200945757 九、發明說明： 【發明所屬之技術領域】 纟發明是有關於-種發電裝置’特別是指—藉由吸收 熱能以產生電能的散熱發電裝置。 【先前技術】 參閱圖卜中華民國專利公開公報帛2〇〇522497號「利 用溫度發電之裝置」發明專利申請案揭露一種利用溫度發 電之裝置卜包括-設置於一微處理器1〇上的感電構造u β 、-設置於該感電構造11上的散熱片u、一樞設於該散熱 片12内的風扇13，及二分別電連接該感電構造u與該風 扇13第一、二導線14、15。 藉由該感電構造11初步吸收該微處理器1〇運作時所產 生的熱能，使該感電構造11靠抵於該微處理器1〇的一側， 與靠抵於該散熱片12的另一侧因溫度差產生熱電效應而生 成電流，而電流經由該第-、二導線14、15以驅動該風扇 13旋轉，達成不需額外電力即可為該微處理器10散熱的功 ® 效。 但是，該感電構造11從中阻隔了該散熱片12與該微處 理器10,使得該散熱片12無法直接與該微處理器1〇接觸 ，而該風扇13所吸入的氣流又僅能用於冷卻該散熱片12， 由於該感電構造11從中阻隔了該散熱片12與該微處理器 1〇，降低了該散熱片12利用熱傳導效應所能達成散熱的功 效，即使該風扇13能降低該散熱片12的溫度，亦無法提 升忒散熱片12冷卻該微處理器1〇的效果，倘若該感電構 5 200945757 -. 造11的熱傳導能力較低，更可能造成該散熱片12與該風扇 13兀全無法提供該微處理器1〇所需的散熱效果導致微處 理器10的工作溫度較高，進而影響了該微處理器1〇的效 能’甚至造成該微處理器10因過熱而毀損。 【發明内容】 因此，本發明之目的，即在提供一種兼具卓越散熱效 果與發電功能的散熱發電裝置。 於是，本發明散熱發電裝置，適用於吸收一發熱體所 ® 產生的熱能以產生電力，該散熱發電裝置包含一散熱單元 、一隔熱體、一集熱單元、一致冷晶片，及一輸出單元。 該散熱單元用以吸收該發熱體所產生的熱能。該隔熱 體環設於該散熱單元的外周緣，且具有一開口。該集熱單 疋固設於該散熱單元之一側面上，且突伸於該隔熱體的開 口。該致冷晶片固設於該集熱單元相反於該散熱單元的另 一側上。該輸出單元包括二電連接該致冷晶片的導線。 本發明之功效是利用該散熱單元吸收該發熱體所產生 鏐 &錢’配合該㉟熱體阻隔熱能的散失，再利用該集熱單 元匯集熱能，並傳送至該致冷晶片上，使該致冷晶片藉由 溫差形成熱電效應產生電流，再由電連接該致冷晶片的二 條導線將電流導出加以應用，兼具卓越散熱效果與發電功 能。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之二個較佳實施例的詳細說明中，將可 6 200945757 清楚的呈現。 在本發明被詳細描述之前，要注意的 明内容中’類似的元件是以相同的編號來表示。下的說 參_ 2’本發明散熱發電裝置2之第_較 包含一散熱單元21、—隔熱體22 一集熱單元U、一致冷 晶片24，及一輸出單元25。。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 [Prior Art] Referring to the drawing of the Patent Application Publication No. 522 497 497, the "Using Temperature Generation Apparatus" Patent Application discloses a device for generating electricity by temperature, including a sensory battery disposed on a microprocessor 1 a heat sink u disposed on the heat-sensitive structure 11 , a fan 13 pivotally disposed in the heat sink 12 , and two electrically connected to the first and second wires 14 of the heat-sensitive structure u and the fan 13 respectively 15. The heat-sensing structure 11 initially absorbs the heat energy generated when the microprocessor 1 is operated, so that the electrical-sensing structure 11 abuts against one side of the microprocessor 1 and the other against the heat sink 12 The side generates a current due to the thermoelectric effect generated by the temperature difference, and the current is driven to rotate the fan 13 via the first and second wires 14, 15 to achieve the function of dissipating heat for the microprocessor 10 without requiring additional power. However, the heat-sensitive structure 11 blocks the heat sink 12 from the microprocessor 10, so that the heat sink 12 cannot directly contact the microprocessor 1 , and the airflow sucked by the fan 13 can only be used for cooling. The heat sink 12 is configured to block the heat sink 12 from the microprocessor 1 , thereby reducing the heat dissipation effect of the heat sink 12 by using a heat conduction effect, even if the fan 13 can lower the heat sink The temperature of 12 can not improve the effect of the fins 12 cooling the microprocessor. If the heat transfer capability of the inductor is low, it is more likely to cause the heat sink 12 and the fan 13 to be fully charged. The inability to provide the heat dissipation effect required by the microprocessor 1 results in a higher operating temperature of the microprocessor 10, which in turn affects the performance of the microprocessor 1 'even causing the microprocessor 10 to be damaged by overheating. SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a heat radiation power generation device that has both excellent heat dissipation effects and power generation functions. Therefore, the heat-dissipating power generating device of the present invention is adapted to absorb heat generated by a heating element to generate electric power, and the heat-dissipating power generating device comprises a heat dissipating unit, a heat insulating body, a heat collecting unit, a uniform cold chip, and an output unit. . The heat dissipating unit is configured to absorb thermal energy generated by the heating element. The insulator ring is disposed on an outer circumference of the heat dissipation unit and has an opening. The heat collecting unit is fixed on one side of the heat dissipating unit and protrudes from the opening of the heat insulating body. The refrigerating wafer is fixed on the other side of the heat collecting unit opposite to the heat dissipating unit. The output unit includes two wires electrically connected to the refrigerated wafer. The effect of the present invention is that the heat dissipating unit absorbs the heat generated by the heat generating body and cooperates with the heat dissipation of the 35 heat body, and then collects heat energy by the heat collecting unit, and transmits the heat energy to the cooling chip, so that The cooling chip generates a current by forming a thermoelectric effect by a temperature difference, and then the current is led out by electrically connecting the two wires of the cooling chip, and has excellent heat dissipation effect and power generation function. The above and other technical contents, features and effects of the present invention will be apparent from the following detailed description of the two preferred embodiments of the drawings. Before the present invention is described in detail, the like elements are denoted by the same reference numerals. The second embodiment of the present invention includes a heat dissipating unit 21, a heat insulator 22, a heat collecting unit U, a uniform cold wafer 24, and an output unit 25.
S散·、、、單元21包括複數設置於-發熱體30上的散熱 錯片2U，及—設置於所述散_片211上的散熱風扇212 。於本較佳實施例中’該發熱體3G是電腦的中央處理器（ C論al Pro咖ing Unit，⑽），當然也可以是其他的發熱體 3〇,只要所述散熱縛片211可以安裝在該發熱體％上即可 達到吸收該發熱體30所產生之熱能的相同效果。 該隔熱體22是環設於所述散熱籍片211及該散熱風扇 212的外周緣，且具有—開σ 22卜該集熱單元23包括一 固設於該散熱單元21之散熱211上，且突伸於該隔熱 體22之開口 221的外環繞壁232、-與該外環繞壁232相 間隔的内環繞壁231，及一充填於該内、外環繞壁23 i、 232間的聚熱體233。其t，該外環繞壁232固設於該散熱 單元21之散熱鰭片211的一侧面上，而該致冷晶片24是固 設於該外環繞壁232相反於所述散熱鰭片211的另一側上。 該輸出單元25包括二分別電連接該致冷晶片24的導線251 於本較佳實施例t，該隔熱體22是以陶瓷材料所製成 而該聚熱體233可以是純水，甲醇、丙酿|、氨、氮、納 7 200945757 *» ，或鋰，也可以其中至少任二種的混合而成，於本較佳實 施例中該聚熱體233是純水。 參閱圖3,該致冷晶片24包括一固設於該集熱單元23 之外環繞壁232上的第一連結片241、一與該第一連結片 241相間隔的第二連結片242，及複數間隔設置於該第一連 結片241與該第二連結片242間的n型半導體243與P型 半導體244。 參閱圖2、3,該散熱單元21的散熱鰭片211藉由熱傳 〇 導效應吸收發熱體30所產生的熱能，配合該隔熱體22防 止所述散熱鰭片211所吸收的熱能向外散失，再配合該散熱 風扇212轉動時所吸入的氣流，將所述散熱鰭片211所吸收 的熱忐往該集熱單元23的方向帶動，接下來利用該集熱單 兀23的聚熱體233聚集熱能，造成該集熱單元23的外環 繞壁232迅速升溫，連帶使該致冷晶片24固設於該集熱單 元23之外環繞壁232上的第一連結片241溫度迅速升高， 因此，造成該致冷晶片24的第一連結片241與該第二連結 片242間形成溫差，而該等N型半導體243與p型半導體 244則因該第一連結片241與該第二連結片242間的溫差形 成熱電效應產生電流’電流可經由該輸出單元25的二導線 251傳送至例如本實施例中所使用之散熱風扇212，或其他 本實施例附屬之電子元件上，有效利用發熱體3〇的熱量， 而減少耗電量。 參閱圖4，本發明散熱發電裝置2之第二較佳實施例， 大致上是與該第一較佳實施例相同，包含一散熱單元21、 8 200945757 :隔熱體22、一集熱單元23、一致冷晶片24，及一輸出單 元25其中不相同之處在於：該散熱風扇212是設置在所 述散熱轉片211 +，而該隔熱體22是環設於該散熱單元2ι 之散熱韓片211的外周緣，該散熱風扇212轉動時所導入的 氣流，迫使將所述散熱鰭片211所吸收的熱能導向該集熱單 疋23，而造成該集熱單元23迅速升溫，使該致冷晶片Μ 因為溫度差形成熱電效應產生電流，提供一不同於第一較 ❹㈣實施例之選擇’而同樣可以達成如第一較佳實施例的 功效。 綜上所述，本發明之散熱發電裝i 2,具有下列優點： 1.冷卻效果好： 利用將該散熱單元21的散熱鰭片211直接設置於該 發熱體30上，利用熱傳導效應吸收該發熱體％所產生的 …此，以冷部該發熱體3〇，再配合設置於所述散熱鰭片 211上的散熱風扇212轉料所產生的熱對流效應冷卻所 • 述散熱鰭片2U，持續維持所述散熱韓片211吸收該發熱 體30所產生之熱能的能力，以達成進一步冷卻該發熱體 3〇的功效’較習知利用溫度發電之裝置i的散熱效果更 好。 2·發電效果佳： &利用該隔熱體22減少所述散熱_片211所吸收的熱 散失並配合5亥散熱風胃212的轉動所導入的氣流，迫 使所述散熱鰭片211所吸收的熱能集中導向該集熱單元 再利用該集熱單兀23的聚熱體233聚集熱能迅速提 9 200945757 升該集熱單兀23之外環繞壁232的溫度藉此，集中該 發熱體3G所產生的熱能，使該致冷晶片24因溫度差形成 之熱電效應所產生的電流能更加穩定，所能產生的發電效 果亦較利用習知溫度發電之裝置1更好。 3.減少耗電量： 該致冷晶片24因熱電效應所產生的電流可應用於其 他元件上，不必再額外提供電源，有效減少耗電量。 惟以上所述者，僅為本發明之較佳實施例而已，當不 此以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明内容所作之簡單的等效變化與修飾皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一立體圖’說明中華民國專利公開公報第 200522497號「利用溫度發電之裝置」發明專利申請案所揭 露的一種溫度發電之裝置； φ 圖2是一剖視圖’說明本發明散熱發電裝置之第一較 佳實施例； 圖3是一局部放大剖視圖，說明該較佳實施例中致冷 晶片的結構；及 圖4是一剖視圖，說明本發明散熱發電裝置之第二較 佳實施例。 10 200945757 【主要元件符號說明】 2 散熱發電裝置 233 聚熱體 21 散熱單元 24 致冷晶片 211 散熱鰭片 241 第一連結片 212 散熱風扇 242 第二連結片 22 隔熱體 243 N型半導體 221 開口 244 P型半導體 23 集熱單元 25 輸出單元 231 内環繞壁 251 導線 232 外環繞壁 30 發熱體 11The S-dissipating/discharging unit 21 includes a heat dissipating chip 2U disposed on the heat generating body 30, and a heat radiating fan 212 disposed on the diffusing film 211. In the preferred embodiment, the heating element 3G is a central processing unit of a computer (C), and may be other heating elements, as long as the heat dissipation tab 211 can be installed. The same effect of absorbing the heat energy generated by the heat generating body 30 can be achieved in the heat generating body %. The heat insulator 22 is disposed on the outer periphery of the heat dissipating film 211 and the heat dissipating fan 212, and has an opening σ 22 . The heat collecting unit 23 includes a heat dissipating 211 fixed on the heat dissipating unit 21 . And an outer surrounding wall 232 protruding from the opening 221 of the heat insulator 22, an inner surrounding wall 231 spaced from the outer surrounding wall 232, and a poly filling between the inner and outer surrounding walls 23 i, 232 Hot body 233. The outer surrounding wall 232 is fixed on one side of the heat dissipation fin 211 of the heat dissipation unit 21, and the refrigerant chip 24 is fixed on the outer surrounding wall 232 opposite to the heat dissipation fin 211. On one side. The output unit 25 includes two wires 251 electrically connected to the refrigerant chip 24, respectively. In the preferred embodiment t, the heat insulator 22 is made of a ceramic material, and the heat collector 233 may be pure water, methanol, The propylene powder, ammonia, nitrogen, sodium 7, 200945757 *», or lithium may also be a mixture of at least two of them. In the preferred embodiment, the heat collector 233 is pure water. Referring to FIG. 3, the refrigerating chip 24 includes a first connecting piece 241 fixed to the surrounding wall 232 outside the heat collecting unit 23, and a second connecting piece 242 spaced apart from the first connecting piece 241, and The n-type semiconductor 243 and the P-type semiconductor 244 are disposed at a plurality of intervals between the first connecting piece 241 and the second connecting piece 242. 2 and 3, the heat dissipating fins 211 of the heat dissipating unit 21 absorb the heat energy generated by the heat generating body 30 by the heat transfer enthaling effect, and the heat insulating body 22 is prevented from preventing the heat energy absorbed by the heat dissipating fins 211 from being outward. Dissipating, in conjunction with the airflow drawn by the cooling fan 212, the heat absorbed by the heat dissipation fins 211 is driven in the direction of the heat collecting unit 23, and then the heat collecting body of the heat collecting unit 23 is utilized. 233, the heat is accumulated, and the outer surrounding wall 232 of the heat collecting unit 23 is heated rapidly, and the temperature of the first connecting piece 241 which surrounds the wall 232 outside the heat collecting unit 23 is rapidly increased. Therefore, a temperature difference is formed between the first connecting piece 241 of the cooling chip 24 and the second connecting piece 242, and the N-type semiconductor 243 and the p-type semiconductor 244 are connected to the second connecting piece 241 and the second connecting piece. The temperature difference between the sheets 242 forms a thermoelectric effect generating current. The current can be transmitted to the heat dissipating fan 212 used in the embodiment, for example, by the two wires 251 of the output unit 25, or other electronic components attached to the embodiment, and the heat is effectively utilized. Body heat , and reduce power consumption. Referring to FIG. 4, a second preferred embodiment of the heat-dissipating power generating device 2 of the present invention is substantially the same as the first preferred embodiment, and includes a heat dissipating unit 21, 8 200945757: a heat insulating body 22 and a heat collecting unit 23. The uniform cooling chip 24 and the output unit 25 are different in that the heat dissipating fan 212 is disposed on the heat dissipating fin 211 + , and the heat insulating body 22 is disposed on the heat dissipating unit 2 ι The airflow introduced by the heat dissipation fan 212 is forced to direct the heat energy absorbed by the heat dissipation fins 211 to the heat collecting unit 23, thereby causing the heat collecting unit 23 to rapidly heat up. The cold wafer Μ because the temperature difference creates a thermoelectric effect to generate a current, providing a different choice than the first comparative embodiment, and the same as the first preferred embodiment can be achieved. In summary, the heat-dissipating power generating device i 2 of the present invention has the following advantages: 1. The cooling effect is good: the heat-dissipating fins 211 of the heat-dissipating unit 21 are directly disposed on the heat generating body 30, and the heat is absorbed by the heat conduction effect. The heat generating body 3 冷 is cooled in the cold portion, and the heat convection effect generated by the heat transfer fan 212 disposed on the heat radiating fin 211 is cooled to cool the heat sink fin 2U. The ability of the heat dissipating Korean film 211 to absorb the heat energy generated by the heat generating body 30 is maintained to achieve the effect of further cooling the heat generating body 3'. The heat dissipating effect of the device i that uses the temperature to generate electricity is better. 2. The power generation effect is good: & the heat insulator 22 is used to reduce the heat loss absorbed by the heat dissipation sheet 211 and to match the air flow introduced by the rotation of the heat dissipation stomach 212, forcing the heat dissipation fins 211 to absorb The heat energy is concentrated to the heat collecting unit, and the heat collecting body 233 of the heat collecting unit 23 is used to collect the heat energy. The temperature of the surrounding wall 232 of the heat collecting unit 23 is increased by the temperature of the heat collecting unit 23, thereby concentrating the heat generating body 3G. The generated heat energy makes the current generated by the thermoelectric effect formed by the temperature difference of the refrigerant chip 24 more stable, and the power generation effect which can be generated is better than that of the device 1 which uses the conventional temperature power generation. 3. Reducing power consumption: The current generated by the thermoelectric effect of the refrigerant chip 24 can be applied to other components without additional power supply, thereby effectively reducing power consumption. However, the above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent change and modification according to the scope of the present invention and the description of the invention. All remain within the scope of the invention patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a device for temperature power generation disclosed in the invention patent application No. 200522497 of the Chinese Patent Publication No. 200522497; φ FIG. 2 is a cross-sectional view BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3 is a partially enlarged cross-sectional view showing the structure of a refrigerating wafer in the preferred embodiment; and FIG. 4 is a cross-sectional view showing the second comparison of the heat dissipating power generating device of the present invention. A good example. 10 200945757 [Description of main components] 2 Thermal power generation unit 233 Heat collector 21 Heat sink unit Cooling chip 211 Heat sink fin 241 First joint piece 212 Heat sink fan 242 Second joint piece 22 Heat insulator 243 N type semiconductor 221 Opening 244 P-type semiconductor 23 heat collecting unit 25 output unit 231 inner surrounding wall 251 wire 232 outer surrounding wall 30 heating element 11