201020449 九、發明說明： - 【發明戶斤屬之技術領域】 發明領域 本發明係有關於一種發光源封裝體。 5 【先前技冷椅】 發明背景 與傳統白熾燈發熱的發光原理不同，發光二極體(LED) 的發光原理主要是施加電流在可發光物質上，以達發光效 ❿ 果，故LED被稱為冷光源。由於LED具有高耐久性、壽命 10 長、輕巧、耗電量低等優點，且不含水銀等有害物質，因 此，也使應用LED的固態照明成為未來全球照明產業及半 導體產業的重要研發目標。 第一圖顯示一種習知的鎢絲燈泡B。該燈泡B包含一個 適於E27型插座（圖中未示）連接的金屬基座B1、與該金屬基 15 座B1結合俾可與該金屬基座B1共同形成一個容置空間B20 的透明殼體2、一個置於該容置空間B20内且固定在該基 〇 座B1上的導電接腳組B3、及一個電氣連接到該導電接腳組 B3的鎢絲線圈。當該B1與一接通電源的插座連接時，該 鎢絲線圈B4會通電發亮而達照明之目的。然而，如此之傳 20 統照明裝置非常耗電且壽命短，不符合經濟原則且不符合 目前全球的節能減碳趨勢。 有鑑於此，本案發明人遂以其從事該行業之多年經 驗，並本著精益求精之精神，積極研究改良，遂有本發明 『發光源封裝體』產生。 201020449 【明内】 發明概要 裝體。 提供—種既轉又環保的發光源、圭 5 10 15 根據本發明之—特 發光源封裝體包含：1 ^發切封I體被提供，^ 的電氣插座連接；屬基座，該基座是適於與適驾 ^ 置於該基座上俾可與該基座一起开 成一個谷置空間的透明 起死 弁錄恭风體，及一個置於該容置空間内的 -…射早該光線發射單元包含 該發光二極體晶元是可運作地置於該容置空間内:: =發光二極體晶元之六個表面發射出來的光：:: 部被導出利用。 £ 根據本發明之另—特徵，一種發光源封裂體被提供， 以發光源雜體包含：—個絲基板，該絲基板是為一 ㈣明高散«板而且射—㈣設有預定之電路軌跡的 女裝表面；-發光二極體晶S，該發光二極體晶元是安裝 於該安裝基板的絲表面上而且H第—電極和一第二 電極，該第一電極是經由導線來連接至該基板之對應的電 路軌跡·，一個具有一貫通孔的導熱管，該基板是貼附到該 導熱管以致於在該基板上的發光二極體晶元是位在該導熱 管的貫通孔内，該發光二極體晶元的第二電極是經由導線 來連接到該導熱管，·及一個形成在該導熱管之貫通孔内俾 可覆蓋該發光二極體晶元的螢光粉層。 根據本發明之再一特徵，一種發光源封裝體被提供， 20 201020449 封褒體包含:-個長形的導熱管，·及數個以覆晶 =於該導熱管之一束端部份上的發光二極體晶元。 :本發明之又再_特徵，—種發光源封裝體被提 共=發光源輯祕含：1_歧，射卜殼具有-底部和-個與該底部相對的開放頂部； 一個形成在 該外殼之内表面上的散熱層；—個形成在該散熱層上的導 熱層；—個形成在該導熱層上的反射層；—個光線發射單 參 10 兀，该先線發射單元包含―個置於形成在料殼之内表面 上之反射層上的安裝基板、—心覆晶方式絲於該基板 上的發光二極體日日日元、及-置於該外殼之外表面之用於提 供該發光二極體晶元運作電流的電源控制電路裝置。 圖式簡單說明 ㈣本發明為達上述目的、特徵所採㈣技術手段及 其功效，茲例舉較佳實施例並配合圖式說明如下： 15 帛—圖是為—個顯示—W知白熾燈泡的示意側視平面 圖； 第二圖是為-個顯示本發明之第一較佳實施例之發光 源封裝體之光線發射單元的示意部份立體圖. 第三圖是為-個顯示本發明之第—較佳實施例之發光 20源封裝體的不意部份剖視圖， 第四圖是為-個顯示本發明之第—較佳實施例之發光 源封裝體之變化例子的示意部份侧視平面圖. 第五圖是為一個顯示本發明之第一較佳實施例之發光 源封裝體之又一變化例子的示意侧視平面圖； 201020449 第六圖是為-個顯示本發明之第二較佳實施例之發光 源封裝體的示意側視平面圖； x 第七圖是為-個顯示本發明之第三較佳實施例之發光 源封裝體的示意部份立體圖； 5 帛八圖是為—個顯示本發明之第四較佳實施例之發光 源封裝體的不意側視圖； 第九圖是為示本發明之第四較佳實施例之發光 源封裝體之變化例子的示意側視平面圖；及 第十®是為-侧*在本發明巾所如之電路的示意 10 方塊圖。 一 【實施方式]j 較佳實施例之詳細說明 在後面之本發明之較佳實施例的詳細說明中，相同或 類似的元件是由相同的標號標示，而且它們的詳細描述將 15會破省略。此外，為了清楚揭示本發明的特徵，於圖式中 之元件並非按實際比例描纷。 第一圖和第二圖是為顯示本發明之第一較佳實施例之 ^光源封名體U1的不意圖，第二圖是為—個顯示在第三圖 中斤丁之I光源封裝體中所使用之光線發射單元4的示 20 意立體圖。 請參閱v 、 ‘和二圖所示，本發明之第一較佳實施例之 X 個用於與—插座（圖中未示）連接的 、屬土座1個崎發財元4、及-個設於該基座1上俾 可與該底座1 一起报士 7 、力成—個容置該光線發射單元4之容置空 201020449 間的透明殼體5。 遠底座1是依需要來被設計成適於與，例如，E27、PAR 30 PAR 38、MR16等等般之插座連接的底座丨而且具有一 個正電極接點和一個接地接點。在本實施例中，該底座工是 5以E27為例子，其之正電極接點是設於底部而負電極接點是 設於側壁。 "亥透明设體5可以由任何適合的材料製成，而且是連接 到該基座1俾可與該基座〖一起共同形成該容置空間。 β 該光線發射單元4包括一對導電電極21,22、一反射杯 10 3、及一發光二極體晶元4〇。 該對導電電極21,22是以適當的方式固定在該基座1上 而且是各具有一第一導電連接端21〇,22〇和一第二導電連 接端211,221。該導電電極21的第一導電連接端21〇是連接 到該底座1的正電極接點，而該導電電極22的第一導電連接 15端220是連接到該底座1的負電極接點。 該反射杯3是絕緣地套設在該對導電電極2丨，22上而且 © 是接近該等導電電極21，22的第二導電連接端211，221。 §亥發光二極體晶元40具有一個安裝有一第一電極w的 第一表面和一個安裝有一第二電極42的第二表面。該第一 20電極41和該t二電極42是分別與該對導電電極21，22的第 二導電連接端211，221電氣連接以致於該發光二極體晶元 40是由該對導電電極21，22支持固定。在該發光二極體晶元 40之第一表面和第二表面上是形成有一散熱薄臈43。在本 實施例中’該散熱薄膜43是由散熱係數為8〇〇至12〇〇\\711^ 201020449 的材料形成。在每個散熱薄膜43以及該發光二極體晶元40 - 的四個侧表面上是形成有一榮光粉層44。 應要注意的是，該發光二極體晶元40的如此設置能夠 使由該發光二極體晶元40之六個表面發射出來的光線得以 5 全部被導出利用’進而整體亮度得以提升。 在第三圖中所示的實施例是適用於直流電源，然而， 本發明亦適用於交流電源。請參閱第四圖所示，在本實施 例中’於該對導電電極21,22之間連接一個電容器C及在該 © 導電電極21串聯一個限流電阻r與—個二極體d即可直接 10 使用交流電源。 另一方面，如在第五圖中所示，於該由基座丨與透明殼 體5共同形成的容置空間内是可設置非導電散熱流體，例 如，像是非導電散熱油或其類似般。於該非導電散熱流體 内亦可摻雜有螢光粉。當然’任何適合的流體（包含氣體） 15是應被涵蓋在本發明的範圍之内。 ❹ 第二圖顯示本發明之第二較佳實施例的發光源封裝體 U2 °亥第一較佳實施例的發光源封裝體U2包含一個安骏 板6個發光二極體晶元40、及—個導熱管7。 心I基板6是為—個透明高散熱基板，而且具有 佈«預定之電路軌跡（圖中未示)的安裝表面6〇。有個 '«光—㈣晶㈣是安裝於該安裝基板6 面60上而且且右—铱 _ α ^衣表 -、有一弟一電極400和—第二電極4〇卜診 =極400是經由導線61來連接至該基衫之㈣的電格軌 10 201020449 在本實施例中，該導熱管7具有一貫通孔7〇。該基板6 疋貼附到該導熱管7以致於在该基板6上的發光二極體晶元 40疋位在該導熱管了的貫通孔70内。該發光二極體晶元的 第二電極4〇 1是經由導線62來連接到該導熱管7。 5 一透明螢光粉層71是形成在該導熱管7的貫通孔7〇内 俾可覆蓋該發光二極體晶元40。 第七圖顯示本發明之第三較佳實施例的發光源封裝體 U3。該發光源封裝體U3包含一導熱管7，和數個發光二極體 ® 晶元40。在本實施例中，該導熱管7,的一末端部份作用如 10 一具有五個晶元安裝表面（在圖式中僅顯示其中的三個曰曰 元安裝表面）的安裝部份。於每個晶元安裝表面上是以覆晶 方式安裝有一發光二極體晶元40。 第八圖顯示本發明之第四較佳實施例之發光源封裝體 u4。該發光源封裝體U4包含一光線發射單元和—個杯 15 殼8。 該杯型外殼8是由陶料形成而且具有一密封底部和— ^ 與該底部相對的開放頂部。應要浑意的是，該外殼8亦可以 由摻雜有鐵(Fe)粉末的陶料燒結而成。 在該杯型外殼8的内表面上，是形成有一個散熱層8〇。 2〇在本實施例中，該散熱層8〇可以是由像是鑽石薄膜般曰的材 料形成而且其之熱傳導係數為^^^^阶幻至了⑻^/如欠）。 在該散熱層80上，是形成有一個導熱層8〗。在 列中，該導熱層81可以是由像是列解碳般的材科形成而且 其之熱傳導係數為800至〗200W/mlc。 11 201020449 在及導熱層81上，是形成有一個反射層82。該反射層 82是藉電鑛或電漿塗佈手段來完成，而且可以由金屬或者 非金屬的材料形成。 應要注意的是，陶土加上Fe等等金屬或非金屬材料在 5南溫燒結後’形成合金陶变或非合金陶竞而提升反射杯的 導熱及散熱的功能。 δ亥光線發射單元包含一發光二極體晶元4〇、一安裝基 板45、及一電源控制電路裝置46。 ❹ 光二極體晶元4Q是以覆晶方式安裝於該安裝基板 1〇 45的晶元安裝表面上上。該安裝基板45是安裝於該杯型外 殼8的内表面上，位於該外殼8的底部處，而且是有與該發 光二極體晶元40之對應之焊墊（圖中未示）電氣連接之預定 的電路軌跡（圖中未示）佈置於該安裝基板45的晶元安裝表 面上。 15 該安裝基板45更具有一對延伸貫穿該外殼8之底部的 導電接腳47。該對導電接腳47的連接端是與該安裝基板45 ® 之預定的電路軌跡電氣連接，而丼之延伸貫穿該外殼8之底 部的自由端是適於與外部電源供應器的連接座連接。 該電源控制電路裝置46是置於該外殼8的外表面，位在 20該外殼8之底部的谷置空間80内。該電源控制電路裝置％包 含個AC/DC轉換電路460和一個定電流電路461，如在第十 圖中所示。 該AC/DC轉換電路460具有電氣連接到該對導電接腳 47的輸入端。該定電流電路461具有電氣連接到該AC/DC轉 12 201020449 換電路460之輪出端的輸入端，及電氣連接到該發光二極體 晶元40的輸出端。 該電源控制器亦可具有PWM功能變頻輸出，可節省能 源達20%並且降低LED發熱30%以上。 5 10 15 20 該電源控制器亦可具有過熱保護、過電流電壓保護。 由於過熱保護、過電流電壓保護對域知此項技術的人任 而5疋顯而易知，其之詳細說明於此恕不再贅述。 第九圖是為第八圖之實施例的變化例子。與在第八圖 中所示的實_不同’該反射杯的外表面是形成有數個在 徑向方向上延伸的凸。該等凸肋83是由高傳熱金屬或 陶宪加高導熱金屬燒結而成。 於该等凸肋83的表面上是更可塗佈有高散熱粉末以達 到導熱與散熱結合一起。 綜上所述，本發明之『發光源封裝體』，確能藉上述 所揭露之構造、裝置，達到預期之目的與功效，且申請前 未見於刊物亦未公祕用，符合發明專利之龍、進步 要件。 惟，上述所揭之圖式及說明，僅為本發明之實施例而 已’非為限定本發明之實施例；大凡熟悉該項技藝之人仕， 其所依本發明之特徵麟，所作之其他等效變化或修飾， 皆應涵蓋在以F本案之申請專利範圍内。 【圖式簡I說明】 第-圖是為—個顯示一習知白熾燈泡的示意側視平面 園， 13 201020449 第二圖是為一個顯示本發明之第一較佳實施例之發光 •源封裝體之光線發射單元的示意部份立體圖； 第三圖是為一個顯示本發明之第一較佳實施例之發光 源封裝體的示意部份剖視圖； 5 第四圖是為一個顯示本發明之第一較佳實施例之發光 源封裝體之變化例子的示意部份側視平面圖； 第五圖是為一個顯示本發明之第一較佳實施例之發光 源封裝體之又一變化例子的示意侧視平面圖； φ 第六圖是為一個顯示本發明之第二較佳實施例之發光 10 源封裝體的示意側視平面圖； 第七圖是為一個顯示本發明之第三較佳實施例之發光 源封裝體的示意部份立體圖； 第八圖是為一個顯示本發明之第四較佳實施例之發光 源封裝體的示意侧視圖； 15 第九圖是為一個顯示本發明之第四較佳實施例之發光 源封裝體之變化例子的示意側視平面圖；及 Φ 第十圖是為一個顯示在本發明中所使用之電路的示意 方塊圖。 【主要元件符號說明】 B 鎢絲燈泡 B4 鎢絲線圈 B1 金屬基座 U1 發光源封裝體 B20 容置空間 1 金屬基座 B2 透明殼體 4 光線發射單元 B3 導電接腳組 5 透明殼體 14 201020449201020449 IX. INSTRUCTIONS: - [Technical Field of Inventions] Field of the Invention The present invention relates to a light source package. 5 [Previous technical cold chair] The background of the invention is different from that of the traditional incandescent lamp. The principle of the light-emitting diode (LED) is mainly to apply current on the illuminable substance to achieve the luminous effect, so the LED is called It is a cold light source. LEDs have the advantages of high durability, long life, light weight, low power consumption, and no harmful substances such as mercury. Therefore, solid-state lighting using LEDs has become an important research and development target for the global lighting industry and the semiconductor industry. The first figure shows a conventional tungsten filament bulb B. The bulb B comprises a metal base B1 suitable for connection of an E27 type socket (not shown), and a metal shell 15B1 combined with the metal base B1 to form a transparent housing of the housing space B20. 2. A conductive pin set B3 disposed in the accommodating space B20 and fixed to the base pedestal B1, and a tungsten wire coil electrically connected to the conductive pin set B3. When the B1 is connected to a power-on socket, the tungsten wire coil B4 is energized to illuminate for illumination purposes. However, such a lighting device is very power-hungry and has a short life span, which is not in line with economic principles and does not meet the current global trend of energy saving and carbon reduction. In view of this, the inventor of the present invention has been actively researching and improving in the spirit of excellence in the industry for many years of experience in the industry, and has produced the "light source package" of the present invention. 201020449 【明内】 Summary of invention Mounting. Providing a light source that is both environmentally friendly and environmentally friendly, according to the present invention, the special light source package comprises: 1 ^ haircut type I body is provided, ^ electrical socket connection; is a base, the base It is suitable for being placed on the pedestal with the appropriate driving, and can be opened into a valley space together with the pedestal, and a transparent smashing wind and wind body, and one placed in the accommodating space -... The light emitting unit includes the light emitting diode wafer operatively disposed in the accommodating space:: = Light emitted from the six surfaces of the light emitting diode wafer::: is extracted and utilized. According to another feature of the present invention, a light source source split body is provided, wherein the light source source body comprises: a wire substrate which is provided for a (four) Ming Gao San « plate and shot - (four) a female track surface of the circuit trace; a light-emitting diode crystal S mounted on the surface of the wire of the mounting substrate and having an H-electrode and a second electrode, the first electrode being via a wire Connected to the corresponding circuit trace of the substrate, a heat pipe having a through hole, the substrate being attached to the heat pipe so that the light emitting diode on the substrate is located in the heat pipe In the through hole, the second electrode of the LED body is connected to the heat pipe via a wire, and a fluorescent film formed in the through hole of the heat pipe can cover the light emitting diode cell Powder layer. According to still another feature of the present invention, a light source package is provided, 20 201020449 The package body comprises: - an elongated heat pipe, and a plurality of flip chips = on one end of the heat pipe Luminescent diode crystal. The illuminating source package of the present invention is further characterized in that: the illuminating source contains: 1_disambiguation, and the ejector has a bottom portion and an open top opposite to the bottom portion; a heat dissipation layer on the inner surface of the outer casing; a heat conduction layer formed on the heat dissipation layer; a reflection layer formed on the heat conduction layer; a light emission single parameter 10 兀, the front line emission unit includes one a mounting substrate disposed on the reflective layer formed on the inner surface of the casing, a light-emitting diode on the substrate, a day-to-day yen, and a surface disposed on the outer surface of the casing A power supply control circuit device for providing an operating current of the light emitting diode. BRIEF DESCRIPTION OF THE DRAWINGS (4) The present invention is directed to the above objects and features (4) technical means and their effects, and the preferred embodiment is illustrated with the following description: 15 帛 - Figure is for a display - W knows incandescent bulb 2 is a schematic partial perspective view of a light emitting unit showing a light source package according to a first preferred embodiment of the present invention. The third figure is a display of the present invention. An unintentional partial cross-sectional view of a light source 20 source package of a preferred embodiment. The fourth figure is a schematic side plan view showing a variation of the light source package of the first preferred embodiment of the present invention. 5 is a schematic side plan view showing still another modified example of the light source package of the first preferred embodiment of the present invention; 201020449 FIG. 6 is a second preferred embodiment showing the present invention A schematic side plan view of a light source package; x is a schematic partial perspective view showing a light source package according to a third preferred embodiment of the present invention; 5 帛8 is a display Fourth invention The ninth drawing is a schematic side plan view showing a variation example of the light source package of the fourth preferred embodiment of the present invention; and the tenth is a side * A schematic block diagram of a circuit as in the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the detailed description of the preferred embodiments of the present invention, the same or similar elements are denoted by the same reference numerals, and the detailed description thereof will be omitted. . Further, in order to clearly disclose the features of the present invention, the elements in the drawings are not drawn to the actual scale. The first and second figures are not intended to show the light source seal U1 of the first preferred embodiment of the present invention, and the second figure is an I light source package shown in the third figure. A perspective view of a light emitting unit 4 used in the present invention. Referring to v, 'and the second figure, X of the first preferred embodiment of the present invention is used for connection with a socket (not shown), and is a sacred wealth of 4, and a The pedestal 1 is disposed on the pedestal 1 and can be combined with the pedestal 1 to form a transparent casing 5 between the accommodating space 201020449 of the light emitting unit 4. The remote base 1 is designed to be suitable for connection to, for example, an E27, PAR 30 PAR 38, MR16, etc. socket, and has a positive electrode contact and a ground contact as needed. In the present embodiment, the base is 5, and E27 is taken as an example. The positive electrode contact is provided at the bottom and the negative electrode contact is provided at the side wall. "Heil transparent body 5 can be made of any suitable material, and is connected to the base 1 to form the accommodating space together with the pedestal. The light emitting unit 4 includes a pair of conductive electrodes 21, 22, a reflecting cup 103, and a light emitting diode cell 4. The pair of conductive electrodes 21, 22 are fixed to the base 1 in a suitable manner and each has a first conductive connection end 21, 22 and a second conductive connection end 211, 221. The first conductive connection end 21 of the conductive electrode 21 is a positive electrode contact connected to the base 1, and the first conductive connection 15 end 220 of the conductive electrode 22 is a negative electrode contact connected to the base 1. The reflector cup 3 is insulatively sleeved on the pair of conductive electrodes 2, 22 and © is a second conductive connection end 211, 221 adjacent to the conductive electrodes 21, 22. The illuminating diode lens 40 has a first surface on which a first electrode w is mounted and a second surface on which a second electrode 42 is mounted. The first 20 electrode 41 and the t second electrode 42 are electrically connected to the second conductive connection ends 211, 221 of the pair of conductive electrodes 21, 22, respectively, such that the light emitting diode 40 is the pair of conductive electrodes 21 , 22 support fixed. A heat dissipation fin 43 is formed on the first surface and the second surface of the LED unit 40. In the present embodiment, the heat dissipating film 43 is formed of a material having a heat dissipation coefficient of 8 〇〇 to 12 〇〇 \\ 711 ^ 201020449. A luminescent powder layer 44 is formed on each of the heat dissipation film 43 and the four side surfaces of the light emitting diode 40-. It should be noted that the arrangement of the light-emitting diode cells 40 enables the light emitted from the six surfaces of the light-emitting diode wafer 40 to be fully utilized, and the overall brightness is improved. The embodiment shown in the third figure is suitable for a DC power supply, however, the present invention is also applicable to an AC power source. Referring to the fourth figure, in the embodiment, a capacitor C is connected between the pair of conductive electrodes 21, 22, and a current limiting resistor r and a diode d are connected in series with the © conductive electrode 21. Directly use AC power. On the other hand, as shown in the fifth figure, a non-conductive heat-dissipating fluid, such as a non-conductive heat-dissipating oil or the like, may be disposed in the accommodating space formed by the susceptor 丨 and the transparent casing 5, for example. . The non-conductive heat-dissipating fluid may also be doped with phosphor powder. Of course, any suitable fluid (including gas) 15 is intended to be encompassed within the scope of the invention. The second embodiment shows a light source package U2 according to a second preferred embodiment of the present invention. The light source package U2 of the first preferred embodiment includes an LED plate diode 6 and an LED chip 40, and a heat pipe 7. The core I substrate 6 is a transparent high heat dissipation substrate, and has a mounting surface 6 of a predetermined circuit trace (not shown). There is a '«光—(四) crystal (4) mounted on the surface 60 of the mounting substrate 6 and the right-铱_α^衣表-, one brother-one electrode 400, and the second electrode 4-diagnosis=pole 400 is via The wire 61 is connected to the cell rail 10 of the (4) of the base shirt. 201020449 In the embodiment, the heat pipe 7 has a through hole 7〇. The substrate 6 is attached to the heat transfer tube 7 so that the light-emitting diode wafer 40 on the substrate 6 is clamped in the through hole 70 of the heat transfer tube. The second electrode 4?1 of the light-emitting diode wafer is connected to the heat transfer tube 7 via a wire 62. A transparent phosphor layer 71 is formed in the through hole 7 of the heat transfer tube 7 so as to cover the light emitting diode 40. Fig. 7 shows a light source package U3 of a third preferred embodiment of the present invention. The light source package U3 includes a heat transfer tube 7 and a plurality of light emitting diodes ® wafers 40. In the present embodiment, an end portion of the heat transfer pipe 7, functions as a mounting portion having five wafer mounting surfaces (only three of which are shown in the drawings). A light-emitting diode cell 40 is mounted on the surface of each wafer mounting surface in a flip chip manner. Fig. 8 shows a light source package u4 according to a fourth preferred embodiment of the present invention. The light source package U4 includes a light emitting unit and a cup 15 housing 8. The cup-shaped outer casing 8 is formed of a ceramic material and has a sealed bottom and an open top opposite the bottom. It should be desirable that the outer casing 8 can also be sintered from a ceramic material doped with iron (Fe) powder. On the inner surface of the cup-shaped outer casing 8, a heat dissipation layer 8 is formed. In the present embodiment, the heat dissipation layer 8〇 may be formed of a material such as a diamond film and its thermal conductivity is ^^^^ 幻 至 ( ( 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。. On the heat dissipation layer 80, a heat conduction layer 8 is formed. In the column, the heat conducting layer 81 may be formed of a material such as carbon-deposited carbon and has a heat transfer coefficient of 800 to 200 W/mlc. 11 201020449 On the heat conducting layer 81, a reflective layer 82 is formed. The reflective layer 82 is formed by means of electrowinning or plasma coating and may be formed of a metallic or non-metallic material. It should be noted that the clay and Fe or other metal or non-metal materials form the alloy ceramic or non-alloyed ceramics after the sintering of the south temperature to enhance the heat conduction and heat dissipation of the reflector cup. The δ ray light emitting unit comprises a light emitting diode cell 4, a mounting substrate 45, and a power control circuit device 46. The photodiode transistor 4Q is mounted on the wafer mounting surface of the mounting substrate 1 to 45 in a flip chip manner. The mounting substrate 45 is mounted on the inner surface of the cup-shaped outer casing 8 at the bottom of the outer casing 8, and is electrically connected to a corresponding pad (not shown) of the light-emitting diode wafer 40. A predetermined circuit trace (not shown) is disposed on the wafer mounting surface of the mounting substrate 45. The mounting substrate 45 further has a pair of conductive pins 47 extending through the bottom of the housing 8. The connection end of the pair of conductive pins 47 is electrically connected to a predetermined circuit trace of the mounting substrate 45®, and the free end of the pair extending through the bottom of the housing 8 is adapted to be connected to a connector of an external power supply. The power control circuit unit 46 is disposed on the outer surface of the outer casing 8 in a valley 80 at the bottom of the outer casing 8. The power supply control circuit device % includes an AC/DC conversion circuit 460 and a constant current circuit 461 as shown in the tenth figure. The AC/DC converter circuit 460 has an input electrically coupled to the pair of conductive pins 47. The constant current circuit 461 has an input electrically connected to the output of the AC/DC turn 12 201020449 change circuit 460 and is electrically connected to the output of the LED die 40. The power controller can also have PWM function variable frequency output, which can save energy by 20% and reduce LED heat by more than 30%. 5 10 15 20 The power controller can also have over-temperature protection and over-current voltage protection. Since the overheat protection and overcurrent voltage protection are obvious to those skilled in the art, the detailed description thereof will not be repeated here. The ninth diagram is a variation of the embodiment of the eighth diagram. The outer surface of the reflecting cup is formed with a plurality of convexities extending in the radial direction, unlike the solid one shown in the eighth figure. The ribs 83 are formed by sintering a high heat transfer metal or a ceramic high thermal conductivity metal. On the surface of the ribs 83, a high heat dissipating powder is coated to achieve heat conduction and heat dissipation. In summary, the "light source package" of the present invention can achieve the intended purpose and effect by the above-mentioned disclosed structure and device, and is not found in the publication and is not used publicly before the application, and is in accordance with the dragon of the invention patent. Progressive requirements. The drawings and the descriptions of the present invention are merely exemplary embodiments of the present invention, and are not intended to limit the embodiments of the present invention; those skilled in the art, which are characterized by the invention, Equivalent changes or modifications shall be covered by the patent application in the F case. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic side view plane showing a conventional incandescent light bulb, 13 201020449. The second figure is a light source and source package showing the first preferred embodiment of the present invention. A schematic partial perspective view of a light emitting unit of a body; the third drawing is a schematic partial cross-sectional view showing a light source package of the first preferred embodiment of the present invention; 5 is a diagram showing the first aspect of the present invention. A side view of a schematic side view of a variation of the illumination source package of a preferred embodiment; the fifth figure is a schematic side view showing another variation of the illumination source package of the first preferred embodiment of the present invention Figure 6 is a schematic side plan view showing a light-emitting 10 source package of a second preferred embodiment of the present invention; and Figure 7 is a light-emitting view showing a third preferred embodiment of the present invention; A schematic partial perspective view of a source package; the eighth figure is a schematic side view showing a light source package of the fourth preferred embodiment of the present invention; 15 ninth is a fourth comparison showing the present invention A schematic side plan view of a variation of the light source package of the preferred embodiment; and Φ Fig. 11 is a schematic block diagram showing the circuit used in the present invention. [Main component symbol description] B Tungsten bulb B4 Tungsten coil B1 Metal base U1 Light source package B20 accommodating space 1 Metal base B2 Transparent case 4 Light emitting unit B3 Conductive pin set 5 Transparent case 14 201020449
21 導電電極 401 第二電極 22 導電電極 61 導線 3 反射杯 70 貫通孔 40 發光二極體晶元 62 導線 210 第一導電連接端 71 螢光粉層 220 第一導電連接端 U3 發光源封裝體 211 第二導電連接端 7， 導熱管 221 第二導電連接端 U4 發光源封裝體 41 第一電極 8 杯型外殼 42 第二電極 80 散熱層 43 散熱薄膜 81 導熱層 44 螢光粉層 82 反射層 C 電容器 45 安裝基板 R 限流電阻 46 電源控制電路裝置 D 二極體 47 導電接腳 U2 發光源封裝體 460 AC/DC轉換電路 6 安裝基板 461； 定電流電路 60 安裝表面 83 凸肋 7 導熱管 400 第一電極 1521 conductive electrode 401 second electrode 22 conductive electrode 61 wire 3 reflective cup 70 through hole 40 light emitting diode cell 62 wire 210 first conductive connection end 71 phosphor layer 220 first conductive connection end U3 light source package body 211 Second conductive connection end 7, heat pipe 221 second conductive connection end U4 light source package body 41 first electrode 8 cup type outer casing 42 second electrode 80 heat dissipation layer 43 heat dissipation film 81 heat conduction layer 44 phosphor layer 82 reflection layer C Capacitor 45 Mounting substrate R Current limiting resistor 46 Power control circuit device D Diode 47 Conductive pin U2 Light source package 460 AC/DC converter circuit 6 Mounting substrate 461; Constant current circuit 60 Mounting surface 83 Rib 7 Heat pipe 400 First electrode 15