀(supply blade) 5:刮墨刀(scraping blade) 6 :轉印薄片 7 :轉印胴 8 :基材 -63-Flow rate: 1.0 ml / min Tester; RI The ratio of the weight average molecular weight and the number average molecular weight in terms of polyethylene obtained above was defined as the degree of dispersion (Mw / Μη). [Example 1] 94 parts of a resin solution containing the resin Aa obtained in Synthesis Example 1 (60 parts in solid content) mixed with dipentaerythritol hexaacrylate (KAYARAD DPHA manufactured by Nippon Kayaku Co., Ltd.) 40 parts, 2-A One part of benzyl-2-morpholinyl-1-(4-methylsulfonyl)propan-1-one and 34 parts of diethylene glycol n-butyl ether acetate were used to obtain a curable resin composition 1. Next, the curable resin composition 1 is formed as follows to form a pattern. This method will be described with reference to FIG. 1. -59- 201022320 First, the curable resin composition 1 (2) is dropped from the supply device (1) onto the intaglio plate (3) of the experimental printer (step a). The curable resin composition 1 to be dropped is leveled on the side of the supply blade (4), and the remaining curable resin composition 1 is scraped off by a doctor blade (5) (step b). Next, the transfer cylinder (7) on which the transfer sheet (6) is attached to the outer peripheral surface is rotated on the intaglio plate (3), and the curable resin composition 1 is transferred onto the transfer sheet (6) surface (step c ). Next, the curable resin composition 1 on the surface of the transfer sheet (6) is transferred onto the surface of the substrate (8) (step d), and transferred to the substrate (8), and then carried out at 10 ° C / 10 It was dried in a minute, exposed to 100 mJ/cm 2 (line I), and heat-cured at 220 ° C / 20 minutes to obtain pattern 1. [Example 2] In Example 1, except that the exposure step was omitted, the same operation as in Example 1 was carried out, and pattern 2 was obtained from the curable resin composition 1. [Example 3] The composition shown in Table 1 was carried out in the same manner as in Example 1, and the curable resin composition 2 and the pattern 3 were obtained. [Example 4] The composition shown in Table 1 was carried out in the same manner as in Example 1 to obtain a curable resin composition 3 and a pattern 4. -60-201022320 [Example 5] The composition shown in Table 1 was carried out in the same manner as in Example 1, and the curable resin composition 4 and the pattern 5 were obtained. [Comparative Example 1] The composition shown in Table 1 was carried out in the same manner as in Example 1 to obtain a curable resin composition 5. When the printing method is used in the same manner as in the first embodiment, the curable resin composition 5 has a large amount of hardening on the intaglio plate, and the composition is agglomerated, so that the pattern cannot be formed. The curable resin composition 1 to 5 and the pattern obtained as described above! ~6, carry out the following evaluation. The results are shown in Table 1. <Average transmittance of the composition> Each of the curable resin compositions is an ultraviolet visible near-infrared amp spectrophotometer (V-650; manufactured by JASCO Corporation) (quartz cell, optical path length; Lcm), the average transmittance (〇/0) in the range of 400 to 700 nm was measured. <Average transmittance of the film> Using each of the curable resin compositions, the film thickness after curing was 3/zm, and the following was performed. Make a hardened film. The curable resin composition was diluted with diethylene glycol N-butyl ether acetate to a solid content of 20% by mass. Hardening by spin coating • 61 - 201022320 After the film thickness is 3 " m, it is pre-baked at 100 °C x 1 、, and heat hardened at 220 °C x 20 minutes. With respect to each of the obtained cured films, an average transmittance (%) in the range of 4 0 0 to 70 nm was measured using a microscopic spectrophotometer (OSP-SP200; manufactured by OLYMPUS). A higher transmittance means less absorption. <Shape shape> The shape of each pattern was measured by a three-dimensional non-contact surface shape measuring system (manufactured by Micromap MM527N (manufacturing) system). [Table 1] Example 1 Example 2 Example 3 Example 4 Example 5 Comparative Example 1 Resin composition 1 1 2 3 4 5 Adhesive resin (A) Resin Aa (solid content only) (part) 60 60 60 0 0 60 Tree Moon Ab (solid form only) (parts) 0 0 0 60 60 0 Polymeric compound (B) Dipentaerythritol hexa-propyl acrylate (KAYARADDPHA, manufactured by Nippon Kayaku Co., Ltd.) 40 40 40 40 40 40 Polymerization starter (C) 2-methyl-2-morphinyl-1-(4-methylsulfanylphenyl)propan-1-one (IRGACURE 907, manufactured by Ciba Japan Co., Ltd.) (part) 1 1 1 1 1 1 Solvent (D) Diethylene glycol η-butyl ether acetate (boiling point 247 ° C) (parts) 34 34 101 34 101 404 Solvent amount (% by mass) ※ 25 25 50 25 50 80 Average transmittance (%) of the composition at a wavelength of 400 to 700 nm 79.2 79.0 85.6 79.0 85.3 94.0 Average transmittance (%) of the film 3 // m at a wavelength of 400 to 700 nm 99.6 99.5 99.6 99.5 99.5 99.6 Shape of the hemisphere Hemispherical hemisphere hemisphere hemisphere - X 100 ※ Solvent amount (% by mass) = _ Solvent (D) _ Adhesive resin (A) + Polymeric compound (B) + Solvent (D) -62- 201022320 As shown in Table 1 Example 1 As a result of ~5, it was found that the curable resin composition of the present invention containing a predetermined amount of a solvent can form a coating film and a pattern having a high transmittance by a printing method. On the other hand, in Comparative Example 1, the printing method could not be used. Industrial Applicability The curable resin composition of the present invention can form a coating film and a pattern having excellent transmittance φ by a printing method. Therefore, it can be suitably used for a coating film or pattern for use in a display device, such as a coating layer, a photolithographic spacer, an insulating film, a liquid crystal alignment control protrusion, a coating film layer of a coloring pattern, and the like. form. BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] shows a method of forming a pattern from a resin composition by a printing method. [Main element symbol description] 1 : Supply device 2: Resin composition 3: Intaglio plate 4: Supply blade (supply blade) 5: Scraping blade 6 : Transfer sheet 7 : Transfer 胴 8 : Substrate - 63-

Claims (1)

201022320 七、申請專利範困: ^ 一種硬化性樹脂組成物,其特徵爲含有黏合劑樹 脂(A)、聚合性化合物(B )及溶劑(D ), 相對於黏合劑樹脂(A )、聚合性化合物(B )及溶 劑(D )之合計量,溶劑(d )之量爲20質量%以上未滿 6 0質量%。 2 ·如申請專利範圍第1項記載之硬化性樹脂組成物 ’其中相對於黏合劑樹脂(A )、聚合性化合物(B )及 溶劑(D )之合計量,溶劑(d )之量爲25質量%以上50 質量%以下。 3·如申請專利範圍第丨項或第2項記載之硬化性樹 脂組成物’其中黏合劑樹脂(A )係爲至少使選自由不飽 和羧酸及不飽和羧酸酐所成群之至少1種的化合物(A-a )’與具有碳數2〜4之環狀醚構造的單體(A-c)聚合而 成之共聚物。 4 .如申請專利範圍第3項記載之硬化性樹脂組成物 ’其中具有碳數2〜4之環狀醚構造的單體(A_C)係爲具 有環氧基之單體。 5 _如申請專利範圍第4項記載之硬化性樹脂組成物 ’其中具有環氧基之單體係爲具有脂肪族多環式環氧基之 單體。 6 .如申請專利範圍第5項記載之硬化性樹脂組成物 ’其中具有脂肪族多環式環氧基之單體係爲選自由式(I )所表示之化合物及式(Π)所表示之化合物所成群之至 -64 - 201022320201022320 VII. Application for patents: ^ A curable resin composition characterized by containing a binder resin (A), a polymerizable compound (B) and a solvent (D), relative to the binder resin (A), and polymerizability. The total amount of the compound (B) and the solvent (D), and the amount of the solvent (d) is 20% by mass or more and less than 60% by mass. (2) The amount of the solvent (d) is 25 in terms of the total amount of the binder resin (A), the polymerizable compound (B), and the solvent (D) as described in the first aspect of the invention. The mass% is 50% by mass or less. 3. The curable resin composition according to the invention of claim 2, wherein the binder resin (A) is at least one selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic anhydrides. A copolymer of a compound (Aa)' and a monomer (Ac) having a cyclic ether structure having 2 to 4 carbon atoms. 4. The curable resin composition as described in claim 3, wherein the monomer (A_C) having a cyclic ether structure having 2 to 4 carbon atoms is a monomer having an epoxy group. 5 - The curable resin composition as described in the fourth paragraph of the patent application ' The single system having an epoxy group is a monomer having an aliphatic polycyclic epoxy group. 6. The curable resin composition as described in claim 5, wherein the single system having an aliphatic polycyclic epoxy group is selected from the group consisting of the compound represented by the formula (I) and the formula (Π). Compounds are grouped to -64 - 201022320 [式(I)及式(II)中,Ri及R2各自獨立表示氫原子或 碳數1~4之烷基;該烷基所含之氫原子亦可被羥基取代; Χι及X2各自獨立表示可含有單鍵或雜原子之碳數 1〜6的伸烷基]。 7.如申請專利範圍第3項至第6項中任一項記載之 硬化性樹脂組成物,其中選自由不飽和羧酸及不飽和羧酸 酐所成群之至少1種的化合物(A-a )係爲選自脂肪族不 飽和羧酸及脂肪族不飽和羧酸酐所成群之至少1種的化合 物。 8 .如申請專利範圍第6項記載之硬化性樹脂組成物 ,其中選自由式(I)所表示之化合物及式(II)所表示 之化合物所成群之至少1種的化合物係爲選自由式(I,) 所表示之化合物及式(ΙΓ )所表示之化合物所成群之至 少1種的化合物,[In the formulae (I) and (II), Ri and R2 each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; the hydrogen atom contained in the alkyl group may be substituted by a hydroxyl group; Χι and X2 are each independently represented. It may contain a single bond or a heteroalkyl group having 1 to 6 carbon atoms. The curable resin composition according to any one of claims 3 to 6, wherein at least one compound (Aa) selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic anhydrides is a compound (Aa). It is at least one compound selected from the group consisting of an aliphatic unsaturated carboxylic acid and an aliphatic unsaturated carboxylic anhydride. The curable resin composition according to claim 6, wherein at least one compound selected from the group consisting of the compound represented by the formula (I) and the compound represented by the formula (II) is selected from the group consisting of a compound represented by the formula (I,) and a compound of at least one of the compounds represented by the formula (ΙΓ), [式(Γ)及式(ΙΓ)中,R!’及R2’各自獨立表示氫原子 或碳數1〜4之烷基;該烷基所含之氫原子亦可被羥基取代 ]° 9 ·如申請專利範圍第1項至第8項中任一項記載之 -65- 201022320 硬化性樹脂組成物,其中溶劑(D )係沸點爲2 00 °C以上 ’係爲含有選自由酯系溶劑'醚系溶劑及醇系溶劑所成群 之至少1種溶劑的溶劑。 10·如申請專利範圍第1項至第9項中任一項記載之 硬化性樹脂組成物,其中更含有聚合開始劑(C )。 11.如申請專利範圍第1 0項記載之硬化性樹脂組成 物’其中聚合開始劑(C)係含有選自由雙咪唑系化合物 、苯乙酮系化合物、三嗪系化合物' 醯基膦氧化物系化合 物及肟系化合物所成群之至少1種化合物的聚合開始劑。 1 2 · —種如申請專利範圍第1項至第1〗項中任一項 記載之硬化性樹脂組成物之使用,其係爲形成塗膜或圖型 用者。 13_ —種塗膜或圖型,其特徵爲使用如申請專利範圍 第1項至第1 1項中任一項記載之硬化性樹脂組成物而形 成。 14. 一種顯示裝置,其特徵爲含有如申請專利範圍第 13項記載之塗膜或圖型。 15. —種塗膜或圖型之製造方法,其特徵爲具有將如 申請專利範圍第1項至第11項中任—項記載之硬化性樹 脂組成物使用印刷法於基材上進行塗佈、乾燥、加熱而得 到塗膜或圖型之步驟。 16. —種塗膜或圖型之製造方法,其特徵爲具有將如 申請專利範圍第1項至第1 1項中任一項記載之硬化性樹 脂組成物使用印刷法於基材上進行塗佈、乾燥、曝光處理 -66- 201022320 、更依據需要進行加熱而得到塗膜或圖型之步驟。[In the formula (Γ) and the formula (ΙΓ), R!' and R2' each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms; and the hydrogen atom contained in the alkyl group may be substituted by a hydroxyl group] ° 9 · The -65-201022320 curable resin composition according to any one of claims 1 to 8, wherein the solvent (D) has a boiling point of 200 ° C or more 'is selected from the group consisting of ester-based solvents'. A solvent of at least one solvent in a group of an ether solvent and an alcohol solvent. The curable resin composition according to any one of claims 1 to 9, which further comprises a polymerization initiator (C). 11. The curable resin composition as described in claim 10, wherein the polymerization initiator (C) contains a compound selected from the group consisting of a bisimidazole compound, an acetophenone compound, and a triazine compound thiophosphonium oxide. A polymerization initiator for at least one compound in which a compound and an oxime compound are grouped. The use of the curable resin composition as described in any one of the first to the first aspect of the invention is to form a coating film or a pattern. And a coating film or a pattern, which is formed by using the curable resin composition according to any one of claims 1 to 11. A display device comprising the coating film or pattern as described in claim 13 of the patent application. A method for producing a coating film or a pattern, comprising the step of coating a curable resin composition according to any one of items 1 to 11 of the patent application by a printing method on a substrate. The step of drying or heating to obtain a coating film or pattern. A method for producing a coating film or a pattern, which comprises applying the curable resin composition according to any one of the first to eleventh aspects of the invention to a substrate by a printing method. Cloth, drying, exposure treatment -66- 201022320, and more according to the need to heat to obtain the coating film or pattern steps. -67--67-
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