201020495 九、發明說明： 【發明所屬之技術領域】 本發明「均熱腔體之結構與製造方法」，主要在於討論一種 應用於各種須散熱之發熱體上（如電子零件），能將其運作時所產 生的熱能帶離，以便於維持發熱體的正常運作。 【先前技術】 現階段的電腦晶片運算速度越來越快，所相對產生的溫度也 Q) 越高，因此，業者除了增加該散熱器的體積外，亦增加了散熱鯖 片的數量’目的僅為了增加散熱的表面積，以維持電腦晶片的正 常運作，然而，此一作法，卻大大的壓縮了電腦内部的空間，尤 其是筆記型電腦的應用，輕薄短小是其主要的賣點，但是因散熱 所導致運算速度遲緩的問題’ 一直是筆記型電腦業者極欲克服之 難題。 、 傳統鋁擠型的散熱器，其散熱效能已無法應付目前較高階的 Φ 電腦晶片的散熱需求，故而有熱導管以及均熱腔體的出現，來克 服曰益嚴苛的散熱需求，其中以均熱腔體的效率最佳，但其製造 成本也是最高。 均熱腔體之結構主要係由上、下蓋體利用焊接將二者結合為 一具有中空腔室的腔體，腔體内部抽真空後注入液體，在腔室内 部設有導熱部，該導熱部之構成可由導熱顆粒燒結而成，或金屬 網’或由上下蓋内側面加工凸柱或肋板...等，導熱部的作用在增 加熱交換之表面積’其中以導熱顆粒燒結而觸導熱部能夠提供 201020495 最大的表面積以及均句的孔隙，故以導熱顆粒燒結而成的導熱部 其效能最佳；均熱腔體整個原理係利用下蓋將熱源導引至腔室 後’藉由導熱部迅速的擴散，液體吸熱後’轉換成蒸氣向上移動， 冷卻後，回復成液體再回流至下蓋，形成一個熱轉換的備環，藉 此來達到均熱及散熱的功效。 目前坊間均熱腔體的製作技術（如申請第093119555號、申 •請第092211828號、申請第093215583號、申請第093214132號 ^ 專利等），均僅能製作出平板狀的均熱腔體，其整個技術瓶頸主要 卡在該導熱部的製程，同時上下蓋，須--加工容槽，因形成成 本居高不下，特別是平板狀的均熱腔體，内部熱轉換的高度及空 間不足’特別是其外形受限，無法依據實際狀況，設計出較佳的 均熱腔體。 【發明内容】 ^ 有鑑於習知技術之缺點，本發明係提供一種新的均熱腔體之 結構與製造方法，其上腔殼或下腔殼之導熱部主要係利用模具配 合導熱部之配合面，令導熱顆粒得以均勻的貼佈在上下腔殼之壁 面上’使得均熱腔體不在侷限於平板狀，可依據各種需求，製造 出更能符合其效能及低成本之形狀，能創造更優質的散熱效能， 或以更小體積之散熱器，即能創造出相同的散熱效能，並能利用 較為簡易的製程，即可完成成品，藉以提高產能，降低成本。 為使審查委員對本發明能進一步的瞭解，以及為使同一行業 201020495 之技術人士（Person skilled in the field)能依據本發明之說 明書與實施方式加以實施，故揭露一較佳之實施方式如下，藉此 揭露本發明之基本精神與適#的教示贿熟習此項技術領域之人 士能運用本發明之内容加以衍生變化。以下鱗_較佳實施例， 配合圖式、圖號，將本剌之構肋容及其所達觸功效詳細說 明如後·· 【實施方式】 #) 首先如第一圖所示，本發明主要在於製造-種均熱腔體10， 該腔體10係由上腔殼11及下腔殼12組構成-中空的密閉容室， 腔體10底部具有-接合部13，接合部13對應於發熱源之形狀， 用來與發熱源緊密接觸，接合部13外緣向外及向上延伸有一擴散 -部14，用來擴散熱源之面積及不同方向，接合部13與擴散部14 之夹角大於90並小於180度，在該腔體1〇的内壁面上佈設有導 熱難相互堆4結合喊的導熱部15，雜1()上另财一注口 ❿16 ’供令腔體10之内部抽氣形成真空狀態，並注入有液體2〇 , 將注口予以密封。 另由第一圖配合第二圏及第三圖所示，該擴散部14可為平面 或曲面等幾何面的形式自接細13向外及向上延伸，腔體1〇的 外形除了可呈第-圖所示杯碗狀的形式，亦可第二圖所示盤狀的 形式，或第三圖所示之斜錐方盤狀之形式。 舰導熱，部15之作用，在於利用其較大的表面積迅速的將熱 201020495 源分佈，同時利用導熱顆粒之間的間隙所形成的毛細現象，進行 熱交換’在導熱部15的形狀，除了均勻鋪於腔體内壁面上，亦可 延伸出複數鰭板狀之導熱部15 (如第四圖所示），來增進其熱交 換效率’而複數鰭板狀之導熱部15其排列方式可呈單方向、複方 向、放射狀或同心圓排列之幾何排列。 如第五圖所示，上述均熱腔體之製造方法，主要以高導熱及 散熱效率為材質（如鋁、銅等等）依據所需之形狀製成的上腔殼 <0 11與下腔殼12,該上腔殼11或下腔殼12具有一注口 16 (第四 圖中將注口 16設於上腔殼11上，亦可視實際需求，設於下腔殼 12上）’配合第五A圖及第五B圖所示，另外依據上腔殼η及下 腔殼12外形分別完成的模具30，模具30至少由第一模仁31與 第二模仁32所構成，第一模仁31設有與上腔殼11、及下腔殼12 外形相配之模穴33，供上腔殼11、及下腔殼12置入，第二模仁 32則設有槽穴34，當上腔殼11、及下腔殼12與第二模仁32配 合後’該槽穴34與上腔殼11、及下腔殼12之間隙即形成導熱部 之成型空間’在第二模仁32上另設有入料口 35，與槽穴34相通。 再如第六A圖及第六B圖所示，將上腔殼11或下腔殼12分 別置入模具30中的模穴33後，倒入高導熱效率的導熱顆粒，該導 熱顆粒填滿槽穴34，藉由振動後，導熱顆粒將更均勻且紮實的分 佈’並與於上腔殼11或下腔殼12的壁面緊密接觸，經過燒結後 令位於槽穴34中之導熱顆粒即會與上腔殼11或下腔殼12結合為 201020495 一體’形成導熱部15，將上腔殼11與下腔殼12、组合後，利用焊 接技術將二者結合為-體，最後，由注σ 16抽真空、注入液體 20後’對注口 16進行封〇程序後組構成一均熱腔體結構（如第 一圖或第二圖或第三圖所示）。 另如第七圖所示經由本發明製程所量產出之均熱腔體，可由 與散熱鰭片40組合，利用散熱鰭片4〇較大面積的散熱，配合風 扇50降溫’可得到極佳的散熱效率。 就功效性而言，本發明充份利用了模仁的特性，令導熱部的 形狀能夠完全配合腔殼的形狀，使均熱腔體之造形不必在侷限於 平板狀’如此除能得到更佳的功效外’更能應因實際需求，開發 出更適用的均熱腔體，同時由於所有零組件之設計即相關製程， 均能以模具的配合進行量產，故不論其製造成本以及產能，均有 極大的進步性。 需陳明者，以上所述乃是本發明之具體製程及所運用之技術 蹇^ 原理所製成之實施例，根據本文的揭露或教導可衍生推導出許多 的變更與修正，若依本發明之構想所作之等效改變，其所產生之 功能作用仍未超出說明書及圖式所涵蓋之精神時，均應依全要件 原則或均等論原則而落入（Readon)在本發明之技術範_内而不 離開本發明在申請專利範圍中所陳述之範疇，合先陳明。 201020495 【圖式簡單說明】 第一圖本發明成品示意圖，成品外觀呈杯碗狀 第二圖為本發明另一成品示意圖，成品外觀呈圓盤狀 第三圖為本發明另一成品示意圖，成品外觀呈斜錐盤狀。 第四圖為為本發明下腔殼示意圓，具有鰭片狀之導熱部。 第五圖為本發明製作流程示意圖。 第六A圖為本發明上腔殼成形導熱部之示意圖》 麵） 第六B圖為本發明下腔殼成形導熱部示意圖。 第七圖為本發明配合風扇、散熱鰭片之實施例示意圖。201020495 IX. Description of the Invention: [Technical Field of the Invention] The "structure and manufacturing method of a soaking cavity" of the present invention mainly relates to the application of a heat generating body (such as an electronic component) which is required to dissipate heat, and can operate it. The heat generated during the time is taken away to maintain the normal operation of the heating element. [Prior Art] At present, the computer chip is running faster and faster, and the relative temperature is also higher. Therefore, in addition to increasing the size of the heat sink, the number of heat sinks is increased. In order to increase the surface area of the heat dissipation, in order to maintain the normal operation of the computer chip, however, this method greatly reduces the space inside the computer, especially the application of the notebook computer, light and short is its main selling point, but due to the heat dissipation The problem that caused slow computing speeds has been a problem that notebook companies are eager to overcome. The traditional aluminum-extruded heat sink has been unable to cope with the heat dissipation requirements of the current higher-order Φ computer chips. Therefore, there are heat pipes and soaking cavities to overcome the demanding heat dissipation requirements. The soaking chamber is the most efficient, but its manufacturing cost is also the highest. The structure of the soaking cavity is mainly composed of a combination of the upper and lower covers by welding to form a cavity having a hollow chamber, the inside of the cavity is evacuated, and a liquid is injected, and a heat conducting portion is arranged inside the cavity. The composition of the part may be sintered by the heat conductive particles, or the metal mesh 'or the convex or the ribs are processed by the inner side of the upper and lower covers, etc., and the heat conductive portion acts to increase the surface area of the heat exchange, in which the heat conductive particles are sintered to contact the heat conduction. The department can provide the maximum surface area of 201020495 and the pores of the uniform sentence, so the heat conduction part sintered by the heat conductive particles is the best; the whole principle of the soaking cavity is to guide the heat source to the chamber by the lower cover. The part spreads rapidly, and the liquid absorbs heat and then converts into vapor to move upwards. After cooling, it returns to liquid and then flows back to the lower cover to form a heat-converting backup ring, thereby achieving the effects of soaking and heat dissipation. At present, the production technology of the uniform heat chamber (such as application No. 093119555, application No. 092211828, application No. 093215583, application No. 093214132, etc.) can only produce a flat-shaped soaking cavity. The whole technical bottleneck is mainly stuck in the process of the heat conducting part, and the upper and lower covers are required to process the groove, because the forming cost is high, especially the flat-shaped soaking cavity, and the internal heat conversion height and space are insufficient. In particular, its shape is limited, and it is impossible to design a better soaking cavity according to actual conditions. SUMMARY OF THE INVENTION In view of the shortcomings of the prior art, the present invention provides a new structure and manufacturing method of a soaking cavity, wherein the heat conducting portion of the upper or lower cavity is mainly composed of a mold and a heat conducting portion. The surface allows the heat-conducting particles to be evenly applied to the wall surface of the upper and lower chamber shells, so that the soaking chamber is not limited to a flat plate shape, and can be shaped to better conform to its efficiency and low cost according to various needs, and can create more High-quality heat dissipation, or a smaller heat sink, can create the same heat dissipation performance, and can complete the finished product with a simpler process, thereby increasing productivity and reducing costs. In order to enable the reviewing committee to further understand the present invention, and to enable the skilled person in the field of 201020495 to be implemented in accordance with the specification and embodiments of the present invention, a preferred embodiment is disclosed as follows. The basic spirit and the teachings of the present invention are disclosed. Those skilled in the art can use the content of the present invention to derive variations. The following scales _ preferred embodiment, with the drawings and figure numbers, the configuration of the ribs and the touch function of the present invention are described in detail later. [Embodiment] #) First, as shown in the first figure, the present invention The main purpose is to manufacture a soaking chamber 10, which is composed of a combination of an upper chamber 11 and a lower chamber 12 - a hollow closed chamber, the bottom of the chamber 10 has a joint portion 13, and the joint portion 13 corresponds to The shape of the heat source is used for close contact with the heat source. The outer edge of the joint portion 13 extends outwardly and upwardly with a diffusion portion 14 for diffusing the area of the heat source and different directions, and the angle between the joint portion 13 and the diffusing portion 14 is greater than 90 is less than 180 degrees, and a heat conducting portion 15 is formed on the inner wall surface of the cavity 1 导热, and the heat conducting portion 16 is combined with the shouting. The miscellaneous 1 () is additionally provided with a nozzle ❿ 16 ' to allow the interior of the cavity 10 to be drawn. The gas is in a vacuum state and is filled with liquid 2〇 to seal the nozzle. In addition, as shown in the first figure, the second portion and the third figure are shown. The diffusing portion 14 can be formed in the form of a geometric surface such as a plane or a curved surface, and extends outwardly and upwardly from the joint 13 . - The cup-shaped form shown in the figure may also be in the form of a disk as shown in the second figure, or in the form of a beveled square disk as shown in the third figure. The ship's heat conduction, the role of the part 15 is to use its large surface area to rapidly distribute the heat 201020495 source, while utilizing the capillary phenomenon formed by the gap between the heat-conducting particles, to perform heat exchange 'in the shape of the heat-conducting portion 15, except uniform Spreading on the inner wall surface of the cavity, a plurality of fin-shaped heat conducting portions 15 (as shown in the fourth figure) may be extended to improve the heat exchange efficiency thereof, and the plurality of fin-shaped heat conducting portions 15 may be arranged in a manner Geometric arrangement of single direction, complex direction, radial or concentric arrangement. As shown in the fifth figure, the manufacturing method of the above-mentioned soaking cavity is mainly made of high heat conduction and heat dissipation efficiency (such as aluminum, copper, etc.) according to the shape of the upper cavity <0 11 and lower The chamber casing 12, the upper chamber casing 11 or the lower chamber casing 12 has a nozzle 16 (the nozzle port 16 is disposed on the upper chamber casing 11 in the fourth figure, and is also disposed on the lower chamber casing 12 according to actual needs). The mold 30 is formed by at least the first mold core 31 and the second mold core 32 according to the molds 30 respectively formed by the upper chamber η and the lower chamber shell 12 as shown in the fifth and fifth panels. The mold core 31 is provided with a cavity 33 matched with the outer cavity shell 11 and the lower cavity shell 12 for the upper chamber shell 11 and the lower chamber shell 12 to be placed, and the second mold core 32 is provided with a cavity 34. When the upper chamber shell 11 and the lower chamber shell 12 are engaged with the second mold core 32, the gap between the tank 34 and the upper chamber shell 11 and the lower chamber shell 12 forms a forming space for the heat conducting portion in the second mold core. A feed port 35 is additionally provided on the 32, and communicates with the slot 34. Further, as shown in FIG. 6A and FIG. 6B, after the upper chamber shell 11 or the lower chamber shell 12 are respectively placed into the cavity 33 in the mold 30, the heat conductive particles having high thermal conductivity are poured, and the heat conductive particles are filled. The cavity 34, by vibration, will have a more uniform and solid distribution of the thermally conductive particles and will be in close contact with the wall surface of the upper or lower chamber 11 or the lower chamber 12, and the thermally conductive particles located in the chamber 34 will be sintered. Combined with the upper chamber shell 11 or the lower chamber shell 12 as 201020495, the integral heat forming portion 15 is formed, and after the upper chamber shell 11 and the lower chamber shell 12 are combined, the two are combined into a body by a welding technique, and finally, the σ is injected. After 16 vacuuming and injecting the liquid 20, the group of nozzles 16 is sealed to form a soaking chamber structure (as shown in the first or second or third figures). In addition, as shown in the seventh figure, the soaking chamber produced by the process of the present invention can be combined with the heat dissipating fins 40, and the heat dissipating fins 4 〇 a large area of heat dissipating, and the cooling of the fan 50 can be excellent. Cooling efficiency. In terms of efficacy, the present invention fully utilizes the characteristics of the mold core, so that the shape of the heat transfer portion can completely match the shape of the cavity shell, so that the shape of the heat equalization cavity does not have to be limited to the flat shape. In addition to the efficacy, it is more suitable to develop a more suitable soaking chamber due to actual needs. At the same time, due to the design of all the components, that is, the related processes, the mass production can be carried out with the cooperation of the mold, so regardless of the manufacturing cost and the production capacity, Great progress. It is to be understood that the foregoing is an embodiment of the specific process of the invention and the principles of the application of the invention, and many variations and modifications can be derived therefrom in accordance with the disclosure or teachings herein. The equivalent changes made by the concept, the functional role produced by the concept, should not fall beyond the spirit of the specification and the schema, and should fall into the technical scope of the invention according to the principle of the whole element or the principle of equalization. Without departing from the scope of the invention as set forth in the scope of the patent application, it is first known. 201020495 [Simplified description of the drawings] The first figure shows the finished product of the present invention, and the finished product has a cup-shaped appearance. The second figure is a schematic view of another finished product of the present invention, and the finished product has a disk shape. The third figure is a schematic view of another finished product of the present invention. The appearance is a slanted cone. The fourth figure is a schematic circle of the lower cavity of the present invention, and has a fin-shaped heat conducting portion. The fifth figure is a schematic diagram of the production process of the present invention. 6A is a schematic view showing a heat conducting portion of the upper cavity of the present invention. FIG. 6B is a schematic view showing a heat conducting portion of the lower cavity of the present invention. The seventh figure is a schematic diagram of an embodiment of the present invention with a fan and a heat sink fin.