TW200942473A - Movable table, and processing stage including the same - Google Patents
Movable table, and processing stage including the sameInfo
- Publication number
- TW200942473A TW200942473A TW097143543A TW97143543A TW200942473A TW 200942473 A TW200942473 A TW 200942473A TW 097143543 A TW097143543 A TW 097143543A TW 97143543 A TW97143543 A TW 97143543A TW 200942473 A TW200942473 A TW 200942473A
- Authority
- TW
- Taiwan
- Prior art keywords
- movable table
- same
- processing stage
- stage including
- processing
- Prior art date
Links
- 239000007769 metal material Substances 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q1/00—Members which are comprised in the general build-up of a form of machine, particularly relatively large fixed members
- B23Q1/25—Movable or adjustable work or tool supports
- B23Q1/44—Movable or adjustable work or tool supports using particular mechanisms
- B23Q1/56—Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only, the sliding pairs being the first two elements of the mechanism
- B23Q1/58—Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only, the sliding pairs being the first two elements of the mechanism a single sliding pair
- B23Q1/585—Movable or adjustable work or tool supports using particular mechanisms with sliding pairs only, the sliding pairs being the first two elements of the mechanism a single sliding pair perpendicular to the working surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T483/00—Tool changing
- Y10T483/10—Process
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007294402 | 2007-11-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200942473A true TW200942473A (en) | 2009-10-16 |
TWI392631B TWI392631B (zh) | 2013-04-11 |
Family
ID=40638726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097143543A TWI392631B (zh) | 2007-11-13 | 2008-11-11 | 可動件及處理平台 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8485507B2 (zh) |
JP (1) | JP5039148B2 (zh) |
KR (1) | KR101226942B1 (zh) |
CN (1) | CN101815659B (zh) |
TW (1) | TWI392631B (zh) |
WO (1) | WO2009063877A1 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012219332B4 (de) * | 2012-10-23 | 2014-11-13 | Mdi Schott Advanced Processing Gmbh | Vorrichtung und Verfahren zum Lagern und Fixieren einer Glasscheibe |
NL2013835A (en) | 2014-01-20 | 2015-07-21 | Asml Netherlands Bv | Substrate holder, support table for a lithographic apparatus, lithographic apparatus and device manufacturing method. |
US10381256B2 (en) * | 2015-03-12 | 2019-08-13 | Kla-Tencor Corporation | Apparatus and method for chucking warped wafers |
CN115284718A (zh) * | 2015-04-09 | 2022-11-04 | 信越工程株式会社 | 贴合设备的制造装置 |
CN105750934A (zh) * | 2016-05-04 | 2016-07-13 | 深圳市创世纪机械有限公司 | 数控机床的工作台和数控机床 |
CN107378520B (zh) * | 2017-09-05 | 2023-11-10 | 洛阳霍鑫机电科技有限公司 | 一种不锈钢焊接式组合平台 |
CN109227154A (zh) * | 2018-10-11 | 2019-01-18 | 佛山市南海区精鹰机械有限公司 | 一种组合式工作台 |
USD959279S1 (en) | 2020-04-07 | 2022-08-02 | VB Brands LLC | Spray bottle |
AT523640B1 (de) * | 2020-04-27 | 2021-10-15 | B & R Ind Automation Gmbh | Stützstruktur für einen Planarmotor |
CN114249109A (zh) * | 2020-09-22 | 2022-03-29 | 川奇光电科技(扬州)有限公司 | 显示基板的自动装片装置 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5645021A (en) * | 1979-09-19 | 1981-04-24 | Hitachi Ltd | Moving apparatus |
JPS6014824U (ja) * | 1983-07-07 | 1985-01-31 | 株式会社 牧野フライス製作所 | 耐摩耗、耐蝕性の非金属表面を有したテ−ブル |
JPS6014824A (ja) | 1983-07-08 | 1985-01-25 | 松下電器産業株式会社 | 炊飯器用表示装置 |
US4761876A (en) * | 1986-04-18 | 1988-08-09 | Dynamotion Corporation | High speed precision drilling system |
JPH07311375A (ja) | 1994-05-17 | 1995-11-28 | Ishikawajima Harima Heavy Ind Co Ltd | 液晶ディスプレイ基板検査装置の検査ステージ |
JP4244555B2 (ja) | 2002-02-25 | 2009-03-25 | 東京エレクトロン株式会社 | 被処理体の支持機構 |
JP2004172319A (ja) | 2002-11-19 | 2004-06-17 | Seiko Epson Corp | ワーク搬送テーブル、ワーク搬送装置、液滴吐出装置、電気光学装置、電気光学装置の製造方法および電子機器 |
CN2638911Y (zh) * | 2003-04-07 | 2004-09-08 | 帝马数字机器(深圳)有限公司 | 花岗石精密数控机床 |
JP2005114882A (ja) | 2003-10-06 | 2005-04-28 | Hitachi High-Tech Electronics Engineering Co Ltd | 処理ステージの基板載置方法、基板露光ステージおよび基板露光装置 |
JP4170201B2 (ja) * | 2003-12-01 | 2008-10-22 | 日立ビアメカニクス株式会社 | 基板加工装置 |
-
2008
- 2008-11-11 TW TW097143543A patent/TWI392631B/zh not_active IP Right Cessation
- 2008-11-11 JP JP2009541140A patent/JP5039148B2/ja not_active Expired - Fee Related
- 2008-11-11 KR KR1020107009655A patent/KR101226942B1/ko active IP Right Grant
- 2008-11-11 WO PCT/JP2008/070524 patent/WO2009063877A1/ja active Application Filing
- 2008-11-11 CN CN2008801099623A patent/CN101815659B/zh not_active Expired - Fee Related
- 2008-11-11 US US12/742,177 patent/US8485507B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
WO2009063877A1 (ja) | 2009-05-22 |
TWI392631B (zh) | 2013-04-11 |
KR101226942B1 (ko) | 2013-01-28 |
CN101815659A (zh) | 2010-08-25 |
CN101815659B (zh) | 2012-09-26 |
JPWO2009063877A1 (ja) | 2011-03-31 |
KR20100069702A (ko) | 2010-06-24 |
US20100276858A1 (en) | 2010-11-04 |
JP5039148B2 (ja) | 2012-10-03 |
US8485507B2 (en) | 2013-07-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |