KR100972255B1 - System and method for processing semiconductor workpieces - Google Patents

Abstract

The present invention is a semiconductor workpiece processing system comprising a load lock, a transfer chamber and one or several process chambers. Among them, the transfer chamber is located between the load lock and the process chamber, the process chamber can be installed around the transfer chamber, and the transfer chamber is also provided with a transfer device. The present invention can realize the loading / loading and replacement of the workpiece by using only the conveying device without using the loadlock or the vertical movement of the process chamber. In this way, the workpiece can be loaded / loaded or exchanged at a low cost and productivity can be increased. In addition, the present invention discloses a process chamber of an intake and exhaust system to which a special design is applied. Reactant barriers were formed between each worktable in the process chamber to improve uniformity between worktables and overcome the problem of interacting reactants between different worktables.

Load lock, process chamber, injection head, chamber top cover, loading chamber, transfer chamber, semiconductor processing, extension arm, removable gate, chamber base, exhaust passage

Description

Semiconductor workpiece processing system and processing method {SYSTEM AND METHOD FOR PROCESSING SEMICONDUCTOR WORKPIECES}

BRIEF DESCRIPTION OF THE DRAWINGS Explanatory drawing of the three-dimensional structure of the semiconductor workpiece processing system of this invention.

Figure 2 is a bird's eye view of the process chamber upper cover removed of the semiconductor workpiece processing system of the present invention.

3 is an exploded view of the process chamber structure of the semiconductor workpiece processing system of the present invention.

4 is an explanatory view of a state in which the top cover of the process chamber of the semiconductor workpiece processing system of the present invention is opened.

5 is an explanatory view of a chamber base bottom of the semiconductor workpiece processing system of the present invention.

6 is an explanatory view of the structure of the chamber base pumping separator 13 of the present invention.

FIG. 7 is a cross-sectional view of the chamber base 18 shown in FIG. 4 taken along the line I-I. FIG.

8 is an explanatory view of the structure of the load lock 2 and the transfer chamber 3 of the present invention.
The loadlock here is also referred to as the loading chamber and the transfer chamber is also referred to as the transfer chamber.

9 is a bird's eye view when the transfer device of the present invention is located in a process chamber.

10 is a bird's eye view when the workpiece change table of the present invention is located in a process chamber. The workpiece exchange table is also referred to herein as a workpiece divider.

11 is an explanatory view of a semiconductor workpiece loading flow of the present invention.

12 is an explanatory diagram of a conventional semiconductor workpiece processing system.

13 is an explanatory diagram of another conventional semiconductor workpiece processing system.

<Description of the symbols for the main parts of the drawings>

1: factory interface

2: load lock

3: transfer room

4: process chamber

5: working table

6: reactor feed

7: Control, exhaust and power plant

8: chamber top cover

9: groove area

10: extension part

11: spray head

12: handwork

13: pumping separator

14: air vent

15: conveying device

16: pumping separation hole

17: exhaust tank

18: chamber base

19: heating base

20: ejector pin

20 ': shaft hole

21: exhaust passage

22: exhaust system

23: long detachable gate

24: radial groove

25: exchange table

27: connecting groove

31: central axis

31 ': shaft hole

33: rotating shaft hole

33 ': shaft hole

37: transfer arm

101: batch processing system

102: process chamber

103: work table

111: transfer chamber

112: system

113: process chamber

151: transfer arm

152: transfer arm

201: loadlock

202: loadlock

231: long detachable gate

232: long detachable gate

401: process chamber

402: process chamber

511: work table

512: work table

513: work table

514: work table

521: work table

522: work table

523: work table

524: work table

The present invention relates to semiconductor manufacturing equipment technology, and more particularly, to a semiconductor workpiece processing system and a processing method.

Two types of semiconductor workpiece processing systems are commonly used. One is a system for batch processing of workpieces, and the other is a system for single cutting of workpieces. The batch processing system loads and processes several workpieces horizontally or vertically.

However, the distance between the workpieces is very limited in order to process several workpieces simultaneously in a plant. Therefore, a low pressure process is required to remove the gradient of gas pressure. Normally, if the distance between the workpieces exceeds one quarter of the thickness of the workpiece, the pressure must be lower than 500 milltorr. In this case, the deposition rate is lower than 100 A / min, which means that the processing time is longer.

Single-stage treatment systems have many advantages, such as uniformity of product processing, thermal reactions and processing speed of a single lot, but also have fatal shortcomings with low productivity and high production costs.

In order to solve the problem, a background processing system of US Pat. No. 58,556,81 is proposed. As shown in FIG. 12, the batch processing system 101 includes a process chamber 102, and a plurality of work tables 103 are installed in the process chamber 102, thereby providing a process chamber 102. ) Can not only handle several workpieces at the same time, but also need to pay attention to the gaps between the workpieces.

However, such a system also has a problem that affects the processing speed and quality of the workpiece so that the workpiece cannot be processed in large quantities effectively. Among them, the main problem affecting the processing quality is the uniformity of the processing conditions of each work table. In other words, the uniformity of the treatment conditions is mainly affected by the reaction medium and the temperature. Sealing between work tables usually blocks heat between the work tables, making it impossible to control the temperature uniformity between work tables. In addition, if the working tables are not sealed, the reaction medium between the working tables affects the uniformity of the gas state between the working tables.

As a result, process chambers with several existing work tables are still unable to mass process workpieces simultaneously with uniform quality.

In addition, US Pat. No. 6,068,965 suggested another workpiece batch system. As shown in FIG. 13, the system simplifies the transfer chamber 111 to reduce the machine installation space. However, this system has a problem in that the loading system 112 is complicated, the work load speed is slow, and the productivity is low because a waiting time for the loading / transfer of the work is required. Therefore, there is an urgent need for a facility that reduces the waiting time and improves the processing efficiency of the workpiece by devising an apparatus and method for quickly loading and transferring the workpiece.

In addition, the workpiece processing apparatus of the patent is limited to the number of workpieces that can be processed simultaneously in one machine because only one process chamber 113 can be installed, and the production cost is high.

In addition, the existing batch processing system of the workpiece has a problem that the machine structure is complicated, difficult to maintain and repair, and the unit cost is high because the cost is high when the transfer device is used for loading / transferring and replacing the workpiece.

An object of the present invention is to provide a semiconductor workpiece processing system that can solve the problems of low reliability and complicated mechanical structure existing in the conventional workpiece batch processing apparatus.

The present invention achieves the above object through the following technical method. That is, the semiconductor processing system includes a transfer chamber and a process chamber. The transfer chamber is equipped with a transfer unit, the process chamber has a demountable gate, the transfer unit has two or more individually expandable transfer arms, and the transfer arm can face the same demountable gate of the process chamber, It can be individually adjusted in the vertical direction toward the detachable gate, thereby carrying out and unloading the workpiece.

Among them, the two transfer arms are vertically aligned up and down toward the demountable gate. The transfer arm may rotate in a horizontal plane between the transfer chamber and the process chamber, and the two transfer arms of the transfer apparatus may move up and down along the central axis of the transfer apparatus. Each conveying arm of the conveying apparatus can be freely stretched in the front and rear directions.

This semiconductor workpiece processing system includes at least one load lock. The loadlock has several layers of workpiece support, and the transfer arm can be simultaneously directed to the position of the workpiece support of each layer of the load lock, so that the carrying out and carrying of the workpiece can be realized. Each loadlock is equipped with four layers of workpiece support. The load lock is divided into two layers, and the lower part of the work base is provided with heat dissipation pads to increase the heat dissipation effect.

Another object of the present invention is to provide a semiconductor workpiece processing system that can solve the problem that the processing uniformity existing in the existing workpiece batch processing apparatus is low and can not batch process the workpiece with high quality.

The present invention achieves the above object through the following technical method. That is, it includes a plurality of work tables, and a radial groove is provided around the work table, and an exhaust passage is installed around the process chamber, and the exhaust passage of the process chamber and the radial groove of the work table are mutually This object is achieved through a process chamber connected to form an exhaust system.

Among them, the process chamber includes a chamber top cover and a chamber base. A pumping separator is installed between the chamber top cover and the chamber base, the chamber top cover has several projection heads, and the pumping separator has several pumping separation holes corresponding to the injection head. The chamber base at the bottom of the pump separation plate has a heating base corresponding to the pumping separation hole, and the spray head, the pumping separation hole, and the heating base form a work table. Several radial grooves are installed around the pumping separator hole. The radial grooves are arranged such that the edges of the pumping separator are wider than the center. Several exhaust ports are provided around the pumping separator to correspond to the extension of the chamber upper cover groove.

The chamber base is provided with one or more exhaust tanks for the exhaust, which is connected to the exhaust port of the pumping separator. An exhaust passage connected to the exhaust tank is provided below the chamber base, and the exhaust passage is connected to the exhaust device.

The process of forming the gas barrier film formed by the airflow discharged around the work table is as follows. That is, gas is introduced into each work table through the spray head of the present invention. Due to the air pressure of the intake system and the pumping of the exhaust system, the gas flows out from each work table into the radial groove, and the flow rate of the gas is controlled by the action of the air pressure. Accelerated to form a gas film around the worktable. Inert gas gas is injected upward in the vicinity of the heating base to form a blocking film.

Another technical draft is as follows. It includes several work tables, on which a pumping separator is installed, which also includes several pumping separation holes corresponding to the work table. It is a semiconductor process chamber that isolates the reaction environment of each work table through a pumping separation hole during processing of a semiconductor workpiece.

Among them, the semiconductor process chamber also includes a chamber top cover and a chamber base. The work table is installed in the chamber base, and the pumping separator is installed between the chamber top cover and the chamber base. The chamber upper cover is provided with a spray head having a plurality of projection pores. The pumping separation hole of the pumping separation plate corresponds to the injection head, and the injection head is adjacent to the pumping separation hole of the pumping separation plate during processing of the semiconductor workpiece. The chamber base at the bottom of the pump separation plate has a heating base corresponding to each pumping separation hole, and the corresponding injection head, the pumping separation hole and the heating base form a work table. Several radial grooves are installed around the pumping separation hole, and the distribution of the radial grooves is arranged such that the peripheral side of the pumping separation plate is wider than the center side. Several exhaust ports are provided around the pumping separator to correspond to the extension of the chamber upper cover groove. Several symmetrical exhaust vents are provided around the pumping separator. At least one exhaust tank was installed around the chamber base near the pumping separator for exhaust. An exhaust passage connected to the exhaust tank is provided below the chamber base, and the exhaust passage is connected to the exhaust device.

The flow direction of the air flow in the process chamber is as follows. The reactor body flows into each work table by the injection head and performs processing on the semiconductor workpiece loaded on the heating base. The reactor gas flows out of the radial groove of the pumping separator plate and flows into the groove part of the chamber upper cover due to the air pressure of the intake system and the pumping of the reactor gas of the exhaust device. It enters the exhaust chamber of the chamber base through the exhaust port, and finally enters the exhaust system through the exhaust passage connected to the exhaust tank.

A workpiece mounting and demounting gate is installed on the side of the chamber base facing the transfer chamber. An inert gas is injected from the bottom of the heating base to prevent the deposition of fine dust and the formation of thin films in the heating base.

Another object of the present invention is to provide a semiconductor workpiece processing system that improves the problem of low work load / loading speed and low workpiece processing efficiency existing in the existing workpiece batch processing apparatus.

The present invention achieves the above object through the following technical method. That is, it is a system regarding the workpiece conveyance method of a semiconductor workpiece processing system. The semiconductor workpiece processing system of the present invention includes a transfer chamber and a process chamber. The transfer chamber is provided with a transfer apparatus, and the transfer apparatus has at least two transfer arms that can stretch in the horizontal direction. The method is realized in two steps as follows. (1) the transfer arm of the transfer device to take out a piece of work from the workpiece loading and detaching gate in the process chamber; (2) Completion of the operation of step (1) and at the same time the other transfer arm of the conveying device consists of the process of bringing the other workpiece into the process chamber through the workpiece demounting gate.

Among them, the conveying apparatus is rotatable in a horizontal plane in the conveying chamber, and the two conveying arms of the conveying apparatus can move up and down along the central axis of the conveying apparatus. The feeder imports or unloads the workpiece one by one through the workpiece demounting gate. The workpiece processing system also includes a loadlock, and the feeder can take out two workpieces each time from the loadlock.

Another technical design of the present invention is as follows. That is, it is a system concerning the workpiece loading method of a semiconductor workpiece processing system. The semiconductor workpiece processing system includes a load chamber, a transfer chamber and a process chamber with n work tables. In the process chamber, a workpiece exchange table is provided, and the transfer chamber has a transfer apparatus equipped with at least two transfer arms arranged at the upper and lower sides facing the same position. The step of loading a workpiece in the absence of a workpiece in the process chamber is as follows: (1) The transfer device takes out two workpieces from the load lock using two transfer arms; (2) Rotate the two transfer arms to move the demounting gate of the process chamber so that one of the transfer arms faces the demountable gate, and then load the workpiece loaded on the first transfer arm onto the workpiece exchange table, and then the workpiece Rotate the exchanger a quarter turn; (3) after adjusting the second transfer arm of the transfer device to the position facing the long removal gate, load the workpiece loaded on the second transfer arm to the workpiece exchange table; (4) the two transfer arms return to the loadlock and take out two new workpieces and rotate the workpiece changer one-tenth of a turn; (5) Repeat the above steps (2), (3) and (4) until the workpiece fills the process chamber.

The number n of work tables is a natural number and the number of process chambers is two or three. The load lock has a structure of upper and lower layers, and the upper layer transfers and exchanges the work to the exchange layer, and a lower heat pad is provided.

After step (5) is completed and all the workpieces have been processed, the workpiece exchange step is then entered. The exchange step includes: a. The feeder returns to the loadlock and removes one workpiece pending processing from the loadlock to the first transfer arm; b. Rotate the transfer device back to the process chamber position and direct the second transfer arm toward the demounting gate of the process chamber; c. The conveying apparatus takes out the processed workpiece one by one at the workpiece exchange table through the long mounting gate using the second transfer arm; d. Adjust the position of the feeder so that the first feeder is facing the demounting gate, and the feeder loads one workpiece to be processed into the workpiece exchange table through the demounting gate using the first feeder arm; e. The second transfer arm of the transfer unit returns to the load lock, and the second transfer arm carries the processed workpiece into the load lock.

The workpiece exchange table is provided with n pairs of transfer arms, and the workpiece exchange table is rotatable so that each pair of transfer arms corresponds to the work table.

A system relating to a workpiece transfer method of a semiconductor workpiece processing system, wherein the semiconductor workpiece processing system includes a load lock, a transfer chamber, n work table process chambers, and a workpiece exchange table is provided in the process chamber. Among them, the transfer chamber is provided with a transfer apparatus having two transfer arms arranged in the same direction and arranged in the upper and lower portions. The steps of transferring the workpiece with the workpiece filled in the process chamber are as follows. (1) The transfer device takes out one workpiece from the workpiece exchange table through the long detachable gate using the first transfer arm; (2) the workpiece exchange table is rotated one-nth of a turn to adjust the position of the second feed arm toward the demountable gate; (3) The conveying apparatus takes out a workpiece from the workpiece exchange table using the second transfer arm through the long mounting gate; (4) the second transfer arm of the feeder returns to the loadlock and loads the two workpieces into the loadlock; (5) Repeat the above steps until all workpieces in the process chamber are transferred.

Among them, the work table number n is a natural number and the number of process chambers is two or three. The load lock has an upper and lower layer structure, the upper layer transfers and exchanges the workpiece to the exchange layer, and the lower layer is provided with heat dissipation pads. The workpiece change table is equipped with n pairs of transfer arms. The workpiece change table is rotatable and each pair of transfer arms corresponds to the work table.

A system relating to a workpiece exchange method of a semiconductor workpiece processing system, the system includes a load lock, a transfer chamber, and n work table process chambers, and a workpiece exchange device is installed in the process chamber. Among them, the transfer chamber is provided with a transfer apparatus having at least two transfer arms located in the upper direction and in the lower direction. The step of exchanging the workpiece with the workpiece in the process chamber is as follows. (1) The feeder returns to the loadlock and takes out one workpiece to be processed from the loadlock using the first transfer arm; (2) rotate the transfer device to return to the process chamber position, with the second transfer arm facing the demounting gate of the process chamber; (3) The transfer device takes out a processed workpiece from the workpiece exchange table using the second transfer arm through the long mounting gate; (4) After adjusting the position of the transfer device so that the first transfer arm is directed to the demounting gate, the transfer unit carries one workpiece to be processed into the workpiece exchange table through the demounting gate using the first transfer arm; (5) The second transfer arm of the transfer unit returns to the load lock and loads the processed workpiece loaded on the second transfer arm into the load lock.

Among them, the work table number n is four natural numbers and the number of process chambers is two or three. The load lock has an upper and a lower layer structure, and the upper layer serves as a transfer layer to transfer and exchange the work, and a lower layer is provided with heat dissipation pads. The loadlock accommodates two or four workpieces. The workpiece exchange table is equipped with n pairs of transfer arms, the workpiece changer is rotatable, and each pair of transfer arms corresponds to a worktable.

The present invention applies the workpiece transfer structure of the unique transfer device, it is possible to load / transfer the workpiece more quickly and increase the productivity. The process chamber of the present invention discloses a uniquely designed intake and exhaust system. By forming a reactor gas barrier between the various work tables, the uniformity between the work tables is improved, and the mutual interference of the reactants between the floating work tables is overcome.

BRIEF DESCRIPTION OF THE DRAWINGS The three-dimensional structure explanatory drawing of the semiconductor workpiece processing system of this invention. The present invention consists of one standard factory interface (1), two load locks (2), one transfer chamber (3), one or several process chambers (4). Among them, the factory interface 1 is adjacent to the load lock 2, the transfer chamber 3 is located between the load lock 2 and the process chamber 4, several process chambers 4 are (3) Can be installed around. Each process chamber 4 includes several work tables 5, each work table 5 being capable of processing one semiconductor workpiece. As in the embodiment of FIG. 1, the semiconductor workpiece processing system includes two process chambers 4, and two process chambers 4 are installed around the transfer chamber 3. At the top of each process chamber 4, all one chamber top cover 8 is installed, and for the sake of simplicity of the present invention, the chamber top cover 8 of the process chamber 4 is placed in a sealed state and the other The chamber top cover 8 is placed in the open state. As can be seen from the closed chamber top cover 8, the reactor top supply 8 of the process chamber 4 is provided with a reactor supply 6, and the reactor supply 6 is an intake pipe. The reactor gas is injected into the floating work table 5 of the process chamber 4 from above the chamber top cover 8. Further, as can be seen from the chamber top cover 8 in the open state, there is a groove portion 9 inside the chamber top cover 8, and one extension portion 10 is provided around the four groove portions 9, respectively. have. The groove part 9 is provided with the projection head 11 of the projection form of the quantity equivalent to the number and quantity of the work tables 5. The injection head 11 is provided with several pores 12 which are densely and uniformly distributed so that the reactor gas provided from the reactor gas supply device 6 flows into the work table 5. Moreover, the control, exhaust, and power unit 7 necessary for the processing of the workpiece are also provided on the pedestal side of the process chamber 4. Description thereof will be omitted. Each process chamber 4 of the present invention can share a set of chamber cleaners, a reactor body supply device, an exhaust pump and a detector. In the case of plasma chemical vapor deposition, the work table 5 of the same process chamber 4 may jointly use one radio frequency energy device.

2 is a bird's-eye view of a state in which the process chamber top cover of the present invention is removed from the process chamber. In the embodiment of FIG. 2, the transfer chamber 3 is pentagonal and up to three process chambers 4 can be installed in the periphery. Although two process chambers are provided in the embodiment of FIG. 2, only one process chamber may be installed. And in other embodiments, the transfer chamber 3 may take various other forms, such as hexagonal. Accordingly, the maximum quantity of process chambers 4 that can be installed around the transfer chamber 3 is also different. The process chamber 4 of the FIG. 2 embodiment is rectangular in shape with beveled edges and four work tables 5 are provided therein. Of course, in other embodiments the process chamber 4 may also be equipped with various numbers of work tables 5.

3 is an exploded explanatory view of the process chamber structure of the semiconductor workpiece processing system of the present invention. In FIG. 3, the process chamber includes a chamber top cover 8, a pumping separator 13, a workpiece exchange table 25, a heating base 19 and a chamber base 18. Among them, the heating base 19 is installed in the shaft hole 31 'of the chamber base 18 through the central shaft 31, and the pumping separator 13, the workpiece exchange table 25 and the chamber base 18 ) Is installed below and above the axis centerline of the cavity, the chamber top cover 8 and the chamber base 18 can be mechanically connected to close or open. When the chamber top cover 8 is closed to the chamber base 18, a closed workpiece process chamber is formed inside the chamber top cover 8 and the chamber base 18. In the process chamber of the present invention, a special description may be required. Several workpiece work tables may be installed. In the embodiment of FIG. 3, for example, four workpiece work tables are provided for convenience of description.

The chamber top cover 8 is recessed in to form a groove portion 9 and there is a protrusion 10 in the periphery of the groove 9. When processing the semiconductor workpiece, the chamber top cover 8 is closed to form a sealed reactor chamber inside, which passes through a constant flow in the groove section 9 and is finally discharged into the process chamber. (More on that later). In the groove part 9 of the chamber upper cover 8, four injection heads 11 with protrusions of the groove parts 9 are provided, and the injection head 11 has pores for injection of the reactor body. (12) was uniformly distributed.

The pumping separation plate 13 is provided with a plurality of pumping separation holes 16 corresponding to the number and positions of the injection heads 11. The upper end of the pumping separation hole 16 has a large diameter and a small diameter at the lower end, whereas the injection head 11 of the chamber upper cover 8 has a diameter smaller than the diameter of the upper end of the pumping separation hole 16, and the pumping separation is performed. In a form larger than the diameter of the bottom of the hole 16, this design allows the spray head 11 and the pumping separation hole 16 to be in close contact when the chamber top cover 8 is closed to the chamber base 18. In addition, four exhaust ports 14 penetrating the extension part 10 of the groove part 9 of the chamber upper cover 8 are provided around the pumping separator plate 13.

The workpiece exchange table (25) acts to transfer the workpiece between the various work tables (5), and the opening and closing transfer arm of the same quantity as the quantity of the workpiece system uniformly installed around the rotary shaft hole 33 and the rotary shaft hole 33 37 is installed, the transfer arm 37 is used to load the workpiece. The workpiece exchange table is rotatable 25 so that each pair of transfer arms 37 is located above the work table 5. In this embodiment, four pairs of open and close transfer arms 37 of the pumping separator plate exhaust port work exchange table 25 and the pumping separator hole 16 of the pumping separator plate 13 correspond to each other.

The heating base 19 has a circular heating table, and has a central axis 31 at the center of the lower end of the heating table, so that the heating base 19 can be moved up and down along the shaft hole 31 'in the chamber base 18. . The heating table is loaded with workpieces waiting to be processed. The heating base 19 is also movable up and down along the axial hole 20 'of the chamber base 18 to harmonize with the loading and unloading operation in the heating base 19 of the workpiece exchange table 25. Several ejector pins 20 are provided. The number and arrangement of the ejector pins 20 vary. In the embodiment of FIG. 3, the ejector pins 20 distributed in three triangular forms are provided on each heating base 19.

As can be seen from FIG. 3 and FIG. 4, the center of the chamber base 18 has a shaft hole 33 ′ having a hollow shaft center and a rotation shaft hole 33 of the workpiece exchange table 25. 25 is provided in the shaft hole 33 'of the chamber base 18 by a rotating mechanism (not shown). In the chamber base 18, four work table 5 is provided, and each work table is provided with one shaft hole 31 'and three shaft holes 20'. The central shaft 31 of the heating base 19 can be lifted up and down in the shaft hole 31 ', and the ejector pin 20 can also be lifted up and down in the shaft hole 20'. The chamber base 18 faces the workpiece mounting / detachment gate 23 into which a workpiece installed on one side of the workpiece work table 5 can be carried in and taken out. The chamber base 18 is provided with exhaust tanks 17 capable of exhausting air from both sides of the work mounting / detachment gate 23, respectively. Under the chamber base 18, an exhaust device 22 connected to the exhaust passage 21 is installed. FIG. 7 is a cross-sectional view of the chamber base 18 shown in FIG. 4 taken along the line I-I. As can be seen from FIG. 7, between the exhaust tank 17 and the exhaust passage 21 is penetrated by the connecting groove 27. Therefore, the exhaust tank 17, the exhaust passage 21, and the exhaust apparatus 22 communicate with each other.

6 is an explanatory view of the structure of the pumping separator 13 of the present invention. As shown in FIG. 6, a plurality of radial grooves 24 are installed around the pumping separation hole 16 of the pumping separator 13. A plurality of exhaust ports 14 are also provided around the pumping separator 13 to be connected to the extension 10 of the groove portion 9 of the chamber upper cover 8.

As can be seen from FIG. 3, when processing a workpiece, the chamber top cover 8 is covered with the chamber base 18 to form a working chamber, and within the working chamber, a pumping separator 13 is placed on the chamber base 18. And each pumping separating hole 16 of the pumping separating plate 13 is located above the heating base 19. The injection head 11 of the chamber top cover 8 is attached to the pumping separating hole 16 of the pumping separating plate 13, and the heating base 19 is adjacent to the pumping separating plate 13. The finished workpiece is placed between the heating base 19 and the pumping separator plate 13, and the transfer arm 37 of the workpiece exchange table 25 is interfered with the heating base 19 by various installation methods. It is located in such a position so that the reactor body injected from the injection head 11 does not affect the operation of directly spraying the workpiece onto the heating base 19. Thus, the spray head 11, the pumping separator 13 and the heating base 19 form the work table 5. The reactor body feeder 6 injects the reactor body to the work table 5 through the pores 12 of the injection head 11 at the top of the chamber top cover 8. The reactor body is injected from the injection head 11 and then subjected to processing on the semiconductor workpiece lying on the heating base 19. Since the radial groove 24 is provided in the pumping separator plate 13, the injection head 11 and the pumping separator plate 13 in the chamber upper cover 8 are not completely sealed, and thus the injection head 11 After the reaction gas enters the work table 5 through the distributed pores 12, the workpiece is processed, and then flows out through the gap of the pumping separation plate composed of the radial grooves 24, and the upper part of the chamber. It flows into the recessed part 9 of the cover 8, and then into the extension part 10 of the groove part 9. Since the exhaust portion 14 of the extension portion 10 and the pumping separator plate 13 has penetrated each other, the outflowed gas flows to the plurality of exhaust holes 14 of the pumping separator plate 13 by the action of the exhaust device 22. Automatically flows in, and several exhaust ports 14 are connected to the exhaust tank 17 installed in the chamber base 18 and the exhaust tank 17 and the exhaust passage 21 penetrate each other. It is introduced into the exhaust passage 21 and finally pumped through the exhaust 22 to form a complete intake and exhaust system. In addition, due to the air pressure of the reactor gas supply device 6 and the pumping of the reactor gas in the exhaust device 22, the flow rate of the reactor gas in the intake and exhaust system is accelerated to form a gas film around the work table 5, thereby allowing different operations. Reaction gases between tables do not cause interference.

In addition, in consideration of the influence on the flow velocity of the reactor body due to the non-uniformity of the atmospheric pressure inside the process chamber 4, the present invention is to arrange the radial groove 24 to the periphery of the pumping separation plate 13 with a wider interval and The spacing was narrow. This structure makes the flow of the reactor body flowing out of the radial grooves 24 into the exhaust device 22 more uniform.

In addition, since the work table 5 in the process chamber 4 is symmetrically installed, the resistance received by the reactive gas discharged from each work table 5 becomes uniform. The present invention uses the exhaust tank 17 installed in the chamber base 18 to approach the periphery of the pumping separator plate 13 so that the discharged gas is pumped uniformly and quickly, thereby making the work pieces uniform. To be handled. In addition, the present invention utilizes a gap composed of a radial groove 14 between the injection head 11 and the pumping separator plate 13 as an exhaust port of the work table 5, so that the gas flow in the work table 5 can be controlled. Uniformity can be achieved, and each work table is isolated by the gas film while the discharged gas forms a gas film, and the work environment of the work table is relatively independent. In addition, an inert reactive gas barrier membrane may be formed around the heating base 19 to spray upward, thereby preventing the reactor gas from leaking or flowing through the gap between the heating base 19 and the pumping separator plate 13. Can be. The present invention prevents the mutual interference between the reaction gases between the work tables through the above means.

2 is a bird's eye view when the process chamber upper cover of the semiconductor workpiece processing system of the present invention is removed. The workpiece is transferred from the workpiece box to the semiconductor workpiece processing system of the present invention via a production line, and the factory interface 1 takes the workpiece out of the workpiece box and loads it on the load lock 2. The transfer chamber 3 is provided with a transfer device 15, and the transfer device 15 is provided with two or more stretchable transfer arms. (Detailed later) In the illustrated embodiment, the transfer device 15 is a two-arm robot having two transfer arms, and of course, a robot having two or more transfer arms may be installed. The transfer device 15 takes the workpiece out of the load lock 2 and loads it on the work table 5 of the process chamber 4. After loading the workpieces on all the work tables 5 in the process chamber 4, the process chamber 4 performs processing on the workpieces. After the completion of the processing, the processed workpiece is again taken out using the transfer device 15 of the transfer chamber 3, and the workpiece waiting for processing is loaded at the original position and processed for the next batch. The unloaded workpiece is loaded into the load lock 2 and cooled. After completion of cooling, the workpiece is brought into the workpiece box of the production line through the factory interface 1 and transferred to the next step.

8 is an explanatory view of the structure of the load lock 2 and the transfer chamber 3 of the present invention. The present invention has two load locks 2, and the load locks 2 are provided at positions adjacent to both sides of the factory interface 1 of the pentagonal transfer chamber 3. Among them, each loadlock 2 is divided into four layers, each of which can accommodate one work piece. The loadlock 2 and each layer of the loadlock 2 can be pumped into a vacuum. The factory interface 1 can import or unload the workpiece once or several times in four layers of the loadlock 2. In some embodiments the loadlock 2 may sometimes be divided into an exchange layer or a cooling layer, which is used to transfer the workpiece between the load lock 2 and the process chamber 4, the cooling layer being cooled. A workpiece is transferred to a non-vacuum environment for factory interface 1 to be taken out.

In FIG. 8, the transfer chamber 3 is a pentagonal vacuum chamber. The conveying device 15 is installed in the conveying chamber 3 and the two conveying arms of the conveying device 15 are rotated in synchronization with each other in a horizontal plane or independently at a constant angle (for example, the two conveying arms are rotated to form a 180 degree angle with each other). It can be rotated, and can move up and down along the center axis in the vertical direction, and can be stretched forward and backward in the horizontal direction. In operation, the factory interface 1 takes the workpiece out of the workpiece transfer box into the loadlock 2 and again loads the workpiece into the process chamber 4 by the transfer device 15 of the transfer chamber 3.

9 is a bird's eye view when the transfer device of the present invention is located in the process chamber. The transfer device 15 has two transfer arms 151 and 152, and the two transfer arms 151 and 152 are aligned below and above the same central axis. The two transfer arms 151 and 152 of the transfer device 15 are either synchronously or rotatable in a horizontal plane between the load lock 2 (FIG. 2) and the process chamber 4 (FIG. 2). The transfer device 15 loads a work piece into the process chamber or takes out a work piece from the process chamber through the long mounting gate 23 of the work piece using a transfer arm (the transfer arm 151 or the transfer arm 152). (15) may carry out two workpieces simultaneously from one or several load locks 2 each time. Each conveying arm 151, 152 of the conveying device 15 can be moved and adjusted in the vertical direction along the vertical direction of the center axis of the conveying device 15, and each conveying arm 151, 152 of the conveying device 15 is freely free from the horizontal direction. It can be stretched left, right, front and back. The two transfer arms 151 and 152 of the transfer device 15 may face one direction at the same time. For example, they can simultaneously face the same loadlock or process chamber. In addition, the two transfer arms may rotate independently and may face different directions. For example, two transfer arms can each point to two different workpiece supports of one loadlock; Each may face a different loadlock workpiece support. The transfer arm can carry semiconductor workpieces into or out of the loadlocks towards the loadlocks; The other transfer arm brings the semiconductor workpiece into and out of the process chamber toward the process chamber; It is also possible for both transfer arms to bring in / out of the workpiece into the two process chambers, respectively, towards the two process chambers installed on one side of the transfer chamber. Therefore, the several transfer arms of the inventors of the present invention can smoothly carry out the semiconductor workpiece export / import operation alone, and can simultaneously load or transfer two semiconductor workpieces from one or several loadlocks, and continuously stand by. You can load / load and replace semiconductor workpieces in one or several process chambers without the need for time. In particular, the present invention is applied to a semiconductor workpiece processing system incorporating several load locks or process chambers, thereby greatly improving the throughput of the semiconductor workpiece processing system. Therefore, the feeder 15 of the present invention is the work holder of the load lock 2 and the workpiece changer 25 of the process chamber 4 only by adjusting the vertical positions of the feed arms 151 and 152 of the feeder 15. The workpiece can be exchanged, stacked and transferred in a fixed state, and the workpiece can be exchanged only by the operation of the feeder 15.

In FIG. 10, a work exchange table 25 corresponding to each pumping separation hole 16 and each other is provided between the pumping separation plate 13 and the heating base 19. In the embodiment of FIG. 10, four pairs of transfer arms 37 and four pumping separation holes 16 correspond to each other in the workpiece exchange table 25. The workpiece exchange table 25 is rotated to position each pair of transfer arms 37 above the work table 5, and thereafter loads a semiconductor workpiece on the transfer arms 37, and the ejector pin 20 of FIG. By operation, the semiconductor workpiece is easily loaded on the heating base 19 by the transfer arm 37 of the workpiece exchange table 25, or vice versa, the semiconductor workpiece is transferred from the heating base 19 to the workpiece exchange table 25. Load at 37. Since the feed flow of such a workpiece is very widely used in various forms in the prior art, the description thereof is omitted here. The workpiece exchange table 25 can also be rotated to direct a pair of transfer arms toward the demountable gate 23, so that the transfer device 15 in the transfer chamber 3 moves the workpiece to the workpiece exchange table 25. It is in harmony with the operation of loading on a pair of transfer arm 37 or transfer the workpiece in the transfer arm 37.

After processing, the workpiece is again taken out of the process chamber. First, through the operation of the ejector pin 20 of FIG. 3, the workpiece is loaded on the four pairs of transfer arms 37 of the workpiece exchanger 25. Next, by rotating the workpiece exchanger 25, every pair of transfer arms 37 of the workpiece exchanger 25 are directed to one side of the workpiece loading and detaching gate 23 according to the step, and then the transfer arm of the transfer device 15 The processed workpiece is taken out of each pair of transfer arms 37 through the workpiece mounting / detachment gate 23 and transferred to the loadlock 2.

Hereinafter, according to the accompanying drawings will be described the flow of the transfer device of the present invention to load / transfer the workpiece. As can be seen from FIG. 11. Here, a structure consisting of two load locks 201 and 202, a transfer device 15 and a transfer chamber 3 and two process chambers 401 and 402 will be described as an example. In the present embodiment, the two load locks 201 and 202 have four grooves (not shown). The transfer device 15 has two transfer arms 151 and 152, and two process chambers 401 and 402 have one long mounting gate 231 and 232 facing the transfer chamber 3, respectively, within the process chambers 401 and 402. Has four work tables each. That is, work tables 511, 512, 513, 514 and work tables 521, 522, 523, 524.

In the initial state, there are four workpieces in the loadlocks 201, 202 and no workpieces in the two process chambers 401,402. The transfer device 15 carries out workpieces one by one from two grooves of the load lock 201 using two transfer arms 151 and 152, in which case the two transfer arms 151 and 152 are aligned in the vertical position. The two transfer arms 151 and 152 are then rotated in a horizontal direction to face the mounting gate 231 of the process chamber 401, and then the vertical position of the transfer arm 151 is adjusted so that the transfer arms face the mounting gate 231. After that, the workpiece loaded on the transfer arm 151 is loaded onto the pair of transfer arms 37 of the workpiece exchange table 25 using the transfer arm 151 which is stretchable back and forth, and the workpiece exchange table 25 is divided into four parts. Rotate 1 turn. Then, the other pair of feed arms 152 of the feeder 15 is adjusted upward in the vertical direction to the demounting gate 231, and the work loaded on the feed arms 152 is transferred to the next pair of the workpiece exchange table 25. Loaded on the transfer arm 37, the workpiece exchange table 25 is again rotated a quarter turn. Then, the conveying device 15 returns to its original position and unloads two workpieces from the other two grooves of the load lock 201 while simultaneously adjusting the conveying arms 151 and 152 to the position toward the demounting gate 231. By repeating the above process, the workpieces are loaded on the workpiece exchange table 25 in sequence, and after the workpiece exchange table 25 is rotated once, all the workpieces are loaded on the four pairs of transfer arms 37. Then, the workpiece exchange apparatus 25 The workpiece is loaded into the work tables 511, 512, 513, and 514 at a time by the vertical lifting and lowering operation of the &quot; The workpiece is loaded into the process chamber 401 through the above process. Next, the transfer device 15 is moved to the load lock 202 position and the above steps are repeated to load the workpiece into the process chamber 402.

After the loading is completed, the load locks 201 and 202 load the new work piece from the work box as needed. In the above embodiment, the export / import order of the workpieces in the load locks 201 and 202 can be set freely, and it is not necessary to carry out / import in the order from the top to the bottom or from the bottom to the top.

After completion of processing in the process chambers 401 and 402, the processed workpieces in the process chambers 401 and 402 must be taken out and the workpieces waiting to be processed must be brought in. The specific order is as follows. The transfer device 15 carries out a workpiece being processed in the groove of the load lock 201 using the transfer arm 152, and then rotates the transfer device 15 to remove the mounting gate 231 of the process chamber 401. ). In this case, it is assumed that the transfer arm 152 is positioned below the transfer arm 151, and the transfer arm 151 faces the demountable gate 231. When the transfer arm 151 carries out each processed workpiece from the pair of transfer arms 37 facing the long detachable gate 231 of the workpiece exchanger 25, the pair of transfer arms 37 toward the long detachable gate 231 There is no workpiece and waits for the workpiece to be processed. Then, the transfer arm 152 ascends to the position of the mounting / detachment gate 231, and at the same time, the workpiece waiting to be removed from the load lock is transferred to the workpiece exchange table ( A pair of transfer arms 37 of the workpiece exchange table 25 is loaded onto the pair of transfer arms 37 taken out of the processed workpiece 25, and thus only by the operation of the upper transfer arms 151 and 152 below the transfer device 15. ), You can replace the finished workpiece with the workpiece waiting to be processed. After the above operation, the workpiece exchange table 25 is again rotated a quarter turn. The transfer device 15 returns to its original position, the transfer arm 151 carries the workpiece taken out from the workpiece exchange table 25 into the groove of the load lock 201, and the transfer arm 152 again returns the load lock 201. Take the workpiece out of the other groove. After repeating the above steps until all four workpieces of the process chamber are replaced in this manner, the workpiece exchange table 25 loads all the workpieces on the work table at once. As soon as the loading is completed, the process chamber 402 proceeds with the workpiece processing.

Another embodiment of a highly preferred loadlock design is to design the loadlock in two layers. The upper layer is used for transporting or exchanging the treatment as an exchange layer, and the lower layer installs a quartz pad which is easy to dissipate heat. This design can accelerate the heat dissipation of the treatment. Assuming that four treatments have been processed in the process chamber, the factory interface (1) loads the pending treatment on the exchange layer and the transfer device (15) uses the transfer arm (152) to stand by in the load lock exchange layer. The processed object is taken out and rotated to the position of the long detachable gate 231 of the process chamber 401. The transfer arm 151 faces the long removable gate 231 and the transfer arm 152 is below the transfer arm 151. After the transfer arm (151) has taken out the workpiece processed at the exchange table (25), the transfer arm (152) is located at the demountable gate (231) to place the workpiece taken out of the load lock on the exchange table (25) and the workpiece exchange table. (25) rotates a quarter of a turn The feeder 15 rotates to the loadlock 202 and the transfer arm 151 loads the finished product onto the cooling bed. Pick-up new material in process waiting in the exchange bed of 202) The load locks 201, 202 and the exchange bed obtain new material in process-waiting from the factory interface 1. At the same time, the processed product is cooled and delivered to a non-vacuum environment, so that the factory interface (1) can be picked up, and the replacement of one or more processed materials is completed. Return to the process The same step is repeated until the workpiece change of the chamber 401 is completed, and the workpiece change procedure of the process chamber 402 proceeds again.

Although only the process chamber in which four work tables are installed in the above embodiment has been described, the semiconductor workpiece processing system in which the work table of a different quantity is installed in the process chamber can be simply implemented according to the above embodiment. have.

The transfer apparatus of the present invention has two or more bottom and top aligned transfer arms so that the transfer arm can be moved vertically along the center axis of the transfer device to adjust the up and down position. When loading, it is possible to realize the loading / loading and replacement of the workpiece even by the operation of the conveying device without the need to adjust the loadlock or the vertical position of the process chamber. In other words, the semiconductor workpiece processing system can be realized only by adjusting the position of the several transfer arms of the transfer device in the vertical direction when loading / taking and exchanging the workpiece. There is no need to adjust the position in the vertical direction. In addition, since the lowering of the transfer device, the upper transfer arm of the process chamber by the operation of the upper arm can be directed to the process chamber, a pair of transfer arm of the workpiece exchange table of the process chamber is conveniently replaced with the workpiece waiting to be processed. This can increase productivity by enabling the loading / taking and exchange of workpieces more quickly and at lower cost.

The present invention applies the transfer apparatus to a semiconductor workpiece processing system, and has the following advantages, that is, the transfer apparatus of dual blades dual arms as proposed in the prior art (US Pat. No. 58,556,81). In comparison, the conveying apparatus of the present invention is cheaper in manufacturing cost and more freely and precisely fixed in the process of conveying the semiconductor workpiece. In addition, the transfer arm of the transfer device of the present invention can be designed to be very small because the transfer arm of the present invention is installed in the lower and upper positions along the central axis, unlike the conventional arm transfer device installed in the horizontal direction. This not only simplifies the design of the transfer room, but also significantly increases manufacturing and maintenance costs by minimizing the total area of the semiconductor workpiece handling system. In addition, the several transfer arms of the transfer apparatus of the present invention can smoothly carry out / export operation of the semiconductor workpiece independently, and may load or transfer two semiconductor workpieces simultaneously on one or several load locks. In this way, the semiconductor workpiece can be loaded / loaded and exchanged against one or several process chambers continuously without any waiting time. In particular, it can be applied to a semiconductor workpiece processing system having a plurality of load locks or process chambers can significantly improve the processing capacity of the semiconductor workpiece processing system.

The above described embodiments are only some preferred embodiments of the present invention, and the present invention is not limited to the above described several embodiments. Alternative variations, combinations, separations, and the like, which are commonly used in the technical field of the present invention, and the equivalent modifications and replacements that are commonly used in the industry, which are implemented in the present invention, do not exceed the design and protection scope of the present invention.

Claims (28)

A semiconductor workpiece processing system, the system comprising: A plurality of process chambers equipped with a plurality of work tables inside each chamber; One transfer chamber connected to the plurality of process chambers; It is connected to the transfer chamber, each loading chamber is provided with a plurality of grooves for loading the semiconductor workpiece, to supply the semiconductor workpiece in the process waiting to each process chamber, and to finish the processed semiconductor workpiece in the process chamber A plurality of loading chambers that serve to receive; Installed in the transfer chamber and having at least two extension arms, each of which extends a semiconductor workpiece into a process chamber or a loading chamber so that a maximum number of semiconductor workpieces can be processed in each process chamber, A transport device which is movable in a vertical or horizontal direction to be carried out; Semiconductor workpiece processing system comprising a. The method of claim 1, And said at least two extension arms are all vertically aligned so as to be directed to the workpiece mounting gate. The method of claim 1, And said at least two extension arms rotate horizontally in a plane between a transfer chamber, a loading chamber or a process chamber. The method of claim 1, Each of the loading chambers is connected to a transfer chamber, and each of the extension arms may face a workpiece loading groove of each of the loading chambers, and the semiconductor workpiece may be carried in and out of the loading groove. system. A method for transferring a semiconductor workpiece of a semiconductor workpiece processing system, the method comprising: Providing a plurality of process chambers having a plurality of work tables attached to each chamber; Providing a transfer chamber connected to each of said process chambers; It is connected to the transfer chamber, each of the loading chamber is provided with a plurality of grooves for loading the semiconductor workpiece, supply the semiconductor workpiece in the process waiting to each process chamber, and finished semiconductor workpiece in the process chamber Providing a plurality of loading chambers that serve to receive the; Installed in the transfer chamber and having at least two extension arms, each of which extends the semiconductor workpiece to each process chamber and the loading chamber so as to be able to process the maximum number of semiconductor workpieces in each process chamber. Providing a transport apparatus for carrying in, carrying out, vertically and horizontally; Using one of the extension arms to eject the semiconductor workpiece from the loading chamber, then rotating the extension arms toward the workpiece demounting gate of the process chamber; After moving the extension arm with the work piece vertically to fix it in the proper position, let another extension arm move forward horizontally into the process chamber through the work piece removal gate, picking up one piece of semiconductor, and then Retracting to the gate to eject the semiconductor workpiece within the process chamber; And After the step of unloading the semiconductor workpiece, the other extension arm is vertically moved to fix it in the proper position, and then one semiconductor workpiece is processed through a workpiece mounting gate to move horizontally forward into the process chamber. Bringing it into the chamber; A semiconductor workpiece conveyance method comprising a. The method of claim 5, After the step of bringing the one semiconductor workpiece into the process chamber, rotating the conveying device from the process chamber to the other loading chamber in a horizontal plane in the transfer chamber. The method of claim 6, After the step of rotating the transfer device from the process chamber toward the other loading chamber, further moving the extension arm vertically to an appropriate position to transfer the processed semiconductor workpiece to the other loading chamber. A semiconductor workpiece transfer method. delete delete delete delete delete delete delete delete delete delete delete delete delete A method of loading a semiconductor workpiece of a semiconductor workpiece processing system, the method comprising: a. A plurality of process chambers, each chamber having a workpiece mounting gate, each process chamber having a plurality of process chambers consisting of n work tables; b. Providing a semiconductor workpiece divider movably installed within the process chamber; c. Providing a transfer chamber in communication with a workpiece demounting gate of said process chamber; d. Providing a plurality of loading chambers having a plurality of grooves and attached to the transfer chamber for loading a semiconductor workpiece; e. At least a first extension arm and a second extension arm, wherein the first extension arm and the second extension arm are movable in a vertical or horizontal direction, one of which extension arm is perpendicular to the other extension arm Aligned and wherein the first and second extension arms are positioned within the transfer chamber, operable to face the workpiece demounting gate and the loading chamber, so that the maximum number of semiconductor workpieces can be processed by the process chambers. Providing an apparatus; f. Unloading two semiconductor workpieces in processing from the loading chambers using the respective extension arms; g. Moving the first extension arm in a rotational or horizontal or vertical direction to direct the first extension arm to the workpiece mounting gate; h. Advancing the first extension arm with the semiconductor workpiece into the process chamber from the transfer chamber through the workpiece demounting gate to load the semiconductor workpiece onto the semiconductor workpiece divider; i. Retracting the first extension arm from within the process chamber; j. Rotating the semiconductor workpiece divider a quarter turn; k. Moving the second extension arm in a rotational or horizontal or vertical direction to direct the second extension arm to the workpiece mounting gate; l. Advancing the second extension arm with the semiconductor workpiece into the process chamber through the workpiece demounting gate from the transfer chamber to load the semiconductor workpiece onto the semiconductor workpiece divider; m. Retracting the second extension arm from within the process chamber; n. Rotating the semiconductor workpiece divider a quarter turn; And o. Repeating the operations f to n to load the semiconductor workpiece into all of the n work tables; A semiconductor workpiece loading method of a semiconductor workpiece processing system comprising a. The method of claim 21, The quantity n is a natural number, the semiconductor workpiece loading method of the semiconductor workpiece processing system characterized by the above-mentioned. The method of claim 21, After completing the operation of step "o", p. Processing each semiconductor workpiece within the process chamber; q. Moving the first extension arm in a rotational or horizontal or vertical direction to direct the first extension arm to the loading chamber; r. Advancing the first extension arm into the loading chamber to pick up the semiconductor workpiece that is waiting to be processed and then retracting the first extension arm from the loading chamber; s. Moving the second extension arm in a rotational or horizontal or vertical direction to direct the second extension arm to the workpiece mounting gate; t. Advancing the second extension arm to pass through the workpiece mounting / detachment gate to pick up the completed semiconductor workpiece from the workpiece divider, and then backing the second extension arm from inside the process chamber; u. Moving the first extension arm in a rotational or horizontal or vertical direction to direct the first extension arm to the workpiece mounting gate; v. Advancing the first extension arm with the semiconductor workpiece through the workpiece demounting gate to load the semiconductor workpiece being processed to the semiconductor workpiece divider, and then reversing the first extension arm; And w. Moving the second extension arm in a rotational or horizontal or vertical direction to direct the second extension arm to the loading chamber, advancing the second extension arm into the loading chamber, and loading the processed semiconductor workpiece into the loading chamber. Step; The semiconductor workpiece loading method of a semiconductor workpiece processing system further comprising. The method of claim 21, Providing n pairs of transfer arms mounted to the semiconductor workpiece divider; And Rotating the semiconductor workpiece divider so that each pair of transfer arms corresponds to n work tables; The semiconductor workpiece loading method of a semiconductor workpiece processing system further comprising. As a method of transferring a semiconductor workpiece of a semiconductor workpiece processing system, the method is a. A plurality of process chambers, each chamber having a workpiece mounting gate, each process chamber having a plurality of process chambers consisting of n work tables; b. Providing a semiconductor workpiece divider movably installed within the process chamber; c. Providing a transfer chamber in communication with a workpiece demounting gate of said process chamber; d. At least a first extension arm and a second extension arm, wherein the first extension arm and the second extension arm are movable in a vertical or horizontal direction, one of which extension arm is perpendicular to the other extension arm Providing a transfer device arranged in the transfer chamber, wherein the first extension arm and the second extension arm are operable to face a workpiece demounting gate; e. Providing a loading chamber connected to the transfer chamber; f. Moving the first extension arm in a rotational or horizontal or vertical direction to direct the first extension arm to the workpiece mounting gate; g. Advancing the first extension arm to pass through the workpiece demounting gate to transfer the processed semiconductor workpiece from the semiconductor workpiece divider; h. Retracting the first extension arm with the finished semiconductor workpiece from within the process chamber; i. Rotating the semiconductor workpiece divider a quarter turn; j. Moving the second extension arm in a rotational or horizontal or vertical direction to direct the second extension arm to the workpiece mounting gate; k. Advancing the second extension arm to pass through the workpiece demounting gate to transfer another finished semiconductor workpiece from the semiconductor workpiece divider; l. Retracting the second extension arm from the interior of the process chamber with the finished semiconductor workpiece; m. Moving the first extension arm and the second extension arm in a rotational or horizontal or vertical direction to direct both the first extension arm and the second extension arm to the loading chamber; n. Advancing the first extension arm and the second extension arm into the loading chamber, respectively, to load the finished semiconductor workpiece into the loading chamber; And o. Repeating steps f through n until all of the semiconductor workpieces of the work table are taken out;  A semiconductor workpiece transfer method of a semiconductor workpiece processing system comprising a. The method of claim 25, Quantity n is a natural number, The semiconductor workpiece transfer method of the semiconductor workpiece processing system characterized by the above-mentioned. The method of claim 25, Providing n pairs of transfer arms mounted to the semiconductor workpiece divider; And Rotating the semiconductor workpiece divider so that each pair of transfer arms corresponds to n work tables; The semiconductor workpiece transfer method of the semiconductor workpiece processing system further comprising. A method of exchanging a semiconductor workpiece of a semiconductor workpiece processing system, the method comprising: a. A process chamber, which has a workpiece mounting and detaching gate that can pass into the process chamber, has n work tables inside the process chamber, and at least one work table provides a process chamber in which a processed semiconductor workpiece is loaded. Doing; b. Providing a semiconductor workpiece divider movably installed within the process chamber; c. Providing a transfer chamber in communication with a workpiece demounting gate of said process chamber; d. For loading a semiconductor workpiece, the stack has a plurality of grooves, and serves to supply a semiconductor workpiece in process processing to the process chamber or to receive a processed semiconductor workpiece in the process chamber, wherein the plurality of stacks are attached to the transfer chamber. Providing chambers; e. At least a first extension arm and a second extension arm, wherein the first extension arm and the second extension arm are movable in a vertical or horizontal direction, one of which extension arm is perpendicular to the other extension arm Aligned and wherein the first and second extension arms are positioned within the transfer chamber, operable to face the workpiece demounting gate and the loading chamber, so that the maximum number of semiconductor workpieces can be processed by the process chambers. Providing an apparatus; f. Moving the first extension arm in a rotational or horizontal or vertical direction to direct the first extension arm to the loading chamber; g. Advancing the first extension arm to pick up a processing workpiece from the stacking chamber and backing the first extension arm out of the stacking chamber; h. Rotating the semiconductor workpiece divider to direct at least one finished semiconductor workpiece to a workpiece demounting gate; i. Moving the second extension arm in a rotational or horizontal or vertical direction to direct the second extension arm to the workpiece mounting gate; j. Advancing the second extension arm through the workpiece demounting gate into the process chamber to pick up the finished semiconductor workpiece and to retract the second extension arm from the process chamber; k. Moving the first extension arm in a rotational or horizontal or vertical direction to direct the first extension arm to the workpiece mounting gate; l. Advancing the first extension arm with a semiconductor workpiece into the process chamber to load the semiconductor workpiece being processed into a semiconductor workpiece divider, and then moving the first extension arm out of the process chamber; m. Moving the second extension arm in a rotational or horizontal or vertical direction to direct the second extension arm to the loading chamber; And n. Advancing the second extension arm into the loading chamber, loading the finished semiconductor workpiece into the loading chamber, and then retracting the second extension arm from the loading chamber; A semiconductor workpiece exchange method of a semiconductor workpiece processing system comprising a.

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