CN102017014A - 包含光伏电池导体中所用的亚微米颗粒的组合物 - Google Patents

包含光伏电池导体中所用的亚微米颗粒的组合物 Download PDF

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Publication number
CN102017014A
CN102017014A CN2009801157411A CN200980115741A CN102017014A CN 102017014 A CN102017014 A CN 102017014A CN 2009801157411 A CN2009801157411 A CN 2009801157411A CN 200980115741 A CN200980115741 A CN 200980115741A CN 102017014 A CN102017014 A CN 102017014A
Authority
CN
China
Prior art keywords
composition
microns
submicron particles
silver
inorganic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009801157411A
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English (en)
Chinese (zh)
Inventor
H·杨
R·伊瑞扎瑞
P·J·奥利维耶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of CN102017014A publication Critical patent/CN102017014A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/14—Conductive material dispersed in non-conductive inorganic material
    • H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00—Individual photovoltaic cells, e.g. solar cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/20—Electrodes
    • H10F77/206—Electrodes for devices having potential barriers
    • H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photovoltaic Devices (AREA)
  • Conductive Materials (AREA)
  • Inorganic Insulating Materials (AREA)
CN2009801157411A 2008-05-28 2009-05-28 包含光伏电池导体中所用的亚微米颗粒的组合物 Pending CN102017014A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5659208P 2008-05-28 2008-05-28
US61/056,592 2008-05-28
PCT/US2009/045389 WO2009146348A1 (en) 2008-05-28 2009-05-28 Compositions containing submicron particles used in conductors for photovoltaic cells

Publications (1)

Publication Number Publication Date
CN102017014A true CN102017014A (zh) 2011-04-13

Family

ID=40934192

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801157411A Pending CN102017014A (zh) 2008-05-28 2009-05-28 包含光伏电池导体中所用的亚微米颗粒的组合物

Country Status (7)

Country Link
US (1) US8128846B2 (enExample)
EP (1) EP2294584A1 (enExample)
JP (1) JP2011524068A (enExample)
KR (1) KR20110014675A (enExample)
CN (1) CN102017014A (enExample)
TW (1) TW201005757A (enExample)
WO (1) WO2009146348A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103390444A (zh) * 2013-07-31 2013-11-13 广东风华高新科技股份有限公司 片式电阻器用无铅面电极浆料

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008032554A1 (de) * 2008-07-10 2010-01-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Metallhaltige Zusammensetzung, Verfahren zur Herstellung von elektrischen Kontaktstrukturen auf elektronischen Bauteilen sowie elektronisches Bauteil
US20100301479A1 (en) * 2009-05-28 2010-12-02 E. I. Du Pont De Nemours And Company Devices containing silver compositions deposited by micro-deposition direct writing silver conductor lines
ZA201208302B (en) * 2011-11-09 2014-10-29 Heraeus Precious Metals Gmbh Thick film conductive composition and use thereof
KR101411012B1 (ko) * 2011-11-25 2014-06-24 제일모직주식회사 태양전지 전극용 페이스트 및 이를 이용한 전극 및 태양전지
EP2918371A1 (en) * 2014-03-11 2015-09-16 Heraeus Precious Metals North America Conshohocken LLC Solderable conductive polymer thick film composition
GB201520060D0 (en) * 2015-11-13 2015-12-30 Johnson Matthey Plc Conductive paste and conductive track or coating

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1395259A (zh) * 2001-06-28 2003-02-05 住友电木株式会社 导电糊剂和使用该糊剂制备的半导体装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5403376A (en) * 1992-03-18 1995-04-04 Printron, Inc. Particle size distribution for controlling flow of metal powders melted to form electrical conductors
US5378408A (en) * 1993-07-29 1995-01-03 E. I. Du Pont De Nemours And Company Lead-free thick film paste composition
AU2002324775A1 (en) 2001-08-23 2003-03-10 Sciperio, Inc. Architecture tool and methods of use
JP2004139838A (ja) * 2002-10-17 2004-05-13 Noritake Co Ltd 導体ペーストおよびその利用
GB0307547D0 (en) * 2003-04-01 2003-05-07 Du Pont Conductor composition V
US7176152B2 (en) * 2004-06-09 2007-02-13 Ferro Corporation Lead-free and cadmium-free conductive copper thick film pastes
US7494607B2 (en) 2005-04-14 2009-02-24 E.I. Du Pont De Nemours And Company Electroconductive thick film composition(s), electrode(s), and semiconductor device(s) formed therefrom
US7556748B2 (en) * 2005-04-14 2009-07-07 E. I. Du Pont De Nemours And Company Method of manufacture of semiconductor device and conductive compositions used therein
US7435361B2 (en) 2005-04-14 2008-10-14 E.I. Du Pont De Nemours And Company Conductive compositions and processes for use in the manufacture of semiconductor devices
US7462304B2 (en) 2005-04-14 2008-12-09 E.I. Du Pont De Nemours And Company Conductive compositions used in the manufacture of semiconductor device
JP4934993B2 (ja) * 2005-05-25 2012-05-23 住友電気工業株式会社 導電性ペーストおよびそれを用いた配線基板
US7771623B2 (en) 2005-06-07 2010-08-10 E.I. du Pont de Nemours and Company Dupont (UK) Limited Aluminum thick film composition(s), electrode(s), semiconductor device(s) and methods of making thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1395259A (zh) * 2001-06-28 2003-02-05 住友电木株式会社 导电糊剂和使用该糊剂制备的半导体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103390444A (zh) * 2013-07-31 2013-11-13 广东风华高新科技股份有限公司 片式电阻器用无铅面电极浆料

Also Published As

Publication number Publication date
US8128846B2 (en) 2012-03-06
EP2294584A1 (en) 2011-03-16
KR20110014675A (ko) 2011-02-11
JP2011524068A (ja) 2011-08-25
TW201005757A (en) 2010-02-01
US20090294741A1 (en) 2009-12-03
WO2009146348A1 (en) 2009-12-03

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Application publication date: 20110413