TW201010133A - Method to fabricate the semiproduct, product, and encapsulant of LED by photolithography process, and semiproduct structure thereof - Google Patents
Method to fabricate the semiproduct, product, and encapsulant of LED by photolithography process, and semiproduct structure thereof Download PDFInfo
- Publication number
- TW201010133A TW201010133A TW097133011A TW97133011A TW201010133A TW 201010133 A TW201010133 A TW 201010133A TW 097133011 A TW097133011 A TW 097133011A TW 97133011 A TW97133011 A TW 97133011A TW 201010133 A TW201010133 A TW 201010133A
- Authority
- TW
- Taiwan
- Prior art keywords
- light
- emitting diode
- substrate
- photoresist layer
- emitting
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 45
- 239000008393 encapsulating agent Substances 0.000 title abstract description 4
- 238000000206 photolithography Methods 0.000 title abstract 2
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 48
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 235000012431 wafers Nutrition 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 238000001459 lithography Methods 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000011265 semifinished product Substances 0.000 claims description 7
- 239000003292 glue Substances 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 4
- 238000010894 electron beam technology Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 238000005065 mining Methods 0.000 claims 1
- 238000012856 packing Methods 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 239000000047 product Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 230000000717 retained effect Effects 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 241000238631 Hexapoda Species 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 210000004508 polar body Anatomy 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
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- Led Device Packages (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW097133011A TW201010133A (en) | 2008-08-28 | 2008-08-28 | Method to fabricate the semiproduct, product, and encapsulant of LED by photolithography process, and semiproduct structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW097133011A TW201010133A (en) | 2008-08-28 | 2008-08-28 | Method to fabricate the semiproduct, product, and encapsulant of LED by photolithography process, and semiproduct structure thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201010133A true TW201010133A (en) | 2010-03-01 |
| TWI472052B TWI472052B (cg-RX-API-DMAC7.html) | 2015-02-01 |
Family
ID=44828074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097133011A TW201010133A (en) | 2008-08-28 | 2008-08-28 | Method to fabricate the semiproduct, product, and encapsulant of LED by photolithography process, and semiproduct structure thereof |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201010133A (cg-RX-API-DMAC7.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI419374B (zh) * | 2011-08-09 | 2013-12-11 | Univ Chang Gung | Production Method of Wafer Level Light Emitting Diode |
| TWI462327B (zh) * | 2012-02-06 | 2014-11-21 | Lite On Electronics Guangzhou | 定位系統 |
| CN112928193A (zh) * | 2019-12-05 | 2021-06-08 | 美科米尚技术有限公司 | 发光二极管装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6756186B2 (en) * | 2002-03-22 | 2004-06-29 | Lumileds Lighting U.S., Llc | Producing self-aligned and self-exposed photoresist patterns on light emitting devices |
| TWI331415B (en) * | 2007-02-14 | 2010-10-01 | Advanced Optoelectronic Tech | Packaging structure of photoelectric device and fabricating method thereof |
| TWM332939U (en) * | 2007-09-21 | 2008-05-21 | Kingbright Electronic Co Ltd | LED with silicon gel structure |
-
2008
- 2008-08-28 TW TW097133011A patent/TW201010133A/zh not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI419374B (zh) * | 2011-08-09 | 2013-12-11 | Univ Chang Gung | Production Method of Wafer Level Light Emitting Diode |
| TWI462327B (zh) * | 2012-02-06 | 2014-11-21 | Lite On Electronics Guangzhou | 定位系統 |
| CN112928193A (zh) * | 2019-12-05 | 2021-06-08 | 美科米尚技术有限公司 | 发光二极管装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI472052B (cg-RX-API-DMAC7.html) | 2015-02-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |