201017969 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種寬頻遽波結構’尤指一橋接結構連 接二螺旋結構者。 【先前技術】 按，高速邏輯電路系統中，當元件的訊號快速切換狀 態時會產生瞬間的轉換電流(transient currents)，此瞬間電 ❹ 流會藉著元件的接腳在電壓層（power plane)與接地層 (ground plane)之間傳播，當瞬間之電流變化過大時，對於 電源層與地層之間的電壓有很大的擾動，同時會造成系統 的咼頻豳振’降低系統的功率完整性(p〇wer加嗯办，pi)， 則此種由瞬間電流變化所產生不穩定的現象稱為脈衝電流 雜訊(delta-I n〇ise)，為了提供各類型邏輯型元件足夠的驅 動電壓，因此，電路系統中的電源層或接地層會被切割成 ❿不完整的形狀，或者將相同驅動電壓的元件擺放在一定區 域内’但因為驅動元件在工作時，需在電路系統的電源層 與接地層之間快速充、放電流，此電流會藉由電源層與接 地層之間干擾到相鄰元件的工作狀態’造成電路系統的電 源完整性、電磁干擾與電磁互容等問題。 為了避免元件喊切換時所產生的脈衝電流雜訊影響 他7G件的作狀，並且提供抑制寬頻系統雜訊，最 ㊉使用之作法（如第1及第二圖所示）係於電路基板4 上利用槽線4 〇(slot)隔離易受雜訊干擾之第一、二元件4 201017969 1、42，並且加入高電阻之磁珠元件5 (femte bead)盥兩 顆0.1μΡ之絲合電容6、㈣⑽邱㈣哪 制寬頻脈衝電流雜訊。 雖二在°系統的功率完整性中，常使用磁珠元件5 等被動元件隔離重要電路的㈣（如：類比電路或虹的 power plane)以抑告丨丨皆如 採用高導磁係數材流f1的影響；而一般會 與電磁干擾等問題來改善電源完整性 材料成本較高，因此t於磁珠元件5使用高導磁係數的 著單-㈣的多種增加€路线的料成本，且隨 埠數增多，同時择力^需求提高’使得外部輸出/輸入的 本增加，再^ 元件5的使用量，亦導致產品成 電容6:該磁珠元件5必須分別並聯兩顆去耦合 習用之磁得整體之架構與設計較為複雜；故，一般 之磁珠兀件5較無法符合實際使用之所需。 【發明内容】 ❹ 印刷=路:::之係在於’可使本發明運用於 胸脈岭祕訊、有肢善電磁干優 之功效。4(EMC)問題之外，更可達到有效降低成本 為達上述目的，本發明之一種寬頻：一 有:::線其分別具有一接點，該二接點之外側分別繞設 ,、、、、m狀-端分顺該接點連接；以及 201017969 一橋接單元，其設於該二耦合單元之間，該橋接單元之二 端分別與該二螺旋線之另一端連接。 【實施方式】 »月參閱『第三圖』所示，係本發明第—實施例之基本 架構示意圖。如圖所示：本發明係一種寬頻濾波結構，至 少係由二耦合單元1、2及一橋接單元3所構成。 ❹ 各耦合單元1、2係併列設置，且各耦合單元1、2 係分別包含有一接點1 1、2 1，而各接點1 1、2工之 外侧係分別繞設有一螺旋線1 2、2 2，且各螺旋線丄2、 2 2之—端係分別與接點1 1、2 1連接。 該橋接單元3係設於二耦合單元1、2之間，並與各 耦合單元1、2位於同一平面上，而該橋接單元3之二端 係分別與各螺旋線1 2、2 2之另一端連接，且該橋接單 元3係呈一横向蜿埏狀。如是，藉由上述之結構構成一全 ❹新之寬頻濾波結構。 請參閱『第四圖及第五圖』所示，係分別為本發明第 —實施例之使用狀態側視圖及本發明第一實施例之使用狀 俯側視圖。如圖所示：當本發明於使用時’係可利用銅金 屬餘刻方式成型於印刷式電路板的基板4上，且該基板4 上之第一元件41與第二元件42係在電源層43(或接 地層）以蝕刻槽線4 〇 (Slot)加以隔離，而本發明耦合單元 1、2之接點1 1、2 1則利用鏆孔4 5 (Vias)跨接在槽線 4 0之兩端，以雄持兩個電源層4 3 (或接地層）相同的 7 201017969 直流準位，且在兩個區域電源層（或接地層）之間提供高 阻抗的特性，以抑制寬頻脈衝電流雜訊及電磁干擾/電磁互 容的影響；另本架構亦可使用矽(Si)材料等半導體製程技術 應用於元件封裝内，以求獲得高阻抗值之特性。進而使本 發明可至少達到下列優點： 1. 本案與習用之磁珠元件相比較，可利用印刷式電路 板及1C封裝.基板佈局等製程方式完成，並且使用 較少的去輕合電容(decoupling capacitor)，即可達到 抑制寬頻脈衝電流雜訊及電磁干擾/電磁互容對於 產品系統的影響，可大量降低產品成本及提高產品 設計的準確性。 2. 本案僅需採用電路佈局技術即可實現，且除了使用 鏆孔4 5與電源層4 3 (或接地層）相連接外，電 路架構為微帶線型式；亦可使用現今半導體製程運 用於元件封裝（IC package)内，因此，與習用之磁珠 元件等架構相比，本案架構無需使用特殊的製程方 ◎ 式，便可廣泛的運用於各種產品中。 3. 本案之架構尺寸與實際電路應用之1206磁珠的大 小相同為5.33 X 2.28 mm2，因此，本案架構並不會 增加佈局（layout)面積，在麵合單元1、2上配合螺 旋線1 2、2 2使用螺旋式(spiral)之電路佈局，螺 旋線1 2、2 2的線寬與線距使用最小的電路製 程，另外，利用蜿蜒的橋接單元3連接相鄰兩邊螺 旋線1 2、2 2形成之螺旋式電路，如此可在最小 8 201017969 面積的佈局下提供最大的電阻值。 力閱第^、圖』戶斤^係本發明第二實施例之基本 架構不意圖。如圖所示：本發明除上述第-實施例所提結 構型態之外，於實際製作時亦可運用第一實施例之結構作 相關之變化，其所不同之處在於該橋接單元3a係可設計 為-縱向婉蜒狀，而同樣可達到第一實施例中所提之各種 功效，並使本發明能更符合實際使用之所需。 參鉍上所述，本發明寬頻濾波結構可有效改善習用之種 種缺點，可使本發明運用於印刷式電路板與1C封裝基板 之相關佈局上，除達到具有高阻抗特性、抑制寬頻脈衝電 流雜訊、有效改善電磁干擾(EMI)及電磁互容(EMC)問題之 外，更可達到有效降低成本之功效，進而使本發明之産生 月b更進步、更實用、更符合使用者之所需，確已符合發明 專利申請之要件，爰依法提出專利申請。 惟以上所述者，僅為本發明之較佳實施例而已，當不 ❹此以此限定本發明實施之範圍；故，凡依本發明申請專利 範圍及發明說明書内容所作之簡單的等效變化與修飾，皆 應仍屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 第一圖，係習用磁珠元件之使用狀態示意圖。 第二圖，係第一圖之等效電路示意圖。 第三圖’係本發明第一實施例之基本架構示意圖。 第四圖，係本發明第一實施例之使用狀態侧視圖。 201017969 第五圖，係本發明第一實施例之使用狀俯側視圖。 第六圖，係本發明第二實施例之基本架構示意圖。 【主要元件符號說明】 (習用部分） 4 電路基板 4 0槽線201017969 IX. Description of the Invention: [Technical Field] The present invention relates to a wide-band chopping structure, particularly to a bridging structure connecting two helix structures. [Prior Art] In the high-speed logic circuit system, when the signal of the component is quickly switched, an instantaneous transient current is generated, and the instantaneous current is transmitted through the pin of the component at the power plane. Propagating with the ground plane, when the instantaneous current changes too much, the voltage between the power layer and the ground layer is greatly disturbed, and the system's frequency resonance is reduced, which reduces the power integrity of the system. (P〇wer, pi), this phenomenon caused by transient current changes is called pulse current noise (delta-I n〇ise), in order to provide sufficient driving voltage for each type of logic type components Therefore, the power or ground plane in the circuit system will be cut into an incomplete shape, or the components of the same driving voltage will be placed in a certain area. 'But because the driving components are working, the power supply in the circuit system is required. Quickly charge and discharge current between the layer and the ground plane. This current will cause the power supply of the circuit system to be completely disturbed by the interference between the power supply layer and the ground layer to the working state of the adjacent components. , Electromagnetic interference and electromagnetic mutual capacitance problems. In order to avoid the pulse current noise generated when the component is switched, the 7G device is affected, and the noise of the broadband system is provided, and the tenth method (as shown in FIGS. 1 and 2) is applied to the circuit substrate 4 The first and second components 4 201017969 1 and 42 which are susceptible to noise interference are separated by a slot line 4, and a high-resistance bead element 5 is added. Two 0.1 μΡ wire capacitances are added. (4) (10) Qiu (4) What is the wide-band pulse current noise. Although the power integrity of the system is often used, passive components such as the bead element 5 are often used to isolate the important circuit (4) (such as analog circuits or rainbow power planes) to suppress the use of high permeability coefficients. The effect of f1; and generally with electromagnetic interference and other issues to improve the power integrity of the material cost is higher, so t in the magnetic bead element 5 using a high permeability coefficient of the single-(four) multiple increase the cost of the route, and with The increase in the number of turns, and the increase in the demand ^ demand increase the external output / input, and the use of the component 5, also leads to the product into a capacitor 6: the magnetic bead element 5 must be connected in parallel to the two decoupling magnetic The overall structure and design are more complicated; therefore, the general magnetic bead element 5 is less suitable for practical use. [Summary of the Invention] 印刷 Printing = Road::: The system is based on the effect that the present invention can be applied to the chest vein linguistics. In addition to the 4 (EMC) problem, it is more effective to reduce the cost. For the above purpose, the present invention has a wide frequency: one has::: the wires respectively have a contact, and the outer sides of the two contacts are respectively arranged, And the m-shaped end is connected to the contact; and the 201017969 a bridging unit is disposed between the two coupling units, and the two ends of the bridging unit are respectively connected to the other end of the two spirals. [Embodiment] The following is a schematic diagram of the basic structure of the first embodiment of the present invention as shown in the "third diagram". As shown in the figure, the present invention is a broadband filtering structure, which is composed of at least two coupling units 1, 2 and a bridge unit 3. ❹ Each of the coupling units 1 and 2 is arranged side by side, and each of the coupling units 1 and 2 respectively includes a joint 1 1 and 2 1 , and each of the joints 1 1 and 2 is surrounded by a spiral 1 2 . 2, and the ends of each of the spiral turns 2, 2 2 are connected to the contacts 1 1 and 2 1 respectively. The bridging unit 3 is disposed between the two coupling units 1, 2 and is located on the same plane as each of the coupling units 1, 2, and the two ends of the bridging unit 3 are respectively connected with the respective spirals 1 2, 2 2 One end is connected, and the bridging unit 3 is in a lateral shape. If so, a completely new broadband filtering structure is constructed by the above structure. Referring to the "fourth and fifth figures", respectively, it is a side view of the use state of the first embodiment of the present invention and a use side view of the first embodiment of the present invention. As shown in the figure: when the present invention is used, it can be formed on the substrate 4 of the printed circuit board by copper metal, and the first component 41 and the second component 42 on the substrate 4 are connected to the power supply layer. 43 (or the ground plane) is isolated by etching the slot line 4 S (Slot), and the contacts 1 1 , 2 1 of the coupling units 1 and 2 of the present invention are connected to the slot line 4 by using the pupil 4 5 (Vias). The two ends of the power supply layer 4 3 (or ground layer) have the same 7 201017969 DC level, and provide high-impedance characteristics between the two regional power layers (or ground planes) to suppress broadband pulses. The effects of current noise and electromagnetic interference/electromagnetic mutual capacitance; this architecture can also be applied to component packages using semiconductor process technologies such as germanium (Si) materials to achieve high impedance values. Further, the present invention can at least achieve the following advantages: 1. Compared with the conventional magnetic bead element, the present invention can be completed by using a printed circuit board, a 1C package, a substrate layout, and the like, and uses less decoupling capacitors (decoupling). The capacitor can achieve the effect of suppressing broadband pulse current noise and electromagnetic interference/electromagnetic mutual capacitance on the product system, which can greatly reduce the product cost and improve the accuracy of product design. 2. This case can be realized only by circuit layout technology, and the circuit structure is microstrip line type except that the hole 45 is connected with the power layer 4 3 (or the ground layer); it can also be applied to the current semiconductor process. In the IC package, the architecture of the present invention can be widely used in various products without using a special process, as compared with the conventional magnetic bead components. 3. The frame size of this case is the same as the size of the 1206 magnetic beads used in the actual circuit application is 5.33 X 2.28 mm2. Therefore, the structure of the case does not increase the layout area, and the spiral 1 2 is matched on the face units 1 and 2. 2 2 using a spiral circuit layout, the line width and the line spacing of the spirals 1 2, 2 2 use the smallest circuit process, and in addition, the adjacent bridges 3 are connected by the 桥 bridge unit 3 2 . 2 2 formed spiral circuit, which can provide the maximum resistance value in the layout of the minimum 8 201017969 area. The basic structure of the second embodiment of the present invention is not intended to be used. As shown in the figure, in addition to the structural type mentioned in the above-mentioned first embodiment, the structure of the first embodiment can also be used in the actual production, and the difference is that the bridging unit 3a is It can be designed as a longitudinal braid, and the various effects mentioned in the first embodiment can be achieved as well, and the invention can be more suitable for practical use. As described in the above, the broadband filtering structure of the present invention can effectively improve various disadvantages of the conventional use, and can be applied to the related layout of the printed circuit board and the 1C package substrate, in addition to achieving high impedance characteristics and suppressing broadband pulse current. In addition to effectively improving the electromagnetic interference (EMI) and electromagnetic mutual capacitance (EMC) problems, it can achieve the effect of effectively reducing costs, thereby making the generation of the present invention more progressive, more practical, and more in line with the needs of users. It has indeed met the requirements of the invention patent application, and has filed a patent application according to law. However, the above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto; therefore, the simple equivalent changes made according to the scope of the invention and the contents of the description of the invention And modifications are still within the scope of the invention. [Simple description of the drawing] The first figure is a schematic diagram of the state of use of the conventional magnetic bead element. The second figure is a schematic diagram of the equivalent circuit of the first figure. The third figure is a schematic diagram of the basic structure of the first embodiment of the present invention. The fourth drawing is a side view of the use state of the first embodiment of the present invention. 201017969 The fifth drawing is a side view of the use of the first embodiment of the present invention. The sixth figure is a schematic diagram of the basic architecture of the second embodiment of the present invention. [Main component symbol description] (customized part) 4 Circuit board 4 0 slot line
41第一元件 42第二元件 5 磁珠元件 6 去耦合電容 6 a去耦合電容 (本發明部分） 1 搞合單元41 first element 42 second element 5 magnetic bead element 6 decoupling capacitor 6 a decoupling capacitor (part of the invention) 1 engaging unit
1 1接點 12螺旋線 2 编合單元 2 1接點 2 2螺旋線 3 橋接單元 3a橋接單元 4 電路基板 4 0槽線 10 201017969 41第一元件 4 2第二元件 4 3電源層 4 4接地層 4 5鏆孔 ❹ 111 1 contact 12 spiral 2 braiding unit 2 1 joint 2 2 spiral 3 bridging unit 3a bridging unit 4 circuit board 4 0 slot line 10 201017969 41 first element 4 2 second element 4 3 power layer 4 4 Formation 4 5 ❹ ❹ 11