200940189 九、發明說明： 【發明所屬之技術領域】 本發明是有關於-種基板塗朦方法與設備及其系統， 且特別疋有關於塗膠於基板之周圍端面的基板塗膠方法與 設備及其系統。 【先前技術】 隨著科技的進步，自動化塗膠（或點膠)機已廣泛地應用 參 ☆光電或半導體產業中，例如用以進行封裝或接合步驟。 以液晶顯示器（Liquid Crystal Display ; lcd)的玻璃薄化製 程來舉例說曰月，液晶顯示器具有高晝質、體積小、重量輕、 低驅動電壓、與低消耗功率等優點，因此被廣泛應用於各 種消費性通訊或電子產品中。一般液晶顯示器之主體為液 晶單元，主要是由兩片玻璃基板以及被封於基板之間的液 晶所構成。 在人們追求輕、薄、短、小的訴求下，液晶顯示器的 Ο 玻璃基板的厚度亦需減少，以達到輕薄化之目的。目前已 發展出對液晶顯示面板進行後續加工，以..減少玻璃基板的 厚度。一般玻璃薄化製程可利用切削、研磨或蝕刻等方式 來進行，當利用化學蝕刻方式來進行薄化製程時，需對玻 璃基板的周圍端面進行塗膠封裝，以避免在薄化過程中， 蝕刻液滲入基板中，而造成液晶顯示面板中之元件的損壞。 一般基板端面的塗膠方式係藉由人工來進行，玻璃基 板係平坦地放置，再由人工來塗膠於破璃基板的周圍端 面。然而，若多片基板平置堆疊後再進行塗膠，其塗膠量 5 200940189 不易控制，且基板端面之膠料可能因重力而向下流動，導 致膠料滲漏於基板與基板之間。因此，傳統之基板塗膠方 式不易同時對多片基板進行塗膠，亦不易實現自動化塗 膠’因而效率不佳。 【發明内容】 因此本發明之一方面係在於提供一種基板塗膠方法， 藉以直立式地進行基板塗膠，因而容易控制封膠材料之用 ® 量和塗佈過程，且同時塗膠多片基板，提高工作效率。 本發明之又一方面係在於提供一種基板塗膠設備及其 系統’藉以進行自動化地塗膠，節省人力和時間。 根據本發明之實施例，本發明之基板塗膠設備樣角以 塗佈一封膠材料於至少一基板之第一端面上，其中基板坪 直立地設置，第一端面係位於基板之頂部。基板塗膠設‘ 至少包含有塗膠頭、傳輸裝置及夾持裝置。傳輸裝置係用 以傳輸基板，並定位基板對應於塗膠頭。夾持裝置設置於 © 傳輸裝置上，用以夾持固定基板，其中基板係直i地破夾 持裝置所夾持。 又’根據本發明之實施例，本發明之基板塗膠系統至 少包含有基板塗膠設備、基板搬運裝置及封膠齒化襄置j, 基板塗膠設備係用以塗佈一封膠材料於至少一基板之第一 端面上，其中基板係直立地設置，第一端面係位於基板乏 頂部。基板塗膠設備至少包含有塗膠頭、傳輸裝置及炎持 裝置。傳輸裝置係用以傳輸基板，並定位基板對應於塗膠 頭。夾持裝置設置於傳輸裝置上，用以夾持固定基破，莫 200940189 中基板係直立地被夾持裝置所夾持。基板搬運裝置係用以 搬運基板，封膠固化裝置係用以固化封膠材料。 又，根據本發明之實施例，本發明之基板塗膠方法至 少包含：提供至少一基板，其中基板係直立地設置，且基 板之第一端面係位於基板之頂部；塗佈一封膠材料於基板 之第一端面上；在第一端面上之封膠材料固化後，轉動基 板，藉以使基板之一第二端面位於基板之頂部；以及塗佈 封膠材料於基板之第二端面上。 因此，本發明之基板塗膠方法與設備及其系統可進行 自動化地塗膠製程，且可同時塗膠多片基板，因而提高工 作效率，並節省人力和時間。 【實施方式】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，本說明書將特舉出一系列實施例東加苡說 明。但值得注意的是，此些實施例只是用以嬈明本發明之 〇 實施方式’而非用以限定本發明。 請參照第I圖和第2圖，第1圖係繪示依照本發明之 實施例之基板塗膠設備的正面示意圖，第2圖係繪示依照 本發明之實施例之基板承置於載具内的俯視示意圖d本實 施例之基板塗膠方法可應用於基板薄化製程中，用以封裝 至少一基板100之周圍端面，藉以進行後續薄化製程，例 如可應用於液晶顯示器（Liquid Crystal Display ; LCD)的基 板薄化製程中’藉以利用例如化學蝕刻方式來薄化液晶顯 示面板（Panel)之基板厚度，而基板10〇的塗膠封裝步驟可 200940189 避免在薄化過程中傷害到液晶顯示面板中之元件的損壞。 本實施例之基板塗耀·方法·可配合一基板塗膠設備 200及其 系統，藉以進行自動化基板塗膠，而提升工作效率。在本 實施例中，複數片基板100可預先承載於一載具1〇1内， 例如如卡匣（Cassette)、塑膠盒（ρρ Β〇χ)或搬運箱（Hard Case)，以同時承裝多片基板1〇〇於載具1〇1内來進行塗 膠，並可方便搬運。此時，在栽具1〇1内的每二相鄰此些 基板100之間具有-間距’並至少外露出基板100的第一 Φ 端面U〇，以進打塗膠，其中第—端面110係位於基板100 的頂部。本實施例之基& 100可單片6裁切後之液晶顯示 面板，亦可為具有複數個液晶顯示單元之基板，藉以在薄 化製程後切割成複數個液晶顯示面板。 請參照第3圖，其繪不依照本發明之實施例之基板搬 運裝置與封膠固化裝置的側面示意圖。纟實_之基板塗 膠系統可包含基板塗膠設備2〇〇、基板搬運裝置3〇〇及封移 固化裝置400。基板塗膠設備2〇〇係用以對基板ι〇〇進行塗 ❹ 膠，基板搬運裝置300例如為人工搬運車（Manual Guided200940189 IX. Description of the Invention: [Technical Field] The present invention relates to a substrate coating method and apparatus and system thereof, and particularly to a substrate coating method and apparatus for coating a peripheral end surface of a substrate and Its system. [Prior Art] With advances in technology, automated glue (or dispensing) machines have been widely used in the photovoltaic or semiconductor industry, for example, for packaging or bonding steps. In the liquid crystal display process of liquid crystal display (LCD), for example, the liquid crystal display has the advantages of high quality, small size, light weight, low driving voltage, low power consumption, etc., and thus is widely used. In a variety of consumer communications or electronic products. Generally, the main body of the liquid crystal display is a liquid crystal unit, which is mainly composed of two glass substrates and liquid crystals sealed between the substrates. Under the pursuit of light, thin, short and small, the thickness of the Ο glass substrate of the liquid crystal display needs to be reduced to achieve the purpose of thinning and thinning. Subsequent processing of the liquid crystal display panel has been developed to reduce the thickness of the glass substrate. Generally, the glass thinning process can be performed by cutting, grinding or etching. When the chemical etching method is used for the thinning process, the peripheral end surface of the glass substrate needs to be glue-coated to avoid etching during the thinning process. The liquid penetrates into the substrate, causing damage to components in the liquid crystal display panel. Generally, the coating method of the end face of the substrate is carried out manually, the glass substrate is placed flat, and the glue is applied to the peripheral end of the glass substrate by hand. However, if multiple substrates are stacked and then coated, the amount of glue applied is not easy to control, and the rubber on the end face of the substrate may flow downward due to gravity, causing the rubber to leak between the substrate and the substrate. Therefore, the conventional substrate coating method is not easy to apply a plurality of substrates at the same time, and it is also difficult to achieve automatic coating, which is inefficient. SUMMARY OF THE INVENTION Accordingly, it is an aspect of the present invention to provide a substrate coating method for performing substrate coating in an upright manner, thereby easily controlling the amount of the sealing material and the coating process, and simultaneously coating a plurality of substrates. ,Improve work efficiency. Yet another aspect of the present invention is to provide a substrate coating apparatus and system thereof for automated coating, saving manpower and time. According to an embodiment of the present invention, the substrate coating apparatus of the present invention is coated with a glue material on a first end surface of at least one of the substrates, wherein the substrate is placed upright, and the first end surface is located at the top of the substrate. The substrate coating ‘ contains at least a glue head, a transfer device and a clamping device. The transport device is used to transport the substrate and the positioning substrate corresponds to the glue applicator head. The clamping device is disposed on the © transmission device for clamping the fixed substrate, wherein the substrate is directly clamped by the clamping device. In addition, according to an embodiment of the present invention, the substrate coating system of the present invention comprises at least a substrate coating device, a substrate handling device and a sealing toothing device, wherein the substrate coating device is used for coating a rubber material. The first end surface of the at least one substrate, wherein the substrate is disposed upright, and the first end surface is located at the top of the substrate. The substrate coating device comprises at least a glue applicator, a transfer device and an illuminating device. The transport device is used to transport the substrate and the positioning substrate corresponds to the glue applicator head. The clamping device is disposed on the transmission device for clamping the fixed base, and the substrate in the 200940189 is vertically clamped by the clamping device. The substrate transfer device is used to transport the substrate, and the seal curing device is used to cure the sealant. Moreover, according to an embodiment of the present invention, the substrate coating method of the present invention comprises at least providing at least one substrate, wherein the substrate is disposed upright, and the first end surface of the substrate is located at the top of the substrate; On the first end surface of the substrate; after the sealing material on the first end surface is cured, the substrate is rotated, so that a second end surface of the substrate is located at the top of the substrate; and the sealing material is coated on the second end surface of the substrate. Therefore, the substrate coating method and apparatus of the present invention and the system thereof can be automatedly coated, and a plurality of substrates can be simultaneously coated, thereby improving work efficiency and saving manpower and time. [Embodiment] The above and other objects, features, advantages and embodiments of the present invention will become more apparent and understood. However, it is to be understood that the embodiments are merely illustrative of the invention and are not intended to limit the invention. Referring to FIG. 1 and FIG. 2, FIG. 1 is a front view showing a substrate coating apparatus according to an embodiment of the present invention, and FIG. 2 is a substrate mounting apparatus according to an embodiment of the present invention. The substrate coating method of the present embodiment can be applied to a substrate thinning process for packaging at least one peripheral end surface of the substrate 100 for subsequent thinning process, for example, for liquid crystal display (Liquid Crystal Display) ; LCD) in the substrate thinning process 'by using, for example, chemical etching to thin the substrate thickness of the liquid crystal display panel (Panel), and the substrate 10 〇 plastic packaging step can be 200940189 to avoid damage to the liquid crystal display during thinning Damage to components in the panel. The substrate coating method of the embodiment can be combined with a substrate coating device 200 and a system thereof for automated substrate coating to improve work efficiency. In this embodiment, the plurality of substrates 100 can be pre-loaded in a carrier 1〇1, such as a Cassette, a plastic box, or a Hard Case, for simultaneous loading. The multi-piece substrate 1 is coated in the carrier 1〇1 for coating, and is easy to handle. At this time, the first Φ end face 〇 of the substrate 100 is exposed between each of the adjacent substrates 100 in the device 1〇1 and at least the first Φ end face U〇 of the substrate 100 is exposed to be glued, wherein the first end face 110 It is located at the top of the substrate 100. The base & 100 of the present embodiment can be a single-piece 6-cut liquid crystal display panel, or can be a substrate having a plurality of liquid crystal display units, thereby cutting into a plurality of liquid crystal display panels after the thinning process. Referring to Figure 3, there is shown a schematic side view of a substrate transporting device and a sealant curing device in accordance with an embodiment of the present invention. The substrate coating system may include a substrate coating device 2, a substrate carrying device 3, and a sealing and curing device 400. The substrate coating device 2 is used to coat the substrate ι, and the substrate handling device 300 is, for example, a manual truck (Manual Guided)
Vehicle，MGV)、基板搬運機械人、自動導引載具（Aijt〇matic Guided Vehicle ; AGV)或輸送帶’用以搬運基板1〇〇或搬運 裝有多片基板1〇〇之載具101。封膠固化裝置400例如為曝 光機’用以固化塗佈於基板100上之封膠材料，此封膠材 料可為熱硬化膠或光硬化膠，例如為紫外光硬化膠、雷射 光硬化膠或紅外線硬化膠，亦可為可見光硬化膠（Visible Light Curing Glue)。 請參照第4圖至第6圖，第4圖和第5圖係繪示依照 200940189 本發明之實施例之基板塗膠設備的側面不意圖，第6圖係 繪示依照本發明之實施例之塗膠頭和基板的俯視示意圖。 本實施例之基板塗膠設備200係用以塗佈封膠材料於基板 100之位於頂部的端面上，其中基板100係直立地來進行塗 膠。基板塗膠設備200可包含有塗膠頭210、傳輸裝置220、 夾持裝置230、搬運定位機構240及升降裝置250。塗膠頭 210、傳輸裝置220及升降裝置250可裝設於一座體（未繪 示）上，然不限於此，上述裝置亦可裝設於一罩體（未繪示） φ 内或一框體（未繪示）上。塗膠頭210係設置於基板100之第 一端面110的上方，且位於傳輸裝置220和夾持裝置230 之上方，以塗佈封膠材料於基板100的第一端面110的上ί:， 其中第一端面110係位於基板100之頂部。塗膠頭210可 設有多軸傳動機構211和感應器（未繪示），多轴傳動機森 211例如為滚珠螺桿、滑軌或直線軸承，用以定位塗膠南 210於基板100來進行塗膠動作，並可在塗膠完成後退回塗 膠頭210。當塗膠頭210定位於基板100時，塗膠頭210 Q 之感應器（例如光學感應器）可感應塗膠頭210是否精確走 位於基板100。在本實施例中，塗膠頭210更可設有複數i 注膠閥212，其對應於承載於載具101内妁此些基板100 [， 藉以同時對多片基板100進行塗膠。 ' 本實施例之傳輸裝置220係用以傳輸基板100,並定位 基板100對應於塗膠頭210，以進行塗膠。在塗膠頭2ί〇 完成塗膠後，傳輸裝置220可退回基板100至基板搬運裝 置300,以搬運至封膠固化裝置400來固化封膠材料。傳輸 裝置220可例如為傳動機構（滾珠螺桿、滑軌或軸承)與伺腋 200940189 馬達之組合，亦可為壓電驅動平台等其他傳輸裝置。夾持 裝置230係設置於傳輸裝置220上，並可隨著傳輸裝置220 移動，用以夾持固定基板100,以避免在基板1〇〇傳輸或定 位的過程中晃動或翻覆，其中基板100係直立地被夾持裝 置230所夾持，而呈直立狀態，藉以允許塗膠頭210塗佈 封膠材料於基板100之第一端面110上。在本實施例中， 多片基板100可預先直立地承置於載具101内，再由處持 裝置230夾持固定載具101，因而多片基板100可同時直立 地來進行塗膠。值得注意的是，在本實施例中，夾持裝置 230係夾持於基板100(或載具101)的底部，然不限於此， 夾持裝置230亦可夾持於基板100的任何位置，藉以使墓 板100被直立式地夾持。 本實施例之搬運定位機構240係設置於傳輸裝董2加 之一側，以定位基板搬運裝置300。升降裝置2如係設董於 傳輸裝置220之一側，且位於傳輸裝置220和搬連定位機 構240之間，用以升降基板100(或載具101”藉以供傳輸 裝置220或搬運定位機構240進行動作，因而可自動地袭 卸基板100，避免人力搬運基板100之風險」 請參照第7圖，其繪示依照本發明之實施例之基板查 膠方法的方法流程圖。當進行本實施例之基板塗膠方法 時，首先，提供基板100(步驟501)。在本實施例中，複政 片基板100較佳可預先承置於載具101内，並藉由基板搬 運裝置300和傳輸裝置220來傳輸定位於塗膠頭210。此 時，基板100係藉由夾持裝置230所夾持固定，而呈直立 狀態，並外露出基板100的第一端面110。接薯，塗膠_ 200940189 210可塗佈封膠材料於基板100的第一端面110上（步驟 502)，此時，由於第一端面110係呈水平狀態，因而較易 控制封膠材料之用量。在本實施例中，承置於載具101内 的多片基板100可同時藉由塗膠頭210來進行塗膠，以提 升工作效率。此時，由於基板100係直立狀態，因而塗佈 於第一端面110上之封膠材料受到重力作用而容易滲入基 板100中，而完全地密封住基板100的第一端面110。接著， 在基板100之第一端面110塗佈有封膠材料後，基板100 可藉由傳輸裝置220和基板搬運裝置300來輸送至封膠固 化裝置400中，而進行封膠固化。接著，在第一端面110 上之封膠材料固化後，轉動基板100(或載具101)—角度（步 驟503)，例如轉動90度，藉以使基板100的第二端面120 位於基板100的頂部，因而塗膠頭210可對應第二端面120 來進行塗膠，其中基板搬運裝置300可設有基板轉動機構 或裝置（未繪示）來轉動基板100，然不限於此，亦可直族藉 由人力來轉動基板100。接著，塗膠頭210可塗佈封膠材料Vehicle, MGV), substrate transport robot, automatic guide vehicle (AGV) or conveyor belt' is used to transport the substrate 1 or transport the carrier 101 with a plurality of substrates. The seal curing device 400 is, for example, an exposure machine for curing the sealing material coated on the substrate 100. The sealing material may be a heat curing glue or a light curing glue, such as an ultraviolet curing glue, a laser curing glue or Infrared hardening glue, also known as Visible Light Curing Glue. Please refer to FIG. 4 to FIG. 6 . FIG. 4 and FIG. 5 are schematic side views of a substrate coating apparatus according to an embodiment of the present invention according to 200940189, and FIG. 6 is a view showing an embodiment of the present invention. A schematic view of the rubberized head and the substrate. The substrate coating apparatus 200 of the present embodiment is used for coating a sealing material on the top end surface of the substrate 100, wherein the substrate 100 is applied upright. The substrate coating apparatus 200 may include a coating head 210, a conveying device 220, a clamping device 230, a handling positioning mechanism 240, and a lifting device 250. The glue head 210, the transport device 220, and the lifting device 250 can be installed on a body (not shown). However, the device can be installed in a cover (not shown) φ or a frame. On the body (not shown). The glue head 210 is disposed above the first end surface 110 of the substrate 100 and above the transport device 220 and the clamping device 230 to coat the sealant material on the first end surface 110 of the substrate 100, wherein The first end face 110 is located at the top of the substrate 100. The rubberizing head 210 can be provided with a multi-axis transmission mechanism 211 and an inductor (not shown). The multi-axis transmission machine 211 is, for example, a ball screw, a sliding rail or a linear bearing for positioning the rubber coating South 210 on the substrate 100 for coating. The glue action and can be returned to the glue head 210 after the glue is applied. When the glue head 210 is positioned on the substrate 100, the sensor (e.g., optical sensor) of the glue head 210 Q can sense whether the glue head 210 is accurately positioned on the substrate 100. In this embodiment, the glue head 210 may further be provided with a plurality of glue injection valves 212 corresponding to the substrates 100 carried in the carrier 101, thereby simultaneously coating the plurality of substrates 100. The transmission device 220 of the present embodiment is for transporting the substrate 100, and the positioning substrate 100 corresponds to the glue coating head 210 for applying the glue. After the glue application is completed, the transfer device 220 can be returned to the substrate 100 to the substrate transfer device 300 for transport to the seal curing device 400 to cure the sealant. The transmission device 220 can be, for example, a combination of a transmission mechanism (ball screw, slide rail or bearing) and a servo motor of the 200940189, or other transmission device such as a piezoelectric drive platform. The clamping device 230 is disposed on the transmission device 220 and can be moved along with the transmission device 220 for clamping and fixing the substrate 100 to avoid shaking or flipping during the transmission or positioning of the substrate 1 . It is held upright by the clamping device 230 and is in an upright state, thereby allowing the rubberizing head 210 to coat the sealing material on the first end surface 110 of the substrate 100. In the present embodiment, the multi-piece substrate 100 can be placed upright in the carrier 101 in advance, and the holding device 101 is held by the holding device 230, so that the plurality of substrates 100 can be glued upright at the same time. It should be noted that in the present embodiment, the clamping device 230 is clamped on the bottom of the substrate 100 (or the carrier 101). However, the clamping device 230 can also be clamped at any position of the substrate 100. Thereby the tomb 100 is held upright. The conveyance positioning mechanism 240 of the present embodiment is disposed on one side of the transport unit 2 to position the substrate transfer device 300. The lifting device 2 is disposed on one side of the transport device 220 and is located between the transport device 220 and the transport positioning mechanism 240 for lifting the substrate 100 (or the carrier 101) for the transport device 220 or the transport positioning mechanism 240. The operation is performed, so that the substrate 100 can be automatically removed, and the risk of the substrate 100 being manually transferred is avoided. Referring to FIG. 7 , a flow chart of a method for inspecting a substrate according to an embodiment of the present invention is shown. In the substrate coating method, first, the substrate 100 is provided (step 501). In the present embodiment, the resurfacing substrate 100 is preferably pre-loaded in the carrier 101, and the substrate carrying device 300 and the transport device are provided. 220 is transferred and positioned on the rubberizing head 210. At this time, the substrate 100 is held in an upright state by being clamped and fixed by the clamping device 230, and the first end surface 110 of the substrate 100 is exposed. The potato is coated with glue_200940189 210 can coat the sealing material on the first end surface 110 of the substrate 100 (step 502). At this time, since the first end surface 110 is in a horizontal state, it is easier to control the amount of the sealing material. In this embodiment, Placed in the carrier 101 The multi-piece substrate 100 can be glued by the rubber coating head 210 at the same time to improve work efficiency. At this time, since the substrate 100 is in an upright state, the sealing material applied to the first end surface 110 is subjected to gravity. It is easy to penetrate into the substrate 100 to completely seal the first end surface 110 of the substrate 100. Then, after the first end surface 110 of the substrate 100 is coated with a sealing material, the substrate 100 can be transported by the transfer device 220 and the substrate carrying device 300. After being sent to the sealant curing device 400, the sealant is cured. Then, after the sealant material on the first end face 110 is cured, the substrate 100 (or the carrier 101) is rotated - the angle (step 503), for example, rotated 90. Therefore, the second end surface 120 of the substrate 100 is located at the top of the substrate 100, so that the glue head 210 can be glued corresponding to the second end surface 120, wherein the substrate carrying device 300 can be provided with a substrate rotating mechanism or device (not shown) The substrate 100 is rotated, but it is not limited thereto, and the substrate 100 can be rotated by a human being. The glue head 210 can be coated with a sealing material.
• I 於基板100之的第二端面120上（步驟504)。然後，可重複 上述步驟，以塗膠於基板100的其他端面（第三端面、第甴 端面）。在第二端面120上之封膠材料固化後、轉動基也 100(步驟505)，藉以使基板100之一第三端面位於基板100 之頂部，接著，塗佈封膠材料於基板100之第三端面上（步 驟506)，接著，在第三端面上之封膠材料固化後，轉動基 板100(步驟507)，藉以使基板100之一第四端面位於基板 100之頂部，然後，塗佈封膠材料於基板1〇〇之索甶端面上 (步驟508)。因而可塗膝於基板1〇〇的周圍端面，而可應角 11 200940189 - 於基板薄化製程中。 . 由上述本發明的實施例可知，本發明的基板塗膠方法 可進打直立式的基板塗谬，並可藉由基板塗膠設備及其系 統來自動化地塗膠，且多片基板可同時進行塗膠，因而可 提高工作效率，並節省人力和時間。 雖然本發明已以實施例揭露如上，然其並非用以限定 本發明，任何熟習此技藝者，在不脫離本發明之精神和範 圍内，當可作各種之更動與潤飾，因此本發明之保護範圍 Φ 當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下： ：丨 第1圖係繪示依照本發明之實施例之基板塗膠設備的 正面示意圖。 第2圖係繪示依照本發明之實施例之基板承置於載真 ❹ 内的俯視示意圖。 第3圖係繪示依照本發明之實施例之基板搬運裝皇與 封膝固化裝置的側面示意圖。 第4圖和第5圖係繪示依照本發明之實施例之基板塗 勝設備的側面示意圖。 第6圖係繪示依照本發明之實施例之塗膠頭和基板尚 俯視示意圖。 第7圖係繪示依照本發明之實施例之基棱塗螓方法的 方法流程圖。 12 200940189 【主要元件符號說明】 100 :基板 101 :載具 110 :第一端面 120 :第二端面 200 :基板塗膠設備 210 :塗膠頭 211 :多軸傳動機構 212 :注膠閥 220 :傳輸裝置 230 :夾持裝置 240 :搬運定位機構 250 :升降裝置• I is on the second end face 120 of the substrate 100 (step 504). Then, the above steps may be repeated to be applied to the other end faces (third end face, second end face) of the substrate 100. After the sealing material on the second end surface 120 is cured, the rotating base is also 100 (step 505), so that one third end surface of the substrate 100 is located on the top of the substrate 100, and then the sealing material is applied to the third surface of the substrate 100. On the end surface (step 506), then, after the sealing material on the third end surface is solidified, the substrate 100 is rotated (step 507), so that one of the fourth end faces of the substrate 100 is located on the top of the substrate 100, and then the sealant is coated. The material is on the end face of the substrate 1 (step 508). Therefore, the knee can be applied to the peripheral end surface of the substrate 1 ,, and the angle 11 200940189 can be applied to the substrate thinning process. According to the embodiment of the present invention, the substrate coating method of the present invention can be applied to an upright substrate, and can be automatically applied by a substrate coating device and a system thereof, and multiple substrates can be simultaneously coated. Gluing can increase work efficiency and save manpower and time. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and the present invention can be modified and retouched without departing from the spirit and scope of the present invention. Scope Φ is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; A front view of a substrate coating device. Figure 2 is a top plan view showing a substrate placed in a carrier susceptor in accordance with an embodiment of the present invention. Fig. 3 is a side elevational view showing the substrate carrying and embroidering apparatus according to an embodiment of the present invention. 4 and 5 are schematic side views showing a substrate coating apparatus in accordance with an embodiment of the present invention. Figure 6 is a top plan view showing a rubberized head and a substrate in accordance with an embodiment of the present invention. Figure 7 is a flow chart showing the method of the base edge coating method in accordance with an embodiment of the present invention. 12 200940189 [Description of main components] 100: Substrate 101: Carrier 110: First end face 120: Second end face 200: Substrate coating device 210: Glue head 211: Multi-axis transmission mechanism 212: Injection valve 220: Transmission Device 230: clamping device 240: handling positioning mechanism 250: lifting device
300 :基板搬運裝置 400 :封膠固化裝置 501 :提供基板 502:塗佈封膠材料於基板的第一端面上 503 :轉動基板 504:塗佈封膠材料於基板的第二端面上 505 :轉動基板 506:塗佈封膠材料於基板的第三端面上 507 :轉動基板 508:塗佈封膠材料於基板的第四端面上 13300: substrate transport device 400: sealant curing device 501: providing substrate 502: coating the sealant material on the first end surface of the substrate 503: rotating the substrate 504: coating the sealant material on the second end surface of the substrate 505: rotating The substrate 506: coating the sealing material on the third end surface of the substrate 507: rotating the substrate 508: coating the sealing material on the fourth end surface of the substrate 13