JP2008147631A - Substrate processing equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing equipment for recovering a substrate stored in the substrate processing equipment in a short time, while restaining damages to the substrate and to the substrate processing equipment. <P>SOLUTION: The substrate processing equipment comprises a substrate processing chamber for processing a substrate; a preliminary chamber, disposed in between a substrate housing container for housing a plurality of substrates and the substrate processing chamber, with the internal pressure of which being controllable; a means for transporting the substrate between the substrate housing container and the substrate processing chamber, disposed in the preliminary chamber; and a means for controlling the operation of the means for transporting. The means for control manages the positional information, showing a position of the substrate in the substrate processing chamber and controls its operation so as to make substrates that remain in the substrate processing chamber in the order of closeness transport to the substrate housing container, when the means for controlling becomes no longer capable of managing the positional information, because of interruption of transporting by the means for transporting. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus including a transport unit that transports a substrate.

  A substrate processing apparatus such as a single-wafer substrate processing apparatus includes a substrate storage unit for mounting a substrate storage container for storing a plurality of substrates, an atmospheric transfer chamber communicating with the substrate storage container, and an internal communication with the atmospheric transfer chamber. A spare chamber capable of evacuating the substrate, a substrate processing chamber communicating with the spare chamber to process the substrate, atmospheric transfer means for transporting the substrate between the substrate storage container and the spare chamber, and the spare chamber and the substrate A vacuum transfer unit that transfers the substrate to and from the processing chamber, and an air transfer unit and a control unit that controls the vacuum transfer unit are provided.

  In the above-described substrate processing apparatus, a process of automatically transporting a substrate in a predetermined order to the substrate storage container, the atmospheric transfer chamber, the spare chamber, and the substrate processing chamber is referred to as an automatic transfer process. During the automatic transfer process, the control means automatically recognizes the current substrate position based on the control history for the atmospheric transfer means and the vacuum transfer means, the detection signal from the sensor installed in the substrate processing apparatus, and the like. Are managed.

  The automatic transfer process described above may be interrupted due to various factors such as malfunction of the control means or sensor, dropping or damage of the substrate during transfer, unexpected power failure. In that case, the substrate being transported stays inside the substrate processing apparatus, but in order to resume the automatic transport processing, all the substrates staying inside the substrate processing apparatus are collected in the substrate storage container. It is necessary to keep.

  Here, depending on the interruption factor of the automatic transfer processing, the position of the substrate managed by the control means may be different from the actual position of the substrate. For example, the substrate may break and fall after being transported, or the substrate may thermally expand and ride on the tweezer counterbore provided at the end of the arm of the transport means. For this reason, the position of the substrate recognized by the control means may be different from the actual position of the substrate. In such a case, if the substrate is to be collected based on the position information of the substrate managed by the control means, the substrate cannot be detected by the sensor and is transported, thereby damaging the substrate and the substrate processing apparatus. There is a risk.

  If the automatic transfer process is interrupted and the position of the substrate recognized by the control means is different from the actual position of the substrate, the maintenance staff actually collects the substrate staying inside the substrate processing equipment. It was necessary to carry out manually while visually checking the position of the substrate. However, in this case, it takes time to restore the substrate processing apparatus, and there is a problem in that the operating rate of the substrate processing apparatus decreases.

  An object of the present invention is to provide a substrate processing apparatus capable of automatically collecting a substrate staying inside the substrate processing apparatus in a short time while suppressing damage to the substrate and the substrate processing apparatus. And

According to one aspect of the present invention, a substrate processing chamber for processing a substrate, a substrate storage container for storing a plurality of substrates, and a spare chamber provided between the substrate processing chamber and capable of controlling an internal pressure; A substrate processing apparatus comprising: a transport unit that transports a substrate between the substrate storage container and the substrate processing chamber provided in the preliminary chamber; and a control unit that controls the operation of the transport unit, The control means manages the position information indicating the position of the substrate in the substrate processing apparatus, and the substrate processing when the position information cannot be managed because the transfer processing by the transfer means is interrupted. There is provided a substrate processing apparatus for controlling the operation of the transfer means so as to transfer the substrate remaining in the apparatus into the substrate storage container in the order of proximity from the substrate storage container.

  According to the present invention, it is possible to automatically recover a substrate staying inside the substrate processing apparatus in a short time while suppressing damage to the substrate and the substrate processing apparatus.

  Below, the structure and operation | movement of the substrate processing apparatus concerning one Embodiment of this invention are demonstrated using FIGS.

  In the drawings to be referred to, FIG. 1 is a schematic configuration diagram of a cluster type substrate processing apparatus according to an embodiment of the present invention, and FIG. 2 is a schematic configuration diagram of an inline type substrate processing apparatus according to an embodiment of the present invention. FIG. 3 is a block diagram of the control means provided in the substrate processing apparatus according to the embodiment of the present invention. FIG. 4 is a flowchart of automatic transfer processing performed in the cluster type substrate processing apparatus according to the embodiment of the present invention. FIG. 5 is an operation flowchart showing the substrate recovery process performed in the substrate processing apparatus according to the embodiment of the present invention. FIG. 6 is a schematic diagram showing a collection destination load port selection screen.

(1) Configuration of Substrate Processing Apparatus Generally, substrate processing apparatuses can be classified into a plurality of types according to the chamber arrangement. One is a cluster type substrate processing apparatus in which a plurality of chambers are arranged in a star shape around a transfer chamber. In addition, there is an inline type substrate processing apparatus in which a chamber and a transfer chamber are arranged in a straight line. Hereinafter, the configurations of the cluster type substrate processing apparatus and the inline type substrate processing apparatus and the configuration of the control means for controlling them will be described with reference to FIGS.

(1-1) Configuration of Cluster Type Substrate Processing Apparatus FIG. 1 shows a configuration example of a cluster type substrate processing apparatus according to an embodiment of the present invention. The cluster type substrate processing apparatus is divided into a vacuum side and an atmosphere side.

(A) Configuration on the vacuum side On the vacuum side of the cluster type substrate processing apparatus, a vacuum transfer chamber (transfer chamber) TM capable of being vacuum-tight, vacuum lock chambers (load lock chambers) VL1 and VL2 as spare chambers, a substrate, Process chambers PM1 and PM2 as processing chambers and cooling chambers CS1 and CS2 are provided. The vacuum lock chambers VL1 and VL2, the process chambers PM1 and PM2, and the cooling chambers CS1 and CS2 are arranged in a star shape on the outer periphery of the vacuum transfer chamber TM.

  The vacuum transfer chamber TM has a load lock chamber structure that can withstand a pressure (negative pressure) less than atmospheric pressure such as a vacuum state. In the embodiment of the present invention, the housing of the vacuum transfer chamber TM is formed in a box shape having a hexagonal shape in plan view and closed at both upper and lower ends.

In the vacuum transfer chamber TM, a vacuum robot VR as a vacuum transfer means is provided. The vacuum robot VR mutually transfers the wafer W as a substrate on an arm which is a substrate mounting portion among the vacuum lock chambers VL1 and VL2, the process chambers PM1 and PM2, and the cooling chambers CS1 and CS2. . The vacuum robot VR can be moved up and down by the elevator EV while maintaining the confidentiality of the vacuum transfer chamber TM. Further, a wafer presence sensor as a substrate detection means for detecting the presence or absence of the wafer W is provided at a predetermined position (near the gate valve) in front of the vacuum lock chambers VL1 and VL2, the process chambers PM1 and PM2, and the cooling chambers CS1 and CS2. It is installed so that the presence of the wafer W on the arm can be detected.

  The process chambers PM1 and PM2 function as a substrate processing chamber that gives added value to the wafer W, such as film formation by chemical reaction (CVD). The process chambers PM1 and PM2 include a gas flow controller (MFC) 11 for controlling the flow rate of the processing gas supplied into the process chamber shown in FIG. An auto pressure controller (APC) 12 for controlling the pressure, a temperature regulator 13 for controlling the temperature in the process chamber, an input / output valve I / O 14 for controlling on / off of supply of processing gas and an exhaust valve, etc. It has.

  The vacuum lock chambers VL1 and VL2 function as a spare chamber for carrying the wafer W into the vacuum transfer chamber TM or as a spare chamber for carrying the wafer W out of the vacuum transfer chamber TM. Inside the vacuum lock chambers VL1 and VL2, buffer stages ST1 and ST2 for temporarily supporting the wafer W for loading / unloading of substrates are provided, respectively.

  The vacuum lock chambers VL1 and VL2 communicate with the vacuum transfer chamber TM via gate valves G1 and G2, respectively, and communicate with an atmospheric transfer chamber LM, which will be described later, via gate valves G3 and G4, respectively. Therefore, by opening the gate valves G3 and G4 while the gate valves G1 and G2 are closed, the vacuum lock chambers VL1 and VL2 are kept between the vacuum transfer chamber LM and the vacuum transfer chamber LM while maintaining the vacuum airtightness in the vacuum transfer chamber TM. It is possible to carry the wafer W.

  Further, the vacuum lock chambers VL1 and VL2 are configured as a load lock chamber structure capable of withstanding a negative pressure less than atmospheric pressure such as a vacuum state, and the inside thereof can be evacuated. Therefore, after the gate valves G3 and G4 are closed and the vacuum lock chambers VL1 and VL2 are evacuated, the gate valves G3 and G4 are opened, and the vacuum lock is maintained while maintaining the vacuum state in the vacuum transfer chamber TM. It is possible to transfer the wafer W between the chambers VL1 and VL2 and the vacuum transfer chamber TM.

  The cooling chambers CS1 and CS2 function to store and cool the wafer W. The cooling chambers CS1 and CS2 can also be evacuated. Gate valves are also provided between the cooling chambers CS1 and CS2 and the vacuum transfer chamber TM, respectively.

(B) Configuration on the atmosphere side On the other hand, on the atmosphere side of the cluster type substrate processing apparatus, as described above, the atmosphere transfer chamber LM as the atmosphere transfer chamber connected to the vacuum lock chambers VL1 and VL2, and the atmosphere transfer chamber LM And load ports LP1 to LP3 as substrate storage portions for mounting substrate storage containers (hereinafter referred to as pods PD1 to PD3) connected to.

  Although not shown, the atmospheric transfer chamber LM is provided with a clean air unit for supplying clean air into the atmospheric transfer chamber LM.

In the atmospheric transfer chamber LM, one atmospheric robot AR as an atmospheric transfer means is provided. The atmospheric robot AR mutually transfers the wafer W as a substrate between the vacuum lock chambers VL1 and VL2 and the load ports LP1 to LP3. Similarly to the vacuum robot VR, the atmospheric robot AR also has an arm that is a substrate placement unit. Similarly, a wafer presence / absence sensor as a substrate detecting means for detecting the presence / absence of the wafer W is also installed at a predetermined position (near the gate valve) in front of the atmospheric transfer chamber LM to detect the presence of the wafer W on the arm. It can be detected.

  In the atmospheric transfer chamber LM, an orientation flat alignment device OFA for aligning the crystal orientation of the wafer W is provided as a substrate position correction device.

  On each of the load ports LP1 to LP3, pods PD1 to PD3 (not shown) as substrate storage containers capable of storing a plurality of wafers W can be mounted, respectively. In the pods PD1 to PD3 serving as substrate storage containers, a plurality of slots serving as storage units for storing the wafers W are provided.

(C) Configuration of Control Unit Each component of the cluster type substrate processing apparatus is controlled by the control unit CNT. FIG. 3 shows a configuration example of the control means CNT. The control means CNT includes a general control controller 90, process chamber controllers PMC1 and PMC2, and an operation unit 100 that receives operations by an operator, and these are connected via a LAN line 80 so that they can exchange data with each other. Has been.

  The overall controller 90 is connected to the vacuum robot VR, the atmospheric robot AR, the gate valves G1 to G4, and the vacuum lock chambers VL1 and VL2. Then, the overall controller 90 controls the operations of the vacuum robot VR and the atmospheric robot AR, the opening / closing operations of the gate valves G1 to G4, and the exhaust operations inside the vacuum lock chambers VL1 and VL2. The overall controller 90 is connected to each of the above-described wafer presence / absence sensors, and creates position information indicating the position of the wafer W in the substrate processing apparatus based on a detection signal from the wafer presence / absence sensor and updates it as needed. Is configured to do. Then, the overall control controller 90 adds the process information about the wafer W, the wafer W, in addition to the storage information for designating each slot in the pods PD1 to PD3 and the position information. Based on the data such as the wafer ID for identification and the recipe executed on the wafer W, the operation of the vacuum robot VR, the atmospheric robot AR, the gate valves G1 to G4 as the transfer means is controlled. Yes.

  The process chamber controllers PMC1 and PMC2 are connected to the MFC 11, APC 12, temperature regulator 13, input / output valve I / O 14 and the like provided in the process chambers PM1 and PM2, respectively. The process chamber controllers PMC1 and PMC2 control operations such as a gas introduction / exhaust mechanism to the process chambers PM1 and PM2, a temperature control / plasma discharge mechanism, and a cooling mechanism for the cooling chambers CS1 and CS2.

  The operation unit 100 has screen display / input reception functions such as system control command instructions, monitor display, logging data, alarm analysis, parameter editing, and the like.

(1-2) Configuration of Inline Type Substrate Processing Apparatus Next, FIG. 2 shows a configuration example of an inline type substrate processing apparatus according to an embodiment of the present invention. The inline-type substrate processing apparatus is also divided into a vacuum side and an atmosphere side.

(A) Configuration on the vacuum side Two substrate processing modules MD1 and MD2 are provided in parallel on the vacuum side of the inline-type substrate processing apparatus. The substrate processing module MD1 includes a process chamber PM1 as a vacuum-tight substrate processing chamber connected in-line and a vacuum-tight vacuum lock chamber VL1 as a preliminary chamber provided in the preceding stage. The substrate processing module MD2 also includes a process chamber PM2 and a vacuum lock chamber VL2 as in the case of MD1.

  As in the case of the cluster type substrate processing apparatus, the process chambers PM1 and PM2 function as a substrate processing chamber that gives added value to the wafer W as a substrate, for example, film formation by chemical reaction (CVD). The process chambers PM1 and PM2 include a gas introduction / exhaust mechanism, a temperature control / plasma discharge mechanism, an MFC 11 for controlling the flow rate of the processing gas supplied into the process chamber, and an auto pressure controller APC 12 for controlling the pressure in the process chamber. And a temperature regulator 13 for controlling the temperature in the process chamber, an input / output valve I / O 14 for controlling the supply of processing gas and the on / off of the exhaust valve, and the like.

  The vacuum lock chambers VL1 and VL2 function as spare chambers for loading the wafer W into the process chambers PM1 and PM2, or as spare chambers for unloading the wafer W from the process chambers PM1 and PM2, respectively.

  The vacuum lock chambers VL1 and VL2 are provided with vacuum robots VR1 and VR2 as second substrate transfer apparatuses, respectively. Each of the vacuum robots VR1 and VR2 can transfer the wafer W between the process chamber PM1 and the vacuum lock chamber VL1 or between the process chamber PM2 and the vacuum lock chamber VL2. Each of the vacuum robots VR1 and VR2 is provided with an arm as a substrate placement unit.

  Note that each of the vacuum lock chambers VL1 and VL2 has a multi-stage type that can hold the wafer W, for example, two upper and lower stages. The upper buffer stages LS1 and LS2 have a mechanism for holding the wafer W, and the lower cooling stages CS1 and CS2 have a mechanism for cooling the wafer W.

  The vacuum lock chambers VL1 and VL2 communicate with process chamber controllers PMC1 and PM2 via gate valves G1 and G2, respectively, and communicate with an atmospheric transfer chamber LM described later via gate valves G3 and G4, respectively. Yes. Therefore, by opening the gate valves G3 and G4 while the gate valves G1 and G2 are closed, the vacuum lock chamber VL1 and the process chamber controller PMC1 are maintained while maintaining the vacuum airtightness in the process chamber controllers PMC1 and PM2. It is possible to transfer the wafer W between the vacuum lock chamber VL2 and the process chamber controller PMC2.

  Further, the vacuum lock chambers VL1 and VL2 are configured as a load lock chamber structure capable of withstanding a negative pressure of less than atmospheric pressure such as a vacuum state, and the inside thereof can be evacuated. Therefore, after the gate valves G3 and G4 are closed and the vacuum lock chambers VL1 and VL2 are evacuated, the gate valves G1 and G2 are opened to maintain the vacuum tightness in the process chamber controllers PMC1 and PMC2. Wafer W can be transferred between lock chambers VL1 and VL2 and atmospheric transfer chamber LM.

(B) Atmosphere Configuration As described above, the vacuum lock chamber VL is disposed on the atmosphere side of the inline-type substrate processing apparatus.
1, an atmospheric transfer chamber LM as an atmospheric transfer chamber connected to VL2, and a load port LP1 as a substrate storage portion on which a substrate storage container (hereinafter referred to as pods PD1, PD2) connected to the atmospheric transfer chamber LM is placed. LP2 is provided.

  An atmospheric robot AR is provided in the atmospheric transfer chamber LM, and the wafer W can be transferred between the vacuum lock chambers VL1 and VL2 and the load ports LP1 and LP2. The atmospheric robot AR is provided with an arm as a substrate placement unit.

  The atmospheric transfer chamber LM is provided with an aligner unit AU as a substrate position correction device, which can correct the deviation of the wafer W during transfer and can perform notch alignment to align the notch of the wafer W in a certain direction. It has become.

  Each of the load ports LP1 and LP2 can mount pods PD1 and PD2 (not shown) for storing a plurality of wafers W, respectively.

(C) Configuration of Control Unit Each component of the inline-type substrate processing apparatus is controlled by the control unit CNT. Similar to the cluster type substrate processing apparatus, FIG. 3 shows a configuration example of the control means CNT. The control means CNT includes a general control controller 90, process chamber controllers PMC1 and PMC2, and an operation unit 100, which are connected to each other via a LAN line 80 so that data can be exchanged.

  The overall controller 90 is connected to the vacuum robots VR1 and VR2, the atmospheric robot AR, the gate valves G1 to G4, and the vacuum lock chambers VL1 and VL2. Then, the overall controller 90 controls the operations of the vacuum robots VR1 and VR2 and the atmospheric robot AR, the opening and closing operations of the gate valves G1 to G4, and the exhaust operation inside the vacuum lock chambers VL1 and VL2.

  The process chamber controllers PMC1 and PMC2 are connected to the MFC 11, APC 12, temperature regulator 13, input / output valve I / O 14 and the like provided in the process chambers PM1 and PM2, respectively. The process chamber controllers PMC1 and PMC2 control operations such as a gas introduction / exhaust mechanism to the process chambers PM1 and PM2, a temperature control / plasma discharge mechanism, and a cooling mechanism for the cooling chambers CS1 and CS2. In addition, the description which overlaps the content demonstrated in the case of a cluster type substrate processing apparatus is abbreviate | omitted.

  The operation unit 100 has screen display / input reception functions such as system control command instructions, monitor display, logging data, alarm analysis, parameter editing, and the like.

(2) Overview of Automatic Transfer Processing Next, automatic transfer processing performed by the above-described cluster type substrate processing apparatus will be described with reference to FIG. In the following description, the operation of each part of the substrate processing apparatus is controlled by the control means CNT.

(2-1) Placing the pod on the load port (S1)
First, the gate valves G1 and G4 are closed, the gate valves G2 and G3 are opened, and the vacuum transfer chamber TM, the process chambers PM1 and PM2, and the cooling chambers CS1 and CS2 are evacuated. At the same time, clean air is supplied into the atmospheric transfer chamber LM so that the atmospheric transfer chamber LM has a substantially atmospheric pressure. Then, a pod PD1 (not shown) storing a plurality of unprocessed wafers W is placed on the load port LP1.

(2-2) Transfer to atmospheric transfer chamber (S2)
Subsequently, the atmospheric robot AR transfers the wafer W stored in the substrate position P1 in the pod PD1 placed on the load port LP1 into the atmospheric transfer chamber LM, and moves it to the substrate position P2 on the orientation flat aligner OFA. Install and align the crystal orientation.

(2-3) Transport to vacuum lock chamber (S3)
Subsequently, the atmospheric robot AR picks up the wafer W set at the substrate position P2, transfers it to the vacuum lock chamber VL1, and sets it at the substrate position P3 on the buffer stage ST1. Then, the gate valve G3 is closed, and the vacuum lock chamber VL1 is evacuated.

(2-4) Transfer to process chamber (S4)
When the vacuum lock chamber VL1 is reduced to a predetermined pressure, the gate valve G1 is opened while the gate valve G3 is closed. Then, the wafer W set at the substrate position P3 is picked up by the vacuum robot VR, transferred into the process chamber PM1, and set at the substrate position P4. Thereafter, a processing gas is supplied into the process chamber PM1, and a predetermined process is performed on the wafer W.

(2-5) Transport to cooling chamber (S5)
When the processing of the wafer W in the process chamber PM1 is completed, the processed wafer W installed at the substrate position P4 is picked up by the vacuum robot VR, transferred into the cooling chamber CS1, and placed at the substrate position P5.

(2-6) Transport to vacuum lock chamber (S6)
When the cooling process in the cooling chamber CS1 is completed, the processed wafer W installed at the substrate position P5 is picked up by the vacuum robot VR, transferred into the vacuum lock chamber VL2, and the substrate position P6 on the buffer stage ST2. To place. Thereafter, the gate valve G2 is closed, clean gas is supplied into the vacuum lock chamber VL2, the inside of the vacuum lock chamber VL2 is returned to substantially atmospheric pressure, and the gate valve G4 is opened.

(2-7) Storage in pod placed on load port (S7)
Subsequently, the processed wafer W installed at the substrate position P2 is picked up by the atmospheric robot AR, conveyed to the pod PD3 (not shown) placed on the load port LP3, and stored in the empty slot.

  Thereafter, when the above steps are repeated and automatic transfer processing is performed for all unprocessed wafers, the pod PD3 containing the processed wafers W is unloaded from the load port LP3, and the automatic transfer processing is completed.

(3) Substrate forced recovery process Subsequently, the forced recovery process of the substrate after the automatic transfer process performed by the substrate processing apparatus according to the embodiment of the present invention is interrupted will be described with reference to FIGS. 5 and 6. To do. In the following description, the operation of each part of the substrate processing apparatus is controlled by the control means CNT.

(3-1) Check empty slot of load port (S1)
First, the maintenance staff visually confirms the inside of the substrate processing apparatus, and then selects a load port for recovery of the wafer W from the load ports LP1 to LP3 on the load port selection screen shown in FIG. Then, mapping processing of the collection destination load port, that is, detection of the presence / absence of a wafer in each slot in a pod (not shown) placed on the collection destination load port is performed. Here, the collection destination slot may be manually selected by the maintenance staff from the operation screen, or the control means C
NT may be automatically selected. In the following description, as an example, it is assumed that the load port LP3 is selected as the collection destination load port, and the slots 1 to 9 of the pod PD3 placed on the load port LP3 are empty. Here, it is assumed that the collection destination slots 1 to 9 are manually selected by the maintenance staff on the operation screen, and the control means CNT assigns the collection sources to the selected slots in order from the vicinity of the pod PD3. In this case, it is assumed that the atmospheric robot AR → slot 1, orientation flat aligner OPA → slot 2,..., Process chamber PM2 → slot 9 are assigned. In addition, when the slots 1 to 9 of the pod PD3 are not vacant, they cannot be executed.

  As a preparatory stage for the forced recovery process, a process for moving the atmospheric robot AR and the vacuum robot VR to a predetermined position (for example, a position that should exist before the operation) is necessary. That is, the atmospheric robot AR and the vacuum robot VR are urgently stopped and are stopped during the (axis) operation. In this case, for example, it is manually operated using the transport terminal device and moved to a specified position. If the atmospheric robot AR and the vacuum robot VR are at specified positions at the time of emergency stop, there is no need to perform this operation.

(3-2) Wafer collection on atmospheric robot (S2)
When it is confirmed that there is an empty slot in the pod PD3 placed on the load port LP3, the wafer W is forcibly carried out from a position close to the load port LP3 as described below. Here, forcing the wafer W to be accommodated means that the position of the wafer W in the atmospheric transfer chamber LM, the process chambers PM1 and PM2, the cooling chambers CS1 and CS2, and the vacuum lock chambers VL1 and VL2. This means that the control means CNT forces the atmospheric robot AR and the vacuum robot VR to perform the wafer W storing operation even when the position information shown cannot be managed. In particular, not only the storage operation is performed when the wafer presence sensor detects the presence of the wafer W, but also the process chamber that cannot be equipped with the wafer presence sensor depends on the position information managed by the control means CNT. The storage operation is performed continuously.

  The reason why the storing operation is performed regardless of the position information is as described above. That is, depending on the reason for the interruption of the automatic collection process, the position of the wafer W indicated by the position information managed by the control unit CNT may be different from the actual position of the wafer W. For example, the wafer W may be broken and dropped after the transfer, or the wafer W may thermally expand and ride on a tweezer counterbore provided at the end of the arm of the atmospheric robot AR or the vacuum robot VR. May not be at the regular scheduled transfer position. In such a case, the wafer W cannot be detected by the wafer presence / absence sensor, and the control means CNT erroneously recognizes that the wafer W does not exist even though the wafer W actually exists. Then, if the control means CNT tries to collect the wafer W with such misperception, the wafer W and the substrate processing apparatus may fail to collect the wafer W, or a plurality of wafers W may overlap at the same installation location. There is a risk of damage to other components. For this reason, when the position of the wafer W recognized by the control means CNT differs from the actual position of the substrate, the storing operation is forcibly performed regardless of the position information in the substrate processing apparatus. The position information of the wafer W needs to be updated while being detected by the wafer presence sensor.

  In one embodiment of the present invention, when the start button shown in FIG. 6 is pressed, first, the atmospheric robot AR transports the wafer W placed on the atmospheric robot AR and places it on the load port LP3. The pod PD3 is stored in the first empty slot.

(3-3) Wafer collection on the orientation flat aligner (S3)
Subsequently, the atmospheric robot AR transports the wafer W supported at the substrate position P2 on the orientation flat aligner OFA and stores it in the second empty slot of the pod PD3 placed on the load port LP3.

(3-4) Wafer collection in vacuum lock chamber (S4, S5)
Subsequently, with the gate valves G1 and G2 closed, clean gas is supplied into the vacuum lock chambers VL1 and VL2 to return to substantially atmospheric pressure, and then the gate valves G3 and G4 are opened.
Then, the atmospheric robot AR transfers the wafer W from the substrate positions P3 and P6 on the buffer stages ST1 and ST2, and stores them in the third and fourth empty slots of the pod PD3 placed on the load port LP3.

(3-5) Wafer collection on vacuum robot (S6)
Subsequently, the gate valve G3 is closed, the vacuum lock chamber VL1 is evacuated, and then the gate valve G1 is opened. Then, the vacuum robot VR transports the wafer W on the vacuum robot VR and places it on the substrate position P3 on the buffer stage ST1. Subsequently, the gate valve G1 is closed, clean gas is supplied into the vacuum lock chamber VL1 to return to substantially atmospheric pressure, and the gate valve G3 is opened. Then, the atmospheric robot AR transports the wafer W from the substrate position P3 on the buffer stage ST1, and stores it in the fifth empty slot of the pod PD3 placed on the load port LP3.

(3-6) Wafer collection in the cooling chamber (S7, S8)
Subsequently, the gate valve G3 is closed, the vacuum lock chamber VL1 is evacuated, and then the gate valve G1 is opened. Then, the wafer W on the cooling chamber CS1 is transferred by the vacuum robot VR and placed at the substrate position P3 on the buffer stage ST1. Subsequently, the gate valve G1 is closed, clean gas is supplied into the vacuum lock chamber VL1 to return to substantially atmospheric pressure, and the gate valve G3 is opened. Then, the atmospheric robot AR transports the wafer W from the substrate position P3 on the buffer stage ST1 and stores it in the sixth empty slot of the pod PD3 placed on the load port LP3.

  Thereafter, through the same process, the wafer W on the cooling chamber CS2 is stored in the seventh empty slot of the pod PD3 placed on the load port LP3.

(3-7) Wafer collection in process chamber (S9, S10)
Subsequently, the gate valve G3 is closed, the vacuum lock chamber VL1 is evacuated, and then the gate valve G1 is opened. Then, the wafer W on the process chamber PM1 is transferred by the vacuum robot VR and placed at the substrate position P3 on the buffer stage ST1. Subsequently, the gate valve G1 is closed, clean gas is supplied into the vacuum lock chamber VL1 to return to substantially atmospheric pressure, and the gate valve G3 is opened. Then, the atmospheric robot AR transports the wafer W from the substrate position P3 on the buffer stage ST1, and stores it in the eighth empty slot of the pod PD3 placed on the load port LP3.

  Thereafter, through the same process, the wafer W on the process chamber PM2 is stored in the ninth empty slot of the pod PD3 mounted on the load port LP3.

(4) Effects According to this Embodiment According to this embodiment, even if the position of the wafer W indicated by the position information managed by the control means CNT differs from the actual position of the wafer W, the substrate The wafer W staying inside the processing apparatus can be automatically recovered in a short time while suppressing damage to the components of the wafer W and the substrate processing apparatus. Thereby, it becomes possible to shorten the restoration | recovery operation | work of the substrate processing apparatus after an automatic conveyance process is interrupted, and can improve the operation rate of a substrate processing apparatus.

<Other Embodiments of the Present Invention>
Hereinafter, another embodiment of the present invention will be described.

(1) Configuration of Substrate Processing Apparatus FIG. 7 is a schematic configuration diagram of a cluster type substrate processing apparatus according to another embodiment of the present invention. This cluster type substrate processing apparatus is also divided into a vacuum side and an atmosphere side.

(A) Configuration on the vacuum side The vacuum side of this cluster type substrate processing apparatus includes a vacuum transfer chamber TM that can be vacuum-tight, vacuum lock chambers VL1 and VL2 as spare chambers, and a process chamber PM1 as a substrate processing chamber. PM2 is provided.

  In the vacuum transfer chamber TM, a vacuum robot VR as a vacuum transfer means is provided. The vacuum robot VR places a wafer W as a substrate on an arm which is a substrate placement unit, and transfers the wafer W between the vacuum lock chambers VL1 and VL2 and the process chambers PM1 and PM2. The vacuum robot VR is configured to return the arm to a predetermined position after performing the operation of taking out the wafer W in the process chambers PM1 and PM2 and the vacuum lock chambers VL1 and VL2.

  In the vicinity of the predetermined position where the arm of the vacuum robot VR returns, a wafer presence / absence sensor SA is provided as a substrate detecting means for detecting the presence / absence of the wafer W on the arm. A predetermined position where the arm of the vacuum robot VR returns after the wafer W is taken out from the process chambers PM1 and PM2, and the vacuum robot VR after the wafer W is taken out from the vacuum lock chambers VL1 and VL2. This is different from the predetermined position where the arm returns. For this reason, at least two wafer presence / absence sensors SA are provided corresponding to the respective predetermined positions.

  Further, a wafer pop-out sensor SB as a substrate detection unit for detecting the presence or absence of the wafer W is provided at an arbitrary position (near the gate valve) in front of the process chambers PM1 and PM2 in the vacuum transfer chamber TM. The wafer pop-out sensor SB is configured to detect a positional deviation of the wafer W carried into the process chambers PM1 and PM2 by the vacuum robot VR. Detection by the wafer pop-out sensor SB is performed before the gate valves provided in the process chambers PM1 and PM2 are closed, and the wafer W is only in the case where there is no misalignment of the wafer W so as to suppress damage to the substrate processing apparatus. The gate valve is configured to be closed.

  The process chambers PM1 and PM2 function as a substrate processing chamber that gives added value to the wafer W, such as film formation by chemical reaction (CVD). Although not shown, the process chambers PM1 and PM2 include a gas introduction / exhaust mechanism, a plasma discharge mechanism, a temperature controller, and the like as in the cluster type substrate processing apparatus shown in FIG.

The vacuum lock chambers VL1 and VL2 function as spare chambers for transporting the wafer W into the vacuum transport chamber TM or as spare chambers for transporting the wafer W from the vacuum transport chamber TM. In the vacuum lock chambers VL1 and VL2, placement units on which the wafers W are placed are respectively provided. The placement unit is configured so that the number of wafers W to be placed can be adjusted as necessary. Further, inside the vacuum lock chambers VL1 and VL2, wafer presence / absence sensors SC are provided as substrate detecting means for detecting the presence / absence of the wafer W in the vacuum lock chambers VL1 and VL2, respectively. For example, the wafer presence / absence sensor SC is configured to detect the presence of a wafer W if at least one wafer W exists on the mounting portion of the vacuum lock chambers VL1 and VL2. Detection of the wafer W by the wafer presence / absence sensor SC is performed before the wafer W in the process chambers PM1 and PM2 and the wafer W on the vacuum robot VR are carried into the vacuum lock chambers VL1 and VL2. That is, the control means CNT described later determines whether or not the wafer W can be loaded into the vacuum lock chambers VL1 and VL2 using the wafer presence / absence sensor SC during a forced recovery process described later (that is, an empty placement unit). Is detected). The control means CNT is configured not to load the wafer W into the vacuum lock chambers VL1 and VL2 in which the presence of the wafer W is detected.

  The vacuum lock chambers VL1 and VL2 communicate with the vacuum transfer chamber TM through gate valves, respectively. By performing the gate valve opening / closing control, the wafer W can be transferred between the vacuum lock chambers VL1 and VL2 and the atmospheric robot AR, which will be described later, while maintaining the vacuum airtightness in the vacuum transfer chamber TM.

(B) Configuration on Atmosphere Side On the other hand, an atmosphere robot AR as an atmosphere transfer unit and load ports LP1 and LP2 as substrate accommodation units are provided on the atmosphere side of the substrate processing apparatus according to the present embodiment.

  On the load ports LP1 and LP2, pods PD1 and PD2 are mounted as substrate storage containers configured to store a plurality of wafers W, respectively. In the pods PD1 and PD2 as substrate storage containers, a plurality of slots as storage portions for storing the wafers W are provided.

  The atmospheric robot AR mutually transfers the wafer W as a substrate between the vacuum lock chambers VL1 and VL2 and the pods PD1 and PD2. Similarly to the vacuum robot VR, the atmospheric robot AR also has an arm that is a substrate placement unit. For example, the arm is configured to hold and transfer a plurality of wafers W at a time.

  Between the vacuum lock chambers VL1 and VL2 and the load ports LP1 and LP2, at an arbitrary position in front of the vacuum lock chambers VL1 and VL2 (near the gate valve) or an arbitrary position in front of the load ports LP1 and LP2. Are provided with a wafer presence / absence sensor SD as substrate detection means for detecting the presence / absence of the wafer W, respectively. Wafer presence / absence sensors SD are provided corresponding to vacuum lock chambers VL1 and VL2 and load ports LP1 and LP2, respectively. The wafer presence / absence sensor SD is configured to detect the presence / absence of the wafer W on the arm of the atmospheric robot AR, for example, when the wafer W is transferred between the load port LP1 and the vacuum lock chamber VL1.

(C) Configuration of Control Unit Each component of the cluster type substrate processing apparatus in the present embodiment is controlled by the control unit CNT shown in FIG. The configuration of the control means CNT is almost the same as that of the cluster type substrate processing apparatus shown in FIG.

  The overall control controller 90 included in the control means CNT is connected to the above-described wafer presence / absence sensors SA, SC, SD, and the wafer pop-out sensor SB, respectively. The overall controller 90 creates position information indicating the position of the wafer W in the substrate processing apparatus based on detection signals from the wafer presence / absence sensors SA, SC, SD and the wafer jump-out sensor SB, and updates it as needed. It is configured. Then, the overall controller 90 is configured to control the vacuum robot VR, the atmospheric robot AR, the gate valve, and the like as the transfer means based on the position information.

  Further, when an error occurs in which the position of the wafer W indicated by the position information differs from the actual position of the wafer W, the control unit CNT displays a screen for accepting an operation for correcting the position information on the operation unit 100. It is configured. The control means CNT is configured to accept a correction operation from the operation unit 100 and update the position information. Note that, since it is basically the same as that of the cluster type substrate processing apparatus as an example, detailed description is omitted.

(2) Forced Recovery Process for Substrate Next, the forced recovery process for a substrate according to the present embodiment will be described with reference to FIG. FIG. 8 is an operation flowchart showing a substrate recovery process performed in a substrate processing apparatus according to another embodiment of the present invention. In the following description, the operation of each part of the substrate processing apparatus is controlled by the control means CNT.

(2-1) Load slot empty slot confirmation (S1)
First, as in the above-described embodiment shown in FIGS. 5 and 6, the maintenance staff visually confirms the inside of the substrate processing apparatus and determines whether the wafer W can be forcibly collected. If it is determined that the forced recovery process can be performed, the pods PD1 and PD2 placed on the load ports LP1 and LP2 are replaced with empty pods PD1 and PD2. Next, the collection destination load port is selected on the load port selection screen shown in FIG. For example, up to 25 wafers W can be stored in each of the pods PD1 and PD2, and up to 25 wafers W can be mounted in the storage portions of the vacuum lock chambers VL1 and VL2, respectively, and more than 25 wafers can be collected in the substrate processing apparatus. When the target wafer W exists, two load ports LP1 and LP2 are selected as load ports used for the forced recovery process from the forced substrate recovery screen shown in FIG.

  When selection of the load port is completed, the wafers W remaining in the substrate processing apparatus are forcibly transferred (recovered) into the empty pod PD1 placed on the load port LP1 in the order from the load port LP1. Let Such transfer is performed when the control means CNT detects the presence of the wafer W by the wafer presence / absence sensors SA, SC, SD.

  In the following description, it is assumed that the load port LP1 is selected as the collection destination load port on the load port selection screen shown in FIG. The pod PD1 placed on the load port LP1 has 25 slots (storage units), and all 25 slots are empty. Further, it is configured such that 25 wafers W can be placed on the placement parts of the vacuum lock chambers VL1 and VL2, respectively, and the wafer W is placed on the placement part of the vacuum lock chamber VL1. It is assumed that the wafer W is mounted only on the first, eighth, eleventh, and twenty-fourth mounting portions among the mounting portions of the vacuum lock chamber VL2. Further, it is assumed that one wafer W is placed in the process chamber PM1, and no wafer W is placed in the process chamber PM2, the atmospheric robot AR, and the vacuum robot VR. It is assumed that the number of atmospheric robots AR that can be simultaneously transferred is five, and that the number of vacuum robots VR that can be simultaneously transferred is one.

  As a preparatory stage for the forced recovery process, a process for moving the atmospheric robot AR and the vacuum robot VR to a predetermined position (for example, a position that should exist before the operation) is necessary. That is, the atmospheric robot AR and the vacuum robot VR are urgently stopped and are stopped during the operation. In this case, for example, it is manually operated using the transport terminal device and moved to a specified position. If the atmospheric robot AR and the vacuum robot VR are at specified positions at the time of emergency stop, there is no need to perform this operation.

(2-2) Wafer collection on atmospheric robot (S2)
First, the atmospheric robot AR transports the wafer W placed on the atmospheric robot AR and stores it in the empty slot of the pod PD1 placed on the load port LP1. However, in this embodiment, since the wafer W is not placed on the atmospheric robot AR, such a transfer operation is omitted.

  Specifically, since the load port LP1 is selected, it is moved to the front of the load port LP1 and detected by the wafer presence sensor SD at a predetermined position (standby position). This position is a position where the atmospheric robot AR stands by in order to carry the wafer W with the pod PD1. In this embodiment, since the wafer W is not held, the process proceeds to the next step S3 without opening the pod PD1.

(2-3) Wafer collection in the vacuum lock chamber VL1 (S3)
The wafer lock sensor VL1 is provided with a wafer presence / absence sensor SC. When a signal indicating that the wafer W does not exist is detected from the wafer presence / absence sensor SC, the control means CNT collects the wafer W in the vacuum lock chamber VL1. (Skip step S3), step S4 described later is executed.

  However, a wafer presence / absence sensor SC is provided in the vacuum lock chamber VL1, and when a signal indicating that the wafer W exists is detected from the wafer presence / absence sensor SC, or the wafer presence / absence sensor SC is provided in the vacuum lock chamber VL1. If not, the wafer in the vacuum lock chamber VL1 is collected as described below. That is, the pressure in the vacuum lock chamber VL1 is returned to atmospheric pressure, and the atmospheric-side gate valve is opened while the vacuum-side gate valve is closed. Then, the atmospheric robot AR carries out (takes out) the wafer W from the first to fifth mounting parts of the vacuum lock chamber VL1. At this time, since the wafer W is not placed on the placement portion of the vacuum lock chamber VL1, there is no wafer W from the wafer presence / absence sensor SD provided at an arbitrary position in front of the vacuum lock chamber VL1. Detected. Next, an operation of transporting the wafer W from the sixth to tenth placement parts of the vacuum lock chamber VL1 is performed by the atmospheric robot AR. At this time, it is similarly detected from the wafer presence sensor SD that the wafer W does not exist. Thereafter, the operation of transporting the wafer W to the 25th placement unit is repeated. When it is detected from the wafer presence / absence sensor SD that the wafer W is not present, the atmospheric robot AR does not perform the operation of transporting the wafer W to the empty slot of the pod PD1. When the operation of carrying out all the placement units is executed, the above-described gate valve (not shown) is closed.

  Note that a wafer presence / absence sensor SC is provided in the vacuum lock chamber VL1, and that the wafer W is not present in the vacuum lock chamber VL1 by the wafer presence / absence sensor SC during the above-described collection operation (that is, the vacuum lock chamber VL1). When a signal indicating that all the wafers W in VL1 have been recovered) is detected, the above-described step S3 may be interrupted at that point, and step S4 described later may be executed.

(2-4) Wafer collection in vacuum lock chamber VL2 (S4)
A wafer presence / absence sensor SC is provided in the vacuum lock chamber VL2, and when a signal indicating that the wafer W does not exist is detected from the wafer presence / absence sensor SC, the control means CNT collects the wafer W in the vacuum lock chamber VL2. (Skip step S4), step S5 described later is executed.

However, a wafer presence / absence sensor SC is provided in the vacuum lock chamber VL2, and when a signal indicating that the wafer W exists is detected from the wafer presence / absence sensor SC, or the wafer presence / absence sensor SC is provided in the vacuum lock chamber VL1. If not, the wafer in the vacuum lock chamber VL2 is collected as described below. That is, the pressure in the vacuum lock chamber VL2 is returned to atmospheric pressure, and an atmospheric gate valve (not shown) is opened. Then, the atmospheric robot AR carries out (takes out) the wafer W from the first to fifth mounting parts of the vacuum lock chamber VL2. At this time, the presence / absence of the wafer W is detected from the wafer presence / absence sensor SD provided at an arbitrary position in front of the vacuum lock chamber VL2. Therefore, the atmospheric robot AR performs an operation of transporting the wafer W to the first to fifth empty slots of the pod PD1 placed on the load port LP1.

  Next, an operation of transporting the wafer W from the sixth to tenth mounting parts of the vacuum lock chamber VL2 is performed by the atmospheric robot AR. At this time, the wafer W is placed only on the sixth to eighth placement portions of the vacuum lock chamber VL2, but the presence / absence of the wafer W is detected from the wafer presence / absence sensor SD. Therefore, the atmospheric robot AR performs an operation of transporting the wafer W to the sixth to eighth empty slots of the pod PD1. Note that the ninth to tenth slots of the pod PD1 are empty.

  Next, the atmospheric robot AR performs an operation of transporting the wafer W from the 11th to 15th placement parts of the vacuum lock chamber VL2. At this time, the wafer W is mounted only on the eleventh mounting portion of the vacuum lock chamber VL2, but the presence / absence of the wafer W is detected from the wafer presence sensor SD. Therefore, the atmospheric robot AR performs an operation of transporting the wafer W to the 11th empty slot of the pod PD1. Note that the 12th to 15th slots of the pod PD1 are empty.

  Next, an operation of transporting the wafer W from the 16th to 20th mounting parts of the vacuum lock chamber VL2 is performed by the atmospheric robot AR. At this time, since the wafer W is not placed on the 16th to 20th placement parts of the vacuum lock chamber VL2, it is detected from the wafer presence / absence sensor SD that the wafer W does not exist. Therefore, the operation of transferring the wafer W to the 16th to 20th empty slots of the pod PD1 by the atmospheric robot AR is not performed.

  Next, an operation of transporting the wafer W from the 21st to 25th mounting parts of the vacuum lock chamber VL2 is performed by the atmospheric robot AR. At this time, the wafer W is mounted only on the 24th mounting portion of the vacuum lock chamber VL2, but the presence / absence of the wafer W is detected from the wafer presence / absence sensor SD. Therefore, the atmospheric robot AR performs an operation of transporting the wafer W to the 24th empty slot of the pod PD1. Note that the 21st to 23rd and 25th slots of the pod PD1 are empty.

  In the above description, the slot of the pod PD1 and the mounting portion of the vacuum lock chamber VL2 are associated with each other, but the corresponding positions can be arbitrarily set. For example, the maintenance staff may be able to set the correspondence from the operation unit 100 before performing the forced collection process.

  Note that a wafer presence / absence sensor SC is provided in the vacuum lock chamber VL2, and that the wafer W is not present in the vacuum lock chamber VL2 by the wafer presence / absence sensor SC during the above-described collection operation (that is, the vacuum lock chamber VL2). If a signal indicating that all the wafers W in VL1 have been recovered) is detected, the above-described step S4 may be interrupted at that point, and step S5 described later may be executed.

(2-5) Wafer collection on the vacuum robot VR (S5)
Subsequently, the wafer presence sensor SA detects whether or not the wafer W is placed on the arm of the vacuum robot VR. If the wafer W is present on the arm of the vacuum robot VR, the presence / absence sensor SC detects whether or not the wafer W is present in the vacuum lock chamber VL1 (or the vacuum lock chamber VL2). If the wafer W does not exist in the vacuum lock chamber VL1 (VL2), the pressure in the vacuum lock chamber VL1 (VL2) is reduced to reduce the pressure in the vacuum lock chamber VL1 (VL2) in the vacuum transfer chamber TM. Same as pressure. Then, the gate valve provided on the vacuum side of the vacuum lock chamber VL1 (VL2) is opened, and the inside of the vacuum transfer chamber TM communicates with the inside of the vacuum lock chamber VL1 (VL2). Then, the wafer W on the arm of the vacuum robot VR is transferred into the vacuum lock chamber VL1 (VL2), and the above-described gate valve is closed. Then, the pressure in the vacuum lock chamber VL1 (VL2) is returned to atmospheric pressure, and the gate valve provided on the atmosphere side of the vacuum lock chamber VL1 (VL2) is opened. Then, the wafers W in the vacuum lock chambers VL1 and VL2 are unloaded (taken out) by the atmospheric robot AR, and transferred into the pods PD1 and PD2 by the method shown in the above-described step S4. When the transfer is completed, the gate valve provided on the atmosphere side of the vacuum lock chamber VL1 (VL2) is closed.

  In this embodiment, since the wafer W is not placed on the arm of the vacuum robot VR as described above, the process proceeds to the next step S6 without performing step S5.

(2-6) Recovery of wafer in process chamber PM1 (S6)
Subsequently, at least one of the chambers is depressurized or pressurized so that the pressure in the process chamber PM1 and the pressure in the vacuum transfer chamber TM become the same. Then, the gate valve provided in the process chamber PM1 is opened, and the inside of the process chamber PM1 and the inside of the vacuum transfer chamber TM are communicated. Then, the vacuum robot VR carries out (takes out) the wafer W from the process chamber PM1, and closes the gate valve. Then, after the wafer presence sensor SA detects whether or not the wafer W is placed on the arm of the vacuum robot VR, if the wafer W is placed, the method shown in the above step S5, The wafer W placed on the arm of the vacuum robot VR is transferred into the pod PD1.

(2-7) Wafer collection in process chamber PM2 (S7)
Subsequently, at least one of the chambers is depressurized or pressurized so that the pressure in the process chamber PM2 and the pressure in the vacuum transfer chamber TM become the same. Then, the gate valve provided in the process chamber PM2 is opened, and the inside of the process chamber PM2 and the inside of the vacuum transfer chamber TM are communicated. Then, the vacuum robot VR carries out (takes out) the wafer W from the process chamber PM2, and closes the gate valve. Thereafter, the wafer W placed on the arm of the vacuum robot VR is transferred into the pod PD1 by the method shown in the above-described step S5, and the forced recovery process of the wafer W is completed.

  In the present embodiment, since the wafer W is not placed in the process chamber PM2 as described above, the forced recovery process is terminated without performing step S7.

  In this embodiment, the case where only the load port LP1 is selected in FIG. 6 has been described in detail. For example, the load ports LP1 and LP2 are selected, and the wafer W in the vacuum lock chamber VL1 (or VL2) is transferred to the pod PD1. The wafers W in the process chambers PM1 and PM2 may be recovered in the pod PD2, and the wafers W in the vacuum lock chamber VL1 are recovered in the pod PD1 and in the vacuum lock chamber VL2. The wafer W may be collected in the pod PD2.

Further, in the present embodiment, as in the case of the pods PD1 and PD2, when configured to be able to place 25 wafers W in the vacuum lock chambers VL1 and VL2, for example, the slot of the vacuum lock chamber VL1 If the wafer W is transported so as to correspond to the slot of the pod PD1, the wafer W can be returned to the original position during the forcible collection process, so that the restart after the restoration can be performed quickly. Therefore, it is possible to improve the operation rate of the substrate processing apparatus.

(3) Effects According to this Embodiment According to this embodiment, one or more effects described below are exhibited.

  According to the present embodiment, even when the position of the wafer W indicated by the position information managed by the control unit CNT is different from the actual position of the wafer W, the wafer stays inside the substrate processing apparatus. The wafer W can be automatically recovered in a short time while suppressing damage to the components of the wafer W and the substrate processing apparatus. As a result, it is possible to shorten the recovery work of the semiconductor device after the automatic transfer processing is interrupted, and the operating rate of the substrate processing apparatus can be improved.

  Further, according to the present embodiment, the control unit CNT performs the wafer presence sensor SA in the forced recovery process described above when an error occurs between the position of the wafer W indicated by the position information and the actual position of the wafer W. , SC and SD, the position information of the wafer W detected is sequentially updated. In the conventional substrate processing apparatus, when updating the data of the wafer W to be transferred, not only the position information of the wafer W but also the process status of the wafer W, the wafer ID for identifying the wafer W, It was necessary to edit various data such as recipes to be performed on the wafer W. On the other hand, according to the substrate processing apparatus according to the present embodiment, the forcible recovery process can be quickly performed only with the position information of the wafer W. Further, not only the position information of the wafer W immediately before the error occurs but also data such as the process status of the process for the wafer W is stored, and the position information of the wafer W is corrected to this. In addition, the recovery work after the forced recovery process can be performed quickly. Further, a screen for accepting a correction operation for data such as the position information of the wafer W may be displayed on the operation unit 100, and the correction information from the operation unit 100 may be received to update the position information. By doing this, even if an error occurs and the above-described various data of the wafer W immediately before the emergency stop is not stored, the recovery operation after the forced recovery can be performed.

<Preferred embodiment of the present invention>
Hereinafter, desirable aspects of the present invention will be additionally described.

  The first aspect includes a substrate processing chamber for processing a substrate, a substrate storage container for storing a plurality of substrates, a spare chamber provided between the substrate processing chamber and capable of controlling an internal pressure, and the spare chamber A substrate processing apparatus comprising: a transport unit that transports a substrate between the substrate storage container and the substrate processing chamber; and a control unit that controls an operation of the transport unit, wherein the control unit Manages position information indicating the position of the substrate in the substrate processing apparatus, and when the position information cannot be managed because the transfer process by the transfer means is interrupted, The substrate processing apparatus controls the operation of the transfer means so as to transfer the remaining substrate into the substrate storage container in the order from the substrate storage container.

  Preferably, the substrate storage container includes a plurality of storage units for storing the substrates, and the control unit stores each of the substrates present in the substrate processing apparatus in which storage unit in the substrate storage container. Storage information for designating each of them is held, and during the transfer process, the operation of the transfer means is controlled based on the storage information and the position information.

Preferably, a substrate detection means for detecting the presence or absence of a substrate is provided at each of the substrate transfer scheduled positions in the substrate processing apparatus, and the control means is connected to the substrate detection means, and the substrate detection means The position information is updated on the basis of the detection signal from. More preferably, the control unit transports the substrate closest to the substrate storage container among the plurality of substrates whose presence is detected by the substrate detection unit into the substrate storage container, and then the substrate is placed next to the substrate. The operation of the transfer means is controlled so that a substrate close to the substrate storage container is transferred into the substrate storage container.

  Further preferably, the control means transfers all the substrates existing in the spare chamber into the substrate storage container, and then transfers the substrates present in the substrate processing chamber into the substrate storage container. Control the operation of the transport means.

  The second aspect includes a substrate processing chamber for processing a substrate, a substrate storage container for storing a plurality of substrates, a spare chamber provided between the substrate processing chamber and capable of controlling an internal pressure, and the spare chamber. A substrate processing apparatus comprising: a transport unit that transports a substrate between the substrate storage container and the substrate processing chamber; and a control unit that controls an operation of the transport unit, wherein the control unit Manages position information indicating the position of the substrate in the substrate processing apparatus, and the transfer process by the transfer means is interrupted, and an error in which the position of the substrate indicated by the position information differs from the actual position of the substrate. In the case of occurrence, the substrate processing apparatus controls the operation of the transfer means so as to transfer the substrate remaining in the substrate processing apparatus into the substrate storage container in the order from the substrate storage container.

  Preferably, the control unit includes an operation unit that receives an operation by an operator, and when an error occurs between the position of the substrate indicated by the position information and the actual position of the substrate, the position information A screen for accepting a correction operation is displayed on the operation unit, and a correction operation from the operation unit is received to update the position information.

  According to a third aspect, a substrate storage unit for mounting a substrate storage container for storing a plurality of substrates, an atmospheric transfer chamber in communication with the substrate storage container, an internal communication with the atmospheric transfer chamber, and evacuating the inside. A spare chamber capable of processing, a substrate processing chamber communicating with the spare chamber, processing the substrate, atmospheric transfer means for transporting the substrate between the substrate storage container and the spare chamber, and the spare chamber A substrate processing apparatus comprising: a vacuum transfer unit that transfers the substrate to and from the substrate processing chamber; and a control unit that controls operations of the atmospheric transfer unit and the vacuum transfer unit. When the automatic transfer process is interrupted and the presence of the substrate in the substrate processing chamber and the spare chamber cannot be recognized, the substrate remaining in the atmospheric transfer chamber is transferred into the substrate storage container, The substrate remaining on the substrate Is conveyed into the housed vessel, then, the substrate remaining in the substrate processing chamber so as to be conveyed to the substrate storage container, a substrate processing apparatus for controlling the operation of said air transport means and said vacuum transfer means.

  Preferably, when the control means forcibly recovers the substrate in the substrate processing apparatus to the substrate storage container regardless of the presence or absence of the substrate, the control unit transfers the substrate in the atmospheric transfer chamber to the substrate storage container. And transporting the substrate in the preliminary chamber to the substrate storage container, and then transporting the substrate in the substrate processing chamber to the substrate storage container. To control the operation.

<Other embodiments>
In the above description, the semiconductor manufacturing apparatus is shown as an example of the substrate processing apparatus. However, the present invention is not limited to the semiconductor manufacturing apparatus, and may be an apparatus for processing a glass substrate such as an LCD device. Further, the specific content of the substrate processing is not questioned, and it may be processing such as annealing processing, oxidation processing, nitriding processing, and diffusion processing as well as film forming processing. The film formation process may be, for example, a process for forming a CVD, PVD, oxide film, or nitride film, or a process for forming a film containing a metal.

It is a schematic block diagram of the cluster type substrate processing apparatus concerning one Embodiment of this invention. 1 is a schematic configuration diagram of an inline-type substrate processing apparatus according to an embodiment of the present invention. It is a block block diagram of the control means of the substrate processing apparatus concerning one Embodiment of this invention. It is a flowchart of the automatic conveyance process implemented with the cluster type substrate processing apparatus concerning one Embodiment of this invention. It is an operation | movement flowchart which shows the board | substrate collection | recovery process implemented in the substrate processing apparatus concerning one Embodiment of this invention. It is a schematic diagram which shows the selection screen of a collection destination load port. It is a schematic block diagram of the cluster type substrate processing apparatus concerning other embodiment of this invention. It is an operation | movement flowchart which shows the board | substrate collection | recovery process implemented in the substrate processing apparatus concerning other embodiment of this invention.

Explanation of symbols

AR atmospheric robot (atmospheric transfer means)
CNT control means LP load port (substrate housing part)
LM atmospheric transfer chamber PD pod (substrate storage container)
PM process chamber (substrate processing room)
TM Vacuum transfer chamber VL Vacuum lock chamber (spare chamber)
VR vacuum robot (vacuum transfer means)
W Wafer (Substrate)
SA, SC, SD Wafer presence sensor (substrate detection means)
SB Wafer pop-out sensor (substrate detection means)
100 operation unit

Claims (5)

A substrate processing chamber for processing a substrate, a substrate storage container for storing a plurality of substrates, a spare chamber provided between the substrate processing chamber and capable of controlling the internal pressure, and the substrate storage provided in the spare chamber A substrate processing apparatus comprising: a transfer unit that transfers a substrate between a container and the substrate processing chamber; and a control unit that controls the operation of the transfer unit,
The control means includes
While managing the position information indicating the position of the substrate in the substrate processing apparatus,
When the transfer processing by the transfer means is interrupted and the position information cannot be managed, the substrates remaining in the substrate processing apparatus are transferred into the substrate storage container in order from the substrate storage container. A substrate processing apparatus for controlling the operation of the transfer means so as to make it happen. The substrate storage container includes a plurality of storage units for storing substrates,
The control means holds storage information for designating in which storage section in the substrate storage container each substrate existing in the substrate processing apparatus is to be stored. The substrate processing apparatus according to claim 1, wherein an operation of the transfer unit is controlled based on the position information. Substrate detection means for detecting the presence or absence of a substrate is provided at each planned transfer position of the substrate in the substrate processing apparatus,
The substrate processing apparatus according to claim 1, wherein the control unit is connected to the substrate detection unit and updates the position information based on a detection signal from the substrate detection unit. The control unit transports the substrate closest to the substrate storage container among the plurality of substrates whose presence is detected by the substrate detection unit into the substrate storage container, and then transfers the substrate to the substrate storage container next to the substrate. The substrate processing apparatus according to claim 3, wherein an operation of the transfer unit is controlled so as to transfer a near substrate into the substrate storage container. The control means operates the transfer means so as to transfer all the substrates existing in the spare chamber into the substrate storage container and then transfer the substrates present in the substrate processing chamber into the substrate storage container. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is controlled.

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