M3 04184 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種軟性電路板結構造（二），特 別是指一種將接地線路串接為一體，能夠確保有效接 地效果之軟性電路板構造（二）。 【先前技術】 • 按，在整個資訊、通訊、以及消費性電子產業中， 「印刷電路板」為不可或缺之重要零組件，若依其柔 軟度區分，印刷電路板可分為硬性電路板(RigidpcB) 及軟性電路板(Flexible PCB)兩種，其中硬性電路板的 基材具一定厚度及硬度，用於固定許多的電子元件， 且必須固定在機具的内部。而軟性電路板的基材很薄 (通常在0.1mm以下）具可撓性，其上線路的佈線方 φ 式特殊，組裝上可配合空間的限制改變形狀，而不影 ¥訊號傳輸的功能。是以，軟性電路板藉其特性可被 廣泛地使用於各種輕薄短小或是具可攜式的電子產品 中。 習知軟性電路板的結構包括：絕緣基材、銅導體 及覆蓋層，藉微影技術將_導體組成的線路設置於 絕緣基材，並配合膠合劑組固一體。且，為配合高頻 的傳輸，在銅導體組成的線路中通常將於傳輸訊號之 M304184 線路與線路間，設置接地線路，藉以防止串音(Close Talking)及雜訊的干擾。惟，習知軟性電路板的接地線 路必須再以絞線繞接或隔離（編織）網加工處理，因 而，容易造成某一接地線路的不良接觸，而無法發揮 應有的功能。 【新型内容】 Φ 本創作之目的，即在於提供一種可以確保接地線 路不會有接觸不良之軟性電路板構造（二），藉以可使 知軟性電路板具穩固的訊號傳輸效果。 為達到上述目的，本創作軟性電路板構造（二） 之特徵在於：軟性電路板的接地線路可藉由塗佈或膠 合方式所形成之導電層而被串接為一體，不僅加大其 接觸面，且能夠達到確實的接觸效果。 _ 依據上述的特徵，其中導電層與接地線路的串 接，係於覆蓋層上相對於接地線路處設穿孔，再以銀 聚作為導電體塗佈以形成導電層，使每一穿孔處的接 地線路與銀漿串接一體。 依據上述的特徵，其中該導電體與接地線路的串 接’亦可於覆蓋層上相對於接地線路處設穿孔，再以 $電膠膜為導電體，黏固於軟性電路板上，使得每一 牙孔處的接地線路與導電膠膜串接一體。 M3 04184 【實施方式】 睛參閱第一圖及二圖所示，為本創作軟性電路板 構造（二）的較佳實施例，該軟性電路板丨係包括··絕 緣層2、導電線路3、覆蓋層4及導電體5。其中，絕緣 層2可採用？£丁（卩〇如16〇或1>1(?0如11^)等材料， 、、、邑緣層2具有端部21。導電線路3係採銅導體，設於該 、在緣層2上，導電線路3包含以相互等距間隔排列的複 • 數訊號線路31與複數接地線路32，其中每一線路的一 端位於絕緣層2的端部21上。覆蓋層4係為絕緣材，藉 膠合方式經尚溫硬化處理罩蓋該等導電線路3上方，並 與該絕緣層2相互組固，並於相對於每一接地線路32 上方的覆蓋層4處設有穿孔42,使得一部份的接地線路 32被外露。 於本實施例中，導電層5係利用銀漿塗佈的方式 泰形成，將銀漿塗佈於覆蓋層4之每一穿孔42處的上方， 透過穿孔42使得每一接地線路32與銀漿串接為一體， 並藉由銀漿的作用，使每一接地線路32相互導通。如 是，可使得該等接地線路被統疇於一體，不僅加大其 接觸面，且旎夠達到確實的接觸，令軟性電路板具穩 固的訊號傳輸效果。 在其他貫施例中，該導電層5可為一種導電膠 膜，黏固於覆蓋層4的上方，並透過穿孔42使導電膠膜 M304184 與接地線路32形成接觸，同樣可以達到將接地線路32 串接為一體之功效。 在上述實施例中，係將穿孔42設於覆蓋層4上， 當然，同樣的方式可應用在絕緣層2一面上，在絕緣層 2上，相對於每一接地線路32處開設穿孔42，再將導電 體5塗佈、黏貼於穿孔42處，使導電層5與接地線路32 形成接觸。 綜上所述，本創作軟性電路板構造（二）確能達 到創作之目的’符合新型專利要件，惟，以上所述者 僅為本創作之錄實施_6，大驗縣創作 之各種修飾與，仍應包含於本專财請範圍心 【圖式簡單說明】 之較佳實施 第圖係本創作之軟性電路板構造（二） 例的立體圖。 第二圖為第線之斷面圖。 【主要元件符號說明】 軟性電路板 絕緣層 1 2 導電線路 3 §孔7虎線路 31 接地線路 32 覆蓋層 4 導電層 5 端部 21 穿孔 42M3 04184 VIII. New description: [New technical field] This creation is about a flexible circuit board structure (2), especially a soft circuit board structure that connects the grounding lines in series to ensure effective grounding effect. (two). [Prior Art] • Press, in the entire information, communication, and consumer electronics industries, "printed circuit board" is an indispensable important component. According to its softness, printed circuit boards can be divided into rigid circuit boards. (RigidpcB) and flexible PCB (Flexible PCB), in which the rigid circuit board substrate has a certain thickness and hardness, used to fix many electronic components, and must be fixed inside the machine. The substrate of the flexible circuit board is very thin (usually below 0.1 mm), and the wiring of the flexible circuit board is special. The assembly can be changed in shape according to the space limitation, and the function of the signal transmission is not affected. Therefore, flexible boards can be widely used in a variety of thin, light or portable electronic products. The structure of the conventional flexible circuit board comprises: an insulating substrate, a copper conductor and a cover layer, and the circuit composed of the _conductor is placed on the insulating substrate by lithography, and is integrated with the glue. Moreover, in order to cope with the transmission of high frequency, a grounding line is usually arranged between the line and the line of the transmission signal M304184 in the line composed of the copper conductor, thereby preventing the interference of the Close Talking and the noise. However, the grounding circuit of the conventional flexible circuit board must be processed by twisted wire or isolated (woven) mesh, so that it is easy to cause a bad contact of a certain grounding line, and the function should not be performed. [New content] Φ The purpose of this creation is to provide a flexible circuit board structure (2) that can ensure that the grounding line does not have poor contact, so that the flexible circuit board can have a stable signal transmission effect. In order to achieve the above object, the flexible circuit board structure (2) of the present invention is characterized in that the grounding circuit of the flexible circuit board can be connected in series by the conductive layer formed by coating or gluing, not only increasing the contact surface thereof. And can achieve a true contact effect. According to the above features, the conductive layer and the grounding line are connected in series, and the perforation is provided on the covering layer with respect to the grounding line, and then the silver poly is used as the electric conductor to form a conductive layer, so that the grounding of each perforation is made. The line is connected in series with the silver paste. According to the above feature, the series connection of the electric conductor and the grounding line can also be provided on the covering layer with respect to the grounding line, and then the electric film is used as an electric conductor, and is adhered to the flexible circuit board, so that each The grounding line at one of the holes is connected in series with the conductive film. M3 04184 [Embodiment] Referring to the first and second figures, a preferred embodiment of the flexible circuit board structure (2) is provided. The flexible circuit board includes an insulating layer 2 and a conductive line 3. Cover layer 4 and conductor 5. Among them, the insulating layer 2 can be used? A material such as 16 〇 or 1>1 (?0 such as 11^), and the edge layer 2 has an end portion 21. The conductive line 3 is a copper conductor, and is disposed at the edge layer 2 The conductive line 3 includes a complex signal line 31 and a plurality of ground lines 32 arranged at equal intervals from each other, wherein one end of each line is located on the end portion 21 of the insulating layer 2. The cover layer 4 is an insulating material. The gluing method covers the conductive lines 3 via a heat-hardening treatment cover, and is assembled with the insulating layer 2, and is provided with a perforation 42 at a cover layer 4 above each of the ground lines 32, so that a part The grounding line 32 is exposed. In the present embodiment, the conductive layer 5 is formed by coating with silver paste, and the silver paste is applied over each of the perforations 42 of the cover layer 4, through the perforations 42 A grounding line 32 is connected in series with the silver paste, and each grounding line 32 is electrically connected to each other by the action of the silver paste. If so, the grounding lines can be integrated into one body, not only increasing the contact surface thereof, And enough to achieve a true contact, so that the flexible circuit board has a stable signal transmission effect In other embodiments, the conductive layer 5 can be a conductive film adhered to the top of the cover layer 4, and the conductive film M304184 is brought into contact with the ground line 32 through the through holes 42 to achieve the ground line. In the above embodiment, the through holes 42 are provided on the cover layer 4. Of course, the same manner can be applied to one side of the insulating layer 2 on the insulating layer 2 with respect to each ground. A hole 42 is formed in the line 32, and the electric conductor 5 is coated and adhered to the through hole 42 to make the conductive layer 5 come into contact with the ground line 32. In summary, the soft circuit board structure (2) of the creation can indeed achieve creation. The purpose of 'conforms to the new patent requirements, but the above is only the implementation of this creation _6, the various modifications and creations of Daxian County should still be included in the scope of this special fund [simplified description] The preferred embodiment is a perspective view of the soft circuit board structure (2) of the present invention. The second figure is a sectional view of the first line. [Description of main components] Flexible circuit board insulation layer 1 2 Conductive line 3 § Hole 7 Tiger line Ground line 31 ends 4 conductive layer 5 a perforated covering layer 21 42 32