200928202 九、發明說明： •【發明所屬之技術領域】 本發明涉及一種發光 有散熱結構之發光二極體 【先前技術】 二極體燈具，尤係一種具 燈具。 發光一極體光源作失 ^ 下為一種新興之第三代光 源’雖然現在還不能大規模取代傳統之白；燈， ❹惟’其具有工作壽命長、節能、環保等優點，而普 遍被市場所看好。而且，目前由發光二極體組成之 .模組能產生大功率、高亮度之光源，完全可以取代 現有白熾燈實現室内外照明’亦將廣泛地、革命性 地取代傳統之白熾燈等現有之光源，進而成為符合 節能環保主題之主要光源。 然而’功率、亮度越大之發光二極體或其模組 ❹產生之熱量越大’且在體積相對較小之發光二極體 燈具内難於散發出去。故’發光二極體尚存在較大 散熱技術瓶頸，此亦係目前大功率、高亮度發光.二 極體燈具市場化最難突破之關鍵之處。目前業界 通用之散熱方案係在該燈具内設置一散熱器，該散 熱器具有一扁平底板和底板上形成之複數散熱韓 片。對於一些大功率之燈具，其發光二極體一般係 密集地排列在該底板上並與該底板導熱連接。這樣 發光二極體產生之熱量就可以通過底板傳導到散 6 200928202 .熱鰭片上而散發到周圍之空氣中。 然而，因為散熱器中部之散熱鰭片接受之來自 熱源之熱量較大且空氣對流相對靠近周緣之散熱 鰭片要差，故，像這樣熱源均勻密集地排列在一底 板上，容易致使散熱不均勻而底板中部位置相對周 邊溫度過高，從而極大地影響散熱器之整體散熱性 能。此外，燈源分佈在一平面上使光之出射角度亦 受到一定限制。 ®【發明内容】 有鑒於此，有必要提供一種對流均勻且具有較 -大出射角度之發光二極體燈具。 一種發光二極體燈具，其包括一頂蓋、連接于 頂蓋下方之一散熱器、一導熱體和貼設於導熱體下 端面之複數發光二極體模組，該散熱器包括一導熱 筒壁和從導熱筒壁向外延伸之複數散熱鰭片，該導 _熱體容置在該導熱筒壁内並與導熱筒壁導熱連 接，該導熱體下端面形成一供發光二極體模組貼設 之内凹面。 上述散熱鰭片間之氣流通道位於該導熱體周 緣，有利於空氣自下向上對流將散熱鰭片之熱量帶 走，而實現散熱之效果，同時由於發光二極體模組 貼置於導熱體之内凹面上，增大光之出射角度。 【實施方式】 如圖1 -4所示，本發明一優選實施例之發光二 7 200928202 -極體燈具，可用於室内或戶外如廣場、街道及公路 ,等場所之照明。該發光二極體燈具包括一頂蓋1 〇、 連接于該頂蓋10周緣下方之一環形散熱器20、容 置於該散熱器20内之一導熱體30、貼設於該導熱 體30底端之複數條形發光二極體模組40和與該散 熱器20底端緣結合而將導熱體3〇封於散熱器20 内之一燈蓋50。 上述頂蓋10用於與一燈座（圖未示）導電結 ®合同時將整個發光二極體燈具固定到該燈座上，其 1包括一圓形蓋體12和設置于該蓋體12中間之一燈 •頭14。該蓋體12為一圓形平板體，在靠近其外周 緣處開設有複數間隔之穿孔122，該穿孔122用於 供螺釘（圖未示）穿過而與散熱器20頂端螺合。 該蓋體12在靠近並圍繞該燈頭14之一圓周上均句 間隔開設有複數透孔120 ’該透孔12〇用於供螺針 ❹穿過而與導熱體30頂面螺合。該燈頭14用於插置 到燈座内而將發光二極體燈具固定並電性連接。 上述散熱器20 一*31 /蜀 K 竹如 銅、銘等一體成型’其包括一圓筒形之導熱筒壁 22和由該導熱筒壁22外周緣發散地向外延伸之〃 數散熱韓片24。該導熱筒壁22之直徑略小於或^ 於該頂蓋ίο蓋體之直徑，導熱筒壁22之頂 上間隔開設有複數間隔之固定孔22〇，該等固定 22〇與蓋體12上之穿孔122對應，與穿過穿孔m 8 200928202 .之螺釘螺合而將散熱器20固定到頂蓋1 〇上。該等 ，散熱鰭片24相互間隔且與散熱器2〇或導熱筒壁 22之中心軸線平行’相鄰兩散熱鰭片24之間形成 有沿軸線之1：直通道。該散熱器1〇或散熱鳍片Μ 關於散熱器20或導熱筒壁22之中心軸線中心對 稱。 上述導熱體30由導熱性能良好之金屬材料如 銅、鋁等一體成型’其大致呈一正好容置在散熱器 ® 20之導熱筒壁22内之扁圓柱狀。該導熱體3〇包 -括連接頂蓋10之一頂面32、與散熱器20導熱筒 ’壁22内侧接觸之周面33和位於底端之一内凹面 34 °該頂面32對應頂蓋10蓋體12上之透孔12〇 開設有複數呈圓環形排列之結合孔320，該等結合 孔3 20與穿過透孔120之螺釘配合將導熱體固 疋到頂蓋10上。該頂面3 2中央開設有一上下穿透 ❹之通孔3 22’該通孔3 22可供導線穿過將發光二極 體模組40與該頂蓋10之燈頭14導電連接。該周 面33與導熱筒壁22内側面之間可以填充導熱膠， 以加強導熱效果。該内凹面34係由該導熱體30之 底端呈漏斗狀内凹而成，該内凹面34被平均分為 複數扇形區域，每一扇形區域均被處理成平面狀以 供—發光二極體模組40貼設其上。 上述發光二極體模組40包括一條形之電路板 42和沿該電路板42長度排列並安裝於電路板 42 9 200928202 •亡之稷數發光二極體44。該發光二極體模組40玎 -過鎖螺釘之方式固定於該導熱體30内凹面34 上。 上述燈蓋50為一圓形薄板體，其由透明材料 如玻璃或樹爿曰專製成。該燈蓋5Q之大小正好貼設 在該散熱器2〇導熱筒壁22之下端内緣和導熱體 30内凹面34之底端周緣上，並可通過粘貼等方法 固定。 n _ 上述發光二極體燈具組合時，嫘釘穿過頂蓋 10之穿孔122與散熱器2〇頂端之固定孔22〇螺合 而將散熱器20固定到頂蓋1〇下；該導熱體30通 過其頂面之结合孔32〇與穿過頂蓋之螺釘結合 而固到頂蓋10下；發光二極體模組4〇分別沿導熱 體30之徑向貼設在内凹面34之扇形區域上；該燈 蓋50容置在散熱器20底端内將該導熱體30及發 ©光二極體模組40封裝於散熱器2〇導熱筒壁22内。 上述發光二極體燈具在使用時，發光二極體模 組40產生之熱I均勻地傳導到導熱體3〇上，再通 過導熱體30均句分佈到散熱鰭片24上，最後由散 熱韓片24散發到周圍空氣中而達到冷卻之效果。 上述發光二極體模組4〇成中心對稱地連接到導熱 體30上，上述散熱鳍^ 工 …、θ片24間之氣流通道位於該導 熱體30周緣且&豎直方向延伸，有利於空氣自下 向上對流將散熱鳍片24之熱量帶走，而實現散熱 200928202 .之效果。此外，上述發光二極體模組40發散地貼 設於導熱體30之内凹面34，傾斜面向發光二極體 燈具之四周，從而有效增加照射面積。 綜上所述，本發明符合發明專利要件，爰依法 提出專利申請。惟，以上所述者僅為本發明之較佳 實施例，舉凡熟悉本案技藝之人士，在爰依本發明 精神所作之等效修飾或變化，皆應涵蓋於以下之申 請專利範圍内。 ®【圖式簡單說明】 圖1係本發明發光二極體燈具之一優選實施 例之立體組合圖。 圖2係圖1中發光二極體燈具之立體分解圖。 圖3係圖2之部分組合圖之倒置圖。 圖4係圖2之倒置圖。 【主要元件符號說明】 頂蓋 10 蓋體 12 透孔 120 穿孔 122 燈頭 14 散熱器 20 導熱筒壁 22 固定孔 220 散熱鰭片 24 導熱體 30 頂面 32 結合孔 320 通孔 322 周面 33 内凹面 34 發光二極體模 40 11 200928202 組 電路板 42 潑 ‘光二極體 44 燈蓋 50 ❹ ❹ 12200928202 IX. Description of the invention: • Technical field to which the invention pertains The present invention relates to a light-emitting diode having a heat-dissipating structure. [Prior Art] A diode lamp, in particular, a lamp. The illuminating one-pole light source is a new generation of light source. Although it can not replace the traditional white color on a large scale, the lamp, ❹ ' 'has the advantages of long working life, energy saving, environmental protection, etc. The place is optimistic. Moreover, the module consisting of a light-emitting diode can generate a high-power, high-brightness light source, which can completely replace the existing incandescent lamp to achieve indoor and outdoor lighting. It will also replace the existing incandescent lamp widely and revolutionarily. The light source has become the main light source in line with the theme of energy conservation and environmental protection. However, the greater the power and brightness, the greater the heat generated by the LED or its module, and it is difficult to dissipate in a relatively small volume of a light-emitting diode lamp. Therefore, the light-emitting diode still has a large heat-dissipation technology bottleneck, which is also the current high-power, high-brightness light-emitting. The key to the market breakthrough of the diode lamp is the most difficult. At present, the general heat dissipation solution in the industry is to provide a heat sink in the lamp, the heat sink has a flat bottom plate and a plurality of heat sinks formed on the bottom plate. For some high-power lamps, the light-emitting diodes are generally densely arranged on the bottom plate and thermally connected to the substrate. The heat generated by the light-emitting diodes can be conducted through the bottom plate to the air around the heat fins. However, since the heat dissipating fins in the middle of the heat sink receive a large amount of heat from the heat source and the air convection is relatively close to the heat radiating fins of the periphery, the heat source is uniformly arranged in a dense manner on a bottom plate, which tends to cause uneven heat dissipation. The middle position of the bottom plate is too high relative to the surrounding temperature, which greatly affects the overall heat dissipation performance of the heat sink. In addition, the light sources are distributed on a plane such that the angle of exit of the light is also limited. ® [Invention] In view of the above, it is necessary to provide a light-emitting diode lamp with uniform convection and a relatively large exit angle. A light-emitting diode lamp includes a top cover, a heat sink connected to the lower surface of the top cover, a heat conductor and a plurality of light-emitting diode modules attached to the lower end surface of the heat conductor, the heat sink including a heat-conducting tube a wall and a plurality of heat dissipating fins extending outward from the wall of the heat conducting tube, the heat conducting body being received in the wall of the heat conducting tube and thermally connected to the wall of the heat conducting tube, the lower end surface of the heat conducting body forming a light emitting diode module Concave inside the sticker. The airflow passage between the heat dissipation fins is located at the periphery of the heat conductor, which facilitates the convection of the air from the bottom to the convection to remove the heat of the heat dissipation fins, thereby achieving the effect of heat dissipation, and at the same time, the light emitting diode module is placed on the heat conductor. On the concave surface, increase the angle of exit of the light. [Embodiment] As shown in Figure 1-4, a preferred embodiment of the present invention is a light-emitting device. The light-emitting device can be used for lighting indoors or outdoors such as squares, streets, highways, and the like. The light-emitting diode lamp includes a top cover 1 , an annular heat sink 20 connected to the periphery of the top cover 10 , a heat conductor 30 received in the heat sink 20 , and a bottom portion of the heat conductor 30 . The plurality of strip-shaped LED modules 40 are coupled to the bottom end of the heat sink 20 to seal the heat conductor 3 to a lamp cover 50 in the heat sink 20. The top cover 10 is used to fix the entire LED lamp to the lamp holder when it is contracted with a lamp holder (not shown). The lamp 1 includes a circular cover 12 and is disposed on the cover 12 One of the lights in the middle • Head 14. The cover body 12 is a circular flat body, and a plurality of spaced-apart perforations 122 are formed near the outer periphery thereof, and the through holes 122 are provided for screwing (not shown) to be screwed to the top end of the heat sink 20. The cover 12 is spaced apart from the circumference of one of the bases 14 and is provided with a plurality of through holes 120' for the threaded holes to be screwed into the top surface of the heat conductor 30. The lamp cap 14 is for inserting into the lamp holder to fix and electrically connect the LED lamp. The heat sink 20 is integrally formed of a copper foil, a metal, and the like, and includes a cylindrical heat-conducting cylinder wall 22 and a plurality of heat-dissipating fins 24 extending outward from the outer periphery of the heat-conducting cylinder wall 22. . The diameter of the heat-conducting cylinder wall 22 is slightly smaller than or equal to the diameter of the cover body. The top surface of the heat-conducting cylinder wall 22 is spaced apart from the plurality of fixing holes 22, and the fixing holes 22 and the perforations on the cover body 12. Corresponding to 122, the heat sink 20 is fixed to the top cover 1 by screwing with a screw passing through the perforation m 8 200928202. The heat dissipating fins 24 are spaced apart from each other and are parallel to the central axis of the heat sink 2 or the heat conducting cylinder wall 22. A first channel along the axis is formed between the adjacent heat radiating fins 24. The heat sink 1 or heat sink fins symmetry about the center axis of the heat sink 20 or the heat conducting cylinder wall 22. The above-mentioned heat conductor 30 is integrally formed of a metal material having good thermal conductivity such as copper, aluminum or the like, which is substantially in the shape of a flat cylinder which is accommodated in the heat conducting cylinder wall 22 of the heat sink ® 20. The heat conductor 3 includes a top surface 32 connecting the top cover 10, a peripheral surface 33 contacting the inner side of the heat conducting tube 'wall 22 of the heat sink 20, and a concave surface 34 at one of the bottom ends. The top surface 32 corresponds to the top cover. The through hole 12 of the cover body 12 is provided with a plurality of coupling holes 320 arranged in a circular shape. The coupling holes 30 20 cooperate with the screws passing through the through holes 120 to fix the heat conductor to the top cover 10. A through hole 3 22' is formed in the center of the top surface 32. The through hole 3 22 is provided for the wire to pass through and electrically connect the light emitting diode module 40 to the base 14 of the top cover 10. A heat conductive adhesive may be filled between the circumferential surface 33 and the inner side surface of the heat conducting cylinder wall 22 to enhance the heat conduction effect. The concave surface 34 is formed by a funnel-shaped recess at the bottom end of the heat conductor 30. The concave surface 34 is equally divided into a plurality of sector regions, and each of the sector regions is processed into a planar shape for the light-emitting diode. The module 40 is attached thereto. The LED module 40 includes a strip-shaped circuit board 42 and a length along the length of the circuit board 42 and mounted on the circuit board 42 9 200928202. The light-emitting diode module 40 is fixed to the concave surface 34 of the heat conductor 30 by means of a locking screw. The lamp cover 50 is a circular thin plate body which is made of a transparent material such as glass or tree raft. The lamp cover 5Q is sized to be attached to the inner edge of the lower end of the heat sink wall 22 and the bottom end of the concave surface 34 of the heat conductor 30, and can be fixed by pasting or the like. When the above-mentioned light-emitting diode lamps are combined, the nails are screwed through the through holes 122 of the top cover 10 and the fixing holes 22 of the top end of the heat sink 2 to fix the heat sink 20 to the top cover 1; the heat conductor 30 The top surface of the inner surface of the heat-conducting body 30 is respectively attached to the fan-shaped area of the concave surface 34 by the combination of the top surface of the coupling hole 32 and the screw passing through the top cover. The lamp cover 50 is received in the bottom end of the heat sink 20 to encapsulate the heat conductor 30 and the photodiode module 40 in the heat sink wall 22 of the heat sink 2 . When the above-mentioned light-emitting diode lamp is used, the heat I generated by the LED module 40 is uniformly transmitted to the heat-conducting body 3, and then distributed to the heat-dissipating fins 24 through the heat-conducting body 30, and finally by the heat-dissipating heat The sheet 24 is dissipated into the surrounding air to achieve a cooling effect. The light-emitting diode module 4 is connected to the heat-conducting body 30 in a center-symmetrical manner, and the air flow passage between the heat-dissipating fins and the θ-sheet 24 is located at the periphery of the heat-conducting body 30 and extends in the vertical direction, which is advantageous for The air convection from bottom to top takes away the heat of the fins 24, and achieves the effect of heat dissipation 200928202. In addition, the LED module 40 is disposed on the concave surface 34 of the heat conductor 30, and is inclined to face the periphery of the LED lamp, thereby effectively increasing the irradiation area. In summary, the present invention complies with the requirements of the invention patent, and proposes a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of a preferred embodiment of a light-emitting diode lamp of the present invention. 2 is an exploded perspective view of the light-emitting diode lamp of FIG. 1. Figure 3 is an inverted view of a partial combination diagram of Figure 2. Figure 4 is an inverted view of Figure 2. [Main component symbol description] Top cover 10 Cover body 12 Through hole 120 Perforation 122 Lamp cap 14 Heat sink 20 Thermal tube wall 22 Fixing hole 220 Heat sink fin 24 Heat conductor 30 Top surface 32 Bonding hole 320 Through hole 322 Peripheral surface 33 Concave surface 34 LED module 40 11 200928202 Group circuit board 42 splash 'light diode 44 lamp cover 50 ❹ ❹ 12