TW201009512A - Exposure method, exposure apparatus and device manufacturing method - Google Patents

Abstract

An exposure apparatus which exposes a wafer with an illumination light via a reticle includes a vortex tube which generates a cool gas and a warm gas from a compressed gas injected from a compressed gas supply tube; a flow rate control valve and a Y-shaped joint which mix the cool gas and the warm gas generated from the vortex tube at a variable mixing ratio to output a temperature-controlled gas; and a gas supply duct which supplies the temperature-controlled gas to a heat source or a vicinity thereof. It is possible to perform the local temperature control or the local cooling by the simple mechanism without using any refrigerant or any cooling medium.

Description

[Technical Field] The present invention relates to an exposure technique using a temperature control technique, and performs temperature control of members of an exposure apparatus used for constituting various elements such as semiconductor elements and liquid crystal displays. Suitable for those. Further, the present invention relates to a component manufacturing technique using such an exposure technique. [Prior Art] In a lithography process such as a process of a semiconductor element (electronic component, micro component), in order to transfer a pattern formed on a reticle (or a mask, etc.) to a resist-coated crystal In the circle (or a glass plate or the like), an exposure apparatus such as a one-exposure type (still exposure type) projection exposure apparatus such as a stepper or a scanning exposure type projection exposure apparatus such as a scanning stepper is used. In the exposure apparatus, the illumination characteristics of the illumination optical system and the imaging characteristics of the projection optical system are maintained in a predetermined state, and the positional relationship between the reticle, the projection optical system, and the wafer is maintained in a predetermined relationship, and the exposure is high. Accuracy (positioning accuracy, synchronization accuracy, etc.) is exposed, and the temperature of the reticle stage and the wafer stage, and the temperature of the optical member that affects the illumination characteristics and imaging characteristics must be maintained within the target temperature range. For this reason, the illumination optical system, the reticle stage, the projection optical system, and the wafer stage of the exposure apparatus have been installed in the box-type accommodation room, and the accommodation room is controlled to be installed in a predetermined ship degree, and is supplied with dust in a downflow manner. Clean air from the filter. : Nearly, the part of the mechanism provided in the accommodating chamber is particularly required for the second-degree control accuracy, for example, the measurement of the laser interferometer for measuring the position of the stage is used to reduce the flow and/or Or the lateral flow mode is used for the local temperature control of the temperature-controlled air of the step height of 201009512 (for example, refer to Patent Document 1). [Patent Document 1] International Publication No. 2006/〇28188 [Invention] The conventional exposure apparatus 'is the same as the air supplied to the entire interior of the storage chamber in order to perform local temperature control in the storage chamber. , : • The air taken from the outside air and/or the air recovered after flowing through the storage chamber is generated by a cooling mechanism such as a refrigerant and a dust filter. However, in the future, in order to further increase the exposure accuracy and increase the number of partial temperature control portions in the storage chamber, if the cooling mechanism using the refrigerant is used for temperature control of each portion, the temperature control mechanism will be complicated. And the frequency of maintenance and repair is also high. The present invention has been made in view of the above, and an object thereof is to provide an exposure technique capable of local temperature control or cooling with a simple mechanism without using a refrigerant, and a component manufacturing technique using the exposure technique. A first aspect of the present invention provides an exposure method for illuminating a pattern with an exposure light, and exposing the object through the pattern by the exposure light, comprising: injecting a gas into the vortex tube; adjusting the generation from the vortex tube a mixture of cold air and warm air to generate a temperature controlled gas; and supplying the temperature controlled gas to or near the heat source.

A second aspect of the present invention provides an exposure method for exposing an object to an exposure light illuminating pattern by transmitting the exposure light through the pattern, comprising: injecting a gas into the vortex tube; and generating the vortex tube from the vortex tube The air-conditioning and heating heaters are the first and second cold air and the first and second heating units respectively; and the temperature information of the first air-conditioning and the first air-conditioning of the first heating is mixed, and the first air-conditioning and the first air-conditioning are controlled. a flow rate of the heating; supplying the second gas to the first temperature control region; and the target control accuracy of supplying the second gas mixed with at least a portion of the second cold air and at least a portion of the second heating to the temperature is lower than The second temperature control region of the first temperature control region. A third aspect of the present invention provides an exposure method of exposing an object to an exposure light illumination pattern by transmitting the exposure light through the pattern, comprising: generating a negative when the compressed gas is ejected through the slit portion Pressurizing a gas that increases the flow rate by inhaling the surrounding gas; and supplying the gas whose flow rate is increased to or near the heat source. According to a fourth aspect of the present invention, there is provided an exposure apparatus which emits an illumination light pattern for exposing an object through the pattern, wherein the vortex tube is provided by a compressed gas injected from a compressed gas source. a gas mixture unit that mixes the cold air generated from the vortex tube with the heating mixture at a variable mixing ratio to output a temperature-controlled gas; and a gas supply path that supplies the temperature-controlled gas to Heat source or its vicinity. A fifth aspect of the present invention provides an exposure apparatus for exposing a pattern to an exposure light, wherein the exposure light passes through the pattern to expose an object, and the method includes: a scroll tube that injects a gas into a gas source to generate cold air and a heating; The first and second separating units divide the cold air generated from the scroll into the first and second cold air and the first and second heating units, respectively, and the first and second mixing units, respectively The first cold air is mixed with the first heating unit, at least a part of the second cold air is mixed with at least a part of the second heating unit, and a temperature sensor is configured to measure the first gas output from the first mixing unit. Temperature 201009512 Information 'Control Department, based on the measurement information of the temperature sensor, controls the flow rate of the 1st v milk and the uth heating; the 1st gas supply path for supplying the 1st oxygen body to the 1st a temperature control region; and a second gas supply path for supplying the second gas output from the second mixing unit to the second temperature control region having a lower target control accuracy than the first temperature control region. A sixth aspect of the present invention provides an exposure apparatus for exposing an object to an exposure light illumination pattern by transmitting the exposure light through the pattern, comprising: an official line for guiding a compressed gas from a compressed gas source; The amplification unit includes an injection port through which the compressed gas is injected, a groove portion that communicates with the injection port, a gas suction port that is disposed adjacent to the groove portion, and a gas that flows out from the channel portion The external air suction port sucks the outlet of the external gas; and the gas supply path for supplying the gas ejected from the gas amplifying portion to the heat source or the vicinity thereof. A seventh aspect of the present invention provides a device manufacturing method comprising: an operation of forming a photosensitive layer pattern on a substrate by using the exposure method or the exposure device of the present invention; and an operation of processing a substrate on which the pattern is formed. According to the present invention, local temperature control or cooling can be performed with a simple mechanism without using a refrigerant by using a temperature-controlled gas generated from a compressed gas through a vortex tube or a gas that amplifies the compressed gas. ° As a compressed gas, since a gas such as a compressed air source provided in a general workshop can be used, it is not necessary to have a special gas compression device. [Embodiment] <First Embodiment> 201009512 Hereinafter, an example of the first embodiment of the present invention will be described with reference to Figs. 1 to 5 . In the present embodiment, the temperature is controlled by a scanning exposure type projection exposure apparatus (scanning type exposure apparatus) composed of a scanning stepper (scanner), and the present inventors apply to the present invention. Fig. 1 is a partial cross-sectional view showing the exposure apparatus 10 of the embodiment. In Fig. 1, an exposure device 10 is disposed, for example, on a floor FL of a semiconductor component manufacturing plant that is dust-free. The exposure device 10 includes a light source unit 4 for generating exposure illumination light EL (exposure light), an illumination optical system ILS for illuminating the reticle R (mask) with illumination light EL, and a absorbing and holding reticle R moving. The reticle stage RST and the projection optical system PLe for projecting the image of the reticle pattern onto the wafer W (substrate), and the exposure apparatus 1 〇, the wafer stage with the adsorption holding wafer W moving The WST includes a control system (see FIG. 2) of the main control device 2 including a computer that controls the operation of the exposure device 10, other drive mechanisms, support mechanisms, sensors, and the like, and a housing for accommodating the illumination optical system. A box-type housing chamber 2 such as an ILS, a reticle stage rst, a projection optical system PL, and a wafer stage WST. Further, the main control unit 20 is disposed on the outer side of the storage chamber 2. The components such as the illumination optical system ILS, the reticle stage RST, the projection optical system PL, and the wafer stage WST housed in the accommodating chamber 2 are collectively referred to as an exposure apparatus main body 适当. Further, the exposure apparatus 10 is provided with an overall air conditioning system for performing air conditioning in the entire interior of the storage chamber 2. The overall air conditioning system includes: a plurality of openings 2a in the upper portion of the storage chamber 2 are used to control the temperature, and the clean air (for example, dry air) through a dustproof transition device (such as a HEPA filter or a ULPA filter) is supplied to the housing in a downflow manner. The main air conditioning unit 8 in the room 2, and the main air conditioning control system 35 (see Fig. 2) that controls the operation of 201009512. For example, the air flowing through the storage chamber 2 flows through a plurality of openings (not shown) provided in the floor fl of the bottom surface of the storage chamber 2 to a pipeline (not shown) under the floor, and the air in the pipeline Returning to the gas recovery part of the main air conditioner 8, it is reused. Hereinafter, in 囷1, the z-axis parallel to the optical axis of the projection optical system PL, and the axis perpendicular to the plane of the i-plane in the plane perpendicular to the z-axis are taken in parallel with the plane of the paper of FIG. The axis is used for explanation. In the embodiment, the scanning direction of the reticle R and the wafer W during scanning exposure is parallel to the γ axis (Y direction). In addition, the direction of rotation around the χ axis, ¥ axis, and 2 axes is also called 0X, 0y, and direction. First, the light source unit 4 provided on the outer floor F1 of the storage chamber 2 is provided with a laser light source (exposure light source) for generating an ArF excimer laser (wavelength i93 nm) as illumination light EL, and directs the illumination light EIj to illumination. The light beam transmitting optical system of the optical system ils forms a beam forming optical system in which the sectional shape of the illumination light EL is formed into a predetermined shape. The emission end H of the illumination light EL of the light source unit 4 is disposed in the storage chamber 2 through the opening of the upper side of the + γ direction of the storage chamber 2. Further, as the light source for exposure, an ultraviolet pulse laser light source such as a KrF excimer laser light source (wavelength: 248 nm), a high-order harmonic light source of a YAG laser, and a solid laser (semiconductor laser, etc.) can be used. Subharmonic generating device, or mercury lamp (i line, etc.). Further, the illumination optical system ILS disposed in the upper portion of the accommodating chamber 2 is disclosed, for example, in Japanese Laid-Open Patent Publication No. 2001-313250 (corresponding to the specification of the U.S. Patent Application Publication No. 2/3,025,890), and includes an optical integrator ( Compound eye lens, rod integrator (inside reflection type integrator), diffractive optical element, etc.) 201009512 Illumination equalization optical system, reticle blind (all not shown), including a plurality of collecting lenses A plurality of optical members such as a light optical system and an optical path bending mirror. These optical members are supported within the illumination system barrel 6. The illumination optical system ILS' illuminates the illumination light with a substantially uniform illumination of y-A on the reticle r specified by the reticle. e is a slit-shaped illumination region 0 in the X direction on K, which is formed in the pattern region of the reticle R, and the image of the pattern in the illumination region is transmitted through both sides of the telecentricity and the projection magnification stone is reduced in magnification (for example, 丨/句The projection optical system PL is projected onto the wafer W coated with a resist (photosensitive material). For example, the projection optical system pL has a field of view diameter of about 30 mm. Also in the housing chamber 2 of FIG. The floor panel FL is provided with a lower frame 12 through a plurality of pedestals π, and a flat base structure 13 is fixed at a central portion of the lower frame 12, for example, three places (or four places) are passed through the base member.

° 4 supports the flat wafer base WB, and the wafer stage WST is mounted on the wafer base WB in parallel with the plane through the gas bearing, and is movable in the x direction and the Y direction and rotates in the θ Ζ direction. Further, at the upper end of the lower frame 12, the projection optical system pL is disposed at the central opening of the optical system frame 16 through the anti-vibration #15 supporting optical system frame disposed around the wafer base WB, for example, three (or four) The optical system frame w is surrounded by a projection: the optical system PL fixes the upper frame 17. Anti-vibration table " and Μ, for example. System, electromagnetic damping of air damping and voice coil motors are added. It is a dynamic anti-vibration device. The system including the anti-vibration table ", 15 and the control system (not shown) constitutes the AVIS (Active Vibration Isolation System) of the active vibration separation system 201009512. Further, a γ-axis laser interferometer 21 WY is fixed to the + Y-direction end portion of the bottom surface of the optical system frame 16, and a laser interferometer (not shown) is fixed to the +X-direction end portion of the bottom surface. The wafer interferometer 21W (see FIG. 2) configured by the interferometer respectively irradiates the reflection surface (or the movement mirror) on the side surface of the wafer stage WST with the measurement beam of the plurality of axes, for example, with reference to the side surface of the projection optical system PL. The mirror (not shown) is used as a reference, and the X direction and the γ direction position of the wafer stage Wst ❹ are measured at a plurality of points. The measured value is supplied to the wafer stage drive system 22W via the main control unit 20 of Fig. 2 . Based on these measured values, the rotation angles of the wafer stage WST in the 0X, 0y, and 0Z directions are also obtained. Also, in the optical system frame of Figure 1! 6 bottom surface, an alignment system AL for fixing an off-axis image processing method for measuring the position of the alignment mark on the wafer W, and a plurality of measurement points obliquely incident on the wafer w for optically measuring the z-direction position ( The illumination system 25a of the focus position) and the autofocus sensor (hereinafter referred to as the AF sensor) 25 of the light receiving system 25b (refer to FIG. © the image signal of the alignment system AL is processed by the signal processing system 27 of FIG. To obtain the position information of the detected mark, the position information is supplied to the main control device 20'. The control device 20 performs the wafer w according to the position information, and the detection signal of the AF sensor 25 is further processed by the signal processing system. The information of the focus position of the measurement point on the wafer W is determined to be supplied to the wafer stage drive system 22W through the main control device 20. The wafer stage drive system 2 2 w according to the wafer interferometer 2丨w The measured value and the control information from the main control device 20 control the X direction of the wafer stage WST, the position of the γ direction 11 201009512, and the speed through a driving mechanism including a linear motor 24 or the like, and control the 0Z direction. In addition, the wafer stage driving system 22W controls the z-direction position of the wafer w and the θχ direction, 0y through the z driving unit in the wafer stage WST according to the information of the focus position measured by the AF sensor. The rotation angle of the direction to focus the surface of the wafer w on the image plane of the projection optical system PL. In the wafer stage WST, an image formed by the projection optical system PL for measuring the alignment mark of the reticle R is also provided. The position of the space is measured by the system (not shown). The main control unit 2 aligns the reticle R according to the measured value of the aerial image measuring system. _ On the other hand, the upper frame 17 + 丫The illumination optical system and the illumination system lens barrel 6 of the first ILS are fixed to the upper portion of the direction. In addition, the reticle stage RST capable of moving at a constant speed in the γ direction is loaded through the air bearing on the upper surface of the upper frame 17 parallel to the XY plane. The reticle stage RST can also move in the X direction and in the 0z direction on the upper frame 17. Further, the γ-axis laser interferometer 21RYH surface is fixed at the + γ-direction end of the upper frame 17 χ direction end @定有X轴雷The interferometer (see Fig. 12). The reticle interferometer ❹ 21R (see Fig. 2) constituted by the interferometer respectively irradiates the moving mirror (or the reflecting surface) provided on the reticle stage RST with a plurality of axes. The measuring beam is measured in the X direction and the γ direction of the reticle stage RST at a plurality of reference mirrors (not shown) on the side of the projection optical system PL, and the measured values are passed through the main control device of FIG. 20 is supplied to the reticle stage stage drive system 22R. Based on these measured values, the 0Z of the reticle stage RST and the rotation angle of the 9X and 0y directions can be obtained. The reticle stage stage drive system and the system 22R are based on The measured value 12 201009512 of the reticle interferometer 21R and the control information from the main control device 20 control the gamma directional velocity and position of the reticle stage RST and the position of the X direction by, for example, a drive mechanism including a linear motor 23 or the like. And the rotation angle of the ^ direction. In addition, the arrangement example of the reticle interferometer and the reticle stage RST will be described in detail with reference to Fig. 12 in the second embodiment to be described later. Further, in the present specification, the measurement of the alignment of the wafer W and the reticle R, and the detection of the focus, etc., is appropriately referred to as a measurement operation. In the present embodiment, the wafer stage drive system 22W and the reticle stage drive system 22R are heat sources. Therefore, the wafer stage drive system 22w and the reticle stage stage drive system 22R are arranged together in a box-like control phase 30 that is _γ = supported by the optical system frame 16 in the vicinity of the oscillating table 15 as an example. . The X' control box 3 can be disposed, for example, in the vicinity of the anti-vibration table 15 in the +γ direction, or can be supported by the upper frame 17 or the like. In this case, the AF sensor 25 of Fig. 2 and the signal processing systems 26, 27 for the alignment system, the AL, and other devices that may become heat sources may be disposed in the control box 3A. If you step into it, you can also divide the control box 3 into a plurality of small boxes. Further, when the exposure apparatus 10 of the present embodiment is in a liquid immersion type, a nozzle head (not shown), for example, is disposed on the lower surface of the optical member at the lower end of the projection optical system PL, via the liquid supply device of FIG. A tube, a wire, and the nozzle head, which are not shown, supply a predetermined liquid (pure water or the like) to the optical member and the wafer door. The immersion area of the cockroach. The liquid in the liquid immersion area is recovered by the liquid recovery unit 29 of Fig. 2 via a line (not shown). A liquid immersion mechanism including the boring head, the liquid supply device 28, and the liquid recovery device 29 can be used, for example, in the pamphlet of International Publication No. 2004/053955 (corresponding to 13 201009512 US Patent Application Publication No. 2005/0259234), European Patent A liquid immersion mechanism such as a specification of the publication No. 1420298, or International Publication No. 2005/122218; a booklet (corresponding to US Patent Application Publication No. 2007/0291239). Further, when the exposure apparatus 10 is in the dry state, it is not necessary to use the liquid immersion mechanism. Further, a reticle loading system (not shown) and a wafer loading system (not shown) are disposed in the side direction of the accommodating chamber 2 of Fig. 1, for example, in the Y direction. The reticle loading system and the wafer loading system are disposed in another sub-storage chamber (not shown) that is separate from the accommodating chamber 2 for air conditioning, and the reticle loading system and the wafer Z-loading system pass through the side of the accommodating chamber 2, respectively. The opening (not shown) replaces the reticle r and the wafer W. At the time of exposure of the exposure apparatus 10 of Fig. 1, the alignment of the reticle r and the wafer W is first performed. Thereafter, the illumination light EL is irradiated onto the reticle R, and the reticle stage is placed while projecting a part of the pattern of the reticle R through the projection optical system pL onto one of the irradiation areas on the wafer W. The beating and wafer stage WST transfers the pattern image of the reticle R to the irradiation area by the scanning magnification operation in which the projection magnification of the projection optical system PL is synchronously moved (synchronously scanned) in the gamma direction. Thereafter, the irradiation of the illumination light el is stopped, and the operation of stepwise moving the wafer w in the X direction and the Y direction through the wafer stage WST and the step scanning (step & scan) are performed in the scanning exposure operation. In a manner, the pattern image of the reticle R is transferred to all of the illumination areas on the wafer force. Next, in the exposure apparatus 10 of the present embodiment, in order to illuminate the illumination system, the illumination characteristics of the first ILS (the homologous factor (the value of the coherence), the uniformity of the 201009512 degree, and the projection optical system) Imaging characteristics (the resolution is in a predetermined state, and the reticle R and the projection optical system are similar to m „ The positional relationship of the long-day yen W is maintained at a predetermined relationship to high exposure accuracy, and the degree of synchronization is 4) Exposure, with the inclusion of temperature-controlled air to the downflow

The overall system of the main air conditioning unit 8 that is supplied to the inside of the accommodating chamber 2 is provided. Further, the exposure apparatus is also provided with a partial air conditioning system for controlling or cooling the temperature required for the high temperature control accuracy and the temperature of the heat source portion such as the control box 3〇. The local air conditioning system has a second partial air conditioner 41 and a second partial air conditioner 43, which are disposed outside the upper portion of the storage chamber 2. Further, at least a part of the overall air conditioning system (in this example, the main air conditioner 8 and the partial air conditioning system) is provided above the storage compartment 2, but the invention is not limited thereto, and may be provided, for example, on the side of the storage compartment 2. In order to supply the air-conditioning air to the local air-conditioning system, for example, in the upper part (under the floor or the like) of the storage room 2, the supply control is performed in a predetermined temperature range, and the dust filter (HEPA filter, ULAP filter, etc.) is passed. An air conditioning air supply pipe for air conditioning of air (for example, dry air), and compressed air for supplying compressed air (for example, compressed dry air) that controls air at a substantially predetermined temperature range and compressed through a dust filter. Supply tube 42. The compressed air supply pipe 42 is generally a device such as a semiconductor manufacturing factory. Further, the air-conditioning air supplied from the main air-conditioning unit 8 or the decompressed air or the like may be taken from the compressed air supply pipe 42 without using the air-conditioning air supply pipe 4'. The first partial air conditioner 41 that controls the temperature of the air taken from the air-conditioning air supply pipe 4 with high precision is provided, and the first partial air conditioner 41 15 201009512

The high-temperature-controlled clean air is guided to the air supply part of the illumination system lens barrel 6 of the illumination system ILS in the accommodating chamber 2 via the first (four) 18R and the second catheter lining, QR 4 19R and the air supply of the bottom surface of the optical system frame 16 Department 19W. The first partial air network is used to control the power adjustment device 41, for example, by using a compressor using a refrigerant to control the temperature of the air. cage! A_ is also set up. The temperature control operation of the first partial air conditioner (41) is controlled by the interference optical path of the second embodiment of Fig. 2, which is controlled by the sheet metal 兀 路 路 路 凋 control system. The air supply units 19R and 19W are respectively equipped with a γ-axis laser interferometer 2 1R Υ and a wafer cut-off a D-field v ★ v 私 私 私 私 私 私 私 私 , , , , , , , , , , , , , , , , γ γ γ γ γ γ γ γ γ Interferometer 21WY

The light path of the measuring beam. The air blowing portions 19R and 19w respectively eject the temperature-controlled air AR and aw guided by the ducts 18R and 1 to the optical path of the measuring beam in a uniform wind speed distribution. It is also possible to spray air AR and AW in a side stream manner. Similarly, the optical path of the measuring beam for the x-axis laser interferometer is also partially supplied with temperature-controlled air. According to this, the position of the reticle stage RST and the wafer stage WST can be measured with high precision by the reticle interferometer 21R and the wafer interferometer 2iw. In addition, right

The air ar (ary and ARX) radiated from the X-axis and γ-axis laser interferometers (21RX and 21RY) to the optical paths (65χ and 65γ) of the measuring beam of the reticle stage RST is shown in Fig. 12 which will be described later. Further, a local air conditioner 43 for generating temperature-controlled clean air from the compressed air drawn from the compressed air supply pipe 42 is provided, and the temperature-controlled air A8 from the second partial air conditioner 43 is supplied through The air duct 44 is sprayed on the side of the control box 3 in the accommodating chamber 2. The temperature control operation of the second partial air conditioner 43 is controlled by the control box air conditioner control system 37 of Fig. 2 . For example, the front end portion of the air supply duct 44 is two 16 201009512 divergent ducts 44a and 44b, and the temperature-controlled air A8 is blown from the branch ducts 44a and 44b to the side of the control box 30, respectively. The set temperature (target temperature) of the air A8 is set to be lower than the set temperature of the air supplied by the main air conditioner 8 in the accommodating chamber 2 (for example, a predetermined temperature within 20 to 25 ° C) (for example, the number) Deg). As a result, the temperature rise of the control box 30 containing the heat source can be suppressed, the temperature control accuracy of each portion of the exposure apparatus in the storage chamber 2 can be improved, and the exposure accuracy can be improved in the near future. Hereinafter, the configuration of the second partial air conditioner (43) will be described in detail with reference to Figs. 3 and 4 . 3 is a block diagram showing the configuration of the second partial air conditioning unit 43, and FIG. 4 is a cross-sectional view showing the Vortex tube 45 of FIG. In FIG. 3, the second partial air conditioner (43) includes a scroll (45) that connects the compressed air supply pipe (42) to the transmission line (47). Further, a regulator 48R for pressure smoothing and a main flow control valve 48F for flow rate control are provided in the middle of the line 47, and the lines 49A and 50A are connected to the scroll 45. The scroll 45 includes: a supply port 45a for supplying compressed air A1 from the compressed air supply pipe 42 through the line 47, and a discharge port 45c for discharging the heater A3 having a temperature higher than the compressed air A1 to the line 50A, and the temperature is lower than the compression The cold air A5 of the air A1 is ejected to the exhaust port 45d of the line 49A, and the throttle valve 46 for controlling the flow ratio of the heating A3 to the cold air A5 and the temperature of the cold air A5. As shown in Fig. 4, the scroll 45 is a cylindrical member, and an exhaust port 45d is provided at one end portion of the swirl chamber 45b in the cylindrical member, and a supply port 45a is provided on the side surface thereof. The other end of the swirl chamber 45b is provided with a throttle valve 46 for adjusting the flow rate of the heater A3, and an exhaust port 45c is provided at the end portion near the throttle valve 46. In this case, the compressed air A1 supplied from the supply port 45a to the back 17 201009512 in the swirl chamber 45b is divided into a free vortex A2 that circulates toward the outer side of the exhaust port 45c side and a swirling flow toward the inner side toward the exhaust port 45d side. Forced vortex A4, the temperature of the free vortex A2 gradually rises, and the temperature of the forced vortex A4 gradually decreases. Further, a part of the free vortex A2 is discharged as a warm air A3 from the exhaust port 45c to the line 50A, and a part of the forced vortex A4 is discharged as a cool air A5 from the exhaust port 45d to the line 49A. It is generally known that by adjusting the throttle valve 46, the temperature of the cold air A5 can be lowered by 10 to 70 °C with respect to the compressed air A1. In the present embodiment, when the temperature of the compressed air A1 is, for example, about 20 °C, the cold air A5 having a temperature of, for example, -50 to 10 °C can be produced. In this case, since there is no movable portion in the scroll 45, it is possible to generate cold air substantially without the need for maintenance by the use of compressed air. An example of a refrigerating machine using a vortex tube is disclosed in, for example, JP-A-2001-255023 (corresponding to U.S. Patent Application Publication No. 2001/0020366), JP-A-2006-23010, and JP-A-2005-180752 Wait. The present embodiment is different in that air which is a mixture of cold air and warm air at a variable mixing ratio is used not only for the cold air of the scroll. Returning to Fig. 3, the cold air A5 in the line 49A will be supplied to the lines 49B, 49C via the T-joints 52A, and the heating A3 in the line 50A will be supplied to the lines 50B, 50C via the T-joints 52B. Further, the cold air A7 in the line 49B is mixed with the heating A6 in the line 50B by the Y-type joint 52C, and is supplied as a mixed gas (temperature-controlled air A8) to the air supply duct 44, and the cold air and the line in the line 49C. The heating in the 53D is mixed by the T-type 18 201009512 joint 52D and supplied to the exhaust duct 57. The temperature-controlled air A8 in the air supply duct 44 is blown to the side of the control box 30 of Fig. 1. The air A9 in the exhaust duct 57 is supplied to the main air conditioner 8 for example, and is used as air-conditioning air. Further, the first and second flow rate control valves 53A and 53B are provided in the middle of the lines 49B and 50B, and the third and fourth flow rate control valves 53C and 53D are provided in the middle of the lines 49C and 50C, and the lines 49B and 50B are in the middle of the line. There are provided check valves 54A, 54B for preventing backflow of gas from the Y-shaped joint 52C. Further, a temperature sensor 55A and a flow rate sensor 56A for measuring the temperature and flow rate of the cold air A5 are disposed in the line 49A, and a temperature sensor 55B for measuring the temperature and flow rate of the heater A3 is disposed in the line 50A. The flow sensor 56B is provided with a temperature sensor 55C and a flow sensor 56C for measuring the temperature and flow rate of the air A8 in the air supply duct 44. The measured values of the temperature sensors 55A to 55C and the flow sensors 56A to 56C are supplied to the control box air conditioning control system 37, and the control box air conditioning control system 37 controls the information supplied by the main control device 20 based on the measured values ( The set temperature of the air A8, the set flow rate, and the like) control the opening degree (0 to 100%) of the main flow rate control valve 48F and the flow rate control valves 53A to 53D. Further, the control box air-conditioning control system 37 can further control the air pressure supplied from the regulator 48R and/or the throttle valve 46 of the scroll 45 (control of the flow rate and temperature of the cold air A5). The scroll tube 45, the lines 47, 49A to 49C, 50A to 50C, the regulator 48R, the main flow control valve 48F, the T-joints 52A, 5 2B, 52D, the Y-joint 52C, the flow control valves 53A to 53D, Check valve 54 inlet, 548, air supply conduit 44, exhaust conduit 57, temperature sensor 55 into ~ 19 201009512

A valve (exhaust valve, etc.) to the side of the exhaust duct 57. 55C and flow promotion: a, i gg ς / ς A 〜 ^ In addition, the joint 53C, next, an example of the air conditioning operation of the second partial air conditioner 43 of Fig. 3 will be described with reference to the flowchart of Fig. 5 . This action is controlled in parallel with the exposure action of the exposure apparatus 10 by the control box air conditioning control system 37. Further, this operation can be performed not only in parallel with the exposure operation, but also in parallel with other operations such as the measurement operation, or continuously during the operation of the exposure apparatus 1. At this time, the pressure of the air output from the regulator 48R is set to, for example, about 3 to 5 times the atmospheric pressure, and the throttle valve 46 of the scroll 45 is adjusted to be sent to the air port 8 of the control box 30 of FIG. Set the temperature (for example, the predetermined temperature in 丨5~2〇c). The temperature of the cold air Α5 is lower, and the temperature of the heating 八3 is higher. Further, the set flow rate of the air enthalpy 8 is, for example, set to be smaller than the flow rate of the compressed air Α1 when the opening degree of the main flow control valve 48F is set near the central value (5 〇%). © First, in step 101 of Fig. 5, the opening degrees of the i-th to fourth flow control valves 53A to 53D are set to, for example, a central value. In the next step 丨〇2, the opening degree 蚤 of the main flow control valve 48F is set to, for example, a central value, and the compressed air A1 is introduced from the compressed air supply pipe 42 through the line 47 to the vortex tube 45. Accordingly, 'the supply of cold air A5 from the scroll 45 to the line 49A, the supply of the heater A3 to the line 50A' is branched from the line 49A to the cold air A7 of the line 49B, and the heating unit A6 which is branched from the line 50A to the line 5〇b That is, the air supply duct 44 is supplied to the Y-type joint 20 201009512 52C. At this time, the portion of the cold air A5 and the heating A3 that is not used as the air A8 is discharged to the exhaust duct 57 via the lines 49C, 5〇c and the T-joint 52D.

Next, the temperature and flow rate of the cold air A5 and the warm air A3 are measured by the temperature sensors 55A and 55B and the flow sensors 56A and 56B, and the measured values are supplied to the control I-air air-conditioning control system 37 (step 1〇3). Further, the temperature and flow rate of the air A8 of the mixed gas in the air supply conduit 44 are measured by the temperature sensor 55C and the flow sensor 56c. The measured value is supplied to the control box air conditioning control system 37 (step 104). Then, the control box air-conditioning control system 37 determines whether the measured flow rate of the air A8 is within a predetermined allowable range (set range) relative to the set value supplied by the main control unit 2 (step 1〇5). When the setting range is within, the process moves to step 107, and when the flow rate is not within the set range, the process moves to step 106. In step 106, the control box air-conditioning control system 37 increases the opening degree of the first and second flow rate control valves 53A, 53A by the first control amount (for example, several %) when the flow rate of the air volume 8 is less than the set range, and reduces the number of 3 and the fourth flow control valves 53C, 53D open to offset the increase, and when the flow rate of the air A8 is greater than the set range, the opening of the flow control valves 53A, mb is reduced by the first control The amount and the opening of the flow control valve 5 3 C, 5 3 D are increased to offset the decrease. Further, the control amount of the flow rate itself may be used instead of the first control amount. In addition, after the operations of the plurality of steps 1〇3 to 1〇8 are repeated, the opening degree of at least one of the flow control valves 53 A, 53B in step 106 reaches a predetermined limit of 21 201009512 (9) such as _ degree or upper limit (for example) At 9 G%), the opening degree of the main flow control valve 48F is reduced or increased by a predetermined amount. θ In the next step 107, the control box air conditioning control system determines whether the measured air A8 (mixed gas) temperature is within a predetermined allowable range (set range) relative to the set value supplied by the main control unit f 2 . When the temperature is within the set range, the process returns to step 103 to repeat the operations of steps 1〇3 to 1〇8. Further, when the temperature is not within the set range, the process moves to step 1〇8. In step 108' control box When the temperature of the air A8 is lower than the set range, the air-conditioning control system 37 reduces the opening degree of the i-th flow rate control valve 53 A by a second amount (for example, several %), and increases the opening degree of the second flow rate control valve 53β. The amount of flow reduction of the air A8 caused by the compensation (reduction in opening degree) is controlled by the mixing ratio of the cold air A7 and the heating A6, and the flow rate of the air A8 does not change, but the ratio of the cold air A7 in the air A8 is reduced. The temperature of the air A8 is increased. At this time, the opening degrees of the third and fourth flow rate control valves 53C, 53D are increased and decreased to offset the change in the flow rate of the flow rate control valves 53A, 53B. On the other hand, when the air A8 is Temperature is higher than the setting range That is, the opening degree of the flow control valve 53A is increased by the second predetermined amount, and the opening degree of the flow control valve 53B is decreased to offset the increase in the flow rate of the air as caused by the increase in opening degree. Accordingly, the air A8 Although the flow rate does not change, the ratio of the cold air A7 in the air A8 is increased to lower the temperature of the air A8. At this time, the opening of the flow control valves 53C, 53D is reduced and increased to offset the flow control valve 53 A, 5 3 The change in the flow rate of B. In addition, the control amount of the flow rate itself may be used instead of the second control amount. Thereafter, the operation proceeds back to step 103, and then the steps of steps 1〇3 to 1〇8 are repeated. Until the main control device 22 201009512 2〇 gives an instruction to the control box air-conditioning control system 37 to stop the air-conditioning. At this time, the temperature of the cold air Α 5 ejected from the vortex tube 45 is lower than the set temperature of the air 八8, and the heating 八3 The temperature is higher than the set temperature. Therefore, in step (10), the mixing ratio of the cold air Α7 xiao heating 八6 is adjusted, that is, the space supplied to the control box 3 of Fig. 1 can be easily arbitrarily A 8 >, θ rir 剌相川The temperature control of the work rolling A8 is set The operation and effect of the exposure apparatus 10 of the present embodiment are as follows. 〇) Using the exposure method of the exposure apparatus 1 , the illumination light EL is used to illuminate the reference line R to illuminate the light beam through the reticle The pattern of R and the projection optical system PL expose the wafer W, which includes the step of injecting the compressed gas ai into the full coil 45, adjusting the cold air A·) generated from the scroll 45, and the heating A3 (A6). The mixing ratio is performed by the steps 1 to 7, 108 for generating the temperature-controlled air A8, and the step 108 of blowing the air A8 to the side of the control box for accommodating the heat source. Further, the exposure device 1 is provided with the second partial air conditioner 43. And the control box air conditioning control system, the system 37, the second partial air conditioning unit i 43# prepares the compressed air A1 injected from the compressed air supply pipe 42 to generate the cold air A5 and the heating VIII vortex 45, the cold air A5 and the heating A3 Mixing means for outputting the temperature-controlled air A8 (lines 49B, 5〇b, flow control valves 53A, 53B and Y-joints 52c) in a variable mixing ratio, and supplying air a8 to the side of the control box 30 Air supply conduit 44. In this way, the vortex tube 45 generates cold air and heating from the compressed air, and controls the ratio of the cold air and the heating to generate the temperature-controlled air, that is, the simple mechanism can be used in the accommodating chamber without using the refrigerant. Local temperature control is performed within 2. Furthermore, since the air supply pipe 42 is generally equipped with a pressure 23 201009512 in a semiconductor component manufacturing factory, the manufacturing cost of the second partial air conditioner can be reduced. (2) Further, the exposure method further includes increasing or decreasing the flow rate of the cold air A7 by the flow control valve 53 and increasing or decreasing the flow rate of the heating A6 by the flow control valve 53B in parallel to control the use of the γ-type joint 52C. Steps 105, 1〇6 of the flow rate of the mixed air A8. Therefore, the flow rate of the air A8 sent to the control box 30 can also be easily controlled. Furthermore, the flow control steps of steps 105, 106 can be omitted. (3) Further, the air outlets of the air supply ducts 44 (the branch ducts 44a and 44b) of Fig. 1 are disposed toward the side of the control box 3 收纳 accommodating the heat source, and the air A8 is blown to the control in an open manner. The side of the box 30 is such that the configuration of the local air conditioning mechanism is simple. However, the air A8 can also be directly sent to the heat source of the reticle stage driving system 22R or the like in the control box 30. In this case, an exhaust duct for discharging the air flowing through the control box 30 may be additionally provided. (4) Further, in this embodiment, although the heat source is housed in the control box 30, for example, the linear motor 23, 24 or the reticle interferometer 21R of Fig. 2,

The laser source of the Q wafer interferometer 21W is regarded as a heat source, and the heat source blows the temperature-controlled air from the air supply duct 44. Next, a modification of the above embodiment will be described. First, the first modification will be described with reference to Figs. 6(A) and (Β). In the first modification, the second partial air conditioner (43) of Fig. 3 is used. However, the control box 30 of the exposure apparatus 10 of Fig. 1 is cooled by the heat sink. [First Modification] This modification is based on the difference between the partial air conditioners in which the local air conditioner of the control unit 24 201009512 of the exposure apparatus of the first embodiment is changed, and the first embodiment is described. In addition to the other parts, since the 盥 form is the same, its q '1 implementation is omitted. Fig. 6(A) shows the IB line including the first modification of the main μ 匕 3 of the control box 30 of the sample: Fig. 6 (8) is along the line of Fig. 6 (8)

The corpus callosum 3 0 Α 之 之 。. In the same manner, the heat source such as the reticle stage drive system cake (4) is housed, and the box body is fixed on the low surface of the casing 3〇a and R (eight).

° . As shown in Fig. 6(B), the inside of the heat dissipating device portion 58 is divided into the i-th, the third end of the end portion by the difference between c, 58d, and 58e. And the 4th space, the scattered track in each bow / a small number of small angular columnar sounds..., piece 59. Further, a supply port 583 is provided in front of the second portion of the heat sink unit 58 and an exhaust port 58b is provided in front of the fourth space. Further, the air supply duct 44 of the second partial air conditioner (43) is connected to the air supply port 58a' via the opening of the casing side, for example, to the exhaust duct 6 of the gas recovery part of the main air conditioner 8 of Fig. 1. The 〇 is connected to the exhaust port 58b via another opening on the side of the body 30A. In the first modification, when the local air conditioner (cooling) of the control box 3 is performed, the temperature-controlled air A8' generated by the second partial air conditioner (43) of Fig. 1 is supplied to the air supply duct 44 via Fig. 6 The air supply port 58a of the heat sink unit 58 in the control box 3 of (A). The supplied air A8 is bent through the four spaces in which the plurality of fins 59 are provided in the heat sink portion 58 as indicated by arrows B1 to B4, and then exhausted from the exhaust port 5 through the exhaust duct 60 as indicated by an arrow B5. Be recycled. According to this, the control box 30 can be effectively cooled. Further, in the first modification, the air supply duct 44 and the exhaust duct 6〇 may be used instead of the flexible pipe of 2010 201012. [Second Modification] This modification is a mode in which the control box 30 of the exposure apparatus according to the first embodiment is changed and the local air conditioner is changed. Referring to Fig. 7 of this variable t L, the following is explained. In addition, the description will be made focusing on the difference from the i-th embodiment. The other portions are the same as the embodiment of the first embodiment, and thus the description thereof will be omitted. The second modification also uses the second office 4 adjustment device 43 of FIG. 3, but the difference is that instead of the control phase 3G of the exposure apparatus 1 of FIG. 1, the control box including two spaces of FIG. 7 is used. soft. Fig. 7 is a cross-sectional view showing the configuration of the main P bit of the control box 30A which does not include the second modification. The inside of the tubular trunk body of the control box is removed from the first to the first space of the large space through the partition plate 262 having the gap, and the small space on the side of the first chamber C1; In the second chamber, the heat source such as the reticle stage driving system 22R and the wafer stage raking system 22W is housed in the first to c1. Further, the bottom surface of the control box 3A is transmitted through a material having a small thermal conductivity (for example, a flat heat shield i6i made of ceramics), and a cylindrical shape is provided on the bottom surface of the end portion of the uC2 on the vibration isolating table 15. The duct portion 30Ac is opened on the side surface of the second chamber c2 of the control box 3A, and is connected to the discharge port of the air supply duct 44 of the second partial air conditioner (43) of Fig. 1. With the second modification, When the exposure device is exposed, the temperature-controlled air Bu sent from the main air conditioning device 8 of the figure is down-flowed.

Bl2 flows into the first chamber cn from the opening 3 of the upper portion 3A of the casing 3A of the control box 30A of Fig. 7 . The air BU and B12 flow around the heat source 26 201009512 in the i-th chamber ci, and then flow from the gap of the partition plate 262 to the end of the second chamber C2 as indicated by an arrow B13. In parallel with this operation, the temperature-controlled air A8 generated by the second partial air conditioning unit 43 of Fig. i is supplied from the opening of the casing 30Aa to the second portion via the air supply duct 44 of Fig. 7 . And the air A8 flowing through the second room C2 is flowing with the first! After the air bu and bi2$ flow in the chamber, as indicated by an arrow B14, the exhaust duct portion 3〇Ac is discharged to the outside of the casing 3〇α & Thus, the combination of the downflow of the main air conditioner 8 and the local air conditioner of the second partial air conditioner , can effectively cool the control box 3〇a. Further, in the second modification, the air discharged from the exhaust duct portion 3AAc can be directly recovered to the gas recovery portion of the main air conditioner 8 of the drawing or discharged to the storage chamber via a line (not shown). 2 external. Further, in the 帛1 embodiment and the i-th modification, in order to prevent the air supplied to the control box 3 from diffusing inside the accommodation chamber 2, the air may be recovered to the gas recovery portion or discharged to the outside of the storage chamber. <Second Embodiment> Next, a second embodiment of the exposure apparatus of the present invention will be described with reference to Figs. 8 to 12 . As shown in FIG. 8 , the exposure apparatus 5 of the present embodiment is also a scanning exposure type projection exposure apparatus (scanning type exposure apparatus) similar to the exposure apparatus of the first embodiment, in order to illuminate the light, the system ILS The illumination characteristics and the imaging characteristics of the projection optical system are maintained in a predetermined state, and the positional relationship between the reticle R, the projection optical system PL, and the wafer w is maintained in a predetermined relationship and exposed with high exposure accuracy, and the overall air conditioning system is provided. The air conditioning system includes a main air conditioning unit 8 that supplies temperature-controlled clean air to the interior of the containment chamber 2 in a downflow manner. In the exposure apparatus of the second embodiment, 27 201009512, the local temperature control is performed in the storage unit 2, but the main difference from the first embodiment is that the second local air conditioner 43 is replaced by the exposure apparatus 5 in the embodiment. On the other hand, the third partial air conditioner ι43 is installed, and the third partial air conditioner 143 introduces a gas whose temperature control and flow rate are restricted into the inside and below of the illumination system barrel 6. The structure and operation of the exposure apparatus which is unique to the second embodiment will be mainly described below, and the structure and operation of the exposure apparatus which are the same as those of the first embodiment will not be described. As shown in FIG. 8, the exposure apparatus 500 is provided with a partial air conditioner #41' that controls the temperature of the air taken from the air-conditioning air supply pipe 40 with high precision, and the temperature is controlled by the first partial air conditioner 41. The clean air is guided to the air blowing portion 19R on the bottom surface of the illumination system lens barrel 6 of the illumination optical system ILS in the storage chamber 2 and the air blowing portion 19W on the bottom surface of the optical system frame 16 via the first duct 18R and the second duct 18w. The temperature control operation of the first partial air conditioning unit 41 is controlled by the interference optical path air conditioning control system 36 of Fig. 9. The air blowing portions 19R and 19W are disposed on the optical path of the measuring beam such as the laser interferometer 21RY for the reticle stage RST and the laser interferometer 21WY for the wafer stage WST. The air blowing portion 19R, as shown in Fig. ,, controls the temperature of the optical paths 65Y and 65X of the measuring beam from the laser interferometers 21RY and 21RX to the reticle stage RST, respectively, from the conduit 18R. The air ARY and ARX are sprayed in a downflow manner and a uniform wind speed distribution. Air ARY and ARX are represented in Figure 8 by air AR. The air blowing portion 19W of Fig. 8 discharges the temperature-controlled air AW guided from the duct 18w at a uniform wind speed in a downflow manner to the optical path of the measuring light 28 201009512. Further, the air AR and AW may be ejected in a side stream manner. As a result, the position of the reticle stage RST and the wafer stage WST can be accurately measured by the reticle interferometer 21R and the wafer interferometer 21W. Further, a third partial air conditioner 143 for generating the temperature-controlled clean air A28 and A29 with high precision and different precision from the compressed air drawn from the compressed air supply pipe 42 is also provided. The third partial air conditioner 143 is provided with an air supply duct 44F for supplying air A28 and A29, respectively.

44R. In this case, the air A29 is supplied from the third partial air conditioner 143 to the illumination system barrel 6 of the illumination optical system ILS via the air supply duct 44R, and the air flowing through the illumination system barrel 6 is transmitted through, for example, an exhaust gas not shown. The guide is recycled to the gas recovery section of the main air conditioner 8. Therefore, the front end of the air supply duct 44R penetrates the wall surface of the illumination system barrel 6. As shown in FIG. 8, an optical path bending mirror for reflecting light from a j-th collecting lens (not shown) of the collecting optical system is accommodated in the illumination system lens barrel 6 and a second collecting lens. CL. A cylindrical member 161 having a gradually smaller opening diameter is mounted under the second condensing lens CL of the illumination system lens barrel 6 and is gradually expanded to surround the private wire R on the reticle stage RST. Cover portion 62. The cylindrical member 61 is disposed to surround the optical path of the illumination light EL. As shown in FIG. 12, the cover portion 62 includes a flat cover piece 62YA, 62YB which is gradually expanded in the Y direction next to one of the reticle R, and the inside of the cover piece 62γΑ, 62γΒ in the direction of the χ One of the reticle R is gradually expanded by the flat cover sheets 62χΑ, 62ΧΒ. In Fig. 12, the arrangement relationship between the cover sheets 62γΑ, 62γΒ, 62χΑ, 62χΒ, and the reticle stage RST and the reticle interferometer 21R is also shown. In the case of 201009512, the laser interferometer 21RY illuminates the measuring beam with the moving mirror 2ΐΜγ composed of the retroreflector disposed at the ten-γ direction end 邛2 of the reticle stage RST, and the laser interferometer 21RX is The rod-shaped moving mirror 21MX fixed to the end portion of the reticle stage RST2 + x direction irradiates the measuring beam of the plurality of axes. The laser interferometer 21RX' 21RY measures the X-direction and the Y-direction of the reticle stage RST at a plurality of points with reference to a reference mirror (not shown) on the side of the projection optical system pL, and the measured value is transmitted via FIG. The main control unit 2 is supplied to the reticle stage drive system 22R. Further, instead of the moving mirrors 21MY and 21Μχ, the reflecting surface on the side surface of the reticle stage RST can be used. 10 In the configuration shown in Fig. 12, 'the reticle stage RST moves back and forth in the gamma direction even during scanning exposure'. The opening of the lower end of the cylindrical member 61 is also at the upper end of the four cover sheets 62YA, 62YB, 62XA, 62XB. The upper part of the rectangular area around the part moves. A rectangular notch portion 61a is formed at one end of the cylindrical member in the γ direction. Returning to Fig. 9 'the third-part local air conditioner 143 supplies the temperature-controlled air A29 of higher precision to the notch portion 61a of the cylindrical member 61 via the air supply duct 44F (refer to Fig. 12, the air A29 is descending from the cylinder) The member 61 ❿ flows inside to the cover portion 62 above the reticle R. Thereafter, the air A28 flows out from the gaps of the cover sheets 62YA, 62YB, 62XA, 62XB to the outside as shown by arrows 64A to 64D in Fig. 12 The FL side is recovered to the gas recovery part of the main air conditioner 8. The air A28 and the set temperature of the air supplied from the main air conditioner 8 in a downflow mode (for example, a predetermined temperature within 20 to 25 t) in the storage chamber 2 The set temperature (target temperature) of A29 is set to the same temperature. However, from 30 201009512, the allowable range of air set temperature supplied by the downflow mode is set to a narrower range, air a28

Hereinafter, the main air conditioning apparatus (control accuracy) of the third partial air conditioner 143 will be described in detail with reference to Fig. 1 . Fig. 10 is a block diagram showing the configuration of the third partial air conditioner 143. * In Fig. 10, the third partial air-conditioning apparatus 143 includes a scroll cymbal that is connected to the line 47 through the compressed air supply pipe 42. The vortex tube 45 is the same as that used in the first embodiment as shown in Fig. 4 . In the middle of the line 47, a regulator 48R for pressure smoothing and a main flow control valve 48F' for flow control are connected to the scrolls 45 to connect the lines 49A and 50A. Further, a pressure sensor may be provided instead of the regulator 48R (the barometer p scroll Ο 45' includes: a supply port 45a for supplying compressed air A1 from the compressed air supply pipe 42 via the line 47, and the temperature is higher than the compressed air The heating A3 of Ai is discharged to the exhaust port 45c of the line 50A, the cold air A5 of the temperature lower than the compressed air A1 is discharged to the exhaust port 45d of the line 49A, and the flow ratio of the heating A3 to the cold air A5 and the cold air A5 are controlled. The temperature throttle valve 46. The cold air A5 in the line 49A is supplied to the line 49B, 49C' through the τ-type joint 52A, and the heater A3 in the line 50A is supplied to the line 5B, 50C through the T-joint 52B. The cooling air A7 in the line 49B and the heating unit A6 in the line 50B are mixed by the Y-type joint 52C 31 201009512, and the temperature-controlled air A28 as the first mixed gas is supplied to the air supply duct 44F. The cold air in the line 49C is branchedly supplied to the line 49D and the line 158 through the T-joint 52E, and the cold air in the line 49D and the heater in the line 50C are mixed by the Y-type joint 152D as the temperature control of the second mixed gas. Air A29 was It is supplied to the air supply duct 44R. The temperature-controlled air A28, A29 in the air supply ducts 44F, 44R are respectively blown out into the cylindrical member 61 of Fig. 8 and in the illumination system barrel 6. The cold air in the line 158, for example, It is supplied to the main air conditioner 8 and used as air conditioning air. Further, the first and second flow rate control valves 153A and 153B are provided in the middle of the lines 49C and 50C, and the third flow rate control valve 153C is provided in the middle of the line 158. Check valves 54A and 54B for preventing backflow of gas from the Y-type joint 52C are provided in the middle of the lines 49B and 50B. Similarly, in the middle of the lines 49C and 50C, a gas counterflow prevention from the Y-type joint 152D is provided. The check valves 54C and 54D. Further, a temperature sensor 55M and a flow rate sensor 56M for measuring the temperature and flow rate of the compressed air A1 are disposed in the line 47, and the measuring air conditioner A5 and the heating are disposed in the lines 49A and 50A. The temperature sensors 55A and 55B of the temperature of A3 are provided with flow rate sensors 56A and 56B for measuring the flow rates of the cold air A7 and the warm air A6 in the lines 49B and 50B. Further, they are separately measured in the air supply duct 44F. The temperature of air A28, The temperature and pressure temperature sensor 55C, the flow sensor 56C and the pressure sensor 57C are provided with a temperature sensor 55D for measuring the temperature, flow rate and pressure of the air A29, and the flow sensing in the air supply conduit 44R. The device 56D and the pressure sensor 32 201009512 57D. The measured values of the temperature sensors 55M, 55A to 55D, the flow sensors 56M, 56A to 56D and the pressure sensors 57C, 57D are supplied to the local air conditioning control system 1 3 7 'The local air conditioning control system 13 7 controls the main flow control valve and the flow control valve based on the measured values and the control information supplied by the main control device 20 (the set temperature of the air A28, the set flow rate, and the set temperature of the air A29, etc.) The opening degree of 153A~153C (〇~1〇〇%). Further, the local air modulating control system 13 can further control the air pressure supplied from the regulator 48R and/or the throttle valve 46 of the scroll 45 (the flow rate of the cold air A5 and the temperature control). The vortex tube 45, the lines 47, 49A to 49D, 50A to 50C, 158, the regulator 48R, the main flow control valve 48F, and the T-type connection are included.

Heads 52A, 52B, 52E, Y-type joints 52C, 152D, flow control valves 153A to 153C, check valves 54A to 54D, air supply ducts 44F, 44R, temperature sensors 55M, 55A to 55D, flow rate sensor 56M 56A to 56D and dust sensors 57C and 57D constitute a third partial air conditioner 143. Further, the flow rate control valves 153A, 153B may be provided, for example, in the lines 49B, 50B. Next, an example of the air conditioning operation of the third partial air conditioner 143 of Fig. 10 will be described with reference to a flowchart of Fig. 11 . This action is carried out in parallel with the exposure of the exposure device 1 and is controlled by the local air conditioning control system 137. At this time, the pressure of the air output from the regulator 48R is set to, for example, about 3 to 5 times the atmospheric pressure, and the throttle valve 46 of the scroll 45 is adjusted to the set temperature of the air A28 and A29 of FIG. 8 (for example, 20). The temperature is lower than ~25 °C), the temperature of the cold air A5 is lower, and the temperature of the heating A3 is higher. Further, the set flow rate of the air A28 33 201009512 is, for example, set to be smaller than the flow rate of the compressed air a 1 when the opening degree of the main flow rate control valve 48f is set near the center value (50%). First, in step 11〇1 of Fig. 11, the opening degrees of the first and second flow rate control valves 153 A and 153B are set to, for example, a central value. Further, the opening degree of the third flow rate control valve 153C is set to a small value (e.g., 丨〇%). In the next step 1102, the opening degree of the main flow control valve 48F is set to, for example, a central value ', and the compressed air A1 is introduced into the scroll 45 from the compressed air supply pipe 42 via the line 47. According to this, the cold air A5 is supplied from the scroll 45 to the line port 49A, the heater A3 is supplied to the line 50A, the cold air A7 branched from the line 49A to the line 49B, and the heating A6 branched from the line 50A to the line 50B. It is mixed by the Y-shaped joint 52C and supplied to the air supply duct 44F as air A28. At this time, the cold air passing through the line 49D and the warm air passing through the line 50C are mixed and supplied as the air A29 to the air supply duct 44R. The cold air supplied from the flow control valve 153C to the side of the line 158 is recovered. Secondly, the temperature and flow rate of the cold air A5 (A7) and the heating A3 (A6) are measured by the temperature sensors 55A, 55B and the flow sensors 56A, 56B, and the measured values are supplied to the local air conditioning control system 137 (step u 〇 3). Further, the air sensor A28 (the first temperature-regulating air) and the air supply duct 44R in the air supply duct 44F are respectively measured by the temperature sensors 55C, 55D, the flow sensors 56C, 56D, and the pressure sensors 57C, 57D. The temperature, flow rate and pressure of the air A29 (2nd tempered air) are supplied to the local air conditioning control system 丨3 7 (step 1丨〇4). Thereafter, the local air conditioning control system 137 determines whether or not the measured hunger amount of the air A28 is within the allowable range (setting range) of the preset setting 2010201012 (step 11〇5). When the flow rate is within the set range, the process moves to step 1107, and if the flow rate is not within the set range, then the process moves to step 1106. In step 1106, the local air conditioning control system 137 reduces the opening degree of the first and second flow rate control valves 153A, 153B by the first control amount when the flow rate of the air A28 is less than the set range (for example, %%) The flow rate of the heating A6 is increased to increase the flow rate of the air A28. Moreover, since the flow rate of the cold air A7 and the heating A6 has been measured in step 丨丨〇3, the opening degree of the flow control valves 153A, 153B can be reduced. The total value of the value is equivalent to 1/2 of the difference between the set value and the set value. On the other hand, when the flow rate of the air A28 is more than the set range, the opening degree of the flow rate control valves 1 53 A, 153B is increased by, for example, only the first control. The amount is such that the flow rate of the cold air A7 and the heating unit A6 is reduced. Further, after the operations of the plurality of steps 11〇3 to 11〇8 are repeated, the opening degree of at least one of the flow rate control valves 153A and 153B reaches the predetermined lower limit in step 1106. (for example, 10%) or an upper limit (for example, 9〇%), the opening degree of the main flow control valve 48F may be increased or decreased by a predetermined amount. In the next step 11 〇 7, the local air conditioning control system 丨 3 7, judge Air A28 measured (1st tone Whether the temperature of the air is relative to the set value supplied by the main control device within a preset allowable range (set range). When the temperature is within the set range, the process moves to step 11〇9, and when the temperature is not within the set range, Go to step 11 〇 8. In step 1108, the local air conditioning control system 137 increases the opening degree of the first flow rate control valve 153A by a second predetermined amount (for example, several %) when the temperature of the air a28 is lower than the set range. The second flow control valve i53B is opened to reduce the flow rate of the air A28 caused by the increase in the opening degree. However, the ratio of the cold air A7 in the air A28 is decreased to increase the temperature of the air A28. On the other hand, when the temperature of the air A28 is higher than the set range, the opening degree of the flow control valve 153A is decreased by the second predetermined amount, and Increasing the opening degree of the flow control valve 153B to offset the increase in the flow rate of the air A28 caused by the decrease in the opening degree. Accordingly, the flow rate of the air A28 does not change, but the air flow A7 is air-cooled A7. The ratio is increased to lower the temperature of the air A 28. Alternatively, the control amount of the flow rate itself may be used instead of the second control amount. In the next step 1109, the local air conditioning control system 137 determines the measured air A29 (second adjustment) Whether the temperature of the warm air is within a predetermined allowable range (setting range) with respect to the set value supplied by the main control unit 20. The setting range of the temperature of the air A29 is set to be wider than the setting range of the temperature of the air A28. When it is within the setting range, it returns to step Π 〇3 to repeat the operations of steps 1103 to 1110. Further, when the temperature is not within the set range, the process proceeds to step 1110. In step 1110, when the temperature of the air A29 is lower than the set range, the local air-conditioning control system 137 increases the opening degree of the third flow rate control valve 153C by a third amount (for example, about 1%). Accordingly, the ratio of the cold air in the air A29 is decreased to cause the temperature of the air A29 to rise. On the other hand, when the temperature of the air A29 is higher than the set range, the opening degree of the flow rate control valve 153C may be increased by the third predetermined amount. By repeating this operation a plurality of times, the temperature of the air A29 can be controlled within the set range. 36 201009512 Further, when the opening degree of the flow rate control valve 153c is 〇% (completely closed), if the temperature of the air A29 passing through the air supply duct 44R is higher than the set temperature, the τ type joint 52E can be set. On the side of the pipeline, a portion of the heating in the line 50C is discharged. Further, when the temperature of the air A29 can be within the set range in a state where the opening degree of the flow control valve i53c is 〇%, the τ-type joint 52E, the pipe, the line 158, and the flow rate control 阙i53c can be omitted, and the step 1109 is omitted. The action of 1110. After Q, the operation returns to the step, and the operations of steps 1103 to 1110 are repeated until the main control device 20 gives an instruction to the local air-conditioning control system 137 to stop the air-conditioning. At this time, since the temperature of the cold air A5 discharged from the scroll 45 is lower than the set temperature of the air A28, and the temperature of the warm air a3 is higher than the set temperature, the mixing ratio of the cold air A? and the heating A6 is performed in the step u〇8. The adjustment can easily control the temperature of the air A28 supplied to the air supply duct 44F of Fig. 8 within the set range. The effects and the like of the exposure apparatus 10 of the present embodiment are as follows. Ο (1) The exposure method by the exposure device 10 is to illuminate the reticle R with the illumination light, and expose the wafer W by the illumination light EL through the pattern of the reticle R and the projection optical system PL. : Step 11〇2 of injecting compressed air A1 into the vortex tube to generate cold air A5 and heating A3, and dividing the generated cold air A5 into the second cold air (cold air A7) and the second cold air, and the generated warm A 3 is divided into The i-th heating (heating A6) and the second heating step u〇3, depending on the temperature of the air-cooling A7 and the heating A3, the temperature of the air A28 (the first tempered air) controls the flow of the cold air A7 and the heating A3. 11〇8, the step of supplying the air A28 to the cylindrical member 61 of FIG. 8 and the mixing of at least a portion of the 37 201009512 2 cold air with the second heating air A29 (2nd tone) The warm air) is supplied to the temperature with a target control accuracy lower than that in the illumination system barrel 6 which is lower in the cylindrical member 61. Further, the exposure apparatus 10 includes a local air conditioning system including a third partial air conditioner 143 and a local air conditioning control system 137, and the third partial air conditioner 143 includes a scroll 45 and cold air A5 and heating A3 generated from the scroll 45. Divided into cold air A7 and second air-conditioning and heating A6 and second heating T-joints 52A and 52B, the air-type connector 52C that mixes the cold air A7 and the heating radiator, and at least a part of the second cold air and the second Heating © Mixed Υ connector 152D, temperature sensor 55C measuring the temperature of air A28 output from γ-type connector 52C, flow control valve for controlling the flow of cold air A7 and heating A6 depending on the measured value of temperature sensor 55C 153A, 15 3B, the air supply duct A is supplied to the air supply duct 44F of the cylindrical member 61, and the air A29 output from the Y-type joint 152D is supplied to the air supply duct 44R of the illumination system barrel 6. Therefore, the cold air and the warm air are generated from the compressed air by the vortex tube 45, and the mixing ratio of the cold air and the warm air is controlled to generate the temperature-controlled air, that is, G can be accommodated in a simple mechanism without using the refrigerant. Local temperature control is performed at 2 of the chamber 2. As a result, high exposure accuracy can be maintained. In addition, since the temperature control accuracy of the air A29 is set lower than the temperature control accuracy of the air A28, the flow rate of the cold air A7 and the heating A6 is first controlled in the third partial air conditioner 143 based on the temperature of the air A28. The configuration of the third partial air conditioner M3 can be simplified. Furthermore, since the air supply pipe 42 is generally equipped with a pressure 38 201009512 in a semiconductor component manufacturing factory or the like, the manufacturing cost of the third partial air conditioner 143 can be reduced. Further, the gas supplied to the scroll 45 does not have to be compressed air, and may be a gas having a volume smaller than that of a general gas. (2) The exposure method further includes the steps 11 05 and 1 1 06 for controlling the flow rate of the cold air A7 and the heating A6 depending on the measured value of the flow rate of the air A28. Therefore, the temperature and flow rate of the air A28 can be controlled within the set range. (3) Further, the air A28 supplied from the air supply duct 44F of Fig. 8 to the zero inside the cylindrical member 61, as shown in Fig. 12, flows through the space inside the cylindrical member 61 through the reticle stage RST. The space in the cover sheets 62 YA, 62YB, 62XA, 62XB provided around the reticle R is discharged from the gaps of the cover sheets 62YA, 62YB, 62XA, 62XB. As described above, since the air A28 does not hinder the flow of the temperature-controlled air ARY and ARX supplied to the optical paths of the laser interferometers 21RY and 21RX, the high measurement accuracy of the laser interferometers 21RY and 21RX can be maintained. (4) In this case, the air A28 is supplied in a downflow manner through the notch portion 61a between the illumination optical system ILS (the illumination system lens barrel 6) and the cylindrical member 61. Therefore, for example, minute foreign matter generated from the reticle R can be discharged from the floor FL side together with the air A28. [Third Modification] In the second embodiment, the two airs A28 and A29 controlled by the temperature of eight degrees from the third partial air conditioner 143 are supplied into the cylindrical member 61 and the illumination system barrel 6, but The two airs A28 and A29 may be supplied to any other area. For example, as shown in the deformation apparatus 600 of the modified form of FIG. 13, 201009512, the air A" is supplied from the third partial air conditioner 143 to the illumination system barrel 6 via the air supply duct 44p, and will be supplied via the air supply duct 44R. The air A29 is blown outside the control box 30 accommodating the heat source. In this case, the control accuracy of the temperature of the air A28 supplied to the illumination system barrel 6 is set to be higher than the temperature of the air A29 blown outside the control box 30. Further, in the deformation state, the air A29 is sprayed on the outside of the control box 3, and is the same as the second embodiment. Therefore, the structure and operation of the exposure apparatus will be omitted. In the first embodiment, the two airs A8 and A9 generated from the second partial air conditioning unit 43 or the second line A28 and A29 which are generated from the third partial air conditioner unit 143 1 in the second embodiment are used. The branch pipe is divided into two or more, and the divergent air is supplied to the portion supplied by the air A8, A9 in the third embodiment, or the portion other than the portion supplied by the air A28, A29 in the second embodiment, for example, Supply to standard The laser beam source or the af sensor 25 of the interferometer 21R and/or the wafer interferometer 21w and/or the signal processing system 26, 27 for the alignment system AL, etc. The reticle R which is heated and swelled is supplied with air which is described as knives. The portion of the air generated from the local air conditioning system is not limited to the above, and can be arbitrarily set. <Third Embodiment> Next, A third embodiment of the present invention will be described with reference to Fig. 14. The exposure apparatus and the exposure method of this embodiment are increased from the compressed air supplied from the compressed air supply s 42 of Fig. 1G using an air amplification technique. A cross-sectional view of a main part of the local air conditioner (fourth partial air conditioner 40 201009512) of the embodiment. In Fig. 14, the compressed air A1 drawn from the compressed air supply pipe 42 of Fig. 1 through the line 47 is supplied. The air inlet member 51 is formed by screwing the cylindrical outer cylinder 51A and the cylindrical inner cylinder 51B with the bolt portion 51Bb. The side surface of the outer cylinder 5 1A is formed. There are injection port 51 Aa, outer cylinder 5 1A The end portion different from the bolt portion 5 lBb is an external air suction port 5 1Ab, and is formed in communication between the step portion in the outer cylinder 51A and the end portion of the inner cylinder 51B in the vicinity of the outer air suction port 5lAb. The groove portion 51Ac having the inlet 51Aa and the width d is variable. The width of the groove portion 51Ac can be adjusted by adjusting the width of the outer cylinder 51A and the inner cylinder 51B. The inner cylinder 51B facing the outer air suction port 51 Ab The end portion is the discharge port 51Ba, and the temperature control object 162 is disposed to face the discharge port 51 through the air supply duct 261. The temperature control object 162 is, for example, the control box 30 or the light source unit 4 that houses the heat source of Fig. 8 . The configuration of the exposure apparatus other than this is the same as that of the embodiment of Figs. 1 and 8. In the embodiment, when the object 162 is locally cooled, the compressed air Ai is injected from the compressed air supply pipe 42 of Fig. 10 via the line 47 (the regulator 48R and the main flow control valve 48F are provided in the middle). The injection port 51 Aa of the air amplifying member 51 of Fig. 14. The injected compressed air a 1 is ejected to the inside of the inner cylinder 51B via the groove portion 5 1 Ac (slit portion) as indicated by an arrow A11. The air A21 around the negative pressure formed at the time of ejection is sucked into the inner cylinder 51B from the outside air suction port 51Ab as indicated by an arrow A22, and the flow rate of the compressed air A1 is substantially increased (amplifying step). The air A41 mixed with the ambient air A21 and the ambient air A21 flows through the interior of the air supply duct 261 of 201009512 and is sent to the temperature control pair 62 (supply step). Therefore, it is possible to perform local temperature control with a simple mechanism without using a long-term use of the refrigerant, and to use the air amplifying member 51 to pass the I-shrinking milk supply pipe 42 through the tube around the ι line 47. When the compressed air A1 is directly sprayed on the temperature control object 1 62, temperature control or cooling can be performed more efficiently. At this time, since the air A31 outside the end portion of the inner cylinder 51 is also leaned by the flow of the air A41, the air is blown to the temperature control object 162, so the temperature is controlled or cooled. Efficiency can be further improved. In this embodiment, the width d of the groove portion 51Ac of the air amplifying member 51 may be adjusted so that the temperature control efficiency of the temperature control target 162 is, for example, the temperature increase range within a predetermined time period is minimized. Further, in the above embodiment, the temperature control or cooling is performed using the compressed process gas obtained from the compressed air supply pipe 42, but compressed air generated by, for example, a compressor, a regulator, and a dustproof filter may be used. For temperature control or cooling

G is an embodiment in which the first partial air conditioner 41 and the second partial air conditioner 43 or the third partial air conditioner 143 are exposed. However, for the purpose of the present invention, the first partial air conditioner is omitted. This. In this case, the temperature-controlled air can be supplied by the second partial air conditioner local air conditioner at the place where the temperature-controlled air is originally supplied to the local air conditioner. Alternatively, instead of the local air conditioning unit, it is possible to use the first partial air conditioning unit (the second partial air conditioning unit or the third partial air conditioning unit) as described in the figure. . Further, in the above embodiment, air is used as an air-conditioning gas (for example, dry air), but an inert gas such as nitrogen or a rare gas (such as helium or neon) may be used instead of air. a mixed gas such as a gas. Further, as described above, the gas supplied to the scroll may not be a compressed gas (air), and may be, for example, a gas whose body is reduced to some extent as compared with a general gas. Further, when an electronic component (or a micro component) such as a semiconductor element is manufactured by using the exposure apparatus or the exposure method of the above embodiment, as shown in FIG. 15, the electronic component is subjected to the function and performance design of the electronic component. Step 222 of fabricating a mask (reticle) according to the design step, a step 223 of coating the substrate (wafer) of the component substrate, and a mask pattern by the exposure apparatus or the exposure method of the foregoing embodiment. a step of exposing to a substrate (inductive substrate), a step of developing the substrate after exposure, a substrate processing step 224 including a curing and etching process of the substrate after development, and a component assembly step (including a cutting step, a bonding step, and a packaging step) It is manufactured by the processing program 225, and the inspection step 226 and the like. φ Therefore, the manufacturing method of the component includes forming a pattern of a photosensitive layer on a substrate by using the exposure apparatus or the exposure method of the above embodiment, and processing the substrate on which the pattern is formed (step 224). According to the exposure apparatus or the exposure method, since the temperature of the exposure apparatus is controlled by using compressed air to reduce the frequency of maintenance, the electronic component can be manufactured with high precision and at low cost. Further, the present invention is not limited to the scanning exposure type projection exposure apparatus, and can be applied to an exposure using a single exposure type (stepper type) projection exposure apparatus. Further, the present invention is also applicable to exposure by an exposure apparatus or the like which does not use a projection optical system in a proximity mode or a contact mode. 43 201009512 Moreover, the present invention is also applicable to an exposure apparatus for projecting an image of a line and space pattern onto a wafer by forming an interference pattern on a wafer as disclosed in, for example, International Publication No. 2001/035168. (Vinition system). Further, the present invention is not limited to the application of the semiconductor element process, and can be widely applied to, for example, a process of forming a liquid crystal display element such as a square glass plate or a display device such as a plasma display, a photographic element (CCD, etc.), and a micro Processes for various components such as machines, MEMS (Microelectromechanical Systems), thin film magnetic heads, and DNA wafers. Further, the present invention is also applicable to a process for manufacturing a photomask (a mask, a reticle, etc.) in which a light-shielding pattern of various elements is formed by using a lithography process. The present invention is also applicable to, for example, Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. 6,590,634, A multi-stage type exposure apparatus having a plurality of stages as disclosed in the specification of No. 6, 208, 407, or the like, or, for example, Japanese Patent Laid-Open No. 1354 No. (and corresponding International Publication No. 1999/23692), special opening 2 〇 — 1645〇4

G disclosed in the Japanese Patent Publication No. 6,897,963, and the like, is provided with an exposure device having a measurement stage (reference mark, sensor, etc.). σ Further, in each of the above embodiments, the position of the reticle stage RST and the wafer stage WST is measured by the interferometer system, but the present invention is not limited thereto, and may be disclosed or deleted by, for example, the US special fund. The encoder system disclosed in No. 121 et al. measures the position of at least one of the reticle stage RST and the wafer stage. 44 201009512 In each of the above embodiments, you are old. Although it is used to form a reticle with a predetermined light-shielding pattern on a light-transmitting substrate, it is only a moon (first transmission type reticle), but it can also be used instead of such a light-transmitting ray mask. No. 6,778,257 describes an electronic reticle (variable shaped reticle) which forms a transmissive pattern or a reflective pattern or a luminescent pattern according to the electronic material of the pattern to be exposed. In addition, in the designated countries (or selected countries) designated by the International, please refer to the disclosures in the above-mentioned bulletins, international publications, US patents, and US patents. As part of the description of this manual. The present invention is not limited to the above-described embodiments, and various modifications may be made without departing from the scope of the invention. [Industrial Applicability] The exposure method and the exposure apparatus of the present invention can perform exposure while performing local temperature control or cooling with a simple mechanism without using a refrigerant such as fluorine gas. The production cost is very excellent in φ. Therefore, the present invention can make a significant contribution to the international development of the precision machine industry such as the semiconductor industry using exposure technology. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partially broken perspective view showing the configuration of an exposure apparatus according to an embodiment. 2 is a block diagram showing a control system of the exposure apparatus of FIG. 1. Fig. 3 is a block diagram showing the configuration of the second partial air conditioner (43) in Fig. 1. Figure 4 is a cross-sectional view showing the scroll 45 of Figure 3. 45 201009512 FIG. 5 is a flow chart showing an example of an air conditioning operation of one of the exposure devices. Fig. 6(A) is a partial cross-sectional view showing a main part of a first modification of the embodiment, and Fig. 6(B) is a cross-sectional view taken along line VIB-VIB of Fig. 6(A). Fig. 7 is a cross-sectional view showing a main part of a second modification of the embodiment. Fig. 8 is a partial cross-sectional view showing the configuration of an exposure apparatus according to a second embodiment. Figure 9 is a block diagram showing a control system of the exposure apparatus of Figure 8. The figure shows a block diagram of the configuration of the third partial air conditioner 143 in Fig. 8. Fig. 11 is a flow chart showing an example of an air-conditioning operation of the exposure apparatus of Fig. 8. Fig. 2 is a perspective view showing an arrangement example of one of the reticle stage stage and the reticle interferometer of Fig. 8. Fig. 13 is a partially cutaway view showing an exposure apparatus of a modified form. Fig. 14 is a cross-sectional view showing a main part of a local air conditioner according to a third embodiment. Figure 15 is a flow chart showing an example of a process of electronic components. [Main component symbol] 2 Containment chamber 2a Opening 6 Lighting system lens barrel 8 Main air conditioner !〇 ' 500 ' 600 Exposure unit 46 201009512

11 pedestal 12 lower frame 13 base member 14 and 15 anti-vibration table 16 optical system frame 18R first duct 18W second duct 19R &gt; 19W air supply unit 20 main control unit 21R reticle interferometer 21RY reticle stage Y-axis laser interferometer 21WY Y-axis laser interferometer for wafer stage 21 W wafer interferometer 22R reticle stage stage drive system 22W wafer stage drive system 24 linear motor 25 AF sensor 25a illumination system 25b light receiving System 26 signal processing system 28 liquid supply device 29 liquid recovery device 30 control box 35 main air conditioning control system 47 201009512 37 control box air conditioning control system 40 air conditioning air supply pipe 41 first partial air conditioning device 42 compressed air supply pipe 43 second partial air conditioning Device 44 gas supply conduits 44a, 44b divergent conduit 45 vortex tube 45a supply port 45c '45d exhaust port

46 throttle valve 47, 49A~49C, 50A~50C, 158 line 48F, 53A, 53B flow control valve 48R pressure smoothing regulator 51 air amplifying member

5 1A Outer tube 51B Inner tube 51Aa Injection port 5 1 Ab Outer air suction port 51 Ac Groove portion 5IBa Spray port 52A, 52B, 52D T-joint 52C ' 152D Y-joint 53A to 53D 1st to 4th flow control valve 48 201009512 54A, 54B check valves 55A to 55D, 55M temperature sensors 56A to 56D, 56M flow sensor 57 exhaust ducts 57C, 57D pressure sensor 58 heat sink 58a air supply port 58b exhaust port 58c ' 58d ' 58e Partition plate 62 Cover part 62YA, 62YB, 62XA, 62XB Cover piece 137 Partial air conditioning control system 143 Third partial air conditioning unit 153A to 153C First to third flow control valve 162 Temperature control target 261 Air supply duct 1000 Exposure Unit body A1 Compressed air A3 ' A6 Heating A5, A7 Air-conditioning A8, A9, A28, A29 Air FL Floor ILS Illumination optical system PL Projection optical system 49 201009512 R Marking sheet RST Marking wafer stage W Wafer WST Wafer stage

Claims (1)

201009512 VII. Patent application scope: The exposure method is an exposure illumination illumination pattern, and the exposure light is used to expose an object through the pattern, which comprises: injecting gas into the vortex tube; adjusting air-conditioning generated from the gyrotron tube a mixing ratio with the heating to generate a temperature controlled gas; and supplying the temperature controlled gas to or near the heat source. 2. The exposure method of claim 1, wherein the gas system of the vortex is injected into the compressed gas. 3. The exposure method of claim 1, wherein adjusting the mixing ratio of the cold air and the heating generated from the thirsty coil to generate the temperature-controlled gas includes adjusting the flow rate of the cold air and the heating separately mixing ratio. 4. The exposure method according to any one of claims 1-3, wherein the act of supplying the gas is to blow the temperature-controlled gas nozzle to the heat source or a member accommodating the heat source. 5. The exposure method according to any of the preceding claims, wherein the supply of the gas supplies the temperature-controlled gas to a heat sink disposed adjacent to the heat source. 6. The exposure method according to any one of clauses 5, wherein the supply of the gas is to supply the temperature-controlled gas to a chamber adjacent to the first chamber containing the heat source via a partition wall. Room 2. 7. The method of exposure of claim 6, wherein the supply of the gas comprises mixing a gas flowing through the first chamber with a gas flowing through the second chamber and venting the gas. The method of exposing the invention according to the invention, wherein the temperature-controlled gas is supplied to or near the heat source while the object is exposed to light through the pattern. 9. The exposure method of claim 1 or 8, further comprising: dividing the cold air and the heating generated from the vortex tube into a second air conditioner and a second air conditioner, respectively, and the first and second heating heaters; Temperature information of the first cold air and the second gas of the second heating unit 'control the flow rate of the first cold air and the first warm air; · supply the first gas to the first temperature control region; and mix the first The second gas of at least a part of the cold air and at least one of the second heating units is supplied to a second temperature control region different from the second temperature control region. 10. An exposure apparatus for illuminating a pattern with an exposure light, wherein the exposure light is transmitted through the pattern to expose an object, comprising: a vortex tube for generating cold and heating by compressing gas injected from a compressed gas source; a gas mixing portion that mixes the cold air generated from the vortex tube with the heating mixture at a variable mixing ratio, and outputs a temperature-controlled gas gas and a gas supply path to supply the temperature-controlled gas to the gas source nearby. 11. The exposure apparatus of claim 10, wherein: the temperature sensor is used to measure the temperature information of the gas mixed with the variable mixing ratio 52 201009512; and the control unit' The mixing ratio at the gas mixing portion is controlled based on the amount information of the temperature sensor. 12. The exposure apparatus of claim U, wherein the gas mixing unit includes a t-th power control unit that controls the flow of the cold air, a second flow control unit that controls the flow of the heating, and the i-th and a mixing unit that mixes the gas outputted by the second flow rate control unit; and a flow rate sensor that measures flow information of the gas mixed by the mixing unit, and the control unit measures the temperature sensor according to the temperature sensor and the flow sensor The information 'controls the flow rate of the gas in the first and second flow rate control units. 13. The exposure apparatus of any one of claims 1 to 12 wherein the discharge port of the gas supply path is disposed toward the inside of the heat source or a member accommodating the heat source. 14. The exposure apparatus according to any one of claims 1 to 12, wherein the exposure apparatus has a heat dissipating device disposed near the heat source; and the discharge port of the gas supply path is decelerated to the heat dissipating device. 15. The exposure apparatus according to any one of claims 12, further comprising: a first chamber including the heat source; and a second chamber adjacent to the first chamber via the partition wall; The supply of fluorine is supplied to the second room. 16. The exposure apparatus according to the fifteenth aspect of the patent application, comprising: an exhaust passage for mixing a gas flowing through the first chamber and a gas flowing through the second chamber to exhaust the gas. The invention relates to an exposure apparatus of any one of the first to sixth aspects of the invention, wherein the exposure apparatus comprises an exposure apparatus body and a housing chamber for accommodating the main body, and the heat source is an exposure apparatus body housed in the housing chamber. Part of it. [18] The exposure apparatus of claim 17, further comprising: an air conditioner that supplies a temperature-controlled gas to the accommodation chamber, wherein the control unit controls the temperature of the gas output from the gas mixing unit to The temperature of the gas supplied from the air conditioner is lower. 19. The exposure apparatus of claim 17 or 18, wherein the thirst coil and the gas mixing portion are disposed outside the housing chamber. 20. The exposure apparatus according to any one of claims 1 to 17, wherein the first and second separation portions are configured to separate the cold air generated from the vortex tube from the heating unit. The first and second cold air and the first and second heating units; the first mixing unit respectively mixes the first cold air with the first heating unit; and the second mixing unit 'at least a part of the second cold air and the first heating unit 2 at least a part of the warm beta gas is mixed; a temperature sensor is used to measure the temperature information of the first gas outputted from the first mixing unit; and the control unit controls the first information based on the measurement information of the temperature sensor Cooling and the flow rate of the first heating; the first gas supply path supplying the first gas to the first temperature control region; and 54 201009512 the second gas supply path, supplying the second mixing portion wheel to the first In the i-th, the Japanese β u u 心 心 心 心 心 乳 乳 乳 乳 乳 乳 乳 乳 乳 乳 乳 乳 乳 乳 乳 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第The service supply system is configured to supply the temperature-controlled gas locally to the injection. The light path of the light for exposure of the pattern; the method for controlling exposure is a method for exposing an object by exposing the light to the object by using the light pattern for exposure, which comprises: The gas is injected into the vortex tube; the cold air and the heating generated from the vortex tube are respectively divided into 帛1 and the second cold air and the first and second heating units; the i-th cold air is mixed with the first heating unit Temperature information of the gas, controlling the flow rate of the first cold air and the first heating; supplying the first gas to the first temperature control region; and mixing at least a portion of the second cold air with at least the second heating - The target control accuracy of the portion of the second gas supply to the temperature is lower than the second temperature control region of the first temperature control region. 3. The exposure method of claim 22, wherein the control controls the flow rate of the third cooling gas and the first heating according to temperature information and flow information of the first gas. 24. The exposure method of claim 22, wherein the first temperature control region includes a region on the mask on which the pattern is formed; and the second temperature control region includes illuminating the exposure light The area of the optical path of at least a portion of the illumination optics of the pattern. 25. The exposure method of claim 24, wherein the temperature control region of the first 55 201009512 includes a partition wall portion disposed at the exposure end of the illumination optical system, and the spacer portion disposed on the photomask The area surrounded by the side members of the illumination optics. The exposure method of claim 25, wherein the supplying the first gas to the first temperature control region comprises flowing the second gas from the illumination optical system to the partition wall portion The way is supplied to the room: inside the wall. 27. The exposure method of any one of clauses 22 to 26, further comprising controlling the flow rate of the second cold gas 视 based on the temperature information of the second gas. 28. The exposure method according to any one of claims 22 to 27, wherein the temperature-controlled first gas and second gas are respectively exposed while the exposure light passes through the pattern to expose the object It is supplied to a second temperature control area different from the second temperature control area. 29. An exposure apparatus for illuminating a pattern by exposure light, wherein the exposure light is transmitted through the pattern to expose an object, the method comprising: a vortex tube for injecting gas into a gas source to generate cold air and heating; a separating unit for dividing the cold air generated from the scroll into the first and second cold air and the first and second heating, respectively; and the first and second mixing units, respectively, the first cold air Mixing with the first heating unit, mixing at least a portion of the second cooling air with at least a portion of the second heating unit; and a temperature sensor for measuring temperature information of the first gas outputted from the first mixing unit; 56 201009512 The control unit controls the flow rate of the third cooling air and the first heating unit according to the measurement information of the temperature sensor; and the first gas supply path for supplying the first gas to the ith temperature control area And the second gas supply path, the target control accuracy for supplying the second emulsion outputted from the second mixing unit to the temperature is higher than the first! The second temperature control area where the temperature control area is low. _ 3〇 · The exposure device of claim 29, which has a flow sensor for measuring flow information of the first gas; the control unit, depending on the temperature sensor and the measurement information of the flow sensor The flow rate of the first cold air and the first heating is controlled. 31. The exposure apparatus of claim 29 or 3, further comprising an illumination optical system for illuminating the pattern with the exposure light, the gradation control region comprising an area on the reticle forming the pattern The second temperature control region is a region including at least a portion of the optical path of the illumination optical system. The exposure apparatus of claim 31, further comprising: a partition wall portion provided at the exposure light emitting end of the illumination optical system; and a cover member provided on the illumination optical system side of the photomask. The second temperature control region includes the partition wall portion and a region surrounded by the cover member. 33. The exposure apparatus of claim 32, wherein the discharge port of the first gas supply path is disposed between the illumination optical system and the partition wall portion. 34. The exposure apparatus according to any one of claims 29 to 33, wherein the exposure apparatus includes an exposure apparatus main body and a housing chamber for housing the main body, the first temperature control area and the second temperature control The area is housed in a portion of the body of the exposure apparatus in the housing chamber. The exposure apparatus according to any one of claims 29 to 34, further comprising an air conditioner that supplies a temperature-controlled gas to the accommodation chamber, the control unit is a gas that is to be output from the gas mixing unit The temperature is controlled to be lower than the temperature of the gas supplied from the air conditioner. 36. The exposure apparatus of claim 35, further comprising an air conditioning control device for performing local air conditioning control at a portion different from the first temperature control region and the second temperature control region in the storage chamber. 37. An exposure method of exposing an object to an exposure light, wherein the exposure light passes through the pattern to expose an object, comprising: generating a negative pressure when the compressed gas is ejected through the slit portion to absorb the surrounding gas; a gas that increases the flow rate; and supplies the increased flow rate gas to or near the heat source. 3. The exposure method of claim 37, wherein the gas having an increased flow rate is supplied to or near the heat source while the exposure light is transmitted through the pattern to expose the object. 39. A method of manufacturing a component, comprising: an action of forming a pattern of a photosensitive layer on a substrate using an exposure method as disclosed in claims 1 to 9, 22 to 28, 37 or 38; and forming the pattern The action of processing the substrate. 40. An exposure apparatus for exposing an exposure light to an object by exposing the exposure light to the object, the method comprising: 58 201009512 a pipeline for guiding a compressed gas from a compressed gas source; a gas amplification unit, The injection port through which the gas is injected through the line, the groove portion connected to the injection chamber, the gas suction port disposed adjacent to the groove portion, and the gas flowing out from the groove portion and the gas discharged from the groove portion The external air suction port sucks a discharge port of the external air; and the gas supply path ' serves to supply the gas ejected from the gas amplification portion to the heat source or the vicinity thereof. The exposure apparatus of claim 4, wherein the width of the groove portion of the gas amplifying portion is adjustable. 42. A method of manufacturing a component, comprising: an action of forming a photosensitive layer pattern on a substrate using an exposure apparatus according to any one of claims 1 to 21 '29 to 36, 40 or 41; forming from a pair The substrate of the pattern is processed. Eight, the pattern: (such as the next page) 59