JPH02198122A - Manufacture of metallized film capacitor - Google Patents

Abstract

PURPOSE:To remove a swelling and the residue and to thermal contraction of a film around notch parts for strengthening adhesion of a spraying metal to a metallized part by previously forming a metal excluded part on the spot where through holes are to be formed at the time of forming the notch parts of an edge face where an electrode lead-out part to be arranged. CONSTITUTION:A small circular metal excluded part 3 is formed on a metallized part 1A of a metallized film 1. Next, through holes 5 having a larger diameter than the metal excluded part 3 are formed on the spot of the metal excluded part 3. In this way, the metallized film 1, whereon lines of through holes 5 are formed, is cut by slitting connected through holes 5 in order to obtain metallized films 11, 12... in which a plurality of notch parts 11b, 12b... basing on the through holes 5 are formed. A metal is sprayed on these notch parts to form an electrode lead-out part, whereby thermal contraction of a dielectric film 1B at the time of forming the through holes 5 concentrates on the metal excluded part 3 to be melted for falling so as to prevent the dielectric film 1B from swelling in the peripheral part of the through holes 5. Thereby, immersion of the spray metal into the notch parts if ensured so that the spray metal can strongly be adhered to the metallized part.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing metallized film capacitors used in electronic and electrical equipment.

BACKGROUND OF THE INVENTION In recent years, chipping and miniaturization of electronic components have been progressing rapidly as mounting technology advances.

This wave of chipping and miniaturization is also hitting metallized film capacitors.

In order to make metallized film capacitors into chips and smaller in size, thin metallized films of 1.5 μm to 4 μm are used, and even thinner metalized films of 1.5 μm or less have recently been used.

- Electrodes of metallized film capacitors are taken out within the film by winding or laminating the metallized film and then applying metal spraying to the exposed surface of the metallized portion at the end of the film. Here, if the contact condition between the electrode on the metallized film (-formed by vacuum evaporating aluminum, zinc, etc. into the film) and the sprayed metal will not only deteriorate the characteristics, but also cause the electrode and the sprayed metal to deteriorate. If the film becomes separated, the capacitor function may be lost, so it is necessary to have sufficient strength both electrically and mechanically, and it is necessary to ensure a gap between the films so that the sprayed metal can easily penetrate.

By the way, as a method of ensuring sufficient electrical and mechanical strength and ensuring gaps between films as described above, it is possible to form notches at the edges of the films using laser light, or to create wide notches. There is a method in which a hole is made in the film using a laser beam, and then a notch is formed by cutting a slit over the hole, and the latter method is extremely easy to mass-produce.

Hereinafter, the above-mentioned conventional technology will be explained with reference to the drawings.

FIG. 3 is a perspective view showing the structure of a multilayer film capacitor using a metalized film on one side. In addition, in FIG. 3, in order to make it easier to understand the structure of the laminated film capacitor and the notch, the distance between the films is widened and the electrode lead-out portion made of sprayed metal is omitted. On one side (upper surface) of each of the laminated notch-forming metallized films It and 12, metallized parts 11A and 12A, which become electrodes, are formed by vapor deposition. Double cutout metallized film 11.1
Narrow groove-shaped non-metalized portions 11a and 12a are provided in the opposite ends of 2 in the length direction to expose the dielectric films 118 and 128 at the bottoms, respectively, and furthermore, the end surfaces of the ends are A plurality of notches 11b and 12b are formed in the. Metal is thermally sprayed from the directions of arrows M and N toward the end face where the notches 11b and 12b are provided. The solvent metal enters through the notches 11b and 12b, and the sprayed metal enters the metallized portion of the lower notch-forming metallized film, for example, the notch 11b, and the metallized portion forms the lower notch. It is connected to the metallized portion 12A of the film 12.

Problems to be Solved by the Invention However, in the conventional technique, a YAG laser is used to form the cutout portion 11b in the metallized film 11.12.

12b or notches 11b, 12
When trying to form a hole to form a hole, the metallized parts 11A and 12A are completely sublimated by the laser beam, but the dielectric films 113 and 123 are not completely sublimated, and as shown in FIG. There was a problem in that the peripheral portion of the notch portion 11b was subject to thermal contraction. That is, for example, the dielectric film 11B heat-shrinks in the peripheral area of the notch 11b to form a raised part 11G on the top and bottom, and the notch 1
A residual film 11d of sublimation protrudes from the peripheral wall portion of 1b. Notch portion 11b.

When 12b is in the above state, even if you try to infiltrate the metal by thermal spraying, the intrusion of the sprayed metal will be prevented due to the presence of unsublimated materials and the swelling of the film around the notch 11t), 12b. It was difficult and incomplete.

The present invention solves the above-mentioned problems, and involves forming a notch using a YAG laser, or metallizing the area around the notch or hole when forming a hole to become the notch. The object of the present invention is to provide a method for manufacturing a metallized film capacitor that prevents the film from rising and the dielectric film remains as an unsublimated material in the notch, and ensures that the sprayed metal penetrates into the capacitor. .

Means for Solving the Problems In order to solve the above problems, the method for manufacturing a metallized film capacitor of the present invention provides a method for manufacturing a metallized film capacitor according to the present invention, in which one end in the width direction of a metallized film is provided with a metallized portion on at least one side of a dielectric film. forming a non-metallized portion in the longitudinal direction on the metallized portion of the end portion, and forming a metal removed portion in the longitudinal direction on the metallized portion at least at the edge of the end portion, and then applying a laser beam to the location of the metal removed portion. At the same time, a notch is formed or a through hole is formed, and the through holes are connected and cut into slits to form a notch on the cut end surface, and then a plurality of sheets of the notch-formed metallized film are The electrodes are stacked so that the ends on which the non-metalized parts are formed are alternately located on opposite sides, and metal is sprayed on both end faces formed by the ends to form electrode extraction parts. It is.

Effect With the above configuration, the thermal contraction of the dielectric film due to the laser energy when forming the notch or through hole is concentrated in the pre-formed metal removed area, so that the notch due to the thermal contraction of the dielectric film is This also prevents the dielectric film from remaining as an unstirred substance in the swell around the through hole and the notch, and when spraying metal onto the end face of the laminated metallized film with the notch, the sprayed metal The infiltration of the metal into the notch becomes reliable, and the adhesion between the sprayed metal and the metallized portion of the metallized film at the electrode extraction portion to be formed becomes strong.

Example Hereinafter, the present invention will be explained with reference to the drawings.

FIG. 1 is a schematic perspective view illustrating one step of a method for manufacturing a metallized film capacitor according to an embodiment of the present invention, and FIG.
The figure is an enlarged perspective view of the main part of FIG. 1. As shown in FIGS. 1 and 2, a metallized portion 1A serving as an electrode is formed on one side (upper surface) of a dielectric film 1B by metal vapor deposition, and a metallized portion on the upper surface of a running wide metallized film 1. to 1A,
A plurality of (three) groove-shaped non-metalized portions 1a are formed in the longitudinal direction at predetermined intervals in the width direction using the non-metalized portion forming laser beam 2a using the non-metalized portion forming laser 2. Next, a small circular metal removal portion 3 is continuously formed along and near the non-metalized portion 1a using a metal removal laser beam 4a using a metal removal laser 4. A through-hole 5 having a larger diameter than the metal-removed portion 3 was formed at the location of the metal-removed portion 3 using a through-hole laser 6 with a through-hole laser beam 6a. In this way, a plurality of parallel non-metalized parts 1a
A single-sided metallized film 1 having a plurality of rows of through holes 5 formed therein is cut by connecting the through holes 5 in each row and slitting it.
a non-metalized portion 11a based on each non-metalized portion 1a at one end;
12a... and at least the non-metalized portion 11a
, 12a..., the through hole 5
A plurality of cutout-forming metallized films 11. in which a plurality of cutout portions 11b, 12b, . . . are formed based on.
12... were divided.

The above-mentioned plurality of notch-forming metallized films 11°12
. . . as shown in FIG. 3, the non-metalized portion 11a.

12a... side edges are alternately located on opposite sides and laminated, and then metal is thermally sprayed on both end surfaces formed by the lamination to form electrode extraction parts, thereby forming a metallized film. I got a capacitor.

In the metallized film capacitor obtained as described above, when metal is thermally sprayed to form the electrode lead-out portion, the notches 11b, 12b, etc. formed on the end face are removed from the metallized portion 1A in advance. By forming the portion 3 to expose the dielectric film 1B, forming the through hole 5 at that location using the through hole laser 6, and forming the through hole 5 based on the through hole 5, the through hole 5 is formed. The heat shrinkage of the dielectric film during the formation of the dielectric film during one day concentrates on the metal removal part 3 and melts and falls, so that no swelling of the dielectric film 1B or residual film is formed around the through hole 5. , each of the notches 11b, 12b, . . . naturally has no swells or residual films around the periphery, so that it is certain that the sprayed metal will infiltrate each of the notches 11b, 12b, .
Sprayed metal and metallized portion 11 in the formed electrode lead-out portion
A, 12... were firmly adhered.

In the above embodiment, the metal removed portions 3 are formed by arranging a plurality of small circular portions, but they may be formed continuously in a linear shape, for example. Moreover, each notch part 11b, 12b... is 131
Although the metallized film 1 was formed by providing a hole 5, a metal removed portion 3 was formed at the edge of the metallized film 1, and a laser was used to directly cut out the notches 11b, 12b, . . . at the metal removed portions 3. may be formed.

Effects of the Invention As described above, in the method for manufacturing a metallized film capacitor of the present invention, when forming the notch on the end face where the electrode extraction portion is arranged, the notch or notch in the metallized film is formed. By forming a metal removed portion in advance at the location where the through hole is to be formed, thermal contraction of the dielectric film due to laser energy is concentrated on the metal removed portion, and the dielectric film around the notch and through hole is There is no swelling or residue due to heat shrinkage, so when spraying metal onto the end face of the laminated notch-forming metallized film that has the notch,
It is possible to obtain a metallized film capacitor in which the penetration of the sprayed metal into the cutout portion is unhindered and reliable, and the adhesion between the solvent metal and the metallized portion in the formed electrode lead-out portion is extremely strong.

[Brief explanation of the drawing]

FIG. 1 is a schematic perspective view illustrating one step of a method for manufacturing a metallized film capacitor in an embodiment of the present invention, and FIG.
The figure is an enlarged perspective view of the main part of Fig. 1, Fig. 3 is a schematic perspective view showing the structure of a metallized film capacitor, and Fig. 4 is a perspective view of the main part of a conventional notch-forming metallized film. . 1...Metalized film, 1A...Metalized part, 1B.
...Dielectric film, 1a... Non-metalized part, 3...
Metal removal part, 5... Through hole, 6... Laser for through hole, 11.12... Notch part forming metallized film, 11
a, 12a...non-metalized part, 11b, 121)
...Notch. Agent: Yoshihiro Morimoto

Claims (2)

[Claims] 1. A metallized film having a metallized portion on at least one side of the dielectric film, wherein a non-metalized portion is formed in the longitudinal direction of the metallized portion at one end in the width direction, and at least the end on which the non-metalized portion is formed. A metal removed portion is formed in the longitudinal direction of the metallized portion at the end edge of the portion, and then a plurality of notches are formed at the location of the metal removed portion using a laser, and then the notched portion forming metal A plurality of sheets of metallized films are stacked so that the ends with non-metalized parts are alternately located on opposite sides, and metal is sprayed on both end faces formed by the ends to form electrode extraction parts. Method of manufacturing metallized film capacitors. 2. A metallized film having a metallized portion on at least one side of the dielectric film, a non-metalized portion is formed in the metalized portion in the longitudinal direction, and a metal removed portion is formed in the longitudinal direction near the non-metalized portion. Next, a laser is used to form a plurality of through holes at the location of the metal removed portion, and the through holes are connected and cut into slits to form a notch on the cut end surface. A plurality of sheets of the metallized film with the notch portion formed are stacked so that the ends with the non-metalized portions are alternately located on opposite sides, and metal is sprayed on both end faces formed by the ends to take out the electrode. A method of manufacturing a metallized film capacitor forming a part.