201009975 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種自動轉換盤裝置，尤指一種適用於 取放封裝完成晶片之自動轉換盤裝置。 5 ❿ 10 15 ❹ 20 【先前技術】 由於不同測試機台間所使用之晶片裝載盤（IC Tray)之 規格不同，舉例而言，通常裝载盤之規格有所謂 的標準化定義，依其標準制定晶片裝載盤的長度、及寬度 或其容置槽之大小尺寸；另一種則是客制的Cust〇mer Tray 的規格。 由於其規格不一，因而於測試機台進行晶片之測試 時’必須以測試機台所能使用之裝載盤為基準，並以人工 的方式將裝載於客制Customer Tray上的待測測晶片夾置於 裝載盤上，以利機台進行測試工作。 如圖1所示，圖1係習知以手工夾取晶片之示意圖。即 是以人手9透過吸筆90將客制裝載盤91上的晶片92吸起，並 逐—放置於使用於機台裝載盤93上直到填滿為止；反之， 田日日片92皆於機台測試完畢後，亦需以人手9再次將機台裝 載盤93上之晶片92放回客制裝載盤91上。 如此’不但耗費人力、及時間，且其工作效率不高， 並可能因人為疏失造成晶片92之損壞。 【發明内容】 5 201009975 _ 本發明係關於自動轉換盤裝置，包括：一供料單元、 一集料單元、一取放裝置、及一控制器。 供料單元包括有一供料滑轨、一供料載台、及一供料 盤，供料載台滑設於供料滑軌上並可選擇式地停止於一出 5料位置、或一空盤位置，供料盤承載於供料載台上，供料 盤凹設有複數個容置槽，複數個容置槽内容置有複數個晶 集料單元包括有一集料滑軌、一集料載台、及一集料 〇 盤，集料載台滑設於集料滑軌上並可選擇式地停止於一入 10料位置、或一出盤位置，集料盤承載於集料載台上，集料 盤凹設有複數個凹槽，其中，複數個凹槽之尺寸大小均彼 此相同並且相同於上述供料盤之複數個容置槽，集料盤之 外部規格尺寸不同於供料盤。 取放裝置其選擇式地移動於位在出料位置之供料載 15 台、及位在入料位置之集料載台之間。 、控制器分別與供料單元、集料單元、及取放裝置電性 • 4接’控制器包括有—記憶體，記憶體内儲存有供料盤内 複數個容置槽的位置資料、及集料盤内複數個凹槽的位置 資料，控制器據以驅動取放裝置自供料盤上之複數個容置 20槽中取出複數個晶月、並分別放置入集料盤上之複數個凹 槽内。 、因此，藉由本發明之取放裝置即可自供料單元之供料 盤逐一取出晶片並逐-放置入集料單元之集料盤上，有利 201009975 - 料同規格之供料盤與集料盤間進行自動轉換晶片裝載盤 作業，其增進取放料工作效率、及降低晶片的損壞率。 其中，取放裝置可包括一旋轉機構，控制器可控制旋 轉機構旋轉-特定角度後，再將複數個放置入集料盤。取 5放裝置可包括複數個取放器，且複數個取放器分別包括一 真空吸嘴。供料單元可包括有一第-集盤裝置，當供料盤 為二盤時，供料載台將供料盤移至該空盤位置，再透過第 一集盤裝置將供料盤載出。此外，集料單元可包括有一第 ❹ —集盤裝置，當集料盤為滿盤時，集料載台將集料盤移至 10出盤位置，再透過第二集盤裝置將集料盤載出。 本發明之自動轉換盤裝置其可包括有另一供料單元， 另一供料單元包括有另一供料滑軌、另一供料載台、及另 一供料盤，另一供料載台滑設於另一供料滑執上並可選擇 式地停止於另一出料位置、或另一空盤位置，另一供料盤 15承載於另一供料載台上，另一供料盤凹設有複數個晶片 槽，其中，複數個晶片槽之尺寸大小均彼此相同並且相同 於上述集料盤之複數個凹槽，複數個晶片槽内容置有複數 個晶片。 其中’取放裝置可選擇式地移動於位在另一出料位置 20之另—供料载台、及位在入料位置之集料載台之間。其中， 控制器可與另一供料單元電性連接，控制器之記憶體内更 儲存有另一供料盤内複數個容置槽的位置資料，控制器更 據以驅動取放裝置自另一供料盤上之複數個晶片槽中取出 複數個晶片、並分別放置入集料盤上之複數個凹槽内。 7 201009975 另-供料單元可包括有一第三集盤裝置，當另一供料 盤為空盤時，另一供料載台將另一供料盤移至另一空盤位 ί置三集盤裝置將另一供料盤載出。自動轉換盤 裝置可包括有-另-集料單元，另一集料單元包括有另一 5集料滑軌、另-集料載台、及另一集料盤，另一集料載台 滑設於另-帛料滑軌上並可選擇式地停止於另一入料位 置、或另一出盤位置，另一集料盤承載於另一集料載台上， 另一集料盤凹設有複數個凹穴，複數個凹穴之尺寸大〇小均 彼此相同並且相同於上述供料盤之複數個容置槽。 1〇 其中，取放裝置可選擇式地移動於位在出料位置之供 料載台、及位在另一入料位置之另一集料載台之間。其中， 控制器可與另-集料單元電性連接，控制器之記憶體内更 儲存有另一集料盤内複數個凹穴的位置資料，控制器更據 以驅動取放裝置自供料盤上之複數個容置槽中取出複數個 15 晶片、並分別放置入另一集料盤之複數個凹穴内。 20 【實施方式】 請參閱圖2，其係本發明自動轉換盤裝置第一較佳實施 例之立體圖。如圖所示，本實施例為一種自動轉換盤裝置， 包括一供料單元1、一集料單元2、一取放裝置3、及一控制 器4。 " 清同時參閱圖2、及圖3，圖3係本發明自動轉換盤裝置 第一較佳實施例之一示意圖。如圖所示，供料單元i包括有 一供料滑軌11、一供料載台12、及一供料盤13，供料载台 8 201009975 12滑設於供料滑軌11上並可選擇式地停止於—出料位置 M、或-空盤位置15’供料盤13承载於供料載台12上，供 料盤13凹設有複數個容置槽⑶，其t，複數個容置槽131 5 10 15 鲁 之尺寸大小均彼此相同，複數個容置槽131内容置有複數個 晶片132。 集料單元2包括有一集料滑軌21、-集料載台22、及一 集料盤23 ’集料載台22滑設於集料滑軌21上並可選擇式地 停止於人料位置24、或-出盤位置25，集料盤23承載於 集料載台22上’集料盤23凹設有複數個凹槽231，其中，複 數個凹槽231之尺寸A小均彼此㈣並且相同於上述供料 盤13之複數個容置槽131 ’集料盤23之外部規格尺寸不同於 供料盤U ’是以集料盤23之凹槽231總數量可不等於、或可 相等於供料盤13之容置槽131的總數量。 取放裝置3其選擇式地移動於位在出料位置14之供料 載台12、及位在入料位置24之集料載台22之間。 控制器4分別與供料單元丨 '集料單元2、及取放裝置3 電性連接’控制器4包括有一記憶體41，記憶體41内儲存有 供料盤u内複數個容置槽131的位置資料、及㈣_内複 數個凹槽231的位置資料，控制器4據以驅動取放裴置3自供 料盤13上之複數個容置槽m中取出複數個晶片132、並: 別放置入集料盤23上之複數個凹槽231内，直到供料盤^呈 現空盤便可再補充一新的供料盤13繼續操作，或者是直到 集料盤23滿盤為止。 20 201009975 如圖2、及圖3所示，取放裝置3包括七個取放器31，其 並排列成一排’於本例中，每個取放器3 1有一個真空吸嘴 3 11，取放裝置3包括一旋轉機構32，控制器4控制旋轉機構 32旋轉一特定角度後’再將複數個晶片in放置入集料盤 5 23 ° 以本實施例而言，由於供料盤13之容置槽131是為6χ6 的格數，而集料盤23之凹槽231是為8x15之格數，因此，取 放裝置3母次自供料盤13之容置槽131吸取一列6個晶片 132 ’分別填充集料盤23為1〜6行的6x15個凹槽23 1的格數， 10 再以取放裝置3自供料盤13之容置槽131吸取一列ό個晶片 132，並以旋轉機構32旋轉_9〇。後分別填滿集料盤23格數為 7〜8行的2x15個凹槽231的格數。 因此，藉由本發明之取放裝置3即可自供料單元丨之供 料盤13逐一取出晶片132並逐一放置入集料單元2之集料盤 15 23上，有利於不同規格之供料盤13與集料盤23間進行自動 轉換晶片裝载盤作業，其增進取放料工作效率、及降低晶 片132的損壞率。 _ ΒΒ 請參閱圖2、及圖3,供料單元丨更包括有一第一集盤裝 置16，當供料盤13為空盤時，供料載台12將供料盤13移至 20空盤位置15，再透過第一集盤裝置16將供料盤^載出。集 =單更包括有_第二集盤裝置％’當集料盤a為滿盤 時，集料載台22將集料盤23移至出盤位置25，再透過至第 二集盤裝置26將集料盤23载出。 201009975 如圖2、4所示，圖4係本發明自動轉換盤裝置第—較佳 實施例之另一示意圖。如圖所示，另一供料單元5包括有另 一供料滑軌51、另一供料載台52、及另一供料盤53，另一 供料載台52滑設於另一供料滑執51上並可選擇式地停止於 5 另一出料位置54、或另一空盤位置55，另一供料盤53承載 於另一供料載台52上，另一供料盤53凹設有複數個晶片槽 53 1 ’其中，複數個晶片槽53 1之尺寸大小均彼此相同並且 相同於上述集料盤23之複數個凹槽231，複數個晶片槽531 g 内容置有複數個晶片532。 其中’取放裝置3更選擇式地移動於位在另一出料位置 54之另一供料載台52、及位在入料位置以之集料載台22之 間。 ° 其中，控制器4更與另一供料單元5電性連接，控制器4 之記憶體41内更儲存有另一供料盤53内複數個晶片槽531 15的位置資料，控制器4更據以驅動取放裝置3自另一供料盤 53上之複數個晶片槽531中取出複數個晶片532、並分別放 _ 置入集料盤23上之複數個凹槽231内。 如圖2、4所示，另一供料單元5更包括有一第三集盤裝 置56田另供料盤53為空盤時，另—供料載台π將另一 2〇空盤位置55上之另-供料盤53移至另_空盤位以，再透 過第三集盤裝置56將另一供料盤53載出。 請參閱圖5,其係本發明自動轉換盤裝置第二較佳實施 例之示意圖。如圖所示，另—集料單元6包括有另一集料滑 軌61、另-集料載台62、及另一集料盤^，另一集料载台 11 201009975 62滑設於另一集料滑執61上並可選擇式地停止於另一入料 位置64、或另一出盤位置65，另一集料盤63承載於另一集 料載台62上，另一集料盤63凹設有複數個凹穴631，複數個 5201009975 IX. Description of the Invention: [Technical Field] The present invention relates to an automatic conversion disk device, and more particularly to an automatic conversion disk device suitable for picking and placing packaged wafers. 5 ❿ 10 15 ❹ 20 [Prior Art] Due to the different specifications of the IC Tray used between different test machines, for example, the specifications of the loaded disk usually have a so-called standardized definition, which is based on the standard. The length and width of the wafer loading tray or the size of its receiving groove; the other is the specifications of the custom Cust〇mer Tray. Due to the different specifications, when testing the wafer on the test machine, 'the test disk that can be used by the test machine must be used as the reference, and the wafer to be tested loaded on the customer's customer Tray is manually clamped. On the loading plate, the test machine is used for the machine. As shown in FIG. 1, FIG. 1 is a schematic view of a conventional method of picking up a wafer. That is, the wafer 92 on the custom loading tray 91 is sucked up by the hand 9 through the suction pen 90, and placed on the machine loading tray 93 until it is filled up; otherwise, the Tianri Japanese film 92 is in the machine. After the test of the station is completed, the wafer 92 on the machine loading tray 93 is again returned to the custom loading tray 91 by the human hand 9. This is not only labor intensive, but also time consuming, and its work efficiency is not high, and the damage of the wafer 92 may be caused by human error. SUMMARY OF THE INVENTION 5 201009975 _ The present invention relates to an automatic conversion disk device, comprising: a feeding unit, a collecting unit, a pick-and-place device, and a controller. The feeding unit comprises a feeding slide rail, a feeding carrier, and a feeding tray. The feeding carrier is slidably disposed on the feeding rail and is selectively stopped at a 5-feed position or an empty tray. Position, the feeding tray is carried on the feeding platform, the feeding tray is concavely provided with a plurality of accommodating grooves, and the plurality of accommodating grooves are provided with a plurality of crystal aggregate units including a collecting slide rail and an aggregate loading The table and the stacking tray are arranged on the aggregate slide rail and are selectively stopped at a 10 material position or a discharge tray position, and the collecting tray is carried on the aggregate loading platform. The collecting tray is concavely provided with a plurality of grooves, wherein the plurality of grooves are equal in size and identical to the plurality of receiving grooves of the feeding tray, and the outer size of the collecting tray is different from the feeding tray . The pick-and-place device is selectively moved between the supply station at the discharge position and the aggregate carrier at the feed position. The controller and the feeding unit, the collecting unit, and the pick-and-place device are electrically connected. The controller includes a memory, and the memory stores the position information of the plurality of receiving slots in the feeding tray, and The position data of the plurality of grooves in the collecting tray, the controller drives the pick-and-place device to take out a plurality of crystals from a plurality of 20 slots in the feeding tray, and respectively put them into a plurality of concaves on the collecting tray Inside the slot. Therefore, by using the pick-and-place device of the present invention, the wafer can be taken out one by one from the feeding tray of the feeding unit and placed on the collecting tray of the collecting unit one by one, which is beneficial to 201009975 - supply tray and collecting tray of the same specification The process of automatically converting the wafer loading tray is performed, which improves the efficiency of picking and discharging, and reduces the damage rate of the wafer. Wherein, the pick-and-place device can include a rotating mechanism, and the controller can control the rotating mechanism to rotate - a certain angle, and then put a plurality of them into the collecting tray. The pick and place device may include a plurality of pick and place devices, and the plurality of pick and place devices respectively include a vacuum nozzle. The feeding unit may include a first-collector device. When the feeding tray is two trays, the feeding tray moves the feeding tray to the empty tray position, and then the feeding tray is carried out through the first collecting device. In addition, the collecting unit may include a third-collector device. When the collecting tray is full, the collecting station moves the collecting tray to the 10-out tray position, and then collects the collecting tray through the second collecting device. Loaded. The automatic transfer tray device of the present invention may include another supply unit, and the other supply unit includes another supply slide rail, another supply carrier, and another supply tray, and another supply load The table slide is set on another feed slip and optionally stops at another discharge position, or another empty tray position, and another feed tray 15 is carried on another feed stage, and the other feed The disk recess is provided with a plurality of wafer slots, wherein the plurality of wafer slots are equal in size and identical to the plurality of grooves of the collecting tray, and the plurality of wafer slots are disposed with a plurality of wafers. Wherein the pick and place device is selectively movable between the other feeding station at the other discharge position 20 and the aggregate carrier at the feed position. Wherein, the controller can be electrically connected to another feeding unit, and the memory of the controller further stores the position data of the plurality of receiving slots in the other feeding tray, and the controller drives the pick-and-place device according to another A plurality of wafers are taken from a plurality of wafer slots on a supply tray and placed in a plurality of grooves on the collecting tray. 7 201009975 The other-feed unit may include a third set device. When the other feed tray is empty, the other feed stage moves the other feed tray to another empty tray. The device carries another supply tray. The automatic transfer tray device may include a - another - aggregate unit, and the other aggregate unit includes another 5 aggregate slide, another - aggregate carrier, and another aggregate tray, and another aggregate carrier slide It is disposed on the other-skid rail and can be selectively stopped at another feeding position or another tray position, the other collecting tray is carried on another aggregate stage, and the other collecting tray is concave. A plurality of pockets are provided, and the plurality of pockets are larger in size and smaller in size and identical to the plurality of receiving slots of the feeding tray. 1) wherein the pick-and-place device is selectively movable between a supply stage positioned at the discharge position and another aggregate stage positioned at another feed position. Wherein, the controller can be electrically connected to the other-collector unit, and the memory of the controller further stores the position data of the plurality of pockets in the other collecting tray, and the controller drives the pick-and-place device self-feeding tray accordingly. A plurality of 15 wafers are taken out from the plurality of accommodating grooves and placed in a plurality of pockets of the other concentrating tray. [Embodiment] Please refer to Fig. 2, which is a perspective view showing a first preferred embodiment of the automatic transfer disk device of the present invention. As shown in the figure, the present embodiment is an automatic conversion disk device comprising a feeding unit 1, a collecting unit 2, a pick-and-place device 3, and a controller 4. " Clearly referring to Figs. 2 and 3, Fig. 3 is a schematic view showing a first preferred embodiment of the automatic transfer disk device of the present invention. As shown, the feeding unit i includes a feeding slide rail 11, a feeding stage 12, and a feeding tray 13, and the feeding stage 8 201009975 12 is slidably disposed on the feeding rail 11 and is selectable. Stopped at the discharge position M, or - the empty tray position 15', the supply tray 13 is carried on the feeding stage 12, and the feeding tray 13 is recessed with a plurality of receiving grooves (3), t, plural The sizes of the slots 131 5 10 15 are the same as each other, and the plurality of accommodating slots 131 are provided with a plurality of wafers 132. The aggregate unit 2 includes an aggregate slide 21, an aggregate stage 22, and a collecting tray 23. The aggregate stage 22 is slidably disposed on the aggregate slide 21 and is selectively stopped at the stock position. 24, or - the exit position 25, the collecting tray 23 is carried on the collecting stage 22 'the collecting tray 23 is recessed with a plurality of grooves 231, wherein the size A of the plurality of grooves 231 are small to each other (four) and The plurality of accommodating grooves 131 of the same feeding tray 13 are different from the supply tray U'. The total number of the grooves 231 of the collecting tray 23 may not be equal to or equal to The total number of receiving slots 131 of the tray 13. The pick-and-place device 3 is selectively moved between the supply stage 12 at the discharge position 14 and the aggregate stage 22 at the feed position 24. The controller 4 is electrically connected to the feeding unit 丨 'aggregate unit 2 and the pick-and-place device 3'. The controller 4 includes a memory 41. The memory 41 stores a plurality of accommodating slots 131 in the feeding tray u. The position data, and (4)_ the position data of the plurality of grooves 231, the controller 4 drives the pick-and-place device 3 to take a plurality of chips 132 from the plurality of receiving slots m on the feeding tray 13, and: It is placed in a plurality of grooves 231 on the collecting tray 23, until the feeding tray is presented with an empty tray, and a new feeding tray 13 can be replenished to continue the operation, or until the collecting tray 23 is full. 20 201009975 As shown in FIG. 2 and FIG. 3, the pick-and-place device 3 includes seven pickers 31 arranged in a row. In this example, each of the pickers 31 has a vacuum nozzle 311. The pick-and-place device 3 includes a rotating mechanism 32. The controller 4 controls the rotating mechanism 32 to rotate a specific angle and then "places a plurality of wafers into the collecting tray 5 23 °. In this embodiment, the feeding tray 13 The receiving groove 131 is a grid number of 6χ6, and the groove 231 of the collecting tray 23 is a grid number of 8×15. Therefore, the pick-and-place device 3 receives a row of 6 wafers 132 from the receiving slot 131 of the feeding tray 13. 'The number of cells of the 6x15 grooves 23 1 of the 1 to 6 rows is respectively filled in the stacking tray 23, and 10 rows of the wafers 132 are sucked from the receiving slots 131 of the feeding tray 13 by the pick-and-place device 3, and the rotating mechanism is rotated. 32 rotation _9 〇. Then, the number of cells of the 2x15 grooves 231 of the stacking tray 23 of 7 to 8 rows is filled. Therefore, by the pick-and-place device 3 of the present invention, the wafers 132 can be taken out one by one from the feeding tray 13 of the feeding unit, and placed one by one into the collecting trays 15 23 of the collecting unit 2, which is advantageous for the feeding trays 13 of different specifications. The wafer tray loading operation is automatically performed between the sump 23, which improves the efficiency of picking and discharging, and reduces the damage rate of the wafer 132. _ ΒΒ Referring to FIG. 2 and FIG. 3, the feeding unit 包括 further includes a first concentrating device 16 . When the feeding tray 13 is an empty tray, the feeding carrier 12 moves the feeding tray 13 to 20 empty trays. At position 15, the supply tray is loaded through the first hub device 16. The set=single includes the second set device %'. When the collecting tray a is full, the collecting stage 22 moves the collecting tray 23 to the exiting position 25 and then to the second collecting device 26 The collecting tray 23 is carried out. 201009975 As shown in Figures 2 and 4, Figure 4 is another schematic view of a preferred embodiment of the automatic transfer disk device of the present invention. As shown, the other supply unit 5 includes another supply slide 51, another supply stage 52, and another supply tray 53. The other supply stage 52 is slidably disposed on the other. The material slide 51 is selectively stopped at 5 another discharge position 54, or another empty tray position 55, and another supply tray 53 is carried on the other supply stage 52, and the other supply tray 53 The recesses are provided with a plurality of wafer slots 53 1 ', wherein the plurality of wafer slots 53 1 are equal in size and identical to the plurality of recesses 231 of the stack tray 23, and the plurality of wafer slots 531 g are provided with a plurality of grooves Wafer 532. Wherein the pick-and-place device 3 is more selectively moved between another feed station 52 located at another discharge position 54 and between the feed stations 22 at the feed position. The controller 4 is further electrically connected to another feeding unit 5, and the memory 41 of the controller 4 further stores the position information of the plurality of wafer slots 531 15 in the other feeding tray 53, and the controller 4 further A plurality of wafers 532 are taken from a plurality of wafer slots 531 on the other supply tray 53 by driving the pick-and-place device 3, and placed in a plurality of grooves 231 respectively placed on the collecting tray 23. As shown in FIG. 2 and FIG. 4, another feeding unit 5 further includes a third collecting device 56. When the other feeding tray 53 is an empty tray, the other feeding stage π sets the other 2 empty tray positions 55. The other supply tray 53 is moved to the other empty tray to carry the other supply tray 53 through the third hub device 56. Referring to Figure 5, there is shown a second preferred embodiment of the automatic transfer disk unit of the present invention. As shown, the other-aggregate unit 6 includes another aggregate slide 61, another-collector loading table 62, and another collecting tray ^, and another aggregate loading table 11 201009975 62 is slidably disposed on the other An aggregate slip 61 is selectively stopped at another feed position 64 or another discharge position 65, and another sump 63 is carried on another aggregate stage 62, another aggregate The disk 63 is concavely provided with a plurality of recesses 631, a plurality of 5
15 凹穴63 1之尺寸大小均彼此相同並且相同於上述供料盤13 之複數個容置槽丨31。 其中取放裝置3更選擇式地移動於位在出料位置η 之供料載台12、及位在另一入料位置64之另一集料載台以 之間。 “其中，控制器4更與另一集料單元6電性連接，控制器4 之記憶體内更儲存有另—集料盤63内複數個凹穴631的位 置資料’控制器4更據以驅動取放裝置3自供料單元i之供料 盤13上之複數個容置槽131中取出晶片132、並放置入另— 集料盤63之複數個凹穴631内。 上述實施例僅係為了方便說明而舉例而已，本發明所 主張之權利範圍自應以中請專利範圍所述為準， 於上述實施例。 民 ❿ 【圖式簡單說明】 圖1係習知以手工夾取晶片之示意圖。 20 =Γ自動轉換盤裝置第—較佳實施例之立體圖。 係本發明自動轉換盤裝置第_ ^係本發明自動轉換盤裝置第-較佳實施例之另=意 圖5係本發明自動轉換盤裝置第二較佳實施例之示意圖。 12 201009975 【主要元件符號說明】The recesses 63 1 are all of the same size and identical to the plurality of accommodating slots 31 of the feed tray 13 described above. The pick-and-place device 3 is more selectively moved between the feed stage 12 at the discharge position η and the other aggregate stage at the other feed position 64. "The controller 4 is further electrically connected to the other aggregate unit 6, and the memory of the controller 4 is further stored with the position data of the plurality of pockets 631 in the stacking tray 63. The pick-and-place device 3 is taken out from the plurality of accommodating grooves 131 on the supply tray 13 of the feeding unit i, and placed in a plurality of pockets 631 of the other collecting tray 63. The above embodiment is only for For convenience of description, the scope of the claims of the present invention is subject to the above-mentioned embodiments, which are based on the above-mentioned embodiments. [Note] FIG. 1 is a schematic diagram of conventionally grasping a wafer by hand. 20 = Γ automatic conversion disk device - a perspective view of a preferred embodiment. The automatic conversion disk device of the present invention is the first automatic embodiment of the automatic conversion disk device of the present invention. A schematic diagram of a second preferred embodiment of the disk device. 12 201009975 [Description of main component symbols]
供料單元1 供料盤13 出料位置14 集料早元2 集料盤23 出盤位置25 取放器31 控制器4 另一供料滑執5 1 晶片槽531 另一空盤位置55 另一集料滑軌61 凹穴631 人手9 晶片92 供料滑軌11 容置槽131 空盤位置15 集料滑軌21 凹槽231 第二集盤裝置26 真空吸嘴3 11 記憶體41 另一供料載台52 晶片532 第三集盤裝置56 另一集料載台62 另一入料位置64 吸筆90 機台裝載盤93 供料載台12 晶片132 第一集盤裝置16 集料載台22 入料位置24 取放裝置3 旋轉機構32 另一供料單元5 另一供料盤53 另一出料位置54 另一集料單元6 另一集料盤63 另一出盤位置65 客制裝載盤91Feeding unit 1 Feed tray 13 Discharge position 14 Aggregate early 2 Collector tray 23 Exit position 25 Picker 31 Controller 4 Another feed slip 5 1 Chip slot 531 Another empty tray position 55 Another Aggregate slide 61 pocket 631 hand 9 wafer 92 feed slide 11 accommodating slot 131 empty disk position 15 aggregate slide 21 groove 231 second hub device 26 vacuum nozzle 3 11 memory 41 another supply Feeding station 52 wafer 532 third collecting device 56 another collecting station 62 another feeding position 64 suction pen 90 machine loading tray 93 feeding station 12 wafer 132 first collecting device 16 collecting platform 22 Feeding position 24 Pick-and-place device 3 Rotating mechanism 32 Another feeding unit 5 Another feeding tray 53 Another discharging position 54 Another collecting unit 6 Another collecting tray 63 Another outlet position 65 Custom Loading tray 91
1313