200947764 九、發明說明： 【發明所屬之技術領域】 本發明係屬LED晶片封裝的技術領域，特別是指一種 具有大量快速生產、縮短製程時間、提高製程良率增加透 鏡的透光率及使用壽命之LED晶片封裝方法。 【先前技術】 按，習知之LED晶片封裝方法，請參閱申請人先前向 〇 鈞局提出申請第96122810號之rLED晶片封裝方法』，其主 要的生產製程步驟： a) 置放一支架組件於一具一模穴之模具内，該組件包括 一具有易與一熱固性透明材料結合表面之支架；及 一設置於該支架上、具有複數接點、且其接點已打線連 接至該支架預定位置之LED晶片； b) 加熱該模具； c) 將該熱固性透明材料前質，以低於一預定速度之流速射 〇 入該模穴中’直到填充至超過該模穴容積一半以上之一 預定容量； d) 柚取該模穴内氣體，使該模穴内形成一預定低壓；及 e) 持續填充該熱固性透明材料前質，並待其固化；藉此， 在該支架組件設置有LED晶片側形成一由該熱固性透 明材料構成之透鏡。 上述創作雖能違成其原先所設定之創作目的，而深受業 界及生產製造者所讚許，但是’其在製程的產生上則會產生 如下的困擾： 200947764 1 ·由於支架組件在置於模具内暨關閉後，方能開始加 熱模具’換言之，在取出已位於模具⑽支架組件時，也必 需使該模具降溫至常溫之下，方能使操作者從模具内取出己 具有透鏡的支架組件’如此的製程，勢必使得每—次關模後 的開始加熱時間及每一次開模前的開始降溫時間均會占完 成一個LED晶片封裝所需的整個產製總時間的比例性是相 當長的時間性，而致使其生產速度及生產量無法再被提高為 0 其一大困擾。 2.由於習知技術手段必需“以較低的流速（即低於預 疋速度）射入模穴至達到其一半以上之預定容量，，勢必會 使得其所需時間的產製時間也會相對性的變長，同時，再以 先抽取模穴内的氣體至預定低壓，’後，再“續填滿至模穴 内為止的分段製程，更會造成再次增加製程的所需時間， 且易使得分段進入模穴内的熱固性透明材料間的分子密度 結合度較不高及其排列組合更加無法均勻化，而造成其透光 〇 率較不佳及降低其使用壽命’進而致使其生產良率無法確實 全面性再提高為其再一大困擾。 3 ·承如第2項所述’由於模穴内的氣體是用抽取方式 為之，換言之，其必需於利用模具以外的抽氣設備才能辦得 到的’因此，其不但必需額外增抽氣設備或機械器具外，同 時，亦會大幅提高其設備成本為其另一大困擾。 有鑑於此，本發明遂針對上述習知技術之缺失，提出一 種LED晶片透鏡封裝方法，以有效克服上述該等問題。 【發明内容】 200947764 本發明之主要目的在提供一種LED晶片透鏡封裝方 法，其係以直接或間接方式將模具加熱維持至預定溫度以 上，再置放支架組件於具有模穴之模具内，再藉由模具的緊 密蓋合而將熱固性透明材料以預定流速加壓射入至填滿模 穴容積的預定容量後，再藉由模具的預定溫度而致使其固 化，再開模取出已經由熱固性透明材料所形成的透鏡能確實 包覆於LED晶片的支架組件上；如此，方能藉由自動模組 化的成型生產方式，以達到模穴内具有邊加壓射入熱固性透 明材料暨邊排風的同步作用，而有效解決改善習知模穴必需 77段進料再抽氣的現象，以致使模穴内的熱固性透明材料間 的分子密度更南及其排列組合更加均勻化，而使得其透光度 及折射率變得更高，而大幅提高其生產良率及增加其使用壽 命外，同時，亦能大幅縮短其整個的生產時間，且能大大的 提高其產能及產量，進而可全面降低其成本為其進步性之功 效。 〇 【實施方式】 本創作係有關於一種LED晶片透鏡封裝方法，請參閱第 一圖至第五圖所示，其步驟流程如下： 如步驟31所述’先將模具24(即公、母模具242、244) 安裝於機台上呈開啟狀態，再經由直接方式（係指模具自身 所產生熱量’即模具内組設有加熱器）或間接方式（係指非直 接由模具自身所產生的尚溫度’即藉由機台、加熱板等所產 生的高溫度傳導至模具上）加熱維持至預定溫度（即約7〇〇c 〜200°c )以上； 200947764 如步驟33，將支架組件2置放於公、母模具242、244 所組成之模具24的模穴240内；請參閱第一圖及第二圖， 另外，本發明亦能在支架組件2置放於模具24之模穴24〇 之刖，如步驟32所述，將安裝有[ED晶片20之支架22表 面以塗佈方式（如：喷塗·.等）將結合劑（pdmei·)均勻 分佈於其上，其中該結合劑係可作為提供熱固性透明材料 (Sihcone)與該支架22表面的相同材質或支架22表面不 〇 同材質間的結合性之用，換言之，能使該支架22表面成為 易與熱固性透明材料（Silicone)結合的表面。此支架22包 括金屬本體221、形成於金屬本體221上之限位部222，且 在本例中，支架22具有LED晶片20置放台220,其上方如 上述現有技術所示，採用例如表面黏著技術、利用導熱膠固 定LED晶片20，並利用如金線等導線進行打線（未示）連接 LED晶片20複數接點與支架22，而成為一支架組件2。當 然，如熟於此技者所能輕易理解，上述支架表面處理亦可為 Ο 電漿處理（即電漿清洗方式）。 在本例中，該熱固性透明材料（Silicone)是由二劑具 有可流動黏稠液體狀的矽膠混合劑所構成，，且上述之二劑妙 朦混合劑係可分為主劑（即業界俗稱A劑）及促煤劑（即業 界俗稱B劑），且上述主劑及促煤劑均為具有可流動性的黏 稠液體所相互混合而成的； 隨後如步琢34，藉由公、母模具242、244的緊密蓋合 後再將熱固性透明材料持續以預定流速加壓填滿於模具之 模穴内，且同步將模穴内的氣體播壓排出；換言之，會致使 200947764 已位於機台上的二劑具有可流動黏稠液體狀的矽膠混合劑 (即主劑及促煤劑）先行以適當比例混合後而形成一熱固性 透明材料（Silicone )後，以預定流速的方式而將已呈適當 混合比例（如1 : 1或1〇 : 1或25 : i ..等為最佳）所混 合形成的二劑梦膠混合劑（即熱固性透明材料）加壓注入至 已具有預定溫度的模穴240中，換言之，二劑矽膠混合劑（即 熱固性透明材料）在加壓經由注入口 241注入至已具有預定 ❹ 溫度的模穴240内係呈邊加壓射入熱固性透明材料暨邊排 風（即從微小氣道243中排出）的同步作用，而有效解決改善 習知模穴必需分段進料再抽氣的現象，以致使分子密度更高 及其排列組合更加均勻化，而使得其透光度及折射率變得更 高’直到熱固性透明材料完全填滿該模穴24〇容積的預定容 量（如第三圖）；而上述之填滿預定容量的方式可為“連續 等速填滿方式”為之、或為“連續不等速度的填滿方式，’為 之； © 由於熱固性透明材料在填滿預定容量時並非受抽氣之 強力吸引而快速流動，其填滿模穴24〇過程中不易產生棄 流，亦使殘存氣泡之機率大幅降低’且緩緩流動之過程亦足 以防止金線折斷彎曲，以降低產品劣化風險。 如步驟36 ’待模穴240内的熱固性透明材料因模具24 的預定加熱溫度（即約70°C〜200°C )而致使其固化後，便 在該支架組件2設置有LED晶片20的外側形成有矽膠混合 劑（即熱固性透明材料）所構成的透鏡30,換言之，熱固 性透明材料所形成的透鏡30能將LED晶片20包覆置於支 200947764 架組件2上，最後，即可開模暨取出表面已形成有透鏡別 之支架22 (如步称37)，進而完成LED晶片20的透鏡30 封裝（如步驟38)，請參閱第四圖。 再於步称38後’將已取出表面已形成有透鏡3〇之支架 組件2 ’並對其進行外觀檢驗，例如透鏡3G是否浮起、氣 泡、水紋、透鏡缺料、有異物、表面異常或刮傷、邊緣破裂、 斷線與防止外露㈣形成毛邊；最後，切除支架·不需要 ❹的如毛邊、金屬外框等，並進行電性測試以期提高 本發明之LED晶片的出貨良率。 此外需強調的是本發明亦可由數個如第二圖所示的模 具所組構而成，且於生產時，一組模具將可同時對數個表面 黏著有LED晶片20之支架組件2進行矽膠混合劑的加壓注 入包覆成型方式為之。又，本發明之支架22可如第五圖所 示，採用無突出LED晶片置放台的[ED支架22。 本發明以模組自動化方式將二劑矽膠混合劑加壓注入 〇 已放置支架的模具之模穴内，且不會對金線產生損害的情況 下，於支架組件上形成覆蓋LED晶片之透鏡，達到大幅縮 短其整個的生產時間、大幅提高其產能產量及大大的降低其 成本的優勢，且亦能使模具適用於具有突出led晶片置放 Q或無犬出LED晶片置放台而無須更換模具。 唯以上所述者，僅為本發明之較佳實施例而已，並非用 來限定本發明實施之範圍。故即凡依本發明申請範圍所述之 特徵及精神所為之均等變化或修飾，均應包括於本發明之申 請專利範圍内β 200947764 【圖式簡單說明】 第一圓係為本發明之步驟流程圖。 第二圖係為本發明將支架放置於模具時的分解剖面示 意圖。 第二圖係為第二圖模具關閉射出時的組合剖面示意圖。 第四圖係為第三圖作動完成後的分解剖面示意圖。 〇 ::圏係本發明採用無突出咖晶片置放台的支架組 件的分解剖面示意圖。 2…支架組件 22·..LED 支竿 221.. .金屬本艘 24.. .模具 〇 241…注入口 243.·.氣道 30·..透鏡 【主要元件符號說明】 20...LED 晶片 220…置放台 222…限位部 240…模穴 242…公模具 244…母模具 31〜38·..步驟200947764 IX. INSTRUCTIONS: [Technical Field] The present invention belongs to the technical field of LED chip packaging, and particularly refers to a method of rapidly producing, shortening process time, improving process yield, increasing lens transmittance and service life. LED chip packaging method. [Prior Art] According to the conventional LED chip packaging method, please refer to the applicant's previous application for the rLED chip packaging method of No. 96122810, which is the main production process steps: a) placing a bracket assembly in one In a mold having a cavity, the assembly includes a bracket having a surface that is easy to bond with a thermosetting transparent material; and a bracket disposed on the bracket, having a plurality of contacts, and the contacts are wire-bonded to the predetermined position of the bracket LED wafer; b) heating the mold; c) projecting the precursor of the thermosetting transparent material into the cavity at a flow rate lower than a predetermined speed until filling to a predetermined capacity exceeding one-half of the volume of the cavity; d) the pomelo takes the gas in the cavity to form a predetermined low pressure in the cavity; and e) continuously filling the precursor of the thermosetting transparent material and curing it; thereby, forming a side of the LED assembly on the support assembly The thermosetting transparent material constitutes a lens. Although the above creations can be contrary to the original purpose of the creation, and are highly praised by the industry and manufacturers, 'there will be the following problems in the production process: 200947764 1 ·Because the bracket assembly is placed in the mold After the inner and the closed, the mold can be started to be heated. In other words, when the mold assembly (10) is removed, the mold must be cooled to a normal temperature, so that the operator can remove the bracket assembly with the lens from the mold. Such a process is bound to make the initial heating time after each mode closing and the start cooling time before each mold opening account for a considerable proportion of the total production time required to complete an LED chip package. Sexuality, which makes it impossible to increase its production speed and production capacity to zero. 2. Since the prior art means must "inject the cavity at a lower flow rate (ie, below the pre-twisting speed) to a predetermined capacity of more than half of it, it will inevitably make the production time of the required time relatively The length of the sex becomes longer. At the same time, the gas in the cavity is first extracted to a predetermined low pressure, and then the process of filling up to the cavity is continued, which further causes the time required for the process to be increased again, and is easy to make. The degree of molecular density bonding between the thermosetting transparent materials that are segmented into the cavity is relatively low and the arrangement is more uniform, resulting in poor transmittance and lowering the service life of the cavity. It is indeed a big problem to improve the comprehensiveness. 3 · As stated in item 2, 'Because the gas in the cavity is extracted, in other words, it must be obtained by using a pumping device other than the mold.' Therefore, it is necessary not only to add additional suction equipment or In addition to mechanical equipment, it will also greatly increase the cost of equipment, which is another major problem. In view of the above, the present invention has been made in view of the above-mentioned shortcomings of the prior art, and proposes an LED wafer lens packaging method to effectively overcome the above problems. SUMMARY OF THE INVENTION The main object of the present invention is to provide an LED wafer lens packaging method for directly or indirectly heating a mold to a predetermined temperature or higher, and then placing the bracket assembly in a mold having a cavity, and then borrowing The thermosetting transparent material is pressurized and injected at a predetermined flow rate to a predetermined capacity filling the cavity volume by tight sealing of the mold, and then solidified by a predetermined temperature of the mold, and then the mold is taken out and removed by the thermosetting transparent material. The formed lens can be surely coated on the bracket assembly of the LED chip; thus, the automatic modularized molding production method can be used to achieve the synchronization effect of the side pressure injection into the thermosetting transparent material and the side exhausting air in the cavity. Therefore, it is effective to solve the phenomenon that the 77-stage feed and the pumping are necessary to improve the conventional mold cavity, so that the molecular density between the thermosetting transparent materials in the cavity is more uniform and the arrangement thereof is more uniform, so that the transmittance and the refractive index change. Higher, and greatly increase its production yield and increase its service life, while also significantly reducing its overall production Time, and can greatly increase its capacity and output, and thus reduce its cost overall is its progressive effect. 〇 [Embodiment] This creation is related to a LED wafer lens packaging method, please refer to the first to fifth figures, the flow of the steps is as follows: As described in step 31, the mold 24 (ie, the male and female molds) 242, 244) Installed on the machine table to open, and then through the direct mode (refers to the heat generated by the mold itself 'that is, the heater is set in the mold) or indirect (refers to the non-directly generated by the mold itself) The temperature 'is transmitted to the mold by the high temperature generated by the machine table, the heating plate, etc.) and the heating is maintained to a predetermined temperature (ie, about 7〇〇c to 200°c); 200947764, as in step 33, the bracket assembly 2 is placed Placed in the cavity 240 of the mold 24 composed of the male and female molds 242, 244; please refer to the first figure and the second figure. In addition, the present invention can also be placed in the cavity 24 of the mold 24 in the bracket assembly 2 Then, as described in step 32, the surface of the holder 22 on which the ED wafer 20 is mounted is uniformly distributed on the surface of the holder 22 (eg, spray coating, etc.), wherein the bonding agent is uniformly distributed thereon. Can be used as a thermosetting transparent material (Sihcone) and The same material or surfaces 22 of the frame holder 22 is not square with the binding between the same material, in other words, the surface of the holder 22 can be easily bound to the surface of a transparent thermosetting material (Silicone). The bracket 22 includes a metal body 221 and a limiting portion 222 formed on the metal body 221. In this example, the bracket 22 has an LED wafer 20 mounting table 220, as shown in the above prior art, for example, using surface adhesion. The LED chip 20 is fixed by a thermal conductive adhesive, and a plurality of contacts of the LED chip 20 and the holder 22 are connected by wires (not shown) such as gold wires to form a bracket assembly 2. Of course, as can be easily understood by those skilled in the art, the surface treatment of the above-mentioned stent can also be Ο plasma treatment (i.e., plasma cleaning method). In this example, the thermosetting transparent material (Silicone) is composed of two silicone adhesives having a flowable viscous liquid, and the above two agents are classified as a main agent (ie, the industry commonly known as A). And a coal-promoting agent (commonly known as the agent B in the industry), and the above-mentioned main agent and coal-promoting agent are mixed with a viscous liquid having fluidity; and then, as in step 34, by a male and female mold After the tight closure of 242, 244, the thermosetting transparent material is continuously pressurized and filled in the cavity of the mold at a predetermined flow rate, and the gas in the cavity is simultaneously discharged; in other words, the 200947764 is already located on the machine. The silicone rubber mixture (ie, the main agent and the coal promoter) having a flowable viscous liquid is firstly mixed in an appropriate ratio to form a thermosetting transparent material (Silicone), and then has a proper mixing ratio at a predetermined flow rate ( A two-component dream glue mixture (ie, a thermosetting transparent material) formed by mixing, such as 1: 1 or 1 〇: 1 or 25: i.. or the like is optimally injected, into a cavity 240 having a predetermined temperature, In other words, two The silicone rubber mixture (i.e., the thermosetting transparent material) is injected into the cavity 240 having a predetermined enthalpy temperature through the injection port 241, and is injected into the thermosetting transparent material and discharged sideways (i.e., discharged from the minute air passage 243). Synchronous action, and effectively solve the phenomenon that the conventional mold cavity must be segmented and then pumped, so that the molecular density is higher and the arrangement is more uniform, so that the transmittance and refractive index become higher. Until the thermosetting transparent material completely fills the predetermined capacity of the cavity 24 ( volume (as shown in the third figure); and the above method of filling the predetermined capacity may be “continuous constant filling method” or “continuous no The method of filling at the same speed, 'for this; © Since the thermosetting transparent material is not attracted by the strong suction of the air when filling the predetermined capacity, it is not easy to generate abandonment during the filling of the cavity 24, and also remains The probability of bubbles is greatly reduced' and the process of slow flow is also sufficient to prevent the gold wire from breaking and bending, so as to reduce the risk of product deterioration. For example, step 36 'The thermosetting transparent material in the cavity 240 After the material is cured by the predetermined heating temperature of the mold 24 (i.e., about 70 ° C to 200 ° C), a silicone rubber mixture (i.e., a thermosetting transparent material) is formed on the outside of the holder assembly 2 on which the LED wafer 20 is disposed. The lens 30 is constructed, in other words, the lens 30 formed by the thermosetting transparent material can cover the LED wafer 20 on the support frame 200974464. Finally, the mold can be opened and the surface of the lens 22 has been formed. Step 37), and then complete the lens 30 package of the LED chip 20 (as in step 38), please refer to the fourth figure. After the step 38, the bracket assembly 2 having the lens 3 has been taken out It performs visual inspection, such as whether the lens 3G floats, bubbles, water marks, lens missing, foreign matter, surface anomalies or scratches, edge cracks, broken lines and prevention of exposure (4) forming burrs; finally, the stent is removed. Such as burrs, metal frames, etc., and electrical testing to improve the shipment yield of the LED wafer of the present invention. In addition, it should be emphasized that the present invention can also be constructed by a plurality of molds as shown in the second figure, and in production, a set of molds can simultaneously perform a plurality of adhesives on the holder assembly 2 with the LED chips 20 adhered to the surface. The pressurized injection of the mixture is overmolded. Further, the holder 22 of the present invention can be as shown in Fig. 5, using the [ED bracket 22 without the protruding LED wafer placing table. The invention applies a two-component silicone rubber mixture into a cavity of a mold in which a stent has been placed in a module automatic manner, and forms a lens covering the LED wafer on the bracket assembly without causing damage to the gold wire. It greatly shortens its overall production time, greatly increases its capacity and greatly reduces its cost, and also enables the mold to be used with a prominent LED wafer placement Q or a dogless LED wafer placement table without the need to change the mold. The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the present invention. Therefore, any change or modification of the features and spirits described in the scope of the present application should be included in the scope of the patent application of the present invention. β 200947764 [Simple Description of the Drawing] The first circle is the step flow of the present invention. Figure. The second figure is an exploded cross-sectional view of the present invention when the stent is placed on a mold. The second figure is a schematic cross-sectional view of the second figure when the mold is closed and shot. The fourth figure is a schematic exploded view of the third figure after the completion of the operation. 〇 ::圏 This is an exploded cross-sectional view of a stent assembly using a non-prominent coffee wafer placement table. 2...Bracket assembly 22·..LED support 221... metal ship 24...mold 〇241...injection port 243.·.airway 30·..lens [main component symbol description]20...LED chip 220... placement table 222... limit portion 240... mold cavity 242... male mold 244... female mold 31~38·.. steps