201020034 九、發明說明： 【發明所屬之技術領域】 本發明係關於升> 成膠圖案於基板上之點膠機以及 利用點膠機塗佈膠之方法。 【先前技術】 • 點膠機為製造各種平面板顯示器（FPDs)時，一種以 預定圖案塗佈膠於基板，以黏著或密封基板之裝置。 此類點膠機包含平台、料元、頭支料、以及頭 移，部。基钱設於平台上。肋排出膠之喷嘴裝設於 頭單元。:單元*頭支撲件支樓。頭移動部插置於頭單 疋及碩支if件之間，且移動頭單元於頭支料之外推線 方向（X軸方向）。 已提出有以下習知塗佈膠於基板之方法：僅當支托 基板於其，之平台移動於X減¥軸方向雜佈膠之方 法、备頭單元移動於χ軸方向而平台移動於^軸方向時 塗佈膠之方法、或當鮮元赫於χ軸方向^頭支撑件 移動於Υ軸方向時塗佈膠之方法。 為了加強具有膠圖案之基板的生產力，可考慮增加 ，佈膠到基板之速度。為了增加塗佈速度，必須增加頭 單元、平台、或頭支撐件之移動速度。如此一來，當增 201020034 」單元、平台、或頭支料之移動速度時，增加了因 二7〇或平台移動所產生的反作用力，因此導致點勝機 的振動增加。結果’降低了 案的品質。 習知轉機在利關基板或噴嘴㈣之方法來塗 一/於基板時尤其有問題，使得增加頭單元、平台、或 碩支撐件之移動速度非常受限。 【發明内容】 因此’本發明有n於習知技術發生的問題，本發明 目的之-為提供-種轉機及利用此點膠機塗佈勝之 方法，其巾當基板及噴嘴_移祕減方向時，形成 膠圖案於基板上，因此於塗佈作業_增加塗佈速产並 降低振動。 夂 • 為了達成上述目的’本發明提供-種點膠機，包含 移動基板之絲移鮮元；飾喷嘴之喷嘴移動單元· 以及控制單元’控制基板移動單元及嘴嘴移動單元去 噴嘴及基板同時移動於相反方向時，塗佈膠到基板上: 基板移動單元包含：平台，安裝於_上，並 基板於其上；以及移動平台於Y軸方向2Y轴驅動 喷嘴移動單元包含：頭域件，战於框架上，以= 於平台上方且延伸於X軸方向並支撐備有喷嘴之頭單 6 201020034 凡，·以及續件移動部，安裝於桓架上，以移動頭 件於γ軸方向。控制單元控制γ轴驅動部以移動平台於 γ軸方向’因而形成γ軸方向之膠圖案於基板上，：同 時控制支料軸部以移_讀件於 頭支撲件之義方向與平台之移動方向相反。使仔 再者，基板移動單元包含：平台，安裝於 „其上；以及X軸驅動部，移動平台於X轴 以i裝單元包含：頭支撐件’支胁框架上， 嘴方且延伸於x轴方向’以及支標備有喷 商i it以及娜動部，安裝於頭支撐件，以移動 方向。控制單元控制x軸驅動部以移動平 因而形成x轴方向之膠圖案於基板上， 單部以移動頭單元於X軸方向，使得頭 早之移動方向與平台之移動方向相反。 膠機S牒為了達成上述目的’本發明提供—種利用點 元、移動噴=嘴===;基板:動單 ==喷嘴移動單元，以當喷嘴及基板同時移動 =方向時’形成膠圖案於基板上，本方法包含：· =，動及同時噴嘴移動於與基板之移動 二 方向時，塗佈膠於基板上。 做之 201020034 再者，塗佈膠之方法更包含當降低基板之移動速度 以及增加噴嘴之移動速度時，或增加基板之移動速度以 及降低噴嘴之移動速度時，形成具有圓角之膠圖案於基 板上。 再者，塗佈膠之方法可利用計算基板或喷嘴之最大 速度之方法’改善塗佈速度及振動衰減效能。於此，計 φ 算基板或喷嘴之最大速度之方法包含：當增加或降低基 板或喷嘴之移動速度時，量測基板及喷嘴間之間隙資 料；決定基板及喷嘴間之間隙資料是否超出參考範圍； 以及當基板及噴嘴間之間隙資料在參考範圍内時，計算 基板或噴嘴之最大速度。再者，計算基板或喷嘴之最大 速度之方法包含：當增加或降低基板或噴嘴之移動速度 時’塗佈膠於基板上；量測塗佈於基板上之膠之截面 積，決定基板及喷嘴間之截面積是否超出參考範圍；以 及當基板及喷嘴間之截面積在參考範圍内時，計算基板 或噴嘴之最大速度。 【實施方式】 於後，參考伴隨圖式將說明根據本發明較佳實施例 之點膠機以及利用點膠機塗佈膠之方法。 如圖1及圖2所示，根據本發明之點膠機包含框架 10、用以移動基板S之基板移動單元2〇、用以移動喷嘴 8 201020034 62之嘴嘴移動單元30、以及控制單元40，用以控制基 板移動單元20及噴嘴移動單元30，使得當喷嘴及美 板S同時移動於相反方向時，塗佈膠到基板s上。土201020034 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a dispensing machine for forming a glue pattern on a substrate and a method for coating a glue using a dispenser. [Prior Art] • When the dispenser is used to manufacture various flat panel displays (FPDs), a device in which a paste is applied to a substrate in a predetermined pattern to adhere or seal the substrate. Such dispensers include a platform, a material element, a head support, and a head movement. The base money is set on the platform. The rib discharge nozzle is mounted on the head unit. : Unit * head support member. The head moving portion is interposed between the head unit and the master member, and the moving head unit pushes the line direction (X-axis direction) outside the head material. The following method has been proposed for applying a glue to a substrate: only when the support substrate is placed thereon, the platform moves in the X-axis direction, and the head unit moves in the x-axis direction and the platform moves on the ^ A method of applying a glue in the axial direction, or a method of applying a glue when the fresh element is moved in the direction of the x-axis. In order to enhance the productivity of a substrate having a glue pattern, it is conceivable to increase the speed at which the glue is applied to the substrate. In order to increase the coating speed, it is necessary to increase the moving speed of the head unit, the platform, or the head support. As a result, when the speed of the 201020034 unit, platform, or headstock is increased, the reaction force generated by the movement of the platform or the platform is increased, resulting in an increase in the vibration of the point winch. The result 'reduces the quality of the case. Conventional transfer machines are particularly problematic when applying a substrate or nozzle (4) to the substrate, so that the movement speed of the head unit, the platform, or the support is very limited. SUMMARY OF THE INVENTION Therefore, the present invention has problems in the prior art, and the object of the present invention is to provide a method for transferring and using the dispensing machine to win the method, and the substrate as a substrate and a nozzle At this time, a glue pattern is formed on the substrate, so that the coating speed is increased and the vibration is reduced in the coating operation.为了• In order to achieve the above object, the present invention provides a dispensing machine comprising a moving substrate, a nozzle moving unit, and a control unit, a control unit moving unit and a nozzle moving unit, for simultaneously removing the nozzle and the substrate. When moving in the opposite direction, the glue is applied to the substrate: the substrate moving unit comprises: a platform mounted on the _ and the substrate thereon; and the moving platform driving the nozzle in the Y-axis direction 2Y axis comprises: a head region component, On the frame, with the = above the platform and extending in the X-axis direction and supporting the head with the nozzle single 6 201020034, and the moving part of the continuation, mounted on the truss to move the head in the γ-axis direction. The control unit controls the γ-axis driving portion to move the platform in the γ-axis direction to form a glue pattern on the substrate in the γ-axis direction: simultaneously controlling the fulcrum shaft portion to move the _ reading member in the direction of the head smashing member and the platform The direction of movement is reversed. Further, the substrate moving unit includes: a platform mounted on the upper side; and an X-axis driving unit, the mobile platform is mounted on the X-axis unit, the head support member is supported on the frame, and the mouth extends over the x-axis. The axis direction 'and the branch are provided with the sprayer i it and the bottom part, and are mounted on the head support to move the direction. The control unit controls the x-axis drive part to move flat to form the glue pattern on the substrate in the x-axis direction, The moving head unit is in the X-axis direction, so that the moving direction of the head is opposite to the moving direction of the platform. In order to achieve the above object, the glue machine S is provided by the present invention, using a dot element, moving spray = mouth ===; : move single == nozzle moving unit, to form a glue pattern on the substrate when the nozzle and the substrate move simultaneously = direction, the method comprises: ·, moving and simultaneously moving the nozzle in the direction of movement with the substrate, coating Glue on the substrate. 201020034 Furthermore, the method of coating the glue further includes when the moving speed of the substrate is lowered and the moving speed of the nozzle is increased, or the moving speed of the substrate is increased and the moving speed of the nozzle is lowered. In addition, the method of applying the glue can improve the coating speed and the vibration attenuation performance by calculating the maximum speed of the substrate or the nozzle. Here, the substrate or the nozzle is calculated. The method of maximum speed includes: measuring the gap between the substrate and the nozzle when increasing or decreasing the moving speed of the substrate or the nozzle; determining whether the gap between the substrate and the nozzle exceeds the reference range; and the gap between the substrate and the nozzle Calculate the maximum speed of the substrate or nozzle when in the reference range. Further, the method of calculating the maximum speed of the substrate or nozzle includes: coating the glue on the substrate when increasing or decreasing the moving speed of the substrate or the nozzle; measuring the coating The cross-sectional area of the glue disposed on the substrate determines whether the cross-sectional area between the substrate and the nozzle exceeds the reference range; and when the cross-sectional area between the substrate and the nozzle is within the reference range, the maximum speed of the substrate or the nozzle is calculated. Hereinafter, a dispenser according to a preferred embodiment of the present invention and a glue application using a dispenser will be described with reference to the accompanying drawings. As shown in FIG. 1 and FIG. 2, the dispenser according to the present invention comprises a frame 10, a substrate moving unit 2 for moving the substrate S, a mouth moving unit 30 for moving the nozzle 8 201020034 62, and a control The unit 40 is configured to control the substrate moving unit 20 and the nozzle moving unit 30 so that when the nozzle and the US plate S are simultaneously moved in opposite directions, the glue is applied onto the substrate s.
上，並支托基板S於其上、移動平台21於χ軸方向之 轴驅動部22、以及騎平台21於γ軸方向之γ轴 部23]轴驅動部23之丫軸導引件231魏於^ 上。X軸驅動部22之X轴導引件221 *設於γ轴導引件 爹上。再者’平台21安置於Χ軸導引件221上。藉由 架構’平台21由玲導引件221導引 轴方向，以及X軸導引件221由γ γ=轴方向。然而，本發明不限於 2導引件231裝毅於框架1〇上， “ 置於Υ軸導引件231上。_，χ 女 於框架10上，而γ轴導引件231可=件221可裝設 剡上。藉由安裝於1軸導引件於χ軸導引件 安裝於平台21下部上部之固定部以及 動部22之驅動调播I B電磁作用作為X轴驅 輪、或耗接動力產生裝置及平力台傳例如皮帶、齒 車由 藉由安裝於Y轴導引件23 =桿）。再者，Upper and lower support substrate S thereon, shaft drive portion 22 of the moving platform 21 in the x-axis direction, and y-axis portion 23 of the riding platform 21 in the γ-axis direction 23] the shaft guide 231 of the shaft drive unit 23 On ^. The X-axis guide 221 * of the X-axis driving portion 22 is provided on the γ-axis guide 爹. Further, the platform 21 is placed on the boring guide 221 . The axis direction is guided by the Ling guide 221 by the architecture 'platform 21', and the X-axis guide 221 is oriented by γ γ = axis. However, the present invention is not limited to the fact that the two guide members 231 are mounted on the frame 1 ,, "on the yoke guide 231. _, χ on the frame 10, and the γ-axis guide 231 can be = 221 It can be mounted on the cymbal. The IB electromagnetic action is used as an X-axis drive wheel or by the mounting of the 1-axis guide on the fixed portion of the lower portion of the platform 21 and the driving portion of the movable portion 22. The power generating device and the flat force transmission such as the belt and the toothed vehicle are mounted on the Y-axis guide 23 = rod).
導弓I件22】下部之移動 ^固疋部以及安裝於X 移動糊之電磁作用作為 201020034 部23之驅動源，可導引χ軸導引件221到γ軸導％件 231而移動。本發明不限於上述架構，可提供動力產生 裝置（例如轉動馬達或液壓缸）以及動力傳送裝置（例如 皮帶、齒輪、或耦接動力產生裝置及x軸導？|件2^之 耦接桿）。藉由基板移動單元20，裝設於平台21上之其 板S可移動於X軸及γ轴方向。 土 鲁 她^移動單元3(3包含頭支撲件31及頭移動部32。 支按件31之兩端支樓於柜架1〇上，且安裝於平 士方’延伸於X軸方向並支撐頭單元6〇。各頭單: =有排峨她2。各鍋⑽安^^ ^ 31 ’並雜咖_單元60蚊細时嘴62 ^ 於碩支射Ml之縱長扣㈣ $ 頭單元60可包含注舢哭〇如圖3所不，各 截面積感測器66至少其中^63與 相通，並埴右右跋'之 注射器61與喷嘴62 並真充有膠。雷射位移感 截:料。截面積感測器66二佈= 心=:r;:r定部及移動部。 長方向α舳方並之伸於碩支撐件31之縱 移動部及固定部間之電磁Pf頭單元60 ’並藉由 向α軸方向）。因此，當各頭^用移β動於固定部之延伸方 噴嘴62可移動於X轴方向。7L G移動於X軸方向時， 201020034 再者，喷嘴移動單_The guide bow member I 22] the movement of the lower portion. The solid portion and the electromagnetic action of the X-moving paste are used as the driving source of the 201020034 portion 23, and the crucible guide 221 can be guided to move to the γ-axis guide member 231. The present invention is not limited to the above-described architecture, and may provide a power generating device (such as a rotating motor or a hydraulic cylinder) and a power transmitting device (such as a belt, a gear, or a coupling mechanism that couples the power generating device and the x-axis guide member). . With the substrate moving unit 20, the plate S mounted on the stage 21 can be moved in the X-axis and γ-axis directions. Tulu her mobile unit 3 (3 includes a head smashing member 31 and a head moving portion 32. The two ends of the supporting member 31 are on the frame 1 ,, and are mounted on the pingshifang' extending in the X-axis direction and Support head unit 6〇. Each head sheet: = There is a row of her 2. Each pot (10) An ^ ^ ^ 31 'and miscellaneous coffee _ unit 60 mosquitoes when the mouth 62 ^ Yu Shuo shot Ml long buckle (four) $ head The unit 60 can include a crying squeegee as shown in FIG. 3. Each of the cross-sectional area sensors 66 is at least 63, and the right and left sides of the syringe 61 and the nozzle 62 are filled with glue. Cut-off material: cross-sectional area sensor 66 2 cloth = heart =: r;: r fixed part and moving part. Electromagnetic Pf extending between the longitudinal moving part of the master support member 31 and the fixed part The head unit 60' is in the direction of the α-axis. Therefore, when the heads are moved by the movement of the movement portion of the fixed portion, the nozzle 62 can be moved in the X-axis direction. When 7L G moves in the X-axis direction, 201020034 Again, the nozzle moves _
時，各喷物村移動^m3/移動於W方向 單元=°板==2°及 (1) 基板S之X軸移動及喷嘴62之χ軸移動之方式 • 使噴嘴62之移動方向與基板S之移動方向相反。 (2) 基板S之Y軸移動及喷嘴62之Y軸移動之方式 使噴嘴62之移動方向與基板S之移動方向相反。 方法（1)可應用於在基板S上塗佈延伸於X轴方向 之膠之案例，而方法（2)可應用於在基板S上塗佈延伸 於Y軸方向之膠之案例。 11 201020034 為了在基板s上形成矩形膠圖案，除了基板s及喷 於x軸方向或γ軸方向之反向移動外，可額外考 慮以下控制方法。 (a) 基板S之X軸移動及喷嘴62之X軸移動之方式 使喷嘴62之移動方向與基板s之移動方向相反，以形 成X轴方向之膠囷案，以及基板S之γ軸移動以形成γ 參 軸方向之膠囷案。 (b) 基板S之X轴移動及喷嘴62之X軸移動之方 式使喷嘴62之移動方向與基板S之移動方向相反’以 形成X軸方向之膠圖案，以及喷嘴62之γ轴移動以形 成Y軸方向之膠圖案。 (c) 喷嘴62之X轴移動以形成X軸方向之膠圖案， 以及基板S之γ軸移動及喷嘴62之Y轴移動之方式使 春 喷嘴62之移動方向與基板s之移動方向相反，以形成γ 軸方向之膠圖案。 (d) 基板S之X軸移動以形成X轴方向之膠圖案， 以及基板S之γ轴移動及喷嘴62之Y轴移動之方式使 喷嘴62之移動方向與基板s之移動方向相反，以形成γ 軸方向之膠圖案。 12 201020034 (e)基板S之χ軸移動及嘴嘴62之χ軸移動之方 式使喷嘴62之移動方向與基板s之移動方向相反，以 形成X軸方向之膠圖案，以及基板§之丫轴移動及喷嘴 62之Y軸移動之方式使喷嘴62之移動方向與基板s之 移動方向相反，以形成γ轴方向之膠圖案。 根據本發明之點膠機之控制單元4〇可透過上述控 • 制方法控制基板移動單元20及喷嘴移動單元30。根據 本發明利用點膠機之塗佈方法可包含所有前述控制方 法。 於下’利財法(e)之塗佈方法將表示為第一實施 例’而利用方法(e)之塗佈方法將表示為第二實施例。 ^下將綱__方法作為發日聰例之代表。由於方 ❿ 這)、⑹、及⑷之詳細說明。然而， ^人仍洛人本發明範圍，且根據本發明之塗佈方 法匕3所有前述方法(a)至方法(e)。 ，將參考圖4至圖6說明根據本發明第-實施 例之塗佈膠之方法。 私乃弟賞施 第四H本㈣第—實闕之顯料法包含第-到 驟。於第一步驟，當頭單元60相對於裝設於平 201020034 ==移= ㈣於、方向“ 〃、十σ 21之移動方向相反時，塗佈延 舍頭單元於基板s，如圖5所示。於第三步驟，When the spray village moves ^m3/moves in the W direction unit=° plate==2° and (1) the X-axis movement of the substrate S and the movement of the nozzle 62, the movement direction of the nozzle 62 and the substrate S moves in the opposite direction. (2) The Y-axis movement of the substrate S and the Y-axis movement of the nozzle 62 are such that the moving direction of the nozzle 62 is opposite to the moving direction of the substrate S. The method (1) can be applied to the case where the glue extending in the X-axis direction is coated on the substrate S, and the method (2) can be applied to the case where the glue extending in the Y-axis direction is coated on the substrate S. 11 201020034 In order to form a rectangular paste pattern on the substrate s, in addition to the substrate s and the reverse movement in the x-axis direction or the γ-axis direction, the following control methods can be additionally considered. (a) the X-axis movement of the substrate S and the X-axis movement of the nozzle 62 are such that the moving direction of the nozzle 62 is opposite to the moving direction of the substrate s to form a plastic film in the X-axis direction, and the γ-axis movement of the substrate S is A plastic case with a gamma axis direction is formed. (b) the X-axis movement of the substrate S and the X-axis movement of the nozzle 62 are such that the moving direction of the nozzle 62 is opposite to the moving direction of the substrate S to form a glue pattern in the X-axis direction, and the γ-axis of the nozzle 62 is moved to form The rubber pattern in the Y-axis direction. (c) the X-axis of the nozzle 62 is moved to form a glue pattern in the X-axis direction, and the γ-axis movement of the substrate S and the Y-axis movement of the nozzle 62 are such that the moving direction of the spring nozzle 62 is opposite to the moving direction of the substrate s, A glue pattern in the direction of the γ-axis is formed. (d) the X-axis of the substrate S is moved to form a glue pattern in the X-axis direction, and the γ-axis movement of the substrate S and the Y-axis movement of the nozzle 62 are such that the moving direction of the nozzle 62 is opposite to the moving direction of the substrate s to form A glue pattern in the γ-axis direction. 12 201020034 (e) The movement of the axis of the substrate S and the movement of the nozzle 62 are such that the direction of movement of the nozzle 62 is opposite to the direction of movement of the substrate s to form a pattern of the glue in the X-axis direction, and the axis of the substrate The movement and the Y-axis movement of the nozzle 62 are such that the direction of movement of the nozzle 62 is opposite to the direction of movement of the substrate s to form a glue pattern in the γ-axis direction. The control unit 4A of the dispenser according to the present invention can control the substrate moving unit 20 and the nozzle moving unit 30 by the above-described control method. The coating method using the dispenser according to the present invention may include all of the aforementioned control methods. The coating method of the lower method (e) will be referred to as the first embodiment, and the coating method using the method (e) will be referred to as the second embodiment. ^ Under the outline __ method as a representative of the Japanese. Due to the detailed description of this, (6), and (4). However, it is still within the scope of the invention, and the coating method according to the invention 匕3 all of the aforementioned methods (a) to (e). A method of applying a glue according to a first embodiment of the present invention will be explained with reference to Figs. 4 to 6 . The private law is rewarded by the fourth H (4) - the actual method of the material contains the first-to-be. In the first step, when the head unit 60 is opposite to the moving direction of the direction “〃, ten σ 21”, the head unit 60 is coated on the substrate s as shown in FIG. 5 . In the third step,
i元60於第-HX轴方向之方式使其移動方向與頭 轴方=驟之移動方向相反時，塗佈延伸於X S f 所塗之料行之膠於基板S，如圖 =吏1移動=驟’當平台一 ^ 相反’且頭單元6。向二平二動方向 向與頭去樘m 轴方向方式使其移動方 延伸於YM ^第二步驟之移動方向相反時，塗佈 S。當以財^行^二^騎仅科狀膠於基板 成矩形職^ 到第四步騎，於基板s上形 於基實施例之塗佈方法中，當塗佈勝 之Υ軸方向時，裝設於平台21上之基板5斑 =於^料31且排出膠之喷嘴62同時移動二= Γ之速因度%條件下，綱相物When the i-element 60 is in the direction of the first-HX axis, the direction of movement is opposite to the direction of movement of the head-axis=step, the glue extending on the substrate coated by XS f is applied to the substrate S, as shown in FIG. = "When the platform is a ^ opposite" and the head unit 6. S is applied to the direction of the second plane and the direction of the head to the direction of the m-axis so that the movement is extended to the YM. When the moving direction of the second step is reversed, S is applied. When it is used to make a rectangular shape from the substrate to the fourth step, it is formed on the substrate s in the coating method of the base embodiment, and when the coating is in the direction of the axis, The substrate 5 spot on the platform 21 is the same as the material 31 and the nozzle 62 for discharging the glue moves at the same time.
m 4㈣嘴62相對於基板S之速度’高於當A ΓίΓ 62其中之一移動時之基板3或喷嘴⑽：； 度因此’增加了整體塗佈速度。 迷 201020034 再者’由於其上裝設有基板S之平台21之γ軸移 動所產生的反作用力方向，與支推頭單元6〇之頭支撲 件31之Υ軸移動所產生之反作用力方向相反，因此彼 此的反作用力可抵銷。因此，降低了平台21及頭支樓 件31之Υ軸移動所產生的振動。 於根據本發明第一實施例之塗佈方法中，基板S及 Φ 喷嘴62間之相對速度，高於基板s或喷嘴62單獨移動 之速度，且因為基板S及喷嘴62移動於相反方向而使 彼此的反作用力抵銷，所以相較於習知膠塗佈方法，增 加了塗佈速度以及降低了振動。 同時，較佳形成具有圓角之膠圖案於基板S上。為 達此目的，在第一及第二步驟間，或第三及第四步驟 間，可進一步提供逐漸降低頭單元6〇於χ軸方向移動 魯的速度以及逐漸增加平台21及頭支撐件31於Υ軸方向 移動之速度之步驟，來塗佈圓化的膠。再者，在第二及 第三步驟間，或在第四步驟後，可進一步提供逐漸降低 平台21及頭支撐件31於Υ軸方向移動的速度以及逐漸 增加頭單元60於X軸方向移動之速度之步驟。透過這 樣的程序’形成具有圓角之膠圖案於基板S上，並且持 續執行塗钸膠於基板S上之程序，因而避免缺陷膠圖案 並增加膠塗佈速度。 201020034 但是本發明不限於上述方法。為了形成具有圓角之 耀·圖案於基板s上，在第一及第二步驟間，或第三及第 四步驟間，可包含以下步驟，當逐漸降低頭單元6〇於叉 軸方向移動的速度、停止平台21或頭支撐件31其中之 一於Y轴方向的移動、以及逐漸增加其餘者於γ軸方向 移動之速度，來塗佈圓化的膠。再者，在第二及第三步 驟間，以及在第四步驟後，可包含以下步驟，當停止平 ❿ 台21或頭支樓件31其中之一於γ軸方向的移動、逐新 降低其餘者於γ轴方向移動的速度、以及逐漸增加頭單 元60於X軸方向移動之速度，來塗佈圓化的膠。亦即， 於根據本發明第一實施例之膠塗佈方法中，基板s及噴 嘴62於線性區段同時移動於相反方向，而基板s及噴 嘴62於角落區段不同時移動於相反方向。亦即，於角 洛又，僅基板S移動於X轴方向，以及僅喷嘴62移 動於Y軸方向。選替地，僅基板5移動於γ軸方向，以 及僅喷嘴62移動於X軸方向。 ❹ 於後，將參考圖7至圖g說明根據本發明第二實施 例之塗佈膠之方法。 々根據本發明第二實施例之膠塗佈方法包含第一到 ^四步驟。於第-步驟’ t頭單元6M目對於裝設於平 台21上之基板S移動於义財向以及平台21移動於 X轴方向使其移動方向與頭單元⑼之移動方向相反時， 201020034 塗佈延伸於x軸方向之膠於基板s，如圖7所示。於第 -步驟’當平台21移動於γ軸方向且頭切件31移動 於γ轴方向之方式使其軸方向解台21之移動方向 相反時，塗佈延伸於Y軸方向之黟於基板S，如圖8所 不。於第三步驟，當頭單元6G機於X軸方向之方式 使其移動方向與頭單元6〇於第-步驟之移動方向相 =以及平台21移動於Χ軸方向之方式使其移動方向 與平台21於第—步驟之鑛方向減時，塗佈延伸於χ ，方向以與第—步驟所塗之膠平行之雜基板s，如圖 所不。再者，於第四步驟，當平台21移動於γ軸方向 之^使其義方向與平台21於第二步驟之移動方向 金且Γ讀件&移動於Υ軸方向之方式使其移動 :向與頭支樓件31於第二步驟之移動方向相反時，塗 ^伸轴方向以與第二步驟所塗之膠平行之膠於基 ί板j由執行第—到第四步驟，可形成矩形膠圖案於 3據本發明第二實關之塗佈方法中，當塗佈膠 裝x軸方向時’裝設於平台21上之基板S與 6〇之噴嘴62同時移動於相反方向。同 =膠於基板S之Y軸方向時，裝設於平台21 時移設於頭支撐件31且排出膠之喷嘴62同 s相對方向。因此’在相同的振動條件下，基板 於喷嘴62之速度，或噴嘴62相對於基板S之速 201020034 度’高於當基板S或喷嘴62其中之一移動時之基板s 或喷嘴62之速度。結果，增加了整體塗伟速度。 再者’由於其上裝設有基板S之平台21之X軸移 動所產生的反作用力方向，與備有喷嘴62之頭單元6〇 之X軸移動所產生之反作用力方向相反，因此彼此的反 作用力可抵銷。因此，可降低平台21及頭單元60之又 軸移動所產生的振動。再者，由於其上裝設有基板S之 平台21之Y轴移動所產生的反作用力方向，與支推頭 單元60之頭支撐件31之Y轴移動所產生之反作用力方 向相反’因此彼此的反作用力可抵銷。因此，可降低平 台21及頭支撐件31之Y軸移動所產生的振動。 如此一來，根據本發明第二實施例之塗佈方法之優 勢在於，基板S及喷嘴62 @之相對速度，高於基板s 或噴嘴62單獨移動之速度，且因為基板s及喷嘴62移 動於相反方向而使彼此的反作用力抵銷，實現了塗佈速 度的增加以及振動的降低。 同時’較佳軸具有圓角之膠_於基板5上。為 達此目的，在第-及第二步驟間，或第三及第四步驟 間’可包含以下步驟’逐漸降低頭單元6〇及平台21於 X軸方向移動的速度’以及逐漸增加平台21及頭支樓件 31於Y軸方向移動之速度，來塗佈圓化的膠。再者，在 18 201020034 第二及第二步驟間，或在第四步驟後，可包含以下步 驟，逐漸降低平台21及頭支撑件31於Y轴方向移動的 速度’以及逐漸増加頭單元6〇及平台21於X軸方向移 動之速度。透過這樣的程序，形成具有圓肖之膠圖案於 基板S上，此外並持續執行塗佈膠於基板s上之程序， 因而避免缺陷膠圖案並增加膠塗佈速度。 ❹ 但是本㈣樣於上述方法。為了形成具有圓角之 膠圖案於基板S上，在第—及第二步驟間，或第三及第 四步驟間，可包含以下步驟，當停止頭單元6G ΐ平台 21其中之-於X軸方向的移動以及逐漸降低其餘者於X 軸方向移動的速度、以及停止平台21或頭支撐件31其 中之一於¥轴方向的移動以及逐漸增加其餘者於Υ軸^ 向移動之速度，來塗佈圓化的膠。再者，在第二及第三 步驟間，以及在第四步驟後，可包含以下步驟，當停止 • 平台21或頭支擇件31其中之一於Y軸方向的移動以及 逐漸降低其餘者於Y轴方向移動的速度、以及停止頭單 元60或平台21其中之一於X軸方向的移動以及逐漸增 加其餘者於X軸方向移動之速度，來塗佈圓化的谬。亦 即，於根據本發明第二實施例之膠塗佈方法中，基板s 及喷嘴62於線性區段同時移動於相反方向而基板$ 及噴，62於角落區段不同時移動於相反方向。亦即， 於角落區段，僅基板5移動於x軸方向，以及僅喷嘴62 移動於y軸方向。選替地，僅基板s移動於y轴方向， J9 201020034 以及僅喷嘴62移動於X轴方向。 同時’根據本發明必須最佳化點膠機之塗佈速度的 增加及振動的降低。於後，將說明最佳化塗佈速度之方 法。 塗佈速度與振動衰減效能成反比。亦即，若塗佈迷 0 度增加則振動增加。相對地’若塗佈速度降低則振動降 低。可由以下質量及加速度方程式計算最佳化之塗佈速 度增加及減少振動。 F=MA=ma=f ⑴ 於方程式（1)中，F表示平台21移動所產生之反作 用力大小，Μ表示平台21及與平台21 —起移動之物件 _ (X軸驅動部22及Υ轴驅動部23)之總質量，Α表示平台 21之加速度’ f表示頭支撐件31(;或頭單元6〇)移動所 產生之反作用力大小，m表示頭支撐件31 (或頭單元6〇) 及與頭支推件31(或頭單元60) —起移動之物件（支撐件 移動部及頭移動部）之總質量，a表示頭支撲件31(或頭 早元60)之加速度。 亦即’當基板S移動所產生之反作用力J?及噴嘴62 移動所產生之反作用力f彼此方向不同但大小相同時， 20 201020034 可得到最佳的振動衰減效能。因此，若計算與基板s〜 起移動之物件之質量Μ以及與噴嘴62 —起移動之物件 之質量m ’則得到基板s之加速度Α與噴嘴62之加連度 a間之關係。因此，當計算基板s之最大移動速度時， 可最佳化喷嘴62之移動速度。當計算噴嘴62之最大移 動速度時，可最佳化基板S之移動速度。 _ 同時’當塗佈膠於一疊基板S時，可透過利用雷射 位移感測器63之方法以及利用截面積感測器66之方法 之至少其中之一方法，計算基板S之最大移動速度或嘴 嘴62之最大移動速度。 亦即，利用雷射位移感測器63計算基板s或嘴嘴 62之最大移動速度之方法包含以下步驟，當增加或降低 基板S或喷嘴62之移動速度時，量測基板s及喷嘴62 φ 間之間隙資料；決定基板S及喷嘴62間之間隙資料是 否超出參考範圍；以及當基板S及噴嘴62間之間隙資 料在參考範圍内時’計算基板S或嘴嘴62之最大速度。 再者，利用截面積感測器66計算基板s或喷嘴62 之最大移動速度之方法包含以下步驟，當增加或降低基 板S或喷嘴62之移動速度時，塗佈膠於基板§上；量 測塗佈於基板S上之膠之截面積；決定基板s及喷嘴62 間之截面積是否超出參考範圍；以及當基板S及喷嘴62 21 201020034 間之截面積在參考範圍内時，計算基板S或喷嘴62之 最大速度。 當透過上述方法計算基板S或噴嘴62之最大速度 時’由基板S及噴嘴62間之加速度關係，計算於振動 衰減效能及塗佈速度最佳化時之基板s及喷嘴62之移 動速度。 於如上所述架構之點膠機以及利用根據本發明之 點膠機之膠塗佈方法中，裝設於平台21上之基板s以 及裝設於由頭支撐件31所支撐之頭單元6〇之喷嘴62 同時移動於相反方向，相較於基板s或喷嘴62其中之 一為固定的案例，增加了膠塗佈速度。 用力方向，與頭与 ’與頭單元60或頭支樓件31移動所產生之反The speed of the m 4 (four) nozzle 62 relative to the substrate S is higher than when the substrate 3 or the nozzle (10) when one of the A Γ Γ 62 moves: thus increasing the overall coating speed. Fan 201020034 Furthermore, the direction of the reaction force generated by the movement of the y-axis of the platform 21 on which the substrate S is mounted is the direction of the reaction force generated by the movement of the yoke of the head member 6 of the ram unit 6 Instead, the reaction forces of each other can be offset. Therefore, the vibration generated by the movement of the cymbal shaft of the platform 21 and the head support 31 is reduced. In the coating method according to the first embodiment of the present invention, the relative speed between the substrate S and the Φ nozzle 62 is higher than the speed at which the substrate s or the nozzle 62 is individually moved, and because the substrate S and the nozzle 62 move in opposite directions. The reaction forces of each other are offset, so that the coating speed is increased and the vibration is reduced compared to the conventional glue coating method. At the same time, it is preferable to form a rubber pattern having rounded corners on the substrate S. To achieve this, between the first and second steps, or between the third and fourth steps, it is further provided to gradually reduce the speed at which the head unit 6 moves in the direction of the x-axis and gradually increase the platform 21 and the head support 31. The rounded glue is applied in the step of moving at the speed of the x-axis. Furthermore, between the second and third steps, or after the fourth step, the speed of gradually moving the platform 21 and the head support 31 in the x-axis direction and gradually increasing the movement of the head unit 60 in the X-axis direction may be further provided. The speed step. Through such a procedure, a glue pattern having rounded corners is formed on the substrate S, and the process of applying the glue on the substrate S is continuously performed, thereby avoiding the defective glue pattern and increasing the speed of the glue application. 201020034 However, the invention is not limited to the above method. In order to form a blazed pattern with rounded corners on the substrate s, between the first and second steps, or between the third and fourth steps, the following steps may be included, when the head unit 6 is gradually lowered in the direction of the fork axis The rounded glue is applied by the speed, the movement of one of the stop platforms 21 or the head support 31 in the Y-axis direction, and the speed at which the others move in the γ-axis direction. Furthermore, between the second and third steps, and after the fourth step, the following steps may be included, when the movement of one of the flat table 21 or the head support member 31 is stopped in the γ-axis direction, and the rest is newly lowered. The rounded glue is applied by the speed of movement in the γ-axis direction and the speed at which the head unit 60 is moved in the X-axis direction. That is, in the glue applying method according to the first embodiment of the present invention, the substrate s and the nozzle 62 are simultaneously moved in opposite directions in the linear section, and the substrate s and the nozzle 62 are moved in opposite directions when the corner sections are not simultaneously. That is, in the corner, only the substrate S moves in the X-axis direction, and only the nozzle 62 moves in the Y-axis direction. Alternatively, only the substrate 5 is moved in the γ-axis direction, and only the nozzle 62 is moved in the X-axis direction. Hereinafter, a method of applying a paste according to a second embodiment of the present invention will be described with reference to Figs. 7 to g. The glue coating method according to the second embodiment of the present invention comprises the first to fourth steps. In the first step, the head unit 6M is applied to the substrate S mounted on the platform 21 to move in the positive direction, and the platform 21 is moved in the X-axis direction so that the moving direction is opposite to the moving direction of the head unit (9), 201020034 coating The glue extending in the x-axis direction is on the substrate s as shown in FIG. In the first step 'when the stage 21 moves in the γ-axis direction and the head-cut member 31 moves in the γ-axis direction such that the direction of movement of the axial direction disengaging table 21 is reversed, the coating extends in the Y-axis direction on the substrate S. As shown in Figure 8. In the third step, when the head unit 6G is in the X-axis direction, the moving direction thereof is opposite to the moving direction of the head unit 6 in the first step = and the platform 21 is moved in the z-axis direction to move the direction and the platform 21 When the direction of the first step is reduced, the miscellaneous substrate s extending in the direction of the crucible and parallel to the glue coated in the first step is applied as shown in the figure. Furthermore, in the fourth step, when the platform 21 moves in the γ-axis direction and moves the direction of the platform 21 in the moving direction of the second step and the reading member & moves in the direction of the x-axis: When the moving direction of the head supporting member 31 is opposite to the moving direction of the second step, the coating is performed in the direction parallel to the glue coated in the second step, and the glue is applied to the base plate j to perform the first to fourth steps. In the coating method according to the second embodiment of the present invention, the substrate S mounted on the stage 21 and the nozzle 62 of the 6 同时 are simultaneously moved in opposite directions when the x-axis direction is applied. When the glue is applied to the Y-axis direction of the substrate S, when it is mounted on the stage 21, it is moved to the head support member 31 and the nozzle 62 for discharging the glue is opposite to the s. Thus, under the same vibration conditions, the speed of the substrate at the nozzle 62, or the speed of the nozzle 62 relative to the substrate S, 201020034' is higher than the speed of the substrate s or the nozzle 62 when one of the substrate S or the nozzle 62 moves. As a result, the overall speed of the coating is increased. Furthermore, the direction of the reaction force generated by the X-axis movement of the stage 21 on which the substrate S is mounted is opposite to the reaction force generated by the X-axis movement of the head unit 6 provided with the nozzle 62, and thus The reaction can be offset. Therefore, the vibration generated by the shaft movement of the stage 21 and the head unit 60 can be reduced. Further, the direction of the reaction force generated by the Y-axis movement of the stage 21 on which the substrate S is mounted is opposite to the reaction force generated by the Y-axis movement of the head support member 31 of the urging head unit 60. The reaction can be offset. Therefore, the vibration generated by the Y-axis movement of the stage 21 and the head support 31 can be reduced. As a result, the coating method according to the second embodiment of the present invention is advantageous in that the relative speed of the substrate S and the nozzle 62 @ is higher than the speed at which the substrate s or the nozzle 62 is separately moved, and since the substrate s and the nozzle 62 are moved at In the opposite direction, the reaction forces of each other are offset, and an increase in the coating speed and a decrease in vibration are achieved. At the same time, the 'better axis has a rounded glue _ on the substrate 5. To achieve this, between the first and second steps, or between the third and fourth steps, 'the following steps can be included to gradually reduce the speed at which the head unit 6〇 and the platform 21 move in the X-axis direction' and gradually increase the platform 21 The rounded glue is applied to the speed at which the head support member 31 moves in the Y-axis direction. Furthermore, between the second and second steps of 18 201020034, or after the fourth step, the following steps may be included to gradually reduce the speed at which the platform 21 and the head support 31 move in the Y-axis direction and gradually increase the head unit 6〇. And the speed at which the platform 21 moves in the X-axis direction. Through such a procedure, a paste pattern having a circular pattern is formed on the substrate S, and further, the process of applying the glue on the substrate s is continuously performed, thereby avoiding the defective adhesive pattern and increasing the speed of the coating of the glue. ❹ But this (4) is like the above method. In order to form a rubber pattern having rounded corners on the substrate S, between the first and second steps, or between the third and fourth steps, the following steps may be included, when the head unit 6G is stopped, and the platform 21 is on the X axis. The movement of the direction and the gradual decrease of the speed of the movement of the rest in the X-axis direction, and the movement of one of the stop plate 21 or the head support 31 in the direction of the ¥ axis and the speed of the other movement in the y-axis are gradually applied. Cloth rounded glue. Furthermore, between the second and third steps, and after the fourth step, the following steps may be included, when the movement of one of the platform 21 or the head support member 31 is stopped in the Y-axis direction and the rest is gradually lowered The speed of the movement in the Y-axis direction, and the movement of one of the head unit 60 or the stage 21 in the X-axis direction and the speed at which the others move in the X-axis direction are gradually applied to coat the rounded flaw. That is, in the glue applying method according to the second embodiment of the present invention, the substrate s and the nozzle 62 are simultaneously moved in opposite directions in the linear section while the substrate $ and the spray 62 are moved in opposite directions when the corner sections are not at the same time. That is, in the corner section, only the substrate 5 moves in the x-axis direction, and only the nozzle 62 moves in the y-axis direction. Alternatively, only the substrate s moves in the y-axis direction, J9 201020034 and only the nozzle 62 moves in the X-axis direction. At the same time, the increase in the coating speed of the dispenser and the reduction in vibration must be optimized according to the present invention. Hereinafter, a method of optimizing the coating speed will be described. The coating speed is inversely proportional to the vibration attenuation efficiency. That is, if the coating degree is increased by 0 degrees, the vibration is increased. Relatively, if the coating speed is lowered, the vibration is lowered. The optimum coating speed can be calculated and reduced by the following mass and acceleration equations. F=MA=ma=f (1) In Equation (1), F represents the magnitude of the reaction force generated by the movement of the platform 21, and Μ represents the platform 21 and the object moving with the platform 21 (the X-axis drive unit 22 and the x-axis) The total mass of the driving portion 23), Α indicates that the acceleration 'f of the platform 21 indicates the magnitude of the reaction force generated by the movement of the head support 31 (or the head unit 6〇), and m indicates the head support 31 (or the head unit 6〇). And the total mass of the moving object (the supporting member moving portion and the head moving portion) which is moved together with the head supporting member 31 (or the head unit 60), and a represents the acceleration of the head supporting member 31 (or the head element 60). That is, when the reaction force J generated by the movement of the substrate S and the reaction force f generated by the movement of the nozzle 62 are different from each other but the same magnitude, 20 201020034 can obtain the best vibration damping performance. Therefore, the relationship between the acceleration 基板 of the substrate s and the degree of addition a of the nozzle 62 is obtained by calculating the mass Μ of the object moving from the substrate s~ and the mass m' of the object moving together with the nozzle 62. Therefore, when the maximum moving speed of the substrate s is calculated, the moving speed of the nozzle 62 can be optimized. When the maximum moving speed of the nozzle 62 is calculated, the moving speed of the substrate S can be optimized. _ At the same time, when the glue is applied to a stack of substrates S, the maximum moving speed of the substrate S can be calculated by at least one of the method using the laser displacement sensor 63 and the method using the cross-sectional area sensor 66. Or the maximum moving speed of the mouth 62. That is, the method of calculating the maximum moving speed of the substrate s or the nozzle 62 by the laser displacement sensor 63 includes the following steps: when the moving speed of the substrate S or the nozzle 62 is increased or decreased, the substrate s and the nozzle 62 are measured. The gap data between the substrate S and the nozzle 62 determines whether the gap data exceeds the reference range; and when the gap data between the substrate S and the nozzle 62 is within the reference range, the maximum speed of the substrate S or the nozzle 62 is calculated. Furthermore, the method for calculating the maximum moving speed of the substrate s or the nozzle 62 by the cross-sectional area sensor 66 includes the following steps: when the moving speed of the substrate S or the nozzle 62 is increased or decreased, the coating glue is applied to the substrate §; The cross-sectional area of the glue applied to the substrate S; determining whether the cross-sectional area between the substrate s and the nozzle 62 exceeds the reference range; and when the cross-sectional area between the substrate S and the nozzle 62 21 201020034 is within the reference range, calculating the substrate S or The maximum speed of the nozzle 62. When the maximum speed of the substrate S or the nozzle 62 is calculated by the above method, the moving speed between the substrate s and the nozzle 62 when the vibration damping performance and the coating speed are optimized is calculated from the acceleration relationship between the substrate S and the nozzle 62. In the dispensing machine constructed as described above and the glue applying method using the dispensing machine according to the present invention, the substrate s mounted on the stage 21 and the head unit 6 supported by the head supporting member 31 are disposed. The nozzle 62 is simultaneously moved in the opposite direction, and the glue coating speed is increased as compared with the case where one of the substrate s or the nozzle 62 is fixed. The direction of force, the opposite of the head and the movement of the head unit 60 or the head support member 31
再者，於點膠機以及利用根據本發明之點膠機之膠 塗佈方法中’支托基板S之平台21移祕產生之反作Further, in the dispenser and the glue coating method using the dispenser of the present invention, the substrate 21 of the support substrate S is secretly produced.
22 201020034 再者’本發明提供一種點膠機以及利用此點膠機塗 佈膠之方法’其中支托基板之平台移動所產生的反作用 力方向’與頭單元或頭支撐件移動所產生的反作用力方 向相反，使得反作用力可彼此抵銷，藉此可更有效地降 低基板或喷嘴移動所造成之振動。 ❿ 再者，本發明提供一種點膠機以及利用此點膠機塗 佈膠之方法，其中基板及喷嘴同時移動於相反方向於 膠塗佈操作期間可使基板或噴嘴之移動距離，比基板或 喷嘴其中之-移動於一個方向時之基板或喷嘴之移動 距離還短。因此，相較於習知_機，根據本發明之點 膠機可具有縮小的尺寸，而易於搬運。 本發明前述實施例可單獨實施，亦可結合實施例。 雖然已揭露本發截佳實施例作為說_例，孰此技術 T者應明瞭在不挣離本發明申請專利範圍界定之精 神與範疇下可有各種修改、添加、及替換。 【圖式簡單說明】 本發明上述及其他目的、特徵及其他優 細說明並配合伴隨圖式，將更加清楚了解，其中: 圖1為根據本發明之點膠機之透視圖，·、 圖2為根據本發明之轉機之控制方塊圓； 23 201020034 圖3為根據本發明之點夥機之頭單元之透視圖； 膠圖4至圖6為根據本發明第一實施例依序顳示塗佈 "之方法之透視圖；以及 圖7至圖9為根據本發明第二實施例依序顯 膠之方法之透視圖。 4 【主要元件符號說明】 樞架 2022 201020034 Furthermore, the present invention provides a dispensing machine and a method for coating a glue using the same, in which the reaction force direction generated by the movement of the platform of the supporting substrate is counteracted by the movement of the head unit or the head support. The forces are reversed so that the reaction forces can cancel each other, thereby more effectively reducing the vibration caused by the movement of the substrate or nozzle. Further, the present invention provides a dispenser and a method of coating a glue using the same, wherein the substrate and the nozzle are simultaneously moved in opposite directions to allow the substrate or nozzle to move a distance during the glue coating operation, compared to the substrate or Among the nozzles, the moving distance of the substrate or the nozzle when moving in one direction is short. Therefore, the dispenser according to the present invention can have a reduced size and is easy to handle as compared with the conventional machine. The foregoing embodiments of the present invention may be implemented separately or in combination with the embodiments. Although the present invention has been disclosed as a singular example, it should be understood that various modifications, additions, and substitutions may be made without departing from the spirit and scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and other advantages of the present invention will become more apparent from the accompanying drawings, in which: Figure 1 is a perspective view of a dispensing machine in accordance with the present invention, The control unit circle of the transfer machine according to the present invention; 23 201020034 FIG. 3 is a perspective view of the head unit of the point machine according to the present invention; the glue drawings 4 to 6 show the coating in sequence according to the first embodiment of the present invention. A perspective view of a method of "; and Figures 7 through 9 are perspective views of a method of sequentially displaying glue in accordance with a second embodiment of the present invention. 4 [Key component symbol description] Pivot frame 20
21 22 23 30 31 32 33 40 60 61 62 63 66 221 231 基板移動單元 平台 X軸驅動部 γ軸驅動部 噴嘴移動單元 頭支撐件 頭移動部 支撐件移動部 控制單元 頭單元 注射器 嘴嘴 雷射位移感測器 截面積感測器 X軸導引件 Y軸導引件 2421 22 23 30 31 32 33 40 60 61 62 63 66 221 231 Substrate moving unit platform X-axis drive unit γ-axis drive unit Nozzle moving unit head support head moving part support moving part control unit head unit injector nozzle laser displacement Sensor sectional area sensor X-axis guide Y-axis guide 24