201015594 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種電子零件製造方法及裝置，且更 具體而言係提供一種用於製造捲起式電子零件（尤指電解 質電容器）之特定方法及裝置，其中一雷射發射裝置被用 來取代傳統器械以發射一雷射光束至一電極箔上，以便自 此電極箱上剝離並去除一餓刻層或一塗敷層，並在此電極 箱處形成一孔，且接著在以一穿刺針處理此電極箔以便將 ❹ 引線端子之凸片連接至此電極箔之程序進行前，先在此電 極箔之諸橫向相對側邊處形成凹槽。根據本發明，此電極 箔在蝕刻層或塗敷層被分離處之區域的形狀可隨意地被設 定，且另外該孔與諸凹槽之形狀亦可隨意地被設定。結果， 在引線端子之凸片與電極箔之金屬間之接觸面積可被擴 大，藉此顯著地增加導電性。 【先前技術】 根據傳統用於製造捲起式電子零件之方法及裝置，多 ® 個正與負電極箔以及多張用於將此諸正與負電極箔相互隔 離之絕緣紙被同時地輸送以備捲起，且一穿刺程序被執 行，亦即一穿刺針被操作以穿過被疊置之多個電極箔及一 引線端子凸片（平板），藉此而形成此諸電極箔及此引線端 子凸片的多根鰭狀體，且接著此諸鰭狀體被壓輾以便可將 此凸片固定至此諸電極箔。 然而，根據此傳統方法，因爲多個電極箔與多張絕緣 紙被同時地輸送以備捲起，故將不可能在該穿刺程序前成 201015594 功地從諸電極箔上剝離並去除蝕刻層與塗敷層。尤其，雷 射光束的用途還尙未被運用在剝離並去除蝕刻層與塗敷 層、在諸電極箔上形成孔、及在諸電極箔之橫向相對側邊 處形成凹槽。 因此，根據此用於製造捲起式電子零件之傳統方法及 裝置，穿刺程序與壓輾程序是在當蝕刻層與塗敷層被留在 諸電極箔處時被進行的。結果，存在於具有相當高絕緣電 阻之凸片與諸電極箔間的蝕刻層與塗敷層會在諸鰭狀體被 壓輾以連接凸片與電極箔時阻礙了電阻在該凸片與該等電 極箔間更加地被減小。因此，難以改善電子零件（特別是 電解質電容器）的電氣特性。 在此方面，本發明之發明人與申請人並不知道存在有 任何與本發明相關之專利文獻及非專利公開資料，故無法 提出此類文件。 【發明内容】 本發明被提供以消除先前技藝之缺陷與缺點。因此， 本發明之一目的在於提供一種用於製造捲起式電子零件之 方法，其中一雷射發射裝置被用以藉雷射光束而從一電極 箔上剝離並去除一蝕刻層或一塗敷層，而此係在該電極箔 被輸送去捲起成一元件之過程中進行，以致並無蝕刻層或 塗敷層存在於電極箔之金屬與引線端子之凸片間，而其等 在隨後之程序中將被相互連接成疊置狀，其中一穿刺針被 操作以貫穿此諸叠置之電極箔與引線端子之凸片，以便形 成多個由電極箔與引線端子位於其一側上之凸片處所突出 201015594 之鰭狀體。另外，此諸程序被設計成藉由寬廣接觸面積而 將引線端子之凸片直接地連接至電極箔之金靥，而此與傳 統者相比較而在其等之間具有顯著之電阻減小（大約 0.1〇1〇至 ΙπιΩ)。 本發明之另一目的在於提供一種用於製造捲起式電子 零件之方法，其中一雷射發射裝置被用以取代傳統器械而 可非常輕易且精確地在電極箔處形成一用於將引線端子之 凸片附接至該電極箔上之孔，而此係在此電極箔被輸送去 捲起成一元件之過程中進行。另外，根據本發明，此雷射 發射裝置被用以隨意地設定或改變此孔之形狀與數量，以 致使得在稍後準備將引線端子附接至電極箔之程序中多個 藉由穿刺針而被產生在凸片與電極箔處之鰭狀體的形成可 被適當地控制，以便使得在凸片與電極箔間之電阻可達到 儘可能地低。 本發明之另一目的在於提供一種用於製造捲起式電子 零件之方法，其中一雷射發射裝置被用以取代傳統器械並 藉由雷射光束而可非常輕易且精確地在電極箔處形成多個 凹槽，而此係在此電極箔被輸送去捲起成一元件之過程中 進行。此諸凹槽之形狀與數量可依情況之需要而隨意地被 設定或改變。 本發明之另一目的在於提供一種用於製造捲起式電子 零件之方法，其中一雷射發射裝置被用以取代傳統器械並 藉由雷射光束而從電極箔上剝離並去除蝕刻層或塗敷層， 且藉由雷射光束之照射而在電極箔上之已去除蝕刻層或塗 201015594 敷層之區域處形成一孔，以便在該處附接引線端子之凸 片，而此係在當凸片與電極箔在下一程序中被相互疊置並 被穿刺針所刺穿以便具有多個產生於該處之鰭狀體時，在 凸片與電極箔之金靥間無蝕刻層或塗敷層之情形下始可達 成。另外，此諸程序被設計成藉由寬廣接觸面積而將凸片 直接地接觸電極箔之金屬，藉以使得與傳統者相比較而可 顯著地減小電阻（大約Ο.ΙπιΩ至ΙιηΩ )。另外，根據本發 明，此雷射發射裝置被用以非常輕易且精確地在電極箔處 ® 形成一孔，且隨意地設定或改變此孔之形狀與數量，以致 使得在稍後準備將引線端子附接至電極箔之程序中藉由穿 刺針而被產生在凸片與電極箔處之諸鰭狀體的形成可被適 當地控制，以便使得在凸片與電極箔間之電阻可達到儘可 能地低，最終可顯著地增加電子零件（尤指電解質電容器） 之電氣性能。 本發明之另一目的在於提供一種用於製造捲起式電子 零件之方法，其中一雷射發射裝置被用以取代傳統器械並 ❹ 藉由雷射光束而從電極箔上剝離並去除蝕刻層或塗敷層， 且藉由雷射光束之照射而在電極箔上之已去除蝕刻層或塗 敷層之區域處形成一孔，並操作穿刺針以便刺穿引線端子 與電極箔，藉以產生引線端子與電極箔之諸鰭狀體，且然 後壓擠諸鰭狀體以便固定地連接引線端子與電極箔，而此 係在凸片與電極箔之金屬間無蝕刻層或塗敷層以致具有寬 廣之接觸面積之情形下始可達成，藉此使得與傳統者相較 可顯著減小電阻（大約Ο.ΙιηΩ至ΙιηΩ)，且藉此可增加電 201015594 子零件（尤指電解質電容器）之電氣性能。 本發明之另一目的在於提供一種用於製造捲起式電子 零件之方法，其中一雷射發射裝置被用以取代傳統器械並 藉由雷射光束而從電極箔上剝離並去除蝕刻層或塗敷層， 且藉由雷射光束而將一引線端子之凸片熔接至電極箔之已 去除蝕刻層或塗敷層的區域上，藉以使凸片可在一相當寬 廣之面積中與電極箔之金屬相接觸，以致使引線端子與電 極箔間之電阻可被顯著地減小，且電傳導性可被顯著地增 加。因此，針穿刺程序可爲不必要的，因而可簡化零件製 造程序並降抵零件製造成本。 本發明之又另一目的在於提供一種用於製造捲起式電 子零件之裝置，其係藉由捲起被同時輸送之複數張電極箔 及複數張絕緣紙，其中一雷射發射裝置被用以取代傳統器 械來發射一雷射光束至諸電極箔，以便從此諸電極箔上剝 離並去除蝕刻層或塗敷層，來形成多個孔於諸電極箔上或 形成多個凹槽於諸電極箔之相對側邊上，而此係在諸電極 箔被一用於將一引線端子之凸片連接至電極箔上之穿刺針 所處理之程序前進行。結果，引線端子與電極箔之金屬可 在一寬廣面積中直接地相互接觸，且此孔之形狀與數量可 藉由雷射光束而被隨意地設定或改變；另外，諸鰭狀體之 最想要形狀可在穿刺針之隨意控制下而獲得，藉此使得與 傳統者相比較可顯著地減小電阻（大約0.1 Π1Ω至1 ιηΩ )， 且藉此提供電子零件（尤指電解質電容器）之絕佳電氣性 201015594 總之，本發明之方法（申請專利範圍第1項）係用於 製造捲起式電子零件者，其使用一雷射發射裝置並藉由雷 射光束而從一電極箔上剝離並去除一蝕刻層或一塗敷層， 而此係在此電極箔被輸送去捲起成一元件之過程中進行。 本發明之方法（申請專利範圍第2項）係用於製造捲 起式電子零件者，其使用一雷射發射裝置並藉由雷射光束 而將一電極箔加工成在其上形成一用於將一引線端子附接 至此電極箔上之孔，而此係在此電極箔被輸送去捲起成一 ® 元件之過程中進行。 本發明之方法（申請專利範圍第3項）係用於製造捲 起式電子零件者，其使用一雷射發射裝置並藉由雷射光束 而將一電極箔加工成在其諸橫向相對側邊上形成多個凹 槽，而此係在此電極箔被輸送去捲起成一元件之過程中進 行。 本發明之方法（申請專利範圍第4項）係用於製造捲 起式電子零件者，其使用一雷射發射裝置並藉由用於將一201015594 VI. Description of the Invention: [Technical Field] The present invention relates to an electronic component manufacturing method and apparatus, and more particularly to a specific method for manufacturing a rolled-up electronic component (especially an electrolytic capacitor) A method and apparatus in which a laser emitting device is used to replace a conventional device to emit a laser beam onto an electrode foil for stripping and removing a hungry layer or a coating layer from the electrode box, and A hole is formed in the electrode case, and then a groove is formed at the laterally opposite sides of the electrode foil before the process of processing the electrode foil with a puncture needle to connect the tab of the 引线 lead terminal to the electrode foil. . According to the present invention, the shape of the electrode foil in the region where the etching layer or the coating layer is separated can be arbitrarily set, and the shape of the hole and the grooves can be arbitrarily set. As a result, the contact area between the tab of the lead terminal and the metal of the electrode foil can be enlarged, whereby the conductivity is remarkably increased. [Prior Art] According to a conventional method and apparatus for manufacturing a rolled-up electronic component, a plurality of positive and negative electrode foils and a plurality of insulating papers for isolating the positive and negative electrode foils are simultaneously conveyed Rolling up, and a puncture procedure is performed, that is, a puncture needle is operated to pass through the stacked electrode foils and a lead terminal tab (plate), thereby forming the electrode foils and the leads A plurality of fins of the terminal tabs, and then the fins are compressed so that the tabs can be secured to the electrode foils. However, according to this conventional method, since a plurality of electrode foils and a plurality of sheets of insulating paper are simultaneously conveyed for rolling up, it is impossible to peel off and remove the etching layer from the electrode foils before the puncture procedure into 201015594. Coating layer. In particular, the use of a laser beam has not been utilized to strip and remove the etch layer and the coating layer, to form holes in the electrode foils, and to form grooves at laterally opposite sides of the electrode foils. Therefore, according to the conventional method and apparatus for manufacturing a rolled-up electronic component, the puncture procedure and the pressing procedure are performed while the etching layer and the coating layer are left at the electrode foils. As a result, the etching layer and the coating layer existing between the tab having a relatively high insulation resistance and the electrode foil may hinder the resistance at the tab when the fins are pressed to connect the tab and the electrode foil. The electrode foil is further reduced between. Therefore, it is difficult to improve the electrical characteristics of electronic parts (especially electrolytic capacitors). In this regard, the inventors of the present invention and the applicant are not aware of the existence of any patent documents and non-patent disclosure materials related to the present invention, and thus such documents cannot be proposed. SUMMARY OF THE INVENTION The present invention has been made to eliminate the disadvantages and disadvantages of the prior art. Accordingly, it is an object of the present invention to provide a method for manufacturing a rolled-up electronic component in which a laser emitting device is used to strip a laser beam from an electrode foil and remove an etch layer or a coating. a layer, which is performed during the process in which the electrode foil is conveyed and rolled up into a component, so that no etching layer or coating layer exists between the metal of the electrode foil and the tab of the lead terminal, and the like The program will be connected to each other in a stacked shape, wherein a puncture needle is operated to penetrate the stacked electrode foil and the tab of the lead terminal to form a plurality of convex portions on the one side of the electrode foil and the lead terminal The sheet highlights the fins of 201015594. In addition, the programs are designed to directly connect the tabs of the lead terminals to the gold foil of the electrode foil by a wide contact area, which has a significant resistance reduction between them as compared with the conventional ones ( About 0.1〇1〇 to ΙπιΩ). Another object of the present invention is to provide a method for manufacturing a rolled-up electronic component in which a laser emitting device is used to replace a conventional device to form a lead terminal at the electrode foil very easily and accurately. The tab is attached to the hole in the electrode foil, and this is performed during the process in which the electrode foil is conveyed to be rolled up into a component. Further, according to the present invention, the laser emitting device is used to arbitrarily set or change the shape and number of the holes, so that a plurality of processes by attaching the lead terminals to the electrode foil are prepared by a puncture needle at a later time. The formation of the fins produced at the tabs and the electrode foil can be appropriately controlled so that the electric resistance between the tabs and the electrode foil can be as low as possible. Another object of the present invention is to provide a method for manufacturing a rolled-up electronic component in which a laser emitting device is used to replace a conventional device and can be formed very easily and accurately at the electrode foil by a laser beam. A plurality of grooves are formed during the process in which the electrode foil is conveyed to be rolled up into a component. The shape and number of the grooves can be arbitrarily set or changed as occasion demands. Another object of the present invention is to provide a method for manufacturing a rolled-up electronic component in which a laser emitting device is used to replace a conventional device and to peel off the electrode foil and remove the etching layer or coating by the laser beam. Laminating, and by etching the laser beam, a hole is formed on the electrode foil to remove the etching layer or the layer coated with the 201015594 layer, so that the tab of the lead terminal is attached thereto, and the system is When the tab and the electrode foil are stacked on each other in the next procedure and are pierced by the puncture needle so as to have a plurality of fins generated there, there is no etching layer or coating between the tab and the gold foil of the electrode foil. The situation can be achieved in the case of layers. In addition, the programs are designed to directly contact the metal of the electrode foil by a wide contact area, so that the resistance (about Ο.ΙπιΩ to ΙιηΩ) can be remarkably reduced as compared with the conventional one. Further, according to the present invention, the laser emitting device is used to form a hole at the electrode foil very easily and accurately, and the shape and number of the hole are arbitrarily set or changed so that the lead terminal is prepared later. The formation of the fins produced at the tabs and the electrode foil by the puncture needle in the procedure of attaching to the electrode foil can be appropriately controlled so that the electric resistance between the tab and the electrode foil can be as much as possible Low ground can ultimately significantly increase the electrical performance of electronic components, especially electrolytic capacitors. Another object of the present invention is to provide a method for manufacturing a rolled-up electronic component in which a laser emitting device is used to replace a conventional device and to peel off and remove an etch layer from the electrode foil by a laser beam or Coating a layer, and forming a hole in the region of the electrode foil on which the etching layer or the coating layer has been removed by irradiation of the laser beam, and operating the puncture needle to pierce the lead terminal and the electrode foil, thereby generating the lead terminal And the fins of the electrode foil, and then the fins are pressed to fixedly connect the lead terminals and the electrode foil, and there is no etching layer or coating layer between the metal of the tab and the electrode foil so as to have a wide The contact area can be achieved, thereby making it possible to significantly reduce the electrical resistance (about Ο.ΙιηΩ to ΙιηΩ) compared to the conventional one, and thereby increase the electrical performance of the electric 201015594 sub-parts (especially electrolytic capacitors). Another object of the present invention is to provide a method for manufacturing a rolled-up electronic component in which a laser emitting device is used to replace a conventional device and to peel off the electrode foil and remove the etching layer or coating by the laser beam. Laminating, and welding a lead terminal tab to a region of the electrode foil from which the etching layer or the coating layer has been removed by a laser beam, so that the tab can be combined with the electrode foil in a relatively wide area The metal phases are contacted so that the electrical resistance between the lead terminals and the electrode foil can be remarkably reduced, and the electrical conductivity can be remarkably increased. Therefore, the needle puncture procedure can be unnecessary, thereby simplifying the part manufacturing process and reducing the manufacturing cost of the part. Still another object of the present invention is to provide an apparatus for manufacturing a rolled-up electronic component by rolling up a plurality of electrode foils and a plurality of sheets of insulating paper which are simultaneously conveyed, wherein a laser emitting device is used Instead of the conventional device, a laser beam is emitted to the electrode foils to peel off and remove the etching layer or the coating layer from the electrode foils to form a plurality of holes on the electrode foils or to form a plurality of grooves in the electrode foils. On the opposite side, this is done before the electrode foil is processed by a puncture needle for attaching the tab of a lead terminal to the electrode foil. As a result, the metal of the lead terminal and the electrode foil can directly contact each other in a wide area, and the shape and number of the hole can be arbitrarily set or changed by the laser beam; in addition, the fins are most desired. The shape can be obtained under the arbitrary control of the puncture needle, thereby making it possible to significantly reduce the electric resistance (about 0.1 Π 1 Ω to 1 ιηΩ) compared with the conventional one, and thereby providing an electronic component (especially an electrolytic capacitor).佳电气性201015594 In summary, the method of the present invention (Patent No. 1 of the patent application) is for the manufacture of a rolled-up electronic component, which uses a laser emitting device and is peeled off from an electrode foil by a laser beam and An etch layer or a coating layer is removed, which is performed during the process in which the electrode foil is transported to be rolled up into a component. The method of the present invention (part 2 of the scope of application) is for manufacturing a rolled-up electronic component, which uses a laser emitting device and processes an electrode foil by laser beam to form a pattern thereon. A lead terminal is attached to the hole in the electrode foil, and this is performed during the process in which the electrode foil is conveyed to be rolled up into a ® element. The method of the present invention (Patent No. 3 of the patent application) is for manufacturing a rolled-up electronic component, which uses a laser emitting device and processes an electrode foil by laser beam to its laterally opposite sides. A plurality of grooves are formed thereon, and this is performed during the process in which the electrode foil is conveyed and rolled up into a component. The method of the present invention (claim 4 of the scope of the patent application) is for manufacturing a rolled-up electronic component using a laser emitting device and by using one
G 引線端子附接至一電極箔上之雷射光束，從電極箔上剝離 並去除一蝕刻層或一塗敷層，且接著將電極箔加工成在蝕 刻層或塗敷層被去除之區域處形成一孔，而此等全在此電 極箔被輸送去捲起成一元件之過程中進行。 本發明之方法（申請專利範圍第5項）係用於製造捲 起式電子零件者，其使用一雷射發射裝置並藉由用於將一 引線端子附接至一電極箔上之雷射光束，而從電極箔上剝 離並去除一蝕刻層或一塗敷層，且接著將此電極箔加工成 201015594 在蝕刻層或塗敷層被去除之地點處形成一孔，且接著將引 線端子安置在該孔上，且接著操作一穿刺針以刺穿引線端 子與電極箔，藉此而產生多個自引線端子與電極箔處伸出 之鰭狀體，且接著壓擠此諸鰭狀體以使引線端子之凸片可 與電極箔連接，而此等全在電極箔被輸送去捲起成一元件 之過程中進行。 本發明之方法（申請專利範圍第6項）係用於製造捲 起式電子零件者，其使用一雷射發射裝置並藉由雷射光束 ® 而從一電極箔上剝離並去除一蝕刻層或一塗敷層，且接著 將一引線端子之凸片熔接至此電極箔之已去除蝕刻層或塗 敷層的區域，而此等全在此電極箔被輸送去捲起成一元件 之過程中進行。 本發明之裝置（申請專利範圍第8項）係用於製造捲 起式電子零件者，其係藉捲起被同時輸送之複數個電極箔 及複數張絕緣紙，而此裝置包括一雷射發射裝置，其用於 發射一雷射光束至諸電極箔上，以便可自此諸電極箔上剝 ❹ 離並去除一蝕刻層或一塗敷層，並在此諸電極箔處形成多 個孔，或在此諸電極箔之橫向相對側邊處形成多個凹槽， 而此係在此諸電極箔被一用於將一引線端子之凸片連接至 電極箔上之穿刺針所處理之程序前所進行者。 由上述說明顯而易知，根據本發明之用於製造捲起式 電子零件之方法，雷射發射裝置被用以藉由雷射光束而從 電極箔上剝離並去除蝕刻層或塗敷層，而此係在電極箔被 輸送去捲起成一元件之過程中進行。因此，當穿刺針在稍 -10- 201015594 後程序中被操作以刺穿被叠置之凸片與電極箔以形成多個 鰭狀體時，在引線端子的凸片與電極箔的金靥之間並無蝕 刻層或塗敷層存在。結果，引線端子的凸片與電極箔的金 屬可在一寬廣面積中直接地相互接觸，且因此使得在引線 端子與電極箔間之電阻相較於傳統者可被顯著地減小（大 約 Ο.ΙιηΩ 至 ΙίηΩ)。 另外，根據本發明之用於製造捲起式電子零件之方 法，雷射發射裝置被用以發射雷射光束至電極箔，以便在 ® 此電極箔上形成可用於將一引線端子附接至電極箔上之 孔，而此係在此電極箔被輸送去捲起成一元件之過程中進 行。因此，此孔可被非常輕易且精確地形成以取代傳統器 械。同時，此孔之形狀與數量可隨意地被設定或改變，且 結果諸鰭狀體之形成可在稍後程序中被隨意地控制，其中 穿刺針被操作以刺穿引線端子的凸片與電極箔，以便將引 線端子附接至電極箔，且因此可獲得最想要之鰭狀體，以 利於在引線端子與電極箔之間將電阻限制在儘可能最低 値。 另外，根據本發明之用於製造捲起式電子零件之方 法，雷射發射裝置被用以發射雷射光束至電極箔，以便在 此電極箔之諸相對側邊處上形成多個凹槽，而此係在此電 極箔被輸送去捲起成一元件之過程中進行。因此，此諸凹 槽可被非常輕易且精確地形成以取代傳統器械，且同時此 諸凹槽之形狀或數量可隨意地被設定或改變。另外，此諸 凹槽可隨意地依需要而被修改。 -11- 201015594 另外，根據本發明之用於製造捲起式電子零件之方 法’雷射發射裝置被用以藉由雷射光束而從電極箔上剝離 並去除蝕刻層或塗敷層，且藉由雷射光束而在電極箔處形 成一孔，以便將引線端子附接至電極箔，而此係在電極箔 被輸送去捲起成一元件之過程中進行。因此，當穿刺針在 稍後程序中被操作以刺穿被疊置之凸片與電極箔以形成多 個鰭狀體時，在引線端子的凸片與電極箔的金屬之間並無 蝕刻層或塗敷層存在。結果，引線端子的凸片與電極箔的 金屬可在一寬廣面積中直接地相互接觸，且因此使得在引 線端子與電極箔間之電阻相較於傳統者可被顯著地減小 (大約Ο.ΙιηΩ至ΙιηΩ)。另外，此孔可被非常輕易且精確 地形成以取代傳統器械，且同時此孔之形狀與數量可隨意 地被設定或改變。另外，根據本發明，諸鰭狀體之形成可 在稍後程序中被隨意地控制，其中穿刺針被操作以刺穿引 線端子的凸片與電極箔，以便將引線端子附接至電極箔， 且因此可獲得最想要之鰭狀體，以利於將引線端子與電極 箔間之電阻限制在儘可能最低値。最後，電子零件（尤指 電解質電容器）可被製造成爲一具有顯著增加之電氣性能 者。 另外，根據本發明之用於製造捲起式電子零件之方 法，雷射發射裝置被用以藉由雷射光束而從電極箔上剝離 並去除蝕刻層或塗敷層，且藉由雷射光束而在電極箔處形 成一孔，以便將引線端子附接至電極箔，並接著操作穿刺 針以刺穿引線端子與電極箔以形成其鰭狀體，且接著壓擠 -12- 201015594The G lead terminal is attached to the laser beam on an electrode foil, stripped from the electrode foil and removed by an etch layer or a coating layer, and then the electrode foil is processed into an area where the etch layer or the coating layer is removed A hole is formed, and this is all performed during the process in which the electrode foil is conveyed and rolled up into a component. The method of the present invention (claim 5 of the patent application) is for manufacturing a rolled-up electronic component using a laser emitting device and by attaching a lead terminal to a laser beam on an electrode foil And peeling off and removing an etch layer or a coating layer from the electrode foil, and then processing the electrode foil into 201015594 to form a hole at a place where the etch layer or the coating layer is removed, and then placing the lead terminal at On the hole, and then operating a puncture needle to pierce the lead terminal and the electrode foil, thereby generating a plurality of fins extending from the lead terminal and the electrode foil, and then pressing the fins to make The tabs of the lead terminals can be connected to the electrode foil, and these are all performed during the process in which the electrode foil is conveyed and rolled up into a single component. The method of the present invention (article 6 of the patent application) is for the manufacture of a rolled-up electronic component using a laser emitting device and stripping and removing an etching layer from an electrode foil by a laser beam® or A coating layer is applied, and then a tab of the lead terminal is welded to the region of the electrode foil from which the etching layer or the coating layer has been removed, and this is all performed during the process in which the electrode foil is conveyed and rolled up into a component. The device of the present invention (article 8 of the patent application scope) is used for manufacturing a rolled-up electronic component by rolling up a plurality of electrode foils and a plurality of sheets of insulating paper which are simultaneously conveyed, and the apparatus includes a laser emission Means for emitting a laser beam onto the electrode foils so as to be detachable from the electrode foils and removing an etch layer or a coating layer, and forming a plurality of holes at the electrode foils, Or forming a plurality of grooves at laterally opposite sides of the electrode foils, wherein the electrode foils are used before a process for attaching the tabs of a lead terminal to the puncture needle on the electrode foil The person who performed it. It will be apparent from the above description that, in accordance with the method of the present invention for manufacturing a rolled-up electronic component, a laser emitting device is used to strip and remove an etch layer or a coating layer from an electrode foil by a laser beam. This is done during the process in which the electrode foil is conveyed and rolled up into a component. Therefore, when the puncture needle is operated in a program after slightly -10-201015594 to pierce the stacked tab and the electrode foil to form a plurality of fins, the tab of the lead terminal and the electrode foil are golden There is no etching layer or coating layer present between them. As a result, the tab of the lead terminal and the metal of the electrode foil can directly contact each other in a wide area, and thus the electric resistance between the lead terminal and the electrode foil can be remarkably reduced as compared with the conventional one (about Ο. ΙιηΩ to ΙίηΩ). Further, according to the method for manufacturing a rolled-up electronic component of the present invention, a laser emitting device is used to emit a laser beam to an electrode foil so as to be formed on the electrode foil for attaching a lead terminal to the electrode A hole in the foil, which is performed during the process in which the electrode foil is conveyed to be rolled up into a component. Therefore, this hole can be formed very easily and accurately to replace the conventional device. At the same time, the shape and number of the holes can be arbitrarily set or changed, and as a result, the formation of the fins can be arbitrarily controlled in a later procedure in which the puncture needle is operated to pierce the tabs and electrodes of the lead terminals. The foil is used to attach the lead terminals to the electrode foil, and thus the most desirable fins are obtained to facilitate limiting the electrical resistance between the lead terminals and the electrode foil to the lowest possible level. Further, according to the method for manufacturing a rolled-up electronic component of the present invention, a laser emitting device is used to emit a laser beam to the electrode foil to form a plurality of grooves at opposite sides of the electrode foil, This is done during the process in which the electrode foil is conveyed and rolled up into a component. Therefore, the grooves can be formed very easily and accurately to replace the conventional instruments, and at the same time, the shape or number of the grooves can be arbitrarily set or changed. Additionally, the grooves can be modified as desired. -11- 201015594 In addition, the method for manufacturing a rolled-up electronic component according to the present invention 'the laser emitting device is used to peel off the electrode foil by the laser beam and remove the etching layer or the coating layer, and borrow A hole is formed in the electrode foil by the laser beam to attach the lead terminal to the electrode foil, which is performed during the process in which the electrode foil is conveyed and rolled up into an element. Therefore, when the puncture needle is operated in a later procedure to pierce the stacked tab and the electrode foil to form a plurality of fins, there is no etching layer between the tab of the lead terminal and the metal of the electrode foil. Or a coating layer is present. As a result, the tab of the lead terminal and the metal of the electrode foil can directly contact each other in a wide area, and thus the electric resistance between the lead terminal and the electrode foil can be remarkably reduced as compared with the conventional one (about Ο. ΙιηΩ to ΙιηΩ). In addition, the hole can be formed very easily and accurately to replace the conventional instrument, and at the same time, the shape and number of the hole can be arbitrarily set or changed. Further, according to the present invention, the formation of the fins can be arbitrarily controlled in a later procedure in which the puncture needle is operated to pierce the tabs of the lead terminals and the electrode foil to attach the lead terminals to the electrode foil, Therefore, the most desirable fins can be obtained to facilitate limiting the resistance between the lead terminals and the electrode foil to the lowest possible level. Finally, electronic components, especially electrolytic capacitors, can be fabricated into a significantly increased electrical performance. Further, according to the method for manufacturing a rolled-up electronic component of the present invention, the laser emitting device is used to peel off the electrode foil by the laser beam and remove the etching layer or the coating layer, and by the laser beam A hole is formed in the electrode foil to attach the lead terminal to the electrode foil, and then the puncture needle is operated to pierce the lead terminal and the electrode foil to form a fin thereof, and then pressed -12-201015594
Ο 此諸鰭狀體 全在電極箔 電極箔之諸 等被形成與 此使得引線 鰭狀體在此 地減小（大 解質電容器 另外， 法，雷射發 並去除鈾刻 之凸片熔接 因此，引線 面積中直接 阻可被顯著 加。另外， 可簡化零件 另外， 捲起成一元 雷射發射裝 除蝕刻層或 電極箔之橫 刺穿引線端 程序前所進 以便將引線端子之凸片附接至電極箔，而此等 被輸送去捲起成一元件之過程中進行。因此， 鰭狀體並無蝕刻層或塗敷層在其諸側邊上，其 引線端子之凸片的諸鰭狀體直接相接觸，且因 端子與電極箔間之電阻可被顯著地減小。當諸 情況下被壓擠時，電阻可相較於傳統者被確實 約Ο.ΙιηΩ至ΙπιΩ)。因此，電子零件（尤指電 )可被製造成爲一具有顯著增加之電氣性能者。 根據本發明之用於製造捲起式電子零件之方 射裝置被用以藉由雷射光束而從電極箔上剝離 層或塗敷層，且藉由雷射光束而將一引線端子 至電極箔之已去除蝕刻層或塗敷層的區域上。 端子之凸片與電極箔之金屬可在一相當寬廣之 相接觸，並因此使得引線端子與電極箔間之電 地減小，且電子零件之電傳導性可被顯著地增 在此情形下，針穿刺程序可爲不必要的，因而 製造程序並降抵零件製造成本。 根據在複數張電極箔及複數張絕緣紙被输送去 件時用於製造捲起式電子零件之本發明裝置， 置被用以藉由雷射光束而從電極箔上剝離並去 塗敷層，且在諸電極箔處.形成多個孔，或在諸 向相對側邊處形成多個凹槽，而此係在穿刺針 子之凸片與諸電極箔以便連接凸片與電極箔之 行者。因此，蝕刻層或塗敷層可被輕易地從電 -13- 201015594 極箔上去除，且諸孔與諸凹槽可被輕易且精確地形成以取 代傳統之器械。另外，引線端子之凸片與電極箔之金屬可 在一寬廣面積中直接地相互接觸，且此孔之形狀與數量可 被隨意地設定或改變。另外，諸鰭狀體之形成可在一於其 中穿刺針被操作以刺穿引線端子的凸片與電極箔以便將引 線端子附接至電極箔之程序中被隨意地控制，並因此獲得 最想要之鰭狀體，其在引線端子與電極箔間之電阻與傳統 者相較被顯著減小（大約Ο.ΙιηΩ至ΙϊπΩ)。因此，電子零 ® 件（尤指電解質電容器）之可被製造成具有一顯著增加之 電氣性能。 【實施方式】 現將於下文中配合參照附圖而詳細描述本發明。參照 第1至5圖所示，一用於製造電子零件（以捲起式電解質 電容器5爲範例）之裝置1配備有一雷射發射裝置8,其 係用於發射雷射光束至電極箔2上，以便可自此電極箔2 _ 處剝離並去除一鈾刻層或一塗敷層（下文中被稱之爲「成 〇 膜2a」）（第6至8圖），用於在電極箔2處形成一孔，或 用於在電極箔2之諸相對側邊2b處形成多個凹槽2c (第 1 7圖），而此係在以一穿刺針刺穿電極箔2以便附接引線 端子之凸片前之程序la中進行者，而此時電子零件製造裝 置1正在同時輸送複數張電極箔2(2A，2B)與複數張絕緣 紙3(3A，3B)，並捲起諸電極箔2與諸絕緣紙3，以便將 引線端子4 ( 4A，4B )之凸片4a附接至電極箔2。 參照第1至3圖所示，電子零件製造裝置1包括一裝 -14- 201015594 置10,其係用於捲起電極箔2A，2B成爲一元件9之裝置的 —必要部分。以分別被捲起於一對捲筒11周圍之型式被貯 存之電極箔2A，2B被同時地向外推出，及由複數個導引滑 輪12所導引而被輸送，並通過一於其中諸電極箔2A，2B 承受針穿刺與壓擠處理之程序lb，且進一步由一對滑輪13, 14所導引而被輸送至一於其中諸電極箔2A, 2B被捲起成 爲元件9之程序la (第4圖）。 針穿刺裝置與壓擠裝置被全構成爲一主體15，其中針 ® 穿刺裝置被設置在前，而壓擠裝置被設置在後。針穿刺裝 置包括複數根穿刺針16、一針固定架18、及一用於驅動針 固定架18之驅動器19(缸體）。壓擠裝置包括一壓擠頭20、 一壓擠座21、及一用於驅動壓擠頭20之驅動器22(缸體）。 雷射發射裝置8被槪括地稱爲雷射處理器、雷射產生 器、雷射熔接器等等，且操作氣體近幾年來已有顯著之改 良。雷射產生器可足以被用來從電極箔2上剝離並去除成 膜2a。雷射發射裝置8被形成可發射一足以加熱並熔接成 〇 膜2a之雷射光束’藉以從電極箔2上剝離並去除成膜2a， 以便在電極箔2上形成一孔2d (第8及9圖），且在電極 箔2之諸相對側邊2b處形成多個凹槽2c。 接著有關於本發明之用於製造捲起式電子零件之方 法，此方法（申請專利範圍第1項）使用可供發射雷射光 束6之雷射發射裝置8，以便從電極箔2上剝離並去除蝕 刻層或塗敷層（亦即成膜2a)，而電極箔2同時被捲起成 元件9，如第6及7圖所示。 -15- 201015594 在第7圖中，雷射發射裝置8被用以依據所需距離而 在箭頭A，B所示方向上發射雷射光束6並將其橫向移動於 附接引線端子4之凸片所需之該距離，且藉由熱而逐漸熔 化成膜2a。已去除成膜2a之區域2e係電極箔2之金屬2g 區域，而此金靥係鋁且具有可被利用之高傳導性。 順便一提的，區域2e之形狀可以各種不同式樣地被形 成。第12圖中所示之區域2e係矩形，並橫過於電極箔2 而延伸。第13圖中所示之區域2e係跑道形或橢圓形，並 ® 相對於電極箔2成側向延伸在其寬度內。第15圖中所示之 諸區域2e被形成爲兩個相對於電極箔2被側面地配置在其 寬度內之圓形。第18圖中所示之諸區域2e被形成爲兩個 具有諸平滑隅角之X字母型式。第19圖中所示之諸區域 2e被形成爲兩個被並肩配置且相對於電極箔2成縱向延伸 之矩形。因此，區域2e之形狀可藉由雷射光束6之照射而 被隨意地形成。 另外，本發明之用於製造捲起式電子零件之方法（申 〇 請專利範圍第2項）藉由雷射發射裝置8而在電極箔2上 形成一孔，以便將引線端子4附接至電極箔2，而此電極 箔2則同時被捲起成元件9,如第8與16至19圖中所示。 如第8圖中所示，雷射光束6可在如箭頭C，D所不之 轉動方向上被往復地運動，以便可形成各種不同型式之孔 2d。諸孔2d通常係圓形或方形，但此形狀可作各種不同之 變化。 例如’如第14至16與1 8圖中所示，兩個孔2d係圓 201015594 形的，及如第17圖中所示，兩個孔2d係方形的。 另外，如第14，15，18與19圖中所示，孔2d可被形 成在被去除掉成膜2a之區域2e處，或如第16與17圖中 所示，孔2d可被形成於在其上保留而未去除掉成膜2a之 電極箱2處。 另外，本發明之用於製造捲起式電子零件之方法（申 請專利範圍第3項）使用雷射發射裝置8並藉由雷射光束 6之照射而在電極箔2之諸相對側邊2b處形成多個凹槽 © 2c，而此電極箔2則同時被捲起成元件9。 至於諸凹槽2c之形成，長度與深度可選擇地決定。 另外，本發明之用於製造捲起式電子零件之方法（申 請專利範圍第4項）使用雷射發射裝置8而從電極箔2上 剝離並去除蝕刻層或塗敷層（亦即成膜2a)，並在電極箔2 之區域2e處形成孔2d，在其處該成膜2a藉由雷射光束6 被去除以供將引線端子4附接至電極箔2，而此電極箔2 則同時被捲起成元件9，如第6至8圖中所示。 ❹ 在此情形下，被去除掉成膜2a之區域2e處的形狀及 孔2d的形狀可多樣化地被形成，如第14，15，18與19圖 中所示。 在第14圖中，區域2e係矩形且相關於電極箔2成橫 向延伸，並在其上具有兩個圓孔2d。在第15圖中，顯示 兩個圓形區域2e，具有分別形成於其上之同心孔2d。在第 18圖中，諸區域2e係以兩X字母型式被設置，其具有多 個平滑隅角並具有兩個分別形成於其中之孔2d。在第19 -17- 201015594 圖中，兩個方形區域2e並肩地配置且相關於電極箔2成縱 向地延伸，並具有分別形成於其中之方形孔2d。 另外’本發明之用於製造捲起式電子零件之方法（申 請專利範圍第5項）使用雷射發射裝置8而從電極箔2上 剝離並去除蝕刻層或塗敷層（亦即成膜2〇，並在電極箔2 之區域2e處形成孔2d，在其處該成膜2a藉由雷射光束6 而被去除以供將引線端子4附接至電極箔2，且然後將引 線端子4安置在孔2d處，並操作穿刺針16移動以刺穿引 ® 線端子4與電極箔2，以便可形成引線端子4與電極箔2 之鰭狀體4f，2f由其處伸出，並可壓擠此諸鰭狀體4f，2f， 藉以將引線端子4連接至電極箔2，而此電極箔2則被捲 起成元件9。 另外，本發明之用於製造捲起式電子零件之方法（申 請專利範圍第6項）使用雷射發射裝置8而從電極箔2上 剝離並去除蝕刻層或塗敷層（亦即成膜2a)，並接著將引 線端子4熔接至電極箔2已去除成膜2a之區域2e(未示於 圖），而此電極箔2則被捲起成元件9。 本發明如上述般地被建構，而操作方式將於下文中被 說明。參照第1至3圖所示，最重要之操作方式係使用雷 射發射裝置，以便藉由雷射光束而不同地處理電極箔2’ 而此電極箔2則被捲起成元件。 一用於捲起電極箔2之裝置10配備有一軸（未示於 圖），其被轉動以捲起分別從捲筒11處捲出之電極箔2’ 並藉由導引滑輪12之導引而被輸送。 -18- 201015594 當被引線端子4所附接之電極箔2部分如第3 示般來到雷射發射裝置8時，此雷射發射裝置8被 發射雷射光束至電極箔2，以便可從電極箔2上剝 除成膜2a，並可在該部分處形成一孔。然後，電極 第9圖中所示般被停止，引線端子4之凸片4a被安 極箔2已去除掉成膜2a之該部分2e上，且電極箔 屬2g被露出。接著，一保持器驅動器19被操作以 用於保持穿刺針1 6之針保持器1 8。穿刺針1 6如箭 示般地向下移動，直到穿剌針16刺穿凸片4a與電 爲止，如第1 〇圖所示。 操作時，凸片4a之諸鰭狀體4f以及電極箔2 狀體2f被形成爲自電極箔2下方處伸出，如第10圖 在此情形下，可注意到電極箔2之諸鰭狀體2f (其 成膜2a之金屬2g)會直接地接觸鋁製之凸片4a的 體4f，且接觸面積係非常寬。 因此，電阻在凸片4a與電極箔2之間被大大地 事實上由試驗證實，電阻係小於傳統方式者0.1 ιηΩ 3 第11圖中，當穿刺針16如箭頭F所示地被上 凸片4a出來時，電極箔2之凸片附接部分被輸送至 擠程序，在該處一壓擠頭驅動器22被操作以下移一 20。結果，電極箔2及凸片4a被壓抵壓擠座21， 來自凸片4a之強大壓擠力，如箭頭G所示。因此， 體2f，4f被壓輾，且凸片4a及電極箔2被相互連接 在此情形下，凸片4a及電極箔彼此2直接地接 圖中所 操作以 離並去 箔2如 置在電 2之金 驅動一 頭E所 極箱2 之諸鰭 丨所示。 係沒有 諸鰭狀 減小。 [1 πιΩ。 移並從 下一壓 壓擠頭 並承受 諸鰭狀 〇 觸在構 -19- 201015594 成凸片4a及電極箔2之金屬的寬廣面積中。因此，所獲得 之產品（亦即電解質電容器5)具有被大大減小之電阻且 具有絕佳之導電性。 順便一提的，凸片4a可藉由雷射光束之照射而非使用 針穿刺與壓擠手段而被熔接至電極箔2。甚至在此情形下， 凸片4a可被熔接以直接與電極箔2之金屬區域2g相接 觸。因此，所得之產品（亦即電解質電容器5)具有被大 大減小之電阻且具有絕佳之導電性。 ® 另外，全由雷射光束之照射而被處理之已去除掉成膜 2a之區域2e的形狀、孔2d之形狀、及諸凹槽2c之形狀可 被選擇地且多樣地形成。尤其，諸鰭狀體2f之形狀可藉由 控制孔2d之形狀而被形成，而諸鰭狀體2f之最佳形狀可 操作地被選擇。另外，區域2e之形狀可被選擇地選擇爲可 最利於將凸片4a連接至電極箔2上者。 本發明已如上述主要係有關於電子零件者，諸如電解 質電容器5之實施例。然而，本發明並不限定於電解質電 容器5,而是適用於任何類型之電容器，諸如薄膜電容器， 以及其他包含捲起式電容器者。 【圖式簡單說明】 第1圖係一電子零件的前視圖。 第2圖係一電子零件製造裝置之重要部分的放大前視 圖。 第3圖係一電子零件製造裝置之重要部分的放大立體 圖。 -20- 201015594 第4圖係一電解質電容器之部分切除立體圖。 第5圖係一電極箔之立體圖，其具有一附接於其上之 凸片，並被插置在一對絕緣紙之間。 第6圖係電極箔之垂直剖面側視圖。 第7圖係電極箔的垂直剖面側視圖，其具有一藉由雷 射光束之照射而從其上被去除之成膜。 第8圖係電極箔之垂直剖面側視圖，其具有一藉由雷 射光束之照射而被形成於其上之孔。 〇 第9圖係電極箔之垂直剖面側視圖，其具有一被置於 電極箔區域上之引線端子的凸片，在該處該成膜被去除， 而一穿刺針將下移。 圖 視 側 面 剖 直 垂 之 箔 極 S ipr 係 圖 ο 11 第 電而上 於，箔 置除極 被去電 有被與 具膜片 其成凸 該得 處使 該箔 在極 ， 電 片與 凸片 的凸 子穿 端刺 線並 弓移 之下 上將 域針 區刺 箔穿 極一 ο 片 端凸 。 線離 成引遠 形及並 而箔移 出極上 伸電將 處係針 其圖刺 由1穿 體1中 狀第其 鰭 ， 之 圖 的 子 視壓 側被 面體 剖狀 直鰭 垂諸 之中 片其 凸且 輾 分 部 被 上 其 從 有 具 其 圖 視 正 分 部 之 箔 極 5 ρτ 係 圖 2 11 第 從 式 方 1 另 以 有 具 其 圖 視 正 分 部 之 箔 極 電 係 膜圖 月 3 成 1 之第 除 去 膜 成 之 除 去 ^ i I 分4 膜 部 1 成 被第之 上 除 其 去 圖 視 正 分 部 之 箔 極 8 係 圖 分的 部處 被域 上區 其之 從膜 有成 具除 其去 已 於 成 形 個 數 複 有 具 且 -21- 201015594 孔。 第15圖係電極箔之部分正視圖，其具有從其上被部分 去除之成膜，且具有複數個形成於多個已去除成膜之區域 處的孔。 第16圖係電極箔之部分正視圖，其具有複數個形成於 該處之孔。 第17圖係電極箔之部分正視圖，其具有複數個形成於 該處之孔，且具有多個相關於電極箔成縱向延伸且形成於 © 電極箔之諸相對側邊處之凹槽。 第18圖係電極箔之部分正視圖，其具有從其上被部分 去除之成膜，且具有複數個形成於多個已去除成膜之區域 處的孔。 第19圖係電極箔之部分正視圖，其具有從其上被部分 去除之成膜，且具有複數個孔形成於多個已用另一方式去 除成膜之區域處。 【主要元件符號說明】 1 電 子 零 件 製 造 裝 置 la 刺 穿 針 作 業 刖 之 程 序 lb 針 穿 刺 及 鰭 狀 體 壓 擠操作之程序 1 c 捲 起 —' 元 件 之 程 序 2 電 極 箔 2 A 電 極 箔 2B 電 極 箔 2a 成 膜 -22- 201015594 2b 諸相對側邊 2c 凹槽 2d 孔 2e 已去除成膜之區域 2f 諸鰭狀體 3 絕緣紙 3 A 絕緣紙 3B 絕緣紙 〇 4 引線端子 4 A 引線端子 4B 引線端子 4 a 凸片 4f 諸鰭狀體 5 電解質電容器 6 雷射光束 ❿ 8 雷射發射裝置 9 元件 10 元件捲起裝置 11 捲筒 12 滑輪 13 滑輪 14 滑輪 15 用於操作針穿剌與鰭狀體壓擠單元之裝置 16 穿刺針 -23- 201015594Ο The fins are all formed in the electrode foil electrode foil and the like, so that the lead fins are reduced here (the large decomposing capacitor is additionally, the method, the laser is emitted, and the uranium engraved tab is welded, therefore, The direct resistance in the lead area can be significantly increased. In addition, the part can be simplified, and rolled up into a one-dimensional laser emission to remove the etching layer or the electrode foil before the horizontal piercing lead terminal is advanced to attach the lead terminal tab To the electrode foil, and these are carried out during the process of being rolled up into a component. Therefore, the fin has no etched layer or coating layer on its sides, and the fins of the tabs of the lead terminals thereof Direct contact, and the resistance between the terminal and the electrode foil can be significantly reduced. When pressed under various conditions, the resistance can be compared with the conventional one. ΙιηΩ to ΙπιΩ). Therefore, electronic components (especially electricity) can be fabricated into a person with significantly increased electrical performance. An illuminating device for manufacturing a rolled-up electronic component according to the present invention is used to peel a layer or a coating layer from an electrode foil by a laser beam, and to connect a lead terminal to the electrode foil by a laser beam The area where the etching layer or the coating layer has been removed. The tab of the terminal and the metal of the electrode foil can be contacted in a relatively wide area, and thus the electrical connection between the lead terminal and the electrode foil is reduced, and the electrical conductivity of the electronic component can be significantly increased in this case. Needle puncture procedures can be unnecessary, thus manufacturing procedures and reducing the cost of parts manufacturing. According to the apparatus of the present invention for manufacturing a rolled-up electronic component when a plurality of electrode foils and a plurality of sheets of insulating paper are transported, the apparatus for peeling off and peeling a layer from the electrode foil by a laser beam is used. And at the electrode foils, a plurality of holes are formed, or a plurality of grooves are formed at opposite sides, and this is a step of puncturing the tabs of the pins with the electrode foils to connect the tabs with the electrode foils. Therefore, the etching layer or the coating layer can be easily removed from the electric foil of the -13-201015594, and the holes and the grooves can be easily and accurately formed to replace the conventional instrument. Further, the tab of the lead terminal and the metal of the electrode foil can directly contact each other in a wide area, and the shape and number of the holes can be arbitrarily set or changed. In addition, the formation of the fins can be arbitrarily controlled in a procedure in which the puncture needle is operated to pierce the tabs of the lead terminals and the electrode foil to attach the lead terminals to the electrode foil, and thus the most desired In the case of the fin, the resistance between the lead terminal and the electrode foil is significantly reduced (about Ο.ΙιηΩ to ΙϊπΩ) as compared with the conventional one. Therefore, electronic components (especially electrolytic capacitors) can be fabricated to have a significantly increased electrical performance. [Embodiment] The present invention will now be described in detail below with reference to the accompanying drawings. Referring to Figures 1 to 5, a device 1 for manufacturing an electronic component (exemplified by a rolled-up electrolytic capacitor 5) is provided with a laser emitting device 8 for emitting a laser beam onto the electrode foil 2. So that a uranium engraved layer or a coating layer (hereinafter referred to as "film formation 2a") can be peeled off from the electrode foil 2_ (Figs. 6 to 8) for use in the electrode foil 2 Forming a hole or for forming a plurality of grooves 2c (Fig. 17) at opposite side edges 2b of the electrode foil 2, and this is to pierce the electrode foil 2 with a puncture needle to attach the lead terminal In the program la before the tab, the electronic component manufacturing apparatus 1 is simultaneously conveying a plurality of electrode foils 2 (2A, 2B) and a plurality of sheets of insulating paper 3 (3A, 3B), and winding up the electrode foils. 2 and insulating paper 3 are attached to attach the tab 4a of the lead terminal 4 (4A, 4B) to the electrode foil 2. Referring to Figures 1 to 3, the electronic component manufacturing apparatus 1 includes a package of -14-201015594, which is an essential part of a device for winding up the electrode foils 2A, 2B into a component 9. The electrode foils 2A, 2B which are stored in a pattern which are respectively wound around a pair of reels 11 are simultaneously pushed outward, and are guided by a plurality of guide pulleys 12, and are passed through The electrode foils 2A, 2B are subjected to a procedure 1b for needle puncture and compression processing, and are further guided by a pair of pulleys 13, 14 to a program in which the electrode foils 2A, 2B are rolled up into the component 9 (Fig. 4). The needle puncturing device and the squeezing device are all constructed as a main body 15, in which the needle ® puncturing device is disposed in the front and the pressing device is disposed in the rear. The needle puncture device includes a plurality of puncture needles 16, a needle holder 18, and a driver 19 (cylinder) for driving the needle holder 18. The pressing device includes a pressing head 20, a pressing seat 21, and a driver 22 (cylinder) for driving the pressing head 20. The laser emitting device 8 is arbitrarily referred to as a laser processor, a laser generator, a laser splicer, etc., and the operating gas has been significantly improved in recent years. The laser generator may be sufficient to be used to peel off the electrode foil 2 and remove the film 2a. The laser emitting device 8 is formed to emit a laser beam sufficient to be heated and fused into the ruthenium film 2a to thereby peel off the electrode foil 2 and remove the film 2a to form a hole 2d in the electrode foil 2 (8th and 9)), and a plurality of grooves 2c are formed at the opposite side edges 2b of the electrode foil 2. Next, there is a method for manufacturing a rolled-up electronic component according to the present invention, which method (Patent Application No. 1) uses a laser emitting device 8 for emitting a laser beam 6 to be peeled off from the electrode foil 2 and The etching layer or the coating layer (i.e., film formation 2a) is removed, and the electrode foil 2 is simultaneously rolled up into the element 9, as shown in Figs. -15- 201015594 In Fig. 7, the laser emitting device 8 is used to emit the laser beam 6 in the direction indicated by the arrow A, B and to laterally move it to the convexity of the attached lead terminal 4 in accordance with the required distance. This distance required for the sheet is gradually melted into a film 2a by heat. The region 2e of the film formation 2a has been removed from the metal 2g region of the electrode foil 2, and this metal is aluminum and has high conductivity which can be utilized. Incidentally, the shape of the region 2e can be formed in various forms. The area 2e shown in Fig. 12 is rectangular and extends across the electrode foil 2. The area 2e shown in Fig. 13 is a racetrack shape or an elliptical shape, and is laterally extended with respect to the electrode foil 2 within its width. The regions 2e shown in Fig. 15 are formed in two circles which are laterally disposed within the width thereof with respect to the electrode foil 2. The regions 2e shown in Fig. 18 are formed into two X-letter patterns having smooth corners. The regions 2e shown in Fig. 19 are formed into two rectangles which are disposed side by side and which extend longitudinally with respect to the electrode foil 2. Therefore, the shape of the region 2e can be arbitrarily formed by the irradiation of the laser beam 6. Further, the method for manufacturing a rolled-up electronic component of the present invention (claim No. 2 of the patent application) forms a hole in the electrode foil 2 by the laser emitting device 8 to attach the lead terminal 4 to The electrode foil 2, which is simultaneously rolled up into the element 9, as shown in Figs. 8 and 16 to 19. As shown in Fig. 8, the laser beam 6 can be reciprocally moved in the direction of rotation as indicated by the arrows C, D so that various types of holes 2d can be formed. The holes 2d are usually circular or square, but the shape can be varied in various ways. For example, as shown in Figs. 14 to 16 and 18, the two holes 2d are in the shape of a circle 201015594, and as shown in Fig. 17, the two holes 2d are square. Further, as shown in Figs. 14, 15, 18 and 19, the hole 2d may be formed at the region 2e from which the film 2a is removed, or as shown in Figs. 16 and 17, the hole 2d may be formed in The electrode box 2 on which the film formation 2a is left is not removed. Further, the method for manufacturing a rolled-up electronic component of the present invention (Patent No. 3 of the patent application) uses the laser emitting device 8 and is irradiated by the laser beam 6 at the opposite side 2b of the electrode foil 2 A plurality of grooves © 2c are formed, and this electrode foil 2 is simultaneously rolled up into the element 9. As for the formation of the grooves 2c, the length and depth are selectively determined. Further, the method for manufacturing a rolled-up electronic component of the present invention (claim 4 of the patent application) uses a laser emitting device 8 to peel off the electrode foil 2 and remove the etching layer or the coating layer (that is, the film formation 2a) And forming a hole 2d at the region 2e of the electrode foil 2, at which the film formation 2a is removed by the laser beam 6 for attaching the lead terminal 4 to the electrode foil 2, and the electrode foil 2 is simultaneously It is rolled up into the element 9, as shown in Figures 6-8. ❹ In this case, the shape at the region 2e from which the film formation 2a is removed and the shape of the hole 2d can be variously formed as shown in Figs. 14, 15, 18 and 19. In Fig. 14, the area 2e is rectangular and extends in the lateral direction with respect to the electrode foil 2, and has two circular holes 2d thereon. In Fig. 15, two circular areas 2e are shown having concentric holes 2d formed thereon, respectively. In Fig. 18, the regions 2e are arranged in two X-letter patterns having a plurality of smooth corners and having two holes 2d formed therein, respectively. In the drawing of Figs. 19-17 to 201015594, the two square regions 2e are disposed side by side and extend longitudinally with respect to the electrode foil 2, and have square holes 2d formed therein, respectively. Further, the method for manufacturing a rolled-up electronic component of the present invention (Patent No. 5) peels off the electrode foil 2 and removes an etching layer or a coating layer using a laser emitting device 8 (that is, film formation 2) 〇, and a hole 2d is formed at the region 2e of the electrode foil 2, at which the film formation 2a is removed by the laser beam 6 for attaching the lead terminal 4 to the electrode foil 2, and then the lead terminal 4 is Positioned at the hole 2d, and operate the puncture needle 16 to pierce the lead wire terminal 4 and the electrode foil 2 so that the fins 4f, 2f of the lead terminal 4 and the electrode foil 2 can be formed to protrude therefrom, and The fins 4f, 2f are pressed to connect the lead terminal 4 to the electrode foil 2, and the electrode foil 2 is rolled up into the element 9. Further, the method for manufacturing a rolled-up electronic part of the present invention (Patent No. 6) The use of the laser emitting device 8 peels off the electrode foil 2 and removes the etching layer or the coating layer (that is, the film formation 2a), and then the lead terminal 4 is welded to the electrode foil 2 to be removed. The region 2e of the film formation 2a (not shown), and the electrode foil 2 is rolled up into the element 9. The present invention The above is generally constructed, and the mode of operation will be explained below. Referring to Figures 1 to 3, the most important mode of operation is to use a laser emitting device to process the electrode foil 2 differently by the laser beam. The electrode foil 2 is rolled up into components. A device 10 for rolling up the electrode foil 2 is provided with a shaft (not shown) which is rotated to wind up the electrodes which are respectively unwound from the spool 11. The foil 2' is conveyed by the guidance of the guide pulley 12. -18- 201015594 When the portion of the electrode foil 2 attached by the lead terminal 4 comes to the laser emitting device 8 as shown in the third embodiment, the mine The radiation emitting device 8 is irradiated with a laser beam to the electrode foil 2 so that the film 2a can be peeled off from the electrode foil 2, and a hole can be formed at the portion. Then, the electrode is stopped as shown in Fig. 9. The tab 4a of the lead terminal 4 is removed from the portion 2e of the film 2a by the anode foil 2, and the electrode foil 2g is exposed. Then, a holder driver 19 is operated for holding the puncture needle 16 Needle holder 18. The puncture needle 16 moves downward as indicated until the piercing needle 16 pierces the tab 4a So far, as shown in Fig. 1. During operation, the fins 4f of the tab 4a and the electrode foil 2 body 2f are formed to protrude from the lower side of the electrode foil 2, as in Fig. 10, in this case, It can be noted that the fins 2f of the electrode foil 2 (the metal 2g of which is formed into the film 2a) directly contact the body 4f of the aluminum tab 4a, and the contact area is very wide. Therefore, the resistance is in the tab 4a and The electrode foil 2 is largely confirmed by experiments, and the resistance is smaller than the conventional one. 0.1 ηηΩ 3 In Fig. 11, when the puncture needle 16 is ejected by the upper tab 4a as indicated by the arrow F, the electrode foil 2 The tab attachment portion is conveyed to the squeezing process where a ram driver 22 is operated to move a 20 below. As a result, the electrode foil 2 and the tab 4a are pressed against the press seat 21, and the strong pressing force from the tab 4a is as indicated by an arrow G. Therefore, the bodies 2f, 4f are compressed, and the tabs 4a and the electrode foils 2 are connected to each other. In this case, the tabs 4a and the electrode foils 2 are directly connected to each other to operate and to be separated from the foil 2 as placed. The gold of the electric 2 drives the fins of the E box 2 of the E. There are no fins reduced. [1 πιΩ. Move and press the head from the next pressure and bear the fins 触 in the wide area of the metal of the tab 4a and the electrode foil 2 of the structure -19-201015594. Therefore, the obtained product (i.e., the electrolytic capacitor 5) has a greatly reduced electrical resistance and excellent electrical conductivity. Incidentally, the tab 4a can be welded to the electrode foil 2 by irradiation of a laser beam instead of using a needle puncture and pressing means. Even in this case, the tab 4a can be welded to directly contact the metal region 2g of the electrode foil 2. Therefore, the obtained product (i.e., the electrolytic capacitor 5) has a resistance which is greatly reduced and has excellent conductivity. Further, the shape of the region 2e from which the film formation 2a has been removed, the shape of the hole 2d, and the shape of the grooves 2c, which are all treated by the irradiation of the laser beam, can be selectively and diversely formed. In particular, the shape of the fins 2f can be formed by the shape of the control hole 2d, and the optimum shape of the fins 2f is operatively selected. Further, the shape of the region 2e can be selectively selected to be the most advantageous for attaching the tab 4a to the electrode foil 2. The present invention has been mainly described above with respect to an electronic component, such as an embodiment of an electrolytic capacitor 5. However, the present invention is not limited to the electrolyte capacitor 5, but is applicable to any type of capacitor, such as a film capacitor, and other those including a rolled-up capacitor. [Simple description of the drawing] Figure 1 is a front view of an electronic component. Fig. 2 is an enlarged front elevational view showing an important part of an electronic component manufacturing apparatus. Fig. 3 is an enlarged perspective view of an important part of an electronic component manufacturing apparatus. -20- 201015594 Figure 4 is a partially cutaway perspective view of an electrolytic capacitor. Fig. 5 is a perspective view of an electrode foil having a tab attached thereto and interposed between a pair of insulating sheets. Figure 6 is a vertical cross-sectional side view of the electrode foil. Fig. 7 is a vertical sectional side view of the electrode foil having a film formed thereon by irradiation of a laser beam. Figure 8 is a vertical cross-sectional side view of an electrode foil having a hole formed thereon by irradiation of a laser beam. 〇 Figure 9 is a vertical cross-sectional side view of an electrode foil having a tab of a lead terminal placed on the electrode foil area where the film is removed and a puncture needle is moved downward. The foil side of the figure is cut perpendicularly. The surface of the foil is S ipr. ο 11 The upper side of the foil is removed, and the foil is de-energized and has a convexity with the diaphragm. The foil is in the pole, the film and the tab. The convex penetrating end piercing line and bowing under the upper needle area of the thorn stripe through the pole ο piece end convex. The line is separated from the far-reaching shape, and the foil is removed from the pole. The needle is twisted by the needle 1 from the middle of the body. The sub-pressure side of the figure is divided by the plane-shaped straight fin. The sheet is convex and the weir portion is taken from the foil pole 5 ρτ having its positive portion, and the foil electrode pattern is taken from the front side of the sheet. The removal of the film from the month of March 3 is removed. i i is divided into 4, and the film portion 1 is divided by the upper portion of the foil electrode 8 which is on the top of the image. There are holes in the formation of the number of parts that have been formed in the 21-201015594. Fig. 15 is a partial front elevational view of the electrode foil having a film formed partially removed therefrom, and having a plurality of holes formed at a plurality of regions where film formation has been removed. Fig. 16 is a partial front elevational view of the electrode foil having a plurality of holes formed therein. Fig. 17 is a partial front elevational view of the electrode foil having a plurality of holes formed therein and having a plurality of grooves extending longitudinally with respect to the electrode foil and formed at opposite sides of the © electrode foil. Fig. 18 is a partial front elevational view of the electrode foil having a film formed partially removed therefrom, and having a plurality of holes formed at a plurality of regions where film formation has been removed. Fig. 19 is a partial front elevational view of the electrode foil having a film formed partially removed therefrom, and having a plurality of holes formed at a plurality of regions which have been removed by another method. [Main component symbol description] 1 Electronic component manufacturing device la Puncture needle operation procedure lb Needle puncture and flip body pressing operation procedure 1 c Roll-up - 'Component procedure 2 Electrode foil 2 A Electrode foil 2B Electrode foil 2a Film formation-22- 201015594 2b Opposite side 2c Groove 2d Hole 2e Area where film formation has been removed 2f Fin 3 Insulation paper 3 A Insulation paper 3B Insulation paper 〇 4 Lead terminal 4 A Lead terminal 4B Lead terminal 4 a Tab 4f Fin body 5 Electrolyte capacitor 6 Laser beam ❿ 8 Laser emitter 9 Element 10 Component winding device 11 Reel 12 Pulley 13 Pulley 14 Pulley 15 For handling needle penetration and flipper pressure Squeezing unit device 16 puncture needle-23- 201015594
18 19 20 2 1 22 A B C18 19 20 2 1 22 A B C
E F G 穿刺針保持器 保持器驅動器 壓擠頭 壓擠座 壓擠頭驅動器 箭頭 箭頭 箭頭 箭頭 箭頭 箭頭 箭頭 ❹ -24E F G puncture needle holder retainer drive press head press seat press head drive arrow arrow arrow arrow arrow arrow arrow ❹ -24