200948237 _d / _________J 26976twf.doc/n ' 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種印刷電路板（printed Circuit Board, PCB)，且特別是有關於一種可撓性電路 Printed Circuitry，FPC )。 【先前技術】 印刷電路板有多種不同類型，有些為剛性電路板，有 些則為可撓性電路板或稱軟板。可撓性電路板是由軟質介 ® 電材料所支撐的一種線路板’其可做為可撓曲的電瘦或應 用在連續性動態彎折的產品中’目前運用於液晶顯示器驅 動1C之封裝及行動化電子產品上尤其廣泛，例如手機、筆 記型電腦及數位相機等。 一般而言’可撓性電路板多應用捲帶式自動接合 (Tape Automated Bonding，TAB )技術，以進行晶片的封 裝。目前常見的捲帶式自動接合技術包括捲帶承載封裝 (Tape Carrier Package，TCP )以及薄膜覆晶（Chip_〇n Film， ⑩ COF)封裝。 圖1為習知一晶片配置於一可撓性電路板的剖面示专 圖。請參考圖1，習知可撓性電路板1具有一封裝區la = 位於封裝區la之相對兩侧的一傳動區ib，其中一晶片2 配置於可撓性電路板1上。可撓性電路板丨包括—可撓性 . 基材10、圖案化金屬層12以及一保護層14。 詳細而言，可撓性基材10具有多個位於傳動區lb内 的傳動孔10a。圖案化金屬層12配置於可撓性基材1〇上， 200948237„_c/n 且圖案化金屬層12覆蓋值 暴露傳動孔10a。封裝區la内覆蓋有俘；基材10 ’並 j机匕ia pg復盍有保護層14 10a周圍的圖案化金屬層η裸露。 圖2為圖1之w射撓性t路板在傳動機台上進 沖切時的示意圖。請同時參考圓1與圖2，滾輪16a虚滚 設於傳動路徑的兩端，用以捲繞可撓性電路板;滾 ❹ ❹ ==二之間設有多個齒輪17，其與可撓性電 路板1上的傳動孔10a相互干涉， 前進。沖切刀_置於傳動路徑上，以;^封電= 可撓性電路板1切割成為多個封裝單心铁而，由 圖案，屬層12裸露，因:當齒輪 磨損而產生金’容易因摩擦造成傳動孔10a 傳動的能::==度僂此外，在 :=】不足，而容易造成斷料或沖切偏二：- 本發明提供一種可撓性電路板，其 度且可提升其製程潔淨度。 、/、有良好的抗拉強 [種可胁魏板，料有—封裝區盘位 撓側Ϊ:傳動區。可撓性電路板包括-可 有多個傳動孔位於傳動區内。$宰 基材上，Μ案化金屬層H ^ 配置於可撓性 材，並暴露出傳動孔。介電/覆動「區内的可撓性基 9覆盖傳動區内的圖案化金屬 V 26976twf.doc/n 200948237 層’並暴露出傳動孔。 在本發明之-實施射，上狀可撓性電路板，更包 •括一保護層。保護層配置於封裝區内，且保護層具有多個 .肖口，以在封裝區内定義出至少一晶片接合區與⑽晶片 接合區外圍的至少-外引腳接合區。圖案化金屬層更包括 多個内引腳位於晶片接合區内以及多個外引腳位於外引腳 接合區内。 纟本發日把―實施例巾，上狀介電層熟護層是藉 髎由相同的製程來製作。 ，、亍曼赝疋精 月之Λ施例中，上述之介電層的材質包括聚 也亞胺樹Hg旨樹脂、壓克力樹脂或環氧樹脂。 =發明之-實施财’上述之介雙包含多個孔 洞。延些孔洞與可撓性基材的傳動孔相對設置。 才目同在本發明之一實施例中，上述之介電層與保護層材質 ❹声上性電路板在其傳動區内的圖案化金屬 ❹層上覆蓋；丨電層。相較於習知， 爾 提供較佳的製㈣淨度财好的抗拉強度1時 I撓性電路板在娜動輕巾，觸麵^ 性電路板發生斷料或沖切偏移的情形。―致可捷 易懂為下讓文其他目的、特徵和優點能更明顯 【實施^配合所關式作詳細朗如下。 以下將以制薄難晶封制可紐電路板做為實 7 26976twf.doc/n 200948237 f例來進行說明。然而，誠如前述，捲帶式自動接合除了 薄膜覆晶封裝之外，還包括捲帶承載封裝。因此，下列實 施例所揭露的技術内容並不限於薄膜覆晶封裝上，還可應 . 祕例如捲帶承载縣献其他可能的場合。 圖3為本發明之一實施例之一晶片配置於一可撓性電 路板的剖面示意圖，圖情示為圖3之可換性電路板的俯 視圖。在此必須說明的是，為了清楚表示可撓性電路板表 Q 面的結構，圖4省略了圖3的晶片與其他可能的構件。 請同時參考圖3與圖4，在本實施例中，可撓性電路 板100具有一封裝區l〇0a與位於封裝區1〇〇a之相對兩側 的一傳動區100b。可撓性電路板100包括一可撓性基材 110、一圖案化金屬層120以及一介電層13〇。 土 詳細而言，可撓性基材丨10具有多個位於傳動區1〇此 内的傳動孔112，其中經由傳動孔112可讓滾輪帶動可挽 性電路板100平順前進。可撓性基材11〇大部分為軟性絕 緣材質所構成，其材質例如為塑膠基材、薄化玻璃基材心 ® 聚酯類基材、聚酮類基材、聚醚類基材、聚脂類基^、聚 烯類基材、聚炔類基材、聚環氧烯類基材、聚環烯類基材、 聚環烷類基材、聚醯類基材、聚酚類基材、聚醛類基材、 或其它聚合物類基材、或上述之組合。 圖案化金屬層120配置於可撓性基材11〇上，且圖 化金屬層120至少覆盍傳動區i〇〇b内的可挽性美材 並暴露出傳動孔112。詳細而言，覆蓋於傳動區仞⑽内 可撓性基材110上的圖案化金屬層120的材料例如是銅， 8 26976twf.doc/n 200948237 用以強化傳動區100b的結構。 另外’職化金屬層120亦可以延伸域裝區驗 内的可撓性基材110上，以形成圖案化的線路，包括内引 腳與外引腳等。換言之’傳動區1()()b内與封裝區1〇〇&内 的圖案化金屬層120可以同時製作，例如由同一個銅箱層 (copperfoil)經過微影蝕刻定義形成。當然，在其他實施 例中，傳動區io〇b内與封裝區100a内的圖案化金屬層12〇 也可以各別製作，並可具有不同的材質或是形成不同厚度 ® 的金屬層，以因應實際的需求。 另外，介電層130覆蓋傳動區1〇〇b内的圖案化金屬 層120’並暴露出傳動孔H2’其中介電層13〇包含多個孔 洞132。孔洞132與傳動孔112相對設置。一般而言，介 電層130用以隔絕圖案化金屬層12〇與外界的空氣。 值得一提的是，在本實施例中，介電層13〇的材質包 括聚醯亞胺（polyimide，Pl)樹脂、聚酯（p〇lyester，pET) 樹脂、壓克力（acrylic)樹脂或環氧（ep〇xy)樹脂。 ❹ 請再參考圖3 ’在本實施例中，晶片200是採覆晶接 合方式配置於可撓性電路板1〇〇上，以藉由凸塊16〇與傳 動區100b内的圖案化金屬層12〇電性連接，以藉由可撓性 電路板100的内部線路來達到電子訊號傳遞之目的。此 外’封裝膠體150覆蓋晶片2〇〇與局部的可撓性電路板 100 ’並暴露出晶片200的頂面。 在本實施例中’由於可撓性電路板100在其傳動區 l〇〇b内的圖案化金屬層12〇上覆蓋介電層13〇，因此可以 26976twf.doc/n 200948237 避免在可撓性電路板100的傳動過程中產生粉塵污染，改 善製程潔淨度，並可以提高可撓性電路板100的抗拉強 •度。此外，也可以避免在沖切製程中，因傳動孔112受損 而導致可撓性電路板1〇〇發生斷料或沖切偏移的情形。 請再同時參考圖3與圖4，在本實施例中，可撓性電 路板100更包括一保護層140。保護層140配置於封裝區 100a内，且保護層140具有多個開口 142，以在封裝區1〇〇a 内疋義出至少一晶片接合區142a與位於晶片接合區i42a © 外圍的至少-外引腳接合區142b。圖案化金屬層12〇更包 括多個内引腳122位於晶片接合區142a内以及多個外引腳 m 位於外引腳接合（outer lead bonding，OLB )區 142b 内。 值得一提的是，在圖4中僅繪示一晶片接合區142a 與了^卜引腳接合區142b，且外引腳接合區142b位於晶片 接&區142a的上下兩側。一般而言，可撓性電路板 可經由加工將傳動區100b切除，只留下晶片接合區142a 與外=腳接合區142b加以應用，例如將其中部份的外引腳 ❹ 124藉由異方性導電膠與顯示面板電性連接，而另一部份 之外引腳124亦藉由異方性導電膠與電路板電性連接。 特別是，在本實施例中，傳動區1〇〇b内的介電層13〇 與封裝區100a内的保護層14〇可以是同一膜層，而具曰有相 f的材質°亦即’經由同-製程來製作，例如薄膜貼附或 材料等方式。然而，在其他實施例中，介電層別 呆護層刚也可以各別製作，並可具有不同的材質或是 不冋的結構組成，例如由不同數量的複數膜層所構成以 200948237 26976twf.doc/n 提供不同的抗拉強度與保護效果。 具體而言，位於傳動區祕 上的介電層130用以強化傳 圖案化金屬層12〇 ;12及其增加抗拉強度；独於二==’，傳動孔 化金屬層m上的保護層14〇用，内的圖案 案化金屬層120。 ，、濩封裝區100a内的圖 與優·=料，本糾之可触電路衫少具有下列特徵 可以動區内的圖案化金屬層上覆蓋介電声， ==電路板在傳動時可能產生的粉塵污 可以屬層上覆蓋介電層， 以避免沖切可換性電路板時，傳動孔因受ΐ 而導致可撓性電路板發生_或沖切偏移的情形。 太私η本發明已以實施例揭露如上，織並非用以限定 2月’任何所屬技術領域中具有通常知識者，在不脫離 ^明之精神和範圍内，當可作些許之更動制飾，故本 後附之_請專利範圍所界定者為準。 圖1為習知之一晶片配置於一可撓性電路板的剖面 意圖 圖2為圖〗之晶片與可撓性電路板在傳動機台上進行 沖切時的示意圖。 26976twf.doc/n 200948237 _________) 圖3為本發明之一實施例之一晶片配置於一可撓性電 路板的剖面示意圖。 圖4繪示為圖3之可撓性電路板的俯視圖。 【主要元件符號說明】 1、 100 :可撓性電路板 la、 100a :封裝區 lb、 100b :傳動區 2、 200 :晶片 ❹ 10、110:可撓性基材 10a、112 :傳動孔 12、120 :圖案化金屬層 14、140 :保護層 16a、16b :滾輪 122 :内引腳 124 :外引腳 130 :介電層 ❹ 132 :孔洞 140 :保護層 142 :開口 142a :晶片接合區 142b :外引腳接合區 150 :封裝膠體 160 :凸塊 12200948237 _d / _________J 26976twf.doc/n ' IX. Description of the Invention: [Technical Field] The present invention relates to a printed circuit board (PCB), and in particular to a flexible circuit Printed Circuitry, FPC). [Prior Art] There are many different types of printed circuit boards, some of which are rigid boards, and some of which are flexible boards or soft boards. A flexible circuit board is a circuit board supported by a soft dielectric material. It can be used as a flexible, thin or a product that can be used in continuous dynamic bending. 'Currently used in LCD driver 1C package. And mobile electronic products are particularly broad, such as mobile phones, notebook computers and digital cameras. In general, flexible circuit boards use Tape Automated Bonding (TAB) technology for wafer packaging. Commonly available tape and reel bonding technologies include Tape Carrier Package (TCP) and Chip_〇n Film (10 COF) packages. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view showing a conventional wafer disposed on a flexible circuit board. Referring to FIG. 1, the conventional flexible circuit board 1 has a package area la = a transmission area ib on opposite sides of the package area 1a, wherein a wafer 2 is disposed on the flexible circuit board 1. The flexible circuit board includes - a flexible substrate 10, a patterned metal layer 12, and a protective layer 14. In detail, the flexible substrate 10 has a plurality of drive holes 10a located in the drive zone lb. The patterned metal layer 12 is disposed on the flexible substrate 1 , 200948237 _ c / n and the patterned metal layer 12 covers the value of the drive hole 10 a. The package area la is covered with a cap; the substrate 10 ' Ia pg reclamation has a patterned metal layer n exposed around the protective layer 14 10a. Fig. 2 is a schematic view of the w-flexible t-plate of Fig. 1 when punching and cutting on the transmission machine. Please refer to circle 1 and figure at the same time. 2, the roller 16a is rolled at both ends of the transmission path for winding the flexible circuit board; the roller ❹ == two is provided with a plurality of gears 17, and the transmission on the flexible circuit board 1 The holes 10a interfere with each other and advance. The punching blade _ is placed on the transmission path to close the power; the flexible circuit board 1 is cut into a plurality of packages of single-core iron, and the pattern 12 is exposed by the pattern, because: The gear wears and generates gold'. The energy of the transmission hole 10a is easily caused by friction::==degree 偻 In addition, the shortage of := is easy to cause the breaking or punching to be two: - The present invention provides a flexible circuit The plate can improve the cleanliness of its process. /, has a good tensile strength [a kind of threatening Wei board, material has - the flexing side of the package area Ϊ: Transmission area. Flexible circuit board includes - there may be multiple transmission holes in the transmission area. On the slaughter substrate, the enamelized metal layer H ^ is disposed on the flexible material and exposes the transmission hole. Electrical/Covering "The flexible base 9 in the zone covers the patterned metal V 26976twf.doc/n 200948237 layer" in the transmission zone and exposes the drive hole. In the present invention, the upper flexible circuit is implemented. The board further includes a protective layer. The protective layer is disposed in the package area, and the protective layer has a plurality of openings to define at least one of the wafer bonding area and (10) the periphery of the wafer bonding area in the package area. a pin bond region. The patterned metal layer further includes a plurality of inner leads in the wafer bond region and a plurality of outer pins in the outer pin bond region. The cooked layer is made by the same process. In the example of the 亍曼赝疋精月, the material of the dielectric layer includes a polyimine tree Hg resin, an acrylic resin or a ring. Oxygen resin. =Inventive-Implementation of the above-mentioned double contains a plurality of holes. The transmission holes of the flexible substrate are oppositely disposed. In one embodiment of the invention, the dielectric layer and the protective layer material of the acoustic layer are covered on the patterned metal layer of the transmission region.丨Electrical layer. Compared with the conventional, it provides a better system. (4) Good netting and good tensile strength. When the I flexible circuit board is in the Nash light towel, the contact surface of the circuit board is broken or rushed. The situation of cutting offset. ― 致 可 可 可 下 让 让 让 让 让 让 让 让 让 让 让 让 让 让 让 让 让 让 让 让 让 让 让 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他 其他Let's take the example of 7 26976twf.doc/n 200948237 f. However, as previously mentioned, the tape and tape type automatic bonding includes a tape and tape carrying package in addition to the film flip chip package. Therefore, the technical contents disclosed in the following embodiments are not limited to the film flip chip package, and may be applied to other possible occasions. 3 is a cross-sectional view showing a wafer disposed on a flexible circuit board in accordance with an embodiment of the present invention, and is a plan view of the replaceable circuit board of FIG. 3. It must be noted here that in order to clearly show the structure of the Q-plane of the flexible circuit board, FIG. 4 omits the wafer of FIG. 3 and other possible components. Referring to FIG. 3 and FIG. 4 simultaneously, in the embodiment, the flexible circuit board 100 has a package area 10a and a transmission area 100b on opposite sides of the package area 1A. The flexible circuit board 100 includes a flexible substrate 110, a patterned metal layer 120, and a dielectric layer 13A. In particular, the flexible substrate 10 has a plurality of drive holes 112 located within the drive zone 1 wherein the drive wheel 112 allows the roller to drive the flexible circuit board 100 smoothly. Most of the flexible substrate 11 is made of a soft insulating material, such as a plastic substrate, a thinned glass substrate, a polyester substrate, a polyketone substrate, a polyether substrate, and a poly a lipid base, a polyolefin substrate, a polyacetylene substrate, a polyoxyalkylene substrate, a polycycloolefin substrate, a polycycloalkyl substrate, a polyfluorene substrate, a polyphenol substrate A polyaldehyde substrate, or other polymeric substrate, or a combination thereof. The patterned metal layer 120 is disposed on the flexible substrate 11A, and the patterned metal layer 120 covers at least the switchable material in the transmission area i〇〇b and exposes the transmission hole 112. In detail, the material of the patterned metal layer 120 overlying the flexible substrate 110 in the drive region (10) is, for example, copper, 8 26976 twf.doc/n 200948237 for enhancing the structure of the transmission region 100b. Alternatively, the metallization layer 120 can be extended over the flexible substrate 110 in the domain package to form patterned lines, including inner and outer leads. In other words, the patterned metal layer 120 in the drive region 1()()b and the package region 1& can be fabricated simultaneously, for example, by the same copper box layer (copperfoil). Of course, in other embodiments, the patterned metal layer 12 in the transmission region io〇b and the package region 100a may also be separately fabricated, and may have different materials or metal layers of different thicknesses to meet the requirements. Actual needs. In addition, the dielectric layer 130 covers the patterned metal layer 120' in the drive region 1b and exposes the drive hole H2', wherein the dielectric layer 13A includes a plurality of holes 132. The hole 132 is disposed opposite to the transmission hole 112. In general, the dielectric layer 130 serves to insulate the patterned metal layer 12 from the outside air. It is worth mentioning that, in this embodiment, the material of the dielectric layer 13〇 comprises polyimide (Pl) resin, polyester (pET) resin, acrylic resin or Epoxy (ep〇xy) resin. ❹ Referring to FIG. 3 again, in the embodiment, the wafer 200 is disposed on the flexible circuit board 1 by the flip chip bonding to form a patterned metal layer in the transmission region 100b by the bumps 16 12〇 electrically connected to achieve electronic signal transmission through the internal circuit of the flexible circuit board 100. Further, the encapsulant 150 covers the wafer 2 and the partially flexible circuit board 100' and exposes the top surface of the wafer 200. In the present embodiment, since the flexible circuit board 100 covers the dielectric layer 13A on the patterned metal layer 12A in its transmission region 10b, it is possible to avoid flexibility in 26976twf.doc/n 200948237. Dust contamination is generated during the transmission process of the circuit board 100, the process cleanliness is improved, and the tensile strength of the flexible circuit board 100 can be improved. In addition, it is also possible to avoid the occurrence of breakage or punching offset of the flexible circuit board 1 due to damage to the transmission hole 112 during the punching process. Referring to FIG. 3 and FIG. 4 at the same time, in the embodiment, the flexible circuit board 100 further includes a protective layer 140. The protective layer 140 is disposed in the package region 100a, and the protective layer 140 has a plurality of openings 142 to define at least one of the wafer bonding regions 142a and at least the outer periphery of the wafer bonding region i42a © in the packaging region 1A. Pin bond area 142b. The patterned metal layer 12 further includes a plurality of inner leads 122 located within the wafer bond region 142a and a plurality of outer leads m positioned within the outer lead bonding (OLB) region 142b. It is to be noted that only one wafer bonding region 142a and the pad bonding region 142b are illustrated in FIG. 4, and the outer pin bonding region 142b is located on the upper and lower sides of the wafer bonding region 142a. In general, the flexible circuit board can be cut through the processing of the transmission region 100b, leaving only the wafer bonding region 142a and the outer=foot bonding region 142b to be applied, for example, by using the outer pin ❹ 124 of the portion thereof. The conductive adhesive is electrically connected to the display panel, and the other portion of the lead 124 is electrically connected to the circuit board by the anisotropic conductive adhesive. In particular, in the present embodiment, the dielectric layer 13〇 in the transmission region 1〇〇b and the protective layer 14〇 in the package region 100a may be the same film layer, and the material having the phase f is also It is made by the same process, such as film attachment or material. However, in other embodiments, the dielectric layer can also be made separately, and can have different materials or non-defective structural components, for example, composed of different numbers of complex layers to be 200948237 26976twf. Doc/n offers different tensile strength and protection. Specifically, the dielectric layer 130 located on the secret portion of the transmission region is used to strengthen the patterned metal layer 12; 12 and its tensile strength is increased; and the protective layer on the metal layer m of the transmission hole is formed by two ==' The inner pattern is used to form the metal layer 120. , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The dust can cover the dielectric layer on the layer to avoid the occurrence of _ or offset deflection of the flexible circuit board due to buckling when the circuit board is punched. The present invention has been disclosed in the above embodiments, and is not intended to limit the general knowledge of any of the technical fields in the art of February, and may be modified in some ways without departing from the spirit and scope of the invention. The scope of this patent is subject to the definition of patent scope. 1 is a cross-sectional view of a conventional wafer disposed on a flexible circuit board. FIG. 2 is a schematic view of the wafer and the flexible circuit board being punched on the transmission table. 26976 twf.doc/n 200948237 _________) FIG. 3 is a cross-sectional view showing a wafer disposed on a flexible circuit board according to an embodiment of the present invention. 4 is a top plan view of the flexible circuit board of FIG. 3. [Description of main component symbols] 1. 100: Flexible circuit board la, 100a: package area lb, 100b: transmission area 2, 200: wafer cassette 10, 110: flexible substrate 10a, 112: transmission hole 12, 120: patterned metal layer 14, 140: protective layer 16a, 16b: roller 122: inner pin 124: outer pin 130: dielectric layer ❹ 132: hole 140: protective layer 142: opening 142a: wafer bonding region 142b: Outer Pin Junction Area 150: Package Colloid 160: Bump 12