201013978 六、發明說明： 【發明所屬之技術領域】 - 本發明係有關於一種發光二極體模組，且特別係有關於一 種以交流電驅動之交流電發光二極體模組。 ' 【先前技術】 發光二極體（Light Emitting Diode，LED )係一種固離半 導體發光元件，主要利用帶負電之電子與帶正電之電洞相^結 合並釋放光子而發光工作。發光二極體具有發光效率高、體積 ® 小、哥命長、污染低等特性’於照明、背光及顯示等領域且有 廣闊之應用前景。 依據交流電發光二極體晶片不同電流之驅動方式，發光二 極體可分為直流發光二極體與交流電發光二極體模組。 其中直流電發光二極體之交流電發光二極體晶片需通過 直流電點亮，使用時，其需增設一外加電路，例如電流轉換器 (Inverter)，以將日常電力環境下之交流電轉換為直流電使 用。然而，該外加電路會增加製造成本、佔用空間，從而使直 〇 流電發光二極體體積難以縮小，且該外加電路產生之熱量還會201013978 VI. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode module, and in particular to an AC light-emitting diode module driven by an alternating current. [Prior Art] A Light Emitting Diode (LED) is a solid-emitting semiconductor light-emitting device that uses a negatively charged electron to combine with a positively charged hole to emit a photon to emit light. Light-emitting diodes have high luminous efficiency, small size, small length, low pollution, etc., and have broad application prospects in the fields of illumination, backlight and display. According to the different current driving modes of the AC light emitting diode chip, the light emitting diode can be divided into a DC light emitting diode and an AC light emitting diode module. The AC LED chip of the DC LED needs to be lit by DC. In use, an additional circuit, such as a current converter, is needed to convert the AC power in daily power environment to DC power. However, the external circuit increases the manufacturing cost and the space occupied, so that the volume of the direct current galvanic diode is difficult to be reduced, and the heat generated by the external circuit is also
增加直SlL電發光一極體之散熱負荷，進而影響直流電發光二極 體之使用壽命。 X 父流電發光二極體模組係指可直接插接於交流電壓使用 之發光一極體。交流電發光二極體模組無需增設電流轉換器等 之外加電路便可直接使用，並且交流電發光二極體模組還具有 低電流操作之特性。相較於直流電發光二極體，交流電發光二 極體模組具有體積小、易於降低成本且壽命較易延長等優點。 近年來交流電發光二極體模組之應用與研發已越來越受到關 注。 3 201013978 然而，習知技術之交流電發光二極體模組之散熱性能一 般，當交流電發光二極體晶片產生之熱量較多時，其往往難以 '將熱量及時、快速地散發出去，因此容易使交流電發光二極體 - 模組之使用壽命及可靠度受影響。 【發明内容】 有鑑於此，有必要提供一種散熱性能與絕緣性較佳之交流 電發光二極體模組。 一種交流電發光二極體模組，其包括交流電發光二極體晶 ❹片、第一導熱板及陶瓷基座，其中交流電發光二極體晶片係以 交流電驅動發光’第一導熱板位於陶瓷基座上，交流電發光二 極體晶片位於第一導熱板上。 進一步交流電發光二極體模組還包括導熱柱，導熱柱一端 與第一導熱板相連’相對之另一端伸入陶瓷基座内部。 上述交流電發光二極體模組，由於陶瓷基座具有優良之散 熱性此，因此谷易使父流電發光二極體晶片產生的熱量通過第 V熱板傳給陶竟基座而快速散發。進一步，由於交流電發光 二極體模組還包括導熱柱，導熱柱具有較佳的熱傳導性能，因 © 此還可彌補陶瓷基座的熱傳導性能之不足，使交流電發光二極 體晶片產生的熱量傳遞至陶瓷基座的速度加快，從而進一步提 升父流電發光二極體模組之散熱性能。 ^為讓本發明之上述和其他目的、特徵和優點能更明顯易 懂，下文特舉實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 ^請參閱圖1，所示為本發明實施例一之交流電發光二極體 模組10，其包括一交流電發光二極體晶片12、一第一導熱板 14及陶竟基座16。第一導熱板14位於陶究基座π上，交 201013978 流電發光二極體晶片12位於第一導熱板14上。其中第一 板14係由導熱性較佳之材質製成，例如金屬材^ ;陶瓷美^ 16係由散熱性能較佳之陶瓷材料製成，例如氧化鋁、二 或碳化石夕。 孔化铭Increasing the heat dissipation load of the direct S1L electroluminescence one pole body, thereby affecting the service life of the direct current LED. The X parent current LED module refers to a light-emitting body that can be directly plugged into an AC voltage. The AC light-emitting diode module can be directly used without adding a current converter, etc., and the AC LED module has the characteristics of low current operation. Compared with the DC light-emitting diode, the AC light-emitting diode module has the advantages of small size, easy cost reduction, and prolonged life. In recent years, the application and development of AC light-emitting diode modules have received increasing attention. 3 201013978 However, the conventional technology of the AC light-emitting diode module has a general heat dissipation performance. When the AC light-emitting diode chip generates more heat, it is often difficult to 'discharge the heat in a timely and rapid manner, so it is easy to make AC Light Emitting Diode - The service life and reliability of the module are affected. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide an AC LED module with better heat dissipation performance and insulation. An alternating current illuminating diode module comprising an alternating current illuminating diode chip, a first heat conducting plate and a ceramic pedestal, wherein the alternating current illuminating diode chip is driven by an alternating current to drive the first heat conducting plate on the ceramic pedestal The AC LED chip is located on the first heat conducting plate. Further, the alternating current illuminating diode module further comprises a heat conducting column, one end of the heat conducting column is connected to the first heat conducting plate, and the other end of the heat conducting column extends into the interior of the ceramic base. In the above-mentioned alternating current illuminating diode module, since the ceramic pedestal has excellent heat dissipation property, the heat generated by the parent current illuminating diode chip is transmitted to the ceramic pedestal through the Vth hot plate and is quickly dissipated. Further, since the AC light-emitting diode module further includes a heat-conducting column, the heat-conducting column has better heat conduction performance, and the heat conduction performance of the ceramic base can be compensated for, thereby making the heat transfer of the AC light-emitting diode chip. The speed to the ceramic base is increased, thereby further improving the heat dissipation performance of the parent current illuminating diode module. The above and other objects, features, and advantages of the present invention will become more apparent from the understanding of the appended claims. [Embodiment] Please refer to FIG. 1 , which shows an AC LED module 10 according to a first embodiment of the present invention, which includes an AC LED chip 12 , a first heat conducting plate 14 , and a ceramic base . 16. The first heat conducting plate 14 is located on the ceramic base π, and the 201013978 galvanic diode chip 12 is located on the first heat conducting plate 14. The first plate 14 is made of a material having better thermal conductivity, such as a metal material, and the ceramic film 16 is made of a ceramic material having a better heat dissipation property, such as alumina, carbon or carbon stone. Kong Huaming
具體於本實施例中，交流電發光二極體模組1〇還包括 熱柱18。導熱柱18與第一導熱板14以一體成型方式形等 導熱柱1S與第-導熱板Μ相似，係採用具有較佳熱傳導性能 之材質製成，例如金屬，具體如鋁或銅；為使交流電發光二: 體模組10具有較低之成本，以為鋁為較佳之選擇。可以理解， 導熱柱18與第一導熱板14之材質可以相同，亦可不同，當然 為使導熱柱18與第一導熱板Μ之間容易一體成型，採 ^ 之材質為較佳之選擇。陶究基座16包括底面164、與底4面： 對之頂面166及連接孔162。第一導熱板14位於頂面ι66上。 連接孔162從頂面166朝陶瓷基座16内部延伸。導熱柱18與 第一導熱板14相對之另一端與連接孔162相配合，亦即導熱 柱18之部分藉由與連接孔162相配合而伸入到陶竞基座π之 内部。 使用時，由於陶瓷基座16具有優良的散熱性能，因此容 易使交流電發光二極體晶片12產生的熱量通過第一導熱板14 快速傳遞給陶瓷基座16而快速散發；例如陶瓷基座16具有多 孔隙結構，當陶瓷基座16位於氣體環境中時，陶瓷基座16外 部之氣體即可經由陶瓷基座16之孔隙進入之陶瓷基座16内 部，並藉由熱對流作用將陶瓷基座16内部之熱量帶出。如此 一來，父流電發光二極體晶片12產生之熱量藉由第一導熱板 Η快速傳遞至陶瓷基座16後，極易由上述之熱對流作用將熱 量散發到交流電發光二極體模組10外，從而提升交流電發光 201013978 二極體模組10之散熱性能’進而提高交流電發光二極體模組 10之使用壽命及可靠度。進一步，由於交流電發光二極體模 組10還包括導熱柱，導熱柱18具有較佳之熱傳導性能， 使交流電發光二極體晶片12產生的熱量傳遞至陶瓷基座16之 面積增加，使熱量傳遞速度加快，從而進一步提升交流電發光 二極體模組1〇之散熱性能。 請參閱圖2 ’所示為本發明實施例二之交流電發光二極體 模組20。交流電發光二極體模組20與交流電發光二極體模組 10相似’包括交流電發光二極體晶片22、第一導熱板24、陶 ® 瓷基座26及導熱枉28。其不同點在於：導熱柱28與第一導 熱板24之間係採用焊接相互固定連接。 請參閱圖3 ’所示為本發明實施例三之交流電發光二極體 模組30。交流電發光二極體模組30與交流電發光二極體模組 10相似’包括交流電發光二極體晶片32、第一導熱板34、陶 瓷基座36及導熱柱38。其不同點在於：導熱柱38與第一導 熱板34之間係採用螺絲35相互固定連接。 請參閱圖4 ’所示為本發明實施例四之交流電發光二極體 © 模組40。交流電發光二極體模組40與交流電發光二極體模組 10相似’包括交流電發光二極體晶片42、第一導熱板44、陶 瓷基座46及導熱柱48 ;陶瓷基座46具有連接孔462。其不同 點在於：導熱柱48與連接孔462孔壁之間填充有散熱膏49。 由於導熱柱48與連接孔462孔壁之間填充有散熱膏49，因此 還可進一步排除導熱柱48與連接孔462孔壁之間空隙内之空 氣’從而降低導熱柱48與陶瓷基座46之間之熱阻，進而提升 交流電發光二極體模組40之散熱性能。 請參閱圖5 ’所示為本發明實施例五之交流電發光二極體 201013978 模組50。交流電發光二極體模組5〇與交流電發光二極體模組 10相似，包括交流電發光二極體晶片52、第一導熱板54、陶 兗基座56及導熱柱58’陶瓷基座56包括底面564、與底面相 對之頂面566及連接孔562。其不同點在於：連接孔562為階 梯形通孔，其貫穿底面564與頂面566。連接孔562包括第一 孔段561與第二孔段563 ’第二孔段563位於底面564側，且 其孔徑大於第一孔段561。裝配時，導熱柱58可從底面564 側之第二孔段563裝入連接孔562再與第一導熱板54藉由螺 ❹絲55相互連接固定。由於導熱柱58係從底面564侧的第二孔 段563裝入連接孔562，因此導熱柱58可在交流電發光二極 體晶片52、第一導熱板54及陶瓷基座56均成型後再安裝， 以便於交流電發光二極體模組5〇之製備。並且對應於連接孔 562之形狀，導熱柱58之直徑較大端位於遠離第一導熱板54 之底面564侧，使得導熱柱58易於將更多的熱量快速傳遞到 陶瓷基座56之底面564侧，以充分利用陶瓷基座56之散熱作 用’從而進一步提高交流電發光二極體模組5〇之散熱性能。 可以理解’於導熱柱58與連接孔562孔壁之間亦可填充有散 ❹熱膏（圖中未顯示）。 請參閱圖6，所示為本發明實施例六之交流電發光二極體 模組60。交流電發光二極體模組60與交流電發光二極體模組 10相似，包括交流電發光二極體晶片62、第一導熱板64、陶 曼基座66及導熱柱68 ;陶竟基座66具有連接孔662。其不同 點在於：陶瓷基座66之連接孔662以及導熱柱68為多數個。 請參閱圖7，所示為本發明實施例七之交流電發光二極體 模組70。交流電發光二極體模組70與交流電發光二極體模組 10相似，包括交流電發光二極體晶片72、第一導熱板74、陶 201013978 瓷基座76及導熱柱78。其不同點在於：陶曼基座％係 射出成型方式形成於第-導熱板74上且包裹導熱柱78，並： 於與第-導熱板74上相對交流電發光二極體晶片72 — .端；並且導熱柱％被陶兗基座76包裹之部分可具有一擴 782。擴散部782用於擴大導熱柱78 _曼基座％内部與^ 竟基座76之接觸面積，其可呈弯折狀。由於陶£基座％藉由 射出成型來包裹導熱柱78 ’因此可使導熱柱78與陶瓷基座76 接觸緊密，避免導熱柱78與陶瓷基座76之間形成空氣層，從 而可降低導熱柱78與陶瓷基座76之間的熱阻，進而提升交流 電發光二極體模組70之散熱性能。並且，由於導熱柱78被陶 瓷基座76包裹之部分含有擴散部782，因此還可進一步加速 熱量於陶瓷基座76上之分佈，從而進一步充分利用陶瓷基座 76的散熱性能’提升交流電發光二極體模組7〇之散熱性能。 請參閱圖8’所示為本發明實施例八之交流電發光二極體 模組80 °交流電發光二極體模組80與交流電發光二極體模組 10相似’包括交流電發光二極體晶片82、第一導熱板84、陶 瓷基座86及導熱柱88。其不同點在於：交流電發光二極體模 ❹組80還包括一第二導熱板89 ;陶瓷基座86包括一頂面866、 一與頂面866相對的底面864及連接頂面866與底面864的側 面865 ;第一導熱板84位於頂面866，第二導熱板89位於底 面864;導熱柱88連接第一導熱板84與第二導熱板89。更具 體地說明’第一導熱板84與導熱柱88以一體成型方式形成’ 第二導熱板89與導熱柱88之間藉由螺絲85相互固定連接， 此僅為舉例’目的使第一導熱板84與第二導熱板89之間藉由 導熱枉88連接者均可以實施。第二導熱板89之材質可與第一 導熱板84與導熱柱88相似，例如為鋁或銅。由於具有第二導 201013978 熱板89，交流電發光二極體模組80可易於進一步提升散熱性 能。可以理解的是’第二導熱板89還可位於陶瓷基座％之側 面865 ;第一導熱板84或第二導熱板89與導熱柱88之間的 *連接方式還可變更，例如，第一導熱板84與導熱柱88藉由焊 接或螺絲相互固定連接，第二導熱板89與導熱柱88以一體成 型方式形成或藉由焊接固定連接，或第一導熱板84、第二導 熱板89及導熱柱88以一體成型方式形成。 綜上所述，在本發明之交流電發光二極體模組，由於陶瓷 ❹基座具有優良的散熱與絕緣性能，因此容易使交流電發光二極 體晶片產生的熱量通過第一導熱板傳給陶瓷基座而快速散 發。進一步，由於交流電發光二極體模組還包括導熱柱，導熱 柱具有較佳之熱傳導性能，因此還可彌補陶瓷基座之熱傳導性 能之不足’使交流電發光二極體晶片產生的熱量傳遞至陶瓷基 座之速度加快’從而進一步提升交流電發光二極體模組之散熱 與絕緣性能。 ” 富對散 之 ❹ 力，以理解，於上述交流電發光二極體模組中，當對 熱性能要求相對較低並且第一導熱板與陶竞基座相鄰表面 間具有較高之接觸面積時，導熱柱還可省略。 雖然本發明已以實施例揭露如上，然其並非用以限定本發 明，任何熟習此技藝者，在不脫離本發明之精神和範圍内，务Specifically, in the embodiment, the AC LED module 1 further includes a thermal column 18. The heat conducting column 18 and the first heat conducting plate 14 are formed in an integrally formed manner, and the heat conducting column 1S is similar to the first heat conducting plate 1S, and is made of a material having better heat conducting properties, such as metal, such as aluminum or copper; Illumination 2: The body module 10 has a lower cost, so that aluminum is the preferred choice. It can be understood that the material of the heat conducting column 18 and the first heat conducting plate 14 may be the same or different, and of course, the material of the heat conducting column 18 and the first heat conducting plate is easily integrally formed. The pedestal base 16 includes a bottom surface 164 and a bottom surface 4: a top surface 166 and a connecting hole 162. The first heat conducting plate 14 is located on the top surface ι66. The connection hole 162 extends from the top surface 166 toward the inside of the ceramic base 16. The other end of the heat conducting column 18 opposite to the first heat conducting plate 14 is engaged with the connecting hole 162, that is, a portion of the heat conducting column 18 is extended into the interior of the Tao Jing base π by cooperation with the connecting hole 162. In use, since the ceramic base 16 has excellent heat dissipation performance, heat generated by the AC LED wafer 12 is easily transmitted to the ceramic base 16 through the first heat conducting plate 14 to be quickly dissipated; for example, the ceramic base 16 has The porous structure, when the ceramic susceptor 16 is in a gaseous environment, the gas outside the ceramic susceptor 16 can enter the interior of the ceramic pedestal 16 via the pores of the ceramic pedestal 16 and the ceramic susceptor 16 is acted upon by thermal convection. The heat inside is taken out. In this way, the heat generated by the parent current illuminating diode chip 12 is quickly transferred to the ceramic susceptor 16 by the first heat conducting plate ,, and the heat is easily radiated to the alternating current illuminating diode module by the above-mentioned thermal convection. The group 10 is externally, thereby improving the heat dissipation performance of the AC illuminating 201013978 diode module 10, thereby improving the service life and reliability of the ac LED module 10. Further, since the AC LED module 10 further includes a heat conducting column, the heat conducting column 18 has better heat conduction performance, so that the heat generated by the AC LED wafer 12 is transmitted to the ceramic base 16 to increase the heat transfer speed. Speed up, thereby further improving the heat dissipation performance of the AC light-emitting diode module. Referring to FIG. 2 ′, an AC LED module 20 according to Embodiment 2 of the present invention is shown. The AC LED module 20 is similar to the AC LED module 10 and includes an AC LED chip 22, a first heat conducting plate 24, a ceramic porcelain base 26, and a thermal conductive crucible 28. The difference is that the heat conducting post 28 and the first heat conducting plate 24 are fixedly connected to each other by welding. Referring to FIG. 3 ′, an AC LED module 30 according to Embodiment 3 of the present invention is shown. The AC LED module 30 is similar to the AC LED module 10 and includes an AC LED chip 32, a first heat conducting plate 34, a ceramic base 36, and a heat conducting post 38. The difference is that the heat conducting post 38 and the first heat conducting plate 34 are fixedly connected to each other by screws 35. Referring to FIG. 4 ′, an AC LED 2012 module 40 according to Embodiment 4 of the present invention is shown. The AC LED module 40 is similar to the AC LED module 10, and includes an AC LED chip 42, a first heat conducting plate 44, a ceramic base 46, and a heat conducting column 48. The ceramic base 46 has a connecting hole. 462. The difference is that the heat-radiating paste 48 is filled between the heat-conducting column 48 and the wall of the connecting hole 462. Since the heat-radiating paste 48 is filled with the heat-dissipating paste 49 between the heat-conducting column 48 and the wall of the connecting hole 462, the air in the gap between the heat-conducting column 48 and the hole of the connecting hole 462 can be further excluded, thereby reducing the heat-conducting column 48 and the ceramic base 46. The thermal resistance between the two further enhances the heat dissipation performance of the AC LED module 40. Referring to FIG. 5 ′, an AC illuminating diode 201013978 module 50 according to Embodiment 5 of the present invention is shown. The AC LED module 5 is similar to the AC LED module 10, and includes an AC LED chip 52, a first heat conducting plate 54, a ceramic base 56, and a heat conducting column 58'. The ceramic base 56 includes The bottom surface 564, the top surface 566 opposite to the bottom surface, and the connecting hole 562. The difference is that the connecting hole 562 is a stepped through hole that penetrates the bottom surface 564 and the top surface 566. The connecting hole 562 includes a first hole segment 561 and a second hole segment 563'. The second hole segment 563 is located on the bottom surface 564 side and has a larger diameter than the first hole segment 561. When assembled, the heat conducting post 58 can be inserted into the connecting hole 562 from the second hole section 563 on the bottom surface 564 side and then fixed to the first heat conducting plate 54 by the screw 55. Since the heat conducting post 58 is inserted into the connecting hole 562 from the second hole segment 563 on the bottom surface 564 side, the heat conducting post 58 can be mounted after the AC LED chip 52, the first heat conducting plate 54, and the ceramic base 56 are molded. In order to facilitate the preparation of the alternating current LED module 5〇. And corresponding to the shape of the connecting hole 562, the larger diameter end of the heat conducting post 58 is located away from the bottom surface 564 side of the first heat conducting plate 54, so that the heat conducting post 58 can easily transfer more heat to the bottom surface 564 side of the ceramic base 56. In order to make full use of the heat dissipation effect of the ceramic pedestal 56, the heat dissipation performance of the ac LED module 5 is further improved. It can be understood that the thermal conductive paste 58 and the wall of the connecting hole 562 may also be filled with a thermal paste (not shown). Referring to FIG. 6, an AC LED module 60 according to Embodiment 6 of the present invention is shown. The AC LED module 60 is similar to the AC LED module 10, and includes an AC LED chip 62, a first heat conducting plate 64, a Tauman base 66, and a heat conducting column 68. The ceramic base 66 has a connecting hole. 662. The difference is that the plurality of connection holes 662 and the heat transfer columns 68 of the ceramic base 66 are plural. Referring to FIG. 7, an AC LED module 70 according to Embodiment 7 of the present invention is shown. The AC LED module 70 is similar to the AC LED module 10, and includes an AC LED chip 72, a first heat conducting plate 74, a ceramic 201013978 ceramic base 76, and a heat conducting column 78. The difference is that the Taman base is formed by injection molding on the first heat conducting plate 74 and encloses the heat conducting column 78, and is opposite to the first heat conducting plate 74 with respect to the alternating current light emitting diode wafer 72. The portion of the column % wrapped by the pottery base 76 may have a flare 782. The diffusing portion 782 is for expanding the contact area between the inside of the heat conducting post 78_Man base pedestal and the pedestal 76, which may be bent. Since the base pedestal encloses the heat-conducting column 78 by injection molding, the heat-conducting column 78 can be brought into close contact with the ceramic base 76, and an air layer is formed between the heat-conducting column 78 and the ceramic base 76, thereby reducing the heat-conducting column. The thermal resistance between the 78 and the ceramic pedestal 76 further enhances the heat dissipation performance of the ac LED module 70. Moreover, since the portion of the heat conducting post 78 surrounded by the ceramic base 76 contains the diffusing portion 782, the heat distribution on the ceramic base 76 can be further accelerated, thereby further utilizing the heat dissipation performance of the ceramic base 76. The heat dissipation performance of the polar body module 7〇. Referring to FIG. 8 ′, the AC light emitting diode module 80 of the eighth embodiment of the present invention is similar to the AC light emitting diode module 10 and includes an AC LED chip 82 . The first heat conducting plate 84, the ceramic base 86 and the heat conducting column 88. The difference is that the AC LED module 80 further includes a second heat conducting plate 89. The ceramic base 86 includes a top surface 866, a bottom surface 864 opposite the top surface 866, and a connecting top surface 866 and a bottom surface 864. The first heat conducting plate 84 is located on the top surface 866, the second heat conducting plate 89 is located on the bottom surface 864, and the heat conducting column 88 is connected to the first heat conducting plate 84 and the second heat conducting plate 89. More specifically, the first heat conducting plate 84 and the heat conducting column 88 are integrally formed. The second heat conducting plate 89 and the heat conducting column 88 are fixedly connected to each other by screws 85. The connection between the 84 and the second heat conducting plate 89 can be carried out by means of a heat conducting port 88. The material of the second heat conducting plate 89 may be similar to the first heat conducting plate 84 and the heat conducting column 88, such as aluminum or copper. With the second guide 201013978 hot plate 89, the AC LED module 80 can easily improve the heat dissipation performance. It can be understood that 'the second heat conducting plate 89 can also be located on the side 865 of the ceramic base 100; the * connection manner between the first heat conducting plate 84 or the second heat conducting plate 89 and the heat conducting column 88 can also be changed, for example, the first The heat conducting plate 84 and the heat conducting column 88 are fixedly connected to each other by welding or screwing, and the second heat conducting plate 89 and the heat conducting column 88 are integrally formed or fixed by welding, or the first heat conducting plate 84, the second heat conducting plate 89 and The heat transfer column 88 is formed in an integrally formed manner. In summary, in the AC LED module of the present invention, since the ceramic crucible base has excellent heat dissipation and insulation properties, it is easy to transfer heat generated by the AC LED chip to the ceramic through the first heat conduction plate. The base is quickly distributed. Further, since the AC LED module further includes a heat conducting column, the heat conducting column has better heat conduction performance, and thus can compensate for the lack of heat conduction performance of the ceramic base, and the heat generated by the AC light emitting diode chip is transferred to the ceramic base. The speed of the seat is increased to further improve the heat dissipation and insulation performance of the AC LED module. To understand, in the above-mentioned AC LED module, when the thermal performance requirement is relatively low and the first heat conducting plate has a high contact area with the adjacent surface of the Tao Jing base, The heat-conducting column may also be omitted. Although the invention has been disclosed in the above embodiments, it is not intended to limit the invention, and those skilled in the art, without departing from the spirit and scope of the invention,
St，動與潤，，因此本發明之保護範圍當視後附之ί 5月导利範園所界定者為準。 【圖式簡單說明】 刘而圖立1綠示為本發明實施例—之交流電發光二極體模組之 刮面不意圖。 圖2繪示為本發明實施例二之交流電發光二極體模組之 201013978 剖面示意圖。 圖3繪示為本發明實施例三之交流電發光二極體模組之 剖面不意圖。 • 圖4繪示為本發明實施例四之交流電發光二極體模組之 剖面示意圖。 圖5繪示為本發明實施例五之交流電發光二極體模組之 剖面示意圖。 圖6繪示為本發明實施例六之交流電發光二極體模組之 剖面示意圖。 ❹ 圖7繪示為本發明實施例七之交流電發光二極體模組之 剖面示意圖。 圖8繪示為本發明實施例八之交流電發光二極體模組之 剖面示意圖。 【主要元件符號說明】 10、20、30、40、50、60、70、80 :交流發光二極體交流電發 光二極體模組 12、22、32、42、52、62、72、82 :交流電發光二極體晶片 ❹ 14、24、34、44、54、64、74、84 :第一導熱板 89 :第二導熱板 16、26、36、46、56、66、76、86 :陶竟基座 162、462、562、662 :連接孔 561 :第一孔段 563 :與第二孔段 164、564、864 :底面 865 :側面 166、566、866 :頂面 201013978 18、28、38、48、58、68、78、88 :導熱柱 35 ' 55 ' 85 :螺絲 ' 49:散熱膏 .782 ·擴散部 ❹St, move and run, therefore, the scope of protection of the present invention is subject to the definition of the attached ί May. [Simple description of the drawing] Liu et al. 1 Green is shown as an embodiment of the invention - the scraping surface of the alternating current illuminating diode module is not intended. FIG. 2 is a cross-sectional view showing the cross section of the AC light emitting diode module of the second embodiment of the present invention. 3 is a cross-sectional view of an alternating current illuminating diode module according to a third embodiment of the present invention. Figure 4 is a cross-sectional view showing an alternating current illuminating diode module according to a fourth embodiment of the present invention. FIG. 5 is a cross-sectional view showing an alternating current illuminating diode module according to a fifth embodiment of the present invention. 6 is a cross-sectional view showing an alternating current illuminating diode module according to a sixth embodiment of the present invention. FIG. 7 is a cross-sectional view showing an alternating current illuminating diode module according to a seventh embodiment of the present invention. 8 is a cross-sectional view showing an alternating current illuminating diode module according to an eighth embodiment of the present invention. [Description of main component symbols] 10, 20, 30, 40, 50, 60, 70, 80: AC light-emitting diode AC light-emitting diode modules 12, 22, 32, 42, 52, 62, 72, 82: Alternating current LED chip ❹ 14, 24, 34, 44, 54, 64, 74, 84: first heat conducting plate 89: second heat conducting plate 16, 26, 36, 46, 56, 66, 76, 86: Tao Bases 162, 462, 562, 662: connection holes 561: first hole segments 563: and second hole segments 164, 564, 864: bottom surface 865: sides 166, 566, 866: top surface 201013978 18, 28, 38 , 48, 58, 68, 78, 88: Thermally conductive column 35 ' 55 ' 85 : Screw ' 49 : Thermal grease .782 · Diffusion ❹
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