TW202245174A - Thermal conductive substrate structure with a non-rectangular heat-dissipation layer - Google Patents

Abstract

A thermal conductive substrate structure with a non-rectangular heat-dissipation layer includes a thermal conductive substrate and a non-rectangular heat-dissipation layer. The non-rectangular heat-dissipation layer is disposed on the thermal conductive substrate. The non-rectangular heat-dissipation layer has at least one positioning feature located at the corner areas of the brazing zone of the non-rectangular heat-dissipation layer, the positioning feature is used for positioning the brazing component that is brazed on the non-rectangular heat-dissipation layer, and the non-rectangular heat-dissipation layer has one or more heat-dissipation legs that extend from at least one side edge of the brazing zone of the non-rectangular heat-dissipation layer.

Description

Heat dissipation substrate structure with non-rectangular heat dissipation layer

The invention relates to a heat dissipation substrate structure, in particular to a heat dissipation substrate structure with a non-rectangular heat dissipation layer.

The power chips in the power modules of current electric vehicles/hybrid vehicles have high power. If there are no proper heat dissipation measures, the temperature of the power chips may exceed the allowable temperature, resulting in performance deterioration or even damage .

Please refer to FIG. 1 and FIG. 2, most of the current power chip 900 is set on the DBC (Direct Bonding Copper: ceramic-metal composite board structure) board 800, wherein the DBC board 800 is the upper copper layer from top to bottom. 801, a ceramic layer 802 and a lower copper layer 803, and the DBC board 800 is a copper sheet 20A that is welded to the surface of the heat dissipation base 10A of the heat dissipation base structure 700A. And, the size of the surface heat dissipation area 201A (or claiming the welding area) of the copper sheet 20A that is arranged on the surface of the heat dissipation substrate structure 700A is the same as the size of the welding area at the bottom of the DBC board 800 to be welded, so that there is Good positioning, however, does not increase the area of the surface heat dissipation area and thus does not increase the heat dissipation performance.

In view of this, the inventor has been engaged in the development and design of related products for many years, and felt that the above-mentioned defects can be improved, so he devoted himself to research and combined with the application of theories, and finally proposed an invention with a reasonable design and effective improvement of the above-mentioned defects.

The technical problem to be solved by the present invention is to provide a heat dissipation base material structure with a non-rectangular heat dissipation layer for the deficiencies of the prior art.

In order to solve the above technical problems, the present invention provides a heat dissipation substrate structure with a non-rectangular heat dissipation layer, comprising: a heat dissipation base and at least one non-rectangular heat dissipation layer; wherein at least one of the non-rectangular heat dissipation layers is arranged on the heat dissipation layer on the substrate, and at least one of the non-rectangular heat dissipation layers has at least one positioning feature located at at least one corner of the welding area of the non-rectangular heat dissipation layer, which is used to position the components for subsequent welding, and at least one of the non-rectangular heat dissipation layers The rectangular heat dissipation layer has one or more heat dissipation feet extending from at least one edge of the welding area of the non-rectangular heat dissipation layer.

In a preferred embodiment, the non-rectangular heat dissipation layer is one of a metal heat dissipation layer and a non-metal heat dissipation layer.

In a preferred embodiment, the non-rectangular heat dissipation layer is a cold spray layer formed on the heat dissipation substrate by cold spraying, and the cold spray material used to form the cold spray layer is selected from copper, silver, One of nickel.

In a preferred embodiment, the non-rectangular heat dissipation layer has four positioning features located at the four corners of the welding area of the non-rectangular heat dissipation layer, and the positioning features are right-angle structures.

In a preferred embodiment, the non-rectangular heat dissipation layer has four positioning features located at four corners of the welding area of the non-rectangular heat dissipation layer, and the positioning features are rounded corner structures.

In a preferred embodiment, the non-rectangular heat dissipation layer has four positioning features located at the four corners of the welding area of the non-rectangular heat dissipation layer, and the positioning features are sharp corner structures.

In a preferred embodiment, the non-rectangular heat dissipation layer has four positioning features located at the four corners of the welding area of the non-rectangular heat dissipation layer, and the positioning features are arbitrary right angles, rounded corners, and sharp corners. complex.

In a preferred embodiment, the non-rectangular heat dissipation layer has four heat dissipation feet extending from the four edges of the welding area of the non-rectangular heat dissipation layer, and at least two of the adjacent heat dissipation feet are connected. A hollow structure is formed.

In a preferred embodiment, at least two heat dissipation legs of at least two non-rectangular heat dissipation layers are connected to each other.

In a preferred embodiment, at least two of the heat dissipation legs of at least two of the non-rectangular heat dissipation layers are connected to each other by a connecting bridge between them.

In a preferred embodiment, the connection bridge extends outwards with a connection cooling foot.

In a preferred embodiment, at least two heat dissipation feet of at least two non-rectangular heat dissipation layers are connected to each other with a connecting bridge between them, and the connecting bridge extends outwards to connect a heat dissipation foot to one of the heat dissipation feet. The non-rectangular heat dissipation layers are connected to form a hollow structure.

The beneficial effect of the present invention lies at least in that the heat dissipation substrate structure provided by the present invention has a non-rectangular heat dissipation layer, which can see through "the non-rectangular heat dissipation layer has at least one positioning feature located at the corner of the welding area of the non-rectangular heat dissipation layer, And the non-rectangular heat dissipation layer has one or more heat dissipation feet extending from at least one edge of the welding area of the non-rectangular heat dissipation layer, which can facilitate positioning and increase the area of the surface heat dissipation area, thereby greatly increasing heat dissipation performance.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings related to the present invention. However, the provided drawings are only for reference and description, and are not intended to limit the present invention.

The following is a specific embodiment to illustrate the implementation of the "radiation substrate structure with non-rectangular heat dissipation layer" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only for simple illustration, and are not drawn according to the actual size, which is stated in advance. The following embodiments will further describe the relevant technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention. It should be understood that although terms such as "first" and "second" may be used herein to describe various elements, these elements should not be limited by these terms. These terms are mainly used to distinguish one element from another. In addition, the term "or" used herein may include any one or a combination of more of the associated listed items depending on the actual situation.

Please refer to FIG. 2 and FIG. 3 , the present invention provides a heat dissipation substrate structure with a non-rectangular heat dissipation layer. As shown in the figure, the heat dissipation substrate structure 700 provided with a non-rectangular heat dissipation layer according to the present invention basically includes a heat dissipation substrate 10 and a non-rectangular heat dissipation layer 20 .

In addition, the non-rectangular heat dissipation layer 20 is disposed on the heat dissipation substrate 10 . The heat dissipation base 10 can be an aluminum heat sink, or a metal substrate with heat dissipation, but it is not limited thereto.

Moreover, the non-rectangular heat dissipation layer 20 may be a metal heat dissipation layer, or a non-metal heat dissipation layer. In this embodiment, the non-rectangular heat dissipation layer 20 is a cold spray layer formed on the heat dissipation substrate 10 by cold spraying, and the cold spray material used to form the cold spray layer can be selected from among copper, silver, and nickel. one.

In this embodiment, the non-rectangular heat dissipation layer 20 has a plurality of positioning features 21 located at a plurality of corners of the welding area 201 of the non-rectangular heat dissipation layer, which are used to position the components for subsequent welding, and the components for subsequent welding can be, for example, It is the DBC board 800 shown in FIG. 3 , but it is not limited thereto. Furthermore, the non-rectangular heat dissipation layer 20 of this embodiment has four positioning features 21 located at the four corners of the welding area 201 of the non-rectangular heat dissipation layer 20, and the rectangular area surrounded by the four positioning features 21 is the welding area 201 , and the four positioning features 21 are all right-angled structures, and the four corners of the welding area at the bottom of the DBC board are also all right-angled structures, because the size of the welding area is the same and the structures at the corners are the same, which can facilitate positioning. Moreover, the non-rectangular heat dissipation layer 20 has one or more heat dissipation feet 22 extending from at least one edge of the welding area 201 of the non-rectangular heat dissipation layer 20 . In this embodiment, the non-rectangular heat dissipation layer 20 has four heat dissipation feet 22 extending from the four edges of the welding area 201 of the non-rectangular heat dissipation layer 20 , so through the four edges of the welding area 201 of the non-rectangular heat dissipation layer 20 Four cooling pins 22 extend from each edge to increase the area of the surface cooling area, which can greatly increase the cooling performance.

Please refer to FIG. 5, in one embodiment, the non-rectangular heat dissipation layer 20 has four positioning features 21a located at the four corners of the welding area 201 of the non-rectangular heat dissipation layer 20, and the four positioning features 21a are all round. Corner structure, and the four corners of the welding area of the subsequent welding parts can also be rounded corner structure, which can facilitate positioning.

Please refer to FIG. 6, in one embodiment, the non-rectangular heat dissipation layer 20 has four positioning features 21b located at the four corners of the welding area 201 of the non-rectangular heat dissipation layer 20, and the four positioning features 21b are all pointed Corner structure, and the four corners of the welding area of the subsequent welding parts can also be sharp corner structure, which can facilitate positioning.

Therefore, it is worth mentioning that the positioning features located at the corners of the welding area 201 of the non-rectangular heat dissipation layer 20 can be right angles, rounded corners, sharp corners, etc., or a combination of any composite features, and the subsequent welding This similar feature is also present at the corners of the welded area of the part to facilitate positioning. In addition, the soldering area may be provided with solder, and the size of the solder may be larger or smaller than the soldering area.

Moreover, in order to increase the heat dissipation performance more significantly, please refer to FIG. 7 , the non-rectangular heat dissipation layer 20 in one embodiment has four heat dissipation feet 22 extending from the four edges of the welding area 201 of the non-rectangular heat dissipation layer 20 , and two adjacent cooling pins 22 are connected to form a hollow structure 23 . Furthermore, two adjacent heat dissipation pins 22 respectively extend from two edges of the soldering area 201 to have two extensions 221 , and are respectively bent and extended from the two extensions 221 to have two connected bending portions 222 surrounding the positioning feature. Instead, a hollow structure 23 is formed. Moreover, the other two adjacent heat dissipation pins 22 may not be connected or connected to form another hollow structure.

Therefore, the non-rectangular heat dissipation layer 20 of this embodiment has a plurality of heat dissipation feet 22 extending from the edges of the welding area 201 of the non-rectangular heat dissipation layer 20, and at least two adjacent heat dissipation feet 22 can be connected to form a There is a hollow structure 23, whereby the heat dissipation performance is greatly increased.

In one embodiment, please refer to FIG. 8 , the two heat dissipation pins 22 of the two non-rectangular heat dissipation layers 20 are connected to each other. Furthermore, adjacent cooling pins 22 can be connected directly or indirectly. In this embodiment, the two cooling pins 22 are connected to each other by a connecting bridge 24 arranged horizontally therebetween. Furthermore, the connection bridge 24 also extends outwards with a vertical connection cooling pin 25 , thereby increasing the heat dissipation performance.

In one embodiment, as shown in FIG. 9 , the two heat dissipation pins 22 of the two non-rectangular heat dissipation layers 20 are connected to each other with a connection bridge 24a between them, and the connection bridge 24a also extends outwards to connect a heat dissipation foot 25a to one of them. The non-rectangular heat dissipation layers 20 are connected to form a hollow structure 23b. In detail, the heat dissipation pin 22 of one of the non-rectangular heat dissipation layers 20 extends outwards with another connecting heat dissipation foot 25b, and the two connecting heat dissipation feet 25a, 25b are connected to each other with another connecting bridge 24b horizontally arranged between them to form around the positioning feature. There is a hollow structure 23b, so that the heat dissipation performance is greatly increased.

In addition, the present invention also provides a manufacturing process of a heat dissipation substrate structure with a non-rectangular heat dissipation layer, which mainly includes the following steps: (a) providing a shielding fixture; The non-rectangular heat dissipation layer of the pins and positioning features is formed on the heat dissipation substrate, and the non-rectangular heat dissipation layer is used for subsequent soldering components (eg, DBC board). Wherein, the heat dissipation substrate may be an aluminum alloy heat sink or a pure aluminum heat sink, and the cold spray material used to form a non-rectangular heat dissipation layer may be selected from one of copper, silver, and nickel.

Based on the above, the present invention provides a heat dissipation substrate structure 700 with a non-rectangular heat dissipation layer, which can see through "the non-rectangular heat dissipation layer 20 has at least one positioning feature located at the corner of the welding area 201 of the non-rectangular heat dissipation layer 20." 21, and the non-rectangular heat dissipation layer 20 has a technical solution of one or more heat dissipation feet 22" extending from at least one edge of the welding area 201 of the non-rectangular heat dissipation layer 20, so as to facilitate positioning and increase the surface heat dissipation area. area, thereby greatly increasing the heat dissipation performance.

The content disclosed above is only a preferred feasible embodiment of the present invention, and does not therefore limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made by using the description and drawings of the present invention are included in the application of the present invention. within the scope of the patent.

700A: heat dissipation substrate structure 10A: heat dissipation base 20A: copper sheet 201A: Surface cooling area 900: power chips 800:DBC board 801: upper copper layer 802: ceramic layer 803: lower copper layer 700: Heat dissipation substrate structure with non-rectangular heat dissipation layer 10: heat dissipation base 20: Non-rectangular heat dissipation layer 201: welding area 21,21a,21b: positioning features 22: cooling feet 221: Extension 222: bending part 23a, 23b: hollow structure 24,24a,24b: connecting bridge 25, 25a, 25b: Connect heat dissipation pins

FIG. 1 is a schematic side view of a heat dissipation substrate structure provided with a DBC board and a power chip in the prior art.

FIG. 2 is a schematic top view of a heat dissipation substrate structure in the prior art.

FIG. 3 is a schematic top view of the structure of the heat dissipation substrate according to the first embodiment of the present invention.

FIG. 4 is a schematic side view of a DBC board and a power chip in a heat dissipation substrate structure according to the first embodiment of the present invention.

FIG. 5 is a schematic top view of a heat dissipation substrate structure according to a second embodiment of the present invention.

FIG. 6 is a schematic top view of a heat dissipation substrate structure according to a third embodiment of the present invention.

FIG. 7 is a schematic top view of a heat dissipation substrate structure according to a fourth embodiment of the present invention.

FIG. 8 is a schematic top view of a heat dissipation substrate structure according to a fifth embodiment of the present invention.

FIG. 9 is a schematic top view of a heat dissipation substrate structure according to a sixth embodiment of the present invention.

700: Heat dissipation substrate structure with non-rectangular heat dissipation layer

10: heat dissipation base

20: Non-rectangular heat dissipation layer

201: welding area

21: Positioning Features

22: cooling feet

Claims (12)

A heat dissipation substrate structure with a non-rectangular heat dissipation layer, comprising: a heat dissipation base and at least one non-rectangular heat dissipation layer; wherein at least one of the non-rectangular heat dissipation layers is arranged on the heat dissipation base, and at least one of the non-rectangular heat dissipation layers The layer has at least one locating feature located at at least one corner of the solder area of the non-rectangular heat dissipation layer, which is used to locate the component for subsequent soldering, and at least one of the non-rectangular heat dissipation layers has one or more positioning features from the The heat dissipation feet extending from at least one edge of the welding area of the non-rectangular heat dissipation layer. The heat dissipation substrate structure with non-rectangular heat dissipation layers according to claim 1, wherein at least one of the non-rectangular heat dissipation layers is one of a metal heat dissipation layer and a non-metal heat dissipation layer. The heat dissipation substrate structure with a non-rectangular heat dissipation layer according to claim 1, wherein at least one of the non-rectangular heat dissipation layers is a cold sprayed layer formed on the heat dissipation substrate by cold spraying, and is used to form The cold spray material of the cold spray coating is selected from one of copper, silver and nickel. The heat dissipation substrate structure with non-rectangular heat dissipation layers according to claim 1, wherein at least one of the non-rectangular heat dissipation layers has four positioning features located at the four corners of the welding area of the non-rectangular heat dissipation layer , the positioning feature is a right-angle structure. The heat dissipation substrate structure with non-rectangular heat dissipation layers according to claim 1, wherein at least one of the non-rectangular heat dissipation layers has four positioning features located at the four corners of the welding area of the non-rectangular heat dissipation layer , the positioning feature is a rounded corner structure. The heat dissipation substrate structure with non-rectangular heat dissipation layers according to claim 1, wherein at least one of the non-rectangular heat dissipation layers has four positioning features located at the four corners of the welding area of the non-rectangular heat dissipation layer , the positioning feature is a pointed structure. The heat dissipation substrate structure with non-rectangular heat dissipation layers according to claim 1, wherein at least one of the non-rectangular heat dissipation layers has four positioning features located at the four corners of the welding area of the non-rectangular heat dissipation layer , the positioning feature is a complex of arbitrary right angles, rounded corners, and sharp corners. The heat dissipation substrate structure with non-rectangular heat dissipation layers according to claim 1, wherein at least one of the non-rectangular heat dissipation layers has four heat dissipation holes extending from the four edges of the welding area of the non-rectangular heat dissipation layer feet, and at least two adjacent heat dissipation feet are connected to form a hollow structure. The heat dissipation substrate structure with a non-rectangular heat dissipation layer according to claim 1, wherein at least two heat dissipation legs of at least two non-rectangular heat dissipation layers are connected to each other. The heat dissipation substrate structure with a non-rectangular heat dissipation layer as claimed in claim 9, wherein at least two heat dissipation pins of at least two non-rectangular heat dissipation layers are connected to each other by connecting bridges therebetween. The heat dissipation base material structure with a non-rectangular heat dissipation layer as claimed in claim 10, wherein a connecting heat dissipation foot extends outward from the connection bridge. The heat dissipation substrate structure with a non-rectangular heat dissipation layer as claimed in claim 1, wherein at least two heat dissipation pins of at least two non-rectangular heat dissipation layers are connected to each other by a connecting bridge between them, and the The connecting bridge extends outwards and has a connecting heat dissipation foot connected to one of the non-rectangular heat dissipation layers to form a hollow structure.

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