TW201005757A - Compositions containing submicron particles used in conductors for photovoltaic cells - Google Patents

Compositions containing submicron particles used in conductors for photovoltaic cells Download PDF

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Publication number
TW201005757A
TW201005757A TW098118104A TW98118104A TW201005757A TW 201005757 A TW201005757 A TW 201005757A TW 098118104 A TW098118104 A TW 098118104A TW 98118104 A TW98118104 A TW 98118104A TW 201005757 A TW201005757 A TW 201005757A
Authority
TW
Taiwan
Prior art keywords
composition
silver
micron
rti
weight
Prior art date
Application number
TW098118104A
Other languages
English (en)
Chinese (zh)
Inventor
Haixin Yang
Roberto Irizarry
Patricia J Ollivier
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of TW201005757A publication Critical patent/TW201005757A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00—Individual photovoltaic cells, e.g. solar cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photovoltaic Devices (AREA)
  • Conductive Materials (AREA)
  • Inorganic Insulating Materials (AREA)
TW098118104A 2008-05-28 2009-06-01 Compositions containing submicron particles used in conductors for photovoltaic cells TW201005757A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US5659208P 2008-05-28 2008-05-28

Publications (1)

Publication Number Publication Date
TW201005757A true TW201005757A (en) 2010-02-01

Family

ID=40934192

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098118104A TW201005757A (en) 2008-05-28 2009-06-01 Compositions containing submicron particles used in conductors for photovoltaic cells

Country Status (7)

Country Link
US (1) US8128846B2 (enExample)
EP (1) EP2294584A1 (enExample)
JP (1) JP2011524068A (enExample)
KR (1) KR20110014675A (enExample)
CN (1) CN102017014A (enExample)
TW (1) TW201005757A (enExample)
WO (1) WO2009146348A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008032554A1 (de) * 2008-07-10 2010-01-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Metallhaltige Zusammensetzung, Verfahren zur Herstellung von elektrischen Kontaktstrukturen auf elektronischen Bauteilen sowie elektronisches Bauteil
US20100301479A1 (en) * 2009-05-28 2010-12-02 E. I. Du Pont De Nemours And Company Devices containing silver compositions deposited by micro-deposition direct writing silver conductor lines
ZA201208302B (en) * 2011-11-09 2014-10-29 Heraeus Precious Metals Gmbh Thick film conductive composition and use thereof
KR101411012B1 (ko) * 2011-11-25 2014-06-24 제일모직주식회사 태양전지 전극용 페이스트 및 이를 이용한 전극 및 태양전지
CN103390444A (zh) * 2013-07-31 2013-11-13 广东风华高新科技股份有限公司 片式电阻器用无铅面电极浆料
EP2918371A1 (en) * 2014-03-11 2015-09-16 Heraeus Precious Metals North America Conshohocken LLC Solderable conductive polymer thick film composition
GB201520060D0 (en) * 2015-11-13 2015-12-30 Johnson Matthey Plc Conductive paste and conductive track or coating

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5403376A (en) * 1992-03-18 1995-04-04 Printron, Inc. Particle size distribution for controlling flow of metal powders melted to form electrical conductors
US5378408A (en) * 1993-07-29 1995-01-03 E. I. Du Pont De Nemours And Company Lead-free thick film paste composition
JP3854103B2 (ja) * 2001-06-28 2006-12-06 住友ベークライト株式会社 導電性ペースト及び該ペーストを用いてなる半導体装置
AU2002324775A1 (en) 2001-08-23 2003-03-10 Sciperio, Inc. Architecture tool and methods of use
JP2004139838A (ja) * 2002-10-17 2004-05-13 Noritake Co Ltd 導体ペーストおよびその利用
GB0307547D0 (en) * 2003-04-01 2003-05-07 Du Pont Conductor composition V
US7176152B2 (en) * 2004-06-09 2007-02-13 Ferro Corporation Lead-free and cadmium-free conductive copper thick film pastes
US7494607B2 (en) 2005-04-14 2009-02-24 E.I. Du Pont De Nemours And Company Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom
US7556748B2 (en) * 2005-04-14 2009-07-07 E. I. Du Pont De Nemours And Company Method of manufacture of semiconductor device and conductive compositions used therein
US7435361B2 (en) 2005-04-14 2008-10-14 E.I. Du Pont De Nemours And Company Conductive compositions and processes for use in the manufacture of semiconductor devices
US7462304B2 (en) 2005-04-14 2008-12-09 E.I. Du Pont De Nemours And Company Conductive compositions used in the manufacture of semiconductor device
JP4934993B2 (ja) * 2005-05-25 2012-05-23 住友電気工業株式会社 導電性ペーストおよびそれを用いた配線基板
US7771623B2 (en) 2005-06-07 2010-08-10 E.I. du Pont de Nemours and Company Dupont (UK) Limited Aluminum thick film composition(s), electrode(s), semiconductor device(s) and methods of making thereof

Also Published As

Publication number Publication date
US8128846B2 (en) 2012-03-06
EP2294584A1 (en) 2011-03-16
KR20110014675A (ko) 2011-02-11
JP2011524068A (ja) 2011-08-25
US20090294741A1 (en) 2009-12-03
CN102017014A (zh) 2011-04-13
WO2009146348A1 (en) 2009-12-03

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