KR200472080Y1 - Packaging structure of full-color led - Google Patents

Abstract

The present invention relates to a packaging structure of a full color light emitting diode (LED) including a drive mechanism, wherein the full color light emitting diode (LED) has one integrated circuit board and one red (R). One green (G), one blue (B) LED chip, combined with ballast resistors, and integrated circuit boards with drivers to control RGB three-color chips In addition, high resolution full color light emitting diodes (LEDs) with high density and excellent light mixing effect are arranged through special arrangement of internal parts, thereby reducing the use space and reducing production cost.

Light Emitting Diodes, Packaging Structure, Ballast Resistors

Description

Full Color Light Emitting Diode Packaging Structure {PACKAGING STRUCTURE OF FULL-COLOR LED}

The present invention relates to a full color LED packaging structure, and more particularly, to a full color light emitting diode (LED) packaging structure including a drive mechanism therein.

As shown in FIG. 1, the packaging structure of each full color LED 10 in the prior art includes a red light (R) chip 11, a green light (G) chip 12, and a blue light (B) chip 13. And various light colors are mixed using RGB three primary colors. However, since the RGB ratios required by various light colors are all different, the full-color LEDs 10 control the light mixing ratio of the RGB three primary colors by connecting ballast resistors and a drive unit to the outside.

As shown in FIG. 2, the conventional method installs a full color LED 10, a stability resistor 20a to 20c, and a drive unit 21 on a soft PCB 40, and finally connects a plurality of circuit boards therebetween. The full-color LED 10 is driven by the operating power and control signals transmitted through the center control, and a full LED display screen is formed through the illumination conversion of a plurality of full-color LEDs.

LED display screens formed by conventional full color light emitting diodes (LEDs) require the addition of ballast resistors and drive units to circuit boards, so that the spacing between adjacent LEDs is too wide to display delicate images. At the same time, the soft circuit board is easily bent, which causes weld spot defects and circuit malfunctions; The drive unit is exposed and easily subject to frequency interference (RFI) and electromagnetic interference (EMI), affecting the operation of the LED display screen.

In view of the advantages, the present invention proposes a packaging structure of a full-color light emitting diode (LED) including a drive mechanism for the purpose of solving the problem that the spacing between adjacent LEDs of the existing LED display screen is too wide. This full color LED has an integrated circuit board and LED dice of red, green and blue light and is combined with ballast resistors.

According to the present invention, the internal unit of the light emitting diode chip is arranged in a special arrangement to form a high resolution full color LED having high density and excellent light mixing effect, thereby reducing the use space and reducing the production cost.

The operating principle of a full color light emitting diode (LED) including a drive mechanism of the present invention is as follows. First, the operating power is input to Vcc and then transferred to the integrated circuit board, which controls the operating state of the LED chip of red light (R), green light (G) and blue light (B), and ballast resistors are operated. Accurately controls the current of the power supply to secure the light color generated when mixing light waves, protects the LED chip, and after the CLKI and SDI control the signal transmission to the integrated circuit board, the driving device in the integrated circuit board is RGB 3 chips Various drop control is generated at the same time, mixed with different light colors, and the operating power is transmitted through Gnd, and the control signal is transmitted to the next full color LED through CLKO and SDI.

In the packaging structure of the full-color LED including the driving device shown in this embodiment (see FIG. 3A), the full-color LED has a power input terminal (Vcc), a power output terminal (Gnd), a clock data input terminal (CLKI), and a clock data output terminal ( CLKO), serial data input (SDI), and serial data output (SDO). The packaging structure in the frame 100 is an integrated circuit board 30, three stability resistors 20a to 20c, a red light chip 11, a green light chip 12, and a blue light chip, respectively fixed on the mounting portion 101. (13), the first electrode and the second electrode are separated and provided on the chip of the RGB three kinds of light colors.

The power input terminal Vcc extends into the full-color LED 10 to form a rectangular expansion portion 102, and three stability resistors 20a to 20c are attached to the expansion portion 102. Is a double-sided conductive chip, and the bottom surface of the ballast resistors 20a to 20c is electrically connected to the power input terminal Vcc directly after attachment and fixing, and the top surface of the ballast resistors 20a to 20c is placed on the first electrode of the three RGB chips. Metal wire bonding.

On the other hand, the second electrode of the RGB three chip is wire bonded to the control point of the integrated circuit board 30, the integrated circuit board 30 is attached to the mounting portion 101, Vcc, Gnd, CLKI, CLKO, SDI, and The six pins of the SDO are wire bonded, and finally, the light mixing bond 103, which is a light transmissive material, is injected to complete the packaging (see FIG. 3B).

The present invention may have another embodiment within the scope of the present invention (see FIG. 4A). A feature of the full-color LED packaging structure according to this embodiment is that Vcc extends into the frame 100 to form a rectangular flat extension 102 on the mounting portion 101, and the integrated circuit board 30 is an extension portion 102. It is directly attached onto the wire and bonded with six pins of Vcc, Gnd, CLKI, CLKO, SDI, and SDO.

In an embodiment, the red light chip 11, the green light chip 12, and the blue light chip 13 are fixed above the control point of the integrated circuit board 30 in an eutectic or attachment manner, and the second electrode is connected to the control point. Electrically connected, ballast resistors 20a-20c are optionally attached over extension 102 to be electrically connected directly to Vcc, and top of ballast resistors 20a-20c are first electrodes of RGB tricolor chips. Wire-bonded to, and immediately after completion of the connection, the light mixing bond 103 is injected to complete the packaging (see FIG. 4B for the laminated structure after completion). In this embodiment, the number of wire bondings is relatively reduced in comparison with the first embodiment, and at the same time, the RGB chips are fixed to the integrated circuit board so that the light mixing interval is more dense and the light color is also complete.

In addition to the above embodiment, the present invention has another embodiment (see FIG. 5A). A feature of the packaging structure according to this embodiment is that the integrated circuit board 30 is directly attached onto the extension 102 and wire bonded with six pins of Vcc, Gnd, CLKI, CLKO, SDI, and SDO.

In order to prevent high heat from affecting the integrated circuit board 30 when the LED chip emits light, a heat insulating layer 32 is attached to the integrated circuit board 30, and the heat insulating layer 32 uses a heat insulating material such as glass or ceramic. Isolate the heat from the LED chip. On the other hand, the heat transfer layer 31 is attached to the heat insulating layer 32, is connected to each other with the mounting portion 101 to radiate the high heat generated in the chip out of the LED, the red light chip 11, green light chip 12, and blue light chip 13 is attached and fixed on the heat transfer layer 31, and the first electrode is wire-bonded with the extension 102 to be electrically connected.

The ballast resistors 20a to 20c are attached to the control terminal of the integrated circuit board 30, and are electrically connected to the control terminal, and the upper part of the ballast resistors 20a to 20c are metal wire bonded to the second electrode of the RGB three chips. After the interconnection with each other, the photomixing bond 30 is injected to complete the packaging (see FIG. 5B for a lamination method). Such a third embodiment has the advantage of further reducing the size of the LED, and at the same time can be expected more excellent light mixing effect by approaching the corresponding positions of the three RGB chips even more.

Within the scope not departing from the scope of the present invention, the following embodiments are also possible when matching the operating power supply of a constant current to the power supply input (Vcc) (see Figure 6a). This embodiment has a full color LED 10 packaging structure of the drive device. The full color LED 10 includes 6 inputs such as a power input terminal (Vcc), a power output terminal (Gnd), a clock data input terminal (CLKI), a clock data output terminal (CLKO), a serial data input terminal (SDI), and a serial data output terminal (SDO). Includes dog pins. The internal packaging structure includes the integrated circuit board 30, the red light (R) LED chip 11, the green light (G) LED chip 12, and the blue light (B) LED chip, all of which are fixed on the mounting portion 102. (13), and the first electrode and the second electrode are separated and installed on the LED chips of three types of red, green and blue colors.

The power input terminal Gnd extends into the full color LED 10 packaging structure to form a rectangular extension 102, and the blue light (B) LED chip 13 and the red light (R) LED chip in the extension 102. (11), and the first electrode of the green light (G) LED chip 12 is metal wire bonded, while the red light (R) LED chip 11, the green light (G) LED chip 12, and the blue light (B) The second electrode of the LED chip 13 is wire bonded to the control point of the integrated circuit board 30, the integrated circuit board 30 is attached to the expansion unit 102, the power input terminal (Vcc), the power output terminal (Gnd) ), Wire-bonded with a total of six pins of the clock data input terminal CLKI, the clock data output terminal CLKO, the serial data input terminal SDI, and the serial data output terminal SDO. Inject to complete packaging (see FIG. 6B). 6B is a side view of a fourth embodiment with a packaging structure of a full color LED having a drive device of the present invention.

There is another embodiment for more stable control of the operating power supply (see FIG. 7A). In the packaging structure according to the present embodiment, the full color LED 10 has a power input terminal Vcc, a power output terminal Gnd, a clock data input terminal CLKI, a clock data output terminal CLKO, a serial data input terminal SDI, and It includes six pins, including a serial data output (SDO). The packaging structure inside the frame 100 includes the integrated circuit board 30, the red light (R) chip 11, the green light (G) chip 12, and the blue light (B) chip, which are fixed on the expansion part 102. (13), and the first electrode and the second electrode are separated and installed on the LED chips of three kinds of red, blue and green colors.

The power input terminal Gnd extends into the full color LED 10 packaging structure to form a rectangular extension 102, and the blue light (B) LED chip 13 and the red light (R) LED chip in the extension 102. (11), and the first electrode of the green light (G) LED chip 12 is metal wire bonded, while the red light (R) LED chip 11, the green light (G) LED chip 12, and the blue light (B) The second electrode of the LED chip 13 is wire-bonded to the control point of the integrated circuit board 30 , the integrated circuit board 30 is attached to the expansion unit 102 is installed to the power input terminal (Vcc), power output terminal (Gnd) (Through the expansion unit 104), a total of six pins are wire-bonded with the clock data input terminal CLKI, the clock data output terminal CLKO, the serial data input terminal SDI, and the serial data SDO.

The ballast resistor 20 is installed on the upper part of the expansion part 102. The ballast resistor 20 is a double-sided conductive chip. The bottom surface is attached to the expansion part 102 and fixed thereto, and then passes through the expansion part 102 to supply a power output terminal (Gnd). Wire-bonded) to be electrically connected, and the other end is wire-bonded to the current regulation point of the integrated circuit board 30. This stabilizer 20 is used to more accurately control the operating power supply within a fixed range, and further serves to protect each chip. Finally, the light mixing bond 103, which is a light transmissive material, is filled to complete packaging (see FIG. 7B for lamination).

1 is a packaging structure diagram of a conventional full color light emitting diode (LED);

2 is a structural diagram of a conventional full color light emitting diode (LED);

3A and 3B show a first embodiment of a packaging structure according to the present invention;

4A and 4B show a second embodiment of a packaging structure according to the present invention;

5A and 5B show a third embodiment of a packaging structure according to the present invention;

6A and 6B show a fourth embodiment of a packaging structure according to the present invention; And

7A and 7B illustrate a fifth embodiment of a packaging structure according to the present invention.

DESCRIPTION OF THE REFERENCE NUMERALS

10. Full Color Light Emitting Diode (LED)

11. Red light chip

12. Green light chip

13. Blue light chip

20a-20c. Ballast resistors

21. Drive Unit

30. Integrated circuit board

31. Heat transfer layer

32. Insulation layer

40. Soft PCB

100. Frame

101. Mounting part

102. Extension

103. Photomix Bond

CLKI. Clock data input

CLKO. Clock data output

SDI. Serial data input terminal

SDO. Serial data output

Vcc. Power input

Gnd. Power output

Claims (5)

In the packaging structure of a full color light emitting diode (LED) having a drive mechanism, the LED is: A power input terminal, a power output terminal, a clock data input terminal, a clock data output terminal, a serial data input terminal, and a serial data output terminal having an expansion unit; A mounting portion having a storage space for storing a red light chip, a green light chip, and a blue light chip each having a first electrode and a second electrode separated therefrom; A first ballast resistor attached to an extension electrically connected to the first electrode of the blue light chip; A second ballast resistor attached to an extension part electrically connected to the first electrode of the red light chip; A third ballast resistor attached to an extension electrically connected to the first electrode of the green light chip; And A packaging structure of a full color light emitting diode (LED) having a driving device attached to the mounting portion and including an integrated circuit board connected to the red light chip, the green light chip, and the second electrode of the blue light chip. In the packaging structure of a full color light emitting diode (LED) having a driving device, the full color light emitting diode (LED) is: A power input stage, a power output stage, a clock data input stage, a clock data output stage, a serial data input stage, and a serial data output stage further extended into the full color LED to form an extension; An integrated circuit board attached and fixed to the extension part and electrically connected to a second electrode of the red light chip, the green light chip, and the blue light chip; The red light chip, the green light chip, and the blue light chip are attached on the integrated circuit board, and the first electrode and the second electrode are separated and installed on the three light color chips of the red light chip, the green light chip, and the blue light chip. A first ballast resistor attached to the extension part and electrically connected to the extension part and a first electrode of the blue light chip; A second stability resistor attached to the extension part and electrically connected to the extension part and the first electrode of the red light chip; And A packaging structure of a full color light emitting diode (LED) having a driving device attached to the extension and including at least a third ballast resistor electrically connected to the extension and the first electrode of the green light chip. In the packaging structure of a full color light emitting diode (LED) having a driving device, the full color light emitting diode (LED) is: A power input stage, a power output stage, a clock data input stage, a clock data output stage, a serial data input stage, and a serial data output stage that are further extended into the full color LED to form an extension; An integrated circuit board attached and fixed to the extension portion; The integrated circuit board includes: a heat insulation layer attached thereto; A heat transfer layer attached to the heat insulation layer; And a red light chip, a green light chip, and a blue light chip attached to the heat transfer layer, wherein the three light color chips of the red light chip, the green light chip, and the blue light chip are provided by separating the first electrode and the second electrode. The first electrode and the power input terminal of the red light chip, the green light chip, and the blue light chip are electrically connected to each other; A first ballast resistor attached to the integrated circuit board and electrically connected to the integrated circuit board and a second electrode of the blue light chip; A second ballast resistor attached to the integrated circuit board and electrically connected to the integrated circuit board and a second electrode of the red light chip; And And a drive device attached to the integrated circuit board and including at least a third ballast resistor electrically connected to the integrated circuit board and a second electrode of the green light chip. In the improvement of the packaging structure of the full color light emitting diode (LED) of the integrated driving device, the full color light emitting diode (LED) has a red light (R) chip and a green light (G) chip each having a first electrode and a second electrode separated therefrom. And a blue light (B) chip, wherein the light emitting diode is: The red light (R) chip, the green light (G) chip, and the blue light (B) chip are attached and are connected to the first electrode of the red light (R) chip, the green light (G) chip, and the blue light (B) chip by a metal wire. A power input stage, a power output stage, a clock data input stage, a clock data output stage, a serial data input stage, and a serial data output stage having an expansion unit; And An integrated circuit board attached to the extension part and connected to the second electrode of the red light (R) chip, the green light (G) chip, and the blue light (B) chip with the metal wire; The integrated circuit board receives operating power having a constant current from the power input terminal, receives control signals from the clock data input terminal and the serial data input terminal, and then the red light (R) chip, green light (G) chip, and blue light (B). After controlling the chip, the operating power is again passed through the power output terminal, and the control signal is transmitted through the clock data output terminal and the serial data output terminal. ) Packaging structure improvements. In the improvement of the packaging structure of the full color light emitting diode (LED) of the integrated driving device, the full color light emitting diode (LED) has a red light (R) chip and a green light (G) chip each having a first electrode and a second electrode separated therefrom. And a blue light (B) chip, wherein the light emitting diode is: The red light (R) chip, the green light (G) chip, and the blue light (B) chip are attached and are connected to the first electrode of the red light (R) chip, the green light (G) chip, and the blue light (B) chip by a metal wire. A power input stage, a power output stage, a clock data input stage, a clock data output stage, a serial data input stage, and a serial data output stage having an expansion unit; An integrated circuit board attached to the extension part and connected to the second electrode of the red light (R) chip, the green light (G) chip, and the blue light (B) chip with the metal wire; And The integrated circuit board receives operating power having a constant current from the power input terminal, receives control signals from the clock data input terminal and the serial data input terminal, and then the red light (R) chip, green light (G) chip, and blue light (B). After controlling the chip, the operating power is again passed through the power output terminal, and the control signal is passed through the clock data output terminal and the serial data output terminal. Improved packaging structure of a full-color light emitting diode (LED) of the integrated drive device further comprises a stability resistor installed in the expansion portion and connected to the integrated circuit board by the metal wire, and used to control the operating power supply of the current. .

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