TW200949899A - Semiconductor processing chamber - Google Patents

Abstract

A semiconductor processing system comprising load lock, transfer chamber and one or several processing chambers. The transfer chamber is between load lock and processing chambers, and processing chambers can be placed around the transfer chamber. The transfer chamber is equipped with transferring apparatus. This invention can complete the loading and exchanging job of workpieces only by the movements of transferring apparatus, and without the vertical movements of lad lock or processing chambers. Thus the loading and exchanging of workpieces can be faster and cheaper, and the throughput can be raised. In this invention, a processing chamber with specially designed intake and exhaust system is published. With reactant gas screens forming among the processing stations in the processing chamber, the uniformity of the processing stations can be improved, thus the cross-interference of reactant gases between different processing stations can be avoided.

Description

200949899 VI. Description of the Invention: [Technical Field] The present invention relates to the field of semiconductor manufacturing equipment, and more particularly to a semiconductor processing system and a processing method thereof. [Prior Art] There are currently two commonly used semiconductor process processing systems, one for batch processing of workpieces and the other for single-piece processing of workpieces. In a batch processing system, multiple pieces of workpiece are placed horizontally or vertically and processed. Since the multiple pieces of the workpiece are processed simultaneously in the apparatus, the spacing between the workpieces is extremely limited. This requires low pressure treatment to eliminate the gas pressure gradient. Generally speaking, 'in the case where the workpiece pitch is more than a quarter of its thickness, the pressure should be less than 500 mTorr' and the deposition rate will be less than 1 〇〇8. /melon. This means that longer processing time is required. While monolithic processing systems have advantages in product handling uniformity, thermal effects, and single batch processing speeds, their low throughput and costly production costs are clearly fatal defects that are difficult to overcome. In order to solve the above problem, a background processing system is provided in the background section of U.S. Patent No. 5,855,681. As shown in FIG. 12, the batch processing system 101 has a processing chamber 102. The processing chamber has a plurality of processing platforms 103'. Thus, the processing chamber 102 can simultaneously process a plurality of workpieces without considering the workpiece. The problem between the spacing. However, such systems also have certain problems, which affect the processing speed and quality of the workpiece, and cannot effectively process large batches of workpieces at the same time. Its 141659.doc 200949899's main problem affecting the quality of processing products is the uniformity of the processing conditions of each processing platform. The treatment conditions ', 'the cow's homogeneity mainly has two aspects, the reaction gas and the temperature. _                                       The temperature uniformity between them is difficult to control; if the processing platforms are not sealed, the reaction gases between the processing platforms may form mutual interaction interference, and the processing atmosphere between the processing platforms will be the same. The processing chamber containing a plurality of imaginary 1U 千 台 仍 仍 still can not handle the simultaneous processing of large quantities of workpieces. In addition, 'US Patent No. 6_65 provides a rational system. As shown in Figure 13, the volume is in the batch... Simplified The transfer chamber 111 realizes a small footprint of the machine. However, the loading system of the system is complicated, the loading speed of the workpiece is slow, and the work material needs to leave a period of time to wait for the workpiece 2 to be unloaded, which affects the production efficiency.衫. 匕 Need to provide a fast workpiece handling dream and method 'to reduce the loading and unloading process rate. μ waiting time, speed up the workpiece processing efficiency and the patent in this patent 虚 骷 骷The processing device can only have one processing chamber 113. Therefore, reducing the number of workpieces that are processed at the same time in each machine is increased. The quantity is 'In addition, the existing workpiece batch processing device also exists. _ :: The mechanical structure is complicated and difficult to maintain 'and the transfer device is loaded or unloaded or the workpiece is high, so the transmission cost is high, so that the unit capacity is reduced. - [Disclosed] The object of the present invention is to provide a solution for solving the current mass production apparatus 141659.doc 200949899 The semiconductor process processing system of the problem of complex mechanical structure. The system is realized by the following technical methods: a semiconductor process, a transfer chamber and a processing chamber. The chamber is provided with a conveying device, and the processing chamber has a loading and unloading port, and the conveying device has at least two telescopic arms respectively. The conveying arm can simultaneously point to the same-loading port of the processing chamber and can be respectively in the vertical direction. Adjust to the position of the same loading and unloading port to complete the pick and place of the workpiece.

The two transfer arms are located above and below the loading and unloading port. The two transfer arms are rotatable on a horizontal plane between the transfer chamber and the processing chamber, and the two transfer arms of the transfer device can move up and down with the spindle of the transfer device, and each transfer arm of the transfer device can be self-propelled Flex before and after. The "Hai Semiconductor Process Processing System also includes at least one vacuum lock that has a plurality of workpiece holders that can simultaneously point to the position of the different workpiece holders of the vacuum lock to complete the pick and place of the workpiece. Each vacuum lock has two or four workpiece holders. The vacuum lock is divided into upper and lower layers, and the workpiece rack in the lower layer is provided with a gasket which is easy to dissipate heat to enhance the heat dissipation effect.

Another object of the present invention is to provide a semiconductor process processing system which solves the problem that the current workpiece mass production apparatus is not uniform in processing and can not perform batch processing of workpieces with high quality. The present invention achieves the above object by the following technical method: a semiconductor processing chamber comprising a plurality of processing platforms, the processing platform is provided with a radial groove for exhausting, and an exhaust passage is arranged around the processing chamber, and the processing chamber is provided. The exhaust passage of the chamber and the radial groove of the processing platform are connected to each other to constitute an exhaust system. 0 141659.doc 200949899 wherein the processing chamber includes a chamber top cover and a chamber base plate, and the suction isolation plate is disposed in the cavity Between the top cover of the chamber and the base plate of the chamber, wherein the top cover of the chamber has a plurality of raised shower heads, and the suction separating plate has a plurality of suction isolation holes corresponding to the shower head, below the suction isolation plate The chamber base has a heating base corresponding to each of the suction isolation holes, and the corresponding shower head, the suction isolation hole and the heating base form a processing platform. A plurality of radial grooves are provided around the suction isolation panel. The radial groove is distributed near the side of the periphery of the suction partition m near the center of the suction isolation plate. A plurality of exhaust ports corresponding to the extension of the recess of the chamber cover are also disposed around the suction partition. ~ At least one exhaust groove for exhausting is provided on the chamber base, and the exhaust groove is connected to the exhaust port of the suction partition. The bottom of the chamber base is provided with an exhaust passage communicating with the exhaust passage, and the exhaust passage is connected to the exhaust device. The air curtain forming process formed by the airflow discharged around the processing platform is: gas is sent to each processing platform by the sprinkler of the present invention, and the gas is extracted from each processing platform due to the air pressure of the intake system and the extraction of the gas by the exhaust device. The radial flow out of the tank, due to the action of air pressure, the flow rate of the gas can be very fast, forming a gas curtain around the treatment platform. An inert gas curtain is sprayed around the heating base. Another technical solution I·· a semiconductor processing chamber, & includes a plurality of processing platforms ′′ also includes a pumping insulation panel disposed on the processing platform, the pumping insulation panel having a plurality of processing platforms corresponding to the processing platform The suction isolation holes are used to isolate the reaction environments of the processing platforms from each other during the semiconductor processing process by pumping the isolation holes. 141659.doc 200949899 wherein the semiconductor processing chamber also includes a chamber top cover and a chamber base, the processing platform is disposed in the chamber base, and the suction isolation plate is disposed between the chamber top cover and the chamber base. The chamber top cover has a plurality of raised showerheads with fine holes. The suction isolation hole on the suction isolation plate corresponds to the shower head, and during the processing of the + conductor workpiece, the shower head abuts against the suction isolation hole of the suction isolation plate. A heating base corresponding to each of the suction isolation holes is formed in the chamber base below the suction isolation plate, and the corresponding shower head, the suction isolation hole and the heating base form a processing platform. The periphery of the suction isolation hole is provided with a plurality of radial grooves. The distribution of the radial grooves is close to the periphery of the suction insulation plate! It is thinner than the side of the center of the suction isolation plate. A plurality of air ports corresponding to the extensions of the recesses of the chamber top cover are also disposed around the air separation panel. A plurality of symmetrical exhaust ports are arranged around the suction isolation plate. At least a venting groove for exhausting is provided around the chamber to the base plate adjacent to the suction partition. The bottom of the chamber base is provided with an exhaust passage communicating with the exhaust passage, and the exhaust passage is connected to the exhaust device. The flow direction from the inner cavity to the middle oxygen flow is: the reaction gas is sent from the nozzle to each processing platform, and the semiconductor workpiece placed on the heating base is processed by: the air pressure of the intake system and the exhaust device pair The reaction gas is extracted, and the reaction gas flows out from the radial groove of the suction isolation plate of each processing platform, into the recessed portion of the top cover of the chamber and flows to the extension portion of the depressed portion, and is surrounded by the pumping isolation plate The exhaust port flows into the exhaust groove of the chamber base, and then enters the exhaust device through an exhaust passage communicating with the exhaust groove. The chamber base is provided with a loading and unloading port for loading and unloading the workpiece on the side of the transfer chamber. The bottom of the heated base is filled with an inert gas to prevent particulate dust from falling under the heated base. 141659.doc 200949899 Square deposition and film growth. Still another object of the present invention is to provide a processing system which solves the problems of slow loading and unloading of workpieces in a workpiece mass production apparatus and low processing efficiency of workpieces. The present invention achieves the above object by the following technical method: a method for transferring a workpiece of a semiconductor process processing system, the semiconductor process processing system comprising a transfer chamber and a processing chamber, the transfer chamber being provided with a transfer device having at least two a transfer arm located at an upper and lower position and capable of telescopically extending 9 in a horizontal direction, the method comprising: (1) one of the transfer devices transporting the arm from a workpiece loading and unloading port in the processing chamber for one month, and (2) following step (1): Another transfer arm of the delivery device places another piece of workpiece into the processing chamber through the workpiece loading and unloading port. =, the conveyor can be rotated on a horizontal plane within the transfer chamber. The transfer is set by the movement of the workpiece each time. Conveying equipment = system: also includes vacuum lock, the transfer device can take ffi two months workpiece in the vacuum lock. The engineering scheme is: a chamber of a semiconductor process processing system, a process processing system having n processing chambers, including a vacuum lock, a transfer part exchange platform, a processing chamber, and a processing position in the processing chamber. Until the light rain / #送室 has a conveyor that points in the same direction and is located between the top and bottom of the two transfer arms, the main door is sent from the vacuum lock. The steps are as follows: (1) The device utilizes the loading and unloading ports I of the two processing chambers, and the two transfer arms are rotated to the position where the first transfer arm is facing the loading and unloading port, and the workpiece held by the transfer arm is the 141659.doc 200949899 Placed on the workpiece exchange platform, the guards pay a two-point circle; (3) the second transfer arm of the conveyor is adjusted to the positive: at the unloading port 'place the guards held by the second transfer arm on the workpiece exchange plane Rotate η minute turn; (5) Repeat piece workpiece 'work piece exchange flat process (4)* Repeat the above (4) (2), (3), (4) until it is ordered, the processing platform wire „ is self-employed. Or triple bias. The vacuum lock is provided with two layers of upper and lower layers, among which: For the transfer and exchange of the workpiece for the father to change m Μ 玄 ~ 卜 layer sighs the easy to dissipate the gasket for political heat. The vacuum lock contains two or four pieces ^ after the completion of step (5) and the waiting step includes Workpiece exchange step, after: second, also forward-return true dr exchange step includes, the transfer device returns the true second lock, and the workpiece taken from the vacuum lock with the first transfer arm, · b. rotary transfer device 1 篦- The value is turned off to return to the processing chamber position, and the transmission: =;: the loading and unloading port of the processing chamber; the device uses the first transfer arm to take out the device by the (1) table; d_ adjust the transfer device The second working device is used to make the transfer arm face the loading and unloading port, and the transfer device uses the transfer arm to insert an H unprocessed workpiece into the workpiece exchange platform through the loading and unloading port; e. The second of the transfer device is second The workpiece obtained by the transfer arm is placed in a vacuum lock real lock, and the workpiece exchange platform is provided with _transmission (four), and the lock is transferred so that each pair of transfer arms corresponds to a processing platform. The platform can rotate a semiconductor process processing system. Process processing system including vacuum lock, transfer method System, to, with n processing platforms 14l659.doc 200949899 The processing chamber is equipped with a workpiece exchange platform, which is located in the same direction and is located in the delivery device, and the processing chamber is full two = one Transfer arm transmission - "piece; (7) workpiece table rotation from the workpiece exchange platform to take out the arm position to make it Dong Dong... One circle, adjust the second pass:: make it facing the loading and unloading port' (3) The two transfer arms take a piece of the workpiece by transferring the workpiece exchange platform; (4) the first transfer arm of the transfer device returns the vacuum lock and the two pieces of the obtained workpiece are placed in the above steps until the process chamber is unloaded.胄, (7) Heavy The number of two platforms... natural number. The number of processing chambers is ^lower two-layer structure' where the upper layer is exchanged for the transport of the yak and the father's and the lower layer is provided with the heat-dissipating plaque. The workpiece exchange platform is provided with a transfer arm in which thousands of workpiece exchanges are rotatable such that each pair of transfer arms corresponds to a processing platform. A workpiece exchange method for a semiconductor process processing system, the semi-duct processing system comprising a vacuum lock, a transfer chamber, and a processing chamber having n processing platforms. The processing chamber is provided with a workpiece exchange platform = the same direction and the upper and lower positions At least two passes:::: The sending device 'The steps of exchanging the workpiece in the case where the processing chamber has a workpiece are as follows. (1) The transfer device returns to the vacuum lock, and the first transfer arm is taken from the vacuum lock to take an unprocessed a workpiece; (7) rotating the transfer device to return it to the processing chamber to the position 'and the second transfer arm is facing the loading and unloading port of the processing chamber; (3) the transfer device is removed by the loading and unloading σ self-defense member exchange platform a piece of processed workpiece; (4) adjust the position of the conveyor so that the first transfer arm is 141659.doc -11 - 200949899 to the loading and unloading port, the platform is placed in a vacuum lock, and the lock 0 is transported by the first transfer arm The loading and unloading port exchanges the unprocessed workpiece to the workpiece, '(5) the second transfer arm of the transfer device returns and the processed workpiece obtained by the second transfer arm is placed in a vacuum, and the processing platform is The number n is a natural number of 4. The number of processing chambers is two or three. The vacuum lock is provided with an upper and lower two-layer structure. The upper layer is an exchange layer for the transfer and exchange of workpieces, and the lower layer is provided with a heat-dissipating fin for heat dissipation. Vacuum lock inside the fine I + μ >, Xing two-frequency 円 円 two or four pieces of workpiece. The workpiece exchange platform is provided with a pair of transfer arms, wherein the workpiece exchange circuit is rotatable such that each pair of transfer arms corresponds to a processing platform. The invention adopts the special transfer device workpiece transfer structure of (4), which can load and unload the workpiece more quickly and improve the production capacity. The processing chamber of the invention adopts a specially designed intake and exhaust system' to form a reaction gas curtain between the processing platforms, which can improve the uniformity between the platforms, and avoid the reaction gas interaction between different processing platforms. . [Embodiment] Please refer to Figure 1, Figure! BRIEF DESCRIPTION OF THE DRAWINGS The present invention consists of a standard factory interface 1, two vacuum locks 2, a transfer chamber 3, or a plurality of processing chambers 4. Among them, the factory interface i is adjacent to the vacuum lock 2. The transfer chamber 3 is located between the vacuum lock 2 and the processing chamber*. A plurality of processing chambers 4 can be disposed around the transfer chamber 3. Each processing chamber 4 contains a plurality of processing platforms 5, each of which can process a single semiconductor workpiece. In the embodiment shown in Fig. 1, the semiconductor process processing system includes two processing chambers 4, and two processing chambers 4 are disposed around the transfer chamber 3. Each of the 141659.doc • 12· 200949899 is provided with a chamber top cover 8 above the processing chamber 4. For the convenience of the description of the present invention, the chamber top cover 8 of one processing chamber 4 is in a closed state, and the other chamber is in a closed state. The top cover 8 is in an open state. It can be seen from the chamber top cover 8 of the self-closing state that a reaction gas supply device 6 is disposed on the chamber top cover 8 of the processing chamber 4, and the reaction gas supply device 6 can be closed from the chamber by the intake pipe. The top of 8 inputs a reactive gas to a different processing platform 5 within the processing chamber 4. As can be seen from the open cavity to the top cover 8, the interior of the chamber top cover 8 has a recess 9 around which each of the recesses 9 has an extension 1〇. In the recessed portion 9, there are a plurality of raised shower heads of the same number as the processing flats 1, and the shower heads are provided with a plurality of uniformly dense pores 12 for the reaction gas supply device 6 to provide. The reaction gas is input into the processing platform 5 . Further, control, exhaust, and power means 7 for performing workpiece processing are also provided on the side of the holder of the processing chamber 4, which will not be described in detail herein for the sake of brevity. Each of the processing chambers 4 of the present invention can share a set of cleaning source and reactive gas supply means, exhaust pump and terminal detector. In the case of plasma chemical vapor deposition, a set of RF energy input devices can also be shared between the processing platform 5 of the same-processing chamber 4. Referring to FIG. 2, FIG. 2 is a top plan view of the semiconductor processing system of the present invention with the processing of the top cover of the chamber omitted. In the embodiment of Fig. 2, the transfer chamber 3 is pentagonal, and up to three processing chambers 4 can be disposed around it. In the embodiment of Fig. 2, two are provided, and of course, only one processing chamber 4 is provided. . In some other embodiments, the transfer chamber 3 can also have other different shapes, such as a hexagon. Accordingly, the maximum number of processing chambers 4 that can be disposed around the transfer chamber 3 can also be different. In the embodiment shown in Fig. 2, the processing chamber 4 has a quadrilateral shape with four chamfers, and four processing platforms 5 are disposed inside. Of course, in some other embodiments, 141659.doc • 13- 200949899, the processing chamber 4 can also have other different shapes and a different number of processing platforms 5. Please refer to FIG. 3. FIG. 3 is a schematic exploded view of the processing chamber in the semiconductor process processing system of the present invention. In Fig. 3, the processing chamber includes a chamber top cover 8, a suction isolation panel 13, a workpiece exchange platform, a heating base 19, and a chamber base 18. Wherein, the heating base 19 is mounted in the shaft hole 31' of the chamber base 18 by its central axis, and the suction separating plate 13, the workpiece exchange platform 25 and the chamber base plate 18 are along the common axis as shown. Mounted together under the line, the chamber top cover 8 is mechanically coupled to the chamber base 18 and can be opened or closed. When the chamber top cover 8 is placed over the chamber base 18, a closed workpiece processing chamber is formed within the chamber top cover 8 and the chamber base 18. It should be noted that a plurality of workpiece processing platforms may be disposed inside the processing chamber in the present invention. For the convenience of description, in the embodiment shown in FIG. 3, only four workpiece processing platforms are taken as an example. The chamber top cover 8 is recessed inwardly to form a recessed portion 9 having an extended protrusion-like extension around the recessed portion 9. When the semiconductor workpiece is processed, the chamber top cover 8 is closed with the chamber top cover, and the inside is formed. In a closed reaction chamber, the reaction gas flows in the recess 9 and eventually exits the processing chamber (described in detail later). The recessed portion 9 of the chamber top cover 8 is provided with four protrusions from the recessed portion 9. The shower head 11 has a fine hole 12 for the input of the reaction gas uniformly distributed on the shower head U. The suction isolation panel 13 is provided with a plurality of evacuation isolation holes 16 corresponding to the number and position of the shower heads u. Correspondingly, the diameter of the suction isolation hole 16 is wider and narrower, and the diameter of the shower head u on the chamber top cover 8 is smaller than the diameter of the suction isolation hole "141659.doc -14· 200949899 upper end diameter" is larger than the reduction hole 16 The lower end diameter is such that when the chamber top cover 8 is placed over the chamber base 18, the sprinkler head venting isolation hole 16 has a closer contact. Another ice, ^ _ m, the twitch isolation plate 13 Also set around

There are four recessed qm A traps with the chamber top cover 8. The exhaust port 14 of the extension portion 10 of the crucible 9 communicates with each other.

The workpiece exchange platform 25 is configured to transfer the workpiece between the processing platforms 5, and has a rotating shaft hole 33 and a transfer arm 37 which is uniformly disposed along the periphery of the rotating shaft hole 33 and which is opposite to the number of workpiece platforms. The transfer arm is used to place the workpiece. The workpiece exchange platform 25 is rotatable and each pair of transfer arms 37 can be positioned just above the processing platform 5. In the present embodiment, the suction separation plate exhaust port workpiece exchange platform 25 has four pairs of openable transfer arms 37 corresponding to the suction isolation holes 16 of the suction insulation plate 13. The heating base 19 has a circular heating platform, and a support bar 3! in the middle to the lower position of the heating platform can be raised and lowered along the shaft hole 3 i in the chamber base i 8 . A workpiece for processing is placed on the heating platform. In order to cooperate with the workpiece exchange platform 25 to pick up and place the workpiece on the heating base 19, the heating base 19 is also provided with a thimble 2 可 which is movable up and down along the shaft hole 2' of the chamber base 丨8. There may be a plurality of ejector pins 2 arranging and arranging. In the embodiment shown in Fig. 3, each of the heating bases 19 has three thimbles 2 which are distributed in a triangular shape. Referring to Figures 3 and 4, a shaft hole 33 coaxial with the shaft hole 33 of the workpiece exchange platform 25 is disposed in the middle of the chamber base plate 18. The workpiece exchange platform 25 is mounted in the chamber by a rotating mechanism (not shown). A shaft hole 33 in the chamber base 18, on. There are four workpiece processing platforms 5 disposed in the cavity to the substrate 18. Each of the workpiece processing platforms is provided with a shaft hole 31' and three shaft holes 20, and the support rod 141659.doc -15-200949899 31 of the heating base 19 can be The shaft hole is lifted up and down, and the ejector pin 2 can be raised and lowered in the shaft hole. The chamber base 18 faces a side of a workpiece processing platform 5 with a workpiece loading and unloading port 23 for the workpiece to enter and exit. An exhaust groove 17 for exhausting is provided on the chamber base 18 on opposite sides of the workpiece loading and unloading port 23. The chamber base is also provided with an exhaust device 22 in communication with the exhaust passage 21 at the bottom. Please refer to FIG. 7 again. FIG. 7 is a cross-sectional view of the chamber substrate shown in FIG. 4 taken along the line. As can be seen from FIG. 7, the exhaust groove 17 and the exhaust passage 21 are connected by one.

The slots 27 connect the two together. Therefore, the exhaust slot, the exhaust passage 2, and the exhaust device 22 communicate with each other. 6 is a schematic structural view of the air separation panel 13 of the present invention. As shown in FIG. 6, the air separation barrier 16 of the air separation panel 13 is provided with a plurality of radial slots 24, and the air separation panel 13 is also surrounded. A plurality of exhaust ports 14 are provided in communication with the extensions 1 of the recesses 9 of the chamber top cover 8.

Referring to FIG. 3, in the processing of the workpiece, the chamber cover 8 covers a processing chamber on the chamber base 18, and in the processing chamber, the air separation panel 13 is placed on the chamber to the base 18, and the air is pumped. Each of the suction isolation holes of the insulation plate 13 is located just above the heating base 19, and the shower head 腔 of the chamber top cover 8 abuts against the suction isolation hole 16 of the air separation plate 13, and the heating base 19 is heated. In contrast to the suction isolation plate U, the workpiece to be processed is placed between the heating base 19 and the suction isolation plate η, and the transfer arm 37 of the workpiece exchange platform 25 can be placed in various ways to prevent the transfer arm 37 from being placed. The position of the susceptor ip is heated so as not to affect the direct injection of the reaction gas ejected from the shower head π onto the workpiece on the heating base 19. Thus, the shower head U, the suction partitioning plate 13, and the heating base 19 form a processing platform 5. The reaction gas supply device 6 is from the top of the chamber top cover 141659.doc •16· 200949899 输入 The reaction gas is supplied to the processing platform 5 through the fine holes 12 in the shower head 11, and the reaction gas is ejected from the shower head 11. The semiconductor workpiece placed on the heating base 丨9 is processed. 'Because the venting spacer 13 is provided with a radial groove 24', the shower head 腔 and the venting spacer 13 on the chamber top cover 8 are provided. The reaction gas that has entered the processing platform 5 from the fine pores 12 on the sprinkler 11 can not be completely sealed. After the workpiece is processed, the pores of the suction separator formed by the radial grooves 24 are leaked out and enter the chamber. The top cover 8 is recessed inwardly by the recess 9 and flows toward the extension 1 of the recessed portion 9, since the extension portion 1 is in communication with the plurality of exhaust ports 14 of the air separation panel 13, and further by the exhaust device 22 The function "leakage gas" automatically flows to the plurality of exhaust ports 14 on the suction partitioning plate 13, because the plurality of exhaust ports 14 communicate with the exhaust slots 17 provided on the chamber base 18, and due to the exhaust The tank 17 and the exhaust passage 21 are in communication, and the gas enters the exhaust passage through the passage The passage 21 is finally withdrawn by the exhaust unit 22 to form a π positive inlet and outlet exhaust system. Due to the gas pressure of the reaction gas supply device 6 and the extraction of the reaction gas by the exhaust device 22, the flow rate of the reaction gas of the entire intake and exhaust system can be fast, forming a gas curtain around the treatment platform 5, so that the reaction between the various platforms The gases do not interfere with each other. Further, considering the influence of the difference in the magnitude of the internal pressure of the processing chamber 4 on the flow velocity of the reaction gas, the present invention sets the distribution of the radial groove to be close to the suction side of one side of the suction isolation plate 13 The two sides of the center shaft hole 35 are sparse. Thus, the ease with which the reaction gas flowing out of each of the radial slots for 2 hours flows to the exhaust unit 22 is more uniform. η and thus money Since the processing platform 5 in the processing chamber 4 is symmetrically arranged, each process 141659.doc • 17. 200949899 The reaction gases discharged from the platform 5 are consistently obstructed. The present invention ensures that the discharged gas is uniformly and rapidly extracted by the exhaust groove 17 provided around the suction partitioning plate 13 on the chamber base plate 18 to ensure uniformity of processing between the plurality of workpieces. Moreover, the present invention adopts the aperture formed by the radial groove 14 between the shower head 丨丨 and the suction separating plate 13 as the exhaust port of the processing platform 5, so that the airflow in the processing platform 5 is more uniform and discharged. The gas forms a gas curtain, and the air curtain isolation is formed under the condition that the chamber is open, so that the processing environment of each processing platform is relatively independent. Also in addition

The hot base 19 is provided with an inert reaction gas curtain which is sprayed upward to further prevent the reaction gas from leaking or entering from the gap between the heating base 19 and the suction partitioning plate 13. By such measures, the mutual interference of the reaction gases between the processing platforms 5 can be effectively avoided.

</ RTI> Fig. 2 is a plan view of the semiconductor process processing system of the present invention with the top cover of the chamber omitted. The workpiece is sent from the workpiece to the semiconductor process processing system of the present invention through the assembly line, and the workpiece is removed from the 4 interface i self-defense member g and placed in the vacuum lock 2. A transfer device 设有 is provided in the transfer chamber 3, the device has at least two transfer arms that can be respectively telescoped (described in detail later), and the transfer device 15 has two transfer robots. The system consists of two people. The conveyor 15 places the workpiece from the processing platform 5 in the machine chamber 4 of the true %. In the self-reality take out 'placed everywhere: inside the visit - all processing platforms of the processing chamber to 4 after the completion of the processing, the processing chamber 4 can be processed by the workpiece... :...# transmitted from the transfer chamber 3 The device is placed in the original position and placed in the unprocessed workpiece and then pushed, _ 仵 then the next batch of shoulders 141659.doc -18- 200949899. The removed workpiece is placed in the vacuum lock 2 for cooling. After cooling, it is placed in the workpiece 匣 placed on the assembly line via the factory interface 1 and sent to the next process step for processing. Referring to Figure 8, Figure 8 is a schematic view showing the structure of the vacuum lock 2 and the transfer chamber 3 of the present invention. The present invention has two vacuum locks 2 located in the pentagon transfer chamber 3 adjacent to two adjacent sides of the factory interface 1. Each of the vacuum locks 2 is divided into four slots, each of which can accommodate one workpiece. The vacuum lock 2 and each of its slots can be evacuated. The work etch 1 interface 1 can load or remove the workpieces in the four slots of the vacuum lock 2 一次 one or more times. In still other embodiments, the vacuum lock 2 can be divided into an exchange layer for transferring the workpiece between the vacuum lock 2 and the processing chamber 4, and a cooling layer for cooling the finished workpiece. Take it to a non-vacuum environment for removal from factory interface 1. The transfer chamber 3 in Fig. 8 is a pentagonal vacuum chamber. There is a transfer device 15 in the transfer chamber 3, and the two transfer arms of the transfer device 15 can rotate synchronously or independently rotate the respective angles on a horizontal plane (for example, the two transfer arms can be rotated to each other at an I80 degree), and in the vertical direction. The directions move up and down along the main axis and can be stretched back and forth in the horizontal direction. In operation, the factory interface extracts the workpiece from the workpiece transfer cassette into the vacuum lock 2, and the workpiece is loaded into the processing chamber 4 by the delivery device I5 in the transfer chamber 3. Figure 9 is a plan view of the transfer device of the present invention in the processing chamber. Figure 1 The transfer device 15 has two transfer arms 151, 152 which are located above the same-spindle. The two extension arms m, 152 of the conveyor 15 can be rotated synchronously or independently on the horizontal surface of the vacuum lock 2 (Fig. 2) and the processing chamber 4 (Fig. 2). The conveyor device 15 is 141,659 each time. Doc -19- 200949899 Sending I (transfer arm 151 or transfer arm 152) to a processing chamber by loading or unloading a piece of workpiece by its workpiece loading and unloading port 23' and the transfer device 15 is in each or more than one vacuum lock Two pieces of workpiece can be taken out in 2. Two arms bl, 152 of the conveying device 15 can be moved up and down in the vertical direction with the main axis of the conveying device 15, and each arm (5), 152 of the agricultural device 15 can be freely disposed. Stretching back and forth in the horizontal direction. The two transfer arms iis, ^ of the conveying device 15 can be directed to the same direction, for example, simultaneously pointing to the same vacuum lock or the same processing chamber, and can also be individually rotated to point in different directions. For example, two transfer arm cutters are not buckled to two different process racks of the same vacuum lock, or W ❹ points to different two vacuum lock process racks; or, the transfer arm points to a real lock for Taking or placing a semiconductor workpiece into the vacuum lock while another transfer Monza to a processing chamber for taking or placing a semiconductor workpiece into the processing chamber; or two transfer arms respectively pointing to two different processing chambers disposed on the side of the transfer chamber for respectively The semiconductor workpiece is taken or placed in the processing chamber. Therefore, the plurality of transfer arms of the transfer device of the present invention can be flexibly: the pick-and-place operation of the semiconductor workpiece can be performed separately, and two pieces can be loaded or unloaded from one or more real locks at the same time. The semiconductor device can also continuously perform the loading, unloading or switching operation of the semiconductor workpiece into the processing chamber or the plurality of processing chambers, especially for the semiconductor process in which multiple vacuum locks or processing chambers are integrated. The processing system, and thus the throughput of the entire semiconductor process processing system, is greatly improved. Therefore, the transfer device of the present invention only needs to be adjusted by the transfer arm 151 during the workpiece exchange or loading and unloading process. The vertical position of m 'vacuum lock 2 workpiece holder and the workpiece exchange platform 25 in the processing chamber to 4 are fixed in the vertical position' only by transmitting 141659.doc -20- 200949899 device 1 The movement of 5 completes the workpiece exchange. Referring to Fig. 10, a workpiece exchange platform 25 corresponding to each of the suction isolation holes 16 is provided between the suction separation plate 13 and the heating base 19, as shown in Fig. In the embodiment, the workpiece exchange platform 25 has four pairs of transfer arms 37 corresponding to the four suction isolation holes 16. The workpiece exchange platform 25 is rotatable such that each pair of transfer arms 37 is located above the processing platform 5, and transmits (4) The upper portion is used for placing the semiconductor workpiece, and by the action of the ejector pin 19 in FIG. 3, the semiconductor workpiece can be placed on the heating base 19 from the transfer arm 37 of the workpiece exchange platform 25, or vice versa. The semiconductor workpiece is placed on the transfer arm 37 of the workpiece exchange platform 25 from the heating susceptor 19, and the transfer of such a workpiece is common in the prior art. There are many ways, which are not described in detail herein. The workpiece exchange platform 25 can also be rotated such that one pair is aligned with the loading and unloading port to engage the transfer device 15 in the transfer chamber 3 to place the workpiece on the transfer arm 37 or on the transfer arm 37. Unload the workpiece. After the treatment is completed, the workpiece is taken out of the chamber. First, in conjunction with the action of the ejector pin 19 in Fig. 3, the workpiece is placed on the four pairs of transfer arms 37 on the workpiece exchange platform 25. By rotating the workpiece exchange platform 25, each pair of transfer arms 37 on the workpiece exchange platform 25 is sequentially moved to one side of the workpiece loading and unloading port 23, and the transfer arm of the transfer device is loaded by the workpiece (4) 3 from each pair. The processed workpiece is taken out on the transfer arm and transferred to the vacuum lock 2. The flow of loading and unloading the workpiece by the conveyor will be described below in conjunction with the drawings. As shown here, the structure of the two vacuum locks 2 () 1, 202, - the transfer chamber 3 containing the transfer skirt = and the two processing chambers 4, 1, is exemplified. 5 In the embodiment, the two vacuum locks 201, 2〇2 each have four slots (not shown) 141659.doc • 21· 200949899 The device 15 has two transfer arms 、, 152; two processing chambers 4〇 ι and 4〇2 respectively have a loading and unloading port 231, 232 facing the transfer chamber 3, and processing chambers 4, 1, 402 respectively have four processing platforms, namely, processing platforms 513, 514 and processing platforms 521, 522, 523, 524. ❹ At the beginning, there are four workpieces in each of the vacuum locks 2〇1 and 202, and there are no workpieces in the two processing chambers. The conveying device 15 uses its two transfer arms 51, 152 to take out the "pieces" from the two slots of the vacuum lock 2G1, respectively, and the two transfer arms 151, 152 are in the up and down vertical positions. Then, the two transfer arms 151, 152 are rotated in the horizontal direction to the loading and unloading port 231 facing the processing chamber 4, and then the vertical position of the transfer arm 151 is adjusted so as to face the loading and unloading port 231, and the front and rear telescopic The transfer arm 151 places the workpiece held by the transfer arm i5i on the transfer arm 37 on the workpiece exchange platform 25, and the workpiece exchange platform 25 is rotated by a quarter turn; the transfer device is next. The other transfer arm 152 is vertically adjusted to face the loading and unloading port 231, and the workpiece held by the transfer arm is placed on the lower-to-transfer (4) of the workpiece exchange platform 25, and the workpiece exchange platform 25 is rotated by a further four quarters. A circle. Then, the transport device b is returned to its original position, and two pieces are taken out from the other two slots of the vacuum lock 2 () 1 : the arms 151, 152 are rotated to the right side of the loading and unloading port. Repeating the above-mentioned over-rotation will be placed on the workpiece exchange platform 25 successively, and the workpiece exchange is flat (4). 2 The transfer arm 37 carries the workpiece on the transfer arm 37, and then the upper and lower platform 25 is lifted and lowered by the workpiece parent and the top (10) is matched: 511, 512, 513, on. This completes the workpiece loading I of -1 = 401. Then, the conveyor 15 is retracted to true = "Repeat the above steps to complete the processing chamber 4 〇 2 work position 141659.doc -22- 200949899 After the loading is completed, the vacuum locks 201, 202 can be re-started from the workpiece by the need Load the workpiece. In the above embodiment, the order of the workpieces in the vacuum locks 2〇1, 2〇2 is free, and it is not necessary to be top-down or bottom-up.处理 After the processing chambers 401, 402 are processed, the processed workpieces in the processing chambers 401°, 402 need to be taken out and replaced with unprocessed workpieces. The specific process is as follows: the conveying device 15 uses the transfer arm 152 from the vacuum lock 2〇1 to take out the unloaded workpiece from the vacuum lock 2 (the slot in the slot), and rotates the transport skirt (four) to the processing chamber. At the time of the unloading port 231, it is assumed that the transfer arm 152 is below the transfer arm 151, and the transfer arm 151 is facing the loading and unloading port hi. The transfer arm 151 is taken out from the workpiece exchange platform 25 on the transfer arm 231. After the processed workpiece is removed, the loading and unloading port 231 has no workpiece on the transfer arm 37, and can wait for a new unprocessed workpiece to be placed. Then, the transfer arm 152 rises to the position of the loading and unloading port 231. And removing the new unprocessed I piece from the vacuum lock on the guard money delivery station 25, just removing one of the processed workpieces on the transfer arm 37, so that only the transfer device can be used The action of the upper and lower transfer arms 151, 152 is replaced by a new unprocessed workpiece on the transfer arm 37 with a new unprocessed workpiece on the transfer arm 37. = one turn. The conveyor 15 returns to its original position, its transfer arm 151 takes it from the workpiece The workpiece taken on the platform 25 is placed in the slot in the vacuum lock 2〇1, and the transfer arm 152 is taken out from the other slot in the vacuum lock 2〇1. The above workpiece is repeated: until the processing chamber After all the four workpieces have been exchanged, the workpiece exchange platform 25 unifies the workpiece on the processing platform, and then the workpiece exchange work of the processing chamber 4〇2 is performed. 141659.doc -23- 200949899 真空 Vacuum lock design In another preferred embodiment, the vacuum lock is designed in two layers, wherein the upper layer is an exchange layer for transferring and exchanging workpieces, and the lower layer is provided with a quartz pad which is easy to dissipate heat, so that the design can accelerate the cooling rate of the workpiece. Four workpieces are processed in the processing chamber. The factory interface i places the unprocessed workpieces in the exchange layer, and the transfer device 15 removes the unprocessed workpiece from the vacuum lock exchange layer by the transfer 52 and rotates it to the processing chamber. The loading port 231 of the chamber 4〇1 is located. The transfer arm 151 is opposite to the agricultural discharge port 23, and the transfer arm 〖a is under the transfer arm. The transfer arm 151 takes out the workpiece processed on the workpiece exchange platform 25, and then the transfer arm 152 rises to The position of the loading and unloading port 231 is placed on the workpiece exchange flat (4), and the workpiece exchange platform 25 is rotated by a quarter. The conveying device 15 is rotated to the vacuum lock, and the transfer arm 151 will process the workpiece. The cooling layer transfer arm 152 is placed in a new unprocessed workpiece from the exchange layer of the vacuum lock 2〇2. The real work lock 2G1 and 2G2 are replaced by a new unprocessed workpiece from the factory interface 1. The cooling layer of the vacuum lock 202 cools the workpiece and sends it to a non-vacuum environment. 便: The factory interface 1 picks up. The above completes the exchange of the workpieces. Then the transfer device 15 returns after completing the crossover sy, c. Vacuum lock 201. The same procedure is repeated until the workpiece replacement in the processing chamber 4〇]φ &gt; U1 is completed, and the workpiece exchange process of the processing chamber 402 is performed. In the example of the death, only the processing chamber with four processing platforms is introduced. For the other processing systems of the mother-processing chamber, the loading method can also be introduced according to the simple example of the above. Since the conveying device of the present invention has at least two transfer arms ' in an up and down positional relationship and the transfer arms can be vertically adjusted along the main axis of the transfer device I41659.doc -24- 200949899

The upper and lower positions of the section. Therefore, when the conveyor picks up the workpiece from the vacuum lock or the processing chamber, the workpiece can be loaded or unloaded only by the movement of the conveyor without the vacuum lock or the vertical adjustment of the processing chamber. Exchange actions. In detail, the 'semiconductor process processing system only needs to adjust the position of the plurality of transfer arms of the transfer device in the vertical direction during the loading or exchange of the workpieces' without the need to adjust the vacuum locks in the semiconductor process processing system as in the prior art. Or the position of the processing chamber in the vertical direction. Moreover, only by aligning the movement of the upper and lower transfer arms of the transfer device with the loading and unloading ports of the processing chamber, it is possible to easily use a new one on the same-to-transfer arm of the guard exchange platform in the processing chamber. The unprocessed workpiece is replaced with a processed workpiece', so that the workpiece can be loaded and unloaded and exchanged more quickly and at low cost, and the present invention is improved in the semiconductor process processing system using the above-mentioned transfer device, and has many advantages: The image transfer device of the present invention is less expensive to manufacture than the dual blade dual arms transfer device disclosed in the technique (U.S. Patent No. 5,855, 568), and is positioned more during the transfer of the semiconductor workpiece. More flexible and more accurate; in addition, at least two transfer arms of the conveyor of the present invention are disposed above and below the main shaft, and the arms of the prior art transfer device are disposed in a horizontal direction, and thus the transfer chamber of the present invention Can be set to report small, not only facilitates the design of the transfer chamber' but also makes the footprint of the entire semiconductor process processing system smaller, greatly reducing This cause and maintenance costs. Furthermore, the plurality of transfer arms of the transfer device of the present invention can flexibly perform the pick-and-place operation of the semiconductor workpiece separately, and can simultaneously load or unload two semiconductor workpieces from one or more vacuum locks, or continuously without waiting time. Ground-to-multiple processing chambers 141659.doc -25- 200949899 The loading, unloading or exchange of semiconductor workpieces is done indoors, especially for semiconductor process processing systems incorporating multiple vacuum locks or processing chambers, thus the entire semiconductor process The throughput of the processing system is greatly increased. The above description is only based on several preferred embodiments of the present invention and is not intended to limit the scope of the present invention. Any alterations, combinations, and variations of the components of the present invention which are well known in the art may be made without departing from the scope of the invention and the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the structure of a semiconductor process processing system of the present invention. 2 is a top plan view of the semiconductor process processing system of the present invention with the processing chamber top cover omitted. 3 is a schematic diagram showing the structure of a processing chamber of a semiconductor process processing system of the present invention. Figure 4 is a schematic illustration of the processing chamber of one of the semiconductor process processing systems of the present invention in the open state of the chamber header. Figure 5 is a schematic illustration of the bottom surface of a chamber substrate of a semiconductor process processing system of the present invention. Figure 6 is a schematic view showing the structure of the suction partitioning plate of the processing chamber of the present invention. Figure 7 is a cross-sectional view of the chamber base plate shown in Figure 4 taken along line. Figure 8 is a schematic view showing the structure of a vacuum lock and a transfer chamber of the present invention. Figure 9 is a top plan view of the transfer device of the present invention positioned within the processing chamber. Figure 10 is a top plan view of the workpiece exchange platform of the present invention located within the processing chamber. 141659.doc -26· 200949899 Figure 2 is a schematic view of the semiconductor workpiece loading process of the present invention. 12 is a schematic diagram of a conventional semiconductor process processing system. Figure 13 is a schematic illustration of another prior art semiconductor process processing system. [Main component symbol description] 1 Factory interface 2 Vacuum lock 3 Transfer chamber 4 Processing chamber

5 Treatment platform 6 Reactive gas supply unit 7 Control, venting and powering 8 Chamber top cover 9 Recessed part 〇 Extension 11 Sprinkler 12 Fine hole 13 Venting isolation plate 14 Exhaust port 15 Conveying device 16 Pumping Gas isolation hole 17 Exhaust tank 18 Chamber base 19 Heating base 2 thimble 141659.doc -27- 200949899 20, Shaft hole 21 Exhaust passage 22 Exhaust device 23 Loading and unloading port 24 Radial groove 25 Exchange platform 27 Connection groove 31 Center shaft 31' Shaft hole 33 Shaft hole 33, Shaft hole 37 Transfer arm 101 Batch processing system 102 Processing chamber 103 Processing platform 111 Transfer chamber 112 System 113 Processing chamber 151 Transfer arm 152 Transfer arm 201 Vacuum lock 202 Vacuum lock 231 Loading and unloading port 232 loading and unloading port

141659.doc -28- 200949899 401 Processing Chamber 402 Processing Chamber 511 Processing Platform 512 Processing Platform 513 Processing Platform 514 Processing Platform 521 Processing Platform 522 Processing Platform ® 523 Processing Platform 524 Processing Platform Reference 141659.doc

Claims (1)

200949899 VII. Patent application scope: A semiconductor processing chamber, comprising a plurality of processing platforms, characterized in that: a pumping isolation board is also disposed on the processing platform, and the pumping insulation board has a plurality of processing platforms corresponding to the processing platform. The gas isolating holes are used to isolate the reaction environments of the processing platforms from each other by evacuating the isolation holes during semiconductor processing. 2. Φ 3. The semiconductor processing chamber of claim 1, wherein the processing chamber further comprises a chamber top cover and a chamber base, the processing platform is disposed in the chamber base, and the suction isolation plate is disposed in the chamber Between the top cover and the chamber base. A semiconductor processing chamber according to claim 2, wherein the chamber top cover has a plurality of raised showerheads with fine holes. 4. The semiconductor processing chamber of claim 3, wherein the pumping isolation aperture on the pumping isolation panel corresponds to the showerhead, and the showerhead is in close proximity to the pumping during processing of the semiconductor workpiece. The suction isolation hole of the isolation plate. ❹ 5. If the request item 4 is half _ two holes, what to do: in the cavity below the suction isolation plate to the base plate has a heating base corresponding to each of the suction isolation holes. The gas isolation hole and the heating base form a processing platform. 6. The semiconductor processing chamber of the request item is characterized in that: the air is isolated, and a plurality of radial grooves are arranged around the radial groove, and the radial groove is distributed close to the periphery of the suction isolation plate and is closer to the isolation. The heart of the plate towel - side sparse. 7. The semiconductor processing chamber of claim 2, wherein the chamber top 141659.doc 200949899 is provided with a recessed portion and an extension portion is provided around the recessed portion. 8. The semiconductor processing chamber of claim 7 wherein: the exhaust isolation plate is also provided with an exhaust port in communication with the extension of the recess of the chamber cover. 9. The semiconductor processing chamber of claim 8 wherein the venting spacer is provided with a plurality of symmetrical exhaust ports. 10. The semiconductor processing chamber of claim 2, wherein at least one venting groove for exhausting is provided around the sinister isolation panel on the chamber substrate. 11. The semiconductor processing chamber of claim 10, wherein the bottom of the chamber substrate has an exhaust passage in communication with the exhaust passage, the exhaust passage being coupled to the exhaust device. 12. The semiconductor processing chamber of claim 1, wherein the flow direction of the gas in the processing chamber is: a reaction gas is sent from a shower head to each processing platform, and the semiconductor workpiece is placed on the heating base. After the treatment, due to the air pressure of the intake system and the extraction of the reaction gas by the exhaust device, the reaction gas flows out from the radial groove of the suction isolation plate of each processing platform, enters the concave portion of the top cover of the chamber, and is recessed. The extension of the portion flows, and the exhaust port around the suction partition flows into the exhaust groove of the chamber base, and then enters the exhaust device through the exhaust passage communicating with the exhaust groove. 13. The semiconductor processing chamber of claim 12, wherein the bottom of the heated susceptor is filled with an inert gas to prevent particulate dust from depositing under the heated pedestal and film growth. 141659.doc