TW200950135A - Composite material for inorganic phosphor and white LED - Google Patents

Composite material for inorganic phosphor and white LED Download PDF

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Publication number
TW200950135A
TW200950135A TW097119324A TW97119324A TW200950135A TW 200950135 A TW200950135 A TW 200950135A TW 097119324 A TW097119324 A TW 097119324A TW 97119324 A TW97119324 A TW 97119324A TW 200950135 A TW200950135 A TW 200950135A
Authority
TW
Taiwan
Prior art keywords
light
composite material
powder
inorganic
quantum
Prior art date
Application number
TW097119324A
Other languages
English (en)
Chinese (zh)
Other versions
TWI355761B (enExample
Inventor
Naum Soshchin
wei-hong Luo
qi-rui Cai
Original Assignee
wei-hong Luo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by wei-hong Luo filed Critical wei-hong Luo
Priority to TW097119324A priority Critical patent/TW200950135A/zh
Priority to US12/463,683 priority patent/US20090289226A1/en
Publication of TW200950135A publication Critical patent/TW200950135A/zh
Application granted granted Critical
Publication of TWI355761B publication Critical patent/TWI355761B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
    • C09K11/7774—Aluminates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Luminescent Compositions (AREA)
TW097119324A 2008-05-26 2008-05-26 Composite material for inorganic phosphor and white LED TW200950135A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW097119324A TW200950135A (en) 2008-05-26 2008-05-26 Composite material for inorganic phosphor and white LED
US12/463,683 US20090289226A1 (en) 2008-05-26 2009-05-11 Compound Material for Inorganic Phosphor and White LED

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097119324A TW200950135A (en) 2008-05-26 2008-05-26 Composite material for inorganic phosphor and white LED

Publications (2)

Publication Number Publication Date
TW200950135A true TW200950135A (en) 2009-12-01
TWI355761B TWI355761B (enExample) 2012-01-01

Family

ID=41341400

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097119324A TW200950135A (en) 2008-05-26 2008-05-26 Composite material for inorganic phosphor and white LED

Country Status (2)

Country Link
US (1) US20090289226A1 (enExample)
TW (1) TW200950135A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI831382B (zh) * 2022-06-21 2024-02-01 優美特創新材料股份有限公司 背光模組與顯示裝置

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012053924A1 (ru) * 2010-10-22 2012-04-26 Vishnyakov Anatoly Vasilyevich Люминесцирующий материал для твердотельных источников белого света
TWM417366U (en) * 2011-05-04 2011-12-01 Johnphil Technology Corp Light module and adhesive member thereof
WO2013109908A1 (en) 2012-01-18 2013-07-25 The Penn State Research Foundation Application of semiconductor quantum dot phosphors in nanopillar light emitting diodes
CN103292225A (zh) * 2013-06-28 2013-09-11 深圳市华星光电技术有限公司 一种led背光光源
JP6237181B2 (ja) * 2013-12-06 2017-11-29 日亜化学工業株式会社 発光装置の製造方法
CN104075194B (zh) * 2014-07-07 2017-09-01 深圳市德仓科技有限公司 一种背光光源组件、背光模组、液晶模组及制作方法
CN105417519B (zh) * 2015-11-20 2018-12-04 江南大学 一种基于激光诱导技术制备量子点隐形墨水的方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7318651B2 (en) * 2003-12-18 2008-01-15 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Flash module with quantum dot light conversion

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI831382B (zh) * 2022-06-21 2024-02-01 優美特創新材料股份有限公司 背光模組與顯示裝置

Also Published As

Publication number Publication date
TWI355761B (enExample) 2012-01-01
US20090289226A1 (en) 2009-11-26

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees