TW200943443A - Tin processing method for surfaces of copper pads of wafer - Google Patents

Tin processing method for surfaces of copper pads of wafer

Info

Publication number
TW200943443A
TW200943443A TW097112404A TW97112404A TW200943443A TW 200943443 A TW200943443 A TW 200943443A TW 097112404 A TW097112404 A TW 097112404A TW 97112404 A TW97112404 A TW 97112404A TW 200943443 A TW200943443 A TW 200943443A
Authority
TW
Taiwan
Prior art keywords
copper pads
metal film
wafer
processing method
tin
Prior art date
Application number
TW097112404A
Other languages
Chinese (zh)
Other versions
TWI353030B (en
Inventor
Wei-Hua Lu
Original Assignee
Wei-Hua Lu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wei-Hua Lu filed Critical Wei-Hua Lu
Priority to TW097112404A priority Critical patent/TWI353030B/en
Publication of TW200943443A publication Critical patent/TW200943443A/en
Application granted granted Critical
Publication of TWI353030B publication Critical patent/TWI353030B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

A tin processing method for surfaces of copper pads of a wafer includes steps of: providing a wafer having copper pads on a surface thereof; forming a metal film on the surface of the wafer to electrically connect all of the copper pads and to expose partial surfaces of each of the copper pads; forming a photo-resist layer on the metal film, and patterning the photo-resist layer to form openings for exposing the metal film on the copper pads; processing the partial surfaces of the copper pads exposed out of the metal film by immersion plating, so as to replace the partial surfaces of the copper pads by a tin layer, until the tin layer is deposited over the metal film; removing the photo-resist layer; and removing the remaining metal film uncovered by the tin layer.
TW097112404A 2008-04-03 2008-04-03 Tin processing method for surfaces of copper pads TWI353030B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097112404A TWI353030B (en) 2008-04-03 2008-04-03 Tin processing method for surfaces of copper pads

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097112404A TWI353030B (en) 2008-04-03 2008-04-03 Tin processing method for surfaces of copper pads

Publications (2)

Publication Number Publication Date
TW200943443A true TW200943443A (en) 2009-10-16
TWI353030B TWI353030B (en) 2011-11-21

Family

ID=44869013

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097112404A TWI353030B (en) 2008-04-03 2008-04-03 Tin processing method for surfaces of copper pads

Country Status (1)

Country Link
TW (1) TWI353030B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117393523A (en) * 2023-12-07 2024-01-12 浙江集迈科微电子有限公司 Multilayer wiring adapter plate for mounting and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117393523A (en) * 2023-12-07 2024-01-12 浙江集迈科微电子有限公司 Multilayer wiring adapter plate for mounting and preparation method thereof
CN117393523B (en) * 2023-12-07 2024-03-08 浙江集迈科微电子有限公司 Multilayer wiring adapter plate for mounting and preparation method thereof

Also Published As

Publication number Publication date
TWI353030B (en) 2011-11-21

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