TW200927623A - Substrate processing apparatus - Google Patents

Abstract

To eliminate unrequited maintenance by re-executing the sequence that is the cause of an error in a substrate processing apparatus. The system is provided with a processing chamber that processes a substrate, a carrier that carries the substrate, and a first controller that controls the carrier in accordance with a predetermined carrying sequence composed of a plurality of sequences, wherein if an error occurs while the carrier is carrying the substrate, after the first controller temporarily suspends an execution of the carrying sequence, it suspends the processing upon receipt of the stop processing and re-executes the sequence that is the cause of the error occurrence out of the carrying sequence upon receipt of the retry processing.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing apparatus, and more particularly to a substrate processing apparatus having a control means for controlling according to a predetermined program. [Prior Art] A substrate processing apparatus including a process for processing a substrate and a transfer robot for transporting the substrate is known, and is controlled by a predetermined transfer program composed of a plurality of programs. The transfer robot is, for example, a cluster type or an in-line type substrate processing apparatus. In such a substrate processing apparatus, the history is provided with two sensors for automatically controlling the transfer robot. SUMMARY OF THE INVENTION (Problems to be Solved by the Invention) However, if an alarm is generated due to an error in the automatic control, an unnecessary maintenance time may occur until the batch processing is started again. For example, in a conventional vacuum transfer sequence, when a wafer is taken out from a chamber, the presence or absence of the wafer is detected by the presence or absence of the wafer detecting sensor. Under normal conditions, the wafer is detected by the sensor, and in an abnormal situation, it is disconnected and an alarm is generated. However, when the normal and abnormalities are judged by turning on and off the sensor, it is impossible to determine whether the part that is the error is on the side of the device or the device detected by the sensor, so that it is impossible to clearly specify that an alarm is generated. The reason. Therefore, when 097140117 and 200927623 generate an alarm under the temporary malfunction of the sensor, the batch processing is stopped and the wafer is recycled to the wafer carrier (10) UP in the same manner as when the component is replaced or repaired. F and t Opening Unified P〇d, the front open wafer cassette), and then the cause of the alarm, which will result in wasted time. It is an object of the present invention to prevent unnecessary maintenance from being performed by executing a program that becomes an error again. (Means for Solving the Problem) According to the aspect of the invention, there is provided a substrate processing apparatus comprising: a processing chamber for processing a substrate; a transporting means for transporting the substrate; and a predetermined program The transfer process (4) controls the first control hand & and when the transfer means generates an error during the transfer of the substrate, "If the first control means temporarily interrupts execution of the transfer program, When the processing is stopped, the processing is stopped, and if the retry processing is accepted, the program that causes the error in the above-described transfer program is executed again. Further, the present invention provides a base processing device including: a processing chamber for processing a substrate; a transporting means for transporting the substrate; and processing the substrate in accordance with a predetermined processing program composed of a plurality of programs The second control means for performing the control; and when there is an error in the processing of the substrate in the processing chamber, the second control means temporarily interrupts the execution of the processing program, and then stops the processing if the processing is stopped. In the processing, if the retry processing is accepted, the cause of the error in the processing program is executed again. 097140117 4 200927623 According to another aspect of the present invention, a substrate processing apparatus including: a substrate housing portion a substrate storage container for accommodating a plurality of substrates; the air is moved to and supplied to the substrate storage container; the preliminary chamber is connected to the atmospheric transfer chamber, and the inside thereof is evacuated; and the substrate processing chamber is The substrate is connected to the preparation chamber and processed to the substrate; the atmospheric transfer means is on the substrate The substrate is transported between the storage container and the preparation chamber, and the vacuum transfer means transports the substrate between the preparation chamber and the substrate processing chamber; ❹X and the first control hand & 'which are formed according to a plurality of programs The predetermined transfer program controls the operation of the atmospheric transfer means or the vacuum transfer means; and when an error occurs in the transfer of the large-size section or the light-handed wealth substrate, the first control means temporarily interrupts the operation. After the execution of the transfer program, if the processing is stopped, the processing is stopped, and if the retry processing is accepted, the program that causes the error in the transfer program is processed again. According to another aspect of the present invention, there is provided a substrate processing apparatus comprising: a substrate storage unit on which a substrate storage container storing a plurality of substrates is placed; and an atmospheric transfer chamber that communicates with the substrate storage container; The substrate is connected to the atmospheric transfer chamber and evacuated internally; the substrate processing chamber is in communication with the pre-chamber and the substrate is processed; the atmospheric transfer means is in the substrate storage container and the substrate The substrate is transported between the preparation chambers, and the vacuum transfer means 'sends the substrate 1 to the substrate processing chamber to send the substrate 1 control means' to the predetermined transfer program in accordance with the order of the seams, and controls 097140117 5 200927623 ^日^& or the operation of the vacuum transfer chamber; and the second control hand U processes the base control according to a 岐 process composed of a plurality of steps, and is generated during the processing of the substrate in the processing chamber = The next control means that the second control means temporarily interrupts the processing of the above-mentioned processing program, "right accept stop processing", the processing is stopped, and the retry processing is accepted. Then, the above-mentioned processing (4) is performed again. (Steps of the error drum) (Effect of the invention) 四 (4) The present invention can remove unnecessary maintenance when the error is retried to recover an error caused by a temporary malfunction. Moreover, even if the error is not restored, it is also wrong. [Embodiment] A substrate processing apparatus according to an embodiment of the present invention will be described with reference to Figs. 1 to 9 . FIG. 1 is a schematic configuration diagram of a cluster-type semiconductor die device according to an embodiment of the present invention, and FIG. 2 is a schematic configuration diagram of a linear semiconductor manufacturing device according to an embodiment of the present invention. 3 is a block diagram of a control means provided in a semiconductor manufacturing apparatus of an embodiment of the present invention. FIG. 4 is a control hand of the manufacturing apparatus of the semi-fourth (fourth) state of the present invention. FIG. 5 to FIG. 5 are flowcharts showing a substrate transfer procedure performed in the semiconductor manufacturing apparatus according to the embodiment of the present invention. 097140117 6 200927623 (1) Configuration of semiconductor manufacturing apparatus In general, semiconductor manufacturing apparatuses are classified into two types according to the arrangement of chambers, such as a cluster-type semiconductor manufacturing apparatus in which a plurality of chambers are arranged in a star shape around the transfer chamber. The other is a linear semiconductor manufacturing apparatus in which a chamber and a transfer chamber are arranged in line. Hereinafter, the configuration of the bundle-semiconducting device, the configuration of the linear semi-fourth manufacturing device, and the control means for controlling the cracking will be described with reference to Figs. 2 and 3, respectively. (1-1) Configuration of the cluster-type semiconductor manufacturing apparatus. The configuration of the cluster-type semiconductor manufacturing apparatus is divided into a vacuum side and an atmosphere side. (a) The vacuum side is formed on the vacuum side of the cluster type semiconductor manufacturing apparatus, and is provided with a vacuum-tight vacuum chamber TM; a vacuum lock chamber VL1 and VL2 having a preliminary chamber; and a process chamber PM having a substrate processing chamber. Bu PM2; and cooling chamber CSb cs2. The vacuum lock chambers VL1, VL2, the process chambers pj, PM2, and the cooling chambers csi, CS2 are arranged in a star shape on the outer circumference of the vacuum transfer chamber TM. * The vacuum transfer chamber (10) is constructed as a load lock chamber structure that can withstand a pressure (negative pressure) below atmospheric pressure such as a vacuum state. Further, in an embodiment of the present invention, the frame system of the vacuum transfer chamber TM has a hexagonal shape in plan view, and is formed in a box shape in which both ends are closed. 097140117 7 200927623 In the vacuum transfer room TM, the person VR. The vacuum side machine VR system is provided as a true line sending means - the vacuum side robot VR system is composed of the following parts: a rotating part VR5, which is provided on the lift EV, which is freely movable, and is rotated on the side; the folding link VR2L is rotated relative to the rotation The portion VR5 is disposed freely in the horizontal plane; the cylinder m is mounted on the folding link, and the expansion and folding of the folding link VR2L is controlled by the expansion and contraction thereof; and the mechanical arm VR4 is mounted on the folding frame The link is "sliding" and slides between the wafer mounting positions on the outer side of the rotating portion VR5 and the radially outer side by the folding. In this manner, the vacuum side robot VR can move up, down, rotate, and expand and contract, and by cooperation, transfer the wafer w between the vacuum lock chambers VU, VL2, the process chambers Pm, pM2, and the cooling chamber. Further, in the advance/retract orbit of the robot arm VR4 before the vacuum lock chamber VLb VL2, the process chambers PJa, PM2, and the cooling chambers CS1 and CS2, the presence or absence of the wafer is detected for detecting whether or not the wafer w is present on the robot arm vR4 ❿. The sensors S1, S2, S3, S4, S5, and S6 are not shown on the drawing surface, and the wafer mounting portion at the front end portion of the robot arm VR4 is formed into two forks for detecting the presence or absence of the wafer. The presence or absence of the wafer w is detected by the sensors S1, S2, • S3, S4, S5, and S6. Inside the process chambers PM1 and PM2, a substrate processing chamber for imparting a value to the wafer W by, for example, film formation by chemical vapor deposition (CVD) is formed. 097140117 g 200927623 Further, in the process chamber PM, the PM2 includes a mass flow controller (MFC), which is supplied to a gas introduction/exhaust mechanism (not shown) and a plasma discharge mechanism (not shown). Not shown), and the flow rate of the processing gas in the process chambers PM1, PM2 is controlled; an automatic pressure controller (APC) 12 controls the pressure in the process chambers PM1, PM2; the temperature regulator 13 , which controls the temperature in the process chambers PM1, PM2;

The input/output valve 1/014 or the like is used to control the supply of the process gas and the opening/closing of the exhaust valve. The inside of the vacuum lock chamber VL VL2 is used as a preliminary chamber for carrying the wafer w into the vacuum transfer chamber TM, or as a preparation chamber for carrying out the wafer w from the top of the vacuum transfer chamber. In the vacuum lock chambers Vu, VL2, a buffer lamp 丨, a lamp 2 is provided to temporarily support the wafer W. The insides of the vacuum lock chambers VU and VL2 communicate with the vacuum transfer f TM via the ports 、 and (2), respectively, and are connected to the U1 by the following atmospheres by _G3 and G4. Therefore, in the state of _Q and (2), the vacuum airtight vacuum in the vacuum transfer chamber TM is maintained, and the two open chambers VL1 and VL2 are transferred to each other. The exhaust gas is configured to absorb the exhaust chamber in order to withstand the negative pressure of the atmospheric pressure, such as a vacuum state. Therefore, in the closing of the door, vacuum can be applied to the respective interiors. # Close _G3, G4 to the vacuum clock ντ〇G3 *; ^" VL1 'VL2 " 1 (7), G4, thereby maintaining the vacuum 097140117 9 200927623, The VL2 and the vacuum chamber in the vacuum transfer chamber TM are in a state of π ^ liter, and the wafer boundary is transferred between the vacuum lock chamber VL1 and the chamber ΤΜ. The cold chambers CS1, CS2 have a function of storing and cooling the wafer w. The cooling chambers CS1 and CS2 are also evacuated to the inside. (b) The composition of the atmosphere side. On the other hand, as described above, the atmosphere transfer chamber lm connected to the vacuum lock chamber and VL2 is provided on the atmosphere side of the cluster-type semi-conductor.

装 The scales Lpi to Lp3 of the substrate Up are placed on the substrate storage container (hereinafter referred to as "dummy containers (pod) PD1 to PD3) connected to the atmospheric transfer chamber LM 〇 - transported to the LM in the atmosphere" Although not shown, a clean air unit that supplies clean air to the inside of the LM is provided. In the large transport room LM, an atmospheric side robot is set up as an atmospheric transport means. At the atmospheric side robot, the wafer w is transferred between the vacuum lock chambers vu and VL2 and the loaders LP1 to LP3. The atmospheric side robot AR is also configured in the same manner as the vacuum side robot VR. Further, at the predetermined position (for example, in the vicinity of the gate valve) before the atmospheric transfer chamber LM, the wafer presence detecting sensor S7 and 兕 are similarly provided, and the wafer presence detecting sensor S7 is used as follows, S8, it is possible to detect whether or not the wafer w is placed on the wafer mounting portion at the front end portion of the robot arm VR4, that is, whether or not the wafer is detected. Further, in the atmospheric transfer chamber U, an orientation flat aligning device 〇FA is provided as a substrate position correcting device for aligning the crystal orientation of the wafer 097140117 10 200927623 w. Each of the loading cassettes LP1 to LP3 is provided with an English container PD1 to PD3 (not shown) capable of storing a plurality of wafers. (c) Configuration of control means Each component of the cluster-type semiconductor manufacturing apparatus is controlled by a control means. In Fig. 3, the configuration example of the control means (10) is shown. The control means book has: ❹ collective control controller 9 〇; process room controller PMC 隐 2, and operation unit 1 〇 these are interchangeable by LAN (Local Area Network) line 80 The way the data is connected. The collective steering controller 90 is connected to the vacuum side robot VR, the atmospheric side robot gate valves G1 to G4, the vacuum lock chambers VU and VL2, the vacuum exhaust system, and the large rolling introduction system. Further, the overall operation controller 9 controls the operation of the vacuum side robot VR and the atmospheric side robot, the opening and closing of the gate valve, the vacuum exhaust system inside the vacuum lock chambers VU and VL2, and the operation of the air introduction system. The clothing spears controllers PMC1 and PMC2 are respectively connected to the MFC11, the automatic pressure controller (APC) 12, the temperature regulator 13, and the -1/014, which are provided in the process chambers pm and pM2. Further, the process chamber controllers PMC1 and PMC2 control the operations of the following mechanisms: gas introduction/exhaust mechanism to the process chamber PMb, PM2, temperature control, plasma discharge mechanism, and cooling mechanism of the cooling chambers csi and CS2. The operation unit 100 is responsible for the display of the system control command, the display of the monitor, and the recording and input of the recording data, such as the 097140117 11 200927623 logging data, alarm analysis, and parameter editing. (1-2) Configuration of a linear semiconductor manufacturing apparatus Next, Fig. 2 shows an example of the configuration of a linear semiconductor manufacturing apparatus according to an embodiment of the present invention. The linear semiconductor manufacturing apparatus is also divided into a vacuum side and an atmosphere side. (a) Configuration on the vacuum side The vacuum side of the linear semiconductor manufacturing apparatus is provided with two substrates in parallel. The rational module MD1 and the rib 2 are provided. The substrate processing module MD1 is provided with a process chamber pM1 equipped with a linearly connectable vacuum-tight substrate processing chamber, and a vacuum lock chamber VL1' equipped with a pre-chambered airtight chamber. Similarly to the MD1, the substrate processing module MD2 includes a process chamber PM2 and a vacuum lock chamber. In the same manner as in the case of the cluster-type semiconductor manufacturing apparatus, the inside of the process chambers pM1 and pM2 has a function as a substrate processing chamber for imparting a mussel value to the wafer w by, for example, film formation by chemical reaction (CVD). Further, the process chambers PM1, PM2 are provided with: a mass quantity controller (MFC) 11 for a gas introduction/exhaust mechanism, a temperature control/plasma discharge mechanism, and a flow rate of a process gas supplied into the process chambers pM and pM2. Controlled; an automatic pressure controller (Apc) 12 that controls the pressure in the process chambers ρ, 'PM2; a temperature regulator 13 that controls the temperature in the process chamber pm PM2; and an input and output valve 1 /014, etc., which is used to control the opening and closing of the supply of the process gas and the valve for exhaust. The vacuum lock chambers VU and VL2 have a function as a preparation chamber for loading the wafer w into the process chambers PM1 and pM2, or a spare chamber of the 097140117 12 200927623 in which the wafers are carried out in the self-contained chambers PM and PM2. In the vacuum lock chambers VL1, VL2, vacuum side robots VR1, VR2 are provided as the second substrate transfer device. The vacuum side robots VR1, VR2 can transfer the wafer W between the process chamber PM1 and the vacuum lock chamber VL1, and between the process chamber PM2 and the vacuum lock chamber % VL2, respectively. Further, in the vacuum side robot VR, a robot arm VR4 having a substrate placing portion is provided. Further, in the vacuum lock chambers VL1, VL2, a multi-stage platform capable of holding the wafer W, for example, a platform of the upper and lower stages, is provided. Further, a device is provided which holds the wafer w' on the buffer stages LSI and LS2 in the upper stage and cools the wafer w on the lower stage cooling stages CS1, CS2. The vacuum lock chambers VU and VL2 communicate with the process chambers PM1 and PM2 via the gate valves G1 and G2, respectively, and communicate with the atmospheric transfer chamber LM described below via the gate valves G3 and G4, respectively. ❹ Therefore, by opening the leisure (2) and G4 mu in a state where the gate valve G and G2 are always closed, it is possible to maintain the vacuum and airtightness in the process room coffee and coffee, and between the process room and the process room _(10). The wafer w is transferred between the vacuum lock chamber VL2 and the controller to the PMC2. The pressure chambers VL1 and VL2 are configured to withstand atmospheric conditions such as a vacuum state. /, _ plus the age of the structure, (4) can be vacuumed (4), therefore, the gate valve G3, G4 is closed to the true * collar a - to the true * row % lock up to VL1, VL2 internal counter-tracking I After the aligning, the gate valve G1 is opened, whereby the wafer w can be transferred between the vacuum lock chambers VL1 and VL2 and the atmospheric transfer chamber LM while maintaining the vacuum in the process chamber pm, 097140117 200927623 PM2. Further, the vacuum side robot VR VR2 is provided with a rotation position as needed, a thief detector (not shown), and a cylinder stroke system H (not shown), wherein the rotation position detecting sensor is used. The rotational position of the rotating portion VR5 is detected, and the gas red stroke sensor detects the position of the wafer mounting portion at the front end portion of the robot arm VR4 according to the expansion and contraction stroke of the cylinder VR3, and the 'in the lift ❹EVJi' is provided with a heart test_ The lifting position detection sensor of the position of the rising material. The lift position detecting sensor detects the height of the lift EV by a height position detecting sensor (not shown), thereby detecting the position of the final wafer placing portion. (b) The configuration of the atmosphere side is as described above. 'On the atmospheric side of the linear semiconductor manufacturing apparatus, the atmospheric transfer chamber lm connected to the real lock chambers vu and VL2, and the load 埠LP as the substrate storage cassette are provided. The LP 2 is provided with a substrate storage container (hereinafter referred to as a pod container, 2) connected to the atmospheric transfer chamber. In the atmospheric transfer chamber LM, an atmospheric side robot AR' is provided which can transfer the wafer evaluation between the vacuum lock chambers vu, VL2 and the load ports LPi, Lp2. Further, the atmospheric side robot AR is provided with a robot arm as a substrate placing portion. Further, in the atmospheric transfer chamber LM, an aligner unit AU as a substrate position correcting device is provided, which can correct the offset of the wafer w during the transfer to make the notch and the fixed direction of the wafer 097140117 200927623 Consistent notch alignment. Each of the loading cassettes LP1, LP2 can have pod containers PD1, PD2 (not shown) for storing a plurality of wafers w, respectively. (c) Configuration of control means Each component of the linear semiconductor manufacturing apparatus is controlled by a control means CNJ. In Fig. 3, a configuration example of the control means CNT is shown. The control means [Ντ: ❹ 操纵 操纵 操纵 操纵 ; ; ; ; ; ; ; ; ; ; ; ; ; 操纵 操纵 操纵 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The collective steering controller 90 is connected to the vacuum side robots vri, 2, the atmosphere side robot AR, the gate valves G1 to G4, and the vacuum lock chambers vu, VL2, respectively. Further, the overall steering controller 9 controls the operation of the vacuum side robot VR and the atmospheric side robot AR, the switching operation of the gates G1 to G4, and the exhaust operation inside the vacuum lock chambers vli and VL2. The process chamber controllers PMCl and PMC2 are respectively connected to the MFC 11, the automatic pressure controller (apc) 12, the temperature regulator 13, and the 1/014, which are provided in the process chambers PM1 and PM2. Moreover, the process chamber controller ΡΜΠ, PMC2 controls the following mechanisms - each action: introduction of gas into the process chambers PM1, ΡΜ 2, exhaust mechanism; temperature control / plasma discharge mechanism; and cooling mechanism of the cooling chambers CS1, CS2, etc. . The operation unit 100 is responsible for the display of the system control command, the display of the monitor, the recording of the data, the analysis of the alarm, and the editing of the parameters. 097140117 15 200927623 (2) Outline of the automatic transfer processing (transfer processing of the substrate) The outline of the 0-day automatic transfer processing by the above-mentioned bundle (four) semi-conductive hard-working device will be described with reference to ϋ 1 '. Further, the operation of each part of the semiconductor manufacturing apparatus will be described below by the control means CNT. (2-1) Mounting on the pod container on the loading cassette First, the gate valve Gb G4 is closed and the gate valves G2 and G3 are opened. Next, it is judged whether or not the opening and closing of the closing doors G2 and G3 are normal. When the judgment result is normal, the vacuum transfer chamber TM, the process chamber MN, the PM 2, and the cooling chambers (3), (10) are evacuated. Further, clean air is supplied into the atmospheric transfer chamber LM so as to be substantially atmospheric. Thereafter, a smiley container PD1 (not shown) in which a plurality of unprocessed wafers w are stored is placed on the loading cassette [pi]. (2-2) Transfer to the atmospheric transfer chamber, and the wafer w stored in the substrate position P1 of the British β-type container pm placed on the loading cassette m is transferred to the atmosphere by the atmospheric side robot AR. Transfer to the LM's and place the button on the substrate position P2 on the orientation plane to the money (4) to perform the alignment of the crystal orientation. (2-3) Transfer to the vacuum lock chamber Next, the wafer W placed on the substrate position p2 is picked up by the atmosphere side robot AR, transferred to the vacuum lock chamber VL1, and placed on the buffer stage Substrate position P3. Thereafter, the gate valve G3 is closed to evacuate the inside of the vacuum lock chamber. 097140117 16 200927623 (2-4) Transportation to the process chamber After depressurizing the vacuum lock chamber VL1 to a predetermined pressure, the gate valve G1 is opened while the gate valve G3 is always closed. Next, the vacuum side robot VR1 picks up the wafer w placed on the substrate position P3, transports it into the process chamber PM1, and mounts it on the substrate position P4. Then, a processing gas ' is supplied into the process chamber PM1 to perform a predetermined process on the wafer W. (2-5) Transfer to the cooling chamber ❹ When the processing of the wafer w in the process chamber PM1 is completed, the vacuum side robot VR picks up the wafer W that has been processed at the substrate position p4 and transports it to the wafer W. In the room CS1, it is disposed at the substrate position P5. —— (2-6) Transfer to the vacuum lock chamber

After the cooling process in the cooling chamber CS1 is completed, the vacuum side robot VR picks up the wafer w that has been processed at the substrate position P5, transfers it to the vacuum lock chamber VL2, and arranges it on the buffer table ST2. The substrate position is p6 ❹. Thereafter, the gate valve G2 is closed, and clean gas is supplied into the vacuum lock chamber VL2 to return the inside of the vacuum lock chamber VL2 to substantially atmospheric pressure, and the gate valve G4 is opened. (2-7) The storage of the pod container placed on the loading cassette is followed by the process of picking up the crystals disposed on the substrate position p2 by the atmospheric side robot AR, and transporting the crystals to the loading solution (10). The upper smile container PD3 (not shown) is housed in the empty space. After that, the above process is repeated, and after the automatic transfer processing is performed on all the unprocessed wafers w, the self-loading cake LP3t (four) stores the processed (four)w smiley 097140117 17 200927623 谷斋 PD3' and completes the automatic transfer processing. (3) Fig. 5 shows an example of the wafer vacuum transfer program of the present invention. In the present embodiment, the vacuum transfer program is a step (2_3) to (2_6) of the portion of the automatic transfer program. As the upper wafer W, the material line is transported. This can be carried out by the transfer control means CNT. As shown in Fig. 5, the vacuum transfer program of the present embodiment sequentially determines the pressure determination program Sq of the chamber, and the transfer destination gate valve opening program: the round take-out program Sq3, the presence or absence of the wafer, and the wafer take-out path c. , wafer transfer wafer presence confirmation program 铋, and transfer destination gate _ When an error occurs in each program and an alarm is generated, the service module is temporarily interrupted and the repair process is selected by the maintenance personnel. , Find and deal with the system heart # (4) Wei line becomes the wrong program and rely on ^ No to make the error recovery process, and the abnormal end process _ to end the real miscellaneous delivery program when it is estimated that it is impossible to recover the error, and can implement maintenance deal with. Furthermore, the number of times of reduction can be sent to the maintenance staff for judgment, and the number of times can be specified in advance. θ 士以下以下' Refer to Fig. 6 to Fig. ' for each program shown by circle 5, such as ~ Qiu. Furthermore, the vacuum transfer program has a program for transferring the wafer cassette between the vacuum lock and the process to the PM1, and in addition, transferring the wafer between the other Y solid vacuum lock chamber VL2 and the cooling chamber (10). The procedure of 097140117 200927623, and the process of transferring the wafer W between one process module VL1 and the cooling chamber CS1, and another process module VL2 and the cooling chamber CS1, etc., are in parallel according to the established transport rhythm. In the present embodiment, in the present embodiment, only the origin of the transfer, the transfer destination, or the transfer order are reversed. In the present embodiment, the vacuum transfer procedure between the vacuum lock chamber VL1 and the process chamber PM1 will be described, and the description of other programs will be omitted. (3-1) Pressure Judgment Procedure (Sqi) of Vacuum Locking Chamber ❹ Fig. 6 shows an example of the pressure judging program Sqi of the vacuum lock chamber. Is the program Sql to transport the wafer W from the vacuum lock chamber VL1 to the vacuum transfer to the TM? Use the procedure to confirm whether the pressure of the vacuum lock chamber hole 1 is equal to the pressure of the vacuum transfer chamber TM. In the program Sqi, first, a pressure sensor that detects the pressure of the vacuum lock chamber vu, that is, a pressure detection value of the vacuum gauge PZ and a set pressure value (step si) are read, and the person determines whether the pressure of the vacuum gauge pz is detected. Equivalent to the set pressure (step transfer. ❹ Μ When the judgment result is N0, it becomes an error, and a message is generated. When an alarm is generated, the vacuum transfer program is temporarily interrupted (step S3), and then an alarm display as an error result is transmitted. The monitor is displayed on the operation picture-surface (step S4). By this, the result of the alarm is notified to the maintenance person. - For example, as shown in FIG. 4, the alarm display is caused by the error content indicating the cause of the riding report. The error data and the error handling button for error handling constitute 'error data is at least composed of the specific alarm category or content. In the picture, the error content, fine (error code), 097140117 200927623 Displaying the oyster period in time _ constituting the error: #料之例, in addition to this, it can also make supplementary information (such as dimension) for special errors or catching errors. Detailed instructions for protection) Ο In the Error Handling button, the “Retry” button and the “Force End” button are displayed. Retry the button to retry the process, that is, to execute the program that is the cause of the error again. The "Forced End" button is used to stop the vacuum transfer process. The threat is terminated by the charm search sequence. 4. If the step is S5, if you select "Retry", then execute the action. , that is, the procedure of the following steps to become the cause of the error. ^ Vacuum lock chamber VL1's diligent judgment program Lang, as the wrong action, true-action or ❹ atmosphere introduction / good, and vacuum lock chamber VL1 vacuum system The sealing of the large rolling introduction system is poor. ❹ When the handling of the stolen smuggling is carried out, the error caused by the temporary movement of the pz or the fresh means cnt will be restored, and other errors will be repeated in several times. After the processing, it is restored. Therefore, it is judged whether it is necessary to carry out the maintenance. U is correctly executed 2 and the retry processing is performed. When the error is recovered, the member (4) is considered to be difficult to repair, and in step S5, the employee is in the step S5. Choose "strong" "End of system" button. In the case of / abnormal maintenance, the abnormality of the transfer program ends. 2 = When the abnormal end is completed, (4) + - After the Bellow 1 enters the maintenance. 971_ , a mistakes such as diligence and true π turn , inter-room G3, 20 200927623 Vacuum exhaust system or atmospheric introduction of exhaust system malfunction or poor sealing 'Slightly mistakes that can be recovered by retry processing, such as temporary malfunction of vacuum gauge, are excluded from maintenance Even when maintenance is performed, the cause of the error has been limited, so the maintenance time is shortened compared to the previous one, and the repair time of the system becomes shorter. Ο ❹ When YES in step S2 and when the error has been restored' Since the detected pressure value is equal to the set pressure value, the routine Sqi ends normally and proceeds to the next transfer destination gate opening procedure Sq2. (3 - 2) Transfer destination gate valve opening procedure (s q 2 ) Fig. 7 shows an example of the transport destination/four valve opening procedure Sq2. This program Sq2 is a program for opening the gate valve G5 of the process chamber PM1 to transport the wafer W to the transfer destination, in this case, the process chamber mi. In the program Sq2, first, the gate valve G5 of the process chamber (10), which is the transfer destination of the wafer W, is opened (step S6), and the on/off sensor that turns on and off the gate valve is detected to be turned on and off. Whether or not the G5 is turned on (step phantom): In the judgment of the step S7, when the judgment result is (10), that is, when the opening and closing sensor is turned off, the program Sq2 becomes an error, and a message is generated. When the alarm is generated, the vacuum transfer program is temporarily interrupted (step S8), and the alarm display is displayed on the operation surface D1 of the monitor (step: 'waiting for the maintenanceman's instruction. Fine_selecting 'retry') In the step s (8), the retry processing is performed again to perform the procedure of the error 邡 邡 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 097 1* detector

As the cause of the error, the example of the ancient rQ barrier, the control of the hand-reading axis ♦ malfunction or the position of the installation position of the kiss. The wafer W can be carried in between the system, the failure, or when the gate valve G3 is opened. - a vacuum lock chamber VL1

= When the = retry "error wire recovery" or when the estimated material recovery is possible, select "forced end" on the operation surface D1 and press the abnormal end processing of the vacuum transfer program (step sio). Order 1 T at 5 = send program _ bundle 'implementation to maintain the error recovery. In the case of an error, in addition to the error that can be recovered by the retry process or a malfunction of 1 ,, the mounting position offset of the open detector is 3*, and the operation of the actuation circuit of the gate valve G3 is defective. More: = Confirmation and correction of the installation position of the open/close sensor or _G3 check 4 or replacement. (3-3) Wafer Fetching Procedure (Sq3) FIG. 8 shows an example of the wafer fetching program Sq3. 097140117 The process of the m-wheel crystal „self-transmission _ chick vacuum transfer, the process of transferring the wafer Vf to the wafer 22 in the process chamber 22 200927623 PM1 from the vacuum lock chamber VL1. In the program Sq3, first, let the elevator Ev The raising/lowering position of the vacuum side machine AVR is adjusted to the wafer double take-out position (step S11). Thereafter, the lifting position detection detector of the elevator EV lifting position is detected (not shown) The detection value of :) is compared with the stabilization, thereby determining whether the height of the elevator ev is the wafer take-out position (step S12). ❹ ❹ When the determination result is NG, an error is generated and an alarm is generated. The vacuum transfer program is temporarily interrupted (step S13), and the alarm display is displayed on the operation surface D1 of the monitor (step su). = the cause of the error is 'there is no mechanical or electrical failure of the lift Ev, or the check It is estimated that the temporary riding of H, the temporary misoperation of control means (10) =, the fault or the offset of the installation position. S(5)n重4", if necessary, error handling and error confirmation (step ^^^^ The second execution becomes the wrong step, such as the mistake of the mistake. 'Zhexiang, such as the lift EV, the wrong furnace, the PW, the temporary malfunction, or the temporary position sensor, the temporary installation of the tester, or the lifting position. When the content or item of the retry process is executed or the error is restored, or when it is estimated that the error cannot be recovered from the alarm display 097140117, select "_End" on the operation page 23 200927623 D1. After the end of the collision, the sling of the vacuum transfer program is executed (step S15). When the delivery is performed, the maintenance is performed by mistake, and the maintenance of the erroneous recovery is performed. The CNT of the elevator EV is malfunctioning and the control is controlled. In addition to the malfunction of the malfunction or the temporary malfunction of the lift position sensor, for example, the riJ/machine age change series, or the fault detection of the sense of nucleus or the offset of the mounting position, etc. Repair or find, confirm the installation position of the sensor or correct the position of the money. When the judgment result is normal, proceed to step / ... to rotate the suspected part VR5 from the starting position to the wafer take-out position (not shown) The detected rotation angle of the rotation portion VR5 detected by the sensor W is detected by the rotational position of the rotation portion VR5: = by which the rotation angle of the rotation portion TM is determined (step S17). Field step S17 If it is judged as (10), an error is generated and an alarm is generated. When the alarm is generated, the vacuum transfer processing is temporarily interrupted (step (10)), and the alarm display is displayed on the operation surface D1 (step S19). ', as the cause of the error, For example, there is a screwing detection sense control means limit shaft, a sample sensor fault or a position offset, etc. (4) Position inspection 097140117 24 200927623 Thereafter, if the maintenanceman operates the screen Di =:, retry the processing 're-money line It becomes the error original:::: As a temporary error that is recovered by the retry processing, there is no temporary malfunction of the temporary operation and control means (10) of the red-turn position detecting sensor. When the "abnormal tuberculosis of the forced sequence is selected in step S20", the "stop operation" is executed. 时 At the end of the program f, the maintenance for recovering the error is performed. ..., the cause of the error is not the failure of the rotating part VR5, the home position of the rotating position detector or the light offset, etc., for riding protection, repair or replacement of the hiking rotation part, replacement or mounting position of the rotary position detecting sensor Corrected. When the judgment result of the step sn is YES or the error recovery has been performed by the retry processing, the next step S21 is automatically executed. In step S21, in order to detect whether or not the wafer W is placed, the cylinder VR3 of the vacuum side machine two R is extended from the initial position to the wafer presence detecting position. After the extension of the field cylinder VR3 is completed, the detection value of the gas red stroke sensor for detecting the expansion and contraction position of the cylinder VR3 is compared with the set value, thereby determining the wafer loading portion of the front end portion of the robot arm VR4. Whether it is extended to the presence or absence of the detection position of the wafer for detecting the presence or absence of the wafer w (step S22). When the judgment result is NO, an error is generated and an alarm is generated. When an alarm is generated, the vacuum transfer program is temporarily stopped (step S23), and an alarm display is displayed on the face D1 of the pants 097140117 200927623 (step S24). As an error, 'exemplary is a malfunction of the cylinder VR3, a mechanism for expanding and contracting, a circuit failure, a displacement of the mounting position of the cylinder VR3, a sense of stroke, a temporary malfunction of the measurement & Temporary malfunction of the shift and control means CNT. If the "Retry" button is selected on the operation screen D1 to perform error processing (step S25)', the retry processing is executed, that is, the processing which becomes the cause of the error is executed. As an error that can be recovered by the retrying process, there are, for example, (4) means, temporary malfunction, temporary malfunction of the gas red stroke sensor, etc., and the error other than the honor is sometimes retried repeatedly. After the error is restored. Select "age" on the operation screen di even if _ "retry" touches the lion "retry" processing and cannot recover the error, or when it is estimated that the error cannot be recovered from the contents of the alarm display or the item name. "M-beam" button (step ❹ ' 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 执行 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于 于Offset of VR3 installation position, failure of cylinder stroke reducer or installation position shift, etc., as maintenance, the replacement or repair of the gas VR3, the position of the women's position or the cylinder VR3 of the gas rainbow stroke sensor Correction of the mounting position. When the result of the determination in step S22 is YES, or the error 097140117 26 200927623 is erroneously restored by the retry processing, the processing is normally ended, and the process proceeds to the next step S26. In step S26, the use of the crystal Whether or not the sensor S1 is detected by the circle, and the wafer presence/reception sensor S5 is turned on or off to confirm that the vacuum side robot is on the wafer mounting portion at the front end of the robot arm VR4. Whether or not the wafer w is placed. When the judgment of the step S26 is that the wafer presence detecting sensor is broken, the wafer is not placed on the wafer mounting portion at the front end portion of the robot arm VR4 [ Therefore, the crystal can be taken out from the buffer stage STi of the vacuum lock chamber VL1. When the judgment of step S26 is N0, an error is generated and an alarm is generated. As a cause of the error, the presence or absence of the wafer detecting sensor % is exemplified. Misoperation, malfunction or offset of the mounting position, temporary malfunction of the control means (10), malfunction of the cylinder VR3, temporary malfunction of the gas red stroke sensor, malfunction or positional displacement of the mounting position, etc. / . The vacuum transfer program is temporarily interrupted, and the alarm display is not displayed on the operation screen D1. After that, if the "Retry" button is selected on the operation screen D1, the retry process is executed, and the error is repeatedly executed again. The procedure below step S26. By using the retry processing, the error caused by the temporary malfunction can be eliminated. It is impossible to make an estimate at the time of the _ _ no error, or from the content or item of the error. When the error is restored, the "Forced community button is selected, and the abnormal completion of the processing of the transfer program is completed." In this case, as an error, the operation of the crystal-free sensor is suppressed, and the malfunction of VR3 is suppressed. Fault or positional deviation of the cylinder stroke controller 097140117 27 200927623 Move, etc. As the dimension 4' system, the wafer has a sense of detection (4) (10) replacement or installation 4 = offset correction, gas red VR3 repair or replacement. = step S26 When it is judged as YES or the error is restored by the retry processing, the process proceeds to step S30.

2 steps S3G + 'make the gas red VR3 further extend from the wafer presence detection position to the front wafer removal position, and secondly, compare the detection value of the two-way sensory position of Wei Hong vr3 wire position with the mosquito value. By turning off the mechanical arm end. Whether the crystal m placement mismatch is located at the wafer removal position (step is satisfied. When the judgment result is (4), the error is generated as an error surface. 乍 is the wrong phase. Example 7F has the operation of the cylinder VR3, so that the cylinder VR3 is extended. = abnormality of the mechanism or circuit), offset of the mounting position of the cylinder VR3, or temporary misoperation of the cylinder stroke sensor of the cylinder VR3 expansion or the displacement of the mounting position, and temporary malfunction of the control means CNT. When the s report is generated, the vacuum transfer program is temporarily interrupted (step S32), and an alarm display is displayed on the operation screen D1 (step s33). Next, if the "Retry" button is selected on the operation screen D1 (step S34), the retry process is executed. When the error is still restored by the re-processing, or if the error is restored by the retry, the error is selected on the operation screen D1 (step S34) 'execute the transfer. The abnormal end of the abnormal processing is terminated, and maintenance is performed thereafter. 097140117 28 200927623 For such a cause of the error, the malfunction of the cylinder VR3, the displacement of the mounting position of the cylinder VR3, or the displacement of the cylinder stroke sensor for detecting the expansion and contraction of the cylinder or the offset of the mounting position are exemplified. When an alarm is generated, the vacuum transfer program is temporarily interrupted (step S32), and an alarm display is displayed on the operation screen D1 (step S33). Then, if the "Retry" button is selected on the operation face D1 (step s34), the retry process is executed. ❹ ❹ Correction of cylinder stroke sensor replacement, cylinder repair or replacement, and installation of cylinder stroke sensor and cylinder VR3 (4). When the judgment of the step is (4), the wafer W can be taken out by the b-mounting portion of the distal end portion of the robot arm, and the process proceeds to step S35. In the step Na, the height of the lift EV is raised to the removal position of the crystal (4), and the wafer We are taken out by the wafer mounting portion at the front end of the arm leg. The lifting position detection sensor == fixed value is compared to determine the lifting of the elevator ev: 疋 No is the removal position of the sun circle w. When the judgment result is NG, an error is generated and an alarm is generated. The cause of the error is exemplified by the malfunction of the elevator EV, the detection of the lift EV lifting position, the positional deviation, the temporary operation of the control means, and the operation of the vacuum transfer program ("S37"). The alarm display is displayed as shown above on the handle surface (step (10)). Speed 097140117 29 200927623 = 2 Select the "Retry" button on the operation panel D1 (step s3Q), and perform the following processing in step S35 which is the cause of the error. Γ 纟 _ _ Retry _ When the erroneous weaving is not possible, _ is selected as the "Forced End" button on the written D1 (step S39), and the abnormal end processing is executed. After the end of the different cranes, maintenance is performed. The cause of the error is exemplified by a malfunction or malfunction of the elevator EV, a detection of the position of the lift/down position, a malfunction, or a positional shift of the mounting position. As maintenance, the repair or replacement of the elevator EV, the replacement of the lift position detecting sensor, or the correction of the positional deviation of the mounting position are performed. When the result of the determination in the step S35 is YES or the error recovery has been performed by the retry processing, the wafer fetching program is normally ended, and the lower detection and wafer fetching program Sq4 is entered. Ηθ (3-4) wafer presence detection and wafer removal program (sq4) ❹ Figure 9 shows an example of wafer presence detection and wafer removal program Sq4. This program Sq4 is a program for taking out the wafer $ placed on the substrate holding portion of the robot arm VR4 from the vacuum lock chamber VL1 to the vacuum transfer chamber tm. First, the cylinder VR3 is contracted to the wafer detecting position (step: $40), and the potted paper detects whether the cylinder v lang is contracted to the wafer detecting position by the wafer presence detecting sensor S1 being turned on or off (step S41). . In this case, it is judged that the burial is performed by comparing the detected value of the cylinder stroke sensor with the set value, and when the determination result is NO, that is, when the wafer w cannot be detected, the error is 097140117 30 200927623 and an alarm is generated. . The vacuum transfer program is temporarily interrupted (step S42), and an alarm display is displayed on the operation (step S43). The bias = the cause of the error 'examples are not the fault of the gas rainbow, the installation position of the cylinder TM (10), the temporary control (f), the control means f, the temporary malfunction of the cylinder stroke sensor, the fault, or the positional deviation Move and so on. Select "Retry" on the β material operation surface to perform error processing (step f 44). Retry processing again. 'Re-execute the steps that become the cause of the error. Measure the following processing & Use the retry (4) When the error is restored, or if the error cannot be recovered by the retry processing based on the item name or content displayed by the error, select "Forced End" on the operation screen D1 and press the red button (step 4). After the forced end, maintenance is performed. © As a remedy, the cylinder TM is repaired, the money or cylinder VR3 position offset is corrected, the cylinder stroke sensor is replaced, or the cylinder stroke sensor position offset is corrected. When the judgment result of the step is yES, or if the error has been recovered by the retry processing, the process proceeds to the next step S45. In step S45, it is confirmed whether or not the wafer W is present by turning on or off the wafer presence detecting sensor & When the judgment result is N0, an error is generated and an alarm is generated. 097140117 31 200927623 When the operator's finger generates an alarm, 'temporarily interrupts the vacuum transfer program (step S46), the screen D1 shows the alarm age (step S4?), *waits to repair the TJx ° as the cause of the error, Whether the wafer has a detection sensor & == position offset, gas TM is bad, temporary malfunction of the second heart, fault or positional shift, temporary misoperation of the control section W, and the like. Person/Fruction ❹ If the repair button is selected on the operation panel D1 and the "Retry" button is selected (step (10)), the processing below step S45, which is the cause of the error, is executed again. Retry processing is used to recover when there is an error in the wafer due to the sense of detection (4) S1 or the material of Wei (4). If the error cannot be recovered even if the retry processing is performed, or if it is estimated that it is impossible to recover the error even after the retry processing, the "forced end" button is selected (step S48), and the transfer program is abnormally terminated. After the abnormal end, maintenance is performed. As a maintenance, there is a failure or positional deviation of the wafer with or without the thief test H S1 , a malfunction of the cylinder VR3, a malfunction of the cylinder stroke sensor, or a positional deviation. In this! #;兄日^·, as the cause of the error, there is a failure of the wafer detection sensor Si or the offset of the mounting position, the malfunction of the cylinder VR3, the failure of the cylinder stroke sensor or the mounting position Temporary malfunction of the shift and control means c NT. '097140117 32 200927623 When the result of the determination in step S45 is time or has been erroneously retried, the process proceeds to the next step S49. In step S49 t, the cylinder VR3 is contracted to the starting position and the wafer w 7 is returned to the starting position. In the step coffee, the detection of the gas rainbow stroke sensor is compared with the value of 6 again. Whether VR3 returns to the starting position. ❹ ❹ When the judgment result is NG, an error is generated and an alarm is generated. When an alarm is generated, the vacuum transfer program is temporarily interrupted (the alarm display is displayed on the screen D1. The malfunction occurs during the _ ^, the installation section, etc. - the fault, the _ error selects the "retry" _ and the error processing is performed ^ Then, the process of generating the error step S49 is performed again by using the 4 test and the error-free test, or = the error is not miscellaneous, and the _昼 (4) is turned up ";=;;" Abnormal processing of abnormal end.

In the case of If, for riding protection, there is little correction of the positional offset correction, the repair or replacement of the cylinder, etc., when the result of the woman’s accidental break is YES, or if the error has been rectified, then the error is set. Go to step S54. In step S54, the elevator EV is lowered to the home position. Next, the bursting 097140117 33 200927623 drop EV is the starting position of the county (step S55). In the case of the "t" condition, the judgment is made by comparing the detected value of the sensor detecting the lift position of the lift to the set value. When the judgment result is N0, an error is generated and an alarm is generated. When J is in the second alarm, 'temporarily interrupt the vacuum transfer program (step is fine), and drop the screen!) 丨上_岭报龄((4)(10). After inserting it, wait for the instructions of the maintenanceman. ❹ = ===弁 示There is a malfunction or malfunction of the lifting operation, a temporary malfunction of the lifting position detecting sensor of the detecting and lowering position, etc. The offset of the mounting position, the temporary misoperation of the control means (10), and the "retry" are selected. New for error handling and ^1 retry processing 'Execution step S54 to cause error. Program = convenient use of the processing still can not make the error recovery, or the estimation is not possible: two = wrong time in the operation On the screen D1, select "Forced End" _, Guard. Forced processing causes the transfer program to be abnormally terminated. After the abnormal end, the dimension or rm knee is used as the cause of the error, and the operation is limited to the lift, and the position is detected. The fault of the detector or the offset position of the installation position is checked as a maintenance. The repair or replacement of the lift βν, 097140117 34 200927623 Sensor replacement or correction of the installation position offset When the result of the determination in the step S55 is YES, or when the retry is performed and the error is restored, the wafer presence detection and the wafer fetching program Sq4 are ended, and the next wafer transfer program Sq5 is entered. 5) Wafer transfer program (Sq5) The figure shows an example of the wafer transfer program Sq5. The program Sq5 transfers the wafer W taken out from the vacuum lock chamber to the process chamber pM1 by the vacuum side robot VR. In the program sq5, firstly, 'the elevator EV is raised or lowered from the starting position, so that the lifting position of the vacuum VR can be adjusted to the position where the wafer W can be transferred (step S59). Detecting the detection value of the lift position detection sensor (not shown) of the lift position, and comparing it with the set value to determine whether the lift position of the lift 疋 is the transfer position of the wafer w (step coffee). When the result of the determination of the field is N0, an error is generated and an alarm is generated. When j is generated, the program "temporarily interrupts the real money delivery program (step S61), and displays an alarm display on the operation surface D1 of the monitor (step Chat). Why is it wrong? The temporary misoperation of the lift position detecting sensor is illustrated as an early or offset of the mounting position, a malfunction or malfunction of the elevator EV, etc. Λ/c -φ- -ρ. ^ Select the "Retry" button as above to select When the error recovery is performed (step S63), the retry process is executed, and the process of the error cause 097140117 35 200927623 S59 is executed again. When the error is restored by the retry process, the lift position of the elevator EV is crystallizable. The position of the circle transfer. j Even if the error is not restored by the retry process, or it is estimated that it is impossible to recover the error from the valley or the name of the alarm display, select "Dongxian" on the operation D1. Press the (4) step to execute the abnormal end processing of the forced stop. The social order ❹ ❹ 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑 骑In the maintenance, the elevator EV is repaired or replaced, and the lift/rear = wheel = detector mounting position confirmation or the ampoule position correction lifting position. If the determination result in the step S6 is normal, the process proceeds to step S64. In ^=S64, the vacuum side robot is rotated to the wafer transfer position. The position is ❹ /, the person will be placed on the rotating part, the position (step S6 = whether the rotation angle of the % turning part VR5 is the wafer transferable, and when the judgment result is N0, the job is an error and an alarm is generated. When an alarm is generated, 'Alarm interrupt is displayed on the vacuum transfer screen D1 (step is). Step _), after the acquisition, if the operation is performed, the retry process is executed, 冉(9)-reduction" (Step _, 097140117 Then, the step S64 is the cause of the error. 36 200927623. When the error cannot be recovered even with the retry processing, or when it is estimated that the error cannot be recovered, select " on the operation screen D1". Forced to end" (S68). Thereby, the abnormal end processing for ending the transport program is executed. After the vacuum transfer program is abnormally completed, it is implemented to perform error recovery. For maintenance, repair or replacement of the rotating part, replacement of the rotary position detection sensor, or correction of the mounting position. When the result of the decision in the step S65 is YES, and the error is restored after the retry processing, the process proceeds to the next step S69. In step S69, the gas red VR3 of the vacuum side robot VR is extended from the start position to the wafer presence detecting position in order to detect whether or not the wafer W' is placed on the wafer mounting portion of the robot arm VR4. When the extension of the cylinder VR3 is completed, the detected value of the cylinder stroke sensor that detects the extended position of the cylinder VR3 is compared with the set value, thereby determining whether the wafer mounting portion of the front end portion of the arm VR4 is in the presence or absence of detection. Whether or not the wafer has a detection position (step S7〇). When the judgment result is N0, an error is generated and an alarm is generated. As the error, the temporary malfunction of the cylinder stroke sensing H, the malfunction of the cylinder VR3, the shift of the cylinder VR3 stroke setting, the displacement of the cylinder stroke sensor or the displacement of the wearer's position, and the malfunction of the control means are exemplified. When an alarm is generated, the vacuum transfer program is temporarily stopped (step S71), and an alarm display (step s? 2) is displayed on the face D1 of the operation 097140117 37 200927623. : Select the "Retry" button on the operation D1 (step _), and perform the step of becoming the cause of the error. When the processing below the lake is retrying and recovering the temporary error, the processing proceeds normally. One step S74. . Not ❹ ❹ _ = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = = =

On Di, select "Strong County Bundle" to touch (step Qing, execute and make it abnormally end the process. Jin,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, When the determination of step S70 is YES, the wafer w is placed on the wafer mounting portion at the end of the machine. 4 In step S74, by wafer Whether or not the detection sensor is turned on to determine whether or not the wafer is placed on the wafer loading portion at the front end portion of the arm/when the determination result is YES, that is, when the wafer has a detection sensor that is illusory, When an alarm is generated, the vacuum transfer program is temporarily interrupted (step 昼 (4) _ 转 转 。 。 。 。 。 。 。 。 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 选择 选择 选择 选择 选择 选择 选择 选择 选择 选择 选择Execution and execution is the processing of step S74 which is the cause of the error. 097140117 38 200927623 When the error is detected by the wafer, the sensor s segment (10) ___ The trajectory control hand is immediately (4) w _ retry surface repair error. Pure law, reinstatement, or miscellaneous Can = ΐ = face bundle" according to the brown _), the abnormal processing of the strong energy beam is executed. After the abnormal end, the maintenance is carried out. Ο Γ Γ Γ ' 作为 作为 作为 作为 作为 作为 作为 作为 作为_ S1 2, 7 TM repair or replacement, wafer with or without the observer or the position of the sensor, the position of the gas VR3 red stroke sensor is set to honor. When step S74 The determination is N0, that is, the wafer step S78 is detected. ^ In step S78, 'the cylinder VR3 is further extended from the wafer presence detection position to the front wafer transfer position. In this state, the front end portion of the mechanical f side is wafer The circular mounting portion is inserted into the process chamber PM1. Secondly, the detected value of the cylinder stroke sensor at the stroke position of the cylinder VR3 is detected and compared with the set value, thereby determining the wafer mounting portion of the front end portion of the arm. Whether or not the position is the wafer transfer position (step S79) - If the result of the determination is N0, an error is generated and an alarm is generated. As a cause of the error, a malfunction of the cylinder VR3 and a gas red stroke in which the cylinder VR3 expands and contracts are detected. Temporary misoperation of the sensor Or the offset of the Annon position, etc. 097140117 39 200927623 When the alarm is generated, the vacuum transfer program is temporarily interrupted (step S80), and the alarm display is displayed on the operation surface D1 (step S81). Right (4) on the face D1 Select "Retry" to touch (step qing, then perform retry processing. When the error cannot be recovered even if the retry processing is completed, or if it is estimated that it is impossible to recover the error even if the retry processing is used, the operation D1 is operated. Select ❹: Forced to end _((4)S82), perform the end of the abnormal suspension of the miscellaneous feed, and then carry out the maintenance. As the maintenance, the replacement of the cylinder stroke sensor, the repair or replacement of the cylinder VR3, the cylinder Correction of the installation position of the stroke sensor, resetting of the cylinder stroke, and the like. The judgment of ❹. is YES, that is, the wafer at the front end of the arm VR4 is placed. When the error is caused by the malfunction when the wafer transfer position in the process chamber PM1 is at the wafer transfer position or the retry processing is performed, the process proceeds to step S83. In step S83, the material drop (four) is lowered to the position of the remaining (four) (specifically, p ' is relative to the susceptor (following the position of e_^). Secondly, the detection of the lifting position of the elevator EV is detected. If the result of the determination is NG, the result is an error and an alarm is generated. When the alarm is generated, the vacuum transfer program processing is temporarily interrupted (step S85), and the operation D1 is operated. The alarm is handled (step S86). 097140117 200927623 Right-click on the D1 side to select "Retry to execute the retry process, and the A button (step S87), and then execute again as a program under error generation. S83o is exemplified by the malfunction of the elevator EV, the malfunction of the elevator EV lift # failure, the position of the lift position of the detection drop position, the positional deviation of the thief detector, the malfunction of the control means (3), etc.

When the error has been recovered by the retry process, the wafer W is shifted (4). When the ίτ retry processing is performed, the "forced end" is selected on the operation screen W (step S87), and the abnormal end processing is executed. After the abnormal end, maintenance is performed. _ As a maintenance, perform repair or replacement of the lift, repair of the lift position detection sensor, or correction of the installation position. When the result of the determination in step S84 is "YES", the next wafer presence confirmation circuit Sq6 is entered. (3-6) Wafer presence confirmation program (Sq6) This program Sq6 detects that the wafer W is not transferred to the wafer mounting portion at the front end portion of the robot arm VR4 after the wafer W is transported to the process chamber PM1. The process of transferring the wafer world has ended normally. Comparing with the wafer presence detection and the wafer fetching program Sq4, it is understood that the difference between the start and the end of the program is only whether or not the wafer w is placed on the wafer mounting portion. Only the different points are explained. In this procedure, the premise is that after the wafer W is transferred, the wafer placement portion does not have the yen Y on the 097140117 41 200927623. Therefore, in step S45, when the wafer presence detecting sensor S1 is disconnected. When it is normal, it turns into an error and an alarm is generated. The reason for the error is the same in this example. When an alarm is generated, the vacuum transfer program is temporarily interrupted (step S46), and an alarm display is displayed on the operation surface 1)1 (S47).

When the ❹ and / are processed without returning the error, or when it is estimated that it is impossible to recover, select the "14 士 未 社 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Since the other situations are the same, the description is omitted. (3 7) Transfer destination gate valve closing procedure (Sq7) Fig. 2 shows an example of the non-transport destination gate valve closing routine Sq7. The program Sq7 is a program for processing the wafer w in the process chamber pM1 after the wafer w is transferred to the process chamber acid, which is the transfer destination. In the program, the first step is to close the process gate valve G5 (step S88), and then, by detecting the opening and closing of the opening and closing sensor of the gate valve G5, it is confirmed whether the gate valve G5 is closed ( Step S89). When you open it, it becomes an error and an alarm is generated. = The cause of the error is exemplified by the temporary malfunction of the open control means CNT of the idle G5, and the malfunction of the G5 operation. ^ 097140117 42 200927623 When the alarm is generated, the vacuum transfer procedure is temporarily interrupted (step S9〇), and An alarm display is displayed on the operation surface D1 (step S91). Thereafter, when the "Retry" button is selected on the operation screen D1, the retry process is executed, and the program of step S88 which is the cause of the error is executed again. When the error is returned to normal after the retry processing, the processing is terminated (normally terminated). When the error is not restored by the retry processing, the "Forced Crust" button is selected on the operation screen m (step S92), and the abnormal end processing for causing the transfer program to be abnormally ended is executed. -- After the forced completion of the execution, the replacement of the opening and closing sensor (not shown) of the gate G5, the correction of the mounting position, or the repair or replacement of the gate valve G5 or G6 are performed. &lt;Effect of the embodiment&gt; (1) According to the present embodiment, the recoverable error is restored by the retry process, so that unnecessary maintenance can be removed. (2) Unused maintenance can be removed because it is known whether the error has been recovered after the retry process. (3) Even if an error occurs in the retry of the retry, the retry can be used to limit the error, so the time from the occurrence of the error to the repair of the system can be shortened. (4) In the series of transporting knives, when several errors k ’ related to the same part are generated, the cause of the error can be sequentially limited according to the error relationship before and after. In this way, 097140117 43 200927623 can reduce maintenance time. (5) In the transfer program, if an error occurs, the error is recovered, so the quality of the wafer is not affected. Processing 'Incoming Lamp Error (6) Since the error is displayed according to the alarm or the processing is terminated abnormally, the retry can be omitted (7). Even if an error occurs, the transfer procedure can be continued. The knot = the error recovery, (8) ... the length of the device can improve the efficiency of the device. In addition, there is an error that can be recovered by retry processing, and the error can be limited before the maintenance of one line, so that it is possible to improve the working efficiency of the device. Working hours for parts preparation, etc. Borrowing φ and then 'in this implementation of the wealth, the following is explained for the error: the error that has been recovered by trial processing is excluded from the maintenance object: there are: the same sensor, the same device, when generated separately There is a mistake: the same, the same as the error implemented in the previous program maintenance can also be excluded from the maintenance object. In this way, since the error can be limited in sequence, the time until the pure recovery can be greatly shortened. &lt;Preferred Aspects of the Invention&gt; Hereinafter, the ideal aspect of the present invention will be described. &lt;Example 1&gt; 097140117 Actually, the substrate 1 is processed, and the substrate is processed to transport the substrate, and the substrate is transported by a plurality of programs. a second control means for controlling the transfer means by sending a program; and when the transfer means generates an error in the transfer process of the substrate, the first control hand & temporarily interrupts execution of the transfer program, and then accepts the stop processing Then, the processing will be stopped. If the retry processing is accepted, the program for the error is caused by the ship-to-ship program. [Embodiment 2] The substrate processing apparatus according to the first aspect of the invention, further comprising: a second control means for processing the above-described processing procedure by a predetermined number of steps The substrate is controlled, and when the substrate in the processing chamber is processed and the error occurs, the second control means temporarily interrupts the above-mentioned miscellaneous sequence, and if the button stops, the ride stops processing, and if the retry is accepted, the retry is accepted. If it is processed, the step of causing the error in the above processing program is executed again. &lt;Continuous Aspect 3&gt; 实施 Embodiment 3 system-type substrate processing apparatus includes: a processing chamber for processing a substrate; a transporting means for transporting the substrate; and a predetermined transporting program including a plurality of programs When the substrate is processed to control the substrate, if the second control means temporarily interrupts the execution of the processing program, the second control means temporarily interrupts the execution of the processing program. '贞彳 will stop processing, if you try to re-test the ribs, you will perform the above steps in the above processing procedure. &lt;Fourth Embodiment 4&gt; 097140117 45 200927623 Embodiment 4 is a substrate storage unit including a substrate storage container on which a plurality of substrates are housed, and an atmospheric transfer chamber that accommodates the substrate storage valley a device communicating with the atmospheric transfer chamber, wherein the inner chamber 4 is evacuated; the substrate processing chamber is in communication with the preliminary chamber, and the substrate is processed; and the atmospheric transfer means is The substrate is transported between the substrate storage container and the preparation chamber; the vacuum transfer means supplies the substrate to the substrate in the preliminary chamber and the substrate processing chamber; and the second control unit is configured by a plurality of programs. In the case where the above-mentioned step or the vacuum transfer means generates an error during the substrate transfer process, the first control means temporarily interrupts the execution of the transfer program, and accepts If the processing is stopped, the above processing will be stopped, and if the retry processing is accepted, the above transfer program will be processed again. Become the cause of the error generator. <Embodiment 5> The fifth aspect of the invention is the substrate processing apparatus according to the fourth aspect, further comprising: a second control means for following a predetermined processing procedure composed of a plurality of steps The substrate is processed for control, and when an error occurs in the substrate processing in the processing chamber, the second control means temporarily interrupts execution of the processing program, and if the processing is stopped, the processing is stopped. If the retry processing is accepted, the procedure for causing the error in the above processing program is executed again. &lt;Embodiment 6&gt; 097140117 200927623 Embodiment 6 is a substrate storage unit including a substrate storage container in which a plurality of substrates are housed, and an atmospheric transfer chamber connected to the substrate storage container a preparation chamber that communicates with the atmospheric transfer chamber and that can evacuate the inside thereof; a substrate processing chamber that communicates with the preparation chamber and processes the substrate; and an atmospheric transfer means that stores the substrate The substrate is transported between the container and the preparation chamber; the vacuum transfer means transports the substrate between the preparation chamber and the substrate processing chamber; and the i-th control means follows a predetermined transfer program composed of a plurality of programs. Controlling the operation of the atmospheric transfer means or the vacuum transfer chamber; and the second control means for processing the substrate in accordance with a predetermined processing procedure composed of a plurality of steps to control the substrate to the inside of the process If there is an error in the process, the second control means temporarily interrupts the execution of the above processing program. If the processing stops processing, the processing is stopped. If the retry processing is accepted, the procedure for causing the error in the above processing program is executed again. ® &lt;Example 7&gt; Embodiment 7 provides a substrate processing apparatus including a substrate processing apparatus that processes a substrate, a transfer means for transporting the substrate, and a plurality of programs The control means CNT for controlling the transport means by the predetermined transport procedure; and when the transport means temporarily causes an error in the substrate (wafer) transport, after the control means (10) temporarily interrupts execution of the transport program, If the processing is stopped, the processing is stopped. If the retry processing is accepted, the 097140117 47 200927623 program that causes the error in the transfer program is executed again. In the seventh aspect of the present invention, the control means is carried out, and the transfer means transfers the substrate in accordance with a predetermined transfer program composed of a plurality of programs. When there is an error in the conveyance of the substrate, it is difficult to discriminate the transmission. Thereafter, wait for the instruction to stop processing or retry the processing, if the acceptance is heavy

If the trial processing is performed, the program that caused the error will be executed again. If the processing is stopped, the transfer program will be stopped. Further, T D &lt;Embodiment 8&gt; Embodiment 8 provides a substrate processing apparatus according to Embodiment 7, wherein the retry processing can be selected in each program. Thereby, when an error occurs in all the programs constituting the transfer program, the stop processing and the retry processing are selectively executed. <Embodiment 9> A substrate processing apparatus according to the seventh aspect of the present invention provides the substrate processing apparatus of the seventh aspect, wherein the composition of the above-mentioned (four) means is "the operation of the establishment of the ancestor (the input), the above-mentioned transfer hand & When an error occurs during the substrate transfer process, the control means temporarily interrupts execution of the transfer program, and notifies the operation of the error to the operation surface to select the stop process or the weight on the operation surface. Try it out. "Through this", an error can be clearly displayed on the operation screen. If the retry processing is selected first to confirm whether it is possible to recover the error, it is preferable to select the retry processing first and then select the stop processing. In this case, if the operation is drawn 097140117 48 200927623, it is easy to maintain = display the notification including the wrong name and content, &lt;implementation 1〇&gt; πΓΓΓΓΓ熟—the county-based display method According to the transfer of the substrate, the substrate is transported to the side of the squad, and the slab is not used to move the singularity of the singularity of the singularity of the singularity of the singer, the singer, the singer, the singer, the singer, the singer The retry processing of the program that is the cause of the error is the embodiment of the processing selected by the sub-executor. The embodiment 11 provides a method of transporting the substrate processing apparatus according to the embodiment 1G, including In the selection step, the above-described stop processing and the above-described retry processing are selected in the above-described transfer process soil. In the program, &lt;Implementation 12] The embodiment 12 provides a transfer of the substrate at the substrate of the implementation of New Zealand (1): Law 'Includes a step of temporarily interrupting the occurrence of an execution error of the transfer program when the transfer means generates an error in the process of the substrate (four), so as to process or retry the operation on the above operation Step τ &lt;Other Embodiments&gt; Further, in the description of the present embodiment, when an error occurs, any one of the "repetition 097140117 49 200927623 test" button or the "_end" button is displayed. The state of waiting for selection, but when there are two vacuum lock chambers', even if there is an error, the transport rhythm can be adjusted to continue the transfer of the wafer w using another vacuum lock chamber. The substrate can be transported and processed without reducing the overall efficiency of the device. In addition, the truth of the state of the real money, when there is an abnormality in the transfer procedure, the situation of the error recovery is explained by the heavy 5 type of processing, but if the person is overly cautious, Other errors can be eliminated as well. In the present embodiment, the vacuum transfer program has been described. Of course, other programs for the atmospheric transfer material can also be used for the present invention. ❹ Here, the procedure for the recipe is illustrated in Figure 12. In Fig. 12, there is shown a process chart of a process recipe of the present invention which does not include at least the following steps: a transfer chamber or a preparation chamber for a processing chamber (process chamber.) in which a wafer w is loaded and a communication chamber. Step of adjusting the pressure difference (in the vacuum transfer chamber TM or in the vacuum lock to VL VL2) (substrate carry-in step = temperature and pressure in the processing chamber and gas flow rate supplied to the processing chamber, - control step (process The preparation step); the step of processing the wafer w in the processing chamber (process step); and the pressure difference between the wafer to be processed or the processing chamber (4) (substrate carry-out step). When the process recipe (process processing) is started, the control means (10) sequentially executes the above-mentioned 097140117 50 200927623 substrate loading step, process preparation step, process step ', and substrate carry-out step (S10G). Then, the control means CNT confirms whether the execution of each step has been performed. Normally ends (S101) 'If it has ended normally (in the case of "Yes" in 81〇1), then ❹ Confirm that the step is the last step (ie, is it (Step S102). Then, if the step of performing the end is the last step (substrate carry-out step) (in the case of "Yes" in S102), the process recipe is normally ended. When there is an error in the execution process and the "N〇J case" in (10) 1 is not completed normally, the control means CNT temporarily stops the execution of the flotation recipe (process processing) (10) 3), and displays it on the operation surface D1. The table is not erroneous - it is displayed by the alarm (5) 〇 4) 9 Then, if "Retry" is selected on the operation screen (when the branch in "10) 5 is "retry"), the control means CNT is executed again (retry) Generate the steps to have this error. Next, if the temporary error is restored by the retry process, the process normally ends the next step of f. When entering the north, it is convenient to try to make a mistake, or when it is estimated that it is impossible to recover the error based on the content of the alarm or the name of the item, select "Forced End" button (10) in the operation screen m to branch to "forced end" The means for performing the maintenance of the substrate processing apparatus is performed by the operator after the end of the abnormal end of the process recipe is completed. In the present embodiment, the processing efficiency is improved, for example, as (four) ash = centering (required for the process recipe: constituting 097140117 is an important issue. In contrast, in the substrate processing apparatus of the present embodiment, 200927623 When the shawl is executed in each step, the wrong lion is not normal. It can also be retried to produce the wrong step if necessary. It is not necessary to make the clock = repair judgment waiting time. There is also a case where the step can be normally ended after the error is quickly restored by the retry of "Valley", so that the substrate processing apparatus of the present embodiment can be retracted by performing a retry. The time required for the recipe, so that the processing efficiency of the basic processing device can be raised. ❿ It is judged by the maintenance staff whether or not the retrying station is implemented in the above-mentioned transfer program or processing program...: In the application of the present invention, In this way, the control means of the repairer retry process can be judged. In the control means of the application of the present invention, the judgment means for judging the implementation of the retry can be provided. However, in the present embodiment, it is necessary to have the error for execution and the error generated. Corresponding to the retry processing rule, for example, it is the secret of the error and the re-processing of the retry processing corresponding to the erroneous correction. The error normalization table is stored in advance in the memory part of the application of the present invention. The above-described control means is determined by the method of performing the re-processing once an error occurs during the execution of the transfer program (or the processing program). After re-trying the treatment of her 'county_ mosquitoes, the traces are abnormally over. In addition, the second-step 'dumping procedure of the per-trial retry processing or the execution of the processing program can be changed. When a retry process is performed with some errors, the information is notified to the service person, so as to seek to increase the device work rate. That is, the maintenance personnel are notified by the maintenance of the error and the retry process is performed. Prepare, so that there can be a ship (10) 097140117 52 200927623 anomaly, seeking to increase the operating rate of the device. Also, 'on the ship, the material manufacturing device as a wire processing device - for example, but not limited to semiconductor manufacturing The device can also be used for processing a glass substrate such as an LCD (Liqiud-Crystal display) device. Moreover, the specific content of the substrate processing is not limited, and it is not only a film forming process but also an annealing process. Processing such as treatment, oxidation treatment, nitridation treatment, diffusion treatment, etc. ❹ Also, the film formation treatment may be, for example, formation of CVD (Chemical Vap〇r

Deposition 'chemical vapor deposition, excitation (10) plus Vapor D-print osi.ton 'physical vapor deposition), oxide film, agrochemical film treatment, and treatment to form a metal-containing film. Further, in the present embodiment, an embodiment applied to a one-piece substrate processing apparatus has been described. However, it is used not only for a vertical substrate processing apparatus but also a group substrate processing apparatus, and for other substrate processing (exposure apparatus, micro The shadow device, the enamel coating device, and the like can also be used in the same manner. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a configuration of a cluster-type semiconductor manufacturing apparatus according to an embodiment of the present invention. Fig. 2 is a schematic configuration diagram of a linear semiconductor manufacturing apparatus according to an embodiment of the present invention. Fig. 3 is a block diagram showing a control means provided in a semiconductor manufacturing apparatus according to an embodiment of the present invention. 097140117 53 200927623, 4 series # is a schematic view showing an operation surface of the semiconductor manufacturing apparatus according to the embodiment of the present invention. • ® 5 denotes a substrate transfer procedure implemented in the semiconductor manufacturing apparatus of the present invention. Fig. 6 is a flowchart showing a vacuum pinning chamber pressure judging routine of the transport program according to the embodiment of the present invention. The program diagram of the transfer destination gate © valve opening program of the transport program according to the embodiment of the present invention is shown. Fig. 9 is a flowchart showing a wafer presence detection and a wafer fetching program of a transfer program according to an embodiment of the present invention. Fig. 10 is a flowchart showing a wafer transfer program of a transfer program according to an embodiment of the present invention. Fig. π is a flowchart showing a transfer destination closing process of the transfer program according to the embodiment of the present invention. Fig. 12 is a view showing a process recipe of an embodiment of the present invention. The process recipe has at least a substrate carry-in step, a process preparation step, a process step, and a substrate carry-out step. [Main component symbol description] 11 Mass flow controller 12 Automatic pressure controller 097140117 54 200927623 13 14 80 ^ 90 ' 100

AR CS1 ' CS2 e cnt D1 -EV -G1 ~G6

LP1 ' LP2 ' LP3 LM LSI , LS2 〇 MD1 ' MD2 OFA PI ~ P6 PM1 ' PM2 PMC1(91) PMC2(92)

PZ SI ~S8 Temperature regulator input and output valve I/O LAN line master operation controller operation part atmosphere side robot cooling room control means operation kneading surface - lift .......... gate valve loading 埠 atmospheric transfer room slow Punch substrate processing module orientation plane alignment device substrate position process chamber process chamber controller process room controller vacuum gauge wafer with or without sensor 097140117 55 200927623 ST1 'ST2 buffer tableTM vacuum transfer chamber VR vacuum side robot 'VR1 ~VR2 vacuum side robot' VR2L folding link VR3 cylinder VR4 arm VR5 rotating part VL1 &gt; VL2 vacuum lock chamber - W wafer... ❿ 097140117 56

Claims (1)

200927623 VII. Patent Application Range 1. A substrate processing apparatus including: a processing chamber for processing a substrate; a transporting means for transporting the substrate; and a kneading program composed of a sequenGe The first control means for controlling the above-described transport means, and when the transport means has an error in the substrate transfer, the first control means temporarily stops the execution of the transfer program, and then accepts the stop processing. The processing is stopped, and if the retry processing is accepted, the program that causes the error in the above transfer program is executed again. 2. The substrate processing apparatus according to claim 1, further comprising a second control means for processing the substrate in accordance with a predetermined processing procedure composed of a plurality of steps for controlling the substrate in the processing chamber If the processing of the processing is interrupted, the second control means stops the processing from the execution of the processing of the processing program, and stops the processing. If the retry processing is accepted, the processing program is executed again. The steps to become the cause of the error. 3. A substrate processing apparatus comprising: - a processing chamber for processing a substrate; a conveying means for transporting the substrate; and a processing for processing the substrate in accordance with a predetermined processing program composed of a plurality of materials 2 control means; 097140117 57 200927623 When there is an error in the processing of the substrate in the processing chamber, the second control means stops the processing after temporarily stopping the processing, and stops the processing. If the retry processing is accepted, the procedure for causing the error in the above processing program is executed again. A substrate processing apparatus comprising: a substrate storage unit that mounts a substrate storage container that stores a plurality of substrates; an atmospheric transfer chamber that communicates with the substrate storage container; and a preparation room that is connected to the large inspection The chamber is connected and can be internally vented; &amp; - a substrate at the substrate, which communicates with the preparation chamber and processes the substrate; a large milk transfer means, the substrate (4) container and the rhyme The substrate is sent to the substrate; the vacuum transfer means transports the substrate between the preparation chamber and the substrate processing chamber; and the first control means 'controls the atmospheric transfer according to a mosquito transfer program composed of a plurality of programs In the substrate processing apparatus, when the atmospheric transfer means or the vacuum transfer means generates an error during the substrate transfer process, the above-mentioned first! When the control means temporarily stops the processing after the execution of the transfer program, the processing is stopped, and if the retry processing is accepted, the cause of the error in the transfer program is again processed. 097140117 58 200927623 5. If the patent application scope is applied The substrate processing apparatus according to the fourth aspect, further comprising: a second control section, wherein the substrate is processed by a predetermined processing procedure composed of a plurality of steps, and the substrate is processed during the processing of the substrate to the inside of the processing. If there is an error, the second control means will stop processing if the process is interrupted after the execution of the above-mentioned processing program is temporarily interrupted. If the retry process is accepted, the above-mentioned processing program becomes an error again. The steps that lead to the cause. A substrate processing apparatus comprising: a substrate housing portion in which a substrate storage container that accommodates a plurality of substrates is placed; and a gas transfer chamber that communicates with the substrate storage container; __ . . . The substrate is connected to the atmospheric transfer chamber and evacuated to the inside; the substrate processing chamber is in communication with the preliminary chamber, and the substrate is processed; the atmospheric transfer hand is further in the substrate storage container and the preparation room. The substrate is transported between the substrate and the substrate, and the substrate is transferred between the preparation chamber and the substrate processing chamber; the control unit 1 is configured to be transported according to a plurality of programs. a program for controlling the operation of the atmospheric transfer means or the vacuum transfer chamber, and a second control means for processing the substrate in accordance with a predetermined processing procedure composed of a plurality of steps; and controlling the substrate in the processing chamber In the case where an error occurs during processing, 097140117 59 200927623, the second control means temporarily interrupts the above processing procedure. After the execution, the processing is stopped if accepted, will stop the processing, if the acceptance retry process will be performed again in the above-described error processing program generating step of reasons. 097140117 60