201018324 '厶 _i0-0-TW 29697twf.doc/n 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種線路板’且特別是有關於一種同 時具有軟性線路及硬性線路的軟硬線路板。 【先前技術】 〜就介電層的軟硬性質不同，線路板包括硬性線路板 ❹（間稱硬板）、軟性線路板（簡稱軟板）及軟硬線路板（簡 稱軟硬板）。軟硬板的製程同時在軟性介電層及硬性介電 層上製作導電線路，這使得軟硬板同時具有軟性線路及硬 式線路。在電子產品的内部空間急遽壓縮的情況下，由於 軟硬板提供了零件連接與組裝空間的最大彈性，所以電子 產品經常採用軟硬板作為其零件載具。 【發明内容】 φ 本發明提供一種軟硬線路板，以提供屏蔽效果。 本發明提出一種軟硬線路板，其包括多個硬性線路、 一軟性線路及一屏蔽薄膜。軟性線路連接於這些硬性線路 • ^間，並具有一接地墊，其暴露於軟性線路之一表面。屏 蔽薄膜覆蓋軟性線路的表面，並連接接地墊。 在本發明之一實施例中，軟性線路具有一凸部，其突 出自軟性線路的一側緣，而接地墊位於凸部。 在本發明之一實施例中，軟性線路具有—接地線，而 接地塾為接地線的—部分。 201018324 jh i /-iiO-O-TW 29697twf.doc/n 在本發明之-實施例中，軟性線路更具有一軟性介電 層，其覆蓋接地線，但暴露出接地墊。 在本發明之-實施例中，屏蔽薄膜藉由接地線連接至 這些硬性線路的接地。 在本發明之-實施例中，軟硬線路板更包括一軟性絕 緣層’其配置於軟性、線路的表面上，並覆蓋屏蔽薄膜。 在本發明之一實施例中，屏蔽薄膜為導電材質。 〇 在本發明之一實施例中，屏蔽薄膜為一銀膜。 本發明更提種軒裝置，其包含上狀軟硬線路 板。 + —基於上述，本發明乃疋藉由將覆蓋在軟性線路上的屏 蔽薄膜直接連接軟性線路的接地墊，以使屏蔽薄膜間接地 藉由軟性線路而連接至這些硬性線路的接地。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉實施例’並配合所附圖式作詳細說明如下。 實施方式】 ^圖1為本發明之實施例之一種軟硬線路板的俯視圖。 °月參考圖1，本實施例之軟硬線路板1〇〇具有多個硬性線 路110及一軟性線路120。這些硬性線路11〇是以硬性介 電材質作為其介電層材質，且這些硬性線路110是用來承 載電子零件或連接器。此外，軟性線路120則以軟性介電 材質作為其介電層材質，且軟性線路120連接於這些硬性 線路板110之間’用以傳遞電性訊號。 29697twf.doc/n 2〇1〇18324〇.〇.tw 圖2為圖1之軟硬線路板的A區域的放大圖，圖3為 圖2之軟硬線路板的沿3-3線的刳面圖。請參考圖1、圖2 及圖3，為了提供良好的屏蔽給軟性線路120内的多條導 線’軟硬線路板100更包括一屏蔽薄膜130 (見圖3)，其 覆蓋軟性線路120的一表面。 為了讓屏蔽薄膜130接地，軟性線路120具有一接地 墊122a’，其暴露於軟性線路丨2〇的上述表面，如圖3所 參 示。因此，當屏蔽薄膜130覆蓋軟性線路120的上述表面 時，屏蔽薄膜130將穿過上方的軟性介電層124的開口 124a而結構性地連接接地墊122a，，用以電性連接至硬性 線路110的接地。 在本實施例中’屏蔽薄膜130可經由接地墊122a，連 接至硬性線路110的接地。導電材質的屏蔽薄膜13〇可為 一銀膜。 在本實施例中，軟性線路120具有一接地線122a及 軟性介電層124a，其中接地墊122a，為接地線122a的一 擊冑分，並暴露於軟性介電層124a之外。此外，軟性線路 120更具有一凸部12〇a，其突出自軟性線路12〇的一侧緣， 而接地墊122a為接地線122a的一外凸部分，而位於凸部 12〇a 〇 在本實施例中，除了上方的軟性介電層124以外，軟 =線路12G更具有兩導電圖案122和另兩軟性介電層 入4’其中這些導電圖案122及這些軟性介電層124交替疊 σ，而上方的導電圖案122更構成了接地線122&及多條位 201018324 π 1 /zjO-O-TW 29697twf.doc/n 於接地線122a旁的訊號線122b。 在本實施例中’軟硬線路板100更具有—軟性絕緣層 H0 ’其酉己置於軟性線路120 #表面上，並覆蓋屏蔽薄^ 130 ’詳細結構如圖3所示。軟性絕緣層14〇可預防屏蔽 膜130與外界相互電性連接。 '201018324 '厶_i0-0-TW 29697twf.doc/n VI. Description of the Invention: [Technical Field] The present invention relates to a circuit board and, in particular, to a soft circuit having both a flexible circuit and a rigid circuit Hard circuit board. [Prior Art] ~ As for the soft and hard properties of the dielectric layer, the circuit board includes a rigid circuit board (referred to as a hard board), a flexible circuit board (referred to as a soft board), and a hard and soft circuit board (referred to as a soft and hard board). The process of the soft and hard board simultaneously makes conductive lines on the flexible dielectric layer and the hard dielectric layer, which makes the soft and hard boards have both flexible lines and hard lines. In the case where the internal space of the electronic product is rapidly compressed, since the soft and hard board provides the maximum flexibility of the parts connection and assembly space, the electronic product often uses a soft and hard board as its part carrier. SUMMARY OF THE INVENTION The present invention provides a soft and hard circuit board to provide a shielding effect. The invention provides a soft and hard circuit board comprising a plurality of rigid lines, a flexible circuit and a shielding film. The flexible circuit is connected between these rigid lines and has a ground pad that is exposed to one surface of the flexible circuit. The shielding film covers the surface of the flexible circuit and is connected to the ground pad. In one embodiment of the invention, the flexible circuit has a projection that protrudes from a side edge of the flexible circuit and the ground pad is located at the projection. In one embodiment of the invention, the flexible circuit has a - ground line and the ground 塾 is a portion of the ground line. 201018324 jh i /-iiO-O-TW 29697twf.doc/n In the embodiment of the invention, the flexible circuit further has a soft dielectric layer covering the ground line but exposing the ground pad. In an embodiment of the invention, the shielding film is connected to the ground of the rigid lines by a grounding wire. In the embodiment of the invention, the hard and soft circuit board further comprises a soft insulating layer which is disposed on the surface of the flexible, wiring and covers the shielding film. In an embodiment of the invention, the shielding film is made of a conductive material. In one embodiment of the invention, the shielding film is a silver film. The invention further discloses a seed device comprising an upper hard and soft circuit board. + - Based on the above, the present invention connects the shielding film to the ground of the hard lines indirectly by means of a flexible circuit by directly connecting the shielding film overlying the flexible wiring to the ground pad of the flexible circuit. The above described features and advantages of the present invention will become more apparent from the description of the appended claims. Embodiments Fig. 1 is a plan view showing a soft and hard circuit board according to an embodiment of the present invention. Referring to Fig. 1, the soft and hard circuit board 1 of the present embodiment has a plurality of rigid lines 110 and a flexible line 120. These rigid wires 11 are made of a hard dielectric material as the material of the dielectric layer, and these rigid wires 110 are used to carry electronic components or connectors. In addition, the flexible circuit 120 has a soft dielectric material as its dielectric layer material, and the flexible circuit 120 is connected between the rigid circuit boards 110 for transmitting electrical signals. 29697twf.doc/n 2〇1〇18324〇.〇.tw Figure 2 is an enlarged view of the A area of the soft and hard circuit board of Figure 1, and Figure 3 is the 3-3 line of the soft and hard circuit board of Figure 2. Surface map. Referring to FIG. 1, FIG. 2 and FIG. 3, in order to provide good shielding to the plurality of wires in the flexible circuit 120, the hard and soft circuit board 100 further includes a shielding film 130 (see FIG. 3) covering one of the flexible lines 120. surface. In order to ground the shielding film 130, the flexible circuit 120 has a ground pad 122a' which is exposed to the above surface of the flexible circuit 2, as shown in FIG. Therefore, when the shielding film 130 covers the surface of the flexible circuit 120, the shielding film 130 will be structurally connected to the ground pad 122a through the opening 124a of the upper flexible dielectric layer 124 for electrically connecting to the rigid line 110. Grounding. In the present embodiment, the shielding film 130 can be connected to the ground of the rigid wiring 110 via the ground pad 122a. The shielding film 13 of the conductive material may be a silver film. In the present embodiment, the flexible circuit 120 has a ground line 122a and a flexible dielectric layer 124a, wherein the ground pad 122a is a hit point of the ground line 122a and is exposed outside the flexible dielectric layer 124a. In addition, the flexible circuit 120 further has a convex portion 12〇a protruding from a side edge of the flexible circuit 12〇, and the ground pad 122a is a convex portion of the ground line 122a, and the convex portion 12〇a is located in the present In the embodiment, in addition to the upper flexible dielectric layer 124, the soft=line 12G further has two conductive patterns 122 and two other flexible dielectric layers 4', wherein the conductive patterns 122 and the flexible dielectric layers 124 are alternately stacked, The upper conductive pattern 122 further constitutes a ground line 122 & and a plurality of bits 201018324 π 1 /zjO-O-TW 29697twf.doc / n signal line 122b beside the ground line 122a. In the present embodiment, the 'soft and hard wiring board 100 has a soft insulating layer H0' which is placed on the surface of the flexible wiring 120# and covers the shield thin film 130'. The detailed structure is as shown in Fig. 3. The flexible insulating layer 14 prevents the shielding film 130 from being electrically connected to the outside. '
上述的軟硬線路板100可以應用於各種電子裂置中， 例如個人電腦（PC)、迷你行動電腦（UMPc) /行動電 話（Mobile Phone)、個人數位助理（pda)、衛星導航 器（GPS )等。 —綜上所述，本發明乃是藉由將覆蓋在軟性線路上的屏 蔽4膜直接連接軟性線路的接地整，以使屏蔽薄膜間接地 藉由軟性線路而連接至該些硬性線路的接地。 雖然本發明已以實施例揭露如上，然其並非用以限定 本發明，任何所屬技術領域中具有通常知識者，在不脫離 本發明之精神和範圍内，當可作些許之更動與潤飾，故本 發明之保護範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1為本發明之實施例之一種軟硬線路板的俯視圖。 圖2為圖1之軟硬線路板的A區域的放大圖。 圖3為圖2之軟硬線路板的沿3_3線的剖面圖。 【主要元件符號說明】 100 :軟硬線路板 201018324,,TW 29697twf.doc/n 110 :硬性線路 120 :軟性線路 120a :凸部 122 :導電圖案 122a :接地線 122a’ ：接地墊 122b :訊號線 124 :軟性介電層 124a :開口 130 :屏蔽薄膜 140 :軟性絕緣層The above-mentioned soft and hard circuit board 100 can be applied to various electronic cracking, such as personal computer (PC), mini mobile computer (UMPc) / mobile phone (Mobile Phone), personal digital assistant (pda), satellite navigator (GPS). Wait. In summary, the present invention is achieved by directly connecting the shield 4 film overlying the flexible circuit to the ground of the flexible circuit such that the shielding film is indirectly connected to the ground of the rigid lines by flexible wiring. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of a soft and hard circuit board according to an embodiment of the present invention. 2 is an enlarged view of a region A of the soft and hard wiring board of FIG. 1. 3 is a cross-sectional view of the soft and hard circuit board of FIG. 2 taken along line 3_3. [Main component symbol description] 100: Soft and hard circuit board 201018324, TW 29697twf.doc/n 110: Hard line 120: Flexible line 120a: convex portion 122: Conductive pattern 122a: Ground line 122a': Ground pad 122b: Signal line 124: Flexible dielectric layer 124a: opening 130: shielding film 140: soft insulating layer