〇〇
200924582 070572.TW 25835twf.doc/n 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種線路板’且特別是有關於一種具 有導熱結構（thermal relief)的線路板。 【先前技術】 現今的線路板已發展出表面黏著技術（Surface Mount Technology，SMT)，即多個電子元件，例如電容、電阻、 電感以及積體電路（lntegrated Circuit，IC)等可以黏著於 線路板的表面以電性連接線路板.這樣線路板的面積能充 分地利用，進而組裝更多的電子元件。 -般而言’上述電子元件通常是藉由焊錫而黏著於線 = = ===== 子元:::黏著於這些銅墊與這些電 浪費成本。 之叫接不良，進而導致良率降低以及 【發明内容】 本發明提供一 x 的焊接品質。 ，以袄升線路板與焊料塊之間 200924582 070572.TW 25835twf.d〇c/n 本發明提供一種線路板，以減少線路板的成本浪費。 本發明提供-種線路板，其包括一絕緣層、至少―、 -J墊:至少一第二接墊、至少一第一導熱圖案以及至少 -第-導熱圖案。第-接塾與第二接塾配置於絕緣層上， 其中第-接塾的厚度與第二触的厚度不辦。第—導教 ，案酉己，於第:接塾上，而第二導熱圖案配置於第二接^BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board' and particularly to a wiring board having a thermal relief. [Prior Art] Today's circuit boards have developed Surface Mount Technology (SMT), in which a plurality of electronic components such as capacitors, resistors, inductors, and integrated circuits (ICs) can be adhered to a circuit board. The surface is electrically connected to the circuit board so that the area of the circuit board can be fully utilized to assemble more electronic components. In general, the above electronic components are usually adhered to the wire by soldering = = ===== Sub-element::: Adhesive to these copper pads and these electricity waste costs. The connection is poor, which in turn leads to a decrease in yield and [Summary of the Invention] The present invention provides a welding quality of x. Between the boosted circuit board and the solder bumps 200924582 070572.TW 25835twf.d〇c/n The present invention provides a circuit board to reduce the cost waste of the circuit board. The invention provides a circuit board comprising an insulating layer, at least a -J pad: at least one second pad, at least one first heat conducting pattern and at least a first heat conducting pattern. The first and second contacts are disposed on the insulating layer, wherein the thickness of the first contact and the thickness of the second contact are not. The first - guide, the case is already, in the first: the connection, and the second thermal pattern is placed in the second connection ^
-、第‘熱圖案的外开》（outli )與第一 的外形不姻。 ¥熱圖案 上述絕緣層配置於第一接墊 在本發明之一實施例中 與第二接墊之間。 在本發明之一實施例中，上述第-接塾與第二接藝皆 配置於絕緣層的同一表面上。 在本發明之-實施例中，上述第一導熱圖案與第二導 ，圖案的練實質上皆為T形，而第—導熱圖案的線寬與 弟二導熱圖案的線寬不相等。 _在本發明之一實施例中’上述第一接塾的厚度小於第 -接塾的厚度，而第’導熱圖案的線寬大於第二導執圖案 的線寬。 · 本發明另提供一種線路板，其具有至少一貫孔。線路 板包括一第一線路層、一第二線路層、一絕緣層、至少_ 導電通孔結構、至少一第一導熱圖案以及至少一第二導熱 圖案。第-線路層包括至少—第一墊圈，而第二線路層包 括至少-第二墊圈，其中第—塾圈的厚度與第二墊圈的厚 度不相等。絕緣層喊於第-線路層與第二線路層之間。 200924582 070572.TW 25835twf.doc/n 貫孔位於絕緣層中，並從第一墊圈延伸至第二墊圈。導電 通孔結構配置於貫孔中，並連接於第一墊圈與第二墊圈之 間。第一導熱圖案配置於絕緣層上，並連接第—墊圈。第 二導熱圖案配置於絕緣層上，並連接第二墊圈。第— 圖案的外形與第二導熱圖案的外形不相同。 m一ΐί發明之—實施例巾’上述第—導熱®案包括多個 弟-¥熱條’而這些第-導熱條從第—整_外緣延 Ο 伸。第二導熱隨包括多個第二導熱條，而這 條從第二墊圈的外緣向外延伸。 ’ 在本發明之-實施财，這㈣—導祕的線寬與這 二弟一導熱條的線寬不相等。 /、 在本發明之-實施例中，上述第—塾圈的厚度小於第 二塾圈的厚度，崎些第—導熱條的線寬大於 熱條的線寬。 、二弟一蜍 藉由上述導熱圖案（即第—導熱圖案與第二導軌圖 ^)，本發明能使線路板的第—接塾與第n者 -墊圈與第二墊圈散熱均勻。如此，線路板*焊料塊之 間的焊接品質可以提升，進而大从方 減少線路板的成本浪費。 π線路板的良率以及 舉較此上述特徵和優點能更·易懂，下文特 佳只施例，亚配合所附圖式，作詳細說明如下。 【實施方式】 【第一實施例】 200924582 070572.TW 25835twf.doc/n 圖1A是本發明第一實施例的線路板的俯視示意圖。 請參閱圖1Α，線路板100包括一絕緣層110、多個第一接 墊120a、多個第二接墊120b、多個第一導熱圖案130a以 及多個第二導熱圖案130b。這些第一接塾120a與這些第 一接整120b配置於絕緣層11〇上，且這些第一接塾120a 與這些第二接墊120b皆配置於絕緣層11〇的同一表面上。 也就是說，這些第一接墊120a與這些第二接墊120b都在 絕緣層110的同一側。 這些第一接墊120a與這些第二接墊i2〇b會與多個焊 料塊（未繪不）連接’以至於至少一個電子元件，例如電 容、電阻、電感或積體電路等’能組裝於線路板1〇〇上。 詳細而言，線路板100在後續的製程中會經過錫爐或其他 高溫爐，以至於多個呈熔融狀態的焊料塊（例如焊錫）能 黏著於這些第一接墊120a與這些第二接墊120b上。之後， 上述電子元件透過這些焊料塊得以組裝於線路板丨⑻上。 圖1B是圖1A中線14的剖面示意圖。請參閱圖1A 與圖1B，為了配合產品的需求，第一接墊u〇a的厚度τι 與第二接墊120b的厚度T2不相等，例如厚度ή小於厚 度T2。因此，第一接墊12〇a與第二接墊12〇b二者的散熱 速率會明顯地不相等’例如第一接墊12〇a的散熱速率會比 第二接墊120b快。也就是說，第一接墊12〇a與第二接墊 120b二者散熱不均勻。在這種第一接墊12〇&與第二接墊 120b二者散熱不均勻的情況下，當第一接墊12〇&與第二 接墊120b經過錫爐或其他高溫爐時，第一接墊12〇a與第 200924582 070572.TW25835twf.doc/n 二接墊120b會發生吃錫不足、墓碑效應或其他線路 與焊料塊之間焊接不良的情形。 為了避免上述情形發生，線路板100更包括多個第一 導熱圖案130a與多個第二導熱圖案130b。這些第—導熱 圖案130a配置於這些第一接墊i2〇a上，而這些第二導熱 圖案130b配置於這些第二接墊i2〇b上，其中第一導熱圖 案130a的外形與第二導熱圖案130b的外形不相同。’' 洋細而δ，這裡所5胃的外形不相同是指第—導熱圖案 130a與第二導熱圖案i3〇b (congruence)。也就是說，第一 二者實質上不全等 導熱圖案130a與第二導 熱圖案130b二者可以是同一種形狀（shape)，但是二者 的面積不相等’或者第一導熱圖案130a與第二導熱圖案 130b二者的形狀不同，但是面積相等。當然，第—導熱圖 案130a與第二導熱圖案130b二者的形狀與面積也可以都 不一樣。 舉例而言，圖1A所示的第一導熱圖案13〇3與第二導 熱圖案130b實質上皆為T形，而第一導熱圖案13〇a的線 寬W1與第二導熱圖案130b的線寬W2不相等，例如線寬 W1大於線寬W2。也就是說，第一導熱圖案i3〇a與第二 導熱圖案130b二者雖然是同一種的形狀（即τ形），但 是二者的面積卻不相等。 雖然第一接墊120a的厚度T1與第二接墊120b的厚 度T2不相等會造成第一接墊120a與第二接墊i2〇b散熱 不均勻’但是藉由這些第一導熱圖案130&與這些第二導熱 200924582 070572.TW 25835twf.doc/n 圖案130b，第一接墊120a與第二接墊120b可以散熱均 勻。詳言之，第一導熱圖案130a的線寬W1大於第二導熱 圖案130b的線寬W2，因此第一接墊120a的散熱速率可 以調整，以使第一接墊120a的散熱速率相當於第二接墊 120b的散熱速率。如此，第一接墊120a與第二接墊120b 在經過錫爐或其他高溫爐時能散熱均勻。這樣可以避免發 生吃錫不足、墓碑效應或其他造成線路板100與焊料塊之 間焊接不良的情形，進而提高線路板100的良率。 必須說明的是，雖然圖1A所繪示的線路板1〇〇包括 二個第一接墊120a、二個第二接墊120b、二個第一導電圖 案130a以及二個第二導電圖案130b，但是在其他未繪示 的實施例中’線路板100可以僅包括一個第—接塾12〇a、 一個第二接墊120b、一個第一導電圖案i3〇a以及一個第 二導電圖案130b，或者是線路板1〇〇所包括的第一接塾 120a、第二接墊120b、第一導電圖案130a以及第二導電 圖案130b四者個別的數量皆可以超過二個。因此，圖 所示的第一接墊120a、第二接墊12〇b、第一導電圖案13〇a 以及第二導電圖案130b四者個別的數量僅為舉例說'明，並 非限定本發明。 另外，在本實施例中，線路板100可以是雙面線路板 (double side circuit board)或是多層線路板（mu][tilayer circuit board)，而針對不同的電路設計，線路板ι〇〇更可 以包括多個導電通孔結構140、多條走線15〇以及多個接 線墊160’其中這些走，線15〇連接於這些導電通孔結構14〇 200924582 070572.TW 25835twf.doc/n 與這些接線墊160之間。 【弟二實施例】 圖2A是本發明第二實施例的線路板的俯視示意圖， 而圖2B是圖2A中的線路板的仰視示意圖。請參閱圖2A 與圖2B，線路板200包括絕緣層110、多個第一接墊220a、 多個第二接墊220b、多個第一導熱圖案230a以及多個第 二導熱圖案230b，其中這些第一接墊220a與這些第二接 墊220b配置於絕緣層110上。這些第一導熱圖案230a配 置於這些第一接墊220a上，而這些第二導熱圖案230b配 置於這些第二接墊220b上。 在本實施例中，線路板200可以僅包括一個第一接墊 220a、一個第二接墊220b、一個第一導熱圖案230a以及 一個第二導熱圖案230b。當然，線路板200所包括的第一 接墊220a、第二接墊220b、第一導熱圖案230a以及第二 導熱圖案230b四者個別的數量皆可以超過二個。因此，圖 2A所示的第一接墊220a、第二接墊220b、第一導熱圖案 230a以及第二導熱圖案230b四者個別的數量僅供舉例說 明，並非限定本發明。 圖2C是圖2A中線J-J的剖面示意圖。請參閱圖2C， 從圖2C來看，顯然第一接墊220a與第二接墊220b二者 的厚度不相等，而第一導熱圖案230a與第二導熱圖案230b 二者的外形也不同’即第一導熱圖案230a與第二導熱圖案 230b不全等（請參考圖2A與圖2B)。詳言之，第一導熱 圖案230a與第二導熱圖案230b二者的形狀實質上皆為τ 11 200924582 υ/uj/z. iw ^j〇J5twf.doc/n 字形，但是第一導熱圖案230a的線寬W3與第二導熱圖案 230b的線寬W4不相等，例如線寬W3大於線寬W4 (如 圖2C所示）。 本實施例的線路板200與第一實施例相似，惟差異之 處在於這些第一接墊220a與這些第二接墊220b配置於絕 緣層110的相對二表面。也就是說，絕緣層110配置於這 些第一接墊220a與這些第二接墊220b之間。因此，線路 板200可以是一種雙面線路板。當然，在其他實施例中， 線路板200亦可以是一種多層線路板。 由於本實施例與第一實施例相似，即這些第一接塾 220a、第二接塾220b、第一導熱圖案230a與第二導熱圖 案230b在結構、外觀以及功能上皆與第一實施例相同，故 在此不再重複敘述。 【第三實施例】 圖3A是本發明第三實施例的線路板的俯視示意圖， 而圖3B是圖3A中的線路板的仰視示意圖。請參閱圖3a 與圖3B ’線路板300包括一絕緣層310、一第一線路層 320a、一第二線路層320b、至少一第一導熱圖案330a、至 少一第二導熱圖案330b以及至少一導電通孔結構34〇,並 具有一位於絕緣層310中的貫孔Η。 請參閱圖3Α’第一線路層320a配置於絕緣層31〇上， 並包括至少一第一墊圈322a、至少一走線324a，、多條走 線324a以及至少一接線墊326，其中走線324a，連接於接 線墊326與第一墊圈322a之間。第一導熱圖案330a配置 12 200924582 υ/uj/z.j. w ^,j〇^5twf.d〇c/n 於絕緣層310上，並連接於第—墊圈322a。 請參閱圖3丑，第二線路層遍配置於絕緣層3ι〇上， 並包括至少-第二_ 322b、至少—走線通，以及多條 走線324b ’其中走線324b，連接第二墊圈现。第二導執 圖案330b配置於絕緣層310上，並連接於第二塾圈322b，、，、 其中第-導熱贿330a的外形與第二導熱_ 3鳥 形不相同（请同時參考圖3八與圖3B)。 詳細而言，上述所提的外形不相同是指第一導執 3地與，二導熱圖案3地不全等，即第—導熱圖案咖 二、弟一 V熱圖案330b二者的形狀或面積不相同，或是 導熱圖案33Ga與第二導熱圖案3遍二者的形狀與面積皆 不相同。 、 在本實施例中，第—導熱圖案330a包括多個第—導 熱條332a，而這些第-導熱條332a從第—墊圈322項 緣向外延伸。在圖3A所示的實關巾，這些第—導熱條 332a是呈輻射狀地分布於第—墊圈322a的外緣。 #第二導熱圖案330b包括多個第二導熱條332b，而這 些第二導熱條332b從第二墊圈挪的外緣向外延伸。在 圖3B所示的實施例中，這些第二導熱條332b是呈輻射狀 地分布於第二㈣322b❸卜緣。另外，第-料條332a 的線寬W5與第二導熱條332b的線寬W6不相等、，例如線 寬W5大於線寬W6。 值得一提的是，在其他未繪示的實施例中，第一導熱 圖案330a與第二導熱圖案33%的形狀可以是米字形、十 13 200924582 υ/υ^ u. χ w ^5»35twf.doc/n 字形或其他適當的形狀。因此，圖3A與圖3B所示的第— 導熱圖案330a與第二導熱圖案330b二者的形狀僅供舉例 說明，並非限定本發明。 圖3C是圖3A中線K-K的剖面示意圖。請參閱圖3C， 絕緣層310配置於第一線路層320a與第二線路層32〇b之 間’即第一線路層320a與第二線路層320b分別配置於絕 緣層310的相對二表面。貫孔Η從第一墊圈322a延伸至 第二墊圈322b，而導電通孔結構340配置於貫孔Η中並連 接於第一墊圈322a與第二墊圈322b之間。另外，第—塾 圈322a的厚度與第二墊圈322b的厚度不相等。從圖3c 來看’顯然第一墊圈322a的厚度小於第二墊圈322b的厚 度。 雖然第一墊圈322a的厚度與第二墊圈322b的厚度不 相等會造成第一墊圈322a與第二墊圈322b散熱不均勻， 但是藉由這些第一導熱條332a與這些第二導熱條332b， 第一墊圈322a與第二墊圈322b可以散熱均勻。這樣可以 避免發生吃錫不足、墓碑效應或其他線路板3〇〇與焊料塊 之間焊接不良的情形，進而提高線路板3〇〇的良率。 v ‘、，、口示/、乐―可阶间杀—， 明能使線路板的第-接塾與第二接墊，或是第— 二墊圈在經過錫爐或其他高溫爐時能散熱均勻。了 路板與焊職之_焊接品質可以提升，_免發生^ 不足、、墓碑效應或其他線路板與焊魏之間烊 ^ 形，進而大幅提高線路板的良率以及減少線路板的^本^ 14 200924582 υ /ud /z. l w /D〇35twf.doc/n- The 'outside of the hot pattern' (outli) is not in line with the first shape. The thermal pattern is disposed between the first pad and the second pad in one embodiment of the invention. In an embodiment of the invention, the first joint and the second joint are disposed on the same surface of the insulating layer. In the embodiment of the present invention, the first heat conduction pattern and the second conductive pattern are substantially T-shaped, and the line width of the first heat conduction pattern is not equal to the line width of the second heat conduction pattern. In one embodiment of the invention, the thickness of the first interface is less than the thickness of the first interface, and the line width of the second thermal pattern is greater than the line width of the second guide pattern. The present invention further provides a wiring board having at least a uniform aperture. The circuit board includes a first circuit layer, a second circuit layer, an insulating layer, at least a conductive via structure, at least one first heat conduction pattern, and at least one second heat conduction pattern. The first wiring layer includes at least a first gasket, and the second wiring layer includes at least a second gasket, wherein the thickness of the first loop is not equal to the thickness of the second gasket. The insulating layer is called between the first circuit layer and the second circuit layer. 200924582 070572.TW 25835twf.doc/n The through hole is located in the insulating layer and extends from the first gasket to the second gasket. The conductive via structure is disposed in the through hole and is connected between the first gasket and the second gasket. The first heat conduction pattern is disposed on the insulating layer and connected to the first gasket. The second heat conduction pattern is disposed on the insulating layer and is connected to the second gasket. The shape of the pattern is different from the shape of the second heat conduction pattern. m - 发明 发明 - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - The second heat conduction includes a plurality of second thermally conductive strips, and the strip extends outwardly from the outer edge of the second gasket. In the present invention, the line width of the guide (four)-guide is not equal to the line width of the two conductors. In the embodiment of the invention, the thickness of the first turn coil is smaller than the thickness of the second turn, and the line width of the first heat conduction strip is larger than the line width of the heat strip. By the above-mentioned heat conduction pattern (i.e., the first heat conduction pattern and the second rail pattern), the present invention enables the first interface of the circuit board and the n-th gasket and the second gasket to dissipate heat uniformly. In this way, the soldering quality between the board* solder bumps can be improved, and the cost of the board can be reduced. The yield of the π circuit board and the above features and advantages can be more easily understood. The following is a preferred example, and the sub-combination of the drawings is described in detail below. [Embodiment] [First Embodiment] 200924582 070572.TW 25835twf.doc/n FIG. 1A is a schematic plan view of a wiring board according to a first embodiment of the present invention. Referring to FIG. 1 , the circuit board 100 includes an insulating layer 110, a plurality of first pads 120a, a plurality of second pads 120b, a plurality of first heat conducting patterns 130a, and a plurality of second heat conducting patterns 130b. The first interface 120a and the first alignment 120b are disposed on the insulating layer 11b, and the first interface 120a and the second pads 120b are disposed on the same surface of the insulating layer 11A. That is, the first pads 120a and the second pads 120b are on the same side of the insulating layer 110. The first pads 120a and the second pads i2〇b are connected to a plurality of solder bumps (not shown) so that at least one electronic component, such as a capacitor, a resistor, an inductor or an integrated circuit, can be assembled. The circuit board is on top of it. In detail, the circuit board 100 may pass through a tin furnace or other high temperature furnace in a subsequent process, so that a plurality of molten solder pieces (for example, solder) can adhere to the first pads 120a and the second pads. On 120b. Thereafter, the electronic component is assembled to the wiring board (8) through the solder bumps. Figure 1B is a schematic cross-sectional view of line 14 of Figure 1A. Referring to FIG. 1A and FIG. 1B, in order to meet the requirements of the product, the thickness τι of the first pad u〇a is not equal to the thickness T2 of the second pad 120b, for example, the thickness ή is less than the thickness T2. Therefore, the heat dissipation rates of the first pads 12A and the second pads 12b may be significantly unequal. For example, the first pads 12a may have a faster heat dissipation rate than the second pads 120b. That is to say, the heat dissipation of the first pad 12A and the second pad 120b is uneven. In the case where the first pads 12 〇 & and the second pads 120 b are not uniformly dissipated, when the first pads 12 amp & and the second pads 120 b pass through a solder pot or other high temperature furnace, The first pad 12〇a and the second pad 120b of the 200924582 070572.TW25835twf.doc/n may have poor soldering, tombstoning effects or poor soldering between the wires and the solder bumps. In order to avoid the above situation, the circuit board 100 further includes a plurality of first heat conduction patterns 130a and a plurality of second heat conduction patterns 130b. The first heat conduction patterns 130a are disposed on the first pads i2〇a, and the second heat conduction patterns 130b are disposed on the second pads i2〇b, wherein the shape of the first heat conduction patterns 130a and the second heat conduction patterns are The shape of the 130b is different. The shape of the stomach is different, and the shape of the stomach is different from that of the first heat conduction pattern 130a and the second heat conduction pattern i3〇b (congruence). That is to say, the first two substantially different heat conduction patterns 130a and the second heat conduction patterns 130b may be the same shape, but the areas of the two are not equal' or the first heat conduction pattern 130a and the second heat conduction The shape of both of the patterns 130b is different, but the areas are equal. Of course, the shape and area of both the first heat conduction pattern 130a and the second heat conduction pattern 130b may be different. For example, the first heat conduction pattern 13〇3 and the second heat conduction pattern 130b shown in FIG. 1A are substantially T-shaped, and the line width W1 of the first heat conduction pattern 13〇a and the line width of the second heat conduction pattern 130b. W2 is not equal, for example, the line width W1 is greater than the line width W2. That is to say, although the first heat conduction pattern i3a and the second heat conduction pattern 130b have the same shape (i.e., the shape of τ), the areas of the two are not equal. Although the thickness T1 of the first pad 120a and the thickness T2 of the second pad 120b are not equal, the heat dissipation of the first pad 120a and the second pad i2〇b may be uneven, but by the first heat conduction patterns 130& These second heat conduction 200924582 070572.TW 25835 twf.doc/n pattern 130b, the first pad 120a and the second pad 120b can dissipate heat uniformly. In detail, the line width W1 of the first heat conduction pattern 130a is greater than the line width W2 of the second heat conduction pattern 130b, so the heat dissipation rate of the first pad 120a can be adjusted so that the heat dissipation rate of the first pad 120a is equivalent to the second. The heat dissipation rate of the pad 120b. In this way, the first pad 120a and the second pad 120b can dissipate heat evenly when passing through a tin furnace or other high temperature furnace. This avoids the occurrence of insufficient tin, tombstoning or other causes of poor soldering between the wiring board 100 and the solder bumps, thereby improving the yield of the wiring board 100. It should be noted that although the circuit board 1A illustrated in FIG. 1A includes two first pads 120a, two second pads 120b, two first conductive patterns 130a, and two second conductive patterns 130b, However, in other embodiments not shown, the circuit board 100 may include only one first interface 12A, one second pad 120b, one first conductive pattern i3〇a, and one second conductive pattern 130b, or The number of the first interface 120a, the second pad 120b, the first conductive pattern 130a, and the second conductive pattern 130b included in the circuit board 1 may be more than two. Therefore, the number of the first pads 120a, the second pads 12A, the first conductive patterns 13A, and the second conductive patterns 130b shown in the figures is merely an example and is not intended to limit the present invention. In addition, in the embodiment, the circuit board 100 may be a double side circuit board or a multi-layer circuit board (mu) [tilayer circuit board), and the circuit board is different for different circuit designs. A plurality of conductive via structures 140, a plurality of traces 15A, and a plurality of wiring pads 160' may be included, wherein the traces are connected to the conductive via structures 14〇200924582 070572.TW 25835twf.doc/n with these Between the wiring pads 160. [Second Embodiment] Fig. 2A is a schematic plan view of a circuit board according to a second embodiment of the present invention, and Fig. 2B is a bottom view of the circuit board of Fig. 2A. Referring to FIG. 2A and FIG. 2B, the circuit board 200 includes an insulating layer 110, a plurality of first pads 220a, a plurality of second pads 220b, a plurality of first heat conducting patterns 230a, and a plurality of second heat conducting patterns 230b. The first pads 220a and the second pads 220b are disposed on the insulating layer 110. The first heat conduction patterns 230a are disposed on the first pads 220a, and the second heat conduction patterns 230b are disposed on the second pads 220b. In this embodiment, the circuit board 200 may include only one first pad 220a, one second pad 220b, one first heat conduction pattern 230a, and one second heat conduction pattern 230b. Of course, the number of the first pad 220a, the second pad 220b, the first heat conduction pattern 230a, and the second heat conduction pattern 230b included in the circuit board 200 may be more than two. Therefore, the number of the first pad 220a, the second pad 220b, the first heat conduction pattern 230a, and the second heat conduction pattern 230b shown in FIG. 2A is merely an example and is not intended to limit the present invention. 2C is a schematic cross-sectional view taken along line J-J of FIG. 2A. Referring to FIG. 2C, it is apparent from FIG. 2C that the thicknesses of the first pad 220a and the second pad 220b are not equal, and the shapes of the first heat conduction pattern 230a and the second heat conduction pattern 230b are different. The first heat conduction pattern 230a and the second heat conduction pattern 230b are not identical (please refer to FIG. 2A and FIG. 2B). In detail, the shapes of both the first heat conduction pattern 230a and the second heat conduction pattern 230b are substantially τ 11 200924582 υ/uj/z. iw ^j〇J5twf.doc/n shape, but the first heat conduction pattern 230a The line width W3 is not equal to the line width W4 of the second heat conduction pattern 230b, for example, the line width W3 is larger than the line width W4 (as shown in FIG. 2C). The circuit board 200 of this embodiment is similar to the first embodiment except that the first pads 220a and the second pads 220b are disposed on opposite surfaces of the insulating layer 110. That is, the insulating layer 110 is disposed between the first pads 220a and the second pads 220b. Therefore, the circuit board 200 can be a double-sided circuit board. Of course, in other embodiments, the circuit board 200 can also be a multi-layer circuit board. Since the first embodiment 220a, the second interface 220b, the first heat conduction pattern 230a and the second heat conduction pattern 230b are identical in structure, appearance and function to the first embodiment, the embodiment is similar to the first embodiment. Therefore, the description will not be repeated here. Third Embodiment FIG. 3A is a schematic plan view of a circuit board according to a third embodiment of the present invention, and FIG. 3B is a bottom view of the circuit board of FIG. 3A. Referring to FIG. 3a and FIG. 3B, the circuit board 300 includes an insulating layer 310, a first circuit layer 320a, a second circuit layer 320b, at least one first heat conduction pattern 330a, at least one second heat conduction pattern 330b, and at least one conductive layer. The via structure 34 is formed and has a through hole 位于 in the insulating layer 310. Referring to FIG. 3A, the first circuit layer 320a is disposed on the insulating layer 31, and includes at least one first gasket 322a, at least one trace 324a, a plurality of traces 324a, and at least one wiring pad 326, wherein the trace 324a Connected between the wiring pad 326 and the first gasket 322a. The first heat conduction pattern 330a is disposed 12 200924582 υ/uj/z.j.w ^, j〇^5twf.d〇c/n on the insulating layer 310 and connected to the first gasket 322a. Referring to FIG. 3, the second circuit layer is disposed on the insulating layer 3 ι and includes at least a second 322b, at least a trace, and a plurality of traces 324b, wherein the trace 324b is connected to the second gasket. Now. The second guiding pattern 330b is disposed on the insulating layer 310 and connected to the second coil 322b, wherein the shape of the first heat-conducting bribe 330a is different from the second heat-conducting bird shape (please refer to FIG. And Figure 3B). In detail, the shape difference mentioned above refers to the first guide 3 and the second heat transfer pattern 3, that is, the shape or area of the first heat conduction pattern 2 and the second heat pattern 330b are not the same. Similarly, the shape and area of both the heat conductive pattern 33Ga and the second heat conductive pattern 3 are different. In the present embodiment, the first heat conduction pattern 330a includes a plurality of first heat conduction strips 332a, and the first heat conduction strips 332a extend outward from the edge of the first gasket 322. In the actual closing towel shown in Fig. 3A, the first heat conducting strips 332a are radially distributed on the outer edge of the first gasket 322a. The second heat conduction pattern 330b includes a plurality of second heat conduction strips 332b, and the second heat conduction strips 332b extend outward from the outer edge of the second gasket. In the embodiment illustrated in Figure 3B, the second thermally conductive strips 332b are radially distributed over the second (four) 322b edge. Further, the line width W5 of the first strip 332a and the line width W6 of the second heat conducting strip 332b are not equal, for example, the line width W5 is larger than the line width W6. It is worth mentioning that, in other embodiments not shown, the shape of the first heat conduction pattern 330a and the second heat conduction pattern 33% may be a m-shaped shape, ten 13 200924582 υ / υ ^ u. χ w ^ 5» 35twf .doc/n glyphs or other suitable shapes. Therefore, the shapes of both the first heat conduction pattern 330a and the second heat conduction pattern 330b shown in FIGS. 3A and 3B are for illustrative purposes only and are not intended to limit the invention. Figure 3C is a schematic cross-sectional view of line K-K of Figure 3A. Referring to FIG. 3C, the insulating layer 310 is disposed between the first wiring layer 320a and the second wiring layer 32b, that is, the first wiring layer 320a and the second wiring layer 320b are disposed on opposite surfaces of the insulating layer 310, respectively. The through hole extends from the first washer 322a to the second washer 322b, and the conductive via structure 340 is disposed in the through hole and is connected between the first washer 322a and the second washer 322b. Further, the thickness of the first loop 322a is not equal to the thickness of the second washer 322b. It is apparent from Fig. 3c that it is apparent that the thickness of the first gasket 322a is smaller than the thickness of the second gasket 322b. Although the thickness of the first gasket 322a and the thickness of the second gasket 322b are different, the first gasket 322a and the second gasket 322b are unevenly radiated, but by the first heat conduction strip 332a and the second heat conduction strips 332b, the first The washer 322a and the second washer 322b can dissipate heat uniformly. This can avoid the occurrence of insufficient tin, tombstoning effect or poor soldering between the other boards and the solder bumps, thereby improving the yield of the board. v ',,, / / / - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - Evenly. The welding quality of the road plate and the welding job can be improved, _ exemption ^ deficiency, tombstone effect or other circuit board and welding Wei shape, thereby greatly improving the board yield and reducing the circuit board ^ 14 200924582 υ /ud /z. lw /D〇35twf.doc/n
雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何所屬技術領域中具有通常知識者，在不 脫離本發明之精神和範圍内，當可作些許之更動與潤飾， 因此本發明之保護範圍當視後附之申請專利範圍所界定者 為準。 【圖式簡單說明】 圖1A是本發明第一實施例的線路板的俯視示意圖。 圖1B是圖1A中線I-Ι的剖面示意圖。 圖2A是本發明第二實施例的線路板的俯視示意圖。 圖2B是圖2A中的線路板的仰視示意圖。 圖2C是圖2A中線J-J的剖面示意圖。 圖3A是本發明第三實施例的線路板的俯視示意圖。 圖3B疋圖3A中的線路板的仰視不'思圖。 圖3C是圖3A中線K-K的剖面示意圖。 【主要元件符號說明】 100、200、300 :線路板 110、310 :絕緣層 120a、220a :第一接墊 120b、220b :第二接墊 130a、230a、330a:第一導熱圖案 130b、230b、330b :第二導熱圖案 15 200924582 υ/UD/z.iw z3635twf.doc/n 140、340 :導電通孔結構 150、324a、324a’、324b、324b’ ：走線 160、326 :接線墊 320a :第一線路層 322a :第一墊圈 320b :第二線路層 322b ··第二墊圈 332a :第一導熱條 332b :第二導熱條 Η :貫孔 ΤΙ、Τ2 :厚度Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and any one of ordinary skill in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A is a schematic plan view of a wiring board according to a first embodiment of the present invention. Fig. 1B is a schematic cross-sectional view taken along line I-Ι of Fig. 1A. 2A is a schematic plan view of a wiring board according to a second embodiment of the present invention. 2B is a bottom plan view of the circuit board of FIG. 2A. 2C is a schematic cross-sectional view taken along line J-J of FIG. 2A. 3A is a schematic plan view of a wiring board according to a third embodiment of the present invention. Figure 3B is a bottom view of the circuit board in Figure 3A. Figure 3C is a schematic cross-sectional view of line K-K of Figure 3A. [Main component symbol description] 100, 200, 300: circuit board 110, 310: insulating layer 120a, 220a: first pads 120b, 220b: second pads 130a, 230a, 330a: first heat conduction patterns 130b, 230b, 330b: second heat conduction pattern 15 200924582 υ/UD/z.iw z3635twf.doc/n 140, 340: conductive via structure 150, 324a, 324a', 324b, 324b': traces 160, 326: wiring pad 320a: First circuit layer 322a: first gasket 320b: second wiring layer 322b · second gasket 332a: first heat conduction strip 332b: second heat conduction strip: through hole ΤΙ, Τ 2: thickness
Wl、W2、W3、W4、W5、W6 :線寬Wl, W2, W3, W4, W5, W6: line width
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