200934282 八、發明說明： 【發明所屬之技術領域】 本發明係關於一種具自動對焦之光感測元件封裝，特別是指一 種製造便利及輕薄短小之光感測元件封裝，可有效降低生產成本 者。 【先前技術】 請參晒-所示，為-種習知具自騎焦之光感測元件封裝 ❺ 之剖視圖’其包括有—基板1G ’其設有-上表面12、-下表面14 及形成於上表©12之凹獅，基板1Q之凹槽16_成有第一焊塾 18下表面14形成有第二焊塾20，第-焊塾18與第二焊塾20係藉 由導線22相互導通；-光_元件24設有錄個焊點驗於其四 周，係設於基板10之凹槽16内；多數條導線28係電連接光感測元 件24之焊點26至基板1〇之第一焊墊18 ;複數個電子零件3〇係設置 基板10之凹槽16内；-透光層32係黏設於基板1Q之上表面^上， 鬌 帛以將凹槽16封閉住，及-自麟焦系統34係設置於透光層32上 方藉由電連接線36連接於基板iq之第二焊墊上。。 如疋自麟焦系統34係藉由電連接線36與光感測元件封装 體之基板10連接，其製造上較為不便，且其體積相對的較大無法 達到輕薄短小之需求。 緣是，本案發明騎虹述具自動_、之光_元件封裝之缺 乃潛。研九’終於提丨一種設計合理且有效改善上述缺失之本 200934282 【發明内容】 本發明之目⑽在於提供_種具自動難之域測元件封装 構w ’其具有降低封裝尺寸之功效，以_更為實用之目的。 本發明之另—目的係在於提供—種具自動對焦之光感測元件 封裝構造，其具有製造便利之功效，α達到降低生產成本之目的。 本發明之特徵在於包括有一基板，其設有一下表面及一上表 面，該上表师成有—凹槽及位於該凹制邊之第—電極；一光感 ❹ 測元件，其錢置於該基板之上表面上，並位於該凹槽内，且電連 接至該基板；-膠體，其係塗佈於該基板之上表面上；一透光廣， 其係藉由該频黏著至該基板上，贿該基板固定住；及—自動對 焦系統’其底部設有第二電極，用以連接該基板之第一電極。 如是，將自動對焦系統直接電連於基板之上表面之第一電極 上，其製造上較為便利，且可有效降低產品之尺寸。 本發明之上述特徵及其它目的’由以下較佳實施例之詳細說 _ 明’並參考圖式俾得以更深入了解。 【實施方式】 為使貴審查員方便簡潔瞭解本發明之其他特徵内容與優點及 其所達成之功效能夠更為顯現，茲將本發明配合附圖，詳細說明如 下： 請參閱第二圖，係為本發明具自動對焦之光感測元件封裝之 剖視圖，其包括有一基板40、一光感測元件42、膠體46、透光層 48及一自動對焦系統44。其中 - 200934282 土板40 „又有一下表面5〇及_上表面％，上表面刈形成有 凹槽54及位於凹槽54頂緣之多數個第一焊塾％及第一電極 57’下表面5〇δ又有第二焊墊％ ’藉由貫通基板之連接線％連 接第-焊墊56 ;另，上表㈣之凹槽％頂緣亦設置有電子元件 51(可為主動或被動元件)電連接至第—焊塾兄。 光感測元件42係設置於基板4〇之上表面52上，並位於該凹 槽54内其上形成有感測區62及位於感測區幻周邊之焊點科。 ❹ 錄料線66係·接光_元件42之焊點64至基板40之 第一焊墊56上。 -膠體46係塗佈於基板40之上表面52上，用以將導線％與 第一焊墊56連接端覆蓋住。 -透光層48為平板狀’係藉由膠體46黏著至基板4〇上，而 與基板40固定住，並覆蓋於凹槽54上。及 -自動對焦系統44，其設有-致動器45及設置於致動器45内 Ο 之光學鏡頭47 ’致動器45底部形成有第二電極(Si，其係藉轉、 異方性導電膠或焊接連接至基板40之第一電極57上；致動^5 可為音圈馬達、壓電式致動器及步進馬達等。 請參閱圖三，本實施例包括有一黏著體68黏著於光感測元件 42之感測區62周邊，用以將導線66與光感測元件42之焊點64 連接處覆住，透光層4請係黏著於轉體68上，肋將光感測元 件42之感測區62密封住。 如是，將自動對焦系統44設置於基板4〇之上表面52上可 200934282 有效縮小產品體積’且其製造上較為便利。 綜上所述’本發明在突破先前之技術結構下， ,也非熟悉該項技藝者所易於思及，再者，本: =Γ 其所具之進步性、實用性及新穎性， 合發明專利之申請要件，纽法提出㈣專利 核准本件發明專卿請案，以勵發明，至_便。 貝局 © 、斤述之實施例僅係為說明本發明之技術關及特點 目的=使《此項技藝之人士_瞭解本發明之內容並據以實 施，虽不此以之限定本發明之專利範圍，即大凡依本發明所揭干 =精神所作之均㈣化或修飾，仍應涵蓋在本發明之專利範圍 【圖式簡單說明】 圖一為習知光感測树縣構造之剖視圖。 =為她自動驗域啦娜之剖視圖。 ® θ「二為本發明自動對焦之光感啦件封叙第二實施例。 主要元件符號說明」 光感測元件 自動對焦系統 凹槽 第二焊塾 焊點 光學鏡頭 基板 40 透光層 上表面 第—電極 感測區 致動器 48 52 57 62 42膠體 46 44下表面 50 54 第一焊墊 56 53連接線 59 64導線 66 47第二電極 61 45 200934282 黏著體 68 電子零件 51200934282 VIII. Description of the Invention: [Technical Field] The present invention relates to a light sensing component package with autofocus, in particular to a light sensing component package which is convenient to manufacture, light and short, and can effectively reduce production cost. . [Prior Art] Please refer to the present invention as a cross-sectional view of a self-riding light sensing component package, which includes a substrate 1G which is provided with an upper surface 12, a lower surface 14 and is formed on The recessed lion of the above table ©12, the recess 16_ of the substrate 1Q is formed with the second soldering surface 18 of the first soldering iron 18, and the second soldering tip 20 is formed. The first soldering wire 18 and the second soldering wire 20 are mutually connected by the wire 22 Conduction; - Light_ component 24 is provided with a solder joint around it, and is disposed in the recess 16 of the substrate 10; a plurality of wires 28 are electrically connected to the solder joint 26 of the photo sensing element 24 to the substrate 1 a solder pad 18; a plurality of electronic components 3 are disposed in the recess 16 of the substrate 10; the light transmissive layer 32 is adhered to the upper surface of the substrate 1Q to close the recess 16 and The self-collar system 34 is disposed above the light transmissive layer 32 and is connected to the second pad of the substrate iq by an electrical connection line 36. . For example, since the pylon system 34 is connected to the substrate 10 of the photo-sensing element package by the electrical connection line 36, it is inconvenient to manufacture, and its relatively large volume cannot meet the requirements of lightness, thinness and shortness. The reason is that the invention of the invention rides the rainbow to say that the automatic _, the light _ component package is lacking.研九' finally proposes a design that is reasonable in design and effective in improving the above-mentioned defects. 200934282 [Invention] The object (10) of the present invention is to provide an automatic hard-to-test domain component package structure, which has the effect of reducing the package size, _ more practical purposes. Another object of the present invention is to provide a light sensing component package structure with autofocus, which has the advantage of being convenient to manufacture, and the purpose of reducing the production cost. The invention is characterized in that it comprises a substrate provided with a lower surface and an upper surface, the upper watcher having a groove and a first electrode located at the concave side; and a light sensing component, the money is placed a surface of the substrate, located in the recess, and electrically connected to the substrate; a colloid applied to the upper surface of the substrate; a light transmissive, which is adhered to the On the substrate, the substrate is fixed; and the autofocus system has a second electrode at the bottom thereof for connecting the first electrode of the substrate. If so, the autofocus system is directly electrically connected to the first electrode on the upper surface of the substrate, which is convenient to manufacture and can effectively reduce the size of the product. The above-described features and other objects of the present invention are more fully understood from the following detailed description of the preferred embodiments. [Embodiment] In order to make it easier for the examiner to understand the other features and advantages of the present invention and the effects achieved thereby, the present invention will be described in detail with reference to the accompanying drawings. A cross-sectional view of an optical sensing component package having an autofocus according to the present invention includes a substrate 40, a light sensing component 42, a colloid 46, a light transmissive layer 48, and an autofocus system 44. Wherein - 200934282 slab 40 „ has a lower surface 5 〇 and _ upper surface %, the upper surface 刈 is formed with a groove 54 and a plurality of first solder 塾 % at the top edge of the groove 54 and the lower surface of the first electrode 57 ′ 5〇δ has a second pad %' connected to the pad-pad 56 by the connection line % through the substrate; in addition, the top edge of the groove (4) of the above table is also provided with an electronic component 51 (which may be an active or passive component) The light sensing component 42 is disposed on the upper surface 52 of the substrate 4, and is disposed in the recess 54 and has a sensing region 62 formed thereon and located in the periphery of the sensing region. Solder Joints ❹ Recording Line 66 is connected to the solder joint 64 of the component 42 to the first pad 56 of the substrate 40. The colloid 46 is applied to the upper surface 52 of the substrate 40 for the wire. % is covered with the connection end of the first pad 56. The light-transmissive layer 48 is in the form of a flat plate adhered to the substrate 4 by the glue 46, and is fixed to the substrate 40 and covered on the groove 54. An autofocus system 44 is provided with an actuator 45 and an optical lens 47 disposed in the actuator 45. The bottom of the actuator 45 is formed with a second electrode (Si, which is It is connected to the first electrode 57 of the substrate 40 by means of a rotating, anisotropic conductive glue or soldering; the actuation ^5 can be a voice coil motor, a piezoelectric actuator, a stepping motor, etc. Please refer to FIG. 3, this embodiment For example, an adhesive body 68 is adhered to the periphery of the sensing region 62 of the light sensing component 42 for covering the wire 66 to the solder joint 64 of the light sensing component 42. The light transmitting layer 4 is adhered to the rotating body. 68, the rib seals the sensing region 62 of the light sensing element 42. If so, the autofocus system 44 is disposed on the upper surface 52 of the substrate 4, and the 200934282 can effectively reduce the product volume' and is convenient to manufacture. As described above, the present invention is beyond the prior art structure, and is not familiar to those skilled in the art. Furthermore, this: = Γ its progressive, practical and novelty, and invention patents The application requirements, Newfa proposed (4) patent approval, the invention of the invention, please file the invention, to invent the invention, to _. The example of the Bay Bureau ©, the description of the article is only to explain the technical and characteristics of the invention. Person skilled in the art_understand the contents of the present invention and implement it accordingly, although not The scope of the patents of the present invention, that is, the uniformity or modification of the spirit of the present invention is still covered in the scope of the patent of the present invention [a brief description of the drawings] FIG. 1 is a conventional light sensing tree county structure Sectional view. = For her automatic cross-sectional view of the field. ® θ "two is the second embodiment of the auto-focus light-sensing device of the present invention. The main component symbol description" light sensing component autofocus system groove Second solder joint soldering point optical lens substrate 40 Transmissive layer upper surface - electrode sensing area actuator 48 52 57 62 42 colloid 46 44 lower surface 50 54 first pad 56 53 connecting line 59 64 wire 66 47 second Electrode 61 45 200934282 Adhesive 68 Electronic parts 51
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