TW201012205A - Image-sensing module for reducing its whole thickness and avoiding electromagnetic interference - Google Patents
Image-sensing module for reducing its whole thickness and avoiding electromagnetic interference Download PDFInfo
- Publication number
- TW201012205A TW201012205A TW97134040A TW97134040A TW201012205A TW 201012205 A TW201012205 A TW 201012205A TW 97134040 A TW97134040 A TW 97134040A TW 97134040 A TW97134040 A TW 97134040A TW 201012205 A TW201012205 A TW 201012205A
- Authority
- TW
- Taiwan
- Prior art keywords
- circuit board
- image sensing
- sensing module
- electromagnetic interference
- reducing
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000005452 bending Methods 0.000 claims abstract description 15
- 239000012790 adhesive layer Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 3
- 230000000295 complement effect Effects 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 230000002265 prevention Effects 0.000 claims description 2
- 230000000873 masking effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 9
- 210000004556 brain Anatomy 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 101001017827 Mus musculus Leucine-rich repeat flightless-interacting protein 1 Proteins 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000000700 radioactive tracer Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Landscapes
- Studio Devices (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97134040A TW201012205A (en) | 2008-09-05 | 2008-09-05 | Image-sensing module for reducing its whole thickness and avoiding electromagnetic interference |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW97134040A TW201012205A (en) | 2008-09-05 | 2008-09-05 | Image-sensing module for reducing its whole thickness and avoiding electromagnetic interference |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201012205A true TW201012205A (en) | 2010-03-16 |
| TWI392348B TWI392348B (enExample) | 2013-04-01 |
Family
ID=44828914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW97134040A TW201012205A (en) | 2008-09-05 | 2008-09-05 | Image-sensing module for reducing its whole thickness and avoiding electromagnetic interference |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201012205A (enExample) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005027041A (ja) * | 2003-07-02 | 2005-01-27 | Renesas Technology Corp | 固体撮像装置 |
| US7714931B2 (en) * | 2004-06-25 | 2010-05-11 | Flextronics International Usa, Inc. | System and method for mounting an image capture device on a flexible substrate |
| TWI262461B (en) * | 2005-04-15 | 2006-09-21 | Au Optronics Corp | Double-sided display device |
| TWI267998B (en) * | 2005-05-27 | 2006-12-01 | Advanced Semiconductor Eng | Image sensor and image sensor module |
-
2008
- 2008-09-05 TW TW97134040A patent/TW201012205A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWI392348B (enExample) | 2013-04-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8054639B2 (en) | Image-sensing module for reducing overall thickness thereof and preventing EMI | |
| CN103699881A (zh) | 指纹识别装置和移动终端 | |
| US10113243B2 (en) | Manufacturing method of casing of electronic device | |
| CN102017313A (zh) | 具有柔性互连部的电连接器 | |
| US10861643B2 (en) | Wireless charging structure and method for forming the same | |
| CN108352244A (zh) | 用于封装上电压调节器的磁性小占用面积电感器阵列模块 | |
| CN204179284U (zh) | 电连接器母头 | |
| KR20230119844A (ko) | 기판 조립체를 포함하는 전자 장치 | |
| TWI449271B (zh) | 具有連接介面的電子裝置、其電路基板以及其製造方法 | |
| TWI245464B (en) | Board-to-board connector | |
| CN101728367B (zh) | 用于降低整体厚度及防止电磁干扰的影像感测模块 | |
| TW201409854A (zh) | 彩色外觀的形成方法與導電外殼 | |
| TW201012205A (en) | Image-sensing module for reducing its whole thickness and avoiding electromagnetic interference | |
| CN106102320B (zh) | 移动终端的电路板以及移动终端 | |
| CN112449477B (zh) | 电路板的制造方法及电路板 | |
| CN106445218A (zh) | 触控板及其电路板 | |
| US20110272799A1 (en) | Ic chip and ic chip manufacturing method thereof | |
| US20110254152A1 (en) | Chip structure, chip bonding structure using the same, and manufacturing method thereof | |
| CN205883335U (zh) | 移动设备 | |
| US20210083489A1 (en) | Charging circuit and charging method | |
| CN109004756A (zh) | 无线充电系统 | |
| EP2239779A2 (en) | Flexible thin image-sensing module with anti-EMI function and flexible thin PCB module with anti-EMI function | |
| CN101877347A (zh) | 具防电磁干扰的可挠性薄型图像感测模块及电路板模块 | |
| US10455707B1 (en) | Connection pad for embedded components in PCB packaging | |
| TWI441579B (zh) | 印刷電路板 |