CN219207631U - Cold head device for handheld cosmetic instrument - Google Patents
Cold head device for handheld cosmetic instrument Download PDFInfo
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- CN219207631U CN219207631U CN202223314857.XU CN202223314857U CN219207631U CN 219207631 U CN219207631 U CN 219207631U CN 202223314857 U CN202223314857 U CN 202223314857U CN 219207631 U CN219207631 U CN 219207631U
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- heat
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- copper plate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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Abstract
The utility model relates to a cold head device for a handheld cosmetic instrument, which comprises a cold head, a semiconductor refrigerating sheet, a radiating fin assembly and a heat absorption and conduction copper pipe; the back of the cold head is provided with an installation part, and the refrigerating surface of the semiconductor refrigerating sheet is attached to the installation part on the back of the cold head; the heat-absorbing heat-conducting copper pipe is bent, and two ends of the heat-absorbing heat-conducting copper pipe are inserted into the mounting holes of the heat-dissipating fin assembly; the middle bending part of the heat absorption and conduction copper pipe extends to the area where the heating surface of the semiconductor refrigeration piece is positioned to be used as a heat absorption end; the heat absorption end is contacted with the heat-generating surface of the semiconductor refrigeration sheet to absorb heat; the heat absorption end is provided with a heat absorption copper plate, and the heat absorption copper plate completely covers the heating surface of the semiconductor refrigeration piece. The utility model simplifies the mounting structure of the semiconductor refrigerating piece, improves the refrigerating effect of the cold head, and perfects the heat radiation system, thereby improving the refrigerating efficiency of the cold head.
Description
Technical Field
The utility model relates to a cold head device applied to a handheld beauty instrument, belonging to the field of beauty equipment.
Background
With the development of electronic technology, household handheld beauty apparatus are popular, and are favored in the market. Aiming at swelling and pain and stinging of skin, a handheld cosmetic instrument is specially provided with a cold head device, and the skin is pressed and massaged by a massage head which is lower than the room temperature (5 ℃) to relieve symptoms such as swelling, pain and itching of the skin.
Especially, the laser skin care device is combined with a handheld laser skin care instrument, and the local position of the skin is burned at high temperature in the moment by laser to destroy pigment cells and pigment particles, so that the effects of whitening, removing wrinkles and the like are achieved; however, at the same time, the high-temperature laser brings some burning sensation to the skin, so the applicant has designed and applied for a household laser beauty instrument with cold compress function of Chinese patent publication No. CN212789460U, a handheld household laser beauty instrument of Chinese patent publication No. CN111557731A, and a metal cap assembly for the laser beauty instrument of Chinese patent publication No. CN211911794U, which uses a semiconductor refrigeration chip (TEC) as a cold source to combine with the metal cap, transfers the cold source generated by the semiconductor refrigeration chip to the metal cap, and the metal cap is responsible for contacting with the skin to perform cold compress.
However, the size of the internal space of the handheld beauty instrument is limited, particularly when a semiconductor refrigeration sheet (TEC) works, one side is a refrigeration surface, the other side is a heating surface, and the semiconductor refrigeration sheet can be kept in a normal working state only by timely sucking and radiating heat generated by the heating surface, and a low-temperature cold source is continuously generated and supplied to a cold head for cold compress. Therefore, in the current structure, the cold head (metal cap) and the semiconductor refrigeration plate (TEC) are connected by a heat conducting arm/cold conducting arm, and the cold energy is lost in the conduction process, so that the cold energy is not fully utilized.
In order to improve the cold compress effect of the cold head on the handheld cosmetic instrument, an improvement on the cold head device is necessary.
Disclosure of Invention
The utility model aims to provide a cold head device for a handheld cosmetic instrument, which is improved in structure, so that the refrigeration efficiency of the cold head is improved, and the cold compress effect of the cosmetic instrument is further improved.
In order to achieve the aim of the utility model, the utility model provides a cold head device for a handheld cosmetic instrument, which comprises a cold head, a semiconductor refrigerating sheet, a radiating fin assembly and a heat absorption and conduction copper pipe;
the cold head is a metal head and is fixed at the working end of the handheld cosmetic instrument to serve as a working head;
the back of the cold head is provided with an installation part, and the refrigerating surface of the semiconductor refrigerating sheet is attached to the installation part on the back of the cold head;
the radiating fin component is formed by stacking a plurality of metal sheets in parallel; the heat-absorbing heat-conducting copper pipe is bent, and two ends of the heat-absorbing heat-conducting copper pipe are inserted into the mounting holes of the heat-dissipating fin assembly;
the metal sheet of the radiating fin assembly forms a connecting sleeve at the mounting hole part; the connecting sleeve is sleeved on 2 end pipes of the heat absorption and conduction copper pipe and is welded and fixed together;
the middle bending part of the heat absorption and conduction copper pipe extends to the area where the heating surface of the semiconductor refrigeration piece is positioned to be used as a heat absorption end; and the heat absorption end is contacted with the heat-generating surface of the semiconductor refrigeration sheet to absorb heat.
As a further improvement of the utility model, the mounting part on the back surface of the cold head is a groove, and the refrigerating surface of the semiconductor refrigerating sheet is embedded in the groove of the mounting part.
As a further improvement of the utility model, a cold guide component is arranged between the cold face of the semiconductor refrigeration piece and the cold head;
the cold-conducting component is a cold-conducting silicon wafer or cold-conducting silicone grease.
As a further improvement of the utility model, the tail end of the heat absorption and conduction copper pipe is positioned outside the radiating fin component.
As a further improvement of the utility model, the heat absorbing end of the heat absorbing and conducting copper pipe is arranged in a flat shape, and the flat surface is contacted with the heat generating surface of the semiconductor refrigeration piece to absorb heat.
Further, the heat absorbing end is provided with a heat absorbing copper plate, the effective size of the heat absorbing copper plate is larger than the size of the heat generating surface of the semiconductor refrigerating sheet, and the heat absorbing copper plate completely covers the heat generating surface of the semiconductor refrigerating sheet.
Still further, the edge of the heat absorption copper plate extends outwards, a part exceeding the heating surface of the semiconductor refrigeration piece forms an installation body, and an installation hole is formed in the installation body;
the back of the cold head is provided with a copper plate mounting column;
the fastening screw passes through the mounting hole at the edge of the heat absorption copper plate and is screwed into the copper plate mounting column at the back of the cold head, so that the heat absorption copper plate is pressed against the semiconductor refrigerating sheet to be fixed at the back of the cold head.
Further, the mounting holes are U-shaped adjustable mounting holes.
Further, a heat insulation piece is arranged between the fastening screw and the connecting part of the cold head or between the fastening screw and the connecting part of the heat absorption copper plate.
Further, the heat insulation piece is a heat insulation lining;
the outer wall of the heat insulation lining is embedded in the mounting hole of the heat absorption copper plate;
the fastening screw penetrates through the heat insulation bushing, and the fastening screw is not in contact with the heat absorption copper plate at all;
the fastening screw is screwed into the copper plate mounting column on the back of the cold head.
Still further, a heat conduction component is arranged between the heat absorption copper plate and the heating surface of the semiconductor refrigeration sheet;
the heat conduction component is a heat conduction silicon wafer or heat conduction silicone grease.
As a further improvement of the utility model, a heat radiation fan is arranged at the heat radiation fin component;
the number of the radiating fans is 1 or 2;
the heat radiation fan is positioned on the air flow passage of the heat radiation fin assembly;
the radiating fan is positioned in an air inlet hole or an air outlet hole of the handheld beauty instrument.
According to the cold head device for the handheld cosmetic instrument, the mounting position of the semiconductor refrigerating piece of the cold head in the handheld cosmetic instrument is adjusted, so that direct contact refrigeration and cold conduction are realized, the refrigeration effect of the cold head is improved, and the cold compress effect of the handheld cosmetic instrument is further improved; the heat-radiating system consisting of the heat-radiating fin component, the heat-absorbing heat-conducting copper pipe, the heat-absorbing copper plate and the heat-radiating fan is specially arranged for the heating surface of the semiconductor refrigerating sheet to efficiently absorb heat, conduct heat and radiate heat, so that the semiconductor refrigerating sheet is maintained in an efficient working state, and cold is continuously output to the cold head.
The cold head device for the handheld beauty instrument further simplifies the mounting structure of the semiconductor refrigerating sheet, improves the refrigerating effect of the cold head, and perfects the heat radiation system, thereby improving the refrigerating efficiency of the cold head.
Drawings
Fig. 1 is a schematic view of the whole structure of a cold head device for a handheld cosmetic instrument according to the present utility model;
fig. 2 is a schematic view of a part of a cold head device for a handheld cosmetic instrument according to the present utility model;
FIG. 3 is a schematic view of the cold head of FIG. 1 partially cut away;
FIG. 4 is a front view of FIG. 2;
FIG. 5 is a half cross-sectional view of FIGS. 1 and 3;
fig. 6 is a cross-sectional view of the semiconductor refrigeration sheet of fig. 1.
Detailed Description
The following describes the embodiments of the present utility model in further detail with reference to the drawings.
The cold head device for the handheld cosmetic instrument has the application state shown in fig. 1 and 2, and is provided with a cold head 1, wherein the cold head 1 is arranged at the working end of the handheld cosmetic instrument and is used as a working head; the cold head 1 is made of metal aluminum, and can play a good role in diffusing cold sources. Referring to a hand-held household laser beauty instrument with a Chinese patent publication number of CN111557731A, a window 11 can be arranged in the middle of the cold head 1 for the laser of the laser beauty instrument to pass through; the back of the cold head 1 is provided with a plurality of cold head fixing support posts 14 which are used for being connected with the shell of the handheld beauty instrument so as to fix the cold head 1.
The improvement of the cold head device for the handheld beauty instrument is that the back of the cold head 1 is provided with an installation part 12 for installing the semiconductor refrigerating sheet 2, the installation part 12 can be a groove, and the refrigerating surface of the semiconductor refrigerating sheet 2 is embedded in the cold head 1; adopt the recess design, can be right semiconductor refrigeration piece 2 plays the locate action, easy to assemble has thinned the wall thickness at this position of cold head 1 simultaneously, has shortened promptly the cold distance of leading of the cold face of semiconductor refrigeration piece 2, can be with the cold volume is faster lead to the working face of cold head 1.
Further, a cold guide member 21 is provided between the cooling surface of the semiconductor cooling fin 2 and the mounting portion 12; the semiconductor refrigeration piece 2 is formed by sintering, the surface of the semiconductor refrigeration piece 2 is provided with a plurality of pits due to the production process, the cold head 1 is a metal piece, and a plurality of pits are also provided in the processing, so that a soft cold guide part 21 is arranged between the semiconductor refrigeration piece 2 and the mounting part 12 of the cold head 1, and the effects of filling gaps between contact surfaces and increasing the contact surfaces can be achieved, thereby better transmitting cold energy to the cold head 1; the cold conducting member 21 may be a cold conducting silicon wafer or cold conducting silicone grease.
The utility model relates to an improvement of a cold head device for a handheld beauty instrument, which is characterized in that a high-efficiency heat dissipation system is arranged for a heating surface of a semiconductor refrigerating sheet 2, and the high-efficiency heat dissipation system comprises a heat dissipation fin assembly 3, a heat absorption heat conduction copper pipe 4, a heat absorption copper plate 5 and a heat dissipation fan 7.
Firstly, the heat-absorbing heat-conducting copper pipe comprises a heat-dissipating fin assembly 3 and a heat-absorbing heat-conducting copper pipe 4; the radiating fin component 3 is formed by stacking a plurality of aluminum or copper sheets in parallel, two ends of the metal sheets are provided with buckles which are mutually clamped together to finally form a fin radiator (also called as a fin radiator/a tooth radiator); the heat dissipation fin assembly 3 is internally provided with a mounting hole, and after the heat absorption and conduction copper pipe 4 is bent, two ends of the heat absorption and conduction copper pipe are inserted into the mounting hole of the heat dissipation fin assembly 3; the metal sheet of the radiating fin assembly 3 is punched and folded at the mounting hole part to form a connecting sleeve 31; the connecting sleeve 31 is sleeved on the pipe walls of the 2 end parts of the heat absorption and conduction copper pipe 4 and is welded and fixed together, so that not only is the fixation of all metal sheets realized, but also the contact area between the metal sheets and the heat absorption and conduction copper pipe 4 can be improved, and better heat conduction and heat dissipation are realized.
Because the heat-absorbing heat-conducting copper pipe 4 is limited by the manufacturing process, the tail end of the heat-absorbing heat-conducting copper pipe 4 has an ineffective end of 3-5mm, so that the tail end 42 of the heat-absorbing heat-conducting copper pipe 4 is preferably positioned outside the radiating fin component 3, namely, the heat-conducting effective part of the heat-absorbing heat-conducting copper pipe 4 is contacted with the radiating fin component 3, so that the heat-conducting and radiating efficiency is improved.
The middle bending part of the heat absorption and conduction copper pipe 4 extends to the area where the heating surface of the semiconductor refrigeration piece 2 is located to be used as a heat absorption end 41; the heat absorbing end 41 is preferably provided in a flat shape, and the flat surface contacts with the heat generating surface of the semiconductor refrigeration sheet 2, so that the heat of the heat generating surface of the semiconductor refrigeration sheet 2 is absorbed into the heat absorbing and conducting copper pipe 4 and then transferred to the heat dissipating fin assembly 3.
Due to the limitation of the diameter of the heat-absorbing and heat-conducting copper pipe 4, after the heat-absorbing end 41 is arranged in a flat shape, the size of the flat surface is limited, and the heat-generating surface of the semiconductor refrigeration piece 2 may not be completely covered; meanwhile, in order to keep the heat absorbing end 41 of the heat absorbing and conducting copper pipe 4 attached to the heat generating surface of the semiconductor refrigeration piece 2, the heat absorbing end 41 needs to be fixed in the area of the semiconductor refrigeration piece 2 through a fixing device.
Therefore, as a further improvement of the present utility model, the heat absorbing end 41 is provided with a heat absorbing copper plate 5, and the effective heat absorbing surface of the heat absorbing copper plate 5 is larger than the heat generating surface of the semiconductor refrigeration piece 2, that is, the heat absorbing copper plate 5 can fully cover the heat generating surface of the semiconductor refrigeration piece 2. The part of the heat absorption copper plate 5 covering the heating surface of the semiconductor refrigeration piece 2 extends outwards to form an installation body; particularly, along the length direction of the heat absorbing copper plate 5, the heat absorbing copper plate extends to two sides to form a mounting body, and a mounting hole 51 is formed at the edge of the heat absorbing copper plate for fixed mounting; the mounting hole 51 is preferably a "U" shaped hole, and the mounting position can be adjusted and adapted according to the dimensional deviation of the components.
The back of cold head 1 is equipped with 2 copper erection columns 13, heat absorption copper 5 passes through fastening screw 6 mounting hole 51 screw in the copper erection column 13 realizes fixing. However, since the cold head 1 is in a cold state during operation, the heat absorbing copper plate 5 is used for absorbing heat and is in a hot state, the fastening screw 6 is generally a metal piece and can conduct heat, the three parts are directly connected together, and the heat is transferred to the fastening screw 6 by the heat absorbing copper plate 5 and then transferred to the cold head 1, so that the refrigerating effect of the cold head 1 is affected. A heat insulating member is provided between the connection of the fastening screw 6 and the cold head 1 or between the connection of the fastening screw 6 and the heat absorbing copper plate 5; in the drawings of the embodiment, a heat insulation bushing 61 is provided, the heat insulation bushing 61 is made of plastic or ceramic, so as to play a role in thermal insulation, the outer wall of the heat insulation bushing 61 is embedded in the mounting hole 51 of the heat absorption copper plate 5, the fastening screw 6 passes through the inner hole of the heat insulation bushing 61, is not directly contacted with the heat absorption copper plate 5 at all, and is screwed into the copper plate mounting post 13 of the cold head 1, so that the heat absorption copper plate 5 is fixed on the cold head 1, the heat absorption copper plate 5 is fully attached to the heat generating surface of the semiconductor refrigeration piece 2, and heat exchange between the cold head 1 and the heat absorption copper plate 5 can be prevented.
Preferably, heat conduction silicone grease is smeared between the heat absorption copper plate 5 and the heating surface of the semiconductor refrigeration piece 2, or a heat conduction silicon wafer is filled in the heat absorption copper plate to increase the contact area and improve the heat conduction efficiency.
The heat generated by the heat generating surface of the semiconductor refrigeration piece 2 is absorbed by the heat absorbing copper plate 5 and then transferred to the heat absorbing end 41 of the heat absorbing heat conducting copper pipe 4, then transferred to the radiating fin assembly 3 through the main body of the heat absorbing heat conducting copper pipe 4, and finally the heat is dissipated into the air in the area through the metal sheet of the radiating fin assembly 3.
In order to improve the heat dissipation efficiency of the heat dissipation fin assembly 3, a heat dissipation fan 7 is further arranged; the number of the cooling fans 7 is 1 as shown in the figure, and the cooling fans are positioned on the air flow passage of the cooling fin assembly 3; of course, 2 heat dissipating fans 7 may be provided, which are respectively located at two sides of the air flow passage of the heat dissipating fin assembly 3. When the cooling fan 7 is arranged, the air outlet surface of the cooling fan is opposite to the cooling fin assembly 3, the cooling fan 7 is positioned at an air inlet of the handheld beauty instrument, cold air outside the handheld beauty instrument is sucked, and then the cold air is blown across the surface of the metal sheet of the cooling fin assembly 3 to take away heat; of course, when the cooling fan 7 is disposed, the air inlet surface of the cooling fan may be opposite to the cooling fin assembly 3, and the cooling fan 7 is located at the air outlet of the handheld cosmetic instrument, so that negative pressure is formed inside the handheld cosmetic instrument, especially near the cooling fin assembly 3, and at this time, cold air outside the handheld cosmetic instrument enters the interior through the air inlet or the shell gap, particularly flows through the surface of the metal sheet of the cooling fin assembly 3, and takes heat away and directly discharges the heat outside the handheld cosmetic instrument through the air outlet.
The heat dissipation fin assembly 3 is formed by laminating metal sheets, the metal sheets are arranged at intervals, an air flow channel is formed between the metal sheets, the heat dissipation fin assembly and the heat dissipation fan 7 are combined to accelerate air circulation in the area, and heat can be rapidly dissipated, so that the metal sheets of the heat dissipation fin assembly 3 maintain a relatively low temperature state, and the heat can be efficiently transferred to the heat dissipation fin assembly 3 through the heat absorption heat conduction copper pipe 4 for heat dissipation.
According to the cold head device for the handheld cosmetic instrument, the mounting position of the semiconductor refrigerating piece 2 of the cold head 1 in the handheld cosmetic instrument is adjusted, so that direct contact refrigeration and cold conduction are realized, the refrigeration effect of the cold head 1 is improved, and the cold compress effect of the handheld cosmetic instrument is further improved; the heat radiation system composed of the heat radiation fin assembly 3, the heat absorption heat conduction copper pipe 4, the heat absorption copper plate 5 and the heat radiation fan 7 is specially arranged for the heat radiation surface of the semiconductor refrigerating sheet 2 to efficiently absorb heat, conduct heat and radiate heat, so that the semiconductor refrigerating sheet 2 is maintained in an efficient working state, and cold energy is continuously output to the cold head 1.
While the preferred embodiments of the present utility model have been illustrated and described, the present utility model is not limited to the embodiments described above, and various equivalent modifications and substitutions can be made by those skilled in the art without departing from the spirit of the present utility model, and these are intended to be included in the scope of the present utility model as defined in the appended claims.
Claims (10)
1. The cold head device for the handheld cosmetic instrument is characterized by comprising a cold head, a semiconductor refrigerating sheet, a radiating fin assembly and a heat absorption and conduction copper pipe;
the cold head is a metal head and is fixed at the working end of the handheld cosmetic instrument to serve as a working head;
the back of the cold head is provided with an installation part, and the refrigerating surface of the semiconductor refrigerating sheet is attached to the installation part on the back of the cold head;
the radiating fin component is formed by stacking a plurality of metal sheets in parallel; the heat-absorbing heat-conducting copper pipe is bent, and two ends of the heat-absorbing heat-conducting copper pipe are inserted into the mounting holes of the heat-dissipating fin assembly;
the metal sheet of the radiating fin assembly forms a connecting sleeve at the mounting hole part; the connecting sleeve is sleeved on 2 end pipes of the heat absorption and conduction copper pipe and is welded and fixed together;
the middle bending part of the heat absorption and conduction copper pipe extends to the area where the heating surface of the semiconductor refrigeration piece is positioned to be used as a heat absorption end; and the heat absorption end is contacted with the heat-generating surface of the semiconductor refrigeration sheet to absorb heat.
2. The cold head device for a hand-held beauty instrument according to claim 1, wherein the mounting portion of the back surface of the cold head is a groove, and the refrigerating surface of the semiconductor refrigerating sheet is fitted in the groove of the mounting portion.
3. The cold head device for a hand-held beauty instrument according to claim 1, wherein a cold guide member is provided between the cold face of the semiconductor refrigeration sheet and the cold head;
the cold-conducting component is a cold-conducting silicon wafer or cold-conducting silicone grease.
4. The cold head device for a hand-held beauty instrument according to claim 1, wherein the heat absorbing end of the heat absorbing and conducting copper pipe is provided in a flat shape, and the flat surface is contacted with the heat generating surface of the semiconductor refrigerating sheet to absorb heat.
5. The cold head device for a handheld beauty instrument according to claim 4, wherein the heat absorbing end is provided with a heat absorbing copper plate, the effective size of the heat absorbing copper plate is larger than the size of the heat generating surface of the semiconductor refrigerating plate, and the heat absorbing copper plate completely covers the heat generating surface of the semiconductor refrigerating plate.
6. The cold head device for the handheld beauty instrument according to claim 5, wherein the edge of the heat absorbing copper plate extends outwards, a mounting body is formed at a position exceeding the heating surface of the semiconductor refrigerating sheet, and a mounting hole is formed in the mounting body;
the back of the cold head is provided with a copper plate mounting column;
the fastening screw passes through the mounting hole at the edge of the heat absorption copper plate and is screwed into the copper plate mounting column at the back of the cold head, so that the heat absorption copper plate is pressed against the semiconductor refrigerating sheet to be fixed at the back of the cold head.
7. The coldhead assembly for a handheld cosmetic instrument of claim 6, wherein the mounting aperture is a U-shaped adjustable mounting aperture.
8. The cold head device for a hand-held beauty instrument according to claim 6, wherein a heat insulating member is provided between the fastening screw and the connecting portion of the cold head or between the fastening screw and the connecting portion of the heat absorbing copper plate.
9. The coldhead assembly for a handheld cosmetic instrument of claim 8, wherein the insulation is an insulation sleeve;
the outer wall of the heat insulation lining is embedded in the mounting hole of the heat absorption copper plate;
the fastening screw penetrates through the heat insulation bushing, and the fastening screw is not in contact with the heat absorption copper plate at all;
the fastening screw is screwed into the copper plate mounting column on the back of the cold head.
10. The cold head device for a hand-held beauty instrument according to claim 1, wherein a heat radiation fan is provided at the heat radiation fin assembly;
the number of the radiating fans is 1 or 2;
the heat radiation fan is positioned on the air flow passage of the heat radiation fin assembly;
the radiating fan is positioned in an air inlet hole or an air outlet hole of the handheld beauty instrument.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223314857.XU CN219207631U (en) | 2022-12-09 | 2022-12-09 | Cold head device for handheld cosmetic instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223314857.XU CN219207631U (en) | 2022-12-09 | 2022-12-09 | Cold head device for handheld cosmetic instrument |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219207631U true CN219207631U (en) | 2023-06-20 |
Family
ID=86758893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223314857.XU Active CN219207631U (en) | 2022-12-09 | 2022-12-09 | Cold head device for handheld cosmetic instrument |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219207631U (en) |
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2022
- 2022-12-09 CN CN202223314857.XU patent/CN219207631U/en active Active
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