CN101281896A - Flexible circuit board - Google Patents

Flexible circuit board Download PDF

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Publication number
CN101281896A
CN101281896A CN 200810100051 CN200810100051A CN101281896A CN 101281896 A CN101281896 A CN 101281896A CN 200810100051 CN200810100051 CN 200810100051 CN 200810100051 A CN200810100051 A CN 200810100051A CN 101281896 A CN101281896 A CN 101281896A
Authority
CN
China
Prior art keywords
circuit board
flexible circuit
patterned metal
metal layer
dielectric layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 200810100051
Other languages
Chinese (zh)
Inventor
陈清隆
陈慧昌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AU Optronics Corp
Original Assignee
AU Optronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AU Optronics Corp filed Critical AU Optronics Corp
Priority to CN 200810100051 priority Critical patent/CN101281896A/en
Publication of CN101281896A publication Critical patent/CN101281896A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Structure Of Printed Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

A flexible circuit board has a encapsulation region and a transmission region arranged at two opposite sides of the encapsulation region. The flexible circuit board includes a flexible base material, a patterned metal layer and a dielectric layer. The flexible base material has a plurality of holes which arranged in the transmission region. The patterned metal layer is equipped on the flexible base material, at least covers the flexible base material in the transmission region and exposes the transmission holes. The dielectric layer covers the patterned metal layer in the transmission layer and exposes the transmission holes.

Description

Flexible circuit board
[technical field]
The invention relates to a kind of printed circuit board (PCB) (Printed Circuit Board, PCB), and particularly relevant for a kind of flexible circuit board (Flexible Printed Circuitry, FPC).
[background technology]
Printed circuit board (PCB) has number of different types, and some is a rigid circuit board, and some then is flexible circuit board or claims soft board.Flexible circuit board is a kind of wiring board that is supported by soft dielectric material, it can or be applied in continuity dynamically in the product of bending as the cable of deflection, apply at present on the encapsulation of liquid crystal display-driving IC and the actionization electronic product especially extensive, for example mobile phone, mobile computer and digital camera etc.
Generally speaking, flexible circuit board is used coil type more and is engaged automatically that (Tape AutomatedBonding, TAB) technology is to carry out the encapsulation of chip.At present the common automatic joining technique of coil type comprise winding carrying encapsulation (Tape Carrier Package, TCP) and membrane of flip chip (Chip-On-Film, COF) encapsulation.
Fig. 1 is for having a chip configuration now in the generalized section of a flexible circuit board.Please refer to Fig. 1, existing flexible circuit board 1 has a drive area 1b of an encapsulation region 1a and the relative both sides that are positioned at encapsulation region 1a, and wherein a chip 2 is disposed on the flexible circuit board 1.Flexible circuit board 1 comprises a flexible substrate 10, patterned metal layer 12 and a protective layer 14.
Specifically, flexible substrate 10 has a plurality of driving hole 10a that are positioned at drive area 1b.Patterned metal layer 12 is disposed on the flexible substrate 10, and the flexible substrate 10 in the patterned metal layer 12 covering drive area 1b, and exposes driving hole 10a.Be coated with protective layer 14 in the encapsulation region 1a, but the patterned metal layer 12 around the driving hole 10a is exposed.
Fig. 2 carries out schematic diagram when die-cut for the chip of Fig. 1 and flexible circuit board on the transmission board.
Please also refer to Fig. 1 and Fig. 2, roller 16a and roller 16b are located at the two ends of drive path, in order to coiling flexible circuit board 1.Be provided with a plurality of gears 17 between roller 16a and the roller 16b, the driving hole 10a on itself and the flexible circuit board 1 interferes mutually, advances to drive flexible circuit board 1.Punching tool 3 is arranged on the drive path, is cut into a plurality of encapsulation units with the flexible circuit board 1 that will be packaged with chip 2 on it.Yet,, therefore when gear 17 is interfered mutually with driving hole 10a, produce metallic dust because of friction causes driving hole 10a wearing and tearing easily, and then influence the cleanliness factor of processing procedure because the patterned metal layer 12 around the driving hole 10a is exposed.In addition, in the process of transmission, also may be because the tensile strength deficiency of the driving hole 10a of flexible circuit board 1, and cause the situation of fracture or die-cut skew easily.
[summary of the invention]
The invention provides a kind of flexible circuit board, it has good tensile strength and can promote its processing procedure cleanliness factor.
The present invention proposes a kind of flexible circuit board, and it has a drive area of an encapsulation region and the relative both sides that are positioned at encapsulation region.Flexible circuit board comprises a flexible substrate, a patterned metal layer and a dielectric layer.Flexible substrate has a plurality of driving holes and is positioned at drive area.Patterned metal layer is disposed on the flexible substrate, and patterned metal layer covers the flexible substrate in the drive area at least, and exposes driving hole.Dielectric layer covers the patterned metal layer in the drive area, and exposes driving hole.
In one embodiment of this invention, above-mentioned flexible circuit board more comprises a protective layer.Protective layer is disposed in the encapsulation region, and protective layer has a plurality of openings, to define at least one chip bonding area and be positioned at pin bonding land outside chip bonding area periphery at least one in encapsulation region.Patterned metal layer comprises that more a plurality of interior pins are positioned at chip bonding area and a plurality of outer pin is positioned at outer pin bonding land.
In one embodiment of this invention, above-mentioned dielectric layer is to make by identical processing procedure with protective layer.
In one embodiment of this invention, the material of above-mentioned dielectric layer comprises polyimide resin, mylar, acryl resin or epoxy resin.
In one embodiment of this invention, above-mentioned dielectric layer comprises a plurality of holes.The driving hole of these holes and flexible substrate is oppositely arranged.
In one embodiment of this invention, above-mentioned dielectric layer is identical with the protective layer material.
Cover dielectric layer on the patterned metal layer of flexible circuit board of the present invention in its drive area.Compared to existing, flexible circuit board of the present invention can provide preferable processing procedure cleanliness factor and good tensile strength, simultaneously can avoid flexible circuit board in by transmission process, driving hole is because of the impaired situation that causes flexible circuit board generation fracture or die-cut skew.
For above and other objects of the present invention, feature and advantage can be become apparent, embodiment cited below particularly, and cooperate appended graphic being described in detail below.
[description of drawings]
Fig. 1 is that an existing chip configuration is in the generalized section of a flexible circuit board.
Fig. 2 carries out schematic diagram when die-cut for the chip of Fig. 1 and flexible circuit board on the transmission board.
Fig. 3 is that the chip configuration of one embodiment of the invention is in the generalized section of a flexible circuit board.
Fig. 4 illustrates the vertical view into the flexible circuit board of Fig. 3.
[embodiment]
Below will describe as embodiment with the flexible circuit board that adopts the membrane of flip chip encapsulation.Yet just as aforementioned, coil type engages automatically except the membrane of flip chip encapsulation, also comprises winding carrying encapsulation.Therefore, the disclosed technology contents of the following example is not limited to also can be applicable to for example winding carrying encapsulation or other possible occasion in the membrane of flip chip encapsulation.
Fig. 3 be the chip configuration of one embodiment of the invention in the generalized section of a flexible circuit board, Fig. 4 illustrates the vertical view into the flexible circuit board of Fig. 3.In this mandatory declaration is that for the structure on clear expression flexible circuit board surface, Fig. 4 has omitted chip and other the possible member of Fig. 3.
Please also refer to Fig. 3 and Fig. 4, in the present embodiment, flexible circuit board 100 has a drive area 100b of an encapsulation region 100a and the relative both sides that are positioned at encapsulation region 100a.Flexible circuit board 100 comprises a flexible substrate 110, a patterned metal layer 120 and a dielectric layer 130.
Specifically, flexible substrate 110 has a plurality of driving holes 112 that are positioned at drive area 100b, wherein can allow roller drive flexible circuit board 100 smooth-going advancing via driving hole 112.Flexible substrate 110 major parts are constituted by soft insulation material, and its material for example is plastic basis material, thinning glass baseplate, polyesters base material, polyketone class base material, polyethers base material, polyester base material, polyalkenes base material, carbene class base material, poly-epoxy alkene class base material, poly-cyclenes class base material, poly-naphthenic base material, poly-vinegar class base material, gathers phenols base material, polyacetals class base material or other polymer class base material or above-mentioned combination.
Patterned metal layer 120 is disposed on the flexible substrate 110, and patterned metal layer 120 covers the flexible substrate 110 in the drive area 100b at least, and exposes driving hole 112.Specifically, the material that is covered in the patterned metal layer 120 on the flexible substrate 110 in the drive area 100b for example is a copper, in order to strengthen the structure of drive area 100b.
In addition, patterned metal layer 120 can also extend on the interior flexible substrate 110 of encapsulation region 100a, to form the circuit of patterning, pin and outer pin etc. in comprising.In other words, drive area 100b patterned metal layer 120 interior and that encapsulation region 100a is interior can be made simultaneously, and for example definition forms through lithography by same copper foil layer (copper foil).Certainly, in other embodiments, drive area 100b patterned metal layer 120 interior and that encapsulation region 100a is interior also can distinctly be made, and can have the different materials or the metal level of formation different-thickness, with the demand in response to reality.
In addition, the patterned metal layer 120 that dielectric layer 130 covers in the drive area 100b, and expose driving hole 112, wherein dielectric layer 130 comprises a plurality of holes 132.Hole 132 is oppositely arranged with driving hole 112.Generally speaking, dielectric layer 130 is in order to isolated patterned metal layer 120 and extraneous air.
What deserves to be mentioned is that in the present embodiment, the material of dielectric layer 130 comprises polyimide (polyimide, PI) resin, polyester (polyester, PET) resin, acryl (acrylic) resin or epoxy (epoxy) resin.
Refer again to Fig. 3, in the present embodiment, chip 200 is to adopt the chip bonding mode to be disposed on the flexible circuit board 100, to electrically connect, reach the purpose that electronic signal is transmitted with internal wiring by flexible circuit board 100 by the patterned metal layer in projection 160 and the drive area 100b 120.In addition, packing colloid 150 covers chip 200 and local flexible circuit board 100, and exposes the end face of chip 200.
In the present embodiment, owing to cover dielectric layer 130 on the patterned metal layer 120 of flexible circuit board 100 in its drive area 100b, therefore can avoid in the transmission process of flexible circuit board 100, producing dust pollution, improve the processing procedure cleanliness factor, and can improve the tensile strength of flexible circuit board 100.In addition, also can avoid in die-cut processing procedure, because of the driving hole 112 impaired situations that cause flexible circuit board 100 that fracture or die-cut skew take place.
Please more simultaneously with reference to figure 3 and Fig. 4, in the present embodiment, flexible circuit board 100 more comprises a protective layer 140.Protective layer 140 is disposed in the encapsulation region 100a, and protective layer 140 has a plurality of openings 142, to define at least one chip bonding area 142a and be positioned at pin bonding land 142b outside chip bonding area 142a periphery at least one in encapsulation region 100a.Patterned metal layer 120 more comprise a plurality of in pins 122 be positioned at chip bonding area 142a and a plurality of outer pin 124 and be positioned at outer pin joint (outer lead bonding OLB) distinguishes in the 142b.
What deserves to be mentioned is, in Fig. 4, only illustrate pin bonding land 142b outside a chip bonding area 142a and two, and outer pin bonding land 142b is positioned at the both sides up and down of chip bonding area 142a.Generally speaking, flexible circuit board 100 can excise drive area 100b via processing, only staying chip bonding area 142a is applied with outer pin bonding land 142b, for example wherein the outer pin 124 of part electrically connects by anisotropic conductive and display floater, and another outer pin 124 partly also electrically connects by anisotropic conductive and circuit board.
Particularly, in the present embodiment, the dielectric layer 130 in the drive area 100b can be same rete with the protective layer 140 in the encapsulation region 100a, and has identical material.That is, make via same processing procedure, for example mode such as film attaching or printing dielectric material.Yet in other embodiments, dielectric layer 130 also can distinctly be made with protective layer 140, and can have different materials or different structures composition, and for example a plurality of rete by varying number is constituted, so that different tensile strength and protection effect to be provided.
Particularly, be positioned at dielectric layer 130 on the patterned metal layer 120 of drive area 100b, make driving hole 112 and increase tensile strength on every side in order to strengthen the structure of drive area 100b; And be positioned at protective layer 140 on the patterned metal layer 120 of encapsulation region 100a in order to the patterned metal layer 120 of protection packaging district 100a.
In sum, flexible circuit board of the present invention has following feature and advantage at least:
(1), can avoid flexible circuit board issuable dust pollution when transmission, to promote the processing procedure cleanliness factor by covering dielectric layer on the patterned metal layer in drive area.
(2), can increase driving hole and tensile strength on every side thereof, and then improve the processing procedure reliability by covering dielectric layer on the patterned metal layer in drive area.For example, in the time of can avoiding die-cut flexible circuit board, driving hole is because of the impaired situation that causes flexible circuit board generation fracture or die-cut skew.
Though the present invention discloses as above with embodiment; right its is not in order to limit the present invention; the technical staff who has common knowledge in the technical field under any; without departing from the spirit and scope of the present invention; when doing a little change and retouching, so protection scope of the present invention is as the criterion when looking accompanying the claim person of defining.

Claims (6)

1. flexible circuit board has a drive area of an encapsulation region and the relative both sides that are positioned at this encapsulation region, and this flexible circuit board comprises:
One flexible substrate has a plurality of driving holes and is positioned at this drive area;
One patterned metal layer is disposed on this flexible substrate, and this patterned metal layer covers this flexible substrate in this drive area at least, and exposes described driving hole; And
One dielectric layer covers this patterned metal layer in this drive area, and exposes described driving hole.
2. flexible circuit board according to claim 1; it is characterized in that; more comprise a protective layer; be disposed in this encapsulation region; and this protective layer has a plurality of openings; to define at least one chip bonding area and at least one outer pin bonding land that is positioned at this chip bonding area periphery in this encapsulation region, this patterned metal layer comprises that more a plurality of interior pins are positioned at this chip bonding area and a plurality of outer pin is positioned at this outer pin bonding land.
3. flexible circuit board according to claim 2 is characterized in that, this dielectric layer is to make by identical processing procedure with this protective layer.
4. flexible circuit board according to claim 1 is characterized in that the material of this dielectric layer comprises polyimide resin, mylar, acryl resin or epoxy resin.
5. flexible circuit board according to claim 1 is characterized in that this dielectric layer comprises a plurality of holes, and described hole and described driving hole are oppositely arranged.
6. flexible circuit board according to claim 2 is characterized in that, this dielectric layer is identical with the material of this protective layer.
CN 200810100051 2008-05-30 2008-05-30 Flexible circuit board Pending CN101281896A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200810100051 CN101281896A (en) 2008-05-30 2008-05-30 Flexible circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200810100051 CN101281896A (en) 2008-05-30 2008-05-30 Flexible circuit board

Publications (1)

Publication Number Publication Date
CN101281896A true CN101281896A (en) 2008-10-08

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200810100051 Pending CN101281896A (en) 2008-05-30 2008-05-30 Flexible circuit board

Country Status (1)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105323947A (en) * 2014-05-30 2016-02-10 南茂科技股份有限公司 Flexible circuit carrier plate
CN105572985A (en) * 2015-12-23 2016-05-11 南京中电熊猫液晶显示科技有限公司 COF substrate and liquid crystal display panel connected with same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105323947A (en) * 2014-05-30 2016-02-10 南茂科技股份有限公司 Flexible circuit carrier plate
CN105323947B (en) * 2014-05-30 2018-05-22 南茂科技股份有限公司 Flexible circuit carrier plate
CN105572985A (en) * 2015-12-23 2016-05-11 南京中电熊猫液晶显示科技有限公司 COF substrate and liquid crystal display panel connected with same

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Open date: 20081008