TW201014447A - Package structure of full-color LED with driver mechanism - Google Patents

Package structure of full-color LED with driver mechanism Download PDF

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Publication number
TW201014447A
TW201014447A TW097136357A TW97136357A TW201014447A TW 201014447 A TW201014447 A TW 201014447A TW 097136357 A TW097136357 A TW 097136357A TW 97136357 A TW97136357 A TW 97136357A TW 201014447 A TW201014447 A TW 201014447A
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Prior art keywords
led
full
blue
electrode
current limiting
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TW097136357A
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Chinese (zh)
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TWI380735B (en
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Hsien-Jung Huang
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Apa Electronic Co Ltd
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Priority to TW097136357A priority Critical patent/TWI380735B/en
Priority to KR2020090012031U priority patent/KR200472080Y1/en
Publication of TW201014447A publication Critical patent/TW201014447A/en
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Publication of TWI380735B publication Critical patent/TWI380735B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/0555Shape
    • H01L2224/05552Shape in top view
    • H01L2224/05554Shape in top view being square
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491Disposition
    • H01L2224/4912Layout
    • H01L2224/49171Fan-out arrangements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)

Abstract

A package structure of full-color LED with driver mechanism includes an IC chip, a red LED dice, a green LED dice, a blue LED dice, and corresponding current limiting resistors. The IC chip has driver mechanism to control the red LED dice, the green LED dice, and the blue LED dice. By the specific arrangement of these elements, the package structure gets a white light or full color light with high resolution, impacted structure, uniform mixing effect and achieves cost down and lowers space usage.

Description

201014447 六、發明說明: 【發明所屬之技術領域】 本發明為-種全彩LED崎裝結構,可朗於各種的 LED顯不幕及特殊絲的顯示效果,此全彩更特別為一 種内部包含有驅動機制之全彩LED的封装結構。 【先前技術】201014447 VI. Description of the Invention: [Technical Field] The present invention is a full-color LED chipping structure, which can be used for display of various LEDs and special wires. This full color is more specifically an internal inclusion. A package structure of a full-color LED with a driving mechanism. [Prior Art]

光源在人類的生活中,長期以來—直都佔有舉足輕重的 地位,隨著科技不斷的進步,在70年代已發展 (Light Emitting Diode ; LED), 源具有體積小、#命長、不易破損、低功率絲、無熱輻射及 有毒物質(如:7jC銀...等)的汙染,目前再日常生活的應用已經 十分普及。 近年來在各國政府大力推動環保節能的政策下,發光二 極體(LED)的朗大致可分細示功能及照明魏2大方向, 由於科技不斷的進步’傳統的單色發光二極體⑽功已經漸漸 無法滿足人類視覺的需求’所以陸續開發出了雙色發光二極體 (LED)、全彩發光二極體(LED)等相關產品,請參照「第丨圖」, 為習知全彩發光二極體之封裝結構示意圖。 —習知全彩發光二極體,為能達成各種顏色的呈現,所以 母一顆全彩LED10封裝結構中,至少包含有紅光取凡印晶片 1卜綠光(G)LED:曰曰片12及藍光⑼LED晶片13,以利用紅光 (f)、綠f*(G)及藍細)三祕絲混合出千變萬化的光線色 彩’但是因為各種光色所需求的RGB三原色光的比例都不 ^二故全彩發光二極體1〇都需要外接搭配有限流電組及驅動 單士’來有效精準的控制RGB三原色的混光比例。 目前習知的作法系以印刷電路板(pCB) 4〇上設置有全彩 LED10、P艮流電組2G (a〜e)及驅動單元21,請參照「第2 3 201014447 圖」,為習知全彩發光二極體之實施結構示意圖。最後只要將 複數個電路板彼此間加以電性連接,透過中央控制傳遞來的工 作電源及控制sfl號來駆動全彩LED,透過多數的全彩led的 光影變換後即可以形成一個完整的LED顯示^。 的 - 【發明内容】 雖然習知的全彩發光二極體所形成的LED顯示幕技術已 臻;^整,但是由於需要在電路板上附加限流電組及驅動單元, 會造成彼此鄰接的全彩LED之間的間距過大,LED顯示幕盔 參 法良好顯示出細緻的圖像;同時軟性電路板亦很容易因為凹^ 而產生與各元件間的焊點接觸不良,造成電路的誤動作及故 障,而驅動元件外露也容易受到頻率干擾(处乃及電磁干擾 (EMI)的影響,進而影響整體LED顯示幕的運作。 有鑑於此,本發明揭露一種具有驅動機制的全gLED之 封裝結構,其目的在於有效改良習知LED顯示幕中,各鄰近 全彩LED之間的間距過大的問題;此全彩LED中包含有一積 體電路晶片、一紅光(R)LED、一綠光(g)LED及一藍光(B)LED 之發光一極體晶片(LED dice)並搭配限流電組所組成,且在此 參 積體電路晶片中更設置有驅動機制來完成對RGB三原色之 LED晶片的控制’同時藉由内部各元件的排列配置,可組成 緊密度高、混光效果佳且高解析度之全彩LED,並有效縮小 使用空間進而降低生產成本。 另一方面將積體電路晶片封裝入全彩led之中,可以進 一步減低頻率干擾(RFI)及電磁干擾(EMI),更可因為元件的簡 化而省略軟性電路板’完全改善軟性電路板因凹折而產生的焊 點接觸不良等故障問題;將全彩led之間的間距縮小後,更 可減少LED顯示屏整體的功率損耗,達到易於控制及節能之 效果。 有關本發明之詳細内容及技術,兹就配合圖式說明如下。 201014447 【實施方式】 根據本發明所揭露之具有驅動機制的全彩LED之封裝結 構’請參閱「第3A圖」所示,其為本發明具有驅動機制的全 彩LED之封裝結構第一實施例示意圖。 參 φ 具有驅動機制的全彩LED之封裝結構,其中全彩LED包 含有.電源輸入端Vcc、電源輸出端〇n(j、時脈數據輸入端 CLKI、時脈數據輸出端CLKO、串行數據輸入端财及串行 數據輸出端SDO共6接腳,而設置於框架1〇〇内部的封穿仕 構則包含有積體電路晶片30、3個限流電組2〇(a〜c)、紅光 LED晶^ 11、,光(g;)LED晶片I2及藍光⑼LED晶片13, 這紅、藍、綠三種光色之LED晶粒上則分別設置有第一電 及第二電極並固定在承載部1〇1之上。 # 電源輸入端Vcc延伸到全彩LED10封裝結構内部形成一 矩形的延伸部1G2 ’並在其延伸部1G2上黏貼有3個限流電組 20(a〜c),此限流電組為雙面導電之晶片電阻,所以當限流電挺 20(a〜c)底部_於延伸部102後,直接就與電源輸入端Μ 形成電性連接’祕流電組2G(a〜e)卿顺金屬線打線接合 (wire bonding)在藍光(B) 13、紅光(R)11及綠光 12之第一電極上。 ^ 而紅光(G)U、綠光(G)i2及藍光出)LED晶片B之第二 電極則以打線接合(wire bonding)至積體電路晶片3〇的控制 點,積體電路晶片30設置黏貼於承載部1〇1之上,並盥電源 輸入端Vcc、電源輸出端Gnd、時脈數據輸入端clki;、時脈 數,m clko、串行數據輸入端SDI及串行數據輸出端 SDO /、6接腳打線接合(wire b〇nding),最後灌入可透光材質 的混光膠103完成封裝,其對應位置可參閱「第3B圖」為本 發明具有鷄_的全彩LED之雖結構第—實施例側 圖。 201014447 τ™ 第4圖」所示,為本發明具有驅動機制的全彩 路圖’首先工作電源由電源輸入端Vcc輸入後 體電路晶片3G,並同時透過3個限流電組2〇(a〜c)提 光ΪΤ、綠光(G)12及藍光⑼㈣晶片13所需的工作 電、机電組2〇(a〜C)用於精準的控制分配到LED晶片上的In the human life, the light source has occupied a pivotal position for a long time. With the continuous advancement of technology, it has developed in the 1970s (Light Emitting Diode (LED)). The source has small size, long life, not easy to break, low. The pollution of power wires, non-thermal radiation and toxic substances (such as: 7jC silver, etc.) is now widely used in daily life. In recent years, under the policy of governments to promote environmental protection and energy conservation, the LEDs of LEDs can be roughly divided into functions and lighting. In the direction of technology, the traditional monochromatic light-emitting diodes (10) The work has gradually failed to meet the needs of human vision. So we have developed two-color LED (LED), full-color LED (LED) and other related products, please refer to the "District", for the full color of the light Schematic diagram of the package structure of the polar body. - The well-known full-color LEDs can achieve a variety of colors, so the mother's full-color LED10 package structure, at least contains red light to print the wafer 1 green light (G) LED: 曰曰 12 and blue (9) LED The wafer 13 mixes the ever-changing light color with the three secret filaments of red light (f), green f* (G) and blue fineness 'But the ratio of RGB three primary colors required by various light colors is not the same. The color LEDs need to be connected with a limited current group and a driving board to effectively control the mixing ratio of the three primary colors of RGB. At present, a conventional method is to provide a full-color LED 10, a P-flow current group 2G (a to e), and a drive unit 21 on a printed circuit board (pCB). Please refer to "2 3 201014447" for details. Schematic diagram of the implementation structure of the color light-emitting diode. Finally, as long as a plurality of circuit boards are electrically connected to each other, the working power supply and the control sfl number transmitted by the central control are used to activate the full-color LED, and a complete LED display can be formed through the light and shadow conversion of most full-color LEDs. ^. - [Summary of the Invention] Although the LED display screen technology formed by the conventional full-color light-emitting diode has been smashed, it is necessary to add a current limiting group and a driving unit to the circuit board, which may cause adjacent to each other. The spacing between the full-color LEDs is too large, and the LED display mirrors are well displayed to show detailed images. At the same time, the flexible circuit boards are also prone to poor solder joints between the components due to the recesses, resulting in malfunction of the circuit and Failure, and the driving component is also exposed to frequency interference (electromagnetic interference (EMI), which affects the operation of the overall LED display screen. In view of this, the present invention discloses a package structure of a full gLED with a driving mechanism. The purpose is to effectively improve the problem that the spacing between adjacent full-color LEDs is too large in the conventional LED display screen; the full-color LED includes an integrated circuit chip, a red (R) LED, and a green light (g). LED and a blue (B) LED light-emitting diode chip (LED dice) is combined with a current-limiting group, and a driver mechanism is further arranged in the pixel circuit chip to complete the LED crystal of the RGB three primary colors. At the same time, by the arrangement of internal components, a full-color LED with high compactness, good light mixing effect and high resolution can be formed, and the use space can be effectively reduced to reduce the production cost. On the other hand, the integrated circuit chip Packaged into full-color led, it can further reduce the frequency interference (RFI) and electromagnetic interference (EMI), and the flexible circuit board can be omitted because of the simplification of the component. Such as the problem of failure; after reducing the spacing between the full-color LEDs, the overall power loss of the LED display can be reduced, and the effect of easy control and energy saving can be achieved. The details and techniques of the present invention are described below with reference to the drawings. 201014447 [Embodiment] According to the package structure of a full-color LED with a driving mechanism disclosed in the present invention, please refer to FIG. 3A, which is a first implementation of a package structure of a full-color LED with a driving mechanism according to the present invention. Example: φ φ full-color LED package structure with drive mechanism, where full-color LED includes. Power input terminal Vcc, power output 〇n (j The clock data input terminal CLKI, the clock data output terminal CLKO, the serial data input terminal and the serial data output terminal SDO have a total of 6 pins, and the sealing mechanism disposed inside the frame 1〇〇 contains the product. The body circuit chip 30, the three current limiting groups 2〇(a~c), the red LED crystal 11, the light (g;) the LED chip I2 and the blue (9) LED chip 13, the red, blue and green light colors The LED die is respectively provided with a first electric and a second electrode and is fixed on the carrying portion 1〇1. # The power input terminal Vcc extends into the full-color LED10 package structure to form a rectangular extension 1G2' and There are three current limiting groups 20 (a~c) adhered to the extension portion 1G2, and the current limiting group is a double-sided conductive chip resistor, so when the current limiting 20 (a~c) bottom portion is extended to the extension portion After 102, it is directly connected to the power input terminal ' 'secret current group 2G (a ~ e) qingshun metal wire bonding (wire bonding) in blue (B) 13, red (R) 11 and green On the first electrode of light 12. ^ The red electrode (G) U, the green light (G) i2, and the blue light out of the second electrode of the LED chip B are wire bonded to the control point of the integrated circuit chip 3, and the integrated circuit chip 30 The setting is adhered to the carrying portion 1〇1, and the power input terminal Vcc, the power output terminal Gnd, the clock data input terminal clki, the clock number, the m clko, the serial data input terminal SDI and the serial data output terminal SDO /, 6 wire bonding (wire b〇nding), and finally filled into the light-transmitting material of the light-mixing material 103 to complete the package, the corresponding position can refer to "3B" is the full color LED with chicken Although the structure is the same as the side view of the embodiment. 201014447 τTM Fig. 4 shows the full-color road map with the driving mechanism of the present invention. The first working power supply is input from the power input terminal Vcc to the rear body circuit chip 3G, and simultaneously passes through three current limiting groups 2 (a ~c) Fluorescent, green (G) 12 and blue (9) (4) wafers 13 required for the working electricity, electromechanical group 2 (a ~ C) for precise control distribution to the LED wafer

占仅確保各LED晶片混光時的產生的光色’同時形 ^保濩LED晶片的作用’時脈數據輸入端CLKI及串行數據 輸入端SDI將控制訊號傳送到積體電路晶片3〇後,積體電路 晶片曰30内的驅動機制則對紅光(G)n、綠光(G)i2及藍光⑼ LED晶片13產生各種壓降的控制以混合成不同的光色,工作 =^透過電源輸出端GND傳出,而控制訊號則是透過時脈 輸出端CLKO及串行數據輸出端SD〇傳出至下一個全彩 a 違反同一發明精神之下,本發明更有另一實施態 印參閱「第5A圖」所示’其為本發明具有驅動機制的全 彩LED之封裝結構第二實施例示意圖。It only takes effect to ensure the color of light generated when each LED chip is mixed with light. 'At the same time, the function of the LED chip is protected.' The clock data input terminal CLKI and the serial data input terminal SDI transmit the control signal to the integrated circuit chip 3 The driving mechanism in the integrated circuit chip 30 produces various voltage drops for the red (G)n, green (G)i2, and blue (9) LED chips 13 to be mixed into different light colors. The power output GND is transmitted, and the control signal is transmitted to the next full color through the clock output terminal CLKO and the serial data output terminal SD. In violation of the same invention, the present invention has another implementation state. Referring to FIG. 5A, FIG. 5 is a schematic view showing a second embodiment of a package structure of a full-color LED having a driving mechanism according to the present invention.

此實施方式的具有驅動機制的全彩Led之封裝結構,其 中全彩LED同樣包含有·· f源輸入端vcc、電源輸出端 GND、轉脈數據輸入端CLKI、η夺脈數據輸出端CLK〇、串行 數據輸入端SDI及串行數據輸出端SD〇共6接腳,特徵在於 電源輸入端Vcc延伸到框架1 〇〇内部形成一矩形平面的延伸部 102於承載部1〇1之上,積體電路晶片3〇則直接黏貼於延伸 部102之上,並與電源輸入端Vcc、電源輸出端Gnd、時脈數 據輸入端CLKI、時脈數據輸出端CLKO、串行數攄輪入踹SDT 及串行數據論SDG共6 _嫩合^b^;^SDI 紅光(G) LED晶片11、綠光(G) LED晶片12及藍光(B) LED晶片13,則分別設置有第一電極及第二電極,此實施例 中二原色LED晶片則以共晶或黏貼方式固定在積體電路晶片 30的控制點之上,第二電極並與控制點形成電性連接。 6 201014447 ❹The package structure of the full-color LED with the driving mechanism of the embodiment, wherein the full-color LED also includes the f source input terminal vcc, the power output terminal GND, the pulse data input terminal CLKI, and the n-pulse data output terminal CLK〇. The serial data input terminal SDI and the serial data output terminal SD 〇 have a total of 6 pins, and the power input terminal Vcc extends to the inside of the frame 1 形成 to form a rectangular planar extension portion 102 on the carrying portion 1〇1. The integrated circuit chip 3 is directly pasted on the extension portion 102, and is connected to the power input terminal Vcc, the power output terminal Gnd, the clock data input terminal CLKI, the clock data output terminal CLKO, and the serial number wheel 踹 SDT. And the serial data theory SDG total 6 _ tender ^ b ^; ^ SDI red (G) LED wafer 11, green (G) LED wafer 12 and blue (B) LED wafer 13, respectively, is provided with a first electrode And the second electrode. In this embodiment, the two primary color LED chips are fixed on the control point of the integrated circuit wafer 30 by eutectic or adhesive bonding, and the second electrode is electrically connected to the control point. 6 201014447 ❹

3個限流電組20(a〜c)則選擇最適合的位置黏貼於延伸部 102之上,此限流電組同為雙面導電之晶片電阻,所以當限流 電組20(a〜c)底部黏固於延伸部1〇2後,直接就與電源輸入端 Vcc形成電性連接’而限流電組2〇(a〜c)頂部則以金屬線打線 接合(wire bonding)方式’連接在積體電路晶片3〇之上的藍光 ⑻13、紅光⑻11及綠光(G)LED晶片12之第一電極,所有 的電性連接完成後則灌入可透光材質的混光膠1〇3完成封 裝’完成後之堆疊狀態可參閱「第5B圖」,為本發明具有驅 動機制的全彩LED之封裝結構第二實施例側剖視圖,從圖中 可明顯看出第二實施例較第一實施例更減少了打線接合(wire bonding)的數量,同時三原色晶片同時聚集固定在積體電路晶 片上’使混光距離更為密集且光色完整。 「除前述實施例之外,本發明更有另一實施態樣,請參閱 「第6A圖」所示,其為本發明具有驅動機制的全彩LED 封裝結構第三實施例示意圖。The three current limiting groups 20 (a to c) are selected to be most suitable for bonding to the extension portion 102. The current limiting group is the double-sided conductive chip resistor, so when the current-limiting group 20 (a~) c) After the bottom is adhered to the extension 1〇2, it is electrically connected directly to the power input terminal Vcc' and the top of the current limiting group 2〇(a~c) is wired by wire bonding. The first electrodes of the blue (8) 13, red (8) 11 and green (G) LED chips 12 connected to the integrated circuit chip 3 are filled with the light-transmitting glue of the light-transmitting material after all the electrical connections are completed. 〇3 Completing the package 'Complete stacking state can be referred to as FIG. 5B. FIG. 5 is a side cross-sectional view showing a second embodiment of a package structure of a full-color LED having a driving mechanism according to the present invention. The first embodiment further reduces the number of wire bonding, while the three primary color wafers are simultaneously assembled and fixed on the integrated circuit wafers to make the light mixing distance denser and the light color complete. In addition to the foregoing embodiments, the present invention has another embodiment. Please refer to FIG. 6A, which is a schematic diagram of a third embodiment of a full-color LED package structure having a driving mechanism according to the present invention.

此實施方式之封裝結構中,全彩LED亦同樣包含有:電 源輸入端Vcc、電源輸出端Gnd、時脈數據輸入端CLKI 輸出端CLKO、串行數據輸入端SDI及串行數據輸出端 〇 了 6接腳’電源輸入端Vcc仍延伸到框架1〇〇内部形 ^^开^面的延伸部1G2於承載部1G1之上,積體電路晶片 >1直接黏貼於延伸部1〇2之上’並與電源輸入端Vee、電 時脈數據輸入端CLKI、時脈數據輸出端⑽: 合SDG共6接腳打線接 光(G)㈣晶片11、綠光(G) LED晶片12及藍光⑼ Z rii3」則分別設f有第一電極及第二電極,為了In the package structure of this embodiment, the full-color LED also includes: a power input terminal Vcc, a power output terminal Gnd, a clock data input terminal CLKI output terminal CLKO, a serial data input terminal SDI, and a serial data output terminal. 6 pin 'power input terminal Vcc still extends to the inner portion of the frame 1 开 open surface 1G2 on the carrying portion 1G1, the integrated circuit wafer > 1 directly adhered to the extension 1 〇 2 'And with the power input terminal Vee, the electrical clock data input terminal CLKI, the clock data output terminal (10): SDG 6-pin wire connection (G) (4) wafer 11, green (G) LED chip 12 and blue light (9) Z rii3" is respectively set to have a first electrode and a second electrode, in order to

=上則貼附有-隔熱層32 ’此隔熱層選; 玻璃、陶轉隔熱材質,來阻隔LED晶片產生的熱能U 7 201014447 熱層31貼附於隔熱層32之上,並與承載部1〇1(或内部 =連,’以求將晶片LED工作時所產生的高熱透 之外’導熱層31則須選用散熱係數良好^金 屬^金來製作,紅光(G)LED晶片u、綠光 及藍光⑼LED晶片B職騎合的位 =上連接第一電酬與延伸部102打線接合一⑶= On the top is attached - Insulation layer 32 'This insulation layer is selected; Glass, ceramic to heat insulation material to block the thermal energy generated by the LED wafer U 7 201014447 The thermal layer 31 is attached to the thermal insulation layer 32, and In addition to the load-bearing part 1〇1 (or internal=connected, 'in order to achieve high heat penetration when the wafer LED is operated, the heat-conducting layer 31 must be made of a good heat dissipation coefficient ^metal gold, red light (G) LED Chip u, green light and blue light (9) LED chip B position of the ride = the first connection is connected to the extension unit 102 and the wire is joined (3)

3個限流電組20(a〜c)則黏貼於積體電路晶片3〇的控 ^上流電組同為雙面導電之晶片電阻,所以當限流電組 f(a〜0底部賴於積體電路晶片30的控制端後,直接就鮮 =形成電性連接’祕流顿2Q(a〜_部取金屬線打線 接&~肪bonding)方式,與積體電路晶片3〇之上的藍 13二紅光_及綠綱LED晶片12之第二電極相連接,然 V势t可透光材質的混光膠1G3完成封裝,其堆*方式可參^ *,6B圖」,為本發明具有驅動機制的全彩LED之封裝結構 第三實施例侧剖視圖,從圖中可明顯看出第三實施例與第: 施例較為雷同’雖分流電阻2〇(a〜C)與藍光(B) 13、紅光(R)11 及、’亲光p)LED晶片12的連接關係互換,但仍不影響其功能, 同樣f有第二實施例之優點’同時第三實施例將 刀加電阻20 (a〜c)設置於積體電路晶片3〇之上具有更進 的尺寸的優點,啊藍_ 13、紅光⑻11 ,、’#Tb(G)LED晶片12對應位置更接近,可產生更加的 果。 ,後請參閱「第7 ®」’本發明具有驅動機獅全彩LED 顯不幕之實施例示意圖。 運用本發明所揭露的全彩LED10相串接後,可組成大型 Ϊ t幕’其令各全彩LED1〇之間更以級聯控制方式連 ^ ’控制峨可從大型的控綱端輸出,減巾包含有使各全 衫LED10同步運作的時脈數據(CLK),以及控制紅光(G)、綠 8 201014447The three current-limiting groups 20 (a to c) are attached to the integrated circuit of the integrated circuit chip 3, and the two-layer conductive chip resistors are the same, so when the current-limiting group f (a~0) depends on After the control terminal of the integrated circuit chip 30, the direct connection is made to form an electrical connection 'The secret flow 2Q (a ~ _ part take the wire wire connection & ~ fat bonding), and the integrated circuit chip 3 〇 The blue 13 red light _ and the second electrode of the green LED chip 12 are connected, but the V potential t can be light-transmissive material mixed glue 1G3 to complete the package, the stack * method can be referred to ^, 6B map", A side cross-sectional view of a third embodiment of a package structure of a full-color LED having a driving mechanism, it is apparent from the figure that the third embodiment is identical to the first embodiment: although the shunt resistors 2〇(a~C) and blue light (B) 13. The connection relationship of the red (R) 11 and the 'affinity p' LED chips 12 is interchanged, but the function is not affected, and f has the advantages of the second embodiment. The resistors 20 (a to c) are disposed on the integrated circuit chip 3A to have a further dimension. The blue_13, red (8)11, and '#Tb(G) LED chips 12 are connected to each other. Nearly, more results can be produced. Please refer to "7th ®" after the invention. The invention has a schematic diagram of an embodiment in which the driving lion full color LED is not displayed. After the full-color LED 10 disclosed in the present invention is connected in series, a large-scale 幕 t screen can be formed, which enables each full-color LED 1 更 to be connected in a cascade control manner, and can be output from a large control terminal. The towel includes clock data (CLK) for simultaneously operating the full-length LEDs 10, and controls red (G), green 8 201014447

光(G)及藍光⑼LED晶片的串行數據(SD),全彩LED10從時 脈數據輸入端CLKI及串行數據輸入端SDI接收控制訊號後, 即運用脈衝寬度變調(Pulse Width Modulation ; PWM)方式對紅 光(G)、綠光(G)及藍光(B) LED晶片進行光色混合控制,同時 將控制訊號透過時脈數據輸入端CLKO及串行數據輸入端 SDO傳送至下一級的全彩LED10 ;透過前述的方式,設計者 即可連接多量的全彩LED來形成大型顯示幕,由於本發明之 全彩LED内建有具有驅動機制的積體電路晶片及限流電阻, 所以可有效的縮減各全彩LED之間的間距,讓大型顯示幕呈 現出更細緻的圖像。 雖然本發明以前述之較佳實施例揭露如上,然其並非用以限定 本發明,任何熟習此技藝者,在不脫離本發明之精神和範圍 内,當可作些許之更動與潤飾,因此本發明之保護範圍當視後 附之申請專利範圍所界定者為準。 【圖式簡單說明】 第1圖為習知全彩發光二極體之封裝結構示意圖; 第2圖為習知全彩發光二極體之實施結構示意圖; 第3A圖為本發明具有驅動機制的全彩LED之封士椹 第一實施例示意圖; 第3B圖為本發明具有驅動機制的全彩LED 第一實施例側剖視圖; <孤。構 第4圖為本發明具有驅動機制的全彩LED之等效電路 第二發明具有驅動機制的全彩LED之封裝結構 第5B圖為本發明具有驅動機制的全彩LED之封裝結構 201014447 第二實施例侧剖視圖; 第6A圖為本發明具有驅動機制的全彩 第三實施例示意圖; 7 _第6B圖為本發明具有驅動機制的全彩 第二實施例侧剖視圖;及 LED之封裝結構 LED之封裝結構 ^ 7圖為本發明具有驅動機制的全彩LED顯示幕之實施The serial data (SD) of the light (G) and blue (9) LED chips, the full-color LED10 receives the control signal from the clock data input terminal CLKI and the serial data input terminal SDI, and then uses Pulse Width Modulation (PWM). The method performs light color mixing control on the red (G), green (G) and blue (B) LED chips, and transmits the control signal through the clock data input terminal CLKO and the serial data input terminal SDO to the next level. Color LED10; Through the above-mentioned manner, the designer can connect a large number of full-color LEDs to form a large-scale display screen. Since the full-color LED of the present invention has a built-in circuit chip with a driving mechanism and a current limiting resistor, it can be effectively The reduction of the spacing between the full-color LEDs allows the large display to present a more detailed image. While the present invention has been described above in terms of the preferred embodiments thereof, it is not intended to limit the present invention, and it is to be understood that those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a package structure of a conventional full-color light-emitting diode; FIG. 2 is a schematic structural view of a conventional full-color light-emitting diode; FIG. 3A is a full-color LED having a driving mechanism according to the present invention; Schematic diagram of the first embodiment of the seal; FIG. 3B is a side cross-sectional view of the first embodiment of the full-color LED having the driving mechanism of the present invention; <orphan. 4 is an equivalent circuit of a full-color LED with a driving mechanism according to the present invention. The second invention has a driving mechanism of a full-color LED package structure. FIG. 5B is a package structure of a full-color LED with a driving mechanism of the present invention 201014447 second 6A is a side view of a full-color second embodiment having a driving mechanism according to the present invention; and FIG. 6B is a side cross-sectional view of a full-color second embodiment having a driving mechanism according to the present invention; and LED package structure LED The package structure ^ 7 is the implementation of the full color LED display screen with the driving mechanism of the invention

^主要元件符號說明】^Main component symbol description]

11 12 13 2〇(a〜c) 21 30 31 32 40 1〇0 1〇1 102 1〇3 CUCI St)I SD〇 V〇c Gnd 全彩LED 紅光(G)LED晶片 綠光(G)LED晶片 藍光(B)LED晶片 限流電阻 驅動單元 積體電路晶片 導熱層 隔熱層 軟式印刷電路板 框架 承載部 延伸部 混光膠 時脈數據輸入端 時脈數據輸出端 串行數據輸八^ 串行數據輸出端 電源輸入端 電源輸出端11 12 13 2〇(a~c) 21 30 31 32 40 1〇0 1〇1 102 1〇3 CUCI St)I SD〇V〇c Gnd Full Color LED Red Light (G) LED Chip Green Light (G) LED chip blue light (B) LED chip current limiting resistor drive unit integrated circuit chip heat conduction layer insulation layer flexible printed circuit board frame carrier extension part mixed light glue clock data input terminal clock data output serial data input eight ^ Serial data output power input power output

Claims (1)

201014447 七、申請專利範圍·· 1. -種料軸機制的全彩LED之封裝結構,該全彩led至 少含有: 一電源輸入端、一電源輸出端、一時脈數據輸入端、 一時脈數據輸出端、一串行數據輸入端及一串行數據輸出 端,其中該電源輸入端更具有一延伸部; 一承载部,具有一容置空間,用以容置一紅光(G)、一 綠光(G)及一藍光(B)LED晶片,且該紅、藍、綠三種光色之 LED晶粒上分別設置有一第一電極及一第二電極; 參 、了第一限流電組,該第一限流電阻黏貼於該延伸部上 並形成電性連接,且以一金屬線與該藍光毋)LED晶片之第 一電極相連接; 、/一第二限流電阻,該第二限流電阻黏貼於該延伸部上 並形成電性連接,且以該金屬線與該紅光(R)LED晶片之第 一電極相連接; 、/一第二限流電阻,該第三限流電阻黏貼於該延伸部上 並形成電性連接,且以該金屬線與該綠光(G)LED晶片之第 一電極相連接;及 一積體電路晶片,該積體電路晶片黏貼於該承載部之 參 上,並以該金屬線與該紅光(G)、綠光(G)及藍光(B) LED晶 片之第二電極連接,該積體電路晶片由該電源輸入端接收一 工作電源’並由該時脈數據輸入端及該串行數據輸入端接收 一控制訊號後,對該紅光(〇)、綠光及藍光(B) LED晶片 產生控制,再將該工作電源透過該電源輸出端傳出,且將該 控制訊號透過該時脈數據輸出端及該串行數據輸出端傳出。 2. 如申請專利範圍第1項所述具有驅動機制的全彩LED之封 裝結構,該全彩LED之間更以一級聯控制方式連接。 3. 如申請專利範圍第1項所述具有驅動機制的全彩LED之封 裝結構’該全彩LED更以一脈衝寬度變調(PWM)方式控制 該紅光(G)、綠光⑼及藍光⑻led晶片。 201014447 4. -種具有驅__全彩LED之封裝結構該 ε 少含有: 一電源輸入端,且該電源輸入端更延伸至該全彩led 2部?伸部、一電源輸出端、一時脈數據輸入端、-時脈數出端、一事行數據輸入端及一串行數據輸出端; -積體電路晶片’該積體電路晶片黏貼岐於該延 部之上,且該積體電路晶片之上更黏貼有一紅光(g)、一 光(G)及-藍光⑻LED晶片,且該紅、藍、綠三種光色= LED晶粒上分別設置有一第一電極及一第二電極,該 電路晶片與該紅光(G)、、綠光及藍^ n = 電?形成電性連接,該積體電路晶片由該電源輸入端接收= 工^電源,島該時脈歸輸人獻料行數雜入端接收 二控制訊驗’ _紅光⑹、軌(G)錄細)LED ^生控制,再將該工作電源透過該電源輸出端傳出,且將 控制訊^透過該時脈數據輸出端及該串行數據輸出端傳出; 了第一限流電組,該第一限流電阻黏貼於該延伸部上 二形成電性連接,m屬線與該藍細)LED晶片之第 一電極相連接; Φ 第二限流電阻’該第二限流電_貼於該延伸部上 J成電性連接,且以該金屬線與該紅光(R)LED晶 一電極相連接;以及 弟 5. Μ=三限流電阻,該第三限流電阻黏貼於該延伸部上 成電性連接’且以該金屬雜該綠光(G)LED晶片 一電極相連接。 專利範圍第4項所述具有驅動機制的全彩£ED 冓’該全彩LED之間更以—級聯控制方式連接。 、ίί專利麵第4項所述具有驅動機制的全彩LED之封 二H ’該全彩LED更以一脈衝寬度變調(pWM)方式 ^、、工光(G)、綠光(G)及藍光⑻LED晶片。 7.種具有驅動機制的全彩LED之封裝結構,該全彩咖至 12 201014447 少含有: 晴3二一且^電二輸,更,伸至該全彩LED 時脈备脉t f卩冑源輸出端、—時脈數據輸入端、一 一籍二·端、一串行數據輸人端及一串行數據輸出端; 部之η積 =電路晶片’該積體電路晶片黏翻定於該延伸 該積體電路晶片之上更設置有: 隔熱層,該隔熱層更黏貼於該積體電路晶片之 .JlL ,201014447 VII. Patent application scope ·· 1. The package structure of the full-color LED with the material axis mechanism. The full-color LED at least contains: a power input terminal, a power output terminal, a clock data input terminal, and a clock data output. a serial data input end and a serial data output end, wherein the power input end further has an extension portion; a load bearing portion having an accommodation space for accommodating a red light (G), a green a light (G) and a blue (B) LED chip, and the red, blue, and green light color LED dies are respectively provided with a first electrode and a second electrode; and the first current limiting power group is The first current limiting resistor is adhered to the extension portion and electrically connected, and is connected to the first electrode of the LED chip by a metal wire; and a second current limiting resistor, the second limit a current resistance is adhered to the extension portion and electrically connected, and the metal line is connected to the first electrode of the red (R) LED chip; and / a second current limiting resistor, the third current limiting resistor Adhering to the extension and forming an electrical connection, and the metal wire a first electrode of the light (G) LED chip is connected; and an integrated circuit chip, the integrated circuit wafer is adhered to the reference of the bearing portion, and the metal line and the red light (G), green light ( G) and a second electrode of the blue (B) LED chip, the integrated circuit chip receives a working power supply from the power input terminal and receives a control signal from the clock data input terminal and the serial data input terminal Controlling the red (〇), green, and blue (B) LED chips, and transmitting the working power through the power output, and transmitting the control signal to the clock data output terminal and the serial The data output is transmitted. 2. The full-color LED package structure with the driving mechanism as described in the first paragraph of the patent application is connected in a first-level control manner. 3. The package structure of a full-color LED with a driving mechanism as described in claim 1 of the patent scope. The full-color LED controls the red (G), green (9) and blue (8) LEDs in a pulse width modulation (PWM) manner. Wafer. 201014447 4. - Package structure with drive __ full color LED The ε contains: a power input, and the power input extends to the full color led 2? a stretching portion, a power output terminal, a clock data input terminal, a clock output terminal, a row data input terminal, and a serial data output terminal; - an integrated circuit chip 'the integrated circuit chip is pasted on the extension Above the part, and a red (g), a light (G) and a blue (8) LED chip are adhered on the integrated circuit chip, and the red, blue and green light colors are respectively arranged on the LED die. a first electrode and a second electrode, wherein the circuit chip is electrically connected to the red light (G), the green light, and the blue light, and the integrated circuit chip is received by the power input terminal. The island returns the number of feeds to the receiving line and receives the second control test ' _ red light (6), track (G) recording) LED ^ raw control, and then the working power is transmitted through the power output And transmitting the control signal through the clock data output end and the serial data output end; the first current limiting power group, the first current limiting resistor is adhered to the extension portion to form an electrical connection, m The strobe line is connected to the first electrode of the blue thin LED chip; Φ the second current limiting resistor 'the second current limiting _ affixed to J is electrically connected to the extension portion, and is connected to the red (R) LED crystal electrode by the metal line; and the 5=3 current limiting resistor, the third current limiting resistor is adhered to the extension portion The upper electrode is electrically connected and connected to the green light (G) LED chip by the metal. The full-color £ED 具有' with the driving mechanism described in item 4 of the patent scope is connected by cascading control. Ίί Patent No. 4, the full-color LED with the driving mechanism, the second H', the full-color LED is further modified by a pulse width modulation (pWM) method, work light (G), green light (G) and Blue (8) LED chip. 7. The package structure of full-color LED with driving mechanism, the full-color coffee to 12 201014447 contains less: Qing 3 21 and ^ electric two lose, more, reach to the full-color LED clock pulse tf source Output end, - clock data input end, one-by-one two-end, one serial data input end and one serial data output end; part of n-product = circuit chip 'the integrated circuit wafer is folded and fixed Extending on the integrated circuit chip, there is further provided: an insulating layer, the insulating layer is more adhered to the integrated circuit chip. JlL, —導熱層,該導熱層更黏貼於該隔熱層之上; 一紅光(G)、一綠光(⑺及一藍光LED晶片,該 .、’= “(Gj、綠光(G)及藍光(B)LED晶片黏貼於該導熱層之 且5亥紅、藍、綠三種光色之LED晶粒上分別設置 =一第一電極及一第二電極,該紅光(G)、綠光(G)及藍 光(B) LED晶片之第一電極以一金屬線與該電源輸入端 形成電性連接,該積體電路晶片由該電源輸入端接收一 工作電源,並由該時脈數據輸入端及該串行數據輸入端 接收一控制訊號後,對該紅光、綠光(G)及藍光(B) LED晶片產生控制,再將該工作電源透過該電源輸出端 傳出,且將該控制訊號透過該時脈數據輸出端及該串行 數據輸出端傳出; 曰 第一限流電組,該第一限流電阻黏貼於該積體電路 曰曰片上並形成電性連接,且以一金屬線與該藍光田)LED晶 片之第二電極相連接; 曰一第二限流電阻,該第二限流電阻黏貼於該積體電路 晶片上並形成電性連接,且以該金屬線與該紅光(r)led晶 片之第二電極相連接·,及 一第三限流電阻,該第三限流電阻黏貼於該積體電路 晶片上並形成電性連接,且以該金屬線與該綠光(G)LED晶 片之第二電極相連接。 8.如申請專利範圍第7項所述具有驅動機制的全彩LED之封 13 201014447 裝結構,該全彩LED之間更以一級聯控制方式連接。 9,如申請專利範圍第7項所述具有驅動機制的全彩LED之封 ,結構’該全彩LED更以一脈衝寬度變調(PWM)方式控制 °亥紅光(G)、綠光(G)及藍光(b)led晶片。a heat conductive layer, the heat conductive layer is more adhered to the heat insulating layer; a red light (G), a green light ((7) and a blue LED chip, the ., '= "(Gj, green light (G) and The blue (B) LED chip is adhered to the LED chip of the three heat colors of the red, blue and green light, respectively, and a first electrode and a second electrode are respectively disposed, and the red light (G) and the green light are respectively disposed. The first electrode of the (G) and blue (B) LED chips is electrically connected to the power input end by a metal wire, and the integrated circuit chip receives a working power from the power input terminal, and is input by the clock data. After receiving the control signal, the terminal and the serial data input terminal control the red, green (G) and blue (B) LED chips, and then transmit the working power through the power output, and a control signal is transmitted through the clock data output end and the serial data output end; 曰 a first current limiting power group, the first current limiting resistor is adhered to the integrated circuit chip and electrically connected, and a metal line is connected to the second electrode of the LED chip; a second current limiting resistor, the second current limiting resistor Attached to the integrated circuit chip and electrically connected, and connected to the second electrode of the red (r) led chip by the metal line, and a third current limiting resistor, the third current limiting resistor Adhering to the integrated circuit chip and forming an electrical connection, and connecting the metal wire to the second electrode of the green (G) LED chip. 8. The driving mechanism is as described in claim 7 The full-color LED seal 13 201014447 is equipped with a structure, and the full-color LEDs are connected in a first-level control manner. 9. The full-color LED seal with a driving mechanism as described in claim 7 of the patent application, the structure of the full color The LED is also controlled by a pulse width modulation (PWM) method to measure the red (G), green (G) and blue (b) LED chips.
TW097136357A 2008-09-22 2008-09-22 Package structure of full-color led with driver mechanism TWI380735B (en)

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