201003284 九、發明說明： 【發明所屬之技術領域】 本發明涉及攝像領域，尤其涉及一種相機模組。 -【先前技術】 . 隨著科技的不斷發展，可攜式電子裝置如移動電話， 數碼相機等的應用日益廣泛，同時也日漸傾向于輕巧、美 觀和多功能化，其中應用於移動電話及數碼相機中的相機 模組係決定移動電話及數碼相機體積大小的主要因素之 一，因此，如何減小整個相機模組的體積，滿足小型化模 組設計的要求已成為本領域研發的重要課題。 請參閱圖1，先前的一種相機模組10包括影像感測晶 片110、基板120、導線130、鏡頭模組140、膠體150以 及電子元件160,通常該電子元件160為主動元件或者被動 元件。其中，該基板120具有一承載面122及開設在該承 載面122上的凹槽124，該影像感測晶片110通過膠體150 固設在該基板120的凹槽124内，且通過導線130與該基 板120電性連接。該電子元件160通過膠體150固設在該 基板120的凹槽124内。該鏡頭模組140通過膠體150固 設在該基板120的承載面122上。 然而，由於該電子元件160放置在該基板120的凹槽 124内，因而增大了該基板120的面積，從而不利於使用該 相機模組10的移動電話或者數碼相機等的小型化。 【發明内容】 有鑒於此，有必要提供一種小型化的相機模組。 5 201003284 一種相機模組’其包括一個第一基板、一個影像感測 晶片、一個鏡頭模組、複數電子元件以及一個第二基板。 該第一基板包括一個第一承載面以及一個開設在該第一承 載面上的凹槽。該影像感測晶片包括一個感測區以及一個 環繞該感測區的非感測區。該第二基板位於該第一承載面 上，且該第二基板包括一個遠離該第一承载面的第二承載 面。該影像感測晶片固設於該凹槽内且與該第一基板電性 連接。該第二基板遮蔽住該非感測區且使該感測區開放並 與該鏡頭模組對正。該鏡頭模組及該複數電子元件固設於 該第二承載面上。 與先刖技術相比，該相機模組將複數電子元件放置在 該第二基板的第二承載面上，該第二承載面位於該影像感 測晶片的非感測區上方的空間，以避免將該複數電子元件 放置在該第一基板的凹槽内而增大該凹槽的面積，從而減 小該第一基板的面積以實現該相機模組的小型化。 【實施方式】 下面將結合附圖，對本發明作進一步的詳細說明。 請參閱圖2,本發明提供的相機模組2〇包括一個影像 感測晶片210、一個第一基板22〇、一個第二美 一 個鏡頭模組240、膠體250、導線26〇以及複^電子元件， 該複數電子元件分別為複數被動元件27〇及複數主動元件 280。其中，該膠體250可為紫外線固化膠、熱溶膠、矽溶 膠或者雙©料，本f施方式巾為紫外線固化膠。該複數 被動元件270包括電阻、電感及電容中任意一個，該複數 201003284 主動元件280包括驅動元件及晶片中任意一個。 該影像感測晶片210可為CCD(Charge Coupled Device， 電荷耦合組件感測器）或者CMOS(Complementary Metal Oxide Semiconductor，互補性金屬氧化物感測器），其用於 將光訊號轉換為電訊號。該影像感測晶片210包括一個晶 片頂面212以及與該晶片頂面212相對的晶片底面214。該 晶片頂面212包括一個感測區216以及一個環繞該感測區 216的非感測區218。該非感測區218上設有複數晶片焊墊 213。 該第一基板220包括一個第一承載面222以及一個開 設在該第一承載面222上的凹槽224。該凹槽224包括一個 凹槽底面226。該凹槽底面226對應該複數晶片焊墊213 設有複數第一基板焊墊223,該影像感測晶片210的晶片底 面214通過膠體250固設於該凹槽底面226上，且該複數 晶片焊墊213通過多條導線260分別與該複數第一基板焊 墊223對應電性連接以使該影像感測晶片210與該第一基 板220電性連接。 可以理解，該影像感測晶片210與該第一基板220電 性連接並不局限於本實施方式中的打線方式，機械性連接 也不局限於本實施方式中採用膠粘方式，可以係採用表面 貼裝方式、覆晶方式、内引腳貼合、自動載帶貼合、倒貼 封裝及熱壓合連接方式中的一種，而使影像感測晶片210 與該第一基板220機械性及電性連接。 該第二基板230包括一個遠離該第一承載面222的第 7 201003284 二承載面232以及一個與該第二承載面232相對設置的連 接面234。該被動元件270及該主動元件280均通過焊錫（圖 未示）焊接於該第二承載面232上。該連接面234通過膠體 '250固設於該第一承載面222上而使該第二基板230固設於 -該第一基板220上，且該第二基板230内部穿孔（圖未示） 並利用導線（圖未示）與該第一基板220電性連接。該第二基 板230遮蔽住該非感測區218且使該感測區216開放並保 證該該感測區216與該鏡頭模組240對正。 可以理解，該第二基板230不局限於本實施方式中通 過膠體250固設於該第一承載面222上而與該第一基板220 , 實現機械性連接，還可以係該第一基板220與該第二基板 230為一體成形結構。 該鏡頭模組240包括一個鏡筒242、一個透鏡組244、 一個鏡座246、以及一個透光元件248。該鏡座246包括一 個鏡座頂部241、一個鏡座底部245以及連接該鏡座頂部 241與該鏡座底部245的鏡座肩部243。該鏡座底部245包 v' 括一個塗佈有膠體250的底端面245a，該鏡座肩部243包 括一個與該影像感測晶片210相對的肩部底面243a。該透 光元件248為一個紅外濾光片，用於對紅外光線進行過濾。 該透鏡組244固設於該鏡筒242内。該鏡筒242通過螺合 方式收容於該鏡座頂部241内。該透光元件248通過該膠 體250固設於該肩部底面243a上，該膠體250與該透光元 件248形成對該影像感測晶片210的感測區216無塵密封 封裝，用於保護該影像感測晶片210的感測區216。該鏡頭 8 201003284 ,· 模組240通過塗佈於該鏡座底部245的底端面245a上的膠 體250固設於該第二承載面232上。 可以理解，該透光元件248並不局限於本實施方式中 為一個紅外濾光片，還可以係玻璃或者其他透光材料。 ' 本發明提供的相機模組20將複數被動元件270及複數 主動元件280放置在該第二基板230的第二承載面232上， 該第二承載面232位於該影像感測晶片210的非感測區218 上方的空間，以避免將該複數被動元件270及該複數主動 元件280放置在該第一基板220的凹槽224内而增大該凹 槽224的面積，從而減小該第一基板220的面積以實現該 相機模組20的小型化。 綜上所述，本發明確已符合發明專利之要件，遂依法 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1為先前的相機模組的剖面示意圖。 圖2為本發明提供的相機模組的剖面示意圖。 【主要元件符號說明】 相機模組 20 影像感測晶片 210 第一基板 220 第二基板 230 鏡頭模組 240 膠體 250 導線 260 被動元件 270 9 201003284 主動元件 280 晶片焊墊 213 感測區 216 第一承載面 222 凹槽 224 第二承載面 232 鏡座頂部 241 鏡座肩部 243 透鏡組 244 底端面 245a 透光元件 248 晶片頂面 212 晶片底面 214 非感測區 218 第一基板焊墊 223 凹槽底面 226 連接面 234 鏡筒 242 肩部底面 243a 鏡座底部 245 鏡座 246 10201003284 IX. Description of the Invention: [Technical Field] The present invention relates to the field of imaging, and in particular to a camera module. - [Prior Art] With the continuous development of technology, portable electronic devices such as mobile phones, digital cameras, etc. are becoming more and more widely used, and at the same time, they are becoming more and more light, beautiful and multifunctional, including mobile phones and digital devices. The camera module in the camera is one of the main factors determining the size of the mobile phone and the digital camera. Therefore, how to reduce the size of the entire camera module and meet the requirements of miniaturized module design has become an important issue in the field. Referring to FIG. 1, a camera module 10 of the prior art includes an image sensing wafer 110, a substrate 120, a wire 130, a lens module 140, a colloid 150, and an electronic component 160. Typically, the electronic component 160 is an active component or a passive component. The substrate 120 has a receiving surface 122 and a recess 124 formed in the carrying surface 122. The image sensing wafer 110 is fixed in the recess 124 of the substrate 120 by the colloid 150, and the wire 130 is connected thereto. The substrate 120 is electrically connected. The electronic component 160 is secured within the recess 124 of the substrate 120 by a glue 150. The lens module 140 is fixed on the bearing surface 122 of the substrate 120 by a glue 150. However, since the electronic component 160 is placed in the recess 124 of the substrate 120, the area of the substrate 120 is increased, which is disadvantageous for miniaturization of a mobile phone or a digital camera or the like using the camera module 10. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a miniaturized camera module. 5 201003284 A camera module 'includes a first substrate, an image sensing die, a lens module, a plurality of electronic components, and a second substrate. The first substrate includes a first bearing surface and a recess formed on the first bearing surface. The image sensing wafer includes a sensing region and a non-sensing region surrounding the sensing region. The second substrate is located on the first bearing surface, and the second substrate includes a second bearing surface away from the first bearing surface. The image sensing wafer is fixed in the recess and electrically connected to the first substrate. The second substrate shields the non-sensing area and opens the sensing area and aligns with the lens module. The lens module and the plurality of electronic components are fixed on the second bearing surface. Compared with the prior art, the camera module places a plurality of electronic components on a second bearing surface of the second substrate, and the second bearing surface is located in a space above the non-sensing area of the image sensing chip to avoid The plurality of electronic components are placed in the recess of the first substrate to increase the area of the recess, thereby reducing the area of the first substrate to achieve miniaturization of the camera module. [Embodiment] Hereinafter, the present invention will be further described in detail with reference to the accompanying drawings. Referring to FIG. 2 , the camera module 2 of the present invention includes an image sensing chip 210 , a first substrate 22 , a second lens module 240 , a colloid 250 , a wire 26 , and a plurality of electronic components . The plurality of electronic components are a plurality of passive components 27A and a plurality of active components 280, respectively. The colloid 250 may be a UV curable adhesive, a hot sol, a bismuth sol or a double absorbing material. The plurality of passive components 270 includes any one of a resistor, an inductor, and a capacitor. The multiplicity 201003284 active component 280 includes any one of a drive component and a wafer. The image sensing wafer 210 can be a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor) for converting optical signals into electrical signals. The image sensing wafer 210 includes a wafer top surface 212 and a wafer bottom surface 214 opposite the wafer top surface 212. The wafer top surface 212 includes a sensing region 216 and a non-sensing region 218 surrounding the sensing region 216. A plurality of die pads 213 are disposed on the non-sensing area 218. The first substrate 220 includes a first bearing surface 222 and a recess 224 formed in the first bearing surface 222. The recess 224 includes a recessed bottom surface 226. The groove bottom surface 226 is provided with a plurality of first substrate pads 223 corresponding to the plurality of wafer pads 213. The wafer bottom surface 214 of the image sensing wafer 210 is fixed on the groove bottom surface 226 by the glue 250, and the plurality of wafer pads are soldered. The pad 213 is electrically connected to the plurality of first substrate pads 223 via a plurality of wires 260 to electrically connect the image sensing die 210 to the first substrate 220. It can be understood that the electrical connection between the image sensing wafer 210 and the first substrate 220 is not limited to the wire bonding method in the embodiment, and the mechanical connection is not limited to the adhesive mode in the embodiment, and the surface may be used. The image sensing wafer 210 and the first substrate 220 are mechanically and electrically connected by one of a mounting method, a flip chip method, an inner pin bonding, an automatic tape bonding, a reverse bonding package, and a thermocompression bonding method. connection. The second substrate 230 includes a seventh 201003284 bearing surface 232 away from the first bearing surface 222 and a connecting surface 234 disposed opposite the second bearing surface 232. The passive component 270 and the active component 280 are both soldered to the second carrier surface 232 by soldering (not shown). The connecting surface 234 is fixed on the first carrying surface 222 by the colloid '250, so that the second substrate 230 is fixed on the first substrate 220, and the second substrate 230 is perforated (not shown). The first substrate 220 is electrically connected by a wire (not shown). The second substrate 230 shields the non-sensing area 218 and opens the sensing area 216 to ensure that the sensing area 216 is aligned with the lens module 240. It can be understood that the second substrate 230 is not limited to be fixed on the first bearing surface 222 by the colloid 250 to be mechanically connected to the first substrate 220, and may be the first substrate 220 and The second substrate 230 is an integrally formed structure. The lens module 240 includes a lens barrel 242, a lens group 244, a lens holder 246, and a light transmissive element 248. The mirror mount 246 includes a lens mount top 241, a mirror mount bottom 245, and a mirror mount shoulder 243 that connects the mount top 241 to the mount bottom 245. The base 245 of the lens holder v' includes a bottom end surface 245a coated with a colloid 250, and the lens holder shoulder 243 includes a shoulder bottom surface 243a opposite the image sensing wafer 210. The light transmissive element 248 is an infrared filter for filtering infrared light. The lens group 244 is fixed in the lens barrel 242. The lens barrel 242 is housed in the lens holder top 241 by screwing. The light-transmitting element 248 is fixed on the bottom surface 243a of the shoulder by the glue 250. The glue 250 and the light-transmitting element 248 form a dust-tight sealed package of the sensing area 216 of the image sensing wafer 210 for protecting the light-transmitting element 248. The image senses the sensing region 216 of the wafer 210. The lens 8 201003284, the module 240 is fixed to the second bearing surface 232 by a glue 250 applied to the bottom end surface 245a of the mirror base 245. It can be understood that the light transmitting member 248 is not limited to one infrared filter in the embodiment, and may be glass or other light transmissive material. The camera module 20 of the present invention places a plurality of passive components 270 and a plurality of active components 280 on the second carrying surface 232 of the second substrate 230. The second bearing surface 232 is located on the non-sense of the image sensing wafer 210. The space above the measurement area 218 is avoided to prevent the plurality of passive elements 270 and the plurality of active elements 280 from being placed in the recess 224 of the first substrate 220 to increase the area of the recess 224, thereby reducing the first substrate. The area of 220 is used to achieve miniaturization of the camera module 20. In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the present invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a schematic cross-sectional view of a prior camera module. 2 is a cross-sectional view of a camera module provided by the present invention. [Main component symbol description] Camera module 20 Image sensing wafer 210 First substrate 220 Second substrate 230 Lens module 240 Colloid 250 Wire 260 Passive component 270 9 201003284 Active component 280 Wafer pad 213 Sensing zone 216 First carrier Face 222 groove 224 second bearing surface 232 lens holder top 241 mirror seat shoulder 243 lens group 244 bottom end surface 245a light transmitting element 248 wafer top surface 212 wafer bottom surface 214 non-sensing area 218 first substrate pad 223 groove bottom surface 226 connecting surface 234 lens barrel 242 shoulder bottom surface 243a mirror base bottom 245 mirror holder 246 10