200949986 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種平面顯示器的製程，且特別是有 關於一種應用於製造平面顯示器的軟烤方法。 【先前技術】 在液晶顯示器中，配向膜是控制顯示品質的關鍵元件 之一。配向膜一般是畫素電極上，用以控制液晶分子的排 列方向’並知供所需液晶分子之預傾角（pretHt angle)。 傳統配向膜之製造係採用滾輪印刷技術，所謂滾輪印 刷技術就是利用滾輪來將配向液塗佈於玻璃基板上，然後 再烤乾配向液中的溶劑，以固化形成配向膜。但這種滾輪 印刷技術有著滾輪維修不易、配向液耗費過多等問題，因 此有關產業已漸漸以喷墨印刷技術來取代傳統的滚輪印刷 技術。 喷墨印刷技術就是利用喷墨頭及喷嘴將配向液喷麗至 玻璃基板上，再加熱乾燥形成配向膜。然而，喷墨印刷技 術所使用的配向液黏度較低，因此常常會在加熱乾燥後產 生厚度不均的現象。這種現象的主要成因為：製造者在加 熱乾燥時所施加的溫度不均勻，使得部分區域的配向液已 乾燥成配向膜，但其它部分卻仍是液態的情況。由於這些 液態的配向液會自發性地流動補充那些已經乾涸的區域， 因此往往讓高溫區域的配向膜在乾燥後過厚。由於這種厚 度不均的現象會嚴重損及液晶顯示器的顯示品質，因此有 200949986 關產業的製造者莫不致力於解決這個問題 【發明内容】 因此本發明一方面就是在提供一種軟烤方、、 熱基板的同時，頂針支撐基板的位 法，其在加 且τ有所改變，以诚 基板上產生局部溫度過高的現象。 避免 根據本發明-實施例，一種軟烤方法包含 以加熱板加熱基板。其中，上述之加熱板具有至少―頂針 =改Γ’在加熱基板的同時，頂針支擇基板的位 置會有所改變。 【實施方式】 β 一般軟烤方法大多是以加熱板來加熱基板，並藉此乾 燥固化基板上的濕膜。而為了在加熱過程中固定基板的位 置’般加熱板上大多需設有多個頂針來支撐基板。然而， 由於這些頂針會將加熱板所產生的熱量直接傳導至基板 ^ ’因此基板與頂針接觸的位置往往會較其它區域具有更 门的皿度由上述之先前技術可知，這種溫度不均的現象 將導致乾燥後產生膜厚不均的問題。因此，本發明下述實 施例將揭露-種軟烤方法，其在加熱基板的同時，頂針支 撐基板的位置會有所改變，以避免基板上產生局部溫度過 南的現象。 本發明之一實施態樣為一種軟烤方法，其包含下列步 驟： 200949986 (1) 以加熱板加熱基板，其中加熱板具有至少一頂針支 撐基板。 (2) 在加熱基板的同時，改變頂針支撐基板的位置。 以下將舉二實施例說明如何具體實施上述之步驟（2)。 在以下三實施例令，基板例如可為塗佈有配向液的玻璃基 板、塗佈有光阻的半導體基材、或其他塗佈有濕膜需加熱 乾燥的基板。以下說明係以塗佈有配向液12〇的玻璃基板 Φ 110(如第1A-3D圖所示）為例，以清楚說明本發明之實施例。 實施例一 第1A-1D圖繪示依照本發明一實施例之軟烤方法的示 意圖。如圖所示，使用者可先將配向液12〇塗佈於玻璃基 板110上，然後再將此玻璃基板11〇置放於加熱板之頂針 130上，並利用加熱板加熱玻璃基板11〇(如第丨八圖所繪 示），使得玻璃基板110上的配向液120乾燥固化成配向 膜。在加熱玻璃基板110時’使用者可適時改變頂針13〇 支撐玻璃基板110的位置（點P)，以避免點P上的配向液12〇 乾燥過快，導致乾燥後的配向膜厚度不均。 具體而言’使用者可在加熱玻璃基板11〇的同時，先 利用抬升機構140將玻璃基板11〇抬離頂針130(如第1B圖 所繪示）。接著，改變玻璃基板110與頂針130的相對位置 (如第1C圖所搶示）’然後再將玻璃基板11 〇放回頂針j3〇 上（如第1D圖所繪示）。由第1D圖可以看出，此時頂針13〇 支撐玻璃基板110的位置已經改變，不再是原本的點p。 200949986 雖然在第1B圖及第1C圖中，使用者係固定頂針i3〇 的位置’並同時依箭頭A的方向移動玻璃基板ιι〇，但此 並不限制本發明，使用者亦可選擇固定玻璃基板的位置， 並同時移動頂針’只要兩者間的相對位置產生改變即可。 實施例二 第2A 2C圖螬示依照本發明另一實施例之軟烤方法的 示意圖。同樣地，使用者可先將配向液12〇塗佈於玻璃基 板110上，然後再將此玻璃基板11〇置放於加熱板之頂針 13〇上，並利用加熱板加熱玻璃基板11〇(如第2A圖所繪 不）’使得玻璃基板110上的配向液12〇乾燥固化成配向 膜。此一實施例與上一實施例的不同點在於：由於本實施 例之頂針130的剖面形狀呈現類似z字形之結構（也就是 說，頂針130之根部與頂部係位在不同之垂直轴上），因此 使用者可藉由轉動頂針130的方式，改變頂針13〇支撐玻 璃基板110的位置。 具體而言，使用者可在加熱玻璃基板110的同時，先 利用抬升機構140將玻璃基板11〇抬離頂針13〇(如第2B圖 所繪示）。接著，固定玻璃基板11〇的位置，並同時轉動頂 針130，使得兩者間的相對位置產生改變（如第2C圖所繪 示）。然後，將玻璃基板11〇放回頂針130上。由第2C圖 可以看出’由於頂針130與玻璃基板11〇的相對位置已經 產生變化，因此頂針130支撐玻璃基板11〇的位置將會有 所改變’而不會再是原本的點p。 200949986 實施例三 第3A-3D圖繪示依照本發明再一實施例之軟烤方法的 示意圖。此一實施例與上一實施例的不同點在於：本實施 例之加熱板上的頂針130數量為複數個，這些頂針13〇將 輪流支撐玻璃基板110 (如第3A_3D圖所繪示），以避免頂 針Π0長時間接觸玻璃基板11〇,導致玻璃基板ιι〇上的局 部溫度過高。 口 具體而言，第3A-3D圖之頂針130係以四個一組的方 式，沿著垂直玻璃基板11〇的方向做簡協運動，其中同組 之頂針130彼此間具有90。的相位差，也就是說該些頂針 130係依序與玻璃基板11〇接觸。應瞭解到，以上所舉的實 施方式僅為例示，並非用以限制本發明，習知此項技藝者 應視當時需要彈性選擇頂針13〇的運動方式。舉例來說， 當頂針改以N個-組的方式做簡協運動時，彼此之間的相 位差則可為360°/Ν。 綜合以上三實施例，由於頂針13〇支撐玻璃基板 的位置在加熱時會有所改變，而不會長時間接觸玻璃基板 110的同位置，因此將可有效避免玻璃基板⑽上因局部 溫度過高所導致的問題，例如：乾燥後的膜厚不均。 此外，在本發明一實施例中，頂針130持續接觸玻璃 土板110 &時間可以控制在例如是秒以内。換言之一 旦頂針130持續接觸玻璃基板110的時間超過20秒，使用 9 200949986 者就會改變頂針130支撐玻璃基板110的位置，以避免玻 璃基板110與頂針130接觸的區域產生溫度過高的現象。 應瞭解到，以上所舉之時間參數均僅為例示，並非用以限 制本發明，習知此項技藝者應視當時需要彈性選擇其實施 方式。 雖然本發明已以實施例揭露如上，然其並非用以限定 本發明，任何熟習此技藝者，在不脫離本發明之精神和範 ❹目内，當可作各種之更動與_，因此本發明之保護範圍 當視後附之申請專利範圍所界定者為準。 意圖 圖式簡單說明] 第lA-m圖緣示依照本發明一實施例之軟烤方法的 示 示意圖 示意圖 ^A-2C时示依照本發明另—實施例之軟烤方法的 =A_3D圖㈣依照本發明再-實施例之軟烤方法的 【主要元件符號說明】 110:玻璃基板 120 :配向液 130 I頂針 140 :抬升機構 A :箭頭200949986 IX. Description of the Invention: [Technical Field] The present invention relates to a process for a flat panel display, and more particularly to a soft bake method for manufacturing a flat panel display. [Prior Art] In a liquid crystal display, an alignment film is one of the key components for controlling display quality. The alignment film is generally on the pixel electrode for controlling the alignment direction of the liquid crystal molecules and knowing the pretHt angle of the desired liquid crystal molecules. Conventional alignment film is manufactured by roller printing technology. The so-called roller printing technology uses a roller to apply an alignment liquid onto a glass substrate, and then bakes the solvent in the alignment liquid to cure to form an alignment film. However, this roller printing technology has problems such as difficulty in repairing the rollers and excessive consumption of the alignment liquid. Therefore, the related industry has gradually replaced the traditional roller printing technology with inkjet printing technology. Inkjet printing technology uses an inkjet head and a nozzle to spray the alignment liquid onto a glass substrate, and then heats and dries to form an alignment film. However, the alignment liquid used in ink jet printing technology has a low viscosity, so that uneven thickness is often caused after heat drying. The main cause of this phenomenon is that the temperature applied by the manufacturer during heating and drying is not uniform, so that the alignment liquid in a part of the area has dried to form an alignment film, but the other parts are still in a liquid state. Since these liquid alignment fluids spontaneously replenish those areas that have dried up, the alignment film in the high temperature region tends to be too thick after drying. Since this uneven thickness phenomenon seriously impairs the display quality of the liquid crystal display, there is a manufacturer of the 200949986 industry that is not committed to solving this problem. [Invention] Therefore, in one aspect, the present invention provides a soft roasting party, At the same time as the thermal substrate, the position method of the thimble supporting the substrate is changed and τ is changed, so that the local temperature is too high on the substrate. Avoid According to the invention - an embodiment, a soft bake method comprises heating a substrate with a heating plate. Wherein, the above-mentioned heating plate has at least "ejector pin = modified" while the substrate is heated, and the position of the ejector pin selecting substrate is changed. [Embodiment] The β general soft baking method mostly uses a hot plate to heat the substrate, and thereby dry and solidify the wet film on the substrate. In order to fix the position of the substrate during the heating process, a plurality of thimbles are often required to support the substrate. However, since these thimbles will directly transfer the heat generated by the heating plate to the substrate, the position of the substrate in contact with the thimble tends to be more gated than in other regions. As is known from the prior art, this temperature is uneven. The phenomenon will cause a problem of uneven film thickness after drying. Accordingly, the following embodiments of the present invention will disclose a soft bake method in which the position of the thimble supporting substrate is changed while the substrate is being heated to avoid local temperature overshoot on the substrate. One embodiment of the present invention is a soft baking method comprising the following steps: 200949986 (1) The substrate is heated by a heating plate, wherein the heating plate has at least one thimble supporting substrate. (2) While heating the substrate, change the position of the ejector supporting substrate. The following will explain how to implement the above step (2) in detail. In the following three embodiments, the substrate may be, for example, a glass substrate coated with an alignment liquid, a semiconductor substrate coated with a photoresist, or another substrate coated with a wet film to be dried by heating. The following description is made by taking a glass substrate Φ 110 (shown in Figs. 1A-3D) coated with an alignment liquid 12〇 as an example to clearly illustrate an embodiment of the present invention. Embodiment 1 FIGS. 1A-1D are diagrams showing a soft baking method according to an embodiment of the present invention. As shown in the figure, the user can first apply the alignment liquid 12 于 on the glass substrate 110, and then place the glass substrate 11 on the thimble 130 of the heating plate, and heat the glass substrate 11 by using a heating plate ( As shown in FIG. 8 , the alignment liquid 120 on the glass substrate 110 is dried and solidified into an alignment film. When the glass substrate 110 is heated, the user can change the position (point P) of the thimble 13 支撑 supporting the glass substrate 110 in time to prevent the alignment liquid 12 上 on the spot P from drying too fast, resulting in uneven thickness of the alignment film after drying. Specifically, the user can lift the glass substrate 11 from the ejector pin 130 by using the lifting mechanism 140 while heating the glass substrate 11 (as shown in Fig. 1B). Next, the relative position of the glass substrate 110 and the ejector pin 130 (as shown in Fig. 1C) is changed, and then the glass substrate 11 is placed back on the ejector pin j3 (as shown in Fig. 1D). As can be seen from Fig. 1D, at this time, the position of the ejector pin 13 支撑 supporting the glass substrate 110 has changed, and is no longer the original point p. 200949986 Although in FIG. 1B and FIG. 1C, the user fixes the position of the thimble i3〇 and simultaneously moves the glass substrate in the direction of the arrow A, this does not limit the present invention, and the user may also select the fixed glass. The position of the substrate, and the ejector pin 'moves at the same time, as long as the relative position between the two changes. Embodiment 2 FIG. 2A 2C is a schematic view showing a soft baking method according to another embodiment of the present invention. Similarly, the user can first apply the alignment liquid 12 于 on the glass substrate 110, and then place the glass substrate 11 on the ejector pin 13 of the heating plate, and heat the glass substrate 11 by using a heating plate (eg, The drawing liquid 12 on the glass substrate 110 is dried and solidified into an alignment film, as depicted in FIG. 2A. This embodiment differs from the previous embodiment in that the cross-sectional shape of the ejector pin 130 of the present embodiment exhibits a zigzag-like structure (that is, the root portion of the ejector pin 130 and the top portion are on different vertical axes). Therefore, the user can change the position of the ejector pin 13 to support the glass substrate 110 by rotating the ejector pin 130. Specifically, the user can lift the glass substrate 11 from the ejector pin 13 by the lifting mechanism 140 while heating the glass substrate 110 (as shown in FIG. 2B). Next, the position of the glass substrate 11 is fixed, and the thimble 130 is rotated at the same time so that the relative position between the two changes (as shown in Fig. 2C). Then, the glass substrate 11 is placed back on the ejector pin 130. It can be seen from Fig. 2C that since the relative positions of the ejector pin 130 and the glass substrate 11A have changed, the position at which the ejector pin 130 supports the glass substrate 11〇 will be changed' and will not be the original point p. 200949986 Embodiment 3 FIGS. 3A-3D are schematic views showing a soft baking method according to still another embodiment of the present invention. The difference between this embodiment and the previous embodiment is that the number of thimbles 130 on the heating plate of the embodiment is plural, and the thimbles 13 轮 will alternately support the glass substrate 110 (as shown in FIG. 3A_3D) to Avoiding the thimble Π0 from contacting the glass substrate 11 for a long time causes the local temperature on the glass substrate to be too high. Specifically, the ejector pins 130 of Figures 3A-3D are arranged in a group of four ways in a direction of vertical glass substrate 11 ,, wherein the thimbles 130 of the same group have 90 between each other. The phase difference, that is, the thimbles 130 are sequentially in contact with the glass substrate 11 . It should be understood that the above-described embodiments are merely illustrative and are not intended to limit the invention, and those skilled in the art should be able to flexibly select the manner in which the thimble 13 运动 is moved. For example, when the thimbles are changed in N-groups for simple movement, the phase difference between them can be 360°/Ν. According to the above three embodiments, since the position of the ejector pin 13 to support the glass substrate changes during heating without contacting the same position of the glass substrate 110 for a long time, the local temperature of the glass substrate (10) can be effectively avoided. Problems caused, for example, uneven film thickness after drying. Moreover, in an embodiment of the invention, the thimble 130 continues to contact the glass earth plate 110 & time can be controlled, for example, within seconds. In other words, once the ejector pin 130 continues to contact the glass substrate 110 for more than 20 seconds, the position of the thimble 130 supporting the glass substrate 110 is changed by using 9 200949986 to prevent the temperature of the glass substrate 110 from contacting the thimble 130 from being excessively high. It should be understood that the above-mentioned time parameters are merely exemplary and are not intended to limit the present invention, and those skilled in the art should be able to flexibly select their implementation manners at that time. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and those skilled in the art can make various changes and _ without departing from the spirit and scope of the present invention. The scope of protection is subject to the definition of the scope of the patent application attached. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A-m is a schematic diagram showing a soft baking method according to an embodiment of the present invention. AA-2C shows a soft baking method according to another embodiment of the present invention. [Main component symbol description] of the soft baking method of the re-embodiment of the present invention 110: Glass substrate 120: alignment liquid 130 I thimble 140: lifting mechanism A: arrow