201016590 六、發明說明： 【發明所屬之技術領域】 本發明係《於-種微機電錢騎裝結構，_揭露 增加電磁防護功能可靠性之微機電麥克風封裂結構。 【先前技術】 目前常見的麥克風，通常為駐極式麥克風，在功能上的訴求 皆以減少Μ積為目標’而由於科技的進步，產業上已有微機電麥 ©克風被研發出來。微機電麥克風在功能與體積上更具有產業之利 用性，然而由於微機電麥克風必須與外界聲音源相^通，容乂 到外在因素的影響，最常見的就是電子元件受到電磁波的訊號干 擾，造成微機電麥克風訊噪比不佳，導致電子產品_加價值條 低；因此’微機電麥克風在封裝結構上仍有突破上述問題點之必 要。 請參閱美國專利 US6781231 #u「Mi_leetrQmeehanieal ^ ❹ paekage with envimnmental and interf_ce shieldj 專利案，在該案 的第1圖當中係揭示-種微機電麥克風_結構1()，此封= 10係將複數個元件12設置在—基板14上，並再將具導電^之 -蓋子20藉由導電膠23她合在基板14上，如此—來， 透過導電膠23連接於基板14之接地科，即可形^的電 磁防護屏障，進而抵抗電磁波的干擾。 孤狀的電 上述專利案所鮮之顯電麥克風縣、轉10杜能改呈電 =之干擾，絲對於確·㈣錄板14之間紐導通_ P早仍嫌不^ ’且若兩者之間整圈皆設置導電膠23以供結人，對於 導電膠23的使用也過於浪費，故而習知微機電麥克風封裳結構10 201016590 確有其改良之必要。 【發明内容】 有鑑於上麟題，本㈣之目的在於提供—種增加電磁 功能可靠性之微機電麥克風封裝結構。 邊 緣是’為達上述目的’本發明之微機電麥克風封脑構係呈 有-腔體、-微機電麥克風及—導電元件；腔體係由一基板 與-金屬蓋結合，且於雜周緣設置有―音似供外界聲音 至腔體内’而微機電麥克風模組乃設置在腔體㈣接收外 音’而導電元件亦設置在腔體内並電性連接基板、金屬蓋盘微 電麥克風模組以形成電性導通，並因此達到電磁防護之效。 為了達到上述㈣’本發明之另一種微機電麥克風封装結構 之腔體係由_基板、-金屬敬及—金屬側板組合而成，且^ 侧板係設置在該基板與金屬頂板之間，且基板與金屬側板之間可 由絕緣膠或導f縣合，金屬側板與金屬頂板之間亦可由導電膜 或絕緣膠結合，*當導電元件設置於腔翻並電性連接基板、金 屬頂板與微機電麥克風模組時，係得_成電性導通而達電磁防 護之功故。 為了賴上述㈣’本㈣之再—機機電麥錢封裝結構 之腔體係由-基板、-金屬頂板及—金屬側板組合而成，且金屬 侧板係設置在該基板與金屬了頁板之間，且基板與金屬侧板之間係 由絕緣膠結合，金屬側板與金屬頂板之間係由導電膠結合，而合 導電元件設置於腔體㈣紐連接餘、金屬條與微機電麥^ 風模組時’係得以形成電性導通而達電磁防護之功效。 201016590 【實施方式】 以下，依據圖式就本發明之微機電麥克風封裝結構實施例加 以說明。 參照第-圖所示，為本發明較佳第一實施例之剖面示意圖。 财顯示微機電麥克風封裝結構〗包括有—腔體、—微機電麥克 風模組20及一導電元件40，其中腔體乃由一基板10盥一金屬莒 3〇相對應結合而成，而微機電麥克風模組2〇係設置在腔體内，^ ❹ 電元件40則是設置在腔體内並電性連接於基板1〇及金屬蓋％: 基板ίο具有一上表面n及相對之一下表面12，基板1〇另 具有-音孔13貫穿上表面n及下表面12，且下表面12任兩相對 點各設置有接腳14鱗接於電子產品；—般而言，基板1〇通常 實施為-印·路姉>CB)，且於絲1G上設有依路設計而 形成之佈線(layout)。 微機電麥姐· 20設置於基板1G之上表面n，微機電麥 克風模組20包括一微機電麥克風21設置於音孔13上，用以接收 /外界透過音孔I3傳遞而來的聲音，並將聲音轉換成電訊號；再者， ❿，機電麥克風模組2〇還包括同樣設置在基板1〇之上表面U之— 二j 22及一被動兀件25，晶片22係藉由基板1〇上之佈線而與被 το件25電性連接，而晶片22與微機電麥克風21之間則以一鋒 線23電性連接，另外，晶片22係受一封膠^覆蓋， 用以保護晶片22受水氣影響而損壞。 · 金屬盖3〇係有一基部S1及一側部％ ’側部％繞設於基部 …側邛32藉由一絕緣膠33連結於棊板1〇之上表面η，因此 形成^蓋3〇得以賴職鉢克顺組胸麵歸之效果。 元伴40係為一接地用金屬線材，導電元件4〇連接於基 201016590 =3面1卜金屬蓋3〇之基部31以及晶片22，且導電元 m㈣膠34連結於金屬蓋3g之基部31，藉此，基 板 j屬盍3〇形成電性連通以形成電磁防護之功效。 ^传特別-提的是，導電元件4G亦可藉由導轉％而連結 ^金屬蓋30之侧部32以達相同功效；另外，上述導電膠34材料 係可選自金、銀、銅...等導電物質以與膠性物質混合而成。 、上述金屬蓋30與基板10之間的結合，若是將絕緣象％置換 為導電谬時’導電元件40係可視為多一道保險，❿得以確保金屬 蓋30與基板1〇電性導通的可靠性。 μ另外，在第一圖所揭示之實施例當中，由於微機電麥克風21 乃=置於a孔13上，使得微機電麥克風21具有足夠的背腔體積 及刖空間，而使得頻率響應曲線較為平坦，不易有明顯的變異產 生0 參照第二圖所示，為本發明較佳第二實施例之剖面示意圖。 本實施例與第—實_之差異轉在於此實補之織電^克風 封裝結構1之基板1〇具有一狹長形聲音通道15，而聲音通道15 一端乃連通於音孔13，另一端則開放於外界，如此使得外界聲音 在進入微機電麥克風封裝結構丨内部時，可避免直接受到灰塵、 水氣或光線等物質的影響，避免降低微機電麥克風的感度值。 參照第三圖所示’為本發明較佳第三實施例之剖面示意圖。 本實施例與第一實施例之差異主要在於微機電麥克風封裝結構1 之腔體之金屬蓋30係由一金屬側板3〇a及一金屬頂板31a取代。 金屬側板30a係繞設於微機電麥克風模組2〇外周緣，且其藉 由一絕緣膠32a連結於基板1 〇之上表面。 金屬頂板3la係藉由一第一導電膠33a連結於金屬側板3〇a 上端’以封閉金屬侧板3〇a’使微機電麥克風模組20容置在基板 201016590 10、金屬側板30a及金屬頂板31a之間。 在此例當中，導電元件4〇連接於基板10上表面Π、金屬頂 板31a以及晶片22’且導電元件4〇乃是透過一導電膠34a連結於 金屬頂板31a’藉此，基板1〇舆金屬側板3〇a、金屬頂板31a形成 電性連通因而接地形成電磁防護之功效。 在此值得注意的是’導電元件4〇亦可藉由導電膠34a而連結 於金屬侧板30a以達相同功效；另外，本實施例當中的第一導電 膠33a與導電膠34a之材料係可選自金、銀、銅…等導電物質以 φ 與膠性物質混合而成。 在與此實施例相同的架構下，第一導電膠3如與絕緣膠32a 亦可相反設置，使第一導電膠3%改設於金屬側板3〇a與基板1〇 之間’絕緣膠32a改設於金屬侧板3〇a與金屬頂板31a之間，然而 透過導電元件40的設置’仍能使得基板1〇與金屬侧板3〇a、金屬 頂板31a形成電性連通而達電磁防護之功效。 參照第四圖所示，為本發明較佳第四實施例之剖面示意圖。 本實施例與第三實施例之差異主要在於此實施例之微機電麥克風 ❹封裝結構1之基板具有一狹長形聲音通道15，而聲音通道15 一端乃連通於音孔13 ’另一端則開放於外界，如此使得外界聲音 在進入微機電麥克風封裝結構i内部時，可避免直接受到灰塵、 水氣或光線等物質的影響，避免降低微機電麥克風的感度值。 參照第五圖所示，為本發明較佳第五實施例之剖面示意圖。 本實施例與第一實施例相近似，其主要差異乃在於微機電麥克風 封裝結構1之金屬蓋30係包括有一音孔35，而微機電麥克風21 係設置於音孔35上；如此一來，晶片22即必須藉由數條焊線23 連接至基板10上，而微機電麥克風21也必須藉由數條焊線23以 連接至基板10上，以使得微機電麥克風21與晶片22藉由焊線23 201016590 以在基板ίο上形成電性連接關係。 w上克風21與晶片22未啊設置在基板1G之配置 上之佈線面積，亦可藉由將微機電麥克風 ^ 2配置在同—軸線上而賴封裝結構的紐，亦或可將 卽省下來的基板10部份再增加其他的元件配置。 此實施例之空間結構改變當不致影響其電磁防護及使頻率響 應曲線較為平坦的姐，射目關技術細在此即不另贅述。 —參照第六圖所示，為本發明較佳第六實施例之剖面示意圖。 本實施例與第三實_相近似’其主要差異乃在於微機電麥克風 封裝結構1之金屬頂板犯係包括有—音孔35a，而微機電麥克風 21係設置於音孔说上；如此一來，晶片22即必須藉由數條焊線 23連接至基板1G上’峨機f麥克風21也必麵錄條焊線a 以連接至基板10上’以使得微機電麥克風21與晶片22藉由焊線 23以在基板1〇上形成電性連接關係。 :在此實施赠中’絲有可縮減基板1G佈線面積、電磁防護 及使頻率響應曲線較平坦等功效’且在此實施例當中第一導電膠 33a與絕緣膠32a係可互換地設置在金屬側板3〇a與基板1〇之間 或金屬側板30a與金屬頂板31 a之間，因此導電元件4〇亦可藉由 導電膠34a而連結於金屬頂板31a或金屬側板3〇a以達相同功曰效； 然此互換關係仍是不影響其藉由導電元件4〇以使得基板1〇、金屬 侧板30a與金屬頂板31a形成電性連通而達電磁防護之功效。 參照第七圖所示，為本發明較佳第七實施例之剖面示意圖。 本實施例與第六實施例相近似，其主要差異乃在於微機電麥克風 封裝結構1之微機電麥克風21之焊線23連接方式改變，其更延 伸地連接到金屬頂板31 a ’然此改變皆不致影響如同第六實施例可 達到之功效，故在此即不另贅述。 201016590 綜合上述，本發明之微機電麥歧封驗構， =電元件電性連接在基板、金屬蓋及晶片之間或' 地的 2在基板、金屬頂板(或金屬側板)及晶 ^=4轉綱斷__，卿具有4=電麥 ，/、％知技術相較之下，本發明藉由導電元^— ❹ ❹ 對於電性導通之多-層保障，而為了節省:電 =料而改親緣縣合金屬蓋與基_，也健可簡 ^使金職與基板雜導躺達魏雜護之功效；另外，^ 一;土用基板、金屬頂板及金屬側板以形成腔體之實施例而言，者 ^、之間無論以導電膠或絕緣膠以互相結合時，皆可藉“ 、酋以作為電性導通的伽，因而翻電雜護之功效，由此可見， ^電元件的加裝係提昇了微機電麥克風封裝結構之產業利用價 值’且無論腔體設計如何變化皆能翻電雜護之效。 立本發明之微機電麥克風封裝結構，係利用微機電麥克風設置 於青孔上，使得微機電麥克風具有足夠的背腔體積及前空間，而 使得頻率響應曲線較為平坦，不胃有簡的賴產生。 再者，柄^之微機冑麥克風封裝結構，係於音孔—端連通 ，狹長狀之聲音通道’聲音通道—端觸放於外界，如此使外界 聲音進入微機電麥克顺裝結翻部時，可聽直接受到灰塵、 水氣或光線等物質的影響，避免降低微機電麥克風的感度值。 另外，本發明之微機電參；克風封裝結構，係可將音孔設置在 金屬蓋或金屬頂板，而微機電麥克風仍是設置於音孔上，因此使 得微機電麥克風與晶片並非同時設置在基板上，也就是說基板上 佈線面積可縮減又改安排其他元件.，另一方面也可藉由將微機電 麥克風與晶片設置在同—軸線上而縮減封裝結構之寬度。 201016590 ，以上=述僅為舉例性，而非為限制性者。任何未睨離本發明 ❿對其進行之等效修改或變更，均應包含於後附 之申請專利範圍中。 【圖式簡單說明】 圖為本發明第—較佳實施例之剖面示意圖； 發明第二較佳實施例之剖面示意圖； ί二3本發明第三較佳實施例之剖面示意圖； =二t=四，施例之剖面示意圖; 佳實施例之剖面示意圖;以及 圖為本發读佳實施例之剖面示意圖； 【主要元件符號說明】 微機電麥克風封裝結構丨0 12 下表面 14 接腳 21 微機電麥克風 23 焊線 25 被動元件 3〇a 金屬側板 31a 金屬頂板 32a 絕緣膠 U 上表面 U 音孔 15 聲音通道 20 微機電麥克風模組 22 晶片 24 封膠 30 金屬蓋 31 基部 32 侧部 201016590 33 絕緣膠 33a 第一導電膠 34 導電膠 34a 第二導電膠 35 音孔 35a 音孔 40 導電元件 ❿ 11201016590 VI. Description of the Invention: [Technical Field of the Invention] The present invention is a micro-electromechanical microphone sealing structure that increases the reliability of electromagnetic protection functions. [Prior Art] At present, the common microphones are usually electret microphones, and the functional appeals are all aimed at reducing hoarding. And due to the advancement of technology, the industry has already developed micro-electromechanical wheat. Micro-electromechanical microphones are more industrially useful in terms of function and volume. However, since MEMS microphones must communicate with external sound sources to accommodate external factors, the most common is that electronic components are interfered by electromagnetic waves. As a result, the MEMS microphone signal-to-noise ratio is not good, resulting in low electronic products _ plus value; therefore, 'micro-electromechanical microphones still need to break through the above problems in the package structure. Please refer to US Patent US6781231 #u"Mi_leetrQmeehanieal ^ ❹ paekage with envimnmental and interf_ce shieldj patent case, in the first picture of the case reveals a kind of MEMS microphone _ structure 1 (), this seal = 10 series will be a plurality of components 12 is disposed on the substrate 14, and then the conductive cover-pad 20 is attached to the substrate 14 by the conductive adhesive 23, so that the conductive paste 23 is connected to the grounding of the substrate 14, and the shape is formed. The electromagnetic protection barrier, in turn, resists the interference of electromagnetic waves. The solitary electricity in the above-mentioned patent case is the sensible electric microphone county, the transfer of 10 Du can be converted into electricity = interference, the silk is for the correct (four) recording board 14 between the new conduction _ P is still too early and does not have a conductive adhesive 23 for the person to be closed, and the use of the conductive adhesive 23 is too wasteful. Therefore, the conventional micro-electromechanical microphone sealing structure 10 201016590 does have its improvement. In view of the above, the purpose of this (4) is to provide a MEMS microphone package structure that increases the reliability of electromagnetic functions. The edge is the MEMS microphone of the present invention for the above purpose. The brain system has a cavity-micro-electromechanical microphone and a conductive component; the cavity system is combined with a metal cover and a micro-electromechanical microphone is provided on the peripheral edge to provide an external sound to the cavity. The module is disposed in the cavity (4) to receive the external sound' and the conductive element is also disposed in the cavity and electrically connected to the substrate, the metal cover disk micro-electric microphone module to form electrical conduction, and thus achieve electromagnetic protection effect. The cavity system of the above-mentioned (4)' another micro-electromechanical microphone package structure of the present invention is composed of a combination of a substrate, a metal and a metal side plate, and a side plate is disposed between the substrate and the metal top plate, and the substrate is The metal side plates may be combined with an insulating glue or a conductive material, and the metal side plate and the metal top plate may be combined by a conductive film or an insulating glue. * When the conductive member is disposed in the cavity and electrically connected to the substrate, the metal top plate and the microelectromechanical microphone module In the group, it is _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The plate is assembled, and the metal side plate is disposed between the substrate and the metal page board, and the substrate and the metal side plate are combined by an insulating glue, and the metal side plate and the metal top plate are combined by a conductive adhesive, and When the conductive element is disposed in the cavity (four) button connection, the metal strip and the micro-electromechanical microphone module, the system can be electrically connected to achieve electromagnetic protection. 201016590 [Embodiment] Hereinafter, the present invention is based on the drawings. The embodiment of the MEMS microphone package structure is described with reference to the first embodiment, which is a cross-sectional view of a preferred embodiment of the present invention. The MEMS micro-mechanical microphone package structure includes a cavity, a micro-electromechanical microphone module. The group 20 and a conductive component 40, wherein the cavity is formed by a combination of a substrate 10, a metal, and a metal, and the micro-electromechanical microphone module 2 is disposed in the cavity, and the electrical component 40 is The device is disposed in the cavity and electrically connected to the substrate 1 and the metal cover. The substrate λ has an upper surface n and a lower surface 12, and the substrate 1 has a sound hole 13 extending through the upper surface n and the lower surface 12, And At any two opposite points of the surface 12, the pins 14 are arranged to be squashed to the electronic product; in general, the substrate 1 is usually implemented as -print and roadway>CB), and the wire 1G is provided with a design according to the road. The layout formed. The MEMS microphone 20 is disposed on the upper surface n of the substrate 1G, and the MEMS microphone module 20 includes a MEMS microphone 21 disposed on the sound hole 13 for receiving/transmitting sound transmitted through the sound hole I3. The sound is converted into a telecommunication signal; furthermore, the electromechanical microphone module 2A further includes a second surface 22 which is also disposed on the upper surface U of the substrate 1 and a passive element 25, and the wafer 22 is supported by the substrate 1 The wiring is electrically connected to the ohmic member 25, and the wafer 22 and the MEMS microphone 21 are electrically connected by a front line 23. In addition, the wafer 22 is covered by a glue to protect the wafer 22. Damage caused by moisture. The metal cover 3 has a base portion S1 and a side portion %' side portion is disposed around the base portion. The side portion 32 is coupled to the upper surface η of the raft plate 1 by an insulating glue 33, thereby forming a cover 3 Lai's job is the effect of the group's chest face. The element 40 is a grounding metal wire, and the conductive element 4 is connected to the base 3116 of the base 201016590=3 surface 1 metal cover 3 and the wafer 22, and the conductive element m (4) glue 34 is coupled to the base 31 of the metal cover 3g. Thereby, the substrate j is electrically connected to form an electromagnetic shielding effect. It is specifically mentioned that the conductive element 4G can also be connected to the side portion 32 of the metal cover 30 by the transfer of % to achieve the same effect; in addition, the conductive adhesive 34 material can be selected from gold, silver, copper. .. and other conductive substances are mixed with the gelatinous substance. The combination of the metal cover 30 and the substrate 10 can reduce the reliability of the electrical conduction between the metal cover 30 and the substrate 1 if the conductive element 40 is regarded as an additional fuse when the insulating image is replaced by the conductive element. . In addition, in the embodiment disclosed in the first figure, since the MEMS microphone 21 is placed on the a hole 13, the MEMS microphone 21 has sufficient back cavity volume and 刖 space, so that the frequency response curve is relatively flat. It is not easy to have obvious variation. 0 Referring to the second figure, it is a schematic cross-sectional view of a preferred second embodiment of the present invention. The difference between this embodiment and the first embodiment is that the substrate 1 of the woven electric package structure 1 has an elongated sound channel 15, and one end of the sound channel 15 is connected to the sound hole 13 and the other end. It is open to the outside world, so that when the external sound enters the inside of the MEMS microphone package structure, it can be directly affected by substances such as dust, moisture or light, and avoid reducing the sensitivity value of the MEMS microphone. Referring to the third drawing, a schematic cross-sectional view of a preferred third embodiment of the present invention is shown. The difference between this embodiment and the first embodiment is mainly that the metal cover 30 of the cavity of the MEMS microphone package structure 1 is replaced by a metal side plate 3A and a metal top plate 31a. The metal side plate 30a is wound around the outer periphery of the MEMS microphone module 2, and is connected to the upper surface of the substrate 1 by an insulating glue 32a. The metal top plate 3la is connected to the upper end of the metal side plate 3〇a by a first conductive adhesive 33a to close the metal side plate 3〇a' to accommodate the MEMS microphone module 20 on the substrate 201016590 10, the metal side plate 30a and the metal top plate. Between 31a. In this example, the conductive member 4 is connected to the upper surface of the substrate 10, the metal top plate 31a and the wafer 22', and the conductive member 4 is connected to the metal top plate 31a through a conductive paste 34a. The side plate 3〇a and the metal top plate 31a form an electrical connection so that the grounding forms an electromagnetic protection effect. It is noted that the conductive element 4 can also be bonded to the metal side plate 30a by the conductive adhesive 34a to achieve the same effect. In addition, the material of the first conductive adhesive 33a and the conductive adhesive 34a in this embodiment can be A conductive material selected from the group consisting of gold, silver, copper, etc. is formed by mixing φ with a gelatinous substance. In the same structure as the embodiment, the first conductive paste 3 may be disposed opposite to the insulating adhesive 32a, so that the first conductive adhesive 3% is changed between the metal side plate 3a and the substrate 1' insulating glue 32a. It is disposed between the metal side plate 3〇a and the metal top plate 31a, but the arrangement of the conductive member 40 can still make the substrate 1〇 electrically connect with the metal side plate 3〇a and the metal top plate 31a to achieve electromagnetic protection. efficacy. Referring to the fourth figure, there is shown a cross-sectional view of a preferred fourth embodiment of the present invention. The difference between this embodiment and the third embodiment is mainly that the substrate of the MEMS microphone package structure 1 of the embodiment has an elongated sound channel 15, and one end of the sound channel 15 is connected to the sound hole 13' and the other end is open to The outside world, so that when the outside sound enters the inside of the MEMS microphone package structure i, it can avoid being directly affected by substances such as dust, moisture or light, and avoid reducing the sensitivity value of the MEMS microphone. Referring to Figure 5, there is shown a cross-sectional view of a preferred fifth embodiment of the present invention. This embodiment is similar to the first embodiment, and the main difference is that the metal cover 30 of the MEMS microphone package structure 1 includes a sound hole 35, and the MEMS microphone 21 is disposed on the sound hole 35; thus, The wafer 22 must be connected to the substrate 10 by a plurality of bonding wires 23, and the microelectromechanical microphone 21 must also be connected to the substrate 10 by a plurality of bonding wires 23 so that the MEMS microphone 21 and the wafer 22 are soldered. Line 23 201016590 forms an electrical connection on the substrate ίο. w the upper air 21 and the wafer 22 are not disposed on the layout of the substrate 1G, or by arranging the MEMS microphone 2 on the same axis, depending on the package structure, or may be saved The lower portion of the substrate 10 is further added with other component configurations. The spatial structure change of this embodiment does not affect the electromagnetic protection and the frequency response curve is relatively flat. - Referring to Figure 6, there is shown a cross-sectional view of a preferred sixth embodiment of the present invention. The main difference between this embodiment and the third real _ is that the metal top board of the MEMS microphone package structure 1 includes a sound hole 35a, and the MEMS microphone 21 is disposed on the sound hole; The wafer 22 must be connected to the substrate 1G by a plurality of bonding wires 23. 'The machine f microphone 21 must also be taped to the substrate 10' to connect the microelectromechanical microphone 21 and the wafer 22 by soldering. The wire 23 is electrically connected to the substrate 1A. : In this implementation, the wire has the effect of reducing the substrate 1G wiring area, electromagnetic protection, and making the frequency response curve relatively flat. In this embodiment, the first conductive paste 33a and the insulating paste 32a are interchangeably disposed on the metal. Between the side plate 3〇a and the substrate 1〇 or between the metal side plate 30a and the metal top plate 31a, the conductive element 4〇 can also be connected to the metal top plate 31a or the metal side plate 3〇a by the conductive adhesive 34a to achieve the same work. However, the interchange relationship still does not affect the electromagnetic shielding effect by the conductive member 4〇 such that the substrate 1〇 and the metal side plate 30a are electrically connected to the metal top plate 31a. Referring to the seventh embodiment, there is shown a cross-sectional view of a seventh preferred embodiment of the present invention. This embodiment is similar to the sixth embodiment, and the main difference is that the connection pattern of the bonding wires 23 of the MEMS microphone 21 of the MEMS microphone package structure 1 is changed, and the connection to the metal top plate 31 a is more extended. It does not affect the achievable effects as in the sixth embodiment, and therefore will not be further described herein. 201016590 In summary, the MEMS MEMS seal of the present invention, = electrical components are electrically connected between the substrate, the metal cover and the wafer or the ground 2, the substrate, the metal top plate (or metal side plate) and the crystal ^ 4 Turning to __, Qing has 4 = electric wheat, /,% know the technology, the invention by the conductive element ^ - ❹ ❹ for the electrical conduction of the multi-layer guarantee, and in order to save: electricity = material And the change of the relative county with the metal cover and the base _, also Jian can make the gold and the substrate miscellaneous guide lie to the Wei miscellaneous protection; In addition, ^ a; soil substrate, metal top plate and metal side plate to form a cavity In the case of the embodiment, when the conductive glue or the insulating glue is combined with each other, the "E.g., the emirate can be used as the electrical conduction gamma, and thus the effect of turning over the electricity and protecting it can be seen. The component mounting system enhances the industrial utilization value of the MEMS microphone package structure and can be turned over and protected regardless of the cavity design. The MEMS microphone package structure of the present invention is set by using a MEMS microphone. On the green hole, the MEMS microphone has enough back cavity And the front space, so that the frequency response curve is relatively flat, no stomach is simple to produce. Moreover, the handle of the microcomputer 胄 microphone package structure, is connected to the sound hole - end, narrow sound channel 'sound channel - end When it is placed on the outside world, so that the external sound enters the micro-electromechanical microphone, it can be directly affected by substances such as dust, moisture or light, and avoids reducing the sensitivity value of the micro-electromechanical microphone. Electromechanical ginseng; gram wind encapsulation structure, the sound hole can be set on the metal cover or the metal top plate, and the MEMS microphone is still disposed on the sound hole, so that the MEMS microphone and the chip are not simultaneously disposed on the substrate, that is, The wiring area on the substrate can be reduced and other components can be arranged. On the other hand, the width of the package structure can be reduced by placing the MEMS microphone and the wafer on the same axis. 201016590, the above description is merely exemplary, and Any equivalent modifications or alterations to the present invention are intended to be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing a first preferred embodiment of the present invention; a cross-sectional view showing a second preferred embodiment of the present invention; FIG. 3 is a schematic cross-sectional view showing a third preferred embodiment of the present invention; Schematic diagram of the embodiment; a schematic cross-sectional view of the preferred embodiment; and a schematic cross-sectional view of the preferred embodiment; [Major component symbol description] MEMS microphone package structure 丨0 12 lower surface 14 pin 21 MEMS microphone 23 Bonding wire 25 Passive component 3〇a Metal side plate 31a Metal top plate 32a Insulating tape U Upper surface U Sound hole 15 Sound channel 20 Microelectromechanical microphone module 22 Wafer 24 Sealing 30 Metal cover 31 Base 32 Side 201016590 33 Insulating adhesive 33a First conductive paste 34 conductive paste 34a second conductive paste 35 sound hole 35a sound hole 40 conductive element ❿ 11