201009346 九、發明說明： 【發明所屬之技術領域】 本發明係有關一種微型探針結構，尤指一種具有爪狀 之探針俾供量測之微型探針結構。 【先前技術】 按’未來晶片尺寸將會繼續朝微小化的目標前進，因 此晶片尺片也會逐漸的縮小，其中又以覆晶封裝 參 （FliP~Chip)的方式最符合小尺寸晶片的封裝技術，由於 覆晶封裝的輸出接腳位於晶片的正下方，因此所做出的晶 片其大小與原先積體電路所設計的面積大致相同，由於覆 晶封襄輸出腳位具有小間距（ Fine pitch)與多腳數（則幼201009346 IX. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD The present invention relates to a microprobe structure, and more particularly to a microprobe structure having a claw-shaped probe for measurement. [Prior Art] According to the 'future wafer size, it will continue to move toward the goal of miniaturization, so the chip size will gradually shrink, and the FliP~Chip is the most suitable package for small-sized wafers. According to the technology, since the output pin of the flip chip package is located directly under the wafer, the size of the wafer is substantially the same as that of the original integrated circuit, because the flip chip output pin has a small pitch (fine pitch ) and the number of feet (then young)
Pin Count)的特性’因此對於後續的電性量測上將會是一 大挑戰。 覆日曰封裝的輸出接腳目前所使用的材料多為球狀之錫 材料（目前因環保因素，歐盟已禁用具有船的材料，已改 為錫銀…等合金），在晶片製作完成後，電性量測方式即透 過探針與m相接觸，以麟電路導通與否。 如第8圖所示’為習用之探針結構及其使用狀態示 、由於I用之探針9係為一尖針桿，當探針9與锡球g 接觸探測時，是將探針9之針尖9 1直減人錫球8之 中’因此在量測完畢探針9拔離後，會於錫球8上產生一 凹洞81之缺陷’為了消除此缺陷會進行再次回熔的動 201009346 讓锡球8回復到無缺陷的狀態，但在回溶的過程之中， 若無法，實該凹洞81時，常會有氣泡產生被包覆在錫球 8的内°卩’此氣泡將會影響到導電特性與使用壽命。 因此，如何解決上述習用探針9結構之問題即為本發 明之重點所在。 【發明内容】 本發明之主要目的，在於解決上述的問題而提供-種 ❿微型探針結構，其係於本體之探測面上設有至少二具有繞 5且變折之探爪，目此’藉由綠之探爪麟球進行量測 * ’係以探爪朗錫球之表面，不會對錫球造成凹洞的破 #故”、、須如習用探針於探測後必須回熔，因此不會有產 生氣泡而影響導電特性以及使用壽命之問題。 本發明之再一目的，在於探針具有爪狀結構之探爪， 且各=爪具有触’因此不論輸ϋ接腳之錫球形狀以及大 小不時’探爪冑可確實接酬财相較於習用之探測 方式必彡I準確的對應輸出接腳之探測點而言，本發明所提 供之微型探針結構，其探測方式更為容易且精準。 為達前述之目的，本發明係包括： 一本體，該本體具有至少一探測面，該探測面由中心 向外延伸至少二具撓性之探爪，各該探爪相對連接該探測 面之-端係分別為一針尖端，各該針尖端係分別相對該探 測面之方向弯曲，以供形成一爪狀之態樣，且各該探爪相 對該探測面之側面係分別為一接觸面，以供與被探測物接 201009346 觸’而各該探爪係與外部電性連接。 本發明之上述及其他目的與優點，不難從下述所選用 實施例之詳細說明與附圖中，獲得深入了解。 當然，本發明在某些另件上，或另件之安排上容許有 所不同，但所選用之實施例，則於本說明書中，予以詳細 說明’並於附圖中展示其構造。 【實施方式】 請參閱第1圖及第2圖，圖中所示者為本發明所選用 參之實施例結構，此僅供說明之用，在專利申請上並不受此 種結構之限制。 本實施例提供一種微型探針結構，其係包括： 1之侧面係為一接觸面1 2 2， 各該探爪12係與外部電性連接， 面11由中心向外延伸四等距分相 一本體1，該本體1具有至少一探測面丄丄，該探測 面1 1由中心向外延伸至少二具撓性之探爪丄2，各該探 爪1 2相對連接該探測面工工之一端係為一針尖端工2 1 ’各該針尖端121係相對該探測面1 1之方向變曲， 春以供形成一爪狀之態樣，且各該探爪12相對該探測面1 ’以供與被探測物接觸，而The characteristics of Pin Count) will therefore be a major challenge for subsequent electrical measurements. The current output pins of the 曰 曰 package are mostly spherical tin materials (currently due to environmental factors, the EU has banned materials with ships, which have been changed to tin-silver...), after the wafer fabrication is completed, The electrical measurement method is to contact the m through the probe to turn on or off the circuit. As shown in Fig. 8, 'for the conventional probe structure and its use state, since the probe 9 for I is a sharp needle rod, when the probe 9 is in contact with the solder ball g, the probe 9 is The needle tip 9 1 is directly reduced in the human solder ball 8 'so that after the probe 9 is removed, a defect of the recess 81 is generated on the solder ball 8 'to re-melt in order to eliminate the defect 201009346 Let the solder ball 8 return to the state of no defect, but in the process of remelting, if it is not possible, when the hole 81 is actually formed, there will often be bubbles generated inside the solder ball 8 卩 'this bubble will Will affect the conductivity and service life. Therefore, how to solve the above problem of the structure of the conventional probe 9 is the focus of the present invention. SUMMARY OF THE INVENTION The main object of the present invention is to solve the above problems and provide a ❿ micro-probe structure which is provided on the detecting surface of the body with at least two prongs having a winding around 5 and folding. The measurement is carried out by the green stalking ball*'s to detect the surface of the stalking sill ball, which will not cause the hole to break the hole. Therefore, it must be melted back after the probe is used. Therefore, there is no problem that bubbles are generated to affect the conductive characteristics and the service life. A further object of the present invention is that the probe has a claw-like structure, and each of the claws has a touch, so that the solder ball regardless of the pin Shape and size from time to time 'probing the claws can be sure to receive money compared to the conventional detection method must be the exact corresponding output pin detection point, the micro-probe structure provided by the present invention, the detection method is more For the purposes of the foregoing, the present invention comprises: a body having at least one detecting surface extending outwardly from the center by at least two flexible prongs, each of the prongs being relatively connected The end of the detection surface The tip of each of the needles is bent relative to the direction of the detecting surface for forming a claw-like state, and each of the detecting claws is a contact surface with respect to the side of the detecting surface for The above-mentioned and other objects and advantages of the present invention are not difficult to obtain from the detailed description and the accompanying drawings of the selected embodiments described below. Of course, the present invention may be different in some of the components, or the arrangement of the components, but the selected embodiments are described in detail in the present specification 'and the construction thereof is shown in the drawings. MODE FOR CARRYING OUT THE INVENTION Please refer to Fig. 1 and Fig. 2, which shows the structure of the embodiment selected for the present invention, which is for illustrative purposes only and is not limited by this structure in the patent application. The embodiment provides a micro-probe structure, which comprises: 1 is a contact surface 1 2 2, each of the probes 12 is electrically connected to the outside, and the surface 11 is extended outward from the center by four equidistant phase separation. Ontology 1, the body 1 has at least one probe In the face, the detecting surface 11 extends outward from the center by at least two flexible claws 2, and each of the detecting claws 1 2 is connected to the detecting surface. The needle tip 121 is curved relative to the direction of the detecting surface 1 1 to form a claw-like shape, and each of the detecting claws 12 is opposite to the detecting surface 1 ′ for contact with the object to be detected.
201009346 為使本發明之探針達微型之結構，係可以體型微加工 或面里微加工技術來製作，在本實施例中，係以體型微加 工技術製作，如第3圖所示，該本體1係以高阻值雙拋< 100>石夕晶圓材料製作，且經由清洗及去水份之前置處理。 首先以熱成長方式，於該本體1之探測面11上形成 層:氧化發之薄膜111，實務上係將砍晶片之本體1 置於商溫之爐管中，並控制該本體1於爐管内之時間，以 ❹成長該薄膜1 1 1，並於形成該薄膜1 1 1後，於該本鳢 1上預先製作與外部電性連結的導體i 5，該導體i 5係 貫穿該本體1及該薄膜111設置。 接著開始進行探爪1 2的製程步驟，先利用微影及蝕 刻技術對該薄膜1 1 1定義出探爪1 2的形狀與大小，以 及供蝕刻之缺口1 12，之後利用該缺口1 12對該本體 1進行非等向性蝕刻，而於該本體丄對應該探爪丄2形狀 之下方蝕刻出一凹槽14,使該凹槽上方探爪12形狀之 鲁’專膜111A成懸浮狀態。 之後’再沉積二層具有不同張應力之金屬層1 3 1 A 、131B於該薄膜工工工上，以供形成該導電層工3， 該二層金屬層131A、131B可供作為導電層1 3之 外，更使懸浮之薄膜1 1 1A受金屬層1 3 1 A、1 3 1 B二種不同殘餘應力作用而產生形變，使懸浮之薄膜1工 1A之懸浮端向上翹起，而形成爪狀之探爪1 2結構，如 此探爪1 2即製作完成；另沉積於其餘薄膜丄丄丄上之導 電層1 3則會連結先前製作之導艎1 5，以供與外部電性 201009346 連結，各該探爪1 2即可以該導電層13與外部電性連結 0 菖元成爪狀之探爪1 2製作，後續可於探爪1 2上透 過其它之製程技術，例如電鑄技術在探2上再電鑄一 層電鑄鎳1 6，以提高探爪1 2結構的鋼性；此外，也可 於探爪的針尖端沉積一層耐磨材料例如鎢，以減少針尖的 磨耗。 上述之探爪結構係以體型微加工技術製作完成，當然 ©可、以面型微加工技術來製作，如第4圖所示，圖中所示係 以面型微加工技術製作完成之探爪結構，其同樣可於一本 體1A之一探測面1 i八上，製作出由中心向外延伸且彎 曲之四探爪1 2 A。201009346 In order to make the probe of the present invention have a micro-structure, it can be fabricated by bulk micro-machining or in-situ micro-machining technology. In this embodiment, it is fabricated by bulk micro-machining technology, as shown in Fig. 3, the body The 1 series is made of high-resistance double-throwing <100> Shixi wafer material, and is processed by washing and de-watering. Firstly, a layer is formed on the detecting surface 11 of the body 1 by a thermal growth method: a thin film 111 of oxidized hair is formed. In practice, the body 1 of the chopped wafer is placed in a furnace tube of a commercial temperature, and the body 1 is controlled in the furnace tube. In the meantime, the film 111 is grown by ❹, and after the film 11 1 is formed, a conductor i 5 electrically connected to the outside is preliminarily formed on the body 1 , and the conductor i 5 is inserted through the body 1 and This film 111 is provided. Then, the process of detecting the claws 1 is started. First, the shape and size of the probes 1 2 and the notches 1 12 for etching are defined by the lithography and etching techniques, and then the gaps 12 12 are used. The body 1 is anisotropically etched, and a recess 14 is etched under the shape of the body 丄 corresponding to the 丄2, so that the shape of the probe 12 above the groove is in a suspended state. Then, two layers of metal layers 1 3 1 A and 131B having different tensile stresses are deposited on the film workman to form the conductive layer 3, and the two metal layers 131A and 131B are available as the conductive layer 1 In addition to 3, the suspended film 1 1 1A is deformed by two different residual stresses of the metal layer 1 3 1 A, 1 3 1 B, and the suspension end of the suspended film 1A is lifted upward to form The claw-like claws 1 2 structure, so that the protuberances 1 2 are completed; the conductive layer 13 deposited on the remaining film crucibles is connected to the previously fabricated guides 15 for external electrical 201009346 The connecting, each of the detecting jaws 1 2 can be made by the conductive layer 13 and the externally electrically connected 0-claw-shaped claws 1 2 , and then can pass through other processing techniques on the detecting claws 1 2 , for example, electroforming technology. A layer of electroformed nickel 1.6 is electroformed on the probe 2 to improve the rigidity of the structure of the probe 12. In addition, a wear-resistant material such as tungsten may be deposited on the tip of the probe to reduce the wear of the tip. The above-mentioned claw structure is made by the body micromachining technology. Of course, it can be made by surface micromachining technology. As shown in Fig. 4, the figure is made by the surface micromachining technology. The structure can also be formed on one of the detecting faces 1 i of one of the bodies 1A to form four claws 1 2 A extending outward from the center and curved.
當然，本發明仍存在許多例子，其間僅細節上之變化 。請參閱第5圖，其係本發明之第二實施例，其中可運用 本發明之探針結構作成探針卡結構，其包括有一本體工B ❹’該本體1 B具有多數之探測面η B，各該探測面丄丄 B分別由中心向外延伸具撓性之四探爪i 2 B，各該探爪 12B相對連接各該探測面i1B之-端係為—針炎端工 2 1B，各該針尖端1 2 1 B係相對各該探測面i i B之 方向f曲，以供形成-爪狀之態樣，且各該探爪丄2 B相 對該探測面1 1B之侧面係為一接觸面1 2 2 B ’以供與 被探測物接觸，而各該探測面丄丄B之各探爪i 2b係分 別與外部電性連接，在本實額中，同樣係以前述體型微 加工方式製成，但為使各該探測面i i B之各探爪i 2 B 201009346 多增加一電』=2 :的製:步驟完成後製 =:r射切割技術，將各 ==::2b與相鄰探爪1 一 -探測面對形成數探測面11B，且每 15 b，以供與別連結先前製作之導體 ❹ 爪12b分別與外部電性=。，使各該探測面iiB之探 型探時音請參閱第7圖，其係本發明之微 ㈣本:施例中，係以球狀錫 為H巾可知，本發明之探針 :二τ移動座（圖中未示）h該移動座係帶動該探 針之探爪1 2向被探測物之輸出接腳2移動，使探爪工2 與輸出接腳2表面接觸，藉此而量測受測接點之電路是否 導通。 由此可見，其相較於習用以針狀之探針，係以接觸式 與輸出接腳電性連接，而非以侵入式，因此不會對於輸出 接腳產生凹洞的破壞，故不需再進行填補之後續動作，當 然不會導致氣泡產生而影響導電特性以及使用壽命。 在實際操作時，若輸出接腳之表面因與探針摩擦的關 係產生些許之刮傷，而需要回熔時，因該刮傷係位於輸出 接腳的表面’而不是凹陷至内部，故在回熔時，並不會有 氣泡產生的問題。 再者，本發明之探針具有爪狀結構之探爪，且各探爪 201009346 具有撓性，因此不論輸出接腳之錫球形狀以及大小不一時 ，探爪皆可確實接觸到錫球，相較於習用之探測方式必須 準確的對應輸出接腳之探測點而言，本發明所提供之微型 探針結構’其探測方式更為容易且精準。 以上所述實施例之揭示係用以說明本發明，並非用以 限制本發明，故舉凡數值之變更或等效元件之置換仍應隸 屬本發明之範疇。 由以上詳細說明’可使熟知本項技藝者明瞭本發明的 ❿確可達成前述目的，實已符合專利法之規定，爰提出專利 申請。 【圖式簡單說明】 第1圖係本發明之立體外觀圖 第2圖係本發明之立體剖視囷 第3圖係本發明之製作流程示意圖 第4圖係本發明以面型微加工技術製作出探針之立體外 $ 觀圖 第5圖係本發明製成探針卡之立體外觀圖 第6圖係本發明製成探針卡之剖視圖 第7圖係本發明量測時之動作示意圖 第8圖係習用微型探針結構之電路量測示意圖 【主要元件符號說明】 (習用部分） 錫球8 11 201009346 凹洞8 1 探針9 (本發明部分)Of course, there are still many examples of the present invention with only minor changes in detail. Please refer to FIG. 5, which is a second embodiment of the present invention, wherein the probe structure of the present invention can be used as a probe card structure, which comprises a body B ❹ 'the body 1 B has a plurality of detecting faces η B Each of the detecting faces 丄丄B extends outwardly from the center to have four flexible probes i 2 B, and each of the detecting claws 12B is connected to the end of each detecting surface i1B as a needle end 2 1B. Each of the needle tips 1 2 1 B is curved with respect to the direction f of each of the detecting faces ii B for forming a claw-like state, and each of the detecting jaws 2 B is opposite to the side of the detecting surface 1 1B. The contact surface 1 2 2 B ' is in contact with the object to be detected, and each of the probes i 2b of each of the detecting faces B is electrically connected to the outside, and in the present embodiment, the body is also micromachined. The method is made, but in order to increase the number of each of the probes i 2 B 201009346 of the detection surface ii B by a system of electricity = 2:: after the step is completed =: r-cutting technology, each ==::2b The number of detecting faces 11B is formed with the adjacent detecting jaws 1 and the detecting faces 11B, and each of the 15bs is separately connected to the previously fabricated conductor claws 12b and externally electrically. For the probe detection time of each of the detection surfaces iiB, please refer to FIG. 7 , which is a micro (four) version of the present invention. In the embodiment, the spherical tin is a H-shaped towel, and the probe of the present invention: two τ a moving seat (not shown) h moves the probe 12 to move the probe 1 2 of the probe to the output pin 2 of the object to be detected, so that the probe 2 contacts the surface of the output pin 2, thereby Measure whether the circuit of the tested contact is conducting. It can be seen that compared with the probe used for the needle, the contact type is electrically connected to the output pin instead of the intrusive type, so that no damage to the output pin is caused, so no need is needed. The follow-up action of the filling is of course not caused by the generation of bubbles, which affects the conductive properties and the service life. In actual operation, if the surface of the output pin is slightly scratched due to friction with the probe and needs to be remelted, since the scratch is located on the surface of the output pin instead of being recessed to the inside, When remelting, there is no problem with bubbles. Furthermore, the probe of the present invention has a claw-like structure, and each of the probes 201009346 has flexibility. Therefore, regardless of the shape and size of the solder balls of the output pins, the probes can surely contact the solder balls. Compared with the detection method of the conventional output pin, the micro-probe structure provided by the present invention is easier and more accurate. The above description of the embodiments is intended to be illustrative of the invention, and is not intended to limit the scope of the invention. From the above detailed description, it will be apparent to those skilled in the art that the present invention can be achieved by the present invention, which is in accordance with the provisions of the Patent Law. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of the present invention. FIG. 2 is a perspective view of the present invention. FIG. 3 is a schematic diagram of a manufacturing process of the present invention. FIG. 4 is a schematic view of the present invention. Fig. 5 is a perspective view of a probe card made in the present invention. Fig. 6 is a cross-sectional view showing a probe card made in the present invention. Fig. 7 is a schematic view showing the operation of the present invention. 8 Figure is a schematic diagram of the circuit measurement of the conventional micro-probe structure [Main component symbol description] (customized part) Tin ball 8 11 201009346 Cavity 8 1 Probe 9 (part of the present invention)
本體1、1A、1 B 探測面11、11A、11B 薄膜1 1 1、1 1 1 A 缺口 1 1 2 ©探爪12、12A、12B 針尖端1 2 1、1 2 1 B 接觸面122、122B 導電層1 3、1 3 B 金屬層1 3 1 A、1 3 1 B 隔絕槽1 3 2 凹槽1 4 導體1 5、1 5 B φ 電鑄鎳1 6 12Body 1, 1A, 1 B Detection surface 11, 11A, 11B Film 1 1 1 , 1 1 1 A Notch 1 1 2 © Probe 12, 12A, 12B Needle tip 1 2 1 , 1 2 1 B Contact surface 122, 122B Conductive layer 1 3, 1 3 B Metal layer 1 3 1 A, 1 3 1 B Insulation groove 1 3 2 Groove 1 4 Conductor 1 5, 1 5 B φ Electroformed nickel 1 6 12