200928696 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種散執步窨女 元件之散熱裝置。裝置（係指—種用於冷卻電子 '【先前技術】 積體電路技術之不斷進步及廣泛應用，資訊 產業之發展犬飛猛進，電腦廣泛應用於各行各業，尤 ❹個人電腦之應用已基本普及，為 : 及即時性要求提高之發罝不斷曰加 斷提古。f 求電腦運行速度不 斷k冋？人所周知，中央處理器係電腦系統之核心元件， 其性能之優劣直接決定整個電腦之性能，因此，高頻 處理益不斷推出。惟，高頻高速運行使得處理器產生大量 之熱，如果不及時排除該等熱量將引起處理器自身溫度之 ^高，—對系統之安全及性能造成很大之影響，目前散熱問 題已經成為每個新—代高速處理器推出時必需解決之問 題。通常業界均在t央處理器等晶片上安裝散熱器來散敎。 為提升散熱器散熱效果，業界常同時使用風扇來增.加 散熱能力。-種傳統之散熱裝置組合包括一散熱器及安裝 在該散熱器一侧之散熱風扇。該散熱風扇在其四角設有螺 孔，該散熱器包括一底座、由底座向上延伸之複數水平分 佈之散熱鰭片。該散熱器每一邊最外側之散熱鰭片一端: 別設有對應散熱風扇螺孔之螺釘螺紋，螺釘依次穿過該螺 孔與螺紋配合將散熱風扇固定在散熱器之一側。這種固定 6 200928696 方式雖能將散熱風扇穩固在散熱器上，但操作複雜，安穿 •及拆卸不方便，且通過這樣固定之風扇，對風扇產生$ .流沒有導流作用’而使風扇產生之氣流無法高度集中地吹 _向散熱器’進而使風扇產生之氣流無法得到充分之利用。 【發明内容】 ㈣於此’有必要提供—種風騎裝簡單便捷之散熱 裝置。 μ 一種散熱裝置，用於對電子元件進行散敎，盆 包括-導風罩、位於導風罩—側之―散熱器和安裝 在導風罩另—側之―風扇，該導風罩包括-頂板和 從頂板兩側向下延伸之二側板’該散熱器包括一基 板和從基板向上延伸之滿批# & μ 熱轉片，該散熱器頂 面開i又一扣槽’該導風罩頂柘念κ 於扣槽内之定位部；面向下凸設有容置 熱器基板兩側卡扣之扣腳。 ^ 散 〇 纟發明與習知技術相比具有如下優點：上述風扇、導 風罩及散熱器通過直接卡扣之 5扇導 ί» & ^ ^ ^ -Λ- Λ- 4心力武組合在一起，其安裝過 耘”，、而螺釘亦無需借助工具且簡單便捷。 【實施方式】 包括至圖5 ’本發明散熱襄置之-較佳實施例 女裝在該導風罩2〇 一側之一風扇％。 皁 上述散熱器1〇由導埶性能Ρ -體形成，其包括貼設到電屬广料如叙、銅等 J电千70件如中央處理器（圖未示） 200928696 上之一矩形基板12和從基板12頂面垂直向上延伸之複數 •散熱鰭片14。對於基板12請參閱圖4和圖5，基板12底 -4中^向下凸设與中央處理器之—接觸部⑽，該接觸部 120靠近風扇30之前側向兩侧傾斜形成一三角形頭部，以 .將風扇30吹向散熱器1G下方之氣流引導向兩側之電子元 件1¾基板12之兩側兩端分別水平向外延伸出一固定耳 122’該固定耳122上開設有―时孔12烈，該固定孔^川 供口疋件（圖未示）穿設而將散熱裝置固^至中央處理器 上。該基板12兩侧靠近風扇3〇之固料122之相對兩處 向内凹陷形成卡置部124。該等散熱韓片14呈矩形片體， 相互間隔平行並垂直於基板12之前後項對兩侧，散熱籍片 14之頂端相互齊平且靠近風扇％之前侧開設—扣槽⑽， 該扣槽140垂直於散熱鰭# 14並橫跨散熱器ι〇左右兩側。 上述導風罩20由塑膠材料一體形成，其包括一頂板 22、從頂板22左右相對兩側垂直向下延伸之二側板以和 ❹連接二側板24底端之一底板26。該頂板。前端部分向上 傾斜趣起延伸，以覆蓋風扇3〇上端部分。該頂板Μ、側 板24和敍26之前端均在一平面上，且形成一供風扇3〇 女裝之安裝面。該頂板22底面沿其後側緣垂直向下凸設有 一定位部220(如圖5所示），該定位部22〇呈長條形，並垂 直於二侧板24,該定位部22〇大小正好容置於散熱器ι〇 頂面之扣槽ί40内以將導風罩2〇限定在適當之位置。該右 側=板24近上端處和左側側板％近下端處各沿著側板24 向則I»又有扣片242，該二扣片242大致為位於該安裝面 200928696 對角位置，該二扣片242末端相向向内凸伸有扣鉤2420。 •該二侧板24與頂板22和底板26之連接處向前凸伸有固定 „ 柱244，該二固定柱244位於二扣片242所在安裝面之另 外二對角處，用於與二扣片242 —起將風扇30固定於該導 -風罩20靠近風扇30之前侧安裝面上。該二侧板24之近後 側下端角落設置有扣腳246，該扣腳246 —側通過一 g直 切槽（未標號）而與侧板24分離，以使其能發生彈性形變 而滑入散熱器10兩侧底部之卡置部124扣合固定。該二扣 ❹腳246相向向内凸設扣鉤2460，以卡扣於散熱器1〇卡置 部124之底部固定。該二侧板24在於二切槽相鄰處各向外 侧凸伸一豎直條狀之凸部248，以加強此處邊緣之強度。 該二側板24底端在與底板26連接處與該凸部248之間向 上凹設有矩形缺口 249，以容置該散熱器1〇前端兩側之固 疋耳122。該底板26與頂板22平行，垂直連接二侧板24 靠近風扇30之前侧部分之底端。該底板26靠近風扇3〇 ❹之前側向下延伸一導風部262，該導風部262上開設有供 風扇30產生之氣流通過之通風孔262〇，該底板％後側邊 緣向上延伸有複數限位凸部264，該等限位凸部264用於 抵頂在散熱器1〇基板12靠近風扇3〇之前側（如圖3所示） 以將導風罩20限定在適當之位置上。 上述風扇30包括一矩形框體，該框體之每個角落設置 有一間隔之凸緣32,該凸緣32上開設有供導風罩2〇固定 柱244穿置之固定孔32〇。 上述散熱裝置組裝時，該導風罩2G套設於該散熱器 9 200928696 10前側’使其頂板22後端之定位部220對應容置在散熱 器10頂部之卡槽140内；該二侧板24底端之缺口 249對 應容置散熱器10前端兩側之固定耳122 ;同時下壓導風罩 • 20使其兩侧板24處於彈性形變狀態下之扣腳246末端之 扣鉤2460滑過散熱器1〇最外側散熱鰭片14而卡入該散熱 器10基板12之卡置部124内固定。接著將風扇30放置在 導風罩20前側之安裝面上，並使導風罩2〇安裝面對角上 之固定柱244對應風扇30二對角上之固定孔320，再將風 〇扇30往導風罩20安裝面上壓，使固定柱244插入固定孔 320内，同時導風罩2〇安裝面另一對角上發生彈性形變之 一扣片242末端之扣鉤2420滑過風扇3〇凸緣32而卡在凸 緣32前側將風扇3〇固定。可以理解地，上述風扇3〇之安 裝順序係可以變換之，可以先將風扇3〇與導風罩2〇組合 起來，再將連著風扇30之導風罩20安裝到散熱器10上。 可見，上述風扇30、導風罩20及散熱器1〇通過直接 〇卡扣之=式組合在—起’其安裝過程無需螺釘亦無需借助 工具且簡單便捷。此外’導風罩2()很好地將散熱器⑺與 j 30間之空間密封起來，使風扇3〇產生之氣流集中吹 1熱器1〇。上述散熱器10基板12底面之接觸部之 2形頭部頂端面向該導風罩2〇之導風部加，風扇3〇 12〇ΓΓ氣流通過導風部262之導風孔262吹向接觸部 =再通過接觸部12G之頭部轉向中央處理器兩侧之電子 =件’從而可兼顧解決中央處理器周圍電子元件之散熱問 200928696 綜上所述，本發明符合發明專利要件，爰依法 提出專利申明准，以上所述者僅為本發明之較佳 實施例，舉凡熟悉本案技藝之人士，在爰依本發明 精神所作之等效修飾或變化，皆應涵蓋於以下:申 請專利範圍内。 【圖式簡單說明】 Ο 〇 圖1係本發明散熱裝置—較佳實施例之立體組合圖 圖2係圖 1中散熱裝置之立體分解圖。 圖3係圖 2中散熱器和導風罩立體組合圖 0 圖4係圖 1中散熱裝置另 一視角之倒置組 合圖 圖5係圖 3中散熱裝置之立體分解圖。 主要元件符號說明】 散熱器 10 基板 12 接觸部 120 固定耳 122 固定孔 1220 卡置部 124 散熱鰭片 14 扣槽 140 導風罩 20 頂板 22 定位部 220 侧板 24 扣片 242 扣鉤 2420、： 固定柱 244 扣腳 246 底板 26 導風部 262 通風孔 2620 限位凸部 264 凸部 248 缺口 24 11 32200928696 風扇 30 凸緣 固定孔 320200928696 IX. Description of the Invention: [Technical Field] The present invention relates to a heat sink for a stray step virgin component. Device (referred to as a kind of cooling electrons) [Prior Art] The continuous advancement and wide application of integrated circuit technology, the development of the information industry is booming, computers are widely used in various industries, especially the application of personal computers has been basically Popularization, for: and the immediate improvement of the demand for the continually continually smashing the ancients. f Seeking the computer running speed is constantly 冋? As everyone knows, the central processor is the core component of the computer system, its performance directly determines the entire computer The performance, therefore, the high-frequency processing benefits continue to be introduced. However, the high-frequency high-speed operation makes the processor generate a lot of heat, if not eliminated in time, the heat of the processor itself will be high, the safety and performance of the system A big impact, the current heat dissipation problem has become a problem that must be solved when each new-generation high-speed processor is introduced. Usually, the industry installs a heat sink on a wafer such as a t-processor to dissipate heat. The industry often uses fans to increase the heat dissipation capacity. A traditional heat sink combination includes a heat sink and is mounted on the heat sink. a cooling fan on one side of the device. The cooling fan has a screw hole at four corners thereof, and the heat sink includes a base and a plurality of horizontally distributed heat dissipation fins extending upward from the base. One end of the outermost heat dissipation fin of each side of the heat sink : There is a screw thread corresponding to the screw hole of the cooling fan. The screw passes through the screw hole and threadedly to fix the cooling fan to one side of the heat sink. This fixing 6 200928696 method can fix the cooling fan on the heat sink. However, the operation is complicated, and it is inconvenient to wear and disassemble, and through such a fixed fan, the fan generates $. The flow has no diversion effect', and the airflow generated by the fan cannot be highly concentrated to blow the radiator to the radiator. The generated airflow cannot be fully utilized. [Summary of the Invention] (4) Here, it is necessary to provide a simple and convenient heat sink for wind riding. μ A heat sink for diverging electronic components, including - wind guide a cover, a heat sink on the side of the air hood, and a fan mounted on the other side of the air hood, the air hood including a top plate and extending downward from both sides of the top plate The two side plates 'the heat sink includes a substrate and a full batch of # & μ thermal transfer fins extending upward from the substrate, the top surface of the heat sink is opened and the other side of the heat sink is slid into the buckle groove The positioning portion is provided with a buckle that faces the two sides of the heat-receiving substrate. The invention has the following advantages compared with the prior art: the fan, the air hood and the radiator are directly buckled. The five guides ί» & ^ ^ ^ -Λ- Λ - 4 are combined together, they are installed over the 耘", and the screws are also simple and convenient without tools. [Embodiment] Included in Figure 5 'The invention Heat Dissipating Device - The preferred embodiment is a fan of one of the fans on the side of the air hood 2. The above-mentioned heat sink 1 is formed of a conductive body, which is attached to an electric material such as A 70-piece such as a central processing unit (not shown) 200928696, a rectangular substrate 12 and a plurality of heat-dissipating fins 14 extending vertically upward from the top surface of the substrate 12. For the substrate 12, referring to FIG. 4 and FIG. 5, the bottom portion 4 of the substrate 12 protrudes downwardly from the central processing unit-contact portion (10), and the contact portion 120 is inclined to form a triangular head near the lateral sides of the fan 30. The airflow of the fan 30 is directed to the lower side of the heat sink 1G, and the two sides of the substrate 12 are horizontally outwardly extended from the two sides of the substrate 12 to form a fixed ear 122'. 12, the fixed hole ^ Chuan mouthpiece (not shown) is worn to fix the heat sink to the central processing unit. The two opposite sides of the solid material 122 of the fan 3's on both sides of the substrate 12 are recessed inward to form a latching portion 124. The heat-dissipating Korean sheets 14 are rectangular sheets, which are parallel to each other and perpendicular to the front and rear sides of the substrate 12, and the top ends of the heat-dissipating sheets 14 are flush with each other and close to the front side of the fan %--the buckle groove (10), the buckle groove 140 is perpendicular to the heat sink fin # 14 and spans the left and right sides of the heat sink ι. The air hood 20 is integrally formed of a plastic material, and includes a top plate 22, two side plates extending vertically downward from opposite left and right sides of the top plate 22, and a bottom plate 26 connected to the bottom end of the two side plates 24. The top plate. The front end portion extends obliquely upward to cover the upper end portion of the fan 3. The top plate 侧, the side plates 24 and the front end of the rib 26 are all on a flat surface and form a mounting surface for the fan. A positioning portion 220 (shown in FIG. 5) is vertically protruded from the bottom surface of the top plate 22 along the rear side edge thereof. The positioning portion 22 is elongated and perpendicular to the two side plates 24, and the positioning portion 22 is sized. Just fit in the buckle ί40 on the top surface of the radiator 〇 to limit the air hood 2〇 to the proper position. The right side=the lower end of the board 24 and the lower side of the left side panel are respectively along the side panel 24 and then have a buckle 242. The two fastening pieces 242 are substantially located at a diagonal position of the mounting surface 200928696. A hook 2420 protrudes inwardly from the end of the 242. The front side of the connecting portion of the two side plates 24 and the bottom plate 22 and the bottom plate 26 are fixed with a fixed column 244. The two fixing posts 244 are located at the other two opposite corners of the mounting surface of the two fastening pieces 242 for use with the two buckles. The 242 is fixed to the windshield 20 adjacent to the front mounting surface of the fan 30. The lower rear corner of the two side panels 24 is provided with a buckle 246, and the buckle 246 is laterally passed through a g Straight slits (not labeled) are separated from the side plates 24 so that they can be elastically deformed and snapped into the bottom portions of the heat sink 10 at the bottom of the heat sink 10. The two buckle legs 246 are convexly facing inward. The hook 2460 is fastened to the bottom of the heat sink 1 〇 card portion 124. The two side plates 24 protrude outwardly from the two grooving portions to protrude outwardly from a vertical strip-shaped convex portion 248 to strengthen the same. The bottom end of the two side plates 24 is recessed with a rectangular notch 249 at a position connecting the bottom plate 26 and the convex portion 248 to receive the fixing lug 122 on both sides of the front end of the heat sink 1 . 26 is parallel to the top plate 22 and vertically connects the two side plates 24 to the bottom end of the front side portion of the fan 30. The bottom plate 26 is adjacent to the fan 3〇. An air guiding portion 262 extends downwardly from the front side of the crucible, and the air guiding portion 262 defines a ventilation hole 262 供 through which the airflow generated by the fan 30 passes. The rear side edge of the bottom plate extends upwardly with a plurality of limiting protrusions 264. The equal-limit protrusion 264 is used to abut the front side of the heat sink 1 〇 substrate 12 near the fan 3 (as shown in FIG. 3) to define the air hood 20 in an appropriate position. The fan 30 includes a rectangular frame. Each of the corners of the frame is provided with a spaced flange 32, and the flange 32 is provided with a fixing hole 32 供 through which the air guiding cover 2 〇 the fixing post 244 is inserted. The air guiding device is assembled when the heat dissipating device is assembled. The cover 2G is sleeved on the front side of the heat sink 9 200928696 10 'the positioning portion 220 at the rear end of the top plate 22 is correspondingly received in the card slot 140 at the top of the heat sink 10; the notch 249 at the bottom end of the two side plates 24 is correspondingly received The fixing ear 122 on both sides of the front end of the heat sink 10; at the same time, the air guiding cover 20 is pressed down, and the hook 2460 at the end of the fastening leg 246 with the two side plates 24 in the elastic deformation state slides over the outermost heat dissipation fin of the heat sink 1 14 is inserted into the latching portion 124 of the base plate 12 of the heat sink 10. The fan 30 is then placed. On the mounting surface on the front side of the air hood 20, the air hood 2 is mounted on the opposite corner of the fixing post 244 corresponding to the fixing hole 320 on the opposite corners of the fan 30, and then the wind fan 30 is directed to the air hood 20. Pressing on the mounting surface causes the fixing post 244 to be inserted into the fixing hole 320, and at the other opposite corner of the mounting surface of the air guiding cover 2, the buckle 2420 at the end of one of the fastening pieces 242 is elastically deformed and slides over the flange 32 of the fan 3〇. The card is fixed on the front side of the flange 32. It can be understood that the installation order of the fan 3〇 can be changed, and the fan 3〇 and the air hood 2〇 can be combined first, and then the fan 30 is connected. The air hood 20 is mounted to the heat sink 10. It can be seen that the fan 30, the air hood 20 and the heat sink 1 are combined by the direct 〇 buckle, and the installation process requires no screws and no tools and is simple and convenient. In addition, the air dam 2 (2) seals the space between the heat sink (7) and the j 30 well, so that the airflow generated by the fan 3 集中 is concentrated on the heat exchanger 1 〇. The top end of the contact portion of the bottom surface of the substrate 12 of the heat sink 10 faces the air guiding portion of the air guiding cover 2, and the airflow of the fan 3〇12〇ΓΓ is blown to the contact portion through the air guiding hole 262 of the air guiding portion 262. Then, by turning the head of the contact portion 12G to the electronic component on both sides of the central processing unit, the heat dissipation of the electronic components around the central processing unit can be solved. 200928696 In summary, the present invention complies with the invention patent requirements and patents according to law. The above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims: BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a heat dissipating device of the present invention in a preferred embodiment. FIG. 2 is an exploded perspective view of the heat dissipating device of FIG. 3 is a perspective view of the heat sink and the air hood of FIG. 2. FIG. 4 is an exploded perspective view of the heat sink of FIG. Main component symbol description] Heatsink 10 Substrate 12 Contact part 120 Fixing ear 122 Fixing hole 1220 Fixing part 124 Heat sink fin 14 Buckle 140 Air deflector 20 Top plate 22 Positioning part 220 Side plate 24 Buckle 242 Buckle 2420,: Fixing post 244 Buckle 246 Base plate 26 Air guiding portion 262 Ventilation hole 2620 Limiting projection 264 Projection 248 Notch 24 11 32200928696 Fan 30 Flange fixing hole 320
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